A wafer loading and unloading machine, a chip testing equipment, and its control method.

Abstract

This invention provides a wafer loading / unloading machine, a chip testing equipment, and a control method thereof, relating to the field of wafer testing technology. The conveying mechanism of this invention includes a conveyor tray for transporting wafers between a wafer loading mechanism, a wafer unloading mechanism, and a testing machine. The conveyor tray has a loading area and an unloading area. The loading area is used to place the chip under test (DUT), and the unloading area is used to place the chip already tested. A first adsorption component of the loading / unloading mechanism is used to transport the DUT from the wafer loading mechanism to the loading area, and a second adsorption component is used to transport the chip already tested from the unloading area to the wafer unloading mechanism. This technical solution uses the same conveyor tray to transport both the DUT and the chip already tested, allowing for simultaneous loading and unloading, reducing the number of transport steps and thus improving chip testing efficiency.

Description

Technical Field

[0001] This invention relates to the field of wafer testing technology, and in particular to a wafer loading and unloading machine, chip testing equipment, and its control method. Background Technology

[0002] During chip testing, a loading tray is used to transport chips from the loading mechanism to the testing mechanism for testing. After the chips complete testing, a unloading tray is used to transport them from the testing mechanism to the unloading mechanism for unloading. This transport method results in a large number of chip transports, leading to low chip testing efficiency. Therefore, there is an urgent need to design a wafer loading and unloading machine that can improve testing efficiency. Summary of the Invention

[0003] One objective of this invention is to provide a wafer loading and unloading machine that solves the technical problem of low testing efficiency caused by the large number of feeding operations in existing chip loading and unloading machines.

[0004] A further objective of the present invention is to provide a chip testing device having the above-mentioned wafer loading and unloading machine.

[0005] Another objective of this invention is to provide a control method applicable to the aforementioned chip testing equipment.

[0006] Specifically, the present invention provides a wafer loading and unloading machine, comprising:

[0007] A wafer loading mechanism is used to convey a wafer along a first horizontal direction to a loading position, wherein the wafer has multiple chips to be tested;

[0008] At least one wafer unloading mechanism is arranged on the same side as the wafer loading mechanism, and is used to transport the carrier tray carrying the tested chip from the unloading position to the hopper.

[0009] A conveying mechanism includes a first conveying section, a second conveying section, and at least one conveying tray; the first conveying section and the second conveying section are arranged in a docking manner; the first conveying section is located on one side of the wafer loading mechanism and the wafer unloading mechanism, and the second conveying section is located on one side of the testing mechanism; the conveying tray can be controllably moved back and forth between a first loading / unloading position of the first conveying section and a second loading / unloading position of the second conveying section; the conveying tray has a loading area and an unloading area, the loading area is used to place the chip to be tested, and the unloading area is used to place the tested chip after testing.

[0010] The loading and unloading conveying mechanism includes a first adsorption component and a second adsorption component. Both the first adsorption component and the second adsorption component are configured to be movable along a second horizontal direction. The first adsorption component is used to transport the chip under test on the wafer loading mechanism to the loading area; the second adsorption component is used to transport the chip under test in the unloading area to the carrier tray of the wafer unloading mechanism. The second horizontal direction is perpendicular to the first horizontal direction.

[0011] Optionally, the loading and unloading conveying mechanism includes loading and unloading conveying guide rails;

[0012] The loading and unloading transport guide rail is arranged along the second horizontal direction. The first adsorption component moves in a controlled manner along the loading and unloading transport guide rail, thereby being able to move back and forth between the loading position and the first loading and unloading position, thereby being able to transport the chip under test on the wafer to the transport tray.

[0013] The second adsorption component moves in a controlled manner along the loading and unloading conveying guide, thereby being able to reciprocate between the first loading / unloading position and the unloading position, thereby being able to transport the tested chip in the conveying tray to the carrier tray of the unloading position.

[0014] Optionally, the wafer unloading mechanism includes a first wafer unloading mechanism and a second wafer unloading mechanism arranged on the same side and in parallel, with the first wafer unloading mechanism disposed between the wafer loading mechanism and the second wafer unloading mechanism; the first wafer unloading mechanism and the second wafer unloading mechanism are respectively used to unload chips with different test results.

[0015] Optionally, the first wafer unloading mechanism includes:

[0016] A first carrier platform is arranged opposite to the conveying mechanism. A first carrier plate is provided on the first carrier platform, and the first carrier plate is used to receive the corresponding tested chip.

[0017] The first guide rail is arranged on one side of the conveying mechanism along the first horizontal direction;

[0018] The feeding tray is slidably mounted on the first guide rail, and the second adsorption component controls the placement of the tested chip on the conveyor tray onto the feeding tray;

[0019] A first sliding component is arranged above the first bearing platform along the second horizontal direction;

[0020] The third adsorption component is slidably mounted on the first sliding component and is used to transfer the tested chip on the feeding tray to the first carrier tray.

[0021] Optionally, the first wafer unloading mechanism further includes:

[0022] The first material feeding hopper is located on the front side of the first bearing platform;

[0023] The first robotic arm is slidably mounted on the first guide rail and is used to clamp the first carrier plate and move it into the first unloading hopper.

[0024] Optionally, the loading and unloading conveying mechanism further includes:

[0025] The second sliding component is mounted on top of the wafer loading mechanism, the wafer unloading mechanism and the conveying mechanism along the second horizontal direction and is arranged parallel to the first sliding component. Both the first adsorption component and the second adsorption component can be slidably mounted on the second sliding component.

[0026] The wafer loading and unloading machine also includes:

[0027] A waste tray is installed on the side of the conveying mechanism near the wafer unloading mechanism to hold damaged tested chips.

[0028] Optionally, the second wafer feeding mechanism includes:

[0029] The second material hopper is arranged in parallel with the first material hopper;

[0030] The second carrier platform is arranged along the first horizontal direction. The second carrier platform is provided with a second carrier plate, which is used to receive the corresponding tested chip.

[0031] The second guide rail is arranged along the first horizontal direction;

[0032] The second robotic arm is slidably mounted on the second guide rail and is used to clamp the second carrier plate to move it into the second unloading hopper.

[0033] Optionally, the wafer loading mechanism includes:

[0034] The loading hopper is used to store wafers to be loaded.

[0035] A third support platform, arranged along the first horizontal direction, is used to support the wafer;

[0036] The third guide rail is arranged along the first horizontal direction;

[0037] The third robotic arm is slidably mounted on the third guide rail for clamping the wafer in the loading bin and moving the wafer to the third support platform.

[0038] In particular, the present invention also provides a chip testing device, comprising:

[0039] Such as the wafer loading and unloading machine mentioned above;

[0040] The testing mechanism is disposed at one end of the wafer loading mechanism and the wafer unloading mechanism along the wafer loading direction; the testing mechanism includes a testing machine, at least one testing transport device, and at least one testing support.

[0041] The test transport device is configured to controllably transport the tested chip in the test carrier to the transport tray, and to controllably transport the chip to be tested in the transport tray on the second transport section to the test carrier.

[0042] The test carrier is configured to reciprocate between the test machine and the test transport device, thereby enabling it to carry the chip under test and cooperate with the test machine to perform functional testing on the chip under test.

[0043] Optionally, it also includes:

[0044] A sealing assembly is disposed at the junction of the second conveying section and the first conveying section, and is arranged on one side of the testing mechanism;

[0045] The sealing assembly has a sealing cavity for accommodating the conveyor tray; an air passage assembly is provided in the sealing cavity, and the air passage assembly is controlled to perform air extraction or air filling operations on the sealing cavity, so that the conveying environment of the conveyor tray can be switched by controlling the air passage assembly during the process of the conveyor tray being conveyed from the first conveying section through the sealing cavity to the second conveying section.

[0046] Optionally, the testing mechanism includes two test handling devices and two test support seats;

[0047] The two test handling devices are respectively arranged opposite each other on both sides of the test machine; the two test support seats are arranged in a one-to-one correspondence with the two test handling devices;

[0048] The conveying mechanism includes two conveying discs; the second conveying section includes a branch conveying section one and a branch conveying section two, which are arranged collinearly along a second horizontal direction;

[0049] The sealing assembly is disposed between the first branch conveying section and the second branch conveying section;

[0050] The two conveyor discs can alternately pass through the sealed cavity and then move along the first conveyor section and the second conveyor section of the branch road, respectively;

[0051] Both sets of test transport devices are used to transport the chip under test in the corresponding transport tray to the corresponding test carrier, and to transport the tested chip in the test carrier to the transport tray; the two test carriers can be controlled to move alternately along the second direction to the test position of the test machine.

[0052] Optionally, the present invention also provides a control method for a chip testing device, applied to the aforementioned chip testing device, comprising the following steps:

[0053] In response to a feeding trigger command, the first adsorption component is controlled to pick up the chip under test from the wafer feeding mechanism and transport the chip under test to the feeding area of ​​the conveyor tray; in response to a discharging trigger command, the second adsorption component is controlled to pick up the tested chip from the discharging area of ​​the conveyor tray and transport the tested chip to the carrier tray of the wafer discharging mechanism. The feeding trigger command and the discharging trigger command are triggered synchronously.

[0054] Control the conveyor plate to transport materials from the first loading / unloading position of the first conveyor section to the second loading / unloading position of the second conveyor section;

[0055] The test transport device is controlled to transport the tested chip on the test carrier to the unloading area of ​​the conveyor tray;

[0056] The test transport device is controlled to transport the chip under test from the loading area to the test carrier.

[0057] The test carrier is controlled to move to the test position of the test machine, and the test machine is controlled to perform performance testing on the chip under test.

[0058] Optionally, the step of controlling the second adsorption component to pick up the tested chip from the unloading area of ​​the conveyor tray and transport the tested chip to the wafer unloading mechanism specifically includes the following steps:

[0059] Based on the test results of the tested chip, the second adsorption component is controlled to transport the tested chip on the unloading area to the corresponding first wafer unloading mechanism or second wafer unloading mechanism.

[0060] Optionally, the step of controlling the second adsorption component to transport the tested chip on the unloading area to the corresponding first wafer unloading mechanism or second wafer unloading mechanism based on the test results of the tested chip specifically includes the following steps:

[0061] If the test result of the tested chip meets the first preset condition, the second adsorption component is controlled to adsorb the tested chip in the feeding area and move along the second sliding component to place the tested chip on the feeding tray.

[0062] Control the feeding tray to move along the first guide rail to the target feeding position;

[0063] The third adsorption component is controlled to adsorb the tested chip on the feeding tray and move along the first sliding component to place the tested chip on the first carrier tray.

[0064] Optionally, the step of controlling the second adsorption component to transport the tested chip on the unloading area to the corresponding first wafer unloading mechanism or second wafer unloading mechanism based on the test results of the tested chip further includes the following steps:

[0065] If the test result of the tested chip meets the second preset condition, the second adsorption component is controlled to adsorb the tested chip in the feeding area and move along the second sliding component to place the tested chip on the second carrier plate. The second preset condition is different from the first preset condition.

[0066] In this invention, the conveying mechanism includes a conveyor tray for transporting wafers between a wafer loading mechanism, a wafer unloading mechanism, and a testing machine. The conveyor tray has a loading area and an unloading area. The loading area is used to place the chip under test (DUT), and the unloading area is used to place the chip already tested. A first adsorption component of the loading / unloading mechanism is used to transport the DUT from the wafer loading mechanism to the loading area, and a second adsorption component is used to transport the chip already tested from the unloading area to the wafer unloading mechanism. This technical solution uses the same conveyor tray to transport both the DUT and the chip already tested, allowing for simultaneous loading and unloading, reducing the number of transport steps and improving chip testing efficiency. Furthermore, the first and second conveyor sections are arranged in a single-track conveying configuration. The conveyor tray can move controllably back and forth between the first loading / unloading position of the first conveyor section and the second loading / unloading position of the second conveyor section, enabling reciprocating transport of the DUT and the chip already tested. Compared to the existing technology that uses a dual-track parallel arrangement for cyclic transport of the chip carrier, this method offers higher transport efficiency and requires less equipment space.

[0067] The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments of the invention in conjunction with the accompanying drawings. Attached Figure Description

[0068] The following sections will describe some specific embodiments of the invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or portions. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0069] Figure 1This is a schematic structural diagram of a wafer loading and unloading machine according to an embodiment of the present invention, taken at one angle.

[0070] Figure 2 This is a schematic structural diagram of a wafer loading and unloading machine according to an embodiment of the present invention from another angle;

[0071] Figure 3 This is a schematic structural diagram of a first wafer feeding mechanism according to an embodiment of the present invention;

[0072] Figure 4 This is a schematic structural diagram of a conveying mechanism according to an embodiment of the present invention;

[0073] Figure 5 This is a schematic structural diagram of a first vision detection mechanism and a second vision detection mechanism according to an embodiment of the present invention;

[0074] Figure 6 This is a schematic structural diagram of a first adsorption component according to an embodiment of the present invention;

[0075] Figure 7 This is a schematic structural diagram of a sealing assembly according to an embodiment of the present invention;

[0076] Figure 8 This is a schematic structural diagram of a testing mechanism according to an embodiment of the present invention;

[0077] Figure 9 This is a schematic flowchart of a control method for a chip testing device according to an embodiment of the present invention;

[0078] Figure 10 This is a schematic flowchart of a control method for a chip testing device according to another embodiment of the present invention.

[0079] Figure label:

[0080] 100-Wafer loading / unloading machine, 200-Wafer, 300-DUT chip, 10-Wafer loading mechanism, 11-Loading hopper, 12-Third support platform, 21-First wafer unloading mechanism, 22-Second wafer unloading mechanism, 211-First unloading hopper, 212-First robotic arm, 213-First guide rail, 214-First support platform, 215-Unloading tray, 216-Third adsorption component, 217-Second slide rail, 218-First support, 221-Second unloading hopper, 222-Second support platform, 223-Second robotic arm, 224-Second guide rail, 225-Fourth slide rail, 30-Frame, 40-Loading / unloading transport Mechanism, 41-Third slide rail, 42-First adsorption component, 421-Adsorption rod, 43-Second adsorption component, 44-Second bracket, 50-Conveying mechanism, 51-First conveying section, 52-Conveying tray, 521-Feeding area, 522-Discharging area, 53-Second conveying section, 531-Branch 1 conveying section, 532-Branch 2 conveying section, 60-First vision inspection mechanism, 70-Second vision inspection mechanism, 80-Waste tray, 90-Sealing component, 91-First sealing door, 92-Second sealing door, 94-Testing machine, 95-Testing support, 96-Testing transport device, 961-Material handling device, 962-Transporting guide rail. Detailed Implementation

[0081] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0082] In the description of this invention, it should be understood that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0083] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically stated, this indicates that other features are not excluded and may be further included.

[0084] Unless otherwise expressly specified and limited, the terms "connection," "installation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0085] Unless otherwise specified, all terms (including technical and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0086] Figure 1 This is a schematic structural diagram of a wafer loading and unloading machine 100 according to an embodiment of the present invention, taken at one angle. Figure 2 This is a schematic structural diagram of a wafer loading and unloading machine 100 according to an embodiment of the present invention from another angle. Figure 3 This is a schematic structural diagram of the first wafer feeding mechanism 21 according to an embodiment of the present invention. Figure 4 This is a schematic structural diagram of a conveying mechanism 50 according to an embodiment of the present invention.

[0087] like Figures 1 to 4As shown, in a specific embodiment, the wafer loading / unloading machine 100 includes a wafer loading mechanism 10, at least one wafer unloading mechanism, a conveying mechanism 50, and a loading / unloading transport mechanism 40. The wafer loading mechanism 10 is used to convey wafers 200 along a first horizontal direction to the loading position, and the wafers 200 have multiple chips 300 to be tested. The wafer unloading mechanism is arranged on the same side as the wafer loading mechanism 10 and is used to convey a carrier tray carrying the tested chips from the unloading position to the hopper. The conveying mechanism 50 includes a first conveying section 51, a second conveying section 53, and at least one conveying tray 52. ​​The first conveying section 51 and the second conveying section 53 are arranged in a mating arrangement. The first conveying section 51 is located on one side of the wafer loading mechanism 10 and the wafer unloading mechanism, and the second conveying section 53 is located on the testing mechanism side. The conveying tray 52 can be controllably moved back and forth between the first loading / unloading position of the first conveying section 51 and the second loading / unloading position of the second conveying section 53. The conveyor tray 52 has a loading area 521 and a unloading area 522. The loading area 521 is used to place the chip under test 300, and the unloading area 522 is used to place the tested chip after testing. The loading and unloading conveying mechanism 40 includes a first adsorption component 42 and a second adsorption component 43. Both the first adsorption component 42 and the second adsorption component 43 are configured to be movable along a second horizontal direction. The first adsorption component 42 is used to transport the chip under test 300 on the wafer loading mechanism 10 to the loading area 521. The second adsorption component 43 is used to transport the tested chip in the unloading area 522 to the carrier tray of the wafer unloading mechanism. The second horizontal direction is perpendicular to the first horizontal direction. Here, the first horizontal direction is... Figure 2 The Y-direction and the second horizontal direction are Figure 2 The X direction in the process. The types of chips transported in this embodiment include, but are not limited to, memory chips. When the conveyor tray 52 is located at the first loading / unloading position of the first conveying section 51, the first adsorption component 42 and the second adsorption component 43 can work synchronously, that is, synchronously transport the chip under test 300 on the wafer loading mechanism 10 to the loading area 521 and transport the tested chip in the unloading area 522 to the wafer unloading mechanism. When the conveyor tray 52 is moved in a controlled manner from the first loading / unloading position of the first conveying section 51 to the second loading / unloading position of the second conveying section 53, the loading area 521 of the conveyor tray 52 contains the chip under test 300, and the unloading area 522 is empty. The purpose is to perform loading and unloading synchronously when the conveyor tray 52 is located at the second loading / unloading position. It can be understood that the conveyor tray 52 does not need to wait for chip testing when it is at the second loading / unloading position, thus improving the conveying efficiency.

[0088] This embodiment uses a conveyor tray 52 to synchronously transfer the chip to be tested 300 and the chip already tested. It can unload while loading, which can reduce the number of conveying operations and thus improve the chip testing efficiency.

[0089] The arrangement of the first conveying section 51 and the second conveying section 53 can be understood as the second conveying section 53 being an extension of the first conveying section 51, forming a monorail conveying system. Furthermore, the conveying tray 52, with its loading area 521 and unloading area 522, can controllably move back and forth between the first loading / unloading position of the first conveying section 51 and the second loading / unloading position of the second conveying section 53, thereby enabling the reciprocating conveying of the chip under test and the unloading of the tested chip. Compared with the traditional method of using a dual-track parallel arrangement with a pushing mechanism to achieve the cyclic conveying of the chip carrier, this solution offers higher conveying efficiency, smaller equipment footprint, and lower investment costs.

[0090] In some embodiments, the first conveying section 51 is a slide rail arranged along a first horizontal direction, and the conveying tray 52 is slidably mounted on the first conveying section 51. This can be understood as the conveying tray 52 being able to slide along the slide rail in the first horizontal direction. The testing mechanism is located behind the wafer loading / unloading machine 100, and the conveying tray 52 can move along the first conveying section 51 into the testing mechanism.

[0091] In some embodiments, the first conveying section 51 and the second conveying section 53 are arranged vertically. A multi-directional conveying device is provided between the first conveying section 51 and the second conveying section 53. The multi-directional conveying device includes a moving mechanism and a lifting motion module. The moving mechanism can reciprocate the conveying tray 52 along a first horizontal direction, that is, it can receive the conveying tray 52 conveyed from the first conveying section 51 and can also transfer the conveying tray 52 to the first conveying section 51. The lifting motion module includes a lifting platform and at least one transmission mechanism disposed on the lifting platform. The lifting platform can drive the transmission mechanism to move up and down. The transmission mechanism can reciprocate the conveying tray 52 along a second horizontal direction, that is, it can receive the conveying tray 52 conveyed from the second conveying section 53 and can also transfer the conveying tray 52 to the second conveying section 53.

[0092] Specifically, the moving mechanism and the lifting motion module can be stacked, meaning the lifting platform can drive the transmission mechanism to move up and down relative to the transmission surface of the moving mechanism. Further, the lifting platform can drive the transmission mechanism to a first working height or a second working height. The first working height is the height at which the transmission surface of the transmission mechanism is lower than the transmission surface of the moving mechanism, and the second working height is the height at which the transmission surface of the transmission mechanism is higher than the transmission surface of the moving mechanism. When the lifting platform drives the transmission mechanism to the first working height, the transmission surface of the transmission mechanism is lower than the transmission surface of the moving mechanism. At this time, the moving mechanism can receive the conveyor tray 52 conveyed along the first conveying section 51 and drive it to move along the first horizontal direction, thereby moving the conveyor tray 52 into the cavity of the multi-directional conveying device. In this state, as the lifting platform drives the transmission mechanism to rise from the first working height to the second working height, the transmission surface of the transmission mechanism can receive the conveyor tray 52 on the moving mechanism and drive it to move along the second horizontal direction, thereby conveying it to the second conveying section 53; thus realizing the reciprocating movement of the conveyor tray 52 on the first conveying section 51 and the second conveying section 53. The first horizontal direction is perpendicular to the second horizontal direction.

[0093] In another embodiment, the first conveying section 51 and the second conveying section 53 are arranged to extend and connect along a first horizontal direction. A belt drive mechanism can be provided between the first conveying section 51 and the second conveying section 53. The moving mechanism can reciprocate the conveying disc 52 along the first horizontal direction, that is, it can receive the conveying disc 52 conveyed from the first conveying section 51 and transfer it to the second conveying section 53; it can also receive the conveying disc 52 conveyed from the second conveying section 53 and transfer it to the first conveying section 51. This realizes the reciprocating movement of the conveying disc 52 on the first conveying section 51 and the second conveying section 53.

[0094] In some embodiments, the loading area 521 and the unloading area 522 are the same size, which can be understood as each occupying half of the conveyor tray 52. ​​In other embodiments, the size of the loading area 521 and the unloading area 522 can also be designed according to specific design requirements.

[0095] In some embodiments, the loading / unloading conveying mechanism 40 includes loading / unloading conveying guides. The loading / unloading conveying guides are arranged along a second horizontal direction. A first adsorption component 42 moves controllably along the loading / unloading conveying guides, thereby reciprocating between the loading position and the first loading / unloading position, and thus transporting the chip under test 300 on the wafer 200 into the transport tray 52. ​​A second adsorption component 43 moves controllably along the loading / unloading conveying guides, thereby reciprocating between the first loading / unloading position and the unloading position, and thus transporting the tested chip in the transport tray 52 onto the carrier tray at the unloading position.

[0096] In some embodiments, the wafer unloading mechanism includes a first wafer unloading mechanism 21 and a second wafer unloading mechanism 22 arranged on the same side and in parallel, with the first wafer unloading mechanism 21 positioned between the wafer loading mechanism 10 and the second wafer unloading mechanism 22. The first wafer unloading mechanism 21 and the second wafer unloading mechanism 22 are respectively used to unload chips with different test results. In other embodiments, the number and arrangement of the wafer unloading mechanisms can be determined according to specific design requirements. The carrier tray includes a first carrier tray and a second carrier tray, respectively arranged on the first wafer unloading mechanism 21 and the second wafer unloading mechanism 22.

[0097] In some embodiments, the wafer loading / unloading machine 100 further includes a frame 30, on which the first conveying section 51 of the conveying mechanism 50 and the loading / unloading transport mechanism 40 are both mounted. At least a portion of the wafer loading mechanism 10 is mounted on the frame 30, and at least a portion of the wafer unloading mechanism is mounted on the frame 30. Here, the loading / unloading transport guide rails are arranged on the frame 30 along a second horizontal direction.

[0098] In some embodiments, the first wafer unloading mechanism 21 includes a first carrier platform 214, a first guide rail 213, an unloading tray 215, a first sliding assembly, and a third adsorption assembly 216. The first carrier platform 214 is arranged opposite to the conveying mechanism 50, and a first carrier tray is provided on the first carrier platform 214 for receiving the corresponding tested chip. The first guide rail 213 is arranged along a first horizontal direction on one side of the conveying mechanism 50. The unloading tray 215 is slidably mounted on the first guide rail 213, and the second adsorption assembly 43 controlsably places the tested chip on the conveying tray 52 onto the unloading tray 215. The first sliding assembly is arranged above the first carrier platform 214 along a second horizontal direction. The third adsorption assembly 216 is slidably mounted on the first sliding assembly for transporting the tested chip on the unloading tray 215 to the first carrier tray. Here, the first sliding assembly includes a second slide rail 217 and a first support 218, the first support 218 being mounted along the second horizontal direction on the frame 30 and located above the first carrier tray. The second slide rail 217 is mounted on the first bracket 218 along the second horizontal direction, and the third adsorption assembly 216 is slidably mounted on the second slide rail 217. The chip under test is placed on the blue film of the first carrier plate.

[0099] In some embodiments, the first wafer unloading mechanism 21 further includes a first unloading bin 211 and a first robotic arm 212. The first unloading bin 211 is disposed on the front side of the first carrier platform 214. The first robotic arm 212 is slidably mounted on a first guide rail 213 for gripping the first carrier tray and moving it into the first unloading bin 211. It can be understood that the first carrier tray is a wafer-level carrier tray, and the first robotic arm 212 and the unloading tray 215 share a first guide rail 213, which makes the structure more compact and saves layout space. The first robotic arm 212 grips the steel ring on the outer periphery of the first carrier tray. In other embodiments, the first robotic arm 212 and the unloading tray 215 may each use a separate guide rail, depending on the design requirements.

[0100] This embodiment is equivalent to arranging the first unloading bin 211, the first bearing platform 214 and the conveying mechanism 50 in sequence along the first horizontal direction, which can make the structure of the wafer loading and unloading machine 100 more compact and reduce the size of the wafer loading and unloading machine 100 in the second horizontal direction.

[0101] In some embodiments, the loading and unloading conveying mechanism 40 further includes a second sliding component. The second sliding component is mounted on top of the wafer loading mechanism 10, the wafer unloading mechanism, and the conveying mechanism 50 along a second horizontal direction and is arranged parallel to the first sliding component. The first adsorption component 42 and the second adsorption component 43 are both slidably mounted on the second sliding component. Here, the second sliding component includes a third slide rail 41 and a second support 44. The second support 44 is mounted on the frame 30 along a second horizontal direction. The third slide rail 41 is mounted on the second support 44 along a second horizontal direction. The first adsorption component 42 and the second adsorption component 43 are both slidably mounted on the third slide rail 41, thereby enabling them to slide along the second horizontal direction.

[0102] The wafer loading / unloading machine 100 also includes a waste tray 80, which is installed on the side of the conveying mechanism 50 near the wafer unloading mechanism and is used to place damaged tested chips. Here, the damaged tested chips can be placed into the waste tray 80 by the first adsorption component 42 or the second adsorption component 43.

[0103] In some embodiments, the second wafer unloading mechanism 22 includes a second unloading bin 221, a second carrier platform 222, a second guide rail 224, and a second robotic arm 223. The second unloading bin 221 is arranged side-by-side with the first unloading bin 211. The second carrier platform 222 is arranged along a first horizontal direction and has a second carrier disk for receiving the corresponding tested chip. The second guide rail 224 is also arranged along the first horizontal direction. The second robotic arm 223 is slidably mounted on the second guide rail 224 and is used to grip the second carrier disk to move it into the second unloading bin 221. Here, the second carrier disk is a wafer-level carrier disk. The second wafer unloading mechanism 22 also includes a fourth slide rail 225 mounted on the frame 30 along the first horizontal direction. The second carrier platform 222 is slidably mounted on the fourth slide rail 225, and the second robotic arm 223 grips the steel ring on the outer periphery of the second carrier disk. It can be understood that the second carrier platform 222 is capable of moving along the first horizontal direction.

[0104] In some embodiments, the wafer loading mechanism 10 includes a loading bin 11, a third support platform 12, a third guide rail, and a third robotic arm. The loading bin 11 stores wafers 200 to be loaded. The third support platform 12 is arranged along a first horizontal direction and is used to support the wafers 200. The third guide rail is arranged along the first horizontal direction. The third robotic arm is slidably mounted on the third guide rail and is used to clamp the wafers 200 in the loading bin 11 and move the wafers 200 onto the third support platform 12. Here, the wafer loading mechanism 10 also includes a fifth slide rail mounted on the frame 30 along the first horizontal direction, the third support platform 12 is slidably mounted on the fifth slide rail, and the third robotic arm clamps the steel ring on the outer periphery of the wafer 200. It can be understood that the third support platform 12 can move along the fifth slide rail toward the first horizontal direction. Depending on the size of the third carrier platform 12, the wafer loading mechanism 10 is suitable for loading wafers 200 of different sizes, such as 8-inch wafers or 12-inch wafers. In this solution, the wafer loading mechanism 10 is suitable for loading 12-inch wafers 200.

[0105] Figure 5 This is a schematic structural diagram of a first visual inspection mechanism 60 and a second visual inspection mechanism 70 according to an embodiment of the present invention. Figure 5As shown, in some embodiments, the wafer loading / unloading machine 100 further includes a first vision inspection mechanism 60 and a second vision inspection mechanism 70. The first vision inspection mechanism 60 is installed between the wafer loading mechanism 10 and the first conveying section 51 of the conveying mechanism 50, and is mounted on the rack 30. The first vision inspection mechanism 60 is used to perform surface defect detection on the chip 300 to be tested adsorbed by the first adsorption component 42, which can be understood as loading inspection. The second vision inspection mechanism 70 is installed between the second wafer unloading mechanism 22 and the first conveying section 51 of the conveying mechanism 50, and is mounted on the rack 30. The second vision inspection mechanism 70 is used to perform surface defect detection on the chip already tested adsorbed by the second adsorption component 43, which can be understood as unloading inspection. Here, the first vision inspection mechanism 60 and the second vision inspection mechanism 70 are both prior art, and will not be described in detail here.

[0106] In some embodiments, the wafer loading and unloading machine 100 further includes an edge-finding camera, which is slidably mounted on a third slide rail 41 for edge-finding of the wafer 200 on the third carrier platform 12 and guiding the first adsorption component 42 to adsorb the chip under test 300.

[0107] Figure 6 This is a schematic structural diagram of the first adsorption component 42 according to an embodiment of the present invention. Figure 6 As shown, the first adsorption component 42 includes multiple adsorption rods 421 arranged side by side. Each adsorption rod 421 is used to adsorb one chip 300 to be tested. The first adsorption component 42 can simultaneously adsorb multiple chips 300 to be tested and can transport multiple chips 300 to be tested at one time. Here, the structures of the second adsorption component 43 and the third adsorption component 216 are the same as those of the first adsorption component 42, and will not be described in detail here.

[0108] In some embodiments, the chip testing equipment includes a wafer loading / unloading machine 100 and a testing mechanism as described in any of the above embodiments. The testing mechanism is disposed at one end of the wafer loading mechanism 10 and the wafer unloading mechanism along the wafer 200 loading direction. The testing mechanism includes a testing machine, at least one test transport device, and at least one test carrier. The test transport device is configured to controllably transport the tested chip in the test carrier to the transport tray 52, and to controllably transport the chip to be tested in the transport tray 52 on the second transport section 53 to the test carrier. The test carrier is configured to reciprocate between the testing machine and the test transport device, thereby enabling it to carry the chip to be tested 300 and cooperate with the testing machine to perform functional testing on the chip to be tested 300.

[0109] Figure 7 This is a schematic structural diagram of a sealing assembly 90 according to an embodiment of the present invention. Figure 7As shown, in some embodiments, the chip testing equipment further includes a sealing assembly 90. The sealing assembly 90 is disposed at the junction of the second transport section 53 and the first transport section 51, and is arranged on one side of the testing mechanism. The sealing assembly 90 has a sealed cavity accommodating the transport tray 52, and an air passage assembly is disposed within the sealed cavity. The air passage assembly controls the evacuation or inflation of the sealed cavity, thereby enabling the switching of the transport environment of the transport tray 52 during its transfer from the first transport section 51 through the sealed cavity to the second transport section 53.

[0110] Here, the gas path assembly is used to fill the sealed cavity with dry air or to evacuate the sealed cavity. As the conveyor tray 52 enters the sealed cavity, the gas path assembly continuously fills the sealed cavity with dry air, making it difficult for outside air to enter. As the conveyor tray 52 is transferred from the sealed cavity to the second conveying section 53, the gas path assembly continuously evacuates the sealed cavity, generating negative pressure, allowing gas from inside the testing mechanism to enter the sealed cavity, thus preventing gas from inside the sealed cavity from entering the testing mechanism and effectively controlling the dew point environment within the testing mechanism.

[0111] In some embodiments, the sealing assembly 90 is provided with a first sealing door 91 and at least one second sealing door 92. The first sealing door 91 is connected to a first conveying section 51, and the second sealing door 92 is connected to a second conveying section 53, and both the first sealing door 91 and the second sealing door 92 are controllably openable and closeable. When the first sealing door 91 is open, the sealing cavity is in communication with the first conveying section 51. The first conveying section 51 conveys the conveyor tray 52 into the sealing cavity of the sealing assembly 90. When the second sealing door 92 is open, the sealing cavity is in communication with the second conveying section 53. The second conveying section 53 receives the conveyor tray 52 conveyed from the sealing cavity of the sealing assembly 90. Here, when the first sealing door 91 is open, the gas path assembly continuously fills the sealing cavity with dry air until the first sealing door 91 is closed. When the second sealing door 92 is open, the gas path assembly continuously evacuates the sealing cavity until the second sealing door 92 is closed.

[0112] Figure 8 This is a schematic structural diagram of a testing mechanism according to an embodiment of the present invention. Figure 8 As shown, in one specific embodiment, the testing mechanism includes two test handling devices 96 and two test support seats 95;

[0113] Two test transport devices 96 are respectively arranged opposite each other on both sides of the test machine 94; two test carriers 95 are arranged in a one-to-one correspondence with the two test transport devices 96; the conveying mechanism 50 includes two conveying trays 52; the second conveying section 53 includes a branch conveying section 531 and a branch conveying section 532, which are arranged collinearly along the second horizontal direction.

[0114] The sealing assembly 90 is located between the first branch conveying section 531 and the second branch conveying section 532; the two conveying discs 52 can alternately pass through the sealing cavity and move along the first branch conveying section 531 and the second branch conveying section 532 respectively; the two sets of test transport devices 96 are used to transport the chip under test 300 in the corresponding conveying disc 52 to the corresponding test carrier 95, and to transport the tested chip in the test carrier 95 to the conveying disc 52; the two test carriers 95 can be controlled to alternately move along the second direction to the test position of the test machine 94.

[0115] Specifically, the sealing assembly 90 is provided with two opposing second sealing doors 92, and the two second sealing doors 92 are respectively provided with the first branch conveying section 531 and the second branch conveying section 532; the first conveying section 51 is arranged in a T-shape with the first branch conveying section 531 and the second branch conveying section 532.

[0116] Specifically, the test transport device 96 includes a transport guide rail 962 and a material handling device 961; the material handling device 961 can move controllably along the transport guide rail 962; the two transport guide rails 962 are arranged on both sides of the test machine 94 along the first horizontal direction and correspond to the first branch conveying section 531 and the second branch conveying section 532 respectively.

[0117] Specifically, the arrangement on the left and right sides of the test machine 94 is the same;

[0118] The arrangement of the test machine 94 is described on one side: the conveyor tray 52 can move along the branch conveyor section 531 to the first loading and unloading position, the corresponding material handling device 961 can transport the chip to be tested 300 in the conveyor tray 52 to the corresponding test carrier 95, and the material handling device 961 can also transport the tested chip in the test carrier 95 to the conveyor tray 52.

[0119] Figure 9 This is a schematic flowchart of a control method for a chip testing device according to an embodiment of the present invention. Figure 9 As shown, in a specific embodiment, the control method for the chip testing equipment is applied to the aforementioned chip testing equipment and includes the following steps:

[0120] In step S100, in response to the loading trigger command, the first adsorption component 42 is controlled to pick up the chip under test 300 on the wafer loading mechanism 10 and transport the chip under test 300 to the loading area 521 of the conveyor tray 52; in response to the unloading trigger command, the second adsorption component 43 is controlled to pick up the tested chip on the unloading area 522 of the conveyor tray 52 and transport the tested chip to the carrier tray of the wafer unloading mechanism. The loading trigger command and the unloading trigger command are triggered synchronously.

[0121] Step S200: Control the conveyor plate 52 to convey materials from the first loading / unloading position of the first conveyor section 51 to the second loading / unloading position of the second conveyor section 53.

[0122] Step S300: Control the test transport device to transport the tested chip on the test carrier to the unloading area 522 of the conveyor tray 52;

[0123] Step S400: Control the test transport device to transport the chip under test 300 in the loading area 521 to the test carrier;

[0124] In step S500, the test carrier is moved to the test position of the test machine, and the test machine is controlled to perform performance testing on the chip 300 under test.

[0125] This embodiment uses the same conveyor tray 52 to transport the chip to be tested 300 and the chip already tested. The loading and unloading can be carried out at the same time, which can reduce the number of conveying times and thus improve the chip testing efficiency.

[0126] Figure 10 This is a schematic flowchart of a control method for a chip testing device according to another embodiment of the present invention. Figure 10 As shown, in some embodiments, the step of controlling the second adsorption component 43 to pick up the tested chip on the unloading area 522 of the conveyor tray 52 and transport the tested chip to the wafer unloading mechanism specifically includes the following steps:

[0127] Based on the test results of the tested chip, the second adsorption component 43 is controlled to transport the tested chip on the unloading area 522 to the corresponding first wafer unloading mechanism 21 or second wafer unloading mechanism 22.

[0128] This embodiment provides a first wafer unloading mechanism 21 and a second wafer unloading mechanism 22 for unloading. The second adsorption component 43 moves the tested chip to the first wafer unloading mechanism 21 or the second wafer unloading mechanism 22 for unloading according to the Bin value information of the tested chip given by the tester. The Bin value information corresponding to the first wafer unloading mechanism 21 and the second wafer unloading mechanism 22 are different.

[0129] In some embodiments, the step of controlling the second adsorption component 43 to transport the tested chip on the unloading area 522 to the corresponding first wafer unloading mechanism 21 or second wafer unloading mechanism 22 according to the test results of the tested chip specifically includes the following steps:

[0130] Step S111: If the test result of the tested chip meets the first preset condition, control the second adsorption component 43 to adsorb the tested chip in the feeding area 522 and move along the second sliding component to place the tested chip on the feeding tray 215.

[0131] Step S112: Control the feeding tray 215 to move along the first guide rail 213 to the target feeding position;

[0132] In step S113, the third adsorption component 216 is controlled to adsorb the tested chip on the feeding tray 215 and move along the first sliding component to place the tested chip on the first carrier tray.

[0133] In step S111, the first preset condition corresponds to the first Bin value information. The tested chip is placed on the blue film of the first carrier disk.

[0134] Following step S113, the following steps are also included:

[0135] The first robotic arm 212 is controlled to grip the first bearing plate on the first bearing platform 214 and slide along the first guide rail 213 to move the first bearing plate into the first unloading bin 211, thereby completing the unloading. Here, the first robotic arm 212 grips the steel ring on the first bearing plate.

[0136] In some embodiments, the step of controlling the second adsorption component 43 to transport the tested chip on the unloading area 522 to the corresponding first wafer unloading mechanism 21 or second wafer unloading mechanism 22 according to the test results of the tested chip further includes the following steps:

[0137] In step S114, if the test result of the tested chip meets the second preset condition, the second adsorption component 43 is controlled to adsorb the tested chip in the feeding area 522 and move along the second sliding component to place the tested chip on the second carrier plate. The second preset condition is different from the first preset condition and corresponds to the second Bin value information. It should be noted that there is no sequential relationship between steps S114 and S111. The tested chip is placed on the blue film of the second carrier plate.

[0138] Following step S114, the following steps are also included:

[0139] The second robotic arm 223 is controlled to grip the second bearing plate on the second bearing platform 222 and slide along the second guide rail 224 to move the second bearing plate into the second unloading bin 221, thereby completing the unloading. Here, the second robotic arm 223 grips the steel ring on the second bearing plate.

[0140] In some embodiments, after the second adsorption component 43 adsorbs the tested chip in the unloading area 522, it needs to move the tested chip to the second vision inspection mechanism 70 for surface defect detection. The tested chips that pass the inspection are unloaded according to the first or second preset conditions. The tested chips that fail the inspection are placed on the waste tray 80. Specifically, the second vision inspection mechanism 70 first inspects two sides of the tested chip. After the inspection is completed, the second adsorption component 43 rotates the tested chip 90°, and the second vision inspection mechanism 70 then inspects the other two sides of the tested chip. Here, the second vision inspection mechanism 70 can be understood as a lower vision inspection camera. The second adsorption component 43 adsorbs the tested chip within the detection area of ​​the lower vision inspection camera to complete the vision inspection. That is, the tested chip is always adsorbed by the second adsorption component 43 during the inspection process.

[0141] In some embodiments, the step of controlling the first adsorption component 42 to pick up the chip under test 300 on the wafer loading mechanism 10 and transport the chip under test 300 to the loading area 521 of the conveyor tray 52 in response to the loading trigger command specifically includes the following steps:

[0142] Step S115: Control the third robotic arm to grip the first bearing plate in the loading bin 11, and control the third robotic arm to slide along the third guide rail to move the first bearing plate onto the third bearing platform 12;

[0143] Step S116: Control the edge-finding camera to find the edge of the first carrier plate on the third carrier platform 12, and control the adsorption rod 421 of the first adsorption component 42 to adsorb the chip 300 to be tested on the third carrier plate.

[0144] Step S117: Control the first adsorption component 42 to move the chip under test 300 to the first vision inspection mechanism 60 for inspection;

[0145] Step S118: Control the first adsorption component 42 to place the normally tested chip 300 onto the feeding area 521 of the conveyor tray 52, and place the abnormally tested chip 300 onto the waste tray 80. It should be noted that steps S115 and S111 are not sequential.

[0146] In step S117, the first visual inspection mechanism 60 first inspects two sides of the chip 300 under test. After the inspection is completed, the adsorption rod 421 of the first adsorption component 42 rotates the chip 300 under test by 90°, and then the first visual inspection mechanism 60 inspects the other two sides of the chip 300 under test. Here, the first visual inspection mechanism 60 can be understood as a lower visual inspection camera. The first adsorption component 42 adsorbs the chip 300 under test into the detection area of ​​the lower visual inspection camera to complete the visual inspection. That is to say, the chip 300 under test is always adsorbed by the first adsorption component 42 during the inspection process. Steps one to four can be understood as the loading steps of the wafer loading and unloading machine 100.

[0147] In some embodiments, the two test carriers 95 are defined as a first test carrier and a second test carrier, and the control method of the chip testing equipment further includes the following steps:

[0148] Step 1: Control the first test carrier to move to the test station and control the first test carrier to be electrically connected to the test machine 94, so as to perform performance testing on the chip under test 300 on the first test carrier;

[0149] Step 2: After the chip under test 300 completes the test, control the first test carrier to move out of the test station;

[0150] Step 3: Control the second test carrier to move to the test station and control the second test carrier to be electrically connected to the test machine 94, so as to perform performance testing on the chip under test 300 on the second test carrier.

[0151] This embodiment uses two test carriers 95 to move alternately to the test station, which reduces the waiting time for loading. The test machine 94 alternately tests the chip under test 300 on the two test carriers 95 and is always in the test state, thus improving the chip testing efficiency.

[0152] Therefore, those skilled in the art should recognize that although numerous exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the invention. Thus, the scope of the present invention should be understood and construed as covering all such other variations or modifications.

Claims

1. A wafer loading and unloading machine, characterized in that, include: A wafer loading mechanism is used to convey a wafer along a first horizontal direction to a loading position, wherein the wafer has multiple chips to be tested; At least one wafer unloading mechanism is arranged on the same side as the wafer loading mechanism, and is used to transport the carrier tray carrying the tested chip from the unloading position to the hopper. The conveying mechanism includes a first conveying section, a second conveying section, and at least one conveying tray; the first conveying section and the second conveying section are arranged in a docking manner; the first conveying section is located on one side of the wafer loading mechanism and the wafer unloading mechanism, the second conveying section is located on one side of the testing mechanism, and the conveying tray can be controllably moved back and forth between a first loading / unloading position of the first conveying section and a second loading / unloading position of the second conveying section; The conveyor tray has a loading area and a unloading area. The loading area is used to place the chip to be tested, and the unloading area is used to place the tested chip after the test is completed. The loading and unloading conveying mechanism includes a first adsorption component and a second adsorption component. Both the first adsorption component and the second adsorption component are configured to be movable along a second horizontal direction. The first adsorption component is used to transport the chip under test on the wafer loading mechanism to the loading area; the second adsorption component is used to transport the chip under test in the unloading area to the carrier tray of the wafer unloading mechanism. The second horizontal direction is perpendicular to the first horizontal direction. The loading and unloading conveying mechanism includes loading and unloading conveying guide rails; The loading and unloading transport guide rail is arranged along the second horizontal direction. The first adsorption component moves in a controlled manner along the loading and unloading transport guide rail, thereby being able to move back and forth between the loading position and the first loading and unloading position, thereby being able to transport the chip under test on the wafer to the transport tray. The second adsorption component moves in a controlled manner along the loading and unloading conveying guide, thereby being able to move back and forth between the first loading / unloading position and the unloading position, thereby being able to transport the tested chip in the conveying tray to the carrier tray at the unloading position.

2. The wafer loading and unloading machine according to claim 1, characterized in that, The wafer unloading mechanism includes a first wafer unloading mechanism and a second wafer unloading mechanism arranged on the same side and in parallel. The first wafer unloading mechanism is arranged between the wafer loading mechanism and the second wafer unloading mechanism. The first wafer unloading mechanism and the second wafer unloading mechanism are respectively used to unload chips with different test results.

3. The wafer loading and unloading machine according to claim 2, characterized in that, The first wafer unloading mechanism includes: A first carrier platform is arranged opposite to the conveying mechanism. A first carrier plate is provided on the first carrier platform, and the first carrier plate is used to receive the corresponding tested chip. The first guide rail is arranged on one side of the conveying mechanism along the first horizontal direction; The feeding tray is slidably mounted on the first guide rail, and the second adsorption component controls the placement of the tested chip on the conveyor tray onto the feeding tray; A first sliding component is arranged above the first bearing platform along the second horizontal direction; The third adsorption component is slidably mounted on the first sliding component and is used to transfer the tested chip on the feeding tray to the first carrier tray.

4. The wafer loading and unloading machine according to claim 3, characterized in that, The first wafer feeding mechanism also includes: The first material feeding hopper is located on the front side of the first bearing platform; The first robotic arm is slidably mounted on the first guide rail and is used to clamp the first carrier plate and move it into the first unloading hopper.

5. The wafer loading and unloading machine according to claim 3, characterized in that, The loading and unloading conveying mechanism also includes: The second sliding component is mounted on top of the wafer loading mechanism, the wafer unloading mechanism and the conveying mechanism along the second horizontal direction and is arranged parallel to the first sliding component. Both the first adsorption component and the second adsorption component can be slidably mounted on the second sliding component. The wafer loading and unloading machine also includes: A waste tray is installed on the side of the conveying mechanism near the wafer unloading mechanism to hold damaged tested chips.

6. The wafer loading and unloading machine according to claim 4, characterized in that, The second wafer feeding mechanism includes: The second material hopper is arranged in parallel with the first material hopper; The second carrier platform is arranged along the first horizontal direction. The second carrier platform is provided with a second carrier plate, which is used to receive the corresponding tested chip. The second guide rail is arranged along the first horizontal direction; The second robotic arm is slidably mounted on the second guide rail and is used to clamp the second carrier plate to move it into the second unloading hopper.

7. The wafer loading and unloading machine according to claim 1, characterized in that, The wafer loading mechanism includes: The loading hopper is used to store wafers to be loaded. A third support platform, arranged along the first horizontal direction, is used to support the wafer; The third guide rail is arranged along the first horizontal direction; The third robotic arm is slidably mounted on the third guide rail for clamping the wafer in the loading bin and moving the wafer to the third support platform.

8. A chip testing device, characterized in that, include: The wafer loading and unloading machine as described in any one of claims 1-7; The testing mechanism is disposed at one end of the wafer loading mechanism and the wafer unloading mechanism along the wafer loading direction; the testing mechanism includes a testing machine, at least one testing transport device, and at least one testing support. The test transport device is configured to controllably transport the tested chip in the test carrier to the transport tray, and to controllably transport the chip to be tested in the transport tray on the second transport section to the test carrier. The test carrier is configured to reciprocate between the test machine and the test transport device, thereby enabling it to carry the chip under test and cooperate with the test machine to perform functional testing on the chip under test.

9. The chip testing equipment according to claim 8, characterized in that, Also includes: A sealing assembly is disposed at the junction of the second conveying section and the first conveying section, and is arranged on one side of the testing mechanism; The sealing assembly has a sealing cavity for accommodating the conveyor tray; an air passage assembly is provided in the sealing cavity, and the air passage assembly is controlled to perform air extraction or air filling operations on the sealing cavity, so that the conveying environment of the conveyor tray can be switched by controlling the air passage assembly during the process of the conveyor tray being conveyed from the first conveying section through the sealing cavity to the second conveying section.

10. The chip testing equipment according to claim 9, characterized in that, The testing mechanism includes two test handling devices and two test support seats; The two test handling devices are respectively arranged opposite each other on both sides of the test machine; the two test support seats are arranged in a one-to-one correspondence with the two test handling devices; The conveying mechanism includes two conveying discs; the second conveying section includes a branch conveying section one and a branch conveying section two, which are arranged collinearly along a second horizontal direction; The sealing assembly is disposed between the first branch conveying section and the second branch conveying section; The two conveyor discs can alternately pass through the sealed cavity and then move along the first conveyor section and the second conveyor section of the branch road, respectively; Both sets of test transport devices are used to transport the chip under test in the corresponding transport tray to the corresponding test carrier, and to transport the tested chip in the test carrier to the transport tray; the two test carriers can be controlled to move alternately along the second direction to the test position of the test machine.

11. A control method for a chip testing device, applied to the chip testing device according to any one of claims 8-10, characterized in that, Includes the following steps: In response to a feeding trigger command, the first adsorption component is controlled to pick up the chip under test from the wafer feeding mechanism and transport the chip under test to the feeding area of ​​the conveyor tray; in response to a discharging trigger command, the second adsorption component is controlled to pick up the tested chip from the discharging area of ​​the conveyor tray and transport the tested chip to the carrier tray of the wafer discharging mechanism. The feeding trigger command and the discharging trigger command are triggered synchronously. Control the conveyor plate to transport materials from the first loading / unloading position of the first conveyor section to the second loading / unloading position of the second conveyor section; The test transport device is controlled to transport the tested chip on the test carrier to the unloading area of ​​the conveyor tray; The test transport device is controlled to transport the chip under test from the loading area to the test carrier. The test carrier is controlled to move to the test position of the test machine, and the test machine is controlled to perform performance testing on the chip under test.

12. The control method according to claim 11, characterized in that, The step of controlling the second adsorption component to pick up the tested chip from the unloading area of ​​the conveyor tray and transport the tested chip to the wafer unloading mechanism specifically includes the following steps: Based on the test results of the tested chip, the second adsorption component is controlled to transport the tested chip on the unloading area to the corresponding first wafer unloading mechanism or second wafer unloading mechanism.

13. The control method according to claim 12, characterized in that, The step of controlling the second adsorption component to transport the tested chip on the unloading area to the corresponding first wafer unloading mechanism or second wafer unloading mechanism based on the test results of the tested chip specifically includes the following steps: If the test result of the tested chip meets the first preset condition, the second adsorption component is controlled to adsorb the tested chip in the feeding area and move along the second sliding component to place the tested chip on the feeding tray. Control the feeding tray to move along the first guide rail to the target feeding position; The third adsorption component is controlled to adsorb the tested chip on the feeding tray and move along the first sliding component to place the tested chip on the first carrier tray.

14. The control method according to claim 13, characterized in that, The step of controlling the second adsorption component to transport the tested chip on the unloading area to the corresponding first wafer unloading mechanism or second wafer unloading mechanism based on the test results of the tested chip further includes the following steps: If the test result of the tested chip meets the second preset condition, the second adsorption component is controlled to adsorb the tested chip in the feeding area and move along the second sliding component to place the tested chip on the second carrier plate. The second preset condition is different from the first preset condition.

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