Radiator and design method thereof, radiating module and electronic equipment

Abstract

The invention relates to a radiator and a design method thereof, a radiating module and electronic equipment. The method comprises the following steps: acquiring a temperature distribution diagram of a chip to be cooled; acquiring a first temperature area and a second temperature area of the chip to be cooled according to the temperature distribution diagram; wherein the temperature of the first temperature area is higher than that of the second temperature area; designing a first cooling area and a second cooling area of the radiator according to the first temperature area and the second temperature area; wherein the first cooling area is used for cooling the first temperature area, the second cooling area is used for cooling the second temperature area, and the cooling capacity of the first cooling area is larger than that of the second cooling area. According to the radiator and the design method thereof, the radiator is subjected to partition design according to different cooling capacities aiming at the problem of non-uniform temperature distribution of the chip to be cooled, and compared with the prior art, local heat accumulation of the chip is reduced, and the performance and the reliability of the chip are improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of radiators, and in particular to a radiator and a design method thereof, a heat dissipation module, and an electronic device. Background Art

[0002] With the technological development of chips (such as graphics processing chips), the number of transistors continues to increase, which not only doubles the chip performance but also leads to increasing chip power and power density. Therefore, a heat sink is needed to effectively dissipate the heat of the chip to ensure its performance and reliability.

[0003] In related technologies, the overall power density distribution of the chip is uneven, and local power differences are very large, resulting in severely uneven chip temperature distribution, local heat accumulation, and hot spots. Therefore, traditional heat sinks cannot meet the heat dissipation needs of the chip. Summary of the Invention

[0004] The purpose of the present disclosure is to provide a heat sink and its design method, a heat dissipation module and an electronic device. To address the problem of uneven temperature distribution of the chip to be cooled, the heat sink is partitioned according to different cooling capacities. Compared with related technologies, this reduces local heat accumulation in the chip and improves the performance and reliability of the chip.

[0005] To achieve the above objectives, according to a first aspect of the present disclosure, a method for designing a heat sink is provided, comprising: Obtain a temperature distribution diagram of the chip to be cooled; Acquire a first temperature zone and a second temperature zone of the chip to be cooled according to the temperature distribution diagram; wherein the temperature of the first temperature zone is greater than the temperature of the second temperature zone; The first cooling zone and the second cooling zone of the radiator are designed according to the first temperature zone and the second temperature zone; wherein the first cooling zone is used for cooling the first temperature zone, the second cooling zone is used for cooling the second temperature zone, and the cooling capacity of the first cooling zone is greater than the cooling capacity of the second cooling zone.

[0006] Optionally, acquiring the first temperature zone and the second temperature zone of the chip to be cooled according to the temperature distribution map includes: Obtaining hot spots and hot spot parameters according to the temperature distribution map; wherein the hot spot parameters include: hot spot location, hot spot number and hot spot size; A first temperature zone and a second temperature zone are determined according to the hot spot and the hot spot parameters.

[0007] Optionally, determining the first temperature zone and the second temperature zone according to the hot spot and the hot spot parameter includes: When the number of the hot spot is one, the first temperature zone corresponds to the hot spot; When there are multiple hot spots, the first temperature zone is determined according to an area surrounded by at least part of the multiple hot spots.

[0008] Optionally, designing a first cooling zone and a second cooling zone of a radiator according to the first temperature zone and the second temperature zone includes: The liquid inlet of the radiator is designed according to the first temperature zone and the second temperature zone; wherein the liquid inlet is located in the first cooling zone or lateral to the first cooling zone; The cooling channel of the radiator is designed according to the first temperature zone and the second temperature zone; wherein one end of the cooling channel close to the liquid inlet is located in the first cooling zone.

[0009] Optionally, the method further includes: Heat dissipation fins are designed in the first cooling zone and the second cooling zone; wherein the total heat dissipation area of ​​the heat dissipation fins in the first cooling zone is greater than the total heat dissipation area of ​​the heat dissipation fins in the second cooling zone.

[0010] Optionally, the designing of heat dissipation fins in the first cooling zone and the second cooling zone includes: Designing the spacing of the heat dissipation fins; wherein the density of the heat dissipation fins in the first cooling zone is greater than the density of the heat dissipation fins in the second cooling zone; and / or The height of the heat dissipation fins is designed, wherein the height of the heat dissipation fins in the first cooling zone is greater than the height of the heat dissipation fins in the second cooling zone.

[0011] According to a second aspect of the present disclosure, a heat sink is further provided for dissipating heat from a chip. The heat sink comprises a first cooling zone and a second cooling zone, wherein the cooling capacity of the first cooling zone is greater than that of the second cooling zone.

[0012] Optionally, the radiator includes a liquid inlet and a cooling channel connected to the liquid inlet, and the liquid inlet is located in the first cooling zone or lateral to the first cooling zone.

[0013] Optionally, the radiator further includes heat dissipation fins arranged inside the radiator, wherein the total heat dissipation area of ​​the heat dissipation fins in the first cooling zone is greater than the total heat dissipation area of ​​the heat dissipation fins in the second cooling zone.

[0014] Optionally, the density of the heat dissipation fins in the first cooling zone is greater than the density of the heat dissipation fins in the second cooling zone; and / or The height of the heat dissipation fins in the first cooling zone is greater than the height of the heat dissipation fins in the second cooling zone.

[0015] According to a third aspect of the present disclosure, a heat dissipation module is further provided, comprising a chip and the above-mentioned heat sink.

[0016] According to a fourth aspect of the present disclosure, an electronic device is further provided, which includes the above-mentioned radiator or the above-mentioned heat dissipation module.

[0017] Through the above-mentioned technical solution, namely the heat sink design method disclosed herein, a temperature distribution map of the chip to be dissipated is obtained, and then the first and second temperature zones of the chip to be dissipated are obtained based on the temperature distribution map. The first and second cooling zones of the heat sink are designed based on the distribution of the first and second temperature zones, so that the first cooling zone of the heat sink with greater cooling capacity cools the first temperature zone with higher temperature of the chip, and the second cooling zone with less cooling capacity cools the second temperature zone with lower temperature of the chip, thereby ensuring the temperature uniformity of the entire chip. The heat sink design method disclosed herein addresses the problem of uneven temperature distribution of the chip to be dissipated by partitioning the heat sink according to different cooling capacities. Compared with related technologies, this method reduces local heat accumulation in the chip and improves the performance and reliability of the chip.

[0018] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following detailed description, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings: Figure 1 This is a flow chart of a heat sink design method provided by some embodiments of the present disclosure.

[0020] Figure 2 This is the temperature distribution diagram of the chip obtained through simulation analysis.

[0021] Figure 3 This is a schematic diagram of the hotspot, first temperature zone, and second temperature zone of a chip provided in some embodiments of the present disclosure.

[0022] Figure 4 2 is a schematic diagram of a heat sink structure provided in some embodiments of the present disclosure, in which the chip is indicated by a dotted line.

[0023] Figure 5 This is a schematic diagram of the hotspot, first temperature zone, and second temperature zone of a chip provided in some other embodiments of the present disclosure.

[0024] Figure 6 2 is a schematic diagram of a heat sink structure provided in some other embodiments of the present disclosure, in which the chip is indicated by a dotted line.

[0025] Figure 7Schematic diagram of a hotspot, a first temperature zone, and a second temperature zone of a chip provided in some other embodiments of the present disclosure, wherein the hotspot is close to the edge of the chip.

[0026] Figure 8 3 is a schematic diagram of a heat sink structure provided by some other embodiments of the present disclosure, wherein the chip is indicated by a dotted line, wherein the hot spot is close to the edge of the chip.

[0027] Figure 9 Schematic diagram of a hotspot, a first temperature zone, and a second temperature zone of a chip provided in some other embodiments of the present disclosure, wherein the two hotspots are close to the edge of the chip.

[0028] Figure 10 3 is a schematic diagram of a heat sink structure provided by some other embodiments of the present disclosure, wherein the chip is indicated by dotted lines, wherein two hot spots are close to the edge of the chip.

[0029] Figure 11 Schematic diagram of hot spots, first temperature zones, and second temperature zones of a chip provided in some other embodiments of the present disclosure, wherein four hot spots are close to the middle of the chip.

[0030] Figure 12 3 is a schematic diagram of a heat sink structure provided by some embodiments of the present disclosure, wherein a chip is indicated by a dotted line, wherein four hot spots are gradually formed near the center of the chip.

[0031] Figure 13 Schematic diagram of a hotspot, a first temperature zone, and a second temperature zone of a chip provided in some other embodiments of the present disclosure, wherein a second temperature zone is provided between the two first temperature zones.

[0032] Figure 14 3 is a schematic diagram of a heat sink structure provided by some other embodiments of the present disclosure, wherein the chip is indicated by a dotted line, wherein a second cooling zone is provided between the two second cooling zones.

[0033] Figure 15 It is a structural schematic diagram of a radiator provided in some embodiments of the present disclosure.

[0034] Figure 16 This is a side view of a radiator provided in some embodiments of the present disclosure.

[0035] Figure 17 This is an exploded view of the heat dissipation module.

[0036] Figure 18 It is a side sectional view of the heat dissipation module.

[0037] Description of Reference Numerals 10-heat dissipation module; 100-radiator; 101-liquid inlet; 102-cooling channel; 103-liquid outlet; 104-heat dissipation fins; 110-first cooling zone; 120-second cooling zone; 200-chip; 210-first temperature zone; 211-hot spot; 220-second temperature zone; 300-heat conducting parts; 400-Substrate. DETAILED DESCRIPTION

[0038] The following describes the specific embodiments of the present disclosure in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present disclosure and are not intended to limit the present disclosure.

[0039] In the present disclosure, unless otherwise specified, directional words such as "inside" and "outside" refer to the inside and outside of the outline of the corresponding component; "far" and "near" refer to the corresponding structure or corresponding component being far away from or close to another structure or component. In addition, the terms "first", "second" and the like used in the present disclosure are intended to distinguish one element from another and do not have order or importance. In addition, in the following description, when referring to the drawings, unless otherwise explained, the same figure marks in different drawings represent the same or similar elements. The above definitions are only used to explain and illustrate the present disclosure and should not be understood as limitations on the present disclosure.

[0040] In order to achieve the above purpose, Figures 1 to 18 As shown, according to the first aspect of the present disclosure, a design method for a heat sink 100 is provided, and the method includes steps S100 to S300.

[0041] Step S100 , obtaining a temperature distribution diagram of the chip 200 to be cooled.

[0042] Step S200 , obtaining a first temperature zone 210 and a second temperature zone 220 of the chip 200 to be cooled according to the temperature distribution diagram; wherein the temperature of the first temperature zone 210 is greater than the temperature of the second temperature zone 220 .

[0043] In step S300, the first cooling zone 110 and the second cooling zone 120 of the radiator 100 are designed according to the first temperature zone 210 and the second temperature zone 220; wherein the first cooling zone 110 is used for cooling the first temperature zone 210, and the second cooling zone 120 is used for cooling the second temperature zone 220, and the cooling capacity of the first cooling zone 110 is greater than the cooling capacity of the second cooling zone 120.

[0044] Through the above technical solution, i.e., the design method of the heat sink 100 disclosed in the present invention, by obtaining a temperature distribution map of the chip 200 to be cooled, and then obtaining the first temperature zone 210 and the second temperature zone 220 of the chip 200 to be cooled based on the temperature distribution map, the first cooling zone 110 and the second cooling zone 120 of the heat sink 100 are designed based on the distribution of the first temperature zone 210 and the second temperature zone 220, so that the first cooling zone 110 of the heat sink 100 with a larger cooling capacity cools the first temperature zone 210 with a higher temperature of the chip 200, and the second cooling zone 120 with a smaller cooling capacity cools the second temperature zone 220 with a lower temperature of the chip 200, thereby ensuring the overall temperature uniformity of the chip 200. The design method of the heat sink 100 disclosed in the present invention addresses the problem of uneven temperature distribution of the chip 200 to be cooled by partitioning the heat sink 100 according to different cooling capacities. Compared with the related art, this method reduces local heat accumulation in the chip 200 and improves the performance and reliability of the chip 200.

[0045] It is understood that the first temperature zone 210 in the embodiment of the present disclosure refers to a region of the chip 200 with a higher temperature, which may be one or more, that is, there are multiple high-temperature regions on the chip 200, and the second temperature zone 220 may be a region with a relatively lower temperature compared to the high temperature of the first temperature zone 210. It should be noted that the higher temperature of the first temperature zone 210 means that the first temperature zone 210 includes multiple regions with a temperature higher than the second temperature zone 220, or the temperature of the entire first temperature zone 210 is higher than the second temperature zone 220. It can also be understood that the average temperature of the first temperature zone 210 is higher than the average temperature of the second temperature zone 220. Correspondingly, the first cooling zone 110 on the heat sink 100 corresponds to the first temperature zone 210. Therefore, as many first cooling zones 110 as there are first temperature zones 210, the heat sink 100 can also be designed with a one-to-one correspondence between the first cooling zones 110 and the first temperature zones 210.

[0046] The temperature distribution map of the chip 200 to be cooled can be obtained by performing a thermal simulation under a pre-designed power consumption distribution of the chip 200, and then plotting the temperature distribution map based on the simulation results. Alternatively, the temperature distribution map can be obtained by measuring the temperature at various locations on the chip 200 using various sensors during actual operation.

[0047] like Figure 2 As shown in FIG. 1 , the temperature distribution on the chip 200 is obtained by thermal simulation, wherein three hot spots 211 arranged in a triangle are shown. Therefore, according to the positions of the three hot spots 211, the following are defined: Figure 3The rectangular first temperature zone 210 is shown, and the area on the chip 200 other than the first temperature zone 210 is defined as the second temperature zone 220. Figure 4 The method is to arrange a first cooling zone 110 corresponding to the first temperature zone 210 and a second cooling zone 120 corresponding to the second temperature zone 220 on the radiator 100, and arrange the liquid inlet 101 of the radiator 100 in the middle of the first cooling zone 110. The cooling of the first temperature zone 210 is achieved through two cooling channels 102 arranged between the hot spots 211 and passing through another hot spot 211. The first temperature zone 210 with a higher temperature can be better dissipated to ensure the temperature uniformity of the entire chip 200.

[0048] It should be noted that the chip 200 to be cooled can be a graphics processing chip 200 or a chip 200 with other functions. With the invention of technology, the number of transistors and other capacitors, resistors or inductors on the chip 200 increases, thereby increasing the unevenness of its surface temperature.

[0049] In addition, it should be noted that the radiator 100 can be any suitable type of radiator 100 , including but not limited to a liquid cooling radiator 100 .

[0050] In some optional embodiments, obtaining the first temperature zone 210 and the second temperature zone 220 of the chip to be cooled 200 according to the temperature distribution map includes the following steps.

[0051] The hot spots 211 and the parameters of the hot spots 211 are obtained according to the temperature distribution diagram; wherein the parameters of the hot spots 211 include: the location of the hot spots 211 , the number of the hot spots 211 , and the size of the hot spots 211 .

[0052] The first temperature zone 210 and the second temperature zone 220 are determined according to the hot spot 211 and the parameters of the hot spot 211 .

[0053] The temperature distribution map can be used to obtain the hot spots 211, which are points with higher temperatures, and parameters of the hot spots 211, including the location, number, and size of the hot spots 211. The first temperature zone 210 is determined based on the hot spots 211 and the parameters of the hot spots 211, including the size and location of the first temperature zone 210. Typically, the hot spots 211 are located within the first temperature zone 210, and the area of ​​the first temperature zone 210 is equal to or greater than the area of ​​the hot spots 211.

[0054] Optionally, determining the first temperature zone 210 and the second temperature zone 220 according to the hot spot 211 and the parameters of the hot spot 211 includes the following steps.

[0055] When the number of the hot spot 211 is one, the first temperature zone 210 corresponds to the hot spot 211 .

[0056] When there are multiple hot spots 211 , the first temperature zone 210 is determined according to an area enclosed by at least a portion of the multiple hot spots 211 .

[0057] like Figure 5 and Figure 6 As shown, in some embodiments, when there is only one hot spot 211 on the temperature distribution diagram, the area of ​​the first temperature zone 210 corresponds to the hot spot 211, and a range slightly larger than the hot spot 211 is determined based on the size of the hot spot 211. The corresponding first cooling zone 110 is designed based on the first temperature zone 210. By arranging the first cooling zone 110 of the heat sink 100 in the first temperature zone 210, it is used to cool the first temperature zone 210. Since the first cooling zone 110 has a relatively strong cooling capacity and a strong heat exchange capacity, it can quickly cool the hot spot 211. In combination with the second cooling zone 120 corresponding to the second temperature zone 220, the second cooling zone 120 is used to cool the second temperature zone 220 relatively weakly, thereby making the overall temperature of the chip 200 more uniform.

[0058] In other embodiments, when there are multiple hot spots 211, the first temperature zone 210 is determined based on the area enclosed by at least a portion of the multiple hot spots 211. The first temperature zone 210 may cover the area enclosed by multiple relatively close hot spots 211. For multiple hot spots 211, there may be one or more first temperature zones 210. Within the multiple first temperature zones 210, relatively close hot spots 211 may be grouped into a single area, thereby enclosing multiple first temperature zones 210. Specifically, a polygon may be formed by sequentially connecting the centers of the multiple relatively close hot spots 211, using the vertices as vertices. The first temperature zone 210 is formed by optimizing the polygon into a relatively regular shape (including a triangle, rectangle, circle, or ellipse, etc.) based on the location and size of each hot spot 211. The shape of the first cooling zone 110 can be designed with reference to the shape of the first temperature zone 210. Its area may be larger than that of the first temperature zone 210, and its shape may also be adaptively adjusted based on the shape of the first temperature zone 210.

[0059] When the radiator 100 is a liquid-cooled radiator 100, the radiator 100 includes a liquid inlet 101, a liquid outlet 103, and a cooling channel 102 connecting the liquid inlet 101 and the liquid outlet 103. Optionally, designing the first cooling zone 110 and the second cooling zone 120 of the radiator 100 according to the first temperature zone 210 and the second temperature zone 220 includes the following steps.

[0060] The liquid inlet 101 of the radiator 100 is designed according to the first temperature zone 210 and the second temperature zone 220 ; wherein, the liquid inlet 101 is located in the first cooling zone 110 or at the side of the first cooling zone 110 .

[0061] The cooling channel 102 of the radiator 100 is designed according to the first temperature zone 210 and the second temperature zone 220 ; wherein, one end of the cooling channel 102 close to the liquid inlet 101 is located in the first cooling zone 110 .

[0062] In some embodiments, when there is only one hot spot 211 and the hot spot 211 corresponds to the middle position of the chip 200, the first cooling zone 110 is designed corresponding to the hot spot 211, and the liquid inlet 101 can be arranged in the first cooling zone 110 of the radiator 100, and is arranged directly opposite the hot spot 211, so that the cooling medium entering from the liquid inlet 101 can first cool the hot spot 211. Since the cooling medium temperature of the liquid inlet 101 is the lowest, the fluid convection heat transfer capacity is stronger, which is conducive to the cooling of the hot spot 211.

[0063] like Figure 7 and Figure 8 As shown, in other embodiments, when the number of hot spots 211 is one and the hot spot 211 corresponds to the edge position of the chip 200, the first cooling zone 110 is designed corresponding to the hot spot 211, and the liquid inlet 101 can be arranged on the side of the first cooling zone 110 of the radiator 100, and the cooling channel 102 connected to the liquid inlet 101 can be located at the hot spot 211 or arranged on the side of the hot spot 211, so that the cooling medium entering from the liquid inlet 101 can be cooled preferentially through the hot spot 211 position. Similarly, since the cooling medium temperature of the liquid inlet 101 and the cooling channel 102 close to the liquid inlet 101 is the lowest, the fluid convection heat transfer capacity is stronger, which is conducive to the cooling of the hot spot 211 position.

[0064] like Figure 9 and Figure 10 As shown, when there are two hot spots 211 and the two hot spots 211 correspond to the edge positions of the chip 200, the first cooling zone 110 is designed corresponding to the two hot spots 211, and the liquid inlet 101 can be arranged on the side of the first cooling zone 110 of the radiator 100, and the cooling channel 102 connected to the liquid inlet 101 can be located at the hot spot 211 or arranged on the side of the hot spot 211, so that the cooling medium entering from the liquid inlet 101 can be cooled preferentially through the hot spot 211 position. Similarly, since the cooling medium temperature of the liquid inlet 101 and the cooling channel 102 close to the liquid inlet 101 is the lowest, the fluid convection heat transfer capacity is stronger, which is conducive to the cooling of the hot spot 211 position.

[0065] like Figures 11 to 14As shown, in some other embodiments, the number of hot spots 211 is multiple, for example, four. The first temperature zone 210 can be demarcated based on the four hot spots 211, and a corresponding first cooling zone 110 can be designed on the radiator 100. The liquid inlet 101 can be arranged in the middle of the first cooling zone 110, and the cooling channel 102 can be set between two adjacent hot spots 211. Through the above design, the cooling medium entering the cooling channel 102 from the liquid inlet 101 can first cool the hot spot 211 at the position closest to the hot spot 211. It is understandable that the cooling channel 102 can be arranged in two, such as Figure 14 As shown, one cooling channel 102 extends upward, passing between the two hot spots 211 on the upper side; the other cooling channel 102 extends downward, passing between the two hot spots 211 on the lower side, thereby cooling the four hot spots 211. It should be noted that the two cooling channels 102 can also be configured to extend in the left and right directions respectively, which will not be repeated here.

[0066] In order to further improve the heat dissipation capability of the heat sink 100 , in some embodiments, the method further includes the following steps.

[0067] Heat dissipation fins 104 are designed in the first cooling zone 110 and the second cooling zone 120 . The total heat dissipation area of ​​the heat dissipation fins 104 in the first cooling zone 110 is greater than the total heat dissipation area of ​​the heat dissipation fins 104 in the second cooling zone 120 .

[0068] The heat dissipation fins 104 can be disposed within the cooling channels 102 of the first cooling zone 110 and the second cooling zone 120 to increase the heat exchange area of ​​the cooling medium, thereby improving the overall heat dissipation efficiency of the heat sink 100. To ensure that the heat exchange capacity of the first cooling zone 110 is greater than that of the second cooling zone 120, the area of ​​the heat dissipation fins 104 in the first cooling zone 110 can be arranged to be larger than the area of ​​the heat dissipation fins 104 in the second cooling zone 120. This allows the heat sink 100 to remove more heat from the first temperature zone 210, ensuring uniform temperature distribution across the chip 200.

[0069] Related research has shown that the spacing of the heat sink fins 104 affects the heat transfer effect. Using high-density / higher-height heat sink fins 104 in hot spots 211 / higher temperature areas, and low-density / higher-height heat sink fins 104 in lower temperature areas, can enhance heat dissipation in the hot spots 211 while reducing overall flow resistance.

[0070] Based on this, in some embodiments, the step of designing the heat dissipating fins 104 in the first cooling zone 110 and the second cooling zone 120 includes: designing the spacing of the heat dissipating fins 104; wherein the density of the heat dissipating fins 104 in the first cooling zone 110 is greater than the density of the heat dissipating fins 104 in the second cooling zone 120; and / or, designing the height of the heat dissipating fins 104, wherein the height of the heat dissipating fins 104 in the first cooling zone 110 is greater than the height of the heat dissipating fins 104 in the second cooling zone 120.

[0071] By designing the spacing between the heat dissipating fins 104 in the first cooling zone 110 and the second cooling zone 120, the density of the heat dissipating fins 104 in the first cooling zone 110 and the second cooling zone 120 is changed. Because the heat exchange demand of the first cooling zone 110 is greater than that of the second cooling zone 120, the density of the heat dissipating fins 104 in the first cooling zone 110 is greater than that in the second cooling zone 120 to ensure the cooling capacity of the first cooling zone 110. Similarly, the height of the heat dissipating fins 104 also affects the heat exchange efficiency. Designing the heat dissipating fins 104 in the first cooling zone 110 to be higher than those in the second cooling zone 120 further improves the cooling capacity of the first cooling zone 110.

[0072] It should be noted that the heat exchange area of ​​the heat dissipating fins 104 of the above-mentioned radiator 100 can be adjusted by the spacing and height of the heat dissipating fins 104, so that the first cooling zone 110 corresponding to the first temperature zone 210 with a higher temperature has a better heat exchange capacity than the second cooling zone 120 corresponding to the second temperature zone 220 with a lower temperature, and the cooling medium can take away more heat to ensure cooling.

[0073] Alternatively, a denser distribution of heat dissipating fins 104 increases the contact area, but this also increases the flow resistance. Based on manufacturing techniques and practical experience, the optimal width and spacing of heat dissipating fins 104 is 0.1 mm to 0.15 mm. Therefore, in the first cooling zone 110 near the hotspot 211, the spacing between two adjacent heat dissipating fins 104 is 0.1 mm to 0.15 mm.

[0074] It should be noted that the method further includes: further designing the arrangement direction of the heat dissipating fins 104 and combining it with the sparseness, spacing and height of the heat dissipating fins 104 to obtain a heat sink 100 having a first cooling zone 110 and a second cooling zone 120 with different cooling capabilities.

[0075] like Figures 15 to 18 As shown, according to the second aspect of the present disclosure, a heat sink 100 is further provided for dissipating heat from a chip 200 . The heat sink 100 includes a first cooling zone 110 and a second cooling zone 120 , wherein the cooling capacity of the first cooling zone 110 is greater than that of the second cooling zone 120 .

[0076] The chip 200 can be disposed on a substrate 400 or a circuit board. The heat sink 100 and the chip 200 are connected via a thermally conductive member 300 (e.g., a thermal pad, thermally conductive adhesive, or thermally conductive paste). The chip 200 has a first temperature zone 210 and a second temperature zone 220, wherein the temperature of the first temperature zone 210 is higher than the temperature of the second temperature zone 220. The first cooling zone 110 corresponds to the first temperature zone 210, and the second cooling zone 120 corresponds to the second temperature zone 220. The first temperature zone 210 can directly correspond to a hotspot 211 on the chip 200, or it can be an area surrounded by several hotspots 211. When the heat sink 100 is used to cool the chip 200, the first cooling zone 110 is arranged corresponding to the first temperature zone 210, and the second cooling zone 120 is arranged corresponding to the second temperature zone 220.

[0077] Through this arrangement, the first cooling zone 110 of the heat sink 100, with its greater cooling capacity, cools the first temperature zone 210 of the chip 200, which has a relatively higher temperature, while the second cooling zone 120, with its relatively smaller cooling capacity, cools the second temperature zone 220 of the chip 200, which has a lower temperature, thereby ensuring temperature uniformity across the chip 200. This heat sink 100 addresses the issue of uneven temperature distribution within the chip 200 being dissipated by designing zones with different cooling capacities. Compared to related technologies, this design reduces localized heat accumulation within the chip 200 and improves the overall performance and reliability of the chip 200.

[0078] In some embodiments, there are multiple first cooling zones 110 and / or second cooling zones 120. Specifically, there can be multiple first cooling zones 110, each corresponding to a hotspot location or hotspot region of the chip, i.e., a first temperature zone 210. Multiple first cooling zones 110 can be used to cool multiple first temperature zones 210. There can also be one or more second cooling zones 120, each corresponding to a hotspot location or hotspot region of the chip and other regions, i.e., a second temperature zone 220. Multiple second cooling zones 120 can be used to cool multiple second temperature zones 220. By providing multiple first cooling zones 110 and second cooling zones 120 that can respectively correspond to the first temperature zone 210 and the second temperature zone 220 of the chip 200, better adaptation to different temperature zones of the chip 200 is achieved, thereby improving the overall temperature uniformity of the chip 200.

[0079] In some embodiments, the first cooling zone 110 and the second cooling zone 120 are connected in series or in parallel. The first cooling zone 110 and the second cooling zone 120 can be connected in series or in parallel. When connected in series, the cooling medium flows through the first cooling zone 110 and the second cooling zone 120 in sequence. The cooling medium can first flow through the first cooling zone 110 to cool the first temperature zone 210, and then flow through the second cooling zone 120 to cool the second temperature zone 220. A higher degree of subcooling is first used to cool the higher temperature zone of the chip 200, and then a relatively smaller degree of subcooling is used to cool the lower temperature zone. It can fully absorb heat and achieve deep cooling, ensuring that the cooling effect of the entire system reaches the optimal state, effectively maintaining the stable operating temperature of the equipment, and extending the service life of the equipment. The use of parallel connection allows the cooling medium to enter the first cooling zone 110 and the second cooling zone 120 at the same time, thereby improving the efficiency and speed of cooling and quickly reducing the temperature of the equipment. It is particularly suitable for high-load, temperature-sensitive equipment scenarios, helping to dissipate heat in a timely manner, avoiding equipment overheating and damage, ensuring the continuity and safety of the production process, providing strong support for the efficient operation of the equipment, meeting the cooling needs under different working conditions, and enhancing the adaptability and flexibility of the system. Of course, it is also possible to achieve cooling for non-temperature zones by designing the size of the cooling process, the flow rate of the cooling medium in the first cooling zone 110 and the second cooling zone 120, etc., so as to improve the temperature uniformity of the entire chip 200.

[0080] It should be noted that the radiator 100 can be a liquid-cooled radiator 100, or the radiator 100 can also be a metal radiator that uses air cooling and / or heat pipe cooling. The radiator 100 can include a liquid inlet 101 and a cooling channel 102 connected to the liquid inlet 101, the liquid inlet 101 is located in the first cooling zone 110 or on the side of the first cooling zone 110, wherein the end of the cooling channel 102 close to the liquid inlet 101 is located in the first cooling zone 110 or is arranged close to the first cooling zone 110. Since the temperature of the cooling medium at the inlet is low when entering the radiator 100, and the convective heat exchange capacity of the fluid is stronger, therefore, arranging the liquid inlet 101 and the end of the cooling channel 102 close to the liquid inlet 101 in the first cooling zone 110 can improve the cooling capacity of the first cooling zone 110, which is conducive to reducing the temperature of the first temperature zone 210 corresponding to the hot spot 211 on the chip 200.

[0081] The liquid inlet 101 can be arranged corresponding to the hotspot 211 or lateral to (near) the hotspot 211. Furthermore, the liquid inlet 101 can be arranged in the second cooling zone 120, away from the first cooling zone 110, to allow the cooling medium to flow out of the heat sink 100 or circulate. Furthermore, the end of the cooling channel 102 near the liquid inlet 101 can pass directly through the hotspot 211 or be located near the hotspot 211. It should be noted that this refers to the position where the orthographic projections of the liquid inlet 101 and the hotspot 211 on the plane of the chip 200 pass through or are located near the hotspot 211.

[0082] To further improve the cooling capacity of the heat sink 100, in some embodiments, the heat sink 100 further includes heat dissipation fins 104 disposed within the heat sink 100. The total heat dissipation area of ​​the heat dissipation fins 104 in the first cooling zone 110 is greater than the total heat dissipation area of ​​the heat dissipation fins 104 in the second cooling zone 120. By arranging the total heat dissipation area of ​​the heat dissipation fins 104 in the first cooling zone 110 to be larger than the total heat dissipation area of ​​the heat dissipation fins 104 in the second cooling zone 120, the heat sink 100 can remove more heat from the first temperature zone 210, ensuring uniform temperature across the chip 200.

[0083] It is understood that a plurality of heat dissipation fins 104 may be provided within the cooling channels 102 of the first cooling zone 110 and the second cooling zone 120 of the radiator 100 to increase the heat dissipation area. Of course, the heat dissipation fins 104 may be used to enclose the aforementioned cooling channels 102, or at least partially enclose the cooling channels 102, without specific limitation herein.

[0084] Optionally, the density of the heat dissipating fins 104 in the first cooling zone 110 is greater than the density of the heat dissipating fins 104 in the second cooling zone 120; and / or the height of the heat dissipating fins 104 in the first cooling zone 110 is greater than the height of the heat dissipating fins 104 in the second cooling zone 120. Because the heat exchange demand of the first cooling zone 110 is greater than that of the second cooling zone 120, the density of the heat dissipating fins 104 in the first cooling zone 110 is greater than that in the second cooling zone 120 to ensure the cooling capacity of the first cooling zone 110. Similarly, the height of the heat dissipating fins 104 also affects the heat exchange efficiency. Designing the heat dissipating fins 104 in the first cooling zone 110 to be greater than that in the second cooling zone 120 further improves the cooling capacity of the first cooling zone 110.

[0085] It should be noted that the total heat exchange area of ​​the heat dissipating fins 104 of the radiator 100 can be adjusted by the spacing and height of the heat dissipating fins 104, so that the first cooling zone 110 corresponding to the first temperature zone 210 with a higher temperature has a better heat exchange capacity than the second cooling zone 120 corresponding to the second temperature zone 220 with a lower temperature, and the cooling medium can take away more heat to ensure cooling.

[0086] Considering that denser the heat dissipation fins 104 are, the greater the contact area is, but also the greater the flow resistance is, in some embodiments, based on manufacturing processes and practical experience, it is determined that the optimal width and spacing of the heat dissipation fins 104 is between 0.1 mm and 0.15 mm. Therefore, in the first cooling zone 110 near the hotspot 211, the spacing between two adjacent heat dissipation fins 104 is between 0.1 mm and 0.15 mm.

[0087] like Figure 17 and 18 As shown, the present disclosure provides a heat dissipation module 10, which includes a chip 200, which is arranged on a substrate 400, and the heat dissipation module 10 also includes the heat sink 100 provided in the above embodiment. The heat sink 100 is used to dissipate heat from the chip 200, and cools the first temperature zone 210 and the second temperature zone 220 of the chip 200 through the first cooling zone 110 and the second cooling zone 120 of the heat sink 100 (wherein the first cooling zone 110 corresponds to the first temperature zone 210, and the second cooling zone 120 corresponds to the second temperature zone 220), and can cool different temperature zones of the chip 200, that is, strongly cool the high temperature zone and weakly cool the low temperature zone, thereby improving the overall temperature uniformity of the chip 200. Among them, the chip 200 includes but is not limited to a GPU chip, a CPU chip or a SOC chip. The heat dissipation module 10 may include a substrate 400 and a GPU (Graphics Processing Unit) chip arranged on the substrate 400. The radiator 100 can be connected to the side of the chip 200 away from the substrate 400 through a thermal pad, and can cool and dissipate heat for the chip 200.

[0088] It is understandable that the chip 200 may also be a CPU (Central Processing Unit) chip, a SOC (System on Chip) chip, etc.

[0089] The embodiment of the present disclosure further provides an electronic device, which includes the above-mentioned radiator 100 or the above-mentioned heat dissipation module 10. Therefore, the electronic device also has all the advantages of the above-mentioned radiator 100 or the above-mentioned heat dissipation module 10, which will not be repeated here.

[0090] It should be noted that electronic devices may include personal computers, servers, base station equipment, tablet computers, mobile phones, digital products and wearable devices, etc.

[0091] The heat sink 100 and its design method, heat dissipation module 10, and electronic device disclosed herein are used to dissipate heat from a high-power chip 200. This design method uses thermal simulation to obtain the temperature distribution on the chip 200 under a pre-designed power consumption distribution of the chip 200. The method then optimizes the liquid inlet 101, cooling channels 102, and liquid outlet 103 of the heat sink 100 based on the location, number, and size of local hot spots 211 in the temperature distribution of the chip 200. The method also optimizes the density, height, and orientation of the heat dissipation fins 104. The result is a heat sink 100 having a first cooling zone 110 and a second cooling zone 120, which at least partially addresses the current heat dissipation problem associated with hot spots 211 on the chip 200.

[0092] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings. However, the present disclosure is not limited to the specific details of the above embodiments. Within the technical concept of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure, and these simple modifications all fall within the scope of protection of the present disclosure.

[0093] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any appropriate manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0094] In addition, the various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.

Claims

1. A method for designing a radiator, characterized in that: include: Obtain a temperature distribution diagram of the chip to be cooled; Acquire a first temperature zone and a second temperature zone of the chip to be cooled according to the temperature distribution diagram; wherein the temperature of the first temperature zone is greater than the temperature of the second temperature zone; The first cooling zone and the second cooling zone of the radiator are designed according to the first temperature zone and the second temperature zone; wherein the first cooling zone is used for cooling the first temperature zone, the second cooling zone is used for cooling the second temperature zone, and the cooling capacity of the first cooling zone is greater than the cooling capacity of the second cooling zone.

2. The method according to claim 1, characterized in that The obtaining of the first temperature zone and the second temperature zone of the chip to be cooled according to the temperature distribution map includes: Obtaining hot spots and hot spot parameters according to the temperature distribution map; wherein the hot spot parameters include: hot spot location, hot spot number and hot spot size; A first temperature zone and a second temperature zone are determined according to the hot spot and the hot spot parameters.

3. The method according to claim 2, characterized in that Determining the first temperature zone and the second temperature zone according to the hot spot and the hot spot parameter includes: When the number of the hot spot is one, the first temperature zone corresponds to the hot spot; When there are multiple hot spots, the first temperature zone is determined according to an area surrounded by at least part of the multiple hot spots.

4. The method according to claim 1, wherein The step of designing the first cooling zone and the second cooling zone of the radiator according to the first temperature zone and the second temperature zone includes: The liquid inlet of the radiator is designed according to the first temperature zone and the second temperature zone; wherein the liquid inlet is located in the first cooling zone or lateral to the first cooling zone; The cooling channel of the radiator is designed according to the first temperature zone and the second temperature zone; wherein one end of the cooling channel close to the liquid inlet is located in the first cooling zone.

5. The method according to claim 1, wherein The method further comprises: Heat dissipation fins are designed in the first cooling zone and the second cooling zone; wherein the total heat dissipation area of ​​the heat dissipation fins in the first cooling zone is greater than the total heat dissipation area of ​​the heat dissipation fins in the second cooling zone.

6. The method according to claim 5, wherein The heat dissipation fins are designed in the first cooling zone and the second cooling zone, including: Designing the spacing of the heat dissipation fins; wherein the density of the heat dissipation fins in the first cooling zone is greater than the density of the heat dissipation fins in the second cooling zone; and / or The height of the heat dissipation fins is designed, wherein the height of the heat dissipation fins in the first cooling zone is greater than the height of the heat dissipation fins in the second cooling zone.

7. A heat sink for chip heat dissipation, characterized in that: The radiator includes a first cooling zone and a second cooling zone, wherein the cooling capacity of the first cooling zone is greater than the cooling capacity of the second cooling zone.

8. The radiator according to claim 7, characterized in that The radiator includes a liquid inlet and a cooling channel communicated with the liquid inlet, and the liquid inlet is located in the first cooling zone or lateral to the first cooling zone.

9. The radiator according to claim 7 or 8, characterized in that The radiator further includes heat dissipation fins disposed inside the radiator, wherein a total heat dissipation area of ​​the heat dissipation fins in the first cooling zone is greater than a total heat dissipation area of ​​the heat dissipation fins in the second cooling zone.

10. The radiator according to claim 9, characterized in that The density of the heat dissipation fins in the first cooling zone is greater than the density of the heat dissipation fins in the second cooling zone; and / or The height of the heat dissipation fins in the first cooling zone is greater than the height of the heat dissipation fins in the second cooling zone.

11. A heat dissipation module, characterized in that: The heat sink comprises a chip and the heat sink according to any one of claims 7 to 10.

12. An electronic device, characterized in that: The electronic device includes the radiator according to any one of claims 7 to 10 or the heat dissipation module according to claim 11.

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