A five-axis laser machining path planning method, device, equipment and medium

Abstract

The application discloses a five-axis laser processing path planning method, device, equipment and medium, and relates to the technical field of laser processing.The application constructs a space filling line cluster, performs a Boolean operation on the filling line cluster and a machined surface to obtain a preliminary continuous processing track, discretizes the processing track into track curve segments, calculates tangent vectors of two endpoints of the curve segments, obtains curvatures of the corresponding curve segments according to the included angle of the tangent vectors of the two endpoints, and performs path planning in the form of equal-curvature discretization characterized by kinematic characteristics, and the process dynamically constrains the discrete density by using the included angle of the tangent vectors.Then, three-dimensional laser coordinate points and two-dimensional laser direction vectors of the corresponding discrete points are generated based on u-direction parameter values and v-direction parameter values, so that the five-axis laser processing path of each discrete point on the track curve segment can be obtained, the three-axis coordinates and the two-axis direction vectors can be synchronized into the five-axis laser processing path, and therefore, the laser processing path with high precision can be obtained to process a workpiece.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser processing, in particular to a five-axis laser processing path planning method, device, equipment and medium. BACKGROUND

[0002] The laser processing system uses laser as a "tool", and removes the material on the workpiece surface layer by layer through the interaction between the high-energy-density laser beam and the material, so as to realize the processing of the workpiece with high precision and complex structure. The laser processing path, that is, the predetermined motion trajectory of the laser spot in the processing process, is not only the basis for realizing accurate removal, but also the core component of the entire laser processing system, which directly determines the precision and surface quality of the final workpiece. In particular, for five-axis laser processing of spatial curved surfaces such as narrow space curved inner walls, the path planning is particularly critical. Such a path not only needs to contain the X, Y, Z axis coordinate information of the laser focal point in the three-dimensional Cartesian coordinate system, but also must accurately control the angle of the laser beam relative to the processing surface to ensure that the laser beam can act on the complex curved surface in the best posture (for example, always perpendicular to the processing point or incident at a specific angle), which is crucial for processing high-quality microstructures on the curved surface.

[0003] The existing laser processing systems, such as those widely used in the fields of laser marking and laser engraving, have been very mature in their application on two-dimensional planes. However, there is still a lack of mature, efficient and universal processing technology for processing complex patterns on the inner surface of a large-curvature narrow cavity with complex three-dimensional free curved surface characteristics. The processing of such complex curved surfaces requires more targeted algorithms to generate five-axis linkage paths that adapt to the changes in the curved surface.

[0004] For path planning in complex three-dimensional laser processing, the current main method is the equal-step parameter discretization method. However, this method has the following defects: on the one hand, equal-step discretization ignores the geometric characteristics of the curved surface, leading to a large deviation between the actual path and the theoretical model; on the other hand, the three-axis coordinates and two-axis direction vectors are calculated step by step, resulting in a large error due to the asynchronization of coordinates and directions. At the same time, the scattered path is composed of short straight line segments, and there are discontinuities in the tangential / curvature at the connection points, which may cause the trajectory to be not smooth. In view of the defects of the equal-step parameter discretization method, the NURBS surface fitting method is commonly used at present. However, this method relies on the chord height constraint interpolation and does not directly control the kinematic characteristics for path planning, and it also has the defect of asynchronization of three-axis coordinates and two-axis direction vectors, making it difficult to obtain a laser processing path with high precision. SUMMARY

[0005] The embodiment of the present application provides a five-axis laser processing path planning method, device, equipment and medium, which can solve the problem that it is difficult to obtain a high-precision laser processing path in the prior art.

[0006] The embodiment of the present application provides a five-axis laser processing path planning method, device, equipment and medium, which can solve the problem that it is difficult to obtain a high-precision laser processing path in the prior art.

[0007] Obtaining a machined region of a workpiece;

[0008] Constructing a filled curve cluster in a parameter space, performing Boolean intersection between the filled curve cluster and the machined region, and obtaining a continuous processing track;

[0009] Discretizing the processing track into a track curve segment, calculating tangent vectors of two end points of each curve segment in the track curve segment, obtaining a curvature of the corresponding curve segment according to an included angle of the tangent vectors of the two end points, and obtaining u-direction parameter values and v-direction parameter values of the two end points of the corresponding curve segment and u-direction parameter values and v-direction parameter values of each discrete point in the track curve segment when the curvature is less than a preset threshold value;

[0010] The u-direction parameter values and the v-direction parameter values are used to represent incremental movement distances of the discrete points relative to a current position.

[0011] Mapping the u-direction parameter values and the v-direction parameter values to a model space to obtain three-dimensional laser coordinate points of the corresponding discrete points, generating two-dimensional laser direction vectors of the corresponding discrete points based on the u-direction parameter values and the v-direction parameter values, and obtaining five-axis laser processing paths of the discrete points on the track curve segment;

[0012] According to the five-axis laser processing path, laser processing is performed on the machined region.

[0013] Preferably, after the five-axis laser processing paths of the discrete points on the track curve segment are obtained, the five-axis laser processing paths are densified to obtain smooth five-axis laser processing paths, including:

[0014] For the three-dimensional laser coordinate points, three adjacent discrete points P, P0 and P1 are selected, Bezier curves are constructed for the discrete points P, P0 and P1 respectively, and control points A and B tangent to line segments PP0 and P0P1 are obtained respectively;

[0015] The points P0, A, B and P1 are taken as control points to fit a curve, and the densification of the three-dimensional laser coordinate points is realized;

[0016] For the two-dimensional laser direction vectors, the two-dimensional laser direction vectors are converted into quaternions, a second-order spherical interpolation model is constructed based on quaternion interpolation, and the densification of the two-dimensional laser direction vectors is realized by fitting through the construction of auxiliary points;

[0017] The densified three-dimensional laser coordinate points and the two-dimensional laser direction vectors are smooth five-axis laser processing paths.

[0018] Preferably, the fitting curve between P0 and P1 is expressed as:

[0019] ;

[0020] The control points A and B are constructed as:

[0021] ;

[0022] Wherein: and represent the tangent vectors at 0 and 1 respectively; P 0 and P 1; a and β represent adjustable parameters;

[0023] The four-nomial interpolation-based second-order spherical interpolation model is constructed, and the interpolation formula is expressed as:

[0024] ;

[0025] Wherein, the first-order spherical interpolation function of the four-nomial is expressed as:

[0026] ;

[0027] The auxiliary point expression formula is:

[0028] ;

[0029] Wherein: represents the interpolated four-nomial sequence; represents the interpolation auxiliary point; t represents an adjustable parameter.

[0030] Preferably, the processed region of the workpiece is obtained, comprising:

[0031] The BRep topological model tree and its topological structure of the processed workpiece are obtained, and the processed region is extracted based on the topological tree structure features and geometric features;

[0032] Wherein, the processing surface is identified by traversing the number of Wires in the BRep topological model tree, the processing wire frame is identified by traversing the number of Wires in the BRep topological model tree, and the associated region is extracted by the geometric distance feature to obtain the processed region.

[0033] Preferably, the u-direction parameter value and the v-direction parameter value of each discrete point in the trajectory curve segment are obtained, comprising:

[0034] discretize the machining trajectory into trajectory curve segments, each trajectory curve segment containing a plurality of curve segments;

[0035] For each curve segment, the tangent vectors M and M' of the two end points A and B of the curve segment are calculated using a parametric equation, the partial derivatives of the curve segment in the X, Y and Z directions are calculated, combined into a spatial direction vector, and the included angle between the tangent vectors M and M' is calculated based on the spatial direction vector, and the included angle between the tangent vectors M and M' is equivalent to the curvature of the corresponding curve segment;

[0036] When the curvature is less than the preset threshold, the u-direction parameter value and the v-direction parameter value of the two end points of the corresponding curve segment are obtained, and the u-direction parameter value and the v-direction parameter value of each discrete point in the trajectory curve segment are obtained;

[0037] When the curvature is less than the preset threshold, the midpoint of the interval AB is taken as point C, the parameter of which is 0.5, and then the curvatures of the intervals AC and CB are judged respectively; if the curvatures are less than the preset threshold, the u-direction parameter value and the v-direction parameter value of the corresponding discrete points are obtained; if the curvatures are higher than the preset threshold, the intervals AC and CB are further segmented until the curvatures of the segmented curve segments are less than the preset threshold.

[0038] The embodiment of the present application also provides a five-axis laser machining path planning device, comprising:

[0039] A region identification module is configured to obtain a machined region of a workpiece;

[0040] A trajectory generation module is configured to construct a filled curve cluster in a parameter space, and perform a Boolean intersection between the filled curve cluster and the machined region to obtain a continuous machining trajectory;

[0041] A parameter module is configured to discretize the machining trajectory into trajectory curve segments, calculate tangent vectors of two end points of each curve segment in the trajectory curve segments, and obtain a curvature of the corresponding curve segment according to an included angle between the tangent vectors of the two end points; when the curvature is less than a preset threshold, obtain u-direction parameter values and v-direction parameter values of the two end points of the corresponding curve segment, and obtain u-direction parameter values and v-direction parameter values of each discrete point in the trajectory curve segment;

[0042] The u-direction parameter values and the v-direction parameter values are used to represent incremental movement distances of the discrete points relative to a current position.

[0043] A path planning module is configured to map the u-direction parameter values and the v-direction parameter values to a model space to obtain three-dimensional laser coordinate points of the corresponding discrete points, generate two-dimensional laser direction vectors of the corresponding discrete points based on the u-direction parameter values and the v-direction parameter values, and obtain five-axis laser machining paths of the discrete points on the trajectory curve segments.

[0044] The machined region is machined by laser according to the five-axis laser machining paths.

[0045] The embodiment of the present application also provides an electronic device, comprising a memory and a processor;

[0046] The memory is used for storing a computer program;

[0047] The processor is used for executing the computer program stored in the memory, so as to realize the steps of the five-axis laser processing path planning method.

[0048] The embodiment of the present application also provides a computer readable storage medium, which is used for storing a computer program, and the computer program is executed by a processor to realize the steps of the five-axis laser processing path planning method.

[0049] The embodiment of the present application provides a five-axis laser processing path planning method, device, equipment and medium, compared with the prior art, has the beneficial effects as follows:

[0050] The embodiment of the present application constructs a space filling curve cluster, performs a Boolean operation on the filling curve cluster and a machined surface to obtain a preliminary continuous processing track, discretizes the processing track into a track curve segment, calculates the tangent vectors of two end points of the curve segment, obtains the curvature of the corresponding curve segment according to the included angle of the tangent vectors of the two end points, and performs path planning in the form of equal-curvature discretization characterized by kinematic characteristics, with the tangent vector included angle dynamically constraining the discretization density; then, based on the u-direction parameter value and the v-direction parameter value, three-dimensional laser coordinate points and two-dimensional laser direction vectors of the corresponding discrete points are generated, so as to obtain the five-axis laser processing path of each discrete point on the track curve segment, so that the three-axis coordinates and the two-axis direction vectors are synchronized into the five-axis laser processing path, so that a high-precision laser processing path can be obtained to process the workpiece. BRIEF DESCRIPTION OF DRAWINGS

[0051] Figure 1 A whole flowchart of a five-axis laser processing path planning method provided by the embodiment of the present application is shown in the figure;

[0052] Figure 2 A BRep model of a workpiece and a topological structure diagram of a five-axis laser processing path planning method provided by the embodiment of the present application are shown in the figure;

[0053] Figure 3 A filling curve cluster of a space constructed by a five-axis laser processing path planning method provided by the embodiment of the present application is shown in the figure;

[0054] Figure 4 A parameter line cluster constructed by a five-axis laser processing path planning method provided by the embodiment of the present application is shown in the figure;

[0055] Figure 5A schematic diagram of the isocurvature method for a five-axis laser processing path planning method provided in an embodiment of the present invention;

[0056] Figure 6 This is a schematic diagram illustrating the mapping from parameter space to model space for a five-axis laser processing path planning method provided in an embodiment of the present invention.

[0057] Figure 7 This is a schematic diagram of the three-axis trajectory point densification of a five-axis laser processing path planning method provided in an embodiment of the present invention;

[0058] Figure 8 A schematic diagram of laser direction vector transformation for a five-axis laser processing path planning method provided in an embodiment of the present invention;

[0059] Figure 9 A schematic diagram of a smoothed flow of a single trajectory in a five-axis laser processing path planning method provided in an embodiment of the present invention;

[0060] Figure 10 This is a schematic diagram illustrating the smoothing of all processing trajectories within an interval in a five-axis laser processing path planning method provided by an embodiment of the present invention.

[0061] Figure 11 This is a schematic diagram of the motion program corresponding to the five-axis laser path generation in a five-axis laser processing path planning method provided in an embodiment of the present invention. Detailed Implementation

[0062] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0063] See Figure 1 This invention provides a five-axis laser processing path planning method, comprising the following steps:

[0064] Step 1: Process the model of the workpiece and convert it into a universally recognizable format. Obtain the BRep model of the workpiece and its topology; such as... Figure 2 As shown, a feature surface recognition strategy is constructed based on the geometric primitive information of the model to extract the processed area.

[0065] The entity structure types in the BRep model are TopShape, Face, Wire, Edge, and Vertex from top to bottom (where TopShape is a collection of all entity structure types); the BRep topology model tree contains all the superior-inferior relationships between entities and their geometric data.

[0066] The machining region is extracted according to the characteristics of the topology tree model, including:

[0067] Method 1: search based on the characteristics of the tree structure, such as Step 1 and Step 2; Step 1 iteratively searches the number of Wires in the Face, and the number of Wires in the machining Face is the largest, according to which the machining face is extracted, Step 2 iteratively searches the number of Edges contained in the Wire in the machining face, and the number of Edges in the characteristic Wire is the largest, according to which one of the machining Wires is extracted.

[0068] Method 2: extraction based on geometric characteristics, such as Step 3: the machining region contains two sectors in addition to the characteristic Wire, and the two sectors are closest to the characteristic Wire in geometric characteristics, according to which the two sectors are extracted, and the extraction of the machining region is completed.

[0069] Step two: as shown in Figure 3 , a filling curve cluster of the space is constructed, and the filling curve cluster is subjected to Boolean operation with the machining region to obtain a continuous machining trajectory.

[0070] The machining region extracted in Step One is a topological structure expressed in a parameter form; its parameter range is obtained, and then a parameter line cluster is constructed; an equal-step parameter line cluster, an equal-interval parameter line cluster, and a specified filling line cluster can be used; the filling line cluster is subjected to Boolean intersection with the machining region to obtain a continuous machining trajectory.

[0071] Step three: a path discretization algorithm is constructed to discretize the machining trajectory, and then the u and v parameter values corresponding to the discrete point positions are obtained.

[0072] The trajectory is discretized in the parameter space using an equal-parameter or equal-curvature method, where the equal-curvature method ensures that the two discrete points are approximately straight lines. The flowchart of the equal-curvature method is as follows: Figure 5As shown; first calculate the two endpoints of the curve segment, using the parametric equation for calculation, usually the parameter value corresponding to the two endpoints is 0 and 1; Then calculate the tangent vectors M, M' of the two endpoints respectively, and the partial derivatives of the parameter curve with respect to X, Y and Z directions are calculated respectively, and combined into a spatial direction vector; Thus, the included angle between the two tangent vectors M, M' is calculated, which can be approximately represented as the bending degree of curvature; Next, it is judged whether the curvature is within the required range, if not, the midpoint of the interval AB is taken as point C, and the parameter corresponding to the point is 0.5. Then it is judged whether the intervals AC and CB satisfy the condition.

[0073] The path discretization algorithm is constructed, and the u and v parameter values of each point are calculated. This step is added before calculating the laser five-axis coordinates, which solves the problem of different synchronization of point coordinates and laser direction generated by directly traversing the path to calculate the machining point. Therefore, the accuracy of the laser path is improved.

[0074] Step four: according to the u, v parameter value, the geometric feature information of the machined surface is calculated, and the preliminary five-axis laser machining path is obtained.

[0075] As shown in Figure 6 , the three-dimensional coordinate value of the point can be obtained by mapping the parameter space to the model space. The laser method of the point can be calculated by cross product method, approximation method and other methods to obtain the preliminary machining path.

[0076] Step five: densification of the preliminary five-axis laser machining path to obtain a continuous and smooth five-axis laser machining path.

[0077] The five-axis path can be divided into three-axis laser point densification and two-axis laser direction densification according to the densification object; As shown in Figure 7 , the three-axis trajectory point is densified; the Bezier curve is used as the densification tool, and two control points which are tangent to the space curve on both sides of the fitting point are constructed to assist the fitting; The fitting formula and the control point calculation method are represented as:

[0078] The fitting curve between P0P1 is represented as:

[0079] .

[0080] The control points are A and B, and the construction method is represented as:

[0081] .

[0082] Among them: and represent the tangent vectors at P 0 and P 1 respectively; a and β represent adjustable parameters.

[0083] The two-axis laser direction densification introduces quaternions as a calculation tool, which only needs to perform polynomial multiplication, has high operation efficiency, and avoids the defects of multiple vector cross product operations required by the interpolation of rotation matrix; as shown in Figure 8 The laser direction vector is first converted into quaternion expression, and then segmented interpolation is performed; to ensure that the fitted vector passes through all original vectors, auxiliary points are constructed for fitting, and the specific calculation formula is represented as:

[0084] The two-order spherical interpolation model is constructed based on quaternion interpolation, and the interpolation formula is represented as:

[0085] .

[0086] The first-order spherical interpolation function of the quaternion is represented as:

[0087] .

[0088] The auxiliary point expression formula is:

[0089] .

[0090] Wherein: represents the interpolated quaternion sequence; represents the interpolation auxiliary point; t represents an adjustable parameter.

[0091] The smoothing process of a single trajectory is shown in Figure 9 First, based on the u and v parameters of the n points obtained by discretization, the direction vector corresponding to each point is calculated, and n sets of direction vectors are obtained; then, using the adjacent direction vectors (i.e. the i-1th and the i-th), the filling line equation corresponding to the i-1th point is derived; this process finally generates n-1 filling line equations.

[0092] The calculation steps of the direction vector of a single point are as follows: determine the calculation equation and the parameter t: determine the equation and its parameter t used to calculate the direction vector of the point; the value of the parameter t is determined by the normalized position ratio of the point (the i-th point) in the total point set (n points); substitute and solve: substitute the determined parameter t into the corresponding calculation equation, and the direction vector of the point (the i-th point) can be obtained.

[0093] As shown in Figure 10 On the basis of completing the smoothing of a single trajectory, all trajectories are traversed in turn to realize the smoothing of all machining trajectories in the interval.

[0094] By performing three-dimensional laser point interpolation and two-dimensional laser direction interpolation on the path, the laser machining path is smoother, and there is no soft impact in the movement process.

[0095] Step six: as Figure 11As shown, according to the five-axis laser path, the corresponding motion program is generated, the motion program is issued to the motion controller, and the laser processing of the complex space surface is realized.

[0096] The application obtains the BRep model and its topological structure by processing the general workpiece model, formulates a feature surface recognition strategy, and extracts the machined surface; a space filling line cluster is constructed, and the filling line cluster is subjected to Boolean operation with the machined surface to obtain a preliminary machining trajectory, and each step is processed by using a topological method, so that the application range is wider and the method can be used for three-dimensional curved surface path construction.

[0097] Meanwhile, the laser direction vector calculation error is reduced: the laser coordinates and laser vectors of the machining points are obtained through the u and v parameters respectively, the three-axis laser coordinates and the two-axis laser vectors are generated synchronously, and the error caused by the asynchronous generation of the two methods in the post-processing laser direction vector generation is avoided.

[0098] Since even if the preliminary five-axis machining path is generated, if not subjected to subsequent smoothing processing, the original path composed of a large number of short straight line segments often has discontinuity of tangent or curvature at the connection of the segments; such discontinuity will cause the sudden change of speed and acceleration in the actual movement of the machine tool, and then cause mechanical vibration and impact; such impact not only reduces the smoothness and contour accuracy of the machined surface, which is absolutely unacceptable in high-precision machining, but also aggravates the wear of the key moving parts (such as guide rails, lead screws and motors) of the machine tool, shortens the service life of the equipment; therefore, the smoothing post-processing technology optimizes the original path by, for example, adopting a Bezier curve fitting, a B-spline curve fitting or a quaternion interpolation method to smoothly transition the tool tip position and the tool posture, aiming to eliminate or weaken the impact and ensure the smoothness of the machine tool operation, thereby improving the final machining quality and efficiency.

[0099] Therefore, the application constructs a five-axis laser trajectory smoothing method, which divides the path smoothing into three-dimensional coordinate smoothing and two-dimensional direction smoothing according to the data characteristics; for the three-dimensional coordinate smoothing, a control point is proposed to assist the fitting smoothing method, solving the problem that the intermediate control points are not on the fitting line when the fitting line passes through the first and last control points; for the two-dimensional direction smoothing, a quaternion is introduced as a mathematical tool, the auxiliary point coordinate calculation based on the quaternion is carried out, a two-order spherical interpolation smoothing method based on the quaternion is constructed, and the densification of the two-dimensional direction vector is realized; the introduction of the quaternion reduces the calculation amount of the laser direction smoothing; not only can the adaptability problem of complex curved surface machining be effectively solved, but also the stability of the machining process, the surface quality and dimensional accuracy of the workpiece can be significantly improved through path optimization, and the machine tool loss is reduced.

[0100] The above embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the scope of the patent. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, several modifications and improvements can be made, which are within the scope of protection of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A five-axis laser machining path planning method, characterized by, The method comprises the following steps: Obtaining a machined region of a workpiece; Constructing a filling curve cluster in a parameter space, performing a Boolean intersection between the filling curve cluster and the machined region, and obtaining a continuous machining track; Discretizing the machining track into track curve segments, calculating tangent vectors of two end points of each curve segment in the track curve segment, obtaining a curvature of the corresponding curve segment according to an included angle of the tangent vectors of the two end points, and obtaining u-direction parameter values and v-direction parameter values of the two end points of the corresponding curve segment when the curvature is less than a preset threshold, and obtaining u-direction parameter values and v-direction parameter values of each discrete point in the track curve segment; The u-direction parameter values and the v-direction parameter values are used to represent incremental moving distances of the discrete points relative to a current position; Mapping the u-direction parameter values and the v-direction parameter values to a model space to obtain three-dimensional laser coordinate points of the corresponding discrete points, generating two-dimensional laser direction vectors of the corresponding discrete points based on the u-direction parameter values and the v-direction parameter values, and obtaining a five-axis laser machining path of each discrete point on the track curve segment; Performing laser machining on the machined region according to the five-axis laser machining path; After the five-axis laser machining path of each discrete point on the track curve segment is obtained, the method further comprises densifying the five-axis laser machining path to obtain a smooth five-axis laser machining path, comprising: For the three-dimensional laser coordinate points, selecting three adjacent discrete points P, P0 and P1, constructing a Bezier curve for the discrete points P, P0 and P1 respectively, and obtaining control points A and B tangent to line segments PP0 and P0P1 respectively; Fitting a curve with the control points P0, A, B and P1 to densify the three-dimensional laser coordinate points; For the two-dimensional laser direction vectors, converting the two-dimensional laser direction vectors into quaternions, constructing a second-order spherical interpolation model based on quaternion interpolation, fitting by constructing auxiliary points to densify the two-dimensional laser direction vectors; The densified three-dimensional laser coordinate points and the two-dimensional laser direction vectors are the smooth five-axis laser machining path; The fitting curve between P0 and P1 is expressed as: ； The construction method of the control points A and B is expressed as: ； wherein: and respectively represent P 0 and P the tangent vector at point 1 ; ɑ and β denote adjustable parameters; The interpolation formula of the second-order spherical interpolation model based on the quaternions is expressed as: ； The first-order spherical interpolation function of the quaternions is expressed as: ； The expression formula of the auxiliary points is: ； wherein: represents the interpolated quaternion sequence; represents an interpolation helper point; t represents an adjustable parameter.

2. The five-axis laser machining path planning method of claim 1, wherein, The method for obtaining the machined region of the workpiece comprises: Obtaining a BRep topological model tree and a topological structure of the machined workpiece, extracting the machined region based on topological tree structure features and geometric features; The machined region is obtained by identifying a machining surface by traversing the number of Wires in the BRep topological model tree, identifying a machining wire frame by traversing the number of Wires in the BRep topological model tree, and extracting a related region by geometric distance features.

3. The method of claim 1, wherein, The method for obtaining the u-direction parameter values and the v-direction parameter values of each discrete point in the track curve segment comprises: Discretizing the machining track into track curve segments, and each track curve segment contains multiple curve segments; For each curve segment, the tangent vectors M and M' of the two end points A and B of the curve segment are calculated by using the parametric equation, the partial derivatives of the curve segment in X, Y and Z directions are calculated, combined into a spatial direction vector, and the included angle between the tangent vectors M and M' is calculated based on the spatial direction vector, and the included angle between the tangent vectors M and M' is equivalent to the curvature of the corresponding curve segment; When the curvature is less than the preset threshold, the u-direction parameter value and the v-direction parameter value of the two end points of the corresponding curve segment are obtained, and the u-direction parameter value and the v-direction parameter value of each discrete point in the trajectory curve segment are obtained; When the curvature is less than the preset threshold, the midpoint of the interval AB is taken as point C, the parameter corresponding to point C is 0.5, and then whether the curvatures of the intervals AC and CB are less than the preset threshold are judged respectively; if less than the preset threshold, the u-direction parameter value and the v-direction parameter value of the corresponding discrete points are obtained for AC and CB; if higher than the preset threshold, AC and CB are further segmented until the curvatures of the segmented curve segments are less than the preset threshold.

4. A five-axis laser machining path planning apparatus characterized by comprising: It comprises: A region identification module for obtaining a machined region of a workpiece; A trajectory generation module for constructing a filled curve cluster in a parameter space, performing Boolean intersection between the filled curve cluster and the machined region, and obtaining a continuous machining trajectory; A parameter module for discretizing the machining trajectory into trajectory curve segments, calculating the tangent vectors of the two end points of each curve segment in the trajectory curve segments, and obtaining the curvature of the corresponding curve segment according to the included angle between the tangent vectors of the two end points; when the curvature is less than the preset threshold, the u-direction parameter value and the v-direction parameter value of the two end points of the corresponding curve segment are obtained, and the u-direction parameter value and the v-direction parameter value of each discrete point in the trajectory curve segment are obtained; The u-direction parameter value and the v-direction parameter value are used to represent the incremental movement distance of the discrete point relative to the current position; A path planning module for mapping the u-direction parameter value and the v-direction parameter value to a model space to obtain three-dimensional laser coordinate points of the corresponding discrete points; based on the u-direction parameter value and the v-direction parameter value, a two-dimensional laser direction vector of the corresponding discrete points is generated to obtain a five-axis laser machining path of each discrete point on the trajectory curve segment; According to the five-axis laser machining path, laser machining is performed on the machined region; After obtaining the five-axis laser machining path of each discrete point on the trajectory curve segment, the five-axis laser machining path is further densified to obtain a smooth five-axis laser machining path, including: For the three-dimensional laser coordinate points, select three adjacent discrete points P, P0 and P1, construct a Bezier curve for each of the discrete points P, P0 and P1, and obtain control points A and B tangent to the line segments PP0 and P0P1, respectively; Fitting a curve with points P0, A, B and P1 as control points to realize the densification of the three-dimensional laser coordinate points; For the two-dimensional laser direction vector, the two-dimensional laser direction vector is converted into a quaternion, a second-order spherical interpolation model is constructed based on the quaternion interpolation, and the densification of the two-dimensional laser direction vector is realized by constructing auxiliary points for fitting; The densified three-dimensional laser coordinate points and the two-dimensional laser direction vector are the smooth five-axis laser machining path; The fitting curve between P0 and P1 is represented as: ； The construction method of control points A and B is represented as: ； wherein: and respectively represent P 0 and P 1 at the tangent vector; ɑ and β represent adjustable parameters; The second-order spherical interpolation model is constructed based on the quaternion interpolation, and an interpolation formula is represented as: ； A first-order spherical interpolation function of the quaternion is represented as: ； An auxiliary point expression formula is: ； wherein: represents the interpolated quaternion sequence; represents an interpolation helper point; t represents an adjustable parameter.

5. An electronic device, comprising: The method comprises the following steps: a memory and a processor; The memory is configured to store a computer program. The processor is configured to execute the computer program stored in the memory to implement the steps of the five-axis laser processing path planning method according to any one of claims 1-3.

6. A computer-readable storage medium, characterized in that, The computer program is stored in the memory and is executed by the processor to implement the steps of the five-axis laser processing path planning method according to any one of claims 1-3.

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