Air conditioner compressor simultaneously meeting low-temperature heating and high-temperature cooling functions

Abstract

The invention relates to the technical field of application of air conditioner compressors, and provides an air conditioner compressor capable of achieving the low-temperature heating function and the high-temperature cooling function at the same time. The compressor comprises a compressor body; the fixing mechanism wraps the outer wall of the compressor body in the circumferential direction; and the refrigerating and heating mechanism comprises a plurality of semiconductor chilling plates which are connected to the inner wall of the fixing mechanism at intervals, and the semiconductor chilling plates are attached to the outer wall of the compressor body. The device is simple in structure and convenient to control; the heating and cooling functions of the compressor can be achieved by rapidly switching the current direction of the semiconductor chilling plate, and therefore optimization of the energy efficiency and reliability of the air conditioning system is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of air-conditioning compressor applications, and in particular to an air-conditioning compressor that simultaneously satisfies low-temperature heating and high-temperature cooling functions. Background Art

[0002] During air conditioning system operation, the compressor requires heating or cooling under different operating conditions. Heating: When the compressor is started at low temperatures, the outdoor temperature is low, the unit has been shut down for an extended period, or after defrosting, a large amount of liquid refrigerant and lubricant accumulate at the bottom of the compressor. During this period, the compressor exhaust gas is low, and the liquid refrigerant at the bottom of the compressor evaporates slowly. This causes a prolonged period of poor operating conditions after startup, seriously impacting the air conditioning system's operating efficiency and the compressor's service life. Heating the compressor during this period serves two purposes: firstly, to pre-evaporate the liquid refrigerant in the compressor to prevent liquid compression during startup; and secondly, to heat the lubricant within the compressor to prevent excessive viscosity at low temperatures, which can affect lubrication. Cooling: When the outdoor temperature is high and the indoor load is low, single-chamber operation results in low refrigerant flow rates, leading to frequent starts and stops in the room. This results in high compressor exhaust and casing temperatures. This, combined with the compressor's low-frequency operating limits, can cause the unit to shut down. Summary of the Invention

[0003] Therefore, the technical problem to be solved by the present invention is to overcome the existing technology.

[0004] To solve the above technical problems, the present invention provides an air-conditioning compressor that can simultaneously meet the functions of low-temperature heating and high-temperature cooling, comprising:

[0005] Compressor body;

[0006] A fixing mechanism circumferentially covers the outer wall of the compressor body;

[0007] The cooling and heating mechanism comprises a plurality of semiconductor cooling sheets, which are connected to the inner wall of the fixing mechanism at intervals, and the semiconductor cooling sheets are in contact with the outer wall of the compressor body.

[0008] In one embodiment of the invention, the present application also includes a heat dissipation mechanism, which includes a plurality of heat dissipation blocks spaced apart on the outside of the fixing mechanism, the heat dissipation block including a heat dissipation block body and a fin side and a plane side protruding from both sides of the heat dissipation block body; the fin side of the heat dissipation block faces outward, and the plane side of the heat dissipation block faces inward and is in contact with the semiconductor refrigeration plate.

[0009] In one embodiment of the invention, the cooling and heating mechanisms are multiple groups, and the multiple groups of cooling and heating mechanisms are sequentially stacked on the inner side of the fixing mechanism along the thickness direction of the fixing mechanism.

[0010] In one embodiment of the invention, buckles for mounting semiconductor refrigeration fins are symmetrically provided on the bottom and top of the inner wall of the fixing mechanism.

[0011] In one embodiment of the invention, a plurality of semiconductor refrigeration chips of the refrigeration and heating mechanism are connected in parallel.

[0012] In one embodiment of the invention, a positive wire and a negative wire are buried in the top of the fixing mechanism, and the positive wire and the negative wire extend to the positive terminal and the negative terminal respectively; the positive wire is provided with positive conductive sheets that are the same in number as the semiconductor cooling sheets, and the negative wire is provided with negative conductive sheets that are the same in number as the semiconductor cooling sheets; a positive power contact and a negative power contact are provided at one end of the semiconductor cooling sheet, and the positive power contact is connected to the positive conductive sheet, and the negative power contact is connected to the negative conductive sheet.

[0013] In one embodiment of the invention, the present application further includes a DC power controller electrically connected to the positive terminal and the negative terminal.

[0014] In one embodiment of the invention, the cooling and heating mechanism is disposed near the bottom of the compressor body.

[0015] In one embodiment of the invention, the thermal refrigeration chip is higher than the initial oil level of the compressor.

[0016] In one embodiment of the invention, mounting ears are correspondingly provided at both ends of the fixing mechanism, and the mounting ears at both ends of the fixing mechanism are connected by bolts.

[0017] The above technical solution of the invention has the following beneficial effects compared with the prior art:

[0018] The air-conditioning compressor of the present invention, which satisfies both low-temperature heating and high-temperature cooling functions, has a simple structure and is easy to control. The heating and cooling functions of the compressor can be achieved by quickly switching the current direction of the semiconductor refrigeration plate, thereby optimizing the energy efficiency and reliability of the air-conditioning system. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to make the content of the invention more clearly understood, the invention is further described in detail below based on specific embodiments of the invention in conjunction with the accompanying drawings, wherein:

[0020] Figure 1 This is a schematic structural diagram of an air-conditioning compressor that satisfies both low-temperature heating and high-temperature cooling functions in a preferred embodiment of the present invention;

[0021] Figure 2 for Figure 1 A schematic diagram showing the connection between a fixing mechanism and a cooling and heating mechanism in an air-conditioning compressor that simultaneously satisfies low-temperature heating and high-temperature cooling functions is shown;

[0022] Figure 3for Figure 1 A schematic diagram showing the connection between a fixing mechanism and a heat dissipation mechanism in an air-conditioning compressor that simultaneously satisfies low-temperature heating and high-temperature cooling functions;

[0023] Figure 4 for Figure 1 A schematic diagram of an expanded fixing mechanism in an air-conditioning compressor that satisfies both low-temperature heating and high-temperature cooling functions is shown;

[0024] Figure 5 A top view of the positive electrode conductive sheet and the negative electrode conductive sheet;

[0025] Figure 6 It is a top view of the semiconductor refrigeration chip;

[0026] Figure 7 This is a flow chart of the cooling mode;

[0027] Figure 8 This is a flow chart of the heating mode.

[0028] Description of the accompanying drawings: 100, compressor body;

[0029] 200, fixing mechanism; 210, hollowing; 220, buckle; 230, positive electrode line; 231, positive electrode conductive sheet; 240, negative electrode line; 241, negative electrode conductive sheet; 250, mounting ear;

[0030] 300, cooling and heating mechanism; 310, semiconductor cooling element; 311, positive power contact; 312, negative power contact;

[0031] 400, heat dissipation mechanism; 410, heat dissipation block;

[0032] 500, positive terminal;

[0033] 600. Negative terminal. DETAILED DESCRIPTION

[0034] The invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the invention and implement it. However, the embodiments are not intended to limit the invention.

[0035] Reference Figures 1 to 6 As shown, an embodiment of the present invention provides an air-conditioning compressor that satisfies both low-temperature heating and high-temperature cooling functions, including:

[0036] Compressor body 100;

[0037] The fixing mechanism 200 is circumferentially covered on the outer wall of the compressor body 100;

[0038] The cooling and heating mechanism 300 includes a plurality of semiconductor cooling fins 310 , which are spaced apart and connected to the inner wall of the fixing mechanism 200 . The semiconductor cooling fins 310 are in contact with the outer wall of the compressor body 100 . The number of semiconductor cooling fins 310 in this application can be adjusted based on the compressor capacity, with the arrangement being evenly distributed. For compressors of the same size with different displacements, the number of semiconductor cooling fins 310 can be adjusted based on demand.

[0039] Specifically, this embodiment has a simple structure and is easy to control; the heating and cooling functions of the compressor can be achieved by quickly switching the current direction of the semiconductor refrigeration plate 310, thereby optimizing the energy efficiency and reliability of the air-conditioning system.

[0040] Furthermore, the semiconductor refrigeration chip 310 has a simple structure and is a solid piece, making it easy to install. Although the power output of a single refrigeration element is low, combining similar stacks in series and parallel to form a refrigeration system can achieve a wide range of target powers, operate without vibration or noise, and have a long lifespan. The semiconductor refrigeration chip 310 has dual functions: cooling and heating. Therefore, a single chip can replace separate heating and cooling systems. By switching the positive and negative poles of the DC control power supply, the cold and hot ends can be quickly switched. Due to low thermal inertia, switching time is short. Furthermore, by controlling the input current, highly precise temperature control can be achieved. The temperature differential range is wide, ranging from 90°C to 130°C.

[0041] Furthermore, the present application also includes a heat dissipation mechanism 400, which includes a plurality of heat dissipation blocks 410 spaced apart on the outside of the fixing mechanism 200. The heat dissipation block 410 includes a heat dissipation block 410 body, a fin side and a flat side protruding from both sides of the heat dissipation block 410 body. The fin side of the heat dissipation block 410 faces outward, and the flat side of the heat dissipation block 410 faces inward and is in contact with the semiconductor cooling plate 310. A hollow 210 is provided in the fixing mechanism 200, and the flat side of the heat dissipation block 410 passes through the hollow 210 and is in contact with the semiconductor cooling plate 310. In this embodiment, the heat dissipation block 410 performs conductive heat dissipation on the semiconductor cooling plate 310, so that without changing the structure of the compressor, the heating and cooling functions can be quickly and conveniently switched by changing the direction and magnitude of the direct current through the DC power controller, and the heating / cooling power can be controlled.

[0042] Furthermore, the cooling and heating mechanism 300 is composed of multiple groups, and the multiple groups of cooling and heating mechanisms 300 are sequentially stacked on the inner side of the fixing mechanism 200 along the thickness direction of the fixing mechanism 200. The multiple groups of cooling and heating mechanisms 300 are supplied with current in the same direction. Taking two groups (i.e., two stages) of cooling and heating mechanisms 300 as an example: that is, the second stage semiconductor refrigeration plate is closely attached to the outer side of the first stage semiconductor refrigeration plate that is close to the outer wall of the compressor. Taking the forward current as an example, the two stages of semiconductor refrigeration plates 310 both absorb heat on the inside and release heat on the outside. At this time, the heat released on the outside of the first stage semiconductor refrigeration plate is absorbed by the inside of the second stage semiconductor refrigeration plate. The multi-stage stacked semiconductor refrigeration plate 310 system has high low-temperature heating and high-temperature cooling efficiency.

[0043] Furthermore, the cooling and heating mechanism 300 includes multiple semiconductor cooling fins 310 connected in parallel. This allows each semiconductor cooling fin 310 to operate independently, and even if semiconductor cooling fins 310 are inserted at intervals in the fixing mechanism 200, the device can still operate normally. Clamps 220 for attaching the semiconductor cooling fins 310 are symmetrically located at the bottom and top of the inner wall of the fixing mechanism 200. A positive line 230 and a negative line 240 are embedded in the top of the fixing mechanism 200. The positive line 230 and the negative line 240 extend to the positive terminal 500 and the negative terminal 600, respectively. The positive line 230 is provided with the same number of positive conductive sheets 231 as the semiconductor cooling sheets 310, and the negative line 240 is provided with the same number of negative conductive sheets 241 as the semiconductor cooling sheets 310. The positive conductive sheets 231 and the negative conductive sheets 241 are located at the buckle 220 at the top of the fixing mechanism 200. One end of the semiconductor cooling sheet 310 is provided with a positive power contact 311 and a negative power contact 312. The positive power contact 311 is electrically connected to the positive conductive sheet 231, and the negative power contact 312 is electrically connected to the negative conductive sheet 241. This allows for quick plug-in connection of the semiconductor cooling sheet 310.

[0044] Furthermore, the present application also includes a DC power controller electrically connected to the positive terminal 500 and the negative terminal 600. Specifically, in this embodiment, the DC power controller can control the direction and magnitude of the current flowing through the semiconductor cooling plate 310, thereby conveniently and quickly switching between heating and cooling functions and controlling the heating / cooling power.

[0045] Furthermore, the cooling and heating mechanism 300 is positioned near the bottom of the compressor body 100. This device serves two primary functions: first, during low-temperature startup or defrosting, it allows the liquid refrigerant at the bottom of the compressor to evaporate quickly, improving lubrication and enabling safe compressor startup. Second, during partial-load operation, it reduces the compressor exhaust temperature and improves compressor operating efficiency. Therefore, this device is positioned near the bottom of the compressor.

[0046] Furthermore, the semiconductor refrigeration plate 310 is higher than the initial oil level of the compressor, so that the liquid refrigerant and lubricating oil at the bottom of the compressor can be fully heated when starting at a low temperature.

[0047] Furthermore, mounting ears 250 are provided at both ends of the fixing mechanism 200, and screw holes are provided on the mounting ears 250. After the fixing mechanism 200 is enclosed on the compressor body 100 to form a closed loop, the mounting ears 250 at both ends of the fixing mechanism 200 are connected by bolts.

[0048] The principles of the cooling mode and the heating mode of the present application are as follows: Assume that the DC power controller is turned on in the forward direction, which is defined as the side of the semiconductor cooling plate 310 that is attached to the compressor body 100 being the cold end.

[0049] Cooling mode:

[0050] See also Figure 7 When the air conditioner turns on the cooling mode, the outdoor temperature T out Is it greater than the set value T c1 If it meets the requirements, the second step is to determine, otherwise the DC power controller will not start. The second step is to determine the compressor exhaust temperature T during the operation of the air conditioner. dis and compressor top temperature T top Is the larger value greater than the set value T c2 If the DC power controller is started in the forward direction, the DC power controller will not start. After the DC power controller starts in the forward direction, the third step is performed. If the start time t is reached, c1 , then shut down, otherwise proceed to the fourth step. The fourth step is to determine the compressor exhaust temperature T dis and compressor top temperature T top Is the smaller value less than the set value T? c3 If it meets the requirements, the DC power controller is turned off, otherwise it returns to the third step.

[0051] Heating mode:

[0052] See also Figure 8 When the air conditioner turns on the heating mode, the outdoor temperature T out Is it less than the set value T h1 If it meets the requirements, the second step is to determine, otherwise the DC power controller will not start. The second step is to determine the compressor exhaust superheat T during the operation of the air conditioner. dsh Is it less than the set value T h2 If the DC power controller is reversed, it will start, otherwise it will not start. After the DC power controller is reversed, it will proceed to the third step. If the start time t is reached, h1 , then shut down, otherwise proceed to the fourth step. The fourth step is to determine the compressor exhaust superheat T dshIs it greater than the set value T h3 If it meets the requirements, the DC power controller is turned off, otherwise it returns to the third step.

[0053] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will appreciate that other variations or modifications can be made based on the above description. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications derived therefrom remain within the scope of protection of the invention.

Claims

1. An air-conditioning compressor that simultaneously satisfies low-temperature heating and high-temperature cooling functions, characterized in that: include: Compressor body; A fixing mechanism circumferentially covering the outer wall of the compressor body; The cooling and heating mechanism comprises a plurality of semiconductor refrigeration sheets, wherein the plurality of semiconductor refrigeration sheets are connected to the inner wall of the fixing mechanism at intervals, and the semiconductor refrigeration sheets are in contact with the outer wall of the compressor body.

2. The air-conditioning compressor capable of simultaneously meeting low-temperature heating and high-temperature cooling functions according to claim 1, characterized in that: It also includes a heat dissipation mechanism, which includes a plurality of heat dissipation blocks spaced apart on the outside of the fixing mechanism, the heat dissipation block including a heat dissipation block body and a fin side and a plane side protruding from both sides of the heat dissipation block body; the fin side of the heat dissipation block faces outward, and the plane side of the heat dissipation block faces inward and fits with the semiconductor refrigeration plate.

3. The air-conditioning compressor capable of simultaneously meeting low-temperature heating and high-temperature cooling functions according to claim 1, characterized in that: The cooling and heating mechanisms are multiple groups, and the multiple groups of cooling and heating mechanisms are sequentially stacked on the inner side of the fixing mechanism along the thickness direction of the fixing mechanism.

4. The air-conditioning compressor capable of simultaneously meeting low-temperature heating and high-temperature cooling functions according to claim 1, characterized in that: Buckles for mounting the semiconductor refrigeration plate are symmetrically provided at the bottom and top of the inner wall of the fixing mechanism.

5. The air-conditioning compressor capable of simultaneously meeting low-temperature heating and high-temperature cooling functions according to claim 4, characterized in that: The plurality of semiconductor refrigeration plates of the refrigeration and heating mechanism are connected in parallel.

6. The air-conditioning compressor capable of simultaneously meeting low-temperature heating and high-temperature cooling functions according to claim 5, characterized in that: A positive wire and a negative wire are buried in the top of the fixing mechanism, and the positive wire and the negative wire extend to the positive terminal and the negative terminal respectively; the positive wire is provided with positive conductive sheets that are the same in number as the semiconductor refrigeration sheets, and the negative wire is provided with negative conductive sheets that are the same in number as the semiconductor refrigeration sheets; a positive power contact and a negative power contact are provided at one end of the semiconductor refrigeration sheet, the positive power contact is connected to the positive conductive sheet, and the negative power contact is connected to the negative conductive sheet.

7. The air-conditioning compressor capable of simultaneously meeting low-temperature heating and high-temperature cooling functions according to claim 6, characterized in that: Also included is a DC power controller electrically connected to the positive terminal and the negative terminal.

8. The air-conditioning compressor capable of simultaneously meeting low-temperature heating and high-temperature cooling functions according to claim 1, characterized in that: The refrigeration and heating mechanism is arranged close to the bottom of the compressor body.

9. The air-conditioning compressor capable of simultaneously meeting low-temperature heating and high-temperature cooling functions according to claim 1, characterized in that: The semiconductor refrigeration plate is higher than the initial oil level of the compressor.

10. The air-conditioning compressor capable of simultaneously meeting low-temperature heating and high-temperature cooling functions according to claim 1, characterized in that: Mounting ears are correspondingly provided at both ends of the fixing mechanism, and the mounting ears at both ends of the fixing mechanism are connected by bolts.

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