High-power converter valve group module and converter

Abstract

The invention relates to the field of converters, and discloses a high-power converter valve group module and a converter, and the high-power converter valve group module comprises a base; the IGCT assembly unit comprises an IGCT assembly and a driving assembly which are adjacent in the first direction; the anti-parallel diode component unit is adjacent to the IGCT component along the second direction; the clamping diode assembly unit is adjacent to the anti-parallel diode assembly unit in the first direction; the absorption component unit is adjacent to the clamping diode component unit in the first direction; the composite clamping busbar assembly is arranged on one side, far away from the IGCT assembly unit, of the clamping diode assembly unit; the composite parallel busbar assembly is arranged on one side, far away from the driving assembly, of the IGCT assembly; and the cooling assembly is arranged on one side, far away from the clamping diode assembly unit, of the absorption assembly unit. The modular design is adopted, the unit space utilization rate can be increased, and the high current sharing effect can be achieved under the driving control of the repetition frequency.

Description

Technical Field

[0001] The present invention relates to the field of converters, and in particular to a high-power converter valve group module and a converter. Background Art

[0002] In related technologies, a converter is an electrical device that changes the voltage, frequency, number of phases, and other electrical quantities or characteristics of a power supply. Converters typically consist of multiple bridge arms, each of which is complex and bulky. This results in a large converter footprint and low power density per unit area, making assembly, disassembly, and maintenance difficult. Furthermore, in related technical applications, there are no examples of directly connecting high-power IGCTs in parallel to increase current flow capacity under repetitive frequency drive control. Summary of the Invention

[0003] The present invention aims to address at least one of the technical problems existing in the prior art. To this end, one objective of the present invention is to provide a high-power converter valve block module with a compact structure and high power density per unit space, thereby reducing the converter's volume and energy density. This design also facilitates the application of directly paralleling high-power IGCTs to increase flow capacity under repetitive frequency drive control.

[0004] The present invention also aims to provide a converter to apply the above-mentioned high-power converter valve group module.

[0005] According to an embodiment of the present invention, a high-power converter valve group module includes: a base; an IGCT component unit, including an IGCT component and a drive component detachably arranged on the base, wherein the IGCT component and the drive component are adjacent to each other in a first direction; an anti-parallel diode component unit, detachably arranged on the base and adjacent to the IGCT component in a second direction; a clamping diode component unit, detachably arranged on the base and adjacent to the anti-parallel diode component unit in the first direction and adjacent to the drive component in the second direction; an absorption component unit, and the clamping diode component unit in the second direction. Adjacent in the first direction and adjacent to the driving component in the second direction, wherein the second direction is perpendicular to the first direction; a composite clamping busbar component is arranged on a side of the clamping diode component unit and the anti-parallel diode component unit away from the IGCT component unit; a composite parallel busbar component is arranged on a side of the IGCT component away from the driving component, and on a side of the anti-parallel diode component unit away from the clamping diode component unit; a cooling component is arranged on a side of the absorption component unit away from the clamping diode component unit, and on a side of the driving component away from the IGCT component.

[0006] According to the high-power converter valve group module of the embodiment of the present invention, the IGCT component unit, the anti-parallel diode component unit, the clamping diode component unit, the absorption component unit, the composite clamping busbar component, the composite parallel busbar component and the cooling component are all modularly designed and compactly arranged on the base, which can reduce the volume of the high-power converter valve group module, improve the unit space utilization, facilitate the assembly and disassembly and maintenance of the high-power converter valve group module, and is also beneficial to expanding the flow capacity. At the same time, the compact structural design of the present invention is also beneficial to improving the high flow sharing effect of the converter valve device in the parallel application of high-power IGCT under the repeated frequency drive control.

[0007] In some embodiments of the present invention, the IGCT assembly includes a plurality of IGCT components and a plurality of first heat sinks, the plurality of IGCT components are arranged along a third direction, and any two adjacent IGCT components are crimped through the first heat sink; the drive assembly includes a plurality of drivers, the plurality of drivers are arranged along the third direction and correspond to the plurality of IGCT components, and each IGCT component is connected to the corresponding driver along the first direction, wherein the third direction, the second direction and the first direction are perpendicular to each other.

[0008] In some embodiments of the present invention, the IGCT assembly further includes a first upper pressure plate, a first lower pressure plate, a first connecting column, a first socket and a first insulating block, the first upper pressure plate and the first lower pressure plate are spaced apart along the third direction and are detachably connected through the first connecting column, the first lower pressure plate is detachably provided on the base, a plurality of the IGCT components and a plurality of first heat sinks are provided between the first upper pressure plate and the first lower pressure plate, the IGCT components located at both ends of the third direction are crimped with the first socket through the first heat sink, and a first insulating block is provided between at least two adjacent groups of the IGCT components; the drive assembly further includes a bottom plate, a top plate, a fixing column, a power supply box and a transformer, the bottom plate is detachably provided on the base and spaced apart from the top plate along the third direction, the top plate is connected to the bottom plate through the fixing column, the power supply box is provided on the top plate, the transformer is provided on the bottom plate, and a plurality of the drivers are provided on the fixing column.

[0009] In some embodiments of the present invention, the plurality of IGCT components are configured into two groups, namely a first group and a second group, the first group and the second group each including a plurality of IGCT components electrically connected in series, the first group and the second group electrically connected in parallel, and the IGCT components of the first group and the IGCT components of the second group are staggered along the third direction.

[0010] In some embodiments of the present invention, the anti-parallel diode assembly unit includes multiple anti-parallel diodes and multiple second heat sinks, the multiple anti-parallel diodes are arranged along the third direction, and any two adjacent anti-parallel diodes are crimped through the second heat sink.

[0011] In some embodiments of the present invention, the anti-parallel diode assembly unit also includes a second upper pressure plate, a second lower pressure plate, a second connecting column, a second socket and a second insulating block. The second upper pressure plate and the second lower pressure plate are spaced apart along the third direction and are detachably connected through the second connecting column. The second lower pressure plate is detachably arranged on the base. A plurality of anti-parallel diodes and a plurality of second heat sinks are arranged between the second upper pressure plate and the second lower pressure plate. The anti-parallel diodes located at both ends of the third direction are crimped with the second socket through the second heat sink. A second insulating block is provided between at least one group of adjacent two anti-parallel diodes.

[0012] In some embodiments of the present invention, the clamping diode assembly unit includes a clamping diode, a freewheeling diode, a first absorption resistor and a third heat sink. There are multiple clamping diodes and multiple third heat sinks. The multiple clamping diodes, the freewheeling diodes and the first absorption resistor are arranged in sequence along the third direction, and any two adjacent components are crimped through the third heat sink.

[0013] In some embodiments of the present invention, the clamping diode assembly unit includes: a third upper pressure plate, a third lower pressure plate, a third connecting column, a third insulating block, and a third supporting member. The third upper pressure plate and the third lower pressure plate are spaced apart along the third direction and are detachably connected through the third connecting column. The third lower pressure plate is detachably arranged on the base. The clamping diode, the freewheeling diode and the first absorption resistor are arranged between the third upper pressure plate and the third lower pressure plate. One of the multiple clamping diodes close to the third upper pressure plate is crimped with the third supporting member through the third heat sink. The first absorption resistor is crimped with another third supporting member through the third heat sink. A third insulating block is provided between at least two adjacent clamping diodes.

[0014] In some embodiments of the present invention, the absorption component unit includes a second absorption resistor and an absorption capacitor. The absorption capacitors are multiple and arranged along the third direction. The absorption capacitors are closer to the base than the second absorption resistor.

[0015] In some embodiments of the present invention, the cooling assembly includes an inlet manifold, an outlet manifold and a plurality of branch pipes, the inlet manifold and the outlet manifold extend along the third direction and are arranged at intervals in the second direction, each branch pipe connects the inlet manifold and the outlet manifold to form a cooling branch, and the first radiator, the second radiator and the third radiator are arranged in series on at least one of the cooling branches.

[0016] In some embodiments of the present invention, the high-power converter valve group module includes a first isolation plate and a second isolation plate, the first isolation plate is an insulating part and is arranged on the side of the composite parallel busbar assembly away from the IGCT assembly and the anti-parallel diode assembly unit, and the second isolation plate is arranged on the side of the cooling assembly away from the absorption assembly unit and the drive assembly.

[0017] A converter provided according to an embodiment of the present invention includes at least one bridge arm, wherein the bridge arm includes at least two high-power converter valve group modules as described in any one of the above descriptions.

[0018] According to the converter of the embodiment of the present invention, the use of the above-mentioned high-power converter valve group module can reduce the size of the bridge arm, thereby reducing the volume of the entire device. Moreover, the high-power converter valve group module can realize modular design, which is convenient for assembling or disassembling the bridge arm, thereby facilitating the assembly, disassembly or maintenance of the converter.

[0019] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments with reference to the accompanying drawings, in which: Figure 1 is a schematic diagram of the three-dimensional structure of a high-power converter valve group module provided by some embodiments of the present invention, viewed from the angle where the composite clamped busbar assembly is located; Figure 2 This is a schematic diagram of the three-dimensional structure of a high-power converter valve group module provided by some embodiments of the present invention, viewed from the angle where the clamping diode assembly unit is located; Figure 3 is a schematic diagram of the three-dimensional structure of a high-power converter valve group module provided by some embodiments of the present invention, viewed from the angle where the IGCT component unit is located; Figure 4 This is a schematic diagram of the three-dimensional structure of a high-power converter valve group module provided by some embodiments of the present invention, viewed from the angle of the IGCT component unit and the composite parallel busbar component; Figure 5This is a schematic diagram of the structure of the cooperation between the drive assembly and part of the cooling assembly provided by some embodiments of the present invention; Figure 6 is a schematic diagram of a cooling circuit between a cooling assembly and an IGCT assembly, an anti-parallel unit, and an anode clamping unit provided in some embodiments of the present invention; Figure 7 It is a schematic diagram of the three-dimensional structure of the bridge arm provided by some embodiments of the present invention.

[0021] Reference numerals: 100. High-power converter valve group module; 10. Base; 20. IGCT component unit; 21. IGCT components; 211, first upper pressing plate; 212, first lower pressing plate; 213, first connecting column; 214, first heat sink; 215, first insulating block; 216, first receiving member; 217, IGCT components; 22. Drive assembly; 221, power supply box; 222, transformer; 223, driver; 224, bottom plate; 225, top plate; 226, fixing column; 30. Anti-parallel diode assembly unit; 31. Second upper pressing plate; 32. Second lower pressing plate; 33. Second connecting column; 34. Second heat sink; 35. Second insulating block; 36. Second receiving member; 37. Anti-parallel diode; 40. Clamping diode assembly unit; 41. Third upper pressing plate; 42. Third lower pressing plate; 43. Third connecting column; 44. Third heat sink; 45. Third insulating block; 46. Third receiving member; 47. Clamping diode; 48. Freewheeling diode; 49. First absorption resistor; 50. Absorption component unit; 51. Second absorption resistor; 52. Absorption capacitor; 70. Composite clamped busbar assembly; 80. Composite parallel busbar assembly; 90. Cooling assembly; 91, inlet manifold; 911, first extension pipe; 92, outlet manifold; 921, second extension pipe; 93, branch pipe; 110, first isolation plate; 120, second isolation plate; 200. Bridge arm. DETAILED DESCRIPTION

[0022] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0023] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0024] In addition, features defined as "first" or "second" may explicitly or implicitly include one or more such features, and are used to distinguish and describe features, without any distinction in order or importance.

[0025] In the description of the present invention, unless otherwise specified, "plurality" means two or more. In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0026] Reference below Figure 1-Figure 7 , describing a high-power converter valve group module 100 according to an embodiment of the present invention.

[0027] like Figures 1 to 3As shown, a high-power converter valve assembly module 100 according to an embodiment of the present invention includes: a base 10, an IGCT assembly unit 20, an anti-parallel diode assembly unit 30, a clamping diode assembly unit 40, an absorption assembly unit 50, a composite clamping busbar assembly 70, a composite parallel busbar assembly 80, and a cooling assembly 90. The IGCT assembly unit 20 includes an IGCT assembly 21 and a driver assembly 22, which are detachably mounted on the base 10. The IGCT assembly 21 and the driver assembly 22 are adjacent to each other in a first direction. The anti-parallel diode assembly unit 30 is detachably mounted on the base 10 and is adjacent to the IGCT assembly 21 in a second direction. The clamping diode assembly unit 40 is detachably mounted on the base 10 and is adjacent to the anti-parallel diode assembly unit 30 in the first direction and adjacent to the driver assembly 22 in a second direction. The absorption assembly unit 50 is adjacent to the clamping diode assembly unit 40 in the first direction and adjacent to the driver assembly 22 in the second direction, wherein the second direction is perpendicular to the first direction. The composite clamping busbar assembly 70 is provided on the side of the clamping diode assembly unit 40 and the anti-parallel diode assembly unit 30 away from the IGCT assembly unit 20. The composite parallel busbar assembly 80 is provided on the side of the IGCT assembly 21 away from the driver assembly 22, and on the side of the anti-parallel diode assembly unit 30 away from the clamping diode assembly unit 40. The cooling assembly 90 is provided on the side of the absorption assembly unit 50 away from the clamping diode assembly unit 40, and on the side of the driver assembly 22 away from the IGCT assembly 21.

[0028] In the above technical solution, the IGCT assembly unit 20, the anti-parallel diode assembly unit 30, and the clamping diode assembly unit 40 are all modular structures, which are convenient for detachable installation on the base 10, and the IGCT assembly unit 20, the anti-parallel diode assembly unit 30, and the clamping diode assembly unit 40 are arranged in the first direction and the second direction, which can improve the compactness of the overall structure and reduce the volume. The absorption assembly unit 50 is arranged in the space between the clamping diode assembly unit 40 and the driving assembly 22, thereby further improving the compactness of the entire valve group. For ease of understanding, as an example, refer to Figures 1 to 3 , the first direction may be the left-right direction, and the second direction may be the front-back direction.

[0029] The composite clamping busbar assembly 70 can be a plate-shaped busbar structure in which all components are glued together. This busbar structure is more compact and smaller in size. Furthermore, the composite clamping busbar assembly 70 is located on the side of the clamping diode assembly unit 40 away from the IGCT assembly unit 20. This approach can reduce the distance between the composite clamping busbar assembly 70 and the clamping diode assembly unit 40, facilitate electrical connection between the composite clamping busbar assembly 70 and the clamping diode assembly unit 40, reduce the size of the composite clamping busbar assembly 70, and help reduce costs.

[0030] The composite parallel busbar assembly 80 may refer to a busbar structure in which all components are encapsulated together with glue to form a plate-like structure. This busbar structure is more compact and smaller in size. Furthermore, the composite parallel busbar assembly 80 is located on the side of the IGCT assembly 21 away from the drive assembly 22, and on the side of the anti-parallel diode assembly unit 30 away from the clamping diode assembly unit 40. The cooling assembly 90 is adjacent to the absorption assembly unit 50 and the drive assembly 22, and directly faces the composite parallel busbar assembly 80. This arrangement allows the composite parallel busbar assembly 80 to be kept away from the cooling assembly 90. This reduces the risk of short circuits due to cooling medium leakage, and also reduces interference from the cooling assembly 90 with the composite parallel busbar assembly 80, facilitating the connection of the high-power converter valve assembly module 100 as a whole to another high-power converter valve assembly module 100 via the composite parallel busbar assembly 80. It can be understood that by adopting the high-power converter valve group module 100 of the above structure, the high-power converter valve group module 100 as a whole can form a large modular structure of a rectangular parallelepiped or a cube, which is convenient for assembling multiple high-power converter valve group modules 100 to form a converter.

[0031] It should be noted that the present invention is an improvement to the layout of the various component structures of the high-power converter valve group module 100. The functions and electrical connection relationships of the IGCT component 21, the drive component 22, the anti-parallel diode component unit 30, the clamping diode component unit 40, the absorption component unit 50, the composite clamping busbar component 70, and the composite parallel busbar component 80 are known to those skilled in the art and will not be repeated here.

[0032] Secondly, the IGCT assembly 21, the driver assembly 22, the anti-parallel diode assembly unit 30, and the clamping diode assembly unit 40 are all detachably connected to the base 10. This makes it possible to detach any of the IGCT assembly 21, the driver assembly 22, the anti-parallel diode assembly unit 30, and the clamping diode assembly unit 40 from the base 10, making it easy to disassemble a component or unit, facilitate assembly and disassembly maintenance, and allow for easy replacement of damaged components, thereby reducing operating costs.

[0033] According to the high-power converter valve group module 100 of the embodiment of the present invention, the IGCT assembly unit 20, the anti-parallel diode assembly unit 30, the clamping diode assembly unit 40, the absorption assembly unit 50, the composite clamping busbar assembly 70, the composite parallel busbar assembly 80 and the cooling assembly 90 are all modularly designed and compactly arranged on the base 10, which can reduce the volume of the high-power converter valve group module 100, improve the unit space utilization rate, and facilitate the assembly, disassembly and maintenance of the high-power converter valve group module 100. Secondly, the high-power converter valve group module 100 adopting the above-mentioned distributed structure has a more compact distribution between the components, especially the distribution of the electrical components is relatively compact, thereby increasing the power density of the entire high-power converter valve group module 100.

[0034] In some embodiments of the present invention, the ends of the IGCT assembly 21 and the drive assembly 22 that are away from the base 10 are detachably connected. The IGCT assembly 21 and the drive assembly 22 are both detachably connected to the base 10. Based on this, the ends of the IGCT assembly 21 and the drive assembly 22 that are away from the base 10, which can be understood as the tops of the IGCT assembly 21 and the drive assembly 22, are detachably connected. This can improve the secure fixation of the IGCT assembly 21 and the drive assembly 22 to the base 10, thereby improving the installation reliability of the IGCT assembly 21 and the drive assembly 22 to the base 10.

[0035] In some embodiments of the present invention, Figure 3 and Figure 4 As shown, the IGCT assembly 21 includes a plurality of IGCT components 217 and a plurality of first heat sinks 214, the plurality of IGCT components 217 are arranged along a third direction, and any two adjacent IGCT components 217 are crimped through the first heat sink 214; the driving assembly 22 includes a plurality of drivers 223, the plurality of drivers 223 are arranged along a third direction and correspond to the plurality of IGCT components 217, and each IGCT component 217 is connected to the corresponding driver 223 along a first direction, wherein the third direction, the second direction and the first direction are perpendicular to each other.

[0036] For ease of understanding, as an example, refer to Figure 3 and Figure 4 , the third direction can be the up and down direction.

[0037] The first radiator 214 can refer to a component that can play a role in heat dissipation, for example, it can be but not limited to a cold plate, a cold pipe, a heat dissipation fin, etc. In the above solution, the first radiator 214 can cool and dissipate heat at both ends of each IGCT component 217 to improve the heat dissipation efficiency. Among them, the function, composition and connection relationship of the IGCT component 217 with other components are well known to the technology in this field and will not be repeated here. The number of IGCT components 217 can be selected as needed to meet different flow capacity requirements. Optionally, referring to Figure 3 、 Figure 4 and Figure 5 , there can be four IGCT components 217.

[0038] The driver 223 may refer to a component capable of driving the IGCT component 217. It should be noted that the structure, function and connection relationship of the driver 223 with the IGCT assembly 21 or other components are well known to those skilled in the art and will not be described in detail here.

[0039] In the above technical solution, the multiple IGCT components 217 and the first heat sink 214 are arranged along the third direction, thereby making the IGCT assembly 21 a module extending along the third direction, resulting in a more compact overall structure and a smaller size. Similarly, the multiple drivers 223 are arranged along the third direction, thereby making the driver assembly 22 a module extending along the third direction, further compacting the structure and reducing the size.

[0040] In some embodiments of the present invention, Figure 3 and Figure 4 As shown, the IGCT assembly 21 also includes a first upper pressure plate 211, a first lower pressure plate 212, a first connecting column 213, a first socket 216 and a first insulating block 215. The first upper pressure plate 211 and the first lower pressure plate 212 are spaced apart along the third direction and are detachably connected through the first connecting column 213. The first lower pressure plate 212 is detachably arranged on the base 10. A plurality of IGCT components 217 and a plurality of first heat sinks 214 are arranged on the first upper pressure plate 211 and the first lower pressure plate 212. The IGCT components 217 located at both ends of the third direction are crimped with the first socket 216 through the first heat sink 214. A first insulating block 215 is provided between at least one group of two adjacent IGCT components 217.

[0041] It is understood that in the above structure, first heat sinks 214 are provided at both ends of each IGCT component 217 in the third direction, which can improve the heat dissipation and cooling capacity of each IGCT component 217. In addition, the first heat sink 214 at the lower end is connected to the first lower pressing plate 212 via the first socket 216, and the first heat sink 214 at the upper end is connected to the first upper pressing plate 211 via the first socket 216. In other words, the first upper pressing plate 211, the first lower pressing plate 212, the first connecting column 213, and the first socket 216 can fix the multiple IGCT components 217 into a whole, forming a modular IGCT assembly 21. As a result, the overall structure of the IGCT assembly 21 is more compact and more reliable, which can ensure the installation security of each component, reduce the risk of damage caused by loosening or detachment of a component, and improve the reliability of installation or removal from the base 10.

[0042] The first insulating block 215 may refer to a component that can play an insulating role, wherein the number of the first insulating blocks 215 can be set as needed. Among them, any two adjacent IGCT components 217 can be isolated by the first insulating block 215, or some of the two adjacent IGCT components 217 can be isolated by the first insulating block 215. For example, referring to Figure 3 and Figure 4 There may be four IGCT components 217 , and the two in the middle are isolated by a first insulating block 215 .

[0043] Optionally, the first upper pressing plate 211 and the first lower pressing plate 212 may be, but are not limited to, thin plates, sheet metal parts, or thick block-shaped parts. Optionally, the first connecting column 213 may be, but is not limited to, a pin, a stud, or the like. For example, a stud facilitates detachable connection between the first upper pressing plate 211 and the first lower pressing plate 212.

[0044] In some embodiments of the present invention, Figure 3 and Figure 4 As shown, the drive assembly 22 includes a bottom plate 224, a top plate 225, a fixing column 226, a power supply box 221 and a transformer 222. The bottom plate 224 is detachably arranged on the base 10 and is spaced apart from the top plate 225 along a third direction. The top plate 225 is connected to the bottom plate 224 through the fixing column 226. The power supply box 221 is arranged on the top plate 225, the transformer 222 is arranged on the bottom plate 224, and multiple drivers 223 are arranged on the fixing column 226.

[0045] The power box 221, the transformer 222 and the plurality of drivers 223 can be fixed into a whole through the bottom plate 224, the top plate 225 and the fixing column 226 to form a modular drive assembly 22. As a result, the overall structure of the drive assembly 22 is more compact and more reliable, which can ensure the installation firmness of each component, reduce the risk of a component loosening or detaching and causing damage, and also improve the reliability of installation or disassembly with the base 10.

[0046] It should be noted that the composition, function and connection relationship of the power box 221 and transformer 222 mentioned above with the IGCT assembly 21 or other components are well known to those skilled in the art and will not be described in detail here.

[0047] Optionally, the bottom plate 224 and the top plate 225 may be, but are not limited to, thin plates, sheet metal parts, or thicker block-shaped parts. Optionally, the fixing posts 226 may be, but are not limited to, pins, studs, etc. For example, studs facilitate detachable connection between the fixing posts 226 and the bottom plate 224 and the top plate 225.

[0048] In some embodiments of the present invention, Figure 3 and Figure 4 As shown, the first upper pressing plate 211 and the top plate 225 are detachably connected. Optionally, the connection between the first upper pressing plate 211 and the top plate 225 can be, but is not limited to, bolt connection, clamping or riveting.

[0049] In some embodiments of the present invention, a plurality of IGCT components 217 are configured into two groups, namely a first group and a second group, each of the first group and the second group includes a plurality of IGCT components 217 electrically connected in series, the first group and the second group are electrically connected in parallel, and the IGCT components 217 of the first group and the IGCT components 217 of the second group are staggered along a third direction.

[0050] The number of IGCT components 217 can be four, and the four IGCT components 217 are arranged in sequence along the third direction, and can be respectively the first IGCT component, the second IGCT component, the third IGCT component, and the fourth IGCT component, wherein the first IGCT component and the second IGCT component are in a series electrical relationship, the first IGCT component and the third IGCT component are in a direct parallel electrical relationship, and the second IGCT component and the fourth IGCT component are in a direct parallel electrical relationship.

[0051] In the related art, in the application of IGCT under repetitive frequency drive control, there is no situation where multiple IGCTs are directly connected in parallel to expand the flow capacity. The above technical solution adopts the above-mentioned direct parallel and series electrical connection relationship through multiple IGCT components 217, and combines the overall compact design of the high-power converter valve group module 100. It can further expand the flow capacity of the entire high-power converter valve group module 100, which is beneficial to the application of controlling high-power IGCT under repetitive frequency drive, using multiple IGCTs directly connected in parallel to improve the flow capacity and improve the flow balancing effect.

[0052] In some embodiments of the present invention, Figure 2 As shown, the anti-parallel diode assembly unit 30 includes a plurality of anti-parallel diodes 37 and a plurality of second heat sinks 34 . The plurality of anti-parallel diodes 37 are arranged along the third direction, and any two adjacent anti-parallel diodes 37 are crimped together by the second heat sink 34 .

[0053] The second heat sink 34 may be a component capable of dissipating heat, such as, but not limited to, a cold plate, a cold pipe, a heat sink fin, etc. The function, structure, and connection relationship of the anti-parallel diode 37 with other components are well known in the art and will not be described in detail here.

[0054] It can be understood that the plurality of anti-parallel diodes 37 and the plurality of second heat sinks 34 are arranged along the third direction, so that the anti-parallel diode assembly unit 30 can be a module extending along the third direction, and the overall structure is more compact and the volume can be reduced.

[0055] In some embodiments of the present invention, Figure 2 As shown, the anti-parallel diode assembly unit 30 also includes a second upper pressure plate 31, a second lower pressure plate 32, a second connecting column 33, a second socket 36 and a second insulating block 35. The second upper pressure plate 31 and the second lower pressure plate 32 are spaced apart along the third direction and are detachably connected through the second connecting column 33. The second lower pressure plate 32 is detachably arranged on the base 10. A plurality of anti-parallel diodes 37 and a plurality of second heat sinks 34 are arranged between the second upper pressure plate 31 and the second lower pressure plate 32. The anti-parallel diodes 37 located at both ends of the third direction are crimped with the second socket 36 through the second heat sink 34. A second insulating block 35 is provided between at least one group of adjacent two anti-parallel diodes 37.

[0056] The second insulating block 35 may refer to a component that can play an insulating role, wherein the number of the second insulating blocks 35 can be set as needed. Among them, any two adjacent anti-parallel diodes 37 can be isolated by the second insulating block 35, or some of the two adjacent anti-parallel diodes 37 can be isolated by the second insulating block 35. For example, referring to Figure 2There may be four anti-parallel diodes 37 , and the two in the middle are isolated by a second insulating block 35 .

[0057] It is understandable that in the above structure, a second heat sink 34 is provided at both ends of the third direction of each anti-parallel diode 37, which can improve the heat dissipation and cooling capacity of each anti-parallel diode 37, and the second heat sink 34 at the lower end is connected to the first lower pressing plate 212 through the second socket 36, and the second heat sink 34 at the upper end is connected to the first upper pressing plate 211 through the second socket 36. In other words, the second upper pressing plate 31, the second lower pressing plate 32, the second connecting column 33, and the second socket 36 can fix a plurality of anti-parallel diodes 37 into a whole, forming a modular anti-parallel diode assembly unit 30, thereby making the overall structure of the anti-parallel diode assembly unit 30 more compact and more reliable, which can ensure the installation firmness of each component, reduce the risk of a component loosening or detaching and causing damage, and improve the reliability of installation or disassembly with the base 10.

[0058] Optionally, the second upper pressing plate 31 and the second lower pressing plate 32 may be, but are not limited to, thin plates, sheet metal parts, or thick block-shaped parts. Optionally, the second connecting column 33 may be, but is not limited to, a pin, a stud, or the like. For example, a stud facilitates detachable connection between the second upper pressing plate 31 and the second lower pressing plate 32.

[0059] In some embodiments of the present invention, Figure 2 As shown, the clamping diode assembly unit 40 includes a clamping diode 47, a freewheeling diode 48, a first absorption resistor 49 and a third heat sink 44. There are multiple clamping diodes 47 and third heat sink 44. Multiple clamping diodes 47, freewheeling diodes 48 and first absorption resistor 49 are arranged in sequence along the third direction, and any two adjacent components are crimped through the third heat sink 44.

[0060] The third heat sink 44 can refer to a component that can play a role in heat dissipation, for example, it can be but not limited to a cold plate, a cold pipe, a heat dissipation fin, etc. In the above scheme, the third heat sink 44 can cool and dissipate heat at both ends of each IGCT component 217 to improve the heat dissipation efficiency. Among them, the functions, composition and connection relationship of the clamping diode 47, the freewheeling diode 48, and the first absorption resistor 49 with other components are well known to the technology in this field and will not be repeated here. The number of clamping diodes 47 can be selected as needed to meet different current flow capacity requirements. Optionally, referring to Figure 2 , there can be two clamping diodes 47 .

[0061] Any two adjacent components are crimped through the third heat sink 44 , which can be understood as any two adjacent components among the multiple clamping diodes 47 are crimped through the third heat sink 44 , the freewheeling diode 48 and the adjacent clamping diode 47 are crimped through the third heat sink 44 , and the freewheeling diode 48 and the first absorption resistor 49 are crimped through the third heat sink 44 .

[0062] In the above technical solution, multiple clamping diodes 47, freewheeling diodes 48, and first absorption resistors 49 are arranged sequentially along the third direction, thereby making the clamping diode assembly unit 40 a module extending along the third direction, making the overall structure more compact and reducing the volume. Secondly, by crimping multiple clamping diodes 47, freewheeling diodes 48, and first absorption resistors 49 together to form the clamping diode assembly unit 40, the freewheeling diodes 48, first absorption resistors 49, and clamping diodes 47 can be modularly assembled together, making the overall structure more compact and allowing for a more rational arrangement of the freewheeling diodes 48 and first absorption resistors 49, thus saving space.

[0063] In some embodiments of the present invention, Figure 2 As shown, the clamping diode assembly unit 40 also includes a third upper pressure plate 41, a third lower pressure plate 42, a third connecting column 43, a third socket 46, and a third insulating block 45. The third upper pressure plate 41 and the third lower pressure plate 42 are spaced apart along the third direction and are detachably connected through the third connecting column 43. The third lower pressure plate 42 is detachably arranged on the base 10. The clamping diode 47, the freewheeling diode 48 and the first absorption resistor 49 are arranged between the third upper pressure plate 41 and the third lower pressure plate 42. One of the multiple clamping diodes 47 close to the third upper pressure plate 41 is crimped with the third socket 46 through the third heat sink 44. The first absorption resistor 49 is crimped with another third socket 46 through the third heat sink 44. A third insulating block 45 is provided between at least one group of adjacent two clamping diodes 47.

[0064] The third insulating block 45 may refer to a component that can play an insulating role, wherein the number of the third insulating blocks 45 can be set as needed, wherein any two adjacent clamping diodes 47 can be isolated by the third insulating block 45, or part of the two adjacent clamping diodes 47 can be isolated by the third insulating block 45. For example, referring to Figure 2 There may be four clamping diodes 47, with the two clamping diodes located in the middle isolated by a third insulating block 45. Optionally, the third upper pressing plate 41 and the third lower pressing plate 42 may be, but are not limited to, thin plates, sheet metal parts, or thicker block-shaped components. Optionally, the third connecting column 43 may be, but is not limited to, a pin, a stud, or the like. For example, a stud facilitates detachable connection between the third upper pressing plate 41 and the third lower pressing plate 42.

[0065] In the above technical solution, third heat sinks 44 are provided at both ends of each clamping diode 47 in the third direction. This improves the heat dissipation and cooling capabilities of each clamping diode 47. Furthermore, the third heat sink 44 at the lower end is connected to the third lower pressing plate 42 via a third connector 46, while the third heat sink 44 at the upper end is connected to the third upper pressing plate 41 via a third connector 46. In other words, the third upper pressing plate 41, the third lower pressing plate 42, the third connecting column 43, and the third connector 46 can secure the plurality of clamping diodes 47 into a single unit, forming a modular clamping diode assembly unit 40. This makes the overall structure of the clamping diode assembly unit 40 more compact and more reliable, ensuring the secure installation of each component, reducing the risk of damage caused by loosening or detachment of a component, and improving the reliability of installation and removal from the base 10.

[0066] In some embodiments of the present invention, Figure 1 As shown, the absorption component unit 50 includes a second absorption resistor 51 and an absorption capacitor 52 . There are multiple absorption capacitors 52 and they are arranged along the third direction. The absorption capacitors 52 are closer to the base 10 than the second absorption resistor 51 .

[0067] It is understandable that the above solution can make the structure of the absorption component unit 50 more compact, reduce the size of the absorption component unit 50, and thus make the high-power converter valve group module 100 more compact, smaller in size, and easier to assemble.

[0068] In some embodiments of the present invention, the second absorption resistor 51 is disposed on a side of at least one absorption capacitor 52 close to the clamping diode assembly unit 40. In this manner, the second absorption resistor 51 and the absorption capacitor 52 are arranged more compactly, which is conducive to saving space and reducing the volume of the high-power converter valve group module 100. For example, Figure 1 As shown, there are three absorption capacitors 52, two of which are larger and arranged close to the base 10, and another absorption capacitor 52 is smaller and away from the base 10. The second absorption resistor 51 and the smaller absorption capacitor 52 are spaced apart in the first direction.

[0069] Alternatively, as Figure 1 As shown, the absorption component unit 50 may include multiple absorption capacitors 52, which may be a first capacitor, a second capacitor, and a third capacitor. The first capacitor and the second capacitor are arranged near the base 10, and the third capacitor is located above the second capacitor and arranged along the first direction with the first absorption resistor 49. The above structure can improve the compactness of the absorption component unit 50.

[0070] In some embodiments of the present invention, Figures 2 to 4As shown, the cooling assembly 90 includes an inlet manifold 91, an outlet manifold 92 and a plurality of branch pipes 93. The inlet manifold 91 and the outlet manifold 92 extend along the third direction and are spaced apart in the second direction. Each branch pipe 93 connects the inlet manifold 91 and the outlet manifold 92 to form a cooling branch, wherein the first radiator 214, the second radiator 34 and the third radiator 44 are arranged in series on at least one cooling branch.

[0071] The inlet manifold 91 is used to introduce a cooling medium, and the outlet manifold 92 is used to converge the cooling medium after heat exchange and output it. Multiple branch pipes 93 can be provided, forming multiple cooling branches together with the inlet manifold 91 and the outlet manifold 92. The cooling medium can be, but is not limited to, a liquid, a gas, or the like. For example, the liquid can be a non-conductive liquid. Optionally, the first radiator 214, the second radiator 34, and the third radiator 44 can be radiators through which a medium can flow.

[0072] Each cooling branch may be connected in series to at least one first radiator 214; alternatively, each cooling branch may be connected in series to at least one second radiator 34; alternatively, each cooling branch may be connected in series to at least one third radiator 44. Alternatively, each cooling branch may be connected in series to at least two of the first radiator 214, the second radiator 34, and the third radiator 44.

[0073] For example, multiple branch pipes 93 are connected to the inlet and outlet manifolds 91 and 92 to form multiple cooling branches. The multiple cooling branches can be divided into three groups. The number of cooling branches in the first group is equal to the number of first radiators 214 and corresponds one to one. Each cooling branch is connected in series with a first radiator 214 (see Figure 5 ), the number of cooling branches in the second group is equal to and corresponds one to one with the number of second radiators 34, and each cooling branch is connected in series with a second radiator 34; the number of cooling branches in the third group is equal to and corresponds one to one with the number of third radiators 44, and each cooling branch is connected in series with a third radiator 44.

[0074] Reference Figure 6The multiple cooling branches can also be divided into two groups. The number of cooling branches in the first group is equal to the number of first heat sinks 214 and corresponds one to one. The number of first heat sinks 214 and second heat sinks 34 is equal, and each cooling branch is connected in series with one first heat sink 214 and one second heat sink 34. The number of cooling branches in the second group is less than the number of third heat sinks 44, and each cooling branch is connected in series with at least two third heat sinks 44. In this technical solution, the cooling assembly 90 cooperates with the first heat sink 214 to provide dual-sided heat dissipation for the IGCT component 217, and cooperates with the second heat sink 34 to provide dual-sided heat dissipation for the anti-parallel diode 37. A parallel heat dissipation layout can also be achieved. The cooling assembly 90 cooperates with the third heat sink 44 to provide dual-sided heat dissipation for the clamping diode 47. In other words, the above solution can improve heat dissipation efficiency and evenly distribute pipe temperature, while requiring a relatively small flow rate of cooling medium.

[0075] In the above technical solution, by adopting the above-mentioned cooling component 90, the IGCT component 21, the anti-parallel diode component unit 30 and the clamping diode component unit 40 can be cooled and dissipated, and the cooling component 90 can be arranged more compactly inside the high-power converter valve group module 100, which is beneficial to reducing the volume of the high-power converter valve group module 100 and improving the structural compactness.

[0076] In some embodiments of the present invention, Figures 2 to 4 As shown, the inlet manifold 91 is provided with a first extension pipe 911, and the outlet manifold 92 is provided with a second extension pipe 921. The second extension pipe 921 and the first extension pipe 911 are spaced apart in the third direction, and the pipe openings of the second extension pipe 921 and the first extension pipe 911 are both away from the composite clamping busbar assembly 70.

[0077] In the above technical solution, the first extension tube 911 and the second extension tube 921 position the interfaces of the inlet manifold 91 and the outlet manifold 92 on the same side, away from the composite clamped busbar assembly 70. This approach not only facilitates the entry and exit of the cooling medium, but also reduces the cooling medium's impact on the composite clamped busbar assembly 70, thereby lowering the risk of short circuits. Furthermore, by placing the inlet manifold 91, the first extension tube 911, the outlet manifold 92, and the second extension tube 921 in close proximity to the drive assembly 22, the dimensions of the high-power converter valve assembly module 100 in the first direction can be reduced, making the structure of the high-power converter valve assembly module 100 more compact.

[0078] In some embodiments of the present invention, Figure 1As shown, the composite clamping busbar assembly 70 and the absorption assembly unit 50 are spaced apart along a first direction. In this manner, the composite clamping busbar assembly 70 is positioned away from the absorption assembly unit 50 and closer to the clamping diode assembly unit 40. This reduces the distance between the composite clamping busbar assembly 70 and the clamping diode assembly unit 40, thereby reducing the size of the composite clamping busbar assembly 70. This saves material, reduces costs, and reduces weight, facilitating assembly or disassembly of the high-power converter valve assembly module 100.

[0079] In some embodiments of the present invention, Figure 1 As shown, the high-power converter valve group module 100 includes a first isolation plate 110 and a second isolation plate 120. The first isolation plate 110 is an insulating member and is arranged on the side of the composite parallel busbar assembly 80 away from the IGCT assembly 21 and the anti-parallel diode assembly unit 30. The second isolation plate 120 is arranged on the side of the cooling assembly 90 away from the absorption assembly unit 50 and the drive assembly 22.

[0080] In the above technical solution, the first isolation plate 110 provides insulation, reducing the risk of short circuits between the two high-power converter valve assembly modules 100 and improving the reliability of the high-power converter valve assembly modules 100. The second isolation plate 120 protects the cooling assembly 90, reducing the chance of damage to the cooling assembly 90 during transportation or assembly.

[0081] like Figure 7 As shown, a converter according to an embodiment of the present invention includes at least one bridge arm 200 , and the bridge arm 200 includes at least two high-power converter valve group modules 100 as described in any of the above embodiments.

[0082] A converter may refer to an electrical device that changes the voltage, frequency, number of phases, and other electrical quantities or characteristics of a power supply system. For those skilled in the art, the other components and operations of the converter are well known to those skilled in the art and will not be described in detail here.

[0083] According to the converter of the embodiment of the present invention, the use of the above-mentioned high-power converter valve group module 100 can reduce the size of the bridge arm 200, thereby reducing the volume of the entire device. Moreover, the high-power converter valve group module 100 can realize a modular design, which is convenient for assembling or disassembling the bridge arm 200, thereby facilitating the assembly, disassembly or maintenance of the converter.

[0084] Throughout this specification, references to terms such as "some embodiments," "optionally," "further," or "some examples" indicate that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0085] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

Claims

1. A high-power converter valve group module, characterized in that: include: base; an IGCT assembly unit, comprising an IGCT assembly and a drive assembly detachably disposed on the base, the IGCT assembly and the drive assembly being adjacent to each other along a first direction; an anti-parallel diode assembly unit, detachably disposed on the base and adjacent to the IGCT assembly along the second direction; a clamping diode assembly unit, detachably disposed on the base, and adjacent to the anti-parallel diode assembly unit in the first direction, and adjacent to the driving assembly in the second direction; an absorption component unit, adjacent to the clamping diode component unit in the first direction and adjacent to the driving component in the second direction, wherein the second direction is perpendicular to the first direction; A composite clamping busbar assembly is provided on a side of the clamping diode assembly unit and the anti-parallel diode assembly unit away from the IGCT assembly unit; A composite parallel busbar assembly is provided on a side of the IGCT assembly away from the drive assembly, and on a side of the anti-parallel diode assembly unit away from the clamping diode assembly unit; The cooling component is arranged on a side of the absorption component unit away from the clamping diode component unit, and on a side of the driving component away from the IGCT component.

2. The high-power converter valve group module according to claim 1, characterized in that: The IGCT assembly includes a plurality of IGCT components and a plurality of first heat sinks, wherein the plurality of IGCT components are arranged along a third direction, and any two adjacent IGCT components are press-connected via the first heat sink; The driving component includes multiple drivers, which are arranged along the third direction and correspond to multiple IGCT components. Each IGCT component is connected to the corresponding driver along the first direction, wherein the third direction, the second direction and the first direction are perpendicular to each other.

3. The high-power converter valve group module according to claim 2, characterized in that: The IGCT assembly further includes a first upper pressing plate, a first lower pressing plate, a first connecting column, a first receiving member and a first insulating block, wherein the first upper pressing plate and the first lower pressing plate are spaced apart along the third direction and are detachably connected via the first connecting column, the first lower pressing plate is detachably arranged on the base, a plurality of the IGCT components and a plurality of first heat sinks are arranged between the first upper pressing plate and the first lower pressing plate, the IGCT components located at both ends of the third direction are press-connected to the first receiving member via the first heat sink, and a first insulating block is provided between at least two adjacent IGCT components; The driving assembly also includes a bottom plate, a top plate, a fixing column, a power supply box and a transformer. The bottom plate is detachably arranged on the base and is spaced apart from the top plate along the third direction. The top plate is connected to the bottom plate through the fixing column. The power supply box is arranged on the top plate, the transformer is arranged on the bottom plate, and multiple drivers are arranged on the fixing column.

4. The high-power converter valve group module according to claim 2 or 3, characterized in that: The plurality of IGCT components are configured into two groups, namely the first group and the second group. The first group and the second group each include a plurality of IGCT components electrically connected in series. The first group and the second group are electrically connected in parallel. The IGCT components of the first group and the IGCT components of the second group are staggered along the third direction.

5. The high-power converter valve group module according to claim 2, characterized in that: The anti-parallel diode assembly unit includes a plurality of anti-parallel diodes and a plurality of second heat sinks. The plurality of anti-parallel diodes are arranged along the third direction, and any two adjacent anti-parallel diodes are crimped together through the second heat sink.

6. The high-power converter valve group module according to claim 5, characterized in that: The anti-parallel diode assembly unit also includes a second upper pressure plate, a second lower pressure plate, a second connecting column, a second socket and a second insulating block. The second upper pressure plate and the second lower pressure plate are spaced apart along the third direction and are detachably connected through the second connecting column. The second lower pressure plate is detachably arranged on the base. A plurality of anti-parallel diodes and a plurality of second heat sinks are arranged between the second upper pressure plate and the second lower pressure plate. The anti-parallel diodes located at both ends of the third direction are crimped with the second socket through the second heat sink. A second insulating block is provided between at least one group of adjacent two anti-parallel diodes.

7. The high-power converter valve group module according to claim 5, characterized in that: The clamping diode assembly unit includes a clamping diode, a freewheeling diode, a first absorption resistor and a third heat sink. There are multiple clamping diodes and multiple third heat sinks. The multiple clamping diodes, freewheeling diodes and first absorption resistors are arranged in sequence along the third direction, and any two adjacent components are crimped through the third heat sink.

8. The high-power converter valve group module according to claim 7, characterized in that: The clamping diode assembly unit includes: a third upper pressure plate, a third lower pressure plate, a third connecting column, a third insulating block, and a third socket. The third upper pressure plate and the third lower pressure plate are spaced apart along the third direction and are detachably connected through the third connecting column. The third lower pressure plate is detachably arranged on the base. The clamping diode, the freewheeling diode and the first absorption resistor are arranged between the third upper pressure plate and the third lower pressure plate. One of the multiple clamping diodes close to the third upper pressure plate is crimped with the third socket through the third heat sink. The first absorption resistor is crimped with another third socket through the third heat sink. A third insulating block is provided between at least two adjacent clamping diodes.

9. The high-power converter valve group module according to claim 7, characterized in that: The absorption component unit includes a second absorption resistor and an absorption capacitor. There are multiple absorption capacitors arranged along the third direction. The absorption capacitors are closer to the base than the second absorption resistor.

10. The high-power converter valve group module according to claim 7, characterized in that: The cooling assembly includes an inlet manifold, an outlet manifold and a plurality of branch pipes, the inlet manifold and the outlet manifold extend along the third direction and are arranged at intervals in the second direction, each branch pipe connects the inlet manifold and the outlet manifold to form a cooling branch, and the first radiator, the second radiator and the third radiator are arranged in series on at least one of the cooling branches.

11. The high-power converter valve group module according to claim 1, characterized in that: The high-power converter valve group module includes a first isolation plate and a second isolation plate. The first isolation plate is an insulating part and is arranged on the side of the composite parallel busbar assembly away from the IGCT assembly and the anti-parallel diode assembly unit. The second isolation plate is arranged on the side of the cooling assembly away from the absorption assembly unit and the drive assembly.

12. A converter, characterized in that: The invention comprises at least one bridge arm, wherein the bridge arm comprises at least two high-power converter valve group modules according to any one of claims 1 to 11.

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