Chip adsorption device for chip feeding machine and chip feeding machine

Abstract

The invention provides a chip adsorption device for a chip feeding machine and the chip feeding machine. The chip adsorption device comprises a base, an adsorption mechanism and a driving mechanism, the clamping structure is fixedly connected to the surface of one side of the base; at least one through vacuumizing hole is formed in the clamping structure and the base below the clamping structure; a blind groove is formed in the bottom of the rubber nozzle; the rubber nozzle is fixed on the outer surface of the clamping structure through the blind groove in a sleeving manner; at least one through adsorption hole is formed in the rubber nozzle; and the vacuumizing hole is communicated with the adsorption hole and is used for providing vacuum for the adsorption hole so as to adsorb the chip on the surface of the rubber nozzle. The clamping structure is arranged on the base, the rubber nozzle is fixed to the base through the clamping structure, the chip is adsorbed through the adsorption holes in the rubber nozzle, the chip is not limited by the size of the chip in the vacuum adsorption process, and the chip feeding precision of the chip, especially a small-size chip can be effectively improved; in addition, the contact damage risk of the chip can be effectively reduced, and the chip feeding yield is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip packaging, and in particular to a chip adsorption device for a chip loading machine and the chip loading machine. Background Art

[0002] Wire bonding packaging products mainly consist of a substrate / lead frame, a chip (Die) and wires connecting the two. The leads are mainly connected to the substrate and chip through welding bonding.

[0003] The loading station is a core station in the manufacturing of wire bond packaging products. The main machines in this production station are the feeder, loader, receiver, and oven. The loading process is as follows: the substrate flows from the feeder to the loader, where the loader picks up and places the chips one by one onto each loading area on the substrate. The chips then enter the receiver, and finally enter the oven for curing and bonding, bonding the chips to the substrate.

[0004] Existing chip loading machines typically utilize a platform-based design or a suction cup-based design for chip loading. In the platform-based design, the chip loading machine's robotic arm directly grasps the chip from the wafer and places it on the substrate's loading area. In the suction cup-based design, the chip loading machine's robotic arm first grasps the chip from the wafer onto a suction cup on an intermediate platform. This suction cup holds the chip in place, allowing alignment adjustment on the intermediate platform. The chip loading machine's robotic arm then grasps the chip from the intermediate platform and places it on the substrate's loading area. Because the platform-based design lacks an intermediate platform for alignment adjustment, the chip is directly grasped from the wafer onto the substrate, resulting in lower positioning accuracy and a high risk of misalignment. The smaller the chip, the more difficult it is to identify misalignment, resulting in even lower positioning accuracy. While the suction cup-based design incorporates an intermediate platform for alignment adjustment, the suction cup on the intermediate platform can cause the chip to shift during the process. This risk increases with smaller chips, impacting the loading machine's accuracy. Summary of the Invention

[0005] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a chip adsorption device for a chip loading machine and a chip loading machine, so as to solve the problem of low chip loading accuracy during the loading process of the chip loading machine in the prior art.

[0006] To achieve the above-mentioned and other related purposes, the present invention provides a chip adsorption device for a chip loading machine, the chip adsorption device comprising:

[0007] base;

[0008] A clamping structure fixedly connected to a side surface of the base; at least one through vacuum hole is provided in the clamping structure and the base below it;

[0009] A rubber nozzle, wherein a blind groove is provided at the bottom of the rubber nozzle, and the shape of the blind groove is adapted to the engaging structure;

[0010] The rubber nozzle is fixed on the outer surface of the clamping structure in a sleeve manner through the blind groove;

[0011] The rubber nozzle is provided with at least one adsorption hole penetrating the rubber nozzle;

[0012] The vacuum hole is communicated with the adsorption hole and is used for providing vacuum to the adsorption hole so as to adsorb the chip on the surface of the rubber nozzle.

[0013] Optionally, the base and the locking structure are integrally formed and made of metal.

[0014] Optionally, one vacuum hole is provided in the engaging structure and the base thereunder, and the one vacuum hole is vertically connected to all the adsorption holes at the same time.

[0015] Optionally, the adsorption holes have a pore diameter of 0.3 mm to 0.6 mm.

[0016] Optionally, the thickness of the rubber mouth is not greater than 4 cm and not less than the thickness of the snap-fit ​​structure, and the thickness of the snap-fit ​​structure is not greater than 2.5 mm.

[0017] Optionally, the locking structure includes a first portion and a second portion from bottom to top along the thickness direction thereof, and a surface contour dimension of the second portion is larger than a surface contour dimension of the first portion.

[0018] Furthermore, the first portion is located in a middle area of ​​the second portion.

[0019] Optionally, the rubber nozzle includes a vertical portion and a chamfered portion from bottom to top along its thickness direction; wherein the surface outer contour size of the vertical portion remains unchanged, and the surface outer contour size of the chamfered portion gradually decreases at a preset angle.

[0020] Furthermore, a plurality of adsorption holes are provided in the rubber nozzle, and all the adsorption holes are arranged in an array on the surface of the rubber nozzle in contact with the chip.

[0021] The present invention also provides a chip loading machine, comprising the chip adsorption device for the chip loading machine as described in any one of the above items.

[0022] As described above, the chip suction device and chip loading machine of the present invention employ a snap-fit ​​structure provided on a base, and a rubber nozzle secured to the base via the snap-fit ​​structure, allowing the chip to be suctioned through the suction holes in the rubber nozzle. Because the rubber material can be injection molded, the suction holes can have very small diameters. This diameter is very small relative to the chip size and does not affect the vacuum suction process of the chip on the rubber nozzle, nor does it cause positional shifting of the chip during suction. Therefore, the rubber nozzle-type chip suction device of the present invention is not limited by chip size during vacuum suction, effectively improving chip loading accuracy, especially for small-sized chips. Furthermore, because the rubber nozzle is made of a deformable elastic material, it provides soft contact with the chip, effectively reducing the risk of contact damage to the chip. Furthermore, the rubber material maintains a stable process within a temperature range of -20°C to 80°C, effectively improving the loading yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic cross-sectional structural diagram of an example of a chip adsorption device for a wafer loading machine according to the present invention.

[0024] Figure 2 It is a schematic cross-sectional structure diagram of another example of the chip adsorption device for a wafer loading machine of the present invention.

[0025] Figure 3 A schematic cross-sectional view showing the relationship between the engagement structure and the thickness of the rubber nozzle in the chip adsorption device for a chip loader of the present invention.

[0026] Figure 4 It is a schematic cross-sectional structure diagram of an example of a locking structure and a base in a chip adsorption device for a wafer loading machine of the present invention.

[0027] Figure 5 The figure shows a cross-sectional structural diagram of another example of the chip adsorption device for a wafer loading machine of the present invention, in which the chip is not shown.

[0028] Figure 6 It is a schematic cross-sectional structure diagram of an example of a locking structure in a chip adsorption device for a wafer loading machine according to the present invention.

[0029] Figure 7 It is a schematic cross-sectional structure diagram of another example of the engaging structure in the chip adsorption device for the wafer loading machine of the present invention.

[0030] Figure 8 The figure shows a cross-sectional structural diagram of an example of a rubber nozzle in a chip adsorption device for a chip loader according to the present invention.

[0031] Figure 9It is a schematic cross-sectional structure diagram of another example of the rubber nozzle in the chip adsorption device for the chip loader of the present invention.

[0032] Figure 10 The schematic diagram shows a top view of an example of an arrangement of adsorption holes on the surface where the rubber nozzle contacts the chip in the chip adsorption device for a wafer loader of the present invention.

[0033] Figure 11 The schematic diagram shows a top view of another example of the arrangement of adsorption holes on the surface where the rubber nozzle contacts the chip in the chip adsorption device for a wafer loader of the present invention.

[0034] Component number description

[0035] 10 base

[0036] 11. Snap-fit ​​structure

[0037] 110 Vacuum hole

[0038] 111 Part 1

[0039] 112 Part 2

[0040] 12 rubber nozzle

[0041] 120 blind slot

[0042] 121 adsorption holes

[0043] 122 vertical part

[0044] 123 chamfer

[0045] 13 Chips DETAILED DESCRIPTION

[0046] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different viewpoints and applications without departing from the spirit of the present invention.

[0047] See also Figures 1 to 11 It should be noted that the diagrams provided in this embodiment are merely schematic illustrations of the basic concept of the present invention. Therefore, the diagrams only show components relevant to the present invention and are not drawn according to the number, shape, and size of components in actual implementation. In actual implementation, the type, quantity, and proportion of each component may be changed arbitrarily, and the component layout may also be more complex.

[0048] like Figures 1 to 11As shown, this embodiment provides a chip adsorption device for a chip loading machine, and the chip adsorption device includes:

[0049] Base 10;

[0050] A snap-fit ​​structure 11 is fixedly connected to a surface of one side of the base 10; at least one through-hole 110 is provided in the snap-fit ​​structure 11 and the base 10 below it; that is, the vacuum hole 110 vertically connects the snap-fit ​​structure 11 and the base 10 directly below it;

[0051] like Figure 1 、 Figure 8 and Figure 9 As shown, the rubber nozzle 12 has a blind groove 120 at the bottom thereof, and the shape of the blind groove 120 is adapted to the engaging structure 11;

[0052] The rubber nozzle 12 is fixed on the outer surface of the locking structure 11 in a sleeve manner through the blind groove 120;

[0053] The rubber nozzle 12 is provided with at least one adsorption hole 121 penetrating the rubber nozzle 12;

[0054] The vacuum hole 110 is communicated with the adsorption hole 121 and is used to provide vacuum to the adsorption hole 121 so as to adsorb the chip 13 on the surface of the rubber nozzle 12 .

[0055] The chip suction device for a chip loading machine of this embodiment employs a snap-fit ​​structure 11 provided on a base 10, and a rubber nozzle 12 secured to the base 10 via the snap-fit ​​structure 11. The chip 13 is suctioned through suction holes 121 in the rubber nozzle 12. Because the rubber material can be injection molded, the diameter of the suction holes 121 can be very small, for example, less than 0.6 mm. This diameter is very small relative to the chip size and does not affect the vacuum suction process of the chip 13 on the rubber nozzle 12, nor does it cause the chip to shift during suction. Therefore, the rubber nozzle-type chip suction device of this embodiment is not limited by chip size during vacuum suction, effectively improving chip loading accuracy, especially for small chips. Furthermore, because the rubber nozzle is made of a deformable elastic material, it provides soft contact with the chip 13, effectively reducing the risk of contact damage to the chip 13. Furthermore, the rubber material is stable in the temperature range of -20°C to 80°C, effectively improving the loading yield rate.

[0056] It should be noted here that in this embodiment, the vacuum hole 110 and the adsorption hole 121 are connected to each other vertically, that is, they are directly connected up and down, and there is no bend in the extension path of the vacuum hole 110 and / or the adsorption hole 121. Figure 1 shown.

[0057] The snap-fit ​​structure 11 is fixedly connected to the base 10, and its fixing method can be a detachable connection method or a non-detachable connection method. The advantage of the detachable connection method is that when one of the two parts needs to be replaced, the two parts can be disassembled and the part that needs to be replaced can be replaced, which saves costs, but the production process is more complicated; the advantage of the non-detachable connection method is that the connection between the two parts is highly secure. Figure 2 As shown, in this embodiment, the snap-fit ​​structure 11 and the base 10 are preferably integrally formed and non-detachably connected to ensure the accuracy of the loading. More preferably, the material is a metal material, such as SUS420 stainless steel.

[0058] The number of the vacuum holes 110 can be one or two or more. Figure 3 The number of the vacuum holes 110 is set to one, and the one vacuum hole 110 is connected to all the adsorption holes 121; Figure 4 The number of the vacuum holes 110 is set to three, as shown in FIG. Figure 5 As shown, the three vacuum holes 110 are respectively connected to the corresponding adsorption holes 121. Here, it is not excessively limited whether the apertures of the plurality of vacuum holes 110 are the same, they can be the same or different, and the number of adsorption holes 121 corresponding to each vacuum hole 110 can be the same or different, for example Figure 5 The two vacuum holes 110 on the left are connected to the corresponding two adsorption holes 121, and the vacuum hole 110 on the right is connected to the corresponding adsorption hole 121. Figure 1 and Figure 2 As shown, in this embodiment, preferably, one vacuum hole 110 is provided in the engaging structure 11 and the base 10 thereunder, and the one vacuum hole 110 is vertically connected to all the adsorption holes 121 at the same time.

[0059] Based on the chip size specifications in the existing packaging field, it is preferably selected that the diameter of the adsorption hole 121 on the rubber nozzle 12 is 0.3 mm to 0.6 mm.

[0060] like Figure 3As shown, as an example, the thickness H2 of the rubber nozzle is no greater than 4 cm and no less than the thickness H1 of the engaging structure, which is no greater than 2.5 mm. The thickness H2 of the rubber nozzle is no less than the thickness H1 of the engaging structure to ensure that the rubber nozzle 12 has a certain thickness above the engaging structure 11 to achieve adsorption of the chip 13. However, the thickness H2 of the rubber nozzle should not be too thick, as this may cause the rubber nozzle 12 to wobble during the adsorption process, affecting the adsorption of the chip 13. For this reason, the thickness H2 of the rubber nozzle can also be set to other thicknesses to prevent wobble.

[0061] The shape of the snap-fit ​​structure 11 is not excessively limited, as long as the rubber nozzle 12 can be securely mounted on the outer surface of the snap-fit ​​structure 11. For rubber materials, a fixed connection is generally achieved by an interference fit. On the other hand, from the perspective of easy process preparation, the snap-fit ​​structure 11 is generally set to a regular shape, such as Figure 6 The shape of the rubber mouth 12 is regular, such as a cylinder or a prism. The column shape is easy to prepare, but the sleeve firmness is relatively poor. The blind groove 120 structure of the rubber mouth 12 adapted to the snap-fit ​​structure 11 of this shape is as follows: Figure 8 As shown; Figure 7 As shown, the snap-fit ​​structure 11 includes a first portion 111 and a second portion 112 from bottom to top in the thickness direction, wherein the surface profile size of the second portion 112 is larger than the surface profile size of the first portion 111. Due to the larger size of the second portion 112, the sleeve of the rubber nozzle 12 is better. More preferably, the first portion 111 is located in the middle area of ​​the second portion 112 to achieve the best sleeve and secure effect of the rubber nozzle 12. The blind groove 120 structure of the rubber nozzle 12 adapted to the snap-fit ​​structure 11 of this shape is as shown in FIG. Figure 9 As shown, for example, it is optional in this embodiment.

[0062] like Figure 8 As shown, the rubber nozzle 12 can be configured to include a vertical portion 122 and a chamfered portion 123 along its thickness from bottom to top. The vertical portion 122 maintains a constant surface profile, while the chamfered portion 123 gradually decreases its surface profile at a predetermined angle θ. This configuration of the rubber nozzle 12 can more effectively concentrate the suction force on the rubber nozzle 12 when attaching the chip 13, improving the suction effect. To maximize the upper surface area of ​​the vertical portion 122, the predetermined angle θ is typically 40° to 50°.

[0063] The shape of the surface of the rubber nozzle 12 in contact with the chip 13 is not excessively restricted, for example, it can be Figure 10 The rectangle can also be Figure 11For example, in this embodiment, the surface of the chamfered portion 123 in contact with the chip can be circular and have a diameter of 5 mm.

[0064] like Figure 10 and Figure 11 As shown, as a preferred example, the rubber nozzle 12 is provided with a plurality of suction holes 121, and all of the suction holes 121 are arranged in an array on the surface of the rubber nozzle 12 that contacts the chip 13. It should be noted that the number of suction holes 121 in the rubber nozzle 12 and the spacing between them are designed based on actual needs, such as the chip size, the desired vacuum level, and other parameters. Generally, larger chips have more suction holes 121; conversely, larger chips have a larger surface area of ​​the rubber nozzle 12.

[0065] This embodiment further provides a chip loading machine, comprising the chip adsorption device for the chip loading machine described above. The chip loading process of the chip loading machine generally includes: first providing a chip loading machine having the chip adsorption device for the chip loading machine described above; then starting the chip loading machine's automatic control system, which generally uses a PID control algorithm to monitor and adjust the chip loading machine's operating status in real time to ensure that each chip can be accurately placed in a predetermined position. Generally, the automatic control system has a sampling period of 0.1s and a control error of ±0.05mm; then, the chip is transferred through the chip loading machine's transfer channel to the bottom of a rubber nozzle, which vacuum-adsorbs the chip and places it in the predetermined position; and repeating the above steps until all chips are accurately placed in the predetermined position, achieving a high-precision loading process.

[0066] In summary, the present invention provides a chip suction device for a chip loading machine and a chip loading machine. The device utilizes a snap-fit ​​structure provided on a base, and a rubber nozzle secured to the base via the snap-fit ​​structure, allowing the chip to be suctioned through suction holes in the rubber nozzle. Because the rubber material can be injection molded, the suction holes can have very small diameters. This diameter is very small relative to the chip size, completely unaffecting the vacuum suction process of the chip on the rubber nozzle and preventing the chip from shifting during suction. Therefore, the rubber nozzle-type chip suction device of the present invention is not limited by chip size during vacuum suction, effectively improving chip loading accuracy, especially for small chips. Furthermore, because the rubber nozzle is made of a deformable elastic material, it provides soft contact with the chip, effectively reducing the risk of contact damage to the chip. Furthermore, the rubber material maintains a stable process within a temperature range of -20°C to 80°C, effectively improving chip loading yield. Therefore, the present invention effectively overcomes various shortcomings of the prior art and possesses high industrial value.

[0067] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed herein are intended to be covered by the claims of the present invention.

Claims

1. A chip adsorption device for a chip loading machine, characterized in that: The chip adsorption device comprises: base; A clamping structure fixedly connected to a side surface of the base; at least one through vacuum hole is provided in the clamping structure and the base below it; A rubber nozzle, wherein a blind groove is provided at the bottom of the rubber nozzle, and the shape of the blind groove is adapted to the engaging structure; The rubber nozzle is fixed on the outer surface of the clamping structure in a sleeve manner through the blind groove; The rubber nozzle is provided with at least one adsorption hole penetrating the rubber nozzle; The vacuum hole is communicated with the adsorption hole and is used for providing vacuum to the adsorption hole so as to adsorb the chip on the surface of the rubber nozzle.

2. The chip adsorption device for a chip loading machine according to claim 1, characterized in that: The base and the engaging structure are integrally formed and made of metal.

3. The chip adsorption device for a chip loading machine according to claim 1, characterized in that: The clamping structure and the base below it are provided with a vacuum hole, and the vacuum hole is vertically connected with all the adsorption holes at the same time.

4. The chip adsorption device for a chip loading machine according to claim 1, characterized in that: The adsorption holes have a pore diameter of 0.3 mm to 0.6 mm.

5. The chip adsorption device for a chip loading machine according to claim 1, characterized in that: The thickness of the rubber mouth is not greater than 4 cm and not less than the thickness of the clamping structure, and the thickness of the clamping structure is not greater than 2.5 mm.

6. The chip adsorption device for a chip loading machine according to claim 1, characterized in that: The locking structure includes a first portion and a second portion from bottom to top along a thickness direction thereof, and a surface contour dimension of the second portion is larger than a surface contour dimension of the first portion.

7. The chip adsorption device for a chip loading machine according to claim 6, characterized in that: The first portion is located in a middle area of ​​the second portion.

8. The chip adsorption device for a chip loading machine according to claim 1, characterized in that: The rubber nozzle includes a vertical portion and a chamfered portion from bottom to top along its thickness direction; wherein the surface outer contour size of the vertical portion remains unchanged, and the surface outer contour size of the chamfered portion gradually decreases at a preset angle.

9. The chip adsorption device for a chip loading machine according to any one of claims 1 to 8, characterized in that: The rubber nozzle is provided with a plurality of adsorption holes, and all the adsorption holes are arranged in an array on the surface of the rubber nozzle in contact with the chip.

10. A film loading machine, characterized in that: The invention comprises a chip adsorption device for a chip loading machine as described in any one of claims 1 to 9.

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