Organosilicon composition, photocurable film and wafer bonding pair

Abstract

The invention discloses an organic silicon composition, a light-cured film and a wafer bonding pair, and relates to the technical field of organic materials. The organic silicon composition provided by the invention comprises the following components in percentage by weight: 49.5-75% of unsaturated silicone oil and / or unsaturated silicon resin; 24.5%-50% of sulfydryl silicone oil and / or sulfydryl silicone resin; 0.5%-5% of a photoinitiator; wherein the unsaturated silicone oil or the unsaturated silicone resin comprises ethynyl. According to the present invention, the cured product of the organosilicon composition uses the silicon-oxygen bond as the skeleton, and the silicon-oxygen bond has excellent high temperature resistance, such that the use temperature can exceed 350 DEG C, and the high heat resistance is provided. Meanwhile, the organic silicon composition comprises ethynyl and sulfydryl, the ethynyl and the sulfydryl can be subjected to a cross-linking reaction under the action of the photoinitiator to cure the organic silicon composition, and the organic silicon composition can be cured within 60 seconds, so that compared with thermocuring organic silicon rubber, the curing time is greatly shortened, and high efficiency and rapidness are achieved; normal-temperature bonding and normal-temperature curing can be achieved, the process can be simplified, and warping can be reduced.

Description

Technical Field

[0001] The present application relates to the technical field of organic materials, and in particular to an organic silicon composition, a photocurable film, and a wafer bonding pair. Background Art

[0002] With the increasing demand for reducing feature size and introducing full-size three-dimensional integration in semiconductor wafer manufacturing, wafers are moving towards large size, multi-chip stacking and ultra-thinness to achieve high-performance system integration, multi-function and cost-effectiveness of high-end chips. However, due to the flexibility and brittleness of large-size ultra-thin wafers when processed alone, the sharp decline in mechanical properties will cause breakage and warping. In order to improve the yield, processing accuracy and packaging accuracy of chip manufacturing, a support system is urgently needed to meet the demanding back-side process technology (such as lithography, etching, passivation, sputtering, electroplating, reflow soldering and dicing processes, etc.). Against this background, temporary bonding and debonding (TBDB) technology came into being.

[0003] Temporary bonding and debonding technology involves temporarily bonding an ultra-thin device wafer to a rigid carrier. After subsequent wafer thinning and backside processing, the ultra-thin wafer is completely removed from the rigid carrier. As the linchpin of temporary bonding technology, the development of temporary bonding materials has garnered widespread attention from both academia and industry.

[0004] However, most temporary bonding materials on the market are thermoplastics. Their inherent linear chain structure inevitably presents a series of problems. They often exhibit flow at high temperatures, causing some wafer shift and reducing yield. Furthermore, their heat and chemical resistance are generally poor. Therefore, it is necessary to develop a temporary bonding material with a short curing time and high heat resistance. Summary of the Invention

[0005] In view of this, the present application provides an organosilicon composition, a photocurable film, and a wafer bonding pair, aiming to improve at least one of the above technical problems existing in existing temporary bonding materials.

[0006] In a first aspect, the present application provides a silicone composition comprising:

[0007] Unsaturated silicone oil and / or unsaturated silicone resin 49.5% to 75%;

[0008] Mercapto silicone oil and / or mercapto silicone resin 24.5% to 50%;

[0009] Photoinitiator 0.1% to 5%;

[0010] The unsaturated silicone oil or unsaturated silicone resin includes an unsaturated functional group, and the unsaturated functional group includes an acetylene group.

[0011] In a possible implementation of the present application, the organosilicon composition comprises at least one of the following features (1) to (5);

[0012] (1) The unsaturated silicone oil includes acetylene silicone oil, the acetylene silicone oil includes the acetylene group, and the content of the acetylene group in the acetylene silicone oil is 0.01 to 1 mmol / g;

[0013] (2) The unsaturated silicone resin includes an ethynyl silicone resin, the ethynyl silicone resin includes the ethynyl group, and the content of the ethynyl group in the ethynyl resin is 0.01 to 1 mmol / g;

[0014] (3) The content of the unsaturated functional group in the unsaturated silicone oil or unsaturated silicone resin is 0.2 mmol / g to 2 mmol / g;

[0015] (4) The content of the unsaturated functional group in the unsaturated silicone oil or unsaturated silicone resin is 0.3 mmol / g to 0.7 mmol / g;

[0016] (5) The unsaturated functional group also includes a vinyl group.

[0017] In a possible implementation of this application,

[0018] The unsaturated silicone oil or unsaturated silicone resin further comprises vinyl silicone oil and / or vinyl silicone resin, the unsaturated functional group further comprises a vinyl group, the vinyl silicone oil and / or vinyl silicone resin comprises the vinyl group, and the mass ratio of the vinyl silicone oil and / or vinyl silicone resin to the silicone composition is 50% to 60%;

[0019] And / or, the mass fraction of the acetylene silicone oil and / or acetylene silicone resin in the silicone composition is 10% to 75%;

[0020] And / or, the unsaturated functional group further includes a vinyl group, and the molar ratio of the ethynyl group to the vinyl group in the unsaturated functional group is 0.1-4.0.

[0021] In a possible implementation of the present application, the organosilicon composition comprises at least one of the following features (1) to (4);

[0022] (1) The mercapto silicone oil and / or mercapto silicone resin includes a mercapto group, and the content of the mercapto group is 0.3 mmol / g to 3 mmol / g;

[0023] (2) The mercapto silicone oil and / or mercapto silicone resin includes a mercapto group, and the content of the mercapto group is 0.5 mmol / g to 1.5 mmol / g;

[0024] (3) The mercapto silicone oil and / or mercapto silicone resin includes a mercapto group, and the molar ratio of the mercapto group to the unsaturated functional group is (0.8-1.5):1;

[0025] (4) The mercapto silicone oil and / or mercapto silicone resin includes a mercapto group, and the molar ratio of the mercapto group to the unsaturated functional group is (0.9-1.1):1.

[0026] In a possible implementation of the present application, the organosilicon composition includes at least one of the following features (1) to (4);

[0027] (1) The viscosity of the unsaturated silicone oil and / or unsaturated silicone resin is 100 mPa·s to 20,000 mPa·s;

[0028] (2) The viscosity of the mercapto silicone oil and / or mercapto silicone resin is 100 mPa·s to 20,000 mPa·s;

[0029] (3) The number average molecular weight of the unsaturated silicone oil and / or unsaturated silicone resin is 2000 g / mol to 20000 g / mol;

[0030] (4) The number average molecular weight of the mercapto silicone oil and / or mercapto silicone resin is 2000 g / mol to 20000 g / mol.

[0031] In a possible implementation of this application,

[0032] The unsaturated silicone oil includes at least one of double-terminated acetylene silicone oil, single-terminated acetylene silicone oil, and polyacetylene silicone oil;

[0033] And / or, the unsaturated silicone resin includes at least one of a double-terminated acetylene resin, a single-terminated acetylene resin, and a polyacetylene resin;

[0034] And / or, the mercapto silicone oil or mercapto silicone resin includes a mercapto substituent, the structural formula of the mercapto substituent is -(CH2) n SH, n is an integer from 1 to 6;

[0035] And / or, the mercapto silicone oil includes at least one of a branched mercapto silicone oil, a carboxyl-terminated branched mercapto silicone oil, and a branched phenyl mercapto silicone oil;

[0036] And / or, the mercapto silicone resin includes at least one of a branched mercapto silicone resin, a carboxyl-terminated branched mercapto silicone resin, and a branched phenyl mercapto silicone resin.

[0037] In a possible implementation of the present application, the vinyl silicone oil includes at least one of double-end-capped vinyl silicone oil, single-end-capped vinyl silicone oil, polyvinyl silicone oil, low-ring vinyl silicone oil, and phenyl vinyl silicone oil;

[0038] And / or, the vinyl silicone resin includes at least one of vinyl silicone resin, phenyl vinyl silicone resin, and vinyl POSS.

[0039] In a possible implementation of the present application, the organosilicon composition includes at least one of the following features (1) to (4);

[0040] (1) The organosilicon composition further includes a tackifier;

[0041] (2) The organosilicon composition further includes a leveling agent;

[0042] (3) The organosilicon composition further includes an inorganic filler;

[0043] (4) The organosilicon composition further comprises a defoaming agent.

[0044] In a possible implementation of the present application, the organosilicon composition satisfies one of the conditions (1) to (5);

[0045] (1) The organosilicon composition further comprises a tackifier, and the mass percentage of the tackifier to the organosilicon composition is 0.1% to 5%;

[0046] (2) The organic silicon composition further comprises a leveling agent, and the mass percentage of the leveling agent to the organic silicon composition is 0.1% to 5%;

[0047] (3) The organosilicon composition further comprises an inorganic filler, and the mass percentage of the inorganic filler to the organosilicon composition is 0.1% to 30%;

[0048] (4) The organosilicon composition further comprises an inorganic filler, and the particle size of the inorganic filler is 0.001 μm to 20 μm;

[0049] (5) The organosilicon composition further comprises a defoaming agent, and the mass percentage of the defoaming agent to the organosilicon composition is 0.1% to 5%.

[0050] A second aspect of the present application provides a photocurable film, which is formed by curing the organosilicon composition.

[0051] A third aspect of the present application provides a wafer bonding pair, comprising a first wafer, a second wafer and an adhesive layer that are stacked together; the adhesive layer is used to bond the first wafer and the second wafer, and the adhesive layer is formed by curing the silicone composition.

[0052] A second aspect of the present application provides a photocurable film, which is formed by curing the organosilicon composition.

[0053] A third aspect of the present application provides a wafer bonding pair, comprising a first wafer, a second wafer and an adhesive layer that are stacked together; the adhesive layer is used to bond the first wafer and the second wafer, and the adhesive layer is formed by curing the silicone composition.

[0054] Beneficial effects:

[0055] The cured product of the silicone composition in the present application has a silicon-oxygen bond as its skeleton. Since the silicon-oxygen bond has excellent high-temperature resistance, the short-term use temperature can exceed 350°C, which makes the silicone composition in the present application have high heat resistance.

[0056] The silicone composition in the present application includes acetylene and mercapto groups. The acetylene and mercapto groups can undergo a cross-linking reaction under the action of a photoinitiator to cure the silicone composition, and can be cured within 60 seconds. Compared with heat-curing silicone rubber, the curing time is greatly reduced, and it is efficient and fast. Moreover, as a temporary bonding material, it can be bonded and cured at room temperature, which not only simplifies the process but also reduces warping, thereby improving the production capacity of the temporary bonding process. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0058] Figure 1 is a TGA curve of the cured product of the organosilicon composition in Example 1;

[0059] Figure 2 is a DSC curve of the organosilicon composition in Example 1;

[0060] Figure 3 is a SAM image of the bonded pair after PECVD of the organosilicon composition in Example 1;

[0061] Figure 4 Schematic diagram of an optical microscope showing the edge of the bonding pair in Example 1 before and after being immersed in a cleaning solvent. DETAILED DESCRIPTION

[0062] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only used to illustrate and explain the present application and are not used to limit the present application.

[0063] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0064] In this application, unless otherwise indicated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of a device in actual use or operation, specifically in the drawing directions of the accompanying drawings; whereas "inner" and "outer" refer to the outline of the device. Furthermore, in the description of this application, the term "including" means "including but not limited to." Terms such as first, second, and third are used merely as labels and do not impose numerical requirements or establish a sequence.

[0065] In this application, "and / or" describes the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. A and B can be singular or plural.

[0066] In this application, "at least one" means one or more, and "plurality" means two or more. "One or more", "at least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, "at least one of a, b, or c", or "at least one of a, b, and c" can all mean: a, b, c, ab (i.e., a and b), ac, bc, or abc, where a, b, and c can be single or plural, respectively.

[0067] Various embodiments of the present application may be presented in the form of a range; it should be understood that the description in the form of a range is only for convenience and brevity and should not be understood as a hard limitation on the scope of the present application; therefore, the range description should be considered to have specifically disclosed all possible sub-ranges and single numbers within the range. For example, the description of a range from 1 to 6 should be considered to have specifically disclosed sub-ranges such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., as well as single numbers within the range, such as 1, 2, 3, 4, 5 and 6, which applies regardless of the range. In addition, whenever a numerical range is indicated herein, it is meant to include any cited number (fractional or integer) within the indicated range.

[0068] In a first aspect, embodiments of the present application provide an organosilicon composition comprising, calculated by mass percentage, an unsaturated silicone oil and / or an unsaturated silicone resin, a mercapto silicone oil and / or a mercapto silicone resin, and an initiator. The unsaturated silicone oil and / or unsaturated silicone resin comprise 49.5% to 75% of the organosilicon composition, and the unsaturated silicone oil or unsaturated silicone resin includes an unsaturated functional group, wherein the unsaturated functional group includes an acetylene group; the mercapto silicone oil and / or mercapto silicone resin comprise 24.5% to 50% of the organosilicon composition; and the photoinitiator comprises 0.1% to 5% of the organosilicon composition.

[0069] The cured product of the silicone composition in this application has a silicon-oxygen bond as its skeleton. Since the silicon-oxygen bond has excellent high-temperature resistance, the short-term use temperature can exceed 350°C, which makes the silicone composition in this application highly heat-resistant and suitable for high-temperature processes.

[0070] At the same time, the organosilicon composition in this application includes acetylene and thiol groups, which can undergo a cross-linking reaction under the action of a photoinitiator to cure the organosilicon composition, and can be cured within 60 seconds. In addition, the organosilicon composition in this application is cured by light curing, which not only reduces warping but is also more efficient and rapid, improving yield and efficiency. Compared with heat-cured silicone rubber, light curing greatly reduces curing time and is efficient and rapid. Moreover, as a temporary bonding material, it can be bonded and cured at room temperature, which not only simplifies the process but also reduces warping, thereby increasing the production capacity of the temporary bonding process.

[0071] In addition, the silicone composition in this application also has excellent adhesion, fluidity, low-temperature resistance, electrical properties, mechanical properties, air permeability, physiological inertness, transparency, the film produced is very uniform and smooth, and it is easy to remove without causing damage to fragile devices. It is suitable for protecting chip surfaces or other key components to prevent damage or contamination during the manufacturing process.

[0072] It should be noted that the silicone oil herein refers to a linear polysiloxane that remains liquid at room temperature. The mercapto silicone oil herein refers to a silicone oil containing a mercapto functional group. The silicone resin herein refers to a polyorganosiloxane having a highly cross-linked network structure. The mercapto silicone resin herein refers to a silicone resin containing a mercapto functional group.

[0073] In some embodiments of the present application, in the organosilicon composition, the molar ratio of the thiol functional group to the unsaturated functional group is (0.8-1.5):1. For example, the molar ratio of the thiol functional group to the unsaturated functional group is (0.8-1.0):1; or, the molar ratio of the thiol functional group to the unsaturated functional group is (0.9-1.1):1; or, the molar ratio of the thiol functional group to the unsaturated functional group is (1.1-1.3):1; or, the molar ratio of the thiol functional group to the unsaturated functional group is (1.3-1.5):1. Specifically, the molar ratio of the thiol functional group to the unsaturated functional group is 0.8:1, or 0.9:1, or 1.0:1, or 1.1:1, or 1.2:1, or 1.3:1, or 1.4:1, or 1.5:1. Preferably, the molar ratio of the thiol functional group to the unsaturated functional group is (0.9-1.1): 1. It is understood that when the molar ratio of the thiol functional group to the unsaturated functional group is (0.8-1.5): 1, the degree of curing of the organosilicon composition is higher, thereby making the cured product have better heat resistance.

[0074] In some embodiments of the present application, the content of unsaturated functional groups in the unsaturated silicone oil and / or unsaturated silicone resin is 0.2mmol / g to 2mmol / g. It should be noted that the unsaturated functional group includes an acetylene group, or the unsaturated functional group includes an acetylene group and a vinyl group. When the unsaturated group content of the unsaturated silicone oil and / or unsaturated silicone resin is less than 0.1mmol / g, the unsaturated functional group content is small, and the cured film obtained therefrom is difficult to cure. When the unsaturated group content of the unsaturated silicone oil and / or unsaturated silicone resin is greater than 2.0mmol / g, the cured film obtained therefrom is over-crosslinked, becomes hard and brittle, reduces its deformation ability, thereby forming stress concentration at the interface, and reducing the bonding strength with the glass interface; illustratively, the content of unsaturated functional groups in the unsaturated silicone oil and / or unsaturated silicone resin is 0.1mmol / g to 2mmol / g. For another example, the content of unsaturated functional groups in the unsaturated silicone oil and / or unsaturated silicone resin is 0.1 mmol / g to 1 mmol / g. For another example, the content of unsaturated functional groups in the unsaturated silicone oil and / or unsaturated silicone resin is 1 mmol / g to 2 mmol / g. Preferably, the content of unsaturated functional groups in the unsaturated silicone oil and / or unsaturated silicone resin is 0.3 mmol / g to 0.7 mmol / g. Illustratively, the content of unsaturated functional groups in the unsaturated silicone oil and / or unsaturated silicone resin is 0.2 mmol / g, or 0.3 mmol / g, or 0.4 mmol / g, or 0.5 mmol / g, or 0.6 mmol / g, or 0.7 mmol / g, or 0.8 mmol / g, or 0.9 mmol / g, or 1.0 mmol / g, or 1.2 mmol / g, or 1.4 mmol / g, or 1.6 mmol / g, or 1.8 mmol / g, or 2.0 mmol / g.

[0075] In some embodiments of the present application, the structural formula of the mercapto substituent in the mercapto silicone oil / resin is -(CH2) n SH, n = 1 to 6. Illustratively, the structural formula of the thiol substituent is -CH2SH, or -(CH2)2SH, or -(CH2)3SH, or -(CH2)4SH, or -(CH2)5SH, or -(CH2)6SH.

[0076] In some embodiments of the present application, the mercapto silicone oil and / or mercapto silicone resin includes a mercapto group, and the content of the mercapto group is 0.3mmol / g to 3mmol / g. Furthermore, the content of the mercapto group in the mercapto silicone oil or mercapto silicone resin is 0.5 to 1.5mmol / g. It should be noted that when the mercapto content of the mercapto silicone oil / resin is less than 0.1mmol / g, the mercapto content of the mercapto silicone oil / resin is relatively small, and the cured film obtained therefrom is difficult to cure. When the mercapto content of the mercapto silicone oil / resin is greater than 2mmol / g, the bonding strength of the cured film obtained therefrom is too high, and even the bonding strength of the bonded pair is too high and the bond cannot be successfully debonded.

[0077] For example, the mercapto content of the mercapto silicone oil and / or mercapto silicone resin is 0.3 mmol / g to 1 mmol / g. For another example, the mercapto content of the mercapto silicone oil and / or mercapto silicone resin is 1 mmol / g to 2 mmol / g.

[0078] Illustratively, the content of mercapto groups in the mercapto silicone oil and / or mercapto silicone resin is 0.3 mmol / g, or 0.4 mmol / g, or 0.5 mmol / g, or 0.6 mmol / g, or 0.7 mmol / g, or 0.8 mmol / g, or 0.9 mmol / g, or 1.0 mmol / g, or 1.2 mmol / g, or 1.4 mmol / g, or 1.5 mmol / g, or 1.6 mmol / g, or 1.8 mmol / g, or 2.0 mmol / g, or 2.2 mmol / g, or 2.4 mmol / g, or 2.6 mmol / g, or 2.8 mmol / g, or 3.0 mmol / g.

[0079] In some embodiments of the present application, the mercapto silicone oil includes at least one of a branched mercapto silicone oil, a carboxyl-terminated branched mercapto silicone oil, and a branched phenyl mercapto silicone oil. The mercapto silicone resin includes at least one of a branched mercapto silicone resin, a carboxyl-terminated branched mercapto silicone resin, and a branched phenyl mercapto silicone resin.

[0080] In some embodiments of the present application, the type of the photoinitiator is not particularly limited. For example, the photoinitiator includes TPO (2,4,6 (trimethylbenzoyl) diphenylphosphine oxide), TPO-L (ethyl 2,4,6-trimethylbenzoylphosphonate), 907 (2-methyl-1-[4-methylthiophenyl]-2-morpholinyl-1-propanone), ITX (2-isopropylthioxanthone (2, 4 isomer mixture), 184 (1-hydroxy-cyclohexyl-phenyl ketone), 1173 (2-hydroxy-2-methyl-1-phenyl-1-propanone), BDK (benzoin dimethyl ether), OMBB (methyl o-benzoylbenzoate), BP (benzophenone), CBP (4- The photoinitiator may be selected from one or more of: benzophenone (chlorobenzophenone), PBZ (4-phenylbenzophenone) and other structurally modified benzophenone initiators, initiator 369 (2-phenylbenzyl-2-dimethylamine-1-(4-morpholinobenzylphenyl)butanone), photoinitiator 819 (phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide), photoinitiator 754 (benzoylformate mixture), photoinitiator 127 (2-hydroxy-1-(4-(2-hydroxy-2-methylpropionylphenyl)benzyl)-2-methyl-1-propanone), and photoinitiator 784 (bis-2,6-difluoro-3-pyrrolphenyl titanocene). Preferably, the photoinitiator is selected from one or more of TPO-L, 1173, and BDK.

[0081] In some embodiments of the present application, the unsaturated silicone oil or unsaturated silicone resin further comprises vinyl silicone oil or resin, and the mass ratio of the acetylene silicone oil to the silicone composition is 10% to 75%, and the mass ratio of the vinyl silicone oil to the silicone composition is 50% to 60%. It will be appreciated that the silicone composition in this embodiment, which includes both vinyl and acetylene groups, has a higher crosslinking density and higher hardness than a silicone composition containing only vinyl groups.

[0082] In some embodiments of the present application, the unsaturated functional group further comprises a vinyl group, and the molar ratio of the ethynyl group to the vinyl group in the unsaturated functional group is 0.1 to 4.0. For example, the molar ratio of the ethynyl group to the vinyl group in the unsaturated functional group is 0.1, or 0.33, or 0.5, or 0.8, or 1.0, or 1.5, or 2.0, or 2.5, or 3.0, or 3.5, or 4.0.

[0083] In some embodiments of the present application, the acetylene content of the acetylene silicone oil or acetylene resin is 0.01 to 1 mmol / g. It should be noted that when the acetylene content is less than 0.01 mmol / g, the resulting cured film is difficult to cure. When the acetylene content is greater than 1 mmol / g, the resulting cured film is too hard and brittle, making it unsuitable for temporary bonding technology.

[0084] Illustratively, the content of acetylene groups in the acetylene silicone oil or acetylene resin is 0.01 mmol / g, or 0.05 mmol / g, or 0.1 mmol / g, or 0.2 mmol / g, or 0.3 mmol / g, or 0.4 mmol / g, or 0.5 mmol / g, or 0.6 mmol / g, or 0.7 mmol / g, or 0.8 mmol / g, or 0.9 mmol / g, or 1 mmol / g.

[0085] In some embodiments of the present application, the acetylene silicone oil is selected from one or more of di-terminated acetylene silicone oil, mono-terminated acetylene silicone oil, and polyacetylene silicone oil. It should be noted that polyacetylene silicone oil in the present application refers to silicone oil having multiple acetylene groups in its molecular structure.

[0086] In some embodiments of the present application, the acetylene resin is selected from one or more of a di-terminated acetylene resin, a mono-terminated acetylene resin, and a polyacetylene resin. It should be noted that the polyacetylene resin in the present application refers to a silicone resin having multiple acetylene groups in its molecular structure.

[0087] In some embodiments of the present application, the content of vinyl in the vinyl silicone oil or vinyl silicone resin is 0.01mmol / g to 1mmol / g. It should be noted that when the content of vinyl is less than 0.01mmol / g, the cured film obtained is difficult to cure. When the content of vinyl is less than 1mmol / g, the hardness of the cured film obtained is too high and brittle, and it cannot be applied to temporary bonding technology. Exemplarily, the content of vinyl in the vinyl silicone oil or vinyl silicone resin is 0.01mmol / g to 0.5mmol / g. For another example, the content of vinyl in the vinyl silicone oil or vinyl silicone resin is 0.5mmol / g to 1mmol / g. For another example, the content of vinyl in the vinyl silicone oil or vinyl silicone resin is 0.01mmol / g, or 0.05mmol / g, or 0.1mmol / g, or 0.5mmol / g, or 0.8mmol / g, or 1.0mmol / g.

[0088] In some embodiments of the present application, the vinyl silicone oil includes at least one of double-end-capped vinyl silicone oil, single-end-capped vinyl silicone oil, polyvinyl silicone oil, low-ring vinyl silicone oil, and phenyl vinyl silicone oil.

[0089] In some embodiments of the present application, the vinyl silicone resin includes at least one of vinyl silicone resin, phenyl vinyl silicone resin, and vinyl POSS (cage polysilsesquioxane).

[0090] In some embodiments of the present application, the viscosity of the unsaturated silicone oil and / or unsaturated silicone resin is 100 mPa·s to 20,000 mPa·s. Exemplarily, the viscosity of the unsaturated silicone oil and / or unsaturated silicone resin is 100mPa·s to 500mPa·s; or, the viscosity of the unsaturated silicone oil and / or unsaturated silicone resin is 500mPa·s to 1000mPa·s; or, the viscosity of the unsaturated silicone oil and / or unsaturated silicone resin is 1000mPa·s to 3000mPa·s; or, the viscosity of the unsaturated silicone oil and / or unsaturated silicone resin is 3000mPa·s to 5000mPa·s; or, the viscosity of the unsaturated silicone oil and / or unsaturated silicone resin is 5000mPa·s to 10000mPa·s; or, the viscosity of the unsaturated silicone oil and / or unsaturated silicone resin is 10000mPa·s to 15000mPa·s; or, the viscosity of the unsaturated silicone oil and / or unsaturated silicone resin is 15000mPa·s to 20000mPa·s. Preferably, the viscosity of the unsaturated silicone oil and / or unsaturated silicone resin is 1000 mPa·s to 5000 mPa·s.

[0091] In some embodiments of the present application, the viscosity of the mercapto silicone oil and / or mercapto silicone resin is 100 mPa·s to 20,000 mPa·s. Exemplarily, the viscosity of the mercapto silicone oil and / or mercapto silicone resin is 100mPa·s to 500mPa·s; or, the viscosity of the mercapto silicone oil and / or mercapto silicone resin is 500mPa·s to 1000mPa·s; or, the viscosity of the mercapto silicone oil and / or mercapto silicone resin is 1000mPa·s to 3000mPa·s; or, the viscosity of the mercapto silicone oil and / or mercapto silicone resin is 3000mPa·s to 5000mPa·s; or, the viscosity of the mercapto silicone oil and / or mercapto silicone resin is 5000mPa·s to 10000mPa·s; or, the viscosity of the mercapto silicone oil and / or mercapto silicone resin is 10000mPa·s to 15000mPa·s; or, the viscosity of the mercapto silicone oil and / or mercapto silicone resin is 15000mPa·s to 20000mPa·s. Preferably, the viscosity of the mercapto silicone oil and / or mercapto silicone resin is 1000 mPa·s to 5000 mPa·s. It should be noted that, unless otherwise specified, the viscosities in this application are all viscosities at room temperature (25° C.).

[0092] In some embodiments of the present application, the number average molecular weight of the unsaturated silicone oil and / or unsaturated silicone resin is 2000 g / mol to 20000 g / mol. For example, the number average molecular weight of the unsaturated silicone oil and / or unsaturated silicone resin is 2000 g / mol to 5000 g / mol; or, the number average molecular weight of the unsaturated silicone oil and / or unsaturated silicone resin is 5000 g / mol to 10000 g / mol; or, the number average molecular weight of the unsaturated silicone oil and / or unsaturated silicone resin is 10000 g / mol to 15000 g / mol; or, the number average molecular weight of the unsaturated silicone oil and / or unsaturated silicone resin is 15000 g / mol to 20000 g / mol. Preferably, the number average molecular weight of the unsaturated silicone oil and / or unsaturated silicone resin is 4000 g / mol to 15000 g / mol.

[0093] In some embodiments of the present application, the number average molecular weight of the mercapto silicone oil and / or mercapto silicone resin is 2000 g / mol to 20000 g / mol. For example, the number average molecular weight of the mercapto silicone oil and / or mercapto silicone resin is 2000 g / mol to 5000 g / mol; or, the number average molecular weight of the mercapto silicone oil and / or mercapto silicone resin is 5000 g / mol to 10000 g / mol; or, the number average molecular weight of the mercapto silicone oil and / or mercapto silicone resin is 10000 g / mol to 15000 g / mol; or, the number average molecular weight of the mercapto silicone oil and / or mercapto silicone resin is 15000 g / mol to 20000 g / mol. Preferably, the number average molecular weight of the mercapto silicone oil and / or mercapto silicone resin is 4000 g / mol to 15000 g / mol.

[0094] In some embodiments of the present application, the silicone composition further comprises a tackifier, and the mass ratio of the tackifier to the silicone composition is 0.1% to 5%. For example, the mass ratio of the tackifier to the silicone composition is 0.1% to 1%; or, the mass ratio of the tackifier to the silicone composition is 1% to 2%; or, the mass ratio of the tackifier to the silicone composition is 2% to 3%; or, the mass ratio of the tackifier to the silicone composition is 3% to 4%; or, the mass ratio of the tackifier to the silicone composition is 4% to 5%.

[0095] In some embodiments of the present application, the type of the tackifier is not particularly limited. For example, the tackifier is selected from KA1003 (vinyl trichlorosilane), KBM-1003 (vinyl trimethoxysilane), KBE-1003 (vinyl triethoxysilane), KBM-573 (phenyl aminopropyl trimethoxysilane), KBE-9007 (γ-isocyanate propyl triethoxysilane), KBM-5103 (acrylate propyl trimethoxysilane), KH-550 (γ-aminopropyl triethoxysilane), The tackifier may be selected from one or more of: KBM-603 (N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane), KBM-602 (γ-glycidoxypropylmethyldiethoxysilane), KH-560 (γ-glycidoxypropyltrimethoxysilane), KH-570 (γ-methacryloxypropyltrimethoxysilane), KH-580 (γ-mercaptopropyltrimethoxysilane), KBM-703 (γ-chloropropyltriethoxysilane), and X-12-817H (triethoxymethylsilane). Preferably, the tackifier is selected from one or more of KH550, KH560, KH570, KH580, and KH590.

[0096] In some embodiments of the present application, the silicone composition further comprises a leveling agent, and the mass ratio of the leveling agent to the silicone composition is 0.1% to 5%. Furthermore, the mass ratio of the leveling agent to the silicone composition is 0.1% to 3%. Exemplarily, the mass ratio of the leveling agent to the silicone composition is 0.1%, or 0.2%, or 0.5%, 0.8%, or 1.0%, or 1.5%, 2.0%, or 2.5%, or 3.0%.

[0097] It should be noted that the type of the leveling agent is not particularly limited. For example, in some embodiments of the present application, the leveling agent includes TEGO Glide 450, TEGO Glide 410, TEGO Glide 100, Glide ZG400, Glide 415, Flow 300, Flow 370, Flow 482, BYK 358N, BYK 066N, BYK 397, BYK 330, BYK 320, BYK 333, BYK 331, BYK 346, BYK 310, BKY 331, BYK 348, BYK A555, BKY 378, BYK3560, BYK306, BYK 345, UV-3510, SILCLEAN 3700, DYNWET 800N, BYK 322, BYK 323, BYK325N, BYK 371, BYK 300, BYK 399, BYK 342, BYK 370, BYKETOL WS, BYKETOL SPECIAL, YCK1200, YCK 1300, YCK 1400, sago 6007, sago 3400, sago 3365, Efka FL 3777, Efka FL3600, Efka SL 3031, Efka SL 3035, Levaslip 435, Levaslip 875, Levaslip 879, Levaslip 872, Levaslip810, Levaslip 466, Levelol 839, SLIP-AYD FS 444, Modaflow Resin, ADDITOL VXW 6503N or any mixture thereof. Preferably, YCK 1200, YCK 1400, Sago 6007, Sago 3400, BYK 330 or any mixture thereof, more preferably, YCK 1200, Sago 6007.

[0098] In some embodiments of the present application, the organosilicon composition further comprises an inorganic filler, and the mass ratio of the inorganic filler to the organosilicon composition is 0.1% to 30%. For example, the mass ratio of the inorganic filler to the organosilicon composition is 0.1% to 5%; or, the mass ratio of the inorganic filler to the organosilicon composition is 5% to 10%; or, the mass ratio of the inorganic filler to the organosilicon composition is 10% to 15%; or, the mass ratio of the inorganic filler to the organosilicon composition is 15% to 20%; or, the mass ratio of the inorganic filler to the organosilicon composition is 20% to 25%; or, the mass ratio of the inorganic filler to the organosilicon composition is 25% to 30%.

[0099] It should be noted that the type of the inorganic filler is not particularly limited. In some embodiments of the present application, for example, the inorganic filler is an inorganic filler having a reactive functional group on its surface after modification and / or an inorganic filler that has not been surface-modified; the inorganic filler is selected from at least one of fumed silica, silica, calcium carbonate, alumina, and aluminum hydroxide; the reactive functional group is a functional group reactive with the mercapto silicone oil / resin, or acetylene silicone oil or resin, or vinyl silicone oil or resin, and is selected from at least one of an epoxy group, an ethylenically unsaturated bond, an amino group, a carboxyl group, a hydroxyl group, and a mercapto group, preferably at least one of an ethylenically unsaturated bond and a mercapto group. These reactive functional groups increase the binding force by forming chemical bonds with the mercapto silicone oil / resin, acetylene silicone oil or resin.

[0100] In some embodiments of the present application, the particle size of the inorganic filler is 0.001 μm to 20 μm. For example, the particle size of the inorganic filler is 0.001 μm to 0.1 μm; or, the particle size of the inorganic filler is 0.01 μm to 0.15 μm; or, the particle size of the inorganic filler is 0.1 μm to 10 μm; or, the particle size of the inorganic filler is 1 μm to 20 μm. Preferably, the particle size of the inorganic filler is 0.05 to 2 μm.

[0101] In some embodiments of the present application, the organosilicon composition further comprises a defoaming agent, and the mass ratio of the defoaming agent to the organosilicon composition is 0.1% to 0.5%. For example, the mass ratio of the defoaming agent to the organosilicon composition is 0.1%, or 0.2%, or 0.3%, or 0.4%, or 0.5%.

[0102] It should be noted that the type of the defoaming agent is not particularly limited. For example, the defoaming agent is selected from one or more of Defom 6800, SGR1830, BYK034, and BYK1796.

[0103] The second aspect of the present application provides a wafer bonding pair, which includes a first wafer, a second wafer and an adhesive layer arranged in a stacked manner, wherein the adhesive layer is used to bond the first wafer and the second wafer, and the adhesive layer is formed by curing the aforementioned silicone composition. Exemplarily, the diameter of the first wafer and the second wafer is 8 inches. The bonding pair obtained in the embodiment of the present application can meet the requirement that after operating under PECVD at 300°C for 20 minutes, the thinned bonding pair is observed under an ultrasonic scanning microscope (SAM) to have no obvious voids or defects, and can meet the requirements of high-temperature processes.

[0104] Furthermore, the bonded pairs obtained in the embodiments of the present application have good resistance to solvent corrosion and do not crack after the wet process, thus meeting the requirements of the wet process and cleaning process. The type of solvent is not particularly limited, and specific examples include: tetramethylammonium hydroxide, dimethyl sulfoxide, dimethylformamide, acetone, propylene glycol methyl ether acetate, isopropyl methyl pyrrolidone, ethylene glycol, methanol, hydrochloric acid (36%), ammonium hydroxide (30%), phosphoric acid (8%), hydrogen peroxide (15%), or any mixture thereof.

[0105] A third aspect of the present application provides a process for preparing a wafer bonding pair, comprising the following steps:

[0106] (1) Cleaning the first wafer and the second wafer to be bonded. For example, the first wafer and the second wafer have the same size and no surface damage, for example, the diameter of the first wafer and the second wafer is 8 inches.

[0107] (2) Spin coating the above-mentioned organosilicon composition on the first wafer or the second wafer. For example, the spin coating thickness is controlled to be 30 μm, and the total thickness variation (TTV) is controlled within 2% of the thickness of the adhesive layer.

[0108] (3) Bonding is performed using a bonding machine. For example, the first wafer or the second wafer coated with glue is positioned at the bottom, and the other of the first wafer or the second wafer is positioned at the top. The first wafer and the second wafer are bonded together using a bonding machine. Before bonding, an isolation sheet is used to separate the wafers. When the vacuum level in the bonding machine chamber drops below 550 N, the isolation sheet is ejected, and a pressure of 1000 N is applied at room temperature for 1 minute. The vacuum is then released, and bonding is complete.

[0109] (4) UV-curing box. For example, a medium pressure mercury lamp 300mW / cm 2 The organic silicon composition is completely cured in a curing box for 180 seconds to obtain a wafer bonding pair.

[0110] A fourth aspect of the present application provides a photocurable film, which is formed by curing the above-mentioned organosilicon composition. Preferably, the thickness of the photocurable film is 5 to 150 μm, more preferably 20 to 60 μm.

[0111] Example 1

[0112] First, 50 parts of vinyl-terminated silicone oil, 10 parts of ethynyl-terminated silicone oil, and 40 parts of mercapto silicone oil were added to a brown reagent bottle. Next, a photoinitiator, a tackifier, a leveling agent, a defoamer, and an inorganic filler were added to the bottle and mixed thoroughly in a planetary mixer. Finally, the mixture was ultrasonically cleaned in an ultrasonic cleaner to remove air bubbles, yielding an organosilicon composition. The viscosity of the vinyl-terminated silicone oil was 500 mPa·s, and the vinyl content was 0.2 mmol / g. The viscosity of the ethynyl-terminated silicone oil was 500 mPa·s, and the ethynyl content was 0.1 mmol / g. The viscosity of the mercapto silicone oil was 500 mPa·s, and the mercaptopropyl content was 0.4 mmol / g.

[0113] The prepared organosilicon composition was applied to a carrier wafer. The wafer was bonded at room temperature using a wafer bonder and then placed in a UV curing box for complete curing. The relevant properties were then tested, and the results are shown in Table 2.

[0114] Example 2 to Example 8

[0115] The preparation method is similar to that of Example 1, except that the raw materials in the organosilicon composition are different, for details refer to Table 1. “ / ” indicates a component not added.

[0116] Comparative Example 1:

[0117] The material used in Comparative Example 1 is temporary bonding material WLPTB130 produced by Shenzhen Huaxun Semiconductor Materials Co., Ltd., which is used directly.

[0118] Comparative Example 2:

[0119] First, 60 parts vinyl-terminated silicone oil and 40 parts hydrogen-containing silicone oil were added to a brown reagent bottle, calculated by weight. Karstedt catalyst, tackifier, leveling agent, defoamer, and inorganic filler were then added to the bottle. The mixture was stirred and mixed in a planetary mixer. Finally, the mixture was ultrasonically cleaned in an ultrasonic cleaner to remove air bubbles, yielding an organosilicon composition. The viscosity of the vinyl-terminated silicone oil was 500 mPa·s, and the vinyl content was 0.2 mmol / g. The viscosity of the hydrogen-containing silicone oil was 500 mPa·s, and the hydrogen content was 0.4 mmol / g.

[0120] Experimental testing

[0121] Thermogravimetric analysis (TGA) of the silicone composition: The heat resistance of the silicone composition was characterized using a TGA55 thermogravimetric analyzer. The test atmosphere was nitrogen and the scanning speed was 10°C / min. The test results are shown in Figure 2. Figure 1 As shown;

[0122] Curing behavior of silicone compositions was studied using a DSC 2500 differential scanning calorimeter, a photocalorimeter accessory, and an Omni Cure SERIES 2000 light curing system. The radiation intensity was 60 mW / cm 2 , the test results are as follows Figure 2 As shown;

[0123] Thermal stability analysis of the bond pair: After operating under PECVD (Plasma Enhanced Chemical Vapor Deposition) at 300°C for 20 minutes, the thinned bond pair was observed under a scanning ultrasonic microscope (SAM) to see if there were any voids or defects. The test results are as follows: Figure 3 shown.

[0124] Chemical resistance test of bonded pairs: soak the bonded pairs in solvents in turn, soak them at room temperature for 20 minutes, and test whether the bonded pairs are cracked. The test results are as follows: Figure 4 shown.

[0125] Table 1

[0126]

[0127]

[0128] Table 2

[0129]

[0130] The test results in Table 2 above demonstrate that the light-curing silicone exhibits excellent thermal stability with a mass loss of less than 5% at 420°C. Furthermore, the silicone cures within 20 seconds, demonstrating high efficiency and speed. Compared to Comparative Example 1, the thermal stability is significantly improved, and the curing time is also shortened. Compared to Comparative Example 2, the curing time is even more significantly shortened.

[0131] from Figure 1 It can be seen that the cured silicone compositions in the embodiments of the present application lose less than 5% of their mass at 420°C, which means that they can cope with a series of high-temperature operations in wafer post-processing and ensure that they will not fail or debond in subsequent processes.

[0132] from Figure 2 It can be seen from the figure that the organosilicon composition in the embodiment of the present application is photocured after being irradiated with ultraviolet light for 15 seconds, and has a high curing efficiency.

[0133] from Figure 3 It can be seen that in the embodiment of the present application, the SAM diagram of the bonding pair after PECVD has no obvious defects and can meet the requirements of high-temperature process.

[0134] like Figure 4As shown in the figure, (a), (b) and (c) respectively represent schematic diagrams of three positions before immersion, (d) represents a schematic diagram of the same position after immersion as (a), (e) represents a schematic diagram of the same position after immersion as (b), and (f) represents a schematic diagram of the same position after immersion as (c). It can be seen that in the embodiment of the present application, there is no cracking of the edge of the bonding pair after immersion in the cleaning solvent, indicating that TBM (temporary bonding material, also known as silicone composition) has good chemical resistance and can meet the requirements of wet process and cleaning process.

[0135] The above is a detailed introduction to the technical solutions provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for those skilled in the art, based on the ideas of the present application, there may be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. An organosilicon composition, calculated by mass percentage, characterized in that: include: Unsaturated silicone oil and / or unsaturated silicone resin 49.5% to 75%; Mercapto silicone oil and / or mercapto silicone resin 24.5% to 50%; Photoinitiator 0.1% to 5%; The unsaturated silicone oil or unsaturated silicone resin includes an unsaturated functional group, and the unsaturated functional group includes an acetylene group.

2. The organosilicon composition according to claim 1, wherein The silicone composition comprises at least one of the following features (1) to (5); (1) The unsaturated silicone oil includes ethynyl silicone oil, the ethynyl silicone oil includes the ethynyl group, and the content of the ethynyl group in the ethynyl silicone oil is 0.01 mmol / g to 1 mmol / g; (2) The unsaturated silicone resin includes an ethynyl silicone resin, the ethynyl silicone resin includes the ethynyl group, and the content of the ethynyl group in the ethynyl silicone resin is 0.01 mmol / g to 1 mmol / g; (3) The content of the unsaturated functional group in the unsaturated silicone oil or unsaturated silicone resin is 0.2 mmol / g to 2 mmol / g; (4) The content of the unsaturated functional group in the unsaturated silicone oil or unsaturated silicone resin is 0.3 mmol / g to 0.7 mmol / g; (5) The unsaturated functional group also includes a vinyl group.

3. The organosilicon composition according to claim 2, wherein The unsaturated silicone oil or unsaturated silicone resin further comprises vinyl silicone oil and / or vinyl silicone resin, the unsaturated functional group further comprises a vinyl group, the vinyl silicone oil and / or vinyl silicone resin comprises the vinyl group, and the mass ratio of the vinyl silicone oil and / or vinyl silicone resin to the silicone composition is 50% to 60%; And / or, the mass fraction of the acetylene silicone oil and / or acetylene silicone resin in the silicone composition is 10% to 75%; And / or, the unsaturated functional group further includes a vinyl group, and the molar ratio of the ethynyl group to the vinyl group in the unsaturated functional group is 0.1-4.

0.

4. The organosilicon composition according to claim 1, wherein The silicone composition comprises at least one of the following features (1) to (4); (1) The mercapto silicone oil and / or mercapto silicone resin includes a mercapto group, and the content of the mercapto group in the mercapto silicone oil and / or mercapto silicone resin is 0.3 mmol / g to 3 mmol / g; (2) The mercapto silicone oil and / or mercapto silicone resin includes a mercapto group, and the content of the mercapto group in the mercapto silicone oil and / or mercapto silicone resin is 0.5 mmol / g to 1.5 mmol / g; (3) The mercapto silicone oil and / or mercapto silicone resin includes a mercapto group, and the molar ratio of the mercapto group to the unsaturated functional group in the silicone composition is (0.8-1.5):1; (4) The mercapto silicone oil and / or mercapto silicone resin includes a mercapto group, and the molar ratio of the mercapto group to the unsaturated functional group in the silicone composition is (0.9-1.1):

1.

5. The organosilicon composition according to claim 1, wherein The silicone composition includes at least one of the following features (1) to (4); (1) The viscosity of the unsaturated silicone oil and / or unsaturated silicone resin is 100 mPa·s to 20,000 mPa·s; (2) The viscosity of the mercapto silicone oil and / or mercapto silicone resin is 100 mPa·s to 20,000 mPa·s; (3) The number average molecular weight of the unsaturated silicone oil and / or unsaturated silicone resin is 2000 g / mol to 20000 g / mol; (4) The number average molecular weight of the mercapto silicone oil and / or mercapto silicone resin is 2000 g / mol to 20000 g / mol.

6. The organosilicon composition according to claim 1, wherein The unsaturated silicone oil includes at least one of double-terminated acetylene silicone oil, single-terminated acetylene silicone oil, and polyacetylene silicone oil; And / or, the unsaturated silicone resin includes at least one of a double-terminated acetylene resin, a single-terminated acetylene resin, and a polyacetylene resin; And / or, the mercapto silicone oil or mercapto silicone resin includes a mercapto substituent, the structural formula of the mercapto substituent is -(CH2) n SH, n is an integer from 1 to 6; And / or, the mercapto silicone oil includes at least one of a branched mercapto silicone oil, a carboxyl-terminated branched mercapto silicone oil, and a branched phenyl mercapto silicone oil; And / or, the mercapto silicone resin includes at least one of a branched mercapto silicone resin, a carboxyl-terminated branched mercapto silicone resin, and a branched phenyl mercapto silicone resin.

7. The organosilicon composition according to claim 3, wherein The vinyl silicone oil includes at least one of double-end-capped vinyl silicone oil, single-end-capped vinyl silicone oil, polyvinyl silicone oil, low-ring vinyl silicone oil, and phenyl vinyl silicone oil; And / or, the vinyl silicone resin includes at least one of vinyl silicone resin, phenyl vinyl silicone resin, and vinyl POSS.

8. The organosilicon composition according to claim 1, wherein The silicone composition includes at least one of the following features (1) to (4); (1) The organosilicon composition further includes a tackifier; (2) The organosilicon composition further includes a leveling agent; (3) The organosilicon composition further includes an inorganic filler; (4) The organosilicon composition further comprises a defoaming agent.

9. The organosilicon composition according to claim 1, wherein The organosilicon composition satisfies one of the conditions (1) to (5); (1) The organosilicon composition further comprises a tackifier, and the mass percentage of the tackifier to the organosilicon composition is 0.1% to 5%; (2) The organic silicon composition further comprises a leveling agent, and the mass percentage of the leveling agent to the organic silicon composition is 0.1% to 5%; (3) The organosilicon composition further comprises an inorganic filler, and the mass percentage of the inorganic filler to the organosilicon composition is 0.1% to 30%; (4) The organosilicon composition further comprises an inorganic filler, and the particle size of the inorganic filler is 0.001 μm to 20 μm; (5) The organosilicon composition further comprises a defoaming agent, and the mass percentage of the defoaming agent to the organosilicon composition is 0.1% to 5%.

10. A photocurable film, characterized in that: The photocurable film is formed by curing the organosilicon composition according to any one of claims 1 to 9.

11. A wafer bonding pair, characterized in that: The wafer bonding pair includes a first wafer, a second wafer and an adhesive layer that are stacked together; the adhesive layer is used to bond the first wafer and the second wafer, and the adhesive layer is formed by curing the organic silicon composition described in any one of claims 1 to 9.

Images