Electronic equipment

Abstract

The invention discloses an electronic device. The electronic equipment comprises a first shell, a second shell, a rotating shaft mechanism and a first flexible circuit board assembly, and the first shell and the second shell are rotationally connected through the rotating shaft mechanism. When the first flexible circuit board assembly is specifically arranged, the first flexible circuit board assembly comprises an NFC module, a wireless charging module, a wired charging module and a first flexible circuit board, the NFC module, the wireless charging module and the wired charging module are all arranged on the first flexible circuit board, and the NFC module, the wireless charging module and the wired charging module are all contained in the second shell. According to the electronic equipment provided by the invention, the NFC module, the wireless charging module and the wired charging module are all integrated on the first flexible circuit board, so that the number of flexible circuit boards in the electronic equipment is reduced, the integration level of the electronic equipment is improved, and the thin design of the whole electronic equipment is realized.

Description

Technical Field

[0001] The present application relates to the technical field of foldable electronic devices, and in particular to an electronic device. Background Art

[0002] With the gradual maturity of flexible display technology, the display mode of electronic devices has undergone tremendous changes. Foldable electronic devices such as foldable flexible screen mobile phones, foldable flexible screen tablets, and wearable electronic devices with foldable flexible screens are an important evolution direction of future smart electronic devices.

[0003] For a double-foldable foldable electronic device, it includes a first shell and a second shell that are rotatably connected by a hinge mechanism. Generally, the first shell is provided with two inner and outer display screens, which makes it difficult to arrange a near-field communication (NFC) module, a wireless charging module, and a wired charging module. Therefore, these modules are all arranged in the second shell of the foldable electronic device. However, if the NFC module, the wireless charging module, and the wired charging module are all arranged separately, the number of flexible printed circuits (FPCs) in the second shell of the foldable electronic device will be large. Since these multiple FPCs are usually arranged in a stacked manner, they occupy a large thickness space of the second shell, resulting in a large thickness of the second shell, which is not conducive to achieving a thin design of the entire foldable electronic device. Summary of the Invention

[0004] The present application provides an electronic device to improve the integration of the electronic device, thereby achieving a thin design of the electronic device.

[0005] The present application provides an electronic device, which includes a first housing, a second housing, a hinge mechanism, and a first flexible circuit board assembly, wherein the first housing and the second housing are rotatably connected via the hinge mechanism. When the first flexible circuit board assembly is specifically provided, it includes an NFC module, a wireless charging module, a wired charging module, and a first flexible circuit board. The NFC module, the wireless charging module, and the wired charging module are all provided on the first flexible circuit board, and the NFC module, the wireless charging module, and the wired charging module are all accommodated in the second housing. The electronic device provided by the present application reduces the number of FPCs in the electronic device by integrating the NFC module, the wireless charging module, and the wired charging module into the first flexible circuit board, which is conducive to improving the integration of the electronic device and thus facilitating the thin design of the entire electronic device.

[0006] In one possible implementation of the present application, the first flexible circuit board includes a first surface and a second surface disposed opposite each other, and the first flexible circuit board assembly further includes a first magnetic conductive material layer disposed on the first surface. This allows the magnetic conductivity of the first magnetic conductive material layer to be utilized to implement the short-range communication function of the NFC module and the wireless charging function of the wireless charging module.

[0007] In addition, in the present application, the first magnetic conductive material layer covers at least a portion of the wired charging module, the NFC module, and the wireless charging module along the direction from the first surface to the second surface. This facilitates utilizing the magnetic conductivity of the first magnetic conductive material layer to implement the short-range communication function of the NFC module and the wireless charging function of the wireless charging module, thereby improving the wireless charging performance of the wireless charging module.

[0008] In a possible implementation of the present application, the first flexible circuit board assembly further includes a second magnetic conductive material layer, and the second magnetic conductive material layer is disposed on the second surface.

[0009] When the second magnetic conductive material layer is specifically arranged, the projection of the second magnetic conductive material layer along the direction from the second surface to the first surface overlaps the projection of the wired charging module, and the second magnetic conductive material layer is staggered with the coil of the NFC module and the coil of the wireless charging module. This helps improve the wireless charging performance of the wireless charging module.

[0010] In one possible implementation of the present application, the thickness of the portion of the first magnetic conductive material layer that faces the second magnetic conductive material layer is thinner than the thickness of the remaining portion of the first magnetic conductive material layer. This allows the space in the second housing freed by the thinning of the first magnetic conductive material layer to be used for the placement of other components, thereby improving the space utilization of the second housing and facilitating the functional diversification of the electronic device.

[0011] This application does not limit the materials of the first and second magnetic conductive material layers. For example, the material of the first magnetic conductive material layer is nanocrystalline, nanoamorphous, ferrite, or silicon steel sheet. In addition, the material of the second magnetic conductive material layer is nanocrystalline, nanoamorphous, ferrite, or silicon steel sheet. It is understood that the materials of the first and second magnetic conductive material layers can be the same or different, as long as they can meet the magnetic conductivity requirements of the NFC module and the wireless charging module.

[0012] In one possible implementation of the present application, a first flexible circuit board extends through the hinge mechanism, with a portion of the first flexible circuit board housed within the first housing and a portion of the first flexible circuit board housed within the second housing. This facilitates electrical connection between the first flexible circuit board and circuit boards or circuit board assemblies within the first and second housings, thereby enabling the functions of the various functional modules to be implemented.

[0013] In another possible implementation of the present application, the electronic device further includes a second flexible circuit board, a portion of which is located on a side of the first magnetic conductive material layer facing away from the first flexible circuit board. Furthermore, the thickness of the portion of the first flexible circuit board that opposes the portion of the second flexible circuit board is thinner than the thickness of the remaining portions of the first flexible circuit board. This allows the space in the second housing freed by the thinning of the first flexible circuit board to be used for the placement of other components, thereby improving the space utilization of the second housing and facilitating the functional diversification of the electronic device.

[0014] In another possible implementation of the present application, the electronic device further includes a second flexible circuit board. A portion of the second flexible circuit board is located on a side of the first magnetic conductive material layer facing away from the first flexible circuit board, and the thickness of the portion of the second flexible circuit board is less than the thickness of the remaining portion of the second flexible circuit board. This allows the space in the second housing freed by the thinning of the portion of the second flexible circuit board to be used for the placement of other components, thereby improving the space utilization of the second housing and facilitating the functional diversification of the electronic device.

[0015] In a possible implementation of the present application, the electronic device further includes a second flexible circuit board, and along the axial direction of the rotating shaft mechanism, the first flexible circuit board assembly and the second flexible circuit board are spaced apart.

[0016] Furthermore, along the axial direction of the hinge mechanism, the projection of the first flexible circuit board assembly overlaps at least partially the projection of the second flexible circuit board. This allows the space occupied by the first flexible circuit board assembly and the second flexible circuit board in the thickness direction of the second housing to at least partially overlap, which helps reduce the thickness of the second housing and thus facilitates a thinner design for the electronic device.

[0017] The first magnetic conductive material layer can cover at least a portion of the second flexible circuit board, with the first and second flexible circuit boards positioned on either side of the first magnetic conductive material layer. This reduces signal interference from the magnetic components in the second flexible circuit board to the NFC module and wireless charging module in the first flexible circuit board assembly, thereby ensuring the proper functioning of the NFC module and wireless charging module.

[0018] In one possible implementation of the present application, the electronic device further includes a first flexible display, which continuously covers the first housing, the second housing, and the hinge mechanism, and is fixedly connected to the first and second housings. In this electronic device, the first housing primarily supports the first flexible display and houses a circuit board, etc., for implementing the functions of the first flexible display, thereby facilitating a thinner design for the electronic device.

[0019] In addition, the electronic device also includes a second flexible display screen, which is disposed within the first housing, with the second flexible display screen and the first flexible display screen located on opposite sides of the first housing. This enables dual-screen display functionality within the first housing, thereby increasing the functionality of the electronic device.

[0020] In this application, the electronic device also includes a battery, which is also housed in the second housing. Because the electronic device employing the solution provided in this application can reduce the number of flexible circuit boards within the second housing, the space for accommodating the battery in the second housing can be increased, thereby increasing the battery capacity and improving battery life. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1a A schematic diagram of the structure of an electronic device provided in an embodiment of the present application in a flattened state;

[0022] Figure 1b for Figure 1a a side view of the electronic device shown;

[0023] Figure 2 A schematic structural diagram of a first flexible circuit board assembly provided in an embodiment of the present application;

[0024] Figure 3 for Figure 2 AA cross-sectional view of the first flexible circuit board assembly shown in;

[0025] Figure 4a BB is a cross-sectional view of the electronic device shown in FIG1 ;

[0026] Figure 4b A cross-sectional view of another structure of an electronic device provided in an embodiment of the present application;

[0027] Figure 4c A cross-sectional view of another structure of an electronic device provided in an embodiment of the present application;

[0028] Figure 5 A cross-sectional view of another structure of an electronic device provided in an embodiment of the present application;

[0029] Figure 6 A cross-sectional view of another structure of an electronic device provided in an embodiment of the present application;

[0030] Figure 7 A cross-sectional view of another structure of an electronic device provided in an embodiment of the present application;

[0031] Figure 8 A cross-sectional view of another structure of an electronic device provided in an embodiment of the present application;

[0032] Figure 9A cross-sectional view of another structure of an electronic device provided in an embodiment of the present application.

[0033] Reference numerals:

[0034] 1-first housing; 2-second housing; 3-rotating shaft mechanism; 4a-first flexible display screen; 4b-second flexible display screen;

[0035] 5-battery; 6-first flexible circuit board assembly; 601-NFC module; 602-wireless charging module; 603-wired charging module;

[0036] 604 - first flexible circuit board; 6041 - first surface; 6042 - second surface; 605 - first magnetic conductive material layer; 606a, 606b - glue;

[0037] 607 - second magnetic conductive material layer; 7 - second flexible circuit board; 8 - graphite heat dissipation layer. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as being limited to the embodiments set forth herein. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted. The words expressing position and direction described in the embodiments of the present application are all explained using the accompanying drawings as examples, but changes may be made as needed, and the changes made are all included in the scope of protection of the present application. The drawings in the embodiments of the present application are only used to illustrate the relative position relationship and do not represent the true proportion.

[0039] It should be noted that the following description sets forth specific details to facilitate understanding of the present application. However, the embodiments of the present application can be implemented in a variety of other ways than those described herein, and those skilled in the art can make similar generalizations without violating the connotations of the embodiments of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0040] The electronic device provided in the embodiment of the present application includes a mobile phone, a personal digital assistant (PDA), a tablet computer or other devices with a foldable function. In order to facilitate understanding of the electronic device provided in the embodiment of the present application, you can first refer to Figure 1a , Figure 1a This is a schematic diagram of the structure of an electronic device in a flattened state provided by an embodiment of the present application. Figure 1aIn the illustrated embodiment, the electronic device is a bi-fold mobile phone as an example for explanation. In other embodiments of the present application, the electronic device can also be set to a three-fold, four-fold, five-fold or more folded form, and its specific setting method is similar to that of the bi-fold electronic device.

[0041] You can continue to refer to Figure 1a The electronic device includes a first shell 1, a second shell 2 and a hinge mechanism 3. The first shell 1 and the second shell 2 are respectively arranged on both sides of the hinge mechanism 3, and the first shell 1 and the second shell 2 are rotatably connected through the hinge mechanism 3, thereby realizing the foldable function of the electronic device.

[0042] It is understandable that a foldable electronic device also includes a flexible display screen. Figure 1b , Figure 1b for Figure 1a A side view of an electronic device is shown. This electronic device includes two flexible displays: a first flexible display 4a and a second flexible display 4b. The first flexible display 4a continuously covers the first housing 1, the hinge mechanism 3, and the second housing 2. The first flexible display 4a is fixedly connected to the first and second housings 1 and 2, so that the first flexible display 4a can be folded or unfolded synchronously with the rotation of the first and second housings 1 and 2 about the hinge mechanism 3. Furthermore, the second flexible display 4b only covers the first housing 1, and the second flexible display 4b and the first flexible display 4a are located on opposite sides of the first housing 1.

[0043] From the above introduction to the basic structure of the electronic device, it can be seen that, in order to meet the requirements of thin design of foldable electronic devices, the first shell 1 is mainly used to set the first flexible display screen 4a and the second flexible display screen 4b and the circuit board for realizing the functions of each flexible display screen, etc., and the second shell 2 is mainly used to set the battery 5, the wireless charging module ( Figure 1a Not shown) and an electric charging module ( Figure 1a (not shown in the figure), etc., when the first shell 1 and the second shell 2 are specifically designed, the thickness of the first shell 1 can be made smaller and the accommodating space of the second shell 2 can be made larger.

[0044] Since wireless charging technology originates from wireless power transmission technology, its operating principle is: based on the technology of transmitting energy through a magnetic field, using magnetic field induction to achieve power transmission between an electronic device and a power supply device, in this application, the wireless charging module is a module used to achieve wireless power transmission between an electronic device and a power supply device. In addition, wired charging technology is a technology that uses a data cable to electrically connect an electronic device to a power supply device to achieve power transmission between the electronic device and the power supply device. Therefore, in this application, the wired charging module is a module used to achieve power transmission between an electronic device and a power supply device.

[0045] As electronic devices become more diverse in functionality, the number of functional modules within them is also increasing. For example, some current electronic devices are equipped with NFC modules. NFC is a short-range wireless communication technology that uses contactless radio frequency identification (RFID) technology to enable close-range communication between electronic devices using magnetic field induction.

[0046] As mentioned above, since display screens are required on both sides of the first housing 1, it is difficult to meet the spatial requirements for the NFC module. Therefore, in electronic devices, the NFC module is typically installed in the second housing 2. Furthermore, since NFC modules, wireless charging modules, and live charging modules are currently often installed on FPCs, if these modules were installed separately, the number of FPCs in the second housing 2 would be relatively large. Furthermore, if these multiple FPCs were installed in a stacked manner, they would occupy a large amount of space in the thickness of the second housing 2, resulting in a larger thickness of the second housing 2, which is not conducive to achieving a thinner design for the entire electronic device.

[0047] In view of this, the electronic device provided by this application integrates the NFC module, wireless charging module, and wired charging module into the same FPC, thereby reducing the number of FPCs in the electronic device, thereby helping to meet the requirements of the thin design of the entire electronic device. To facilitate understanding of the electronic device provided by this application, it will be described in detail below with reference to specific embodiments.

[0048] You can continue to refer to Figure 1a In this application, the electronic device includes the above-mentioned first housing 1, second housing 2, hinge mechanism 3 and battery 5. In addition, the electronic device also includes a first flexible circuit board assembly 6, referring to Figure 2 , Figure 2 A schematic structural diagram of the first flexible circuit board assembly 6 provided in an embodiment of the present application.

[0049] When specifically setting the first circuit board assembly 6, refer to Figure 3 , Figure 3 for Figure 2 AA cross-sectional view of the first flexible circuit board assembly 6 is shown in FIG. The first flexible circuit board assembly 6 includes an NFC module 601, a wireless charging module 602, a wired charging module 603, and a first flexible circuit board 604. The NFC module 601, the wireless charging module 602, and the wired charging module 603 are all provided on the first flexible circuit board 604, and the NFC module 601, the wireless charging module 602, and the wired charging module 603 are all accommodated in the second housing 2.

[0050] It is worth mentioning that this application does not limit the specific settings of the NFC module 601, the wireless charging module 602 and the wired charging module 603. It is sufficient as long as the NFC module 601 can realize the short-range communication function, the wireless charging module 602 can meet the wireless charging requirements of the electronic device, and the wired charging module 603 can meet the wired charging requirements of the electronic device.

[0051] Reference Figure 4a , Figure 4a for Figure 1a BB cross-sectional view of the electronic device shown in FIG. The first flexible circuit board 604 includes a first surface 6041 and a second surface 6042 disposed opposite each other, wherein the second surface 6042 faces away from the first flexible display screen 4a relative to the first surface 6041. Furthermore, the first flexible circuit board assembly 6 also includes a first magnetic conductive material layer 605, which is disposed on the first surface 6041 of the first flexible circuit board 604 and is connected to the first surface 6041 of the first flexible circuit board 604. The connection method may be, but is not limited to, bonding or welding using adhesive 606a.

[0052] The present application does not limit the specific material of the first magnetic conductive material layer 605 , and examples thereof may be materials with magnetic conductive properties such as nanocrystalline, nanoamorphous, ferrite, or silicon steel sheet.

[0053] like Figure 4a As shown, in this application, along the direction from the first surface 6041 to the second surface 6042, that is, Figure 4a The Y direction shown in FIG is also the thickness direction of the second housing 2. The first magnetic conductive material layer 605 covers at least a portion of the wired charging module 603, and also covers the NFC module 601 and the wireless charging module 602. This facilitates utilizing the magnetic conductivity of the first magnetic conductive material layer 605 to implement the short-range communication function of the NFC module 601 and the wireless charging function of the wireless charging module 602, thereby improving the wireless charging performance of the wireless charging module 602.

[0054] In addition, the first flexible circuit board assembly 6 further includes a second magnetic conductive material layer 607, which is disposed on the second surface 6042 of the first flexible circuit board 604 and is bonded to the second surface 6042 of the first flexible circuit board 604 by means of adhesive 606b. Figure 4a Along the direction from the second surface 6042 to the first surface 6041, that is, along the -Y direction, the projection of the second magnetic conductive material layer 607 covers the projection of the wired charging module 603. The second magnetic conductive material layer 607 is staggered with the coil of the NFC module 601 and the coil of the wireless charging module 602. This helps improve the wireless charging performance of the wireless charging module 602.

[0055] like Figure 4a As shown, in the present application, the thickness of the portion of the first magnetic conductive material layer 605 that is disposed opposite the second magnetic conductive material layer 607 is thinner than the thickness of the other portions of the first magnetic conductive material layer 605. In other words, the portion of the first magnetic conductive material layer 605 that is disposed opposite the second magnetic conductive material layer 607 in the thickness direction of the second housing 2 is thinned. The space in the second housing 2 freed by the thinning of the first magnetic conductive material layer 605 can be used for the placement of other components. This can help improve the space utilization of the second housing 2, thereby facilitating the functional diversification design of the electronic device.

[0056] In some other possible embodiments of the present application, for example, when there is ample space in the second housing 2 for arranging other devices, refer to Figure 4b , Figure 4b This is a cross-sectional view of another structure of an electronic device provided in an embodiment of the present application, in which the thickness of the first magnetic conductive material layer 605 can also be the same at all locations.

[0057] In addition, refer to Figure 4c , Figure 4c This is a cross-sectional view of another structure of an electronic device provided in an embodiment of the present application. The first flexible circuit board assembly 6 may also include only the first magnetic conductive material layer 605 without the second magnetic conductive material layer 607. In this case, the routing of the first flexible circuit board 604 can be optimized to improve the wireless charging performance of the wireless charging module 602.

[0058] It can be understood that in addition to being used to set the above-mentioned NFC module 601, wireless charging module 602 and wired charging module 603, the first flexible circuit board 604 can also be used to set other possible functional modules, which are not listed one by one here, but should all be understood to fall within the scope of protection of this application.

[0059] In addition, the first flexible circuit board 604 can also be electrically connected to other circuit boards or circuit board assemblies in the electronic device to realize the functions of various functional modules. Since the first flexible circuit board 604 can be electrically connected to other circuit boards or circuit board assemblies in the second shell 2, it can also be electrically connected to other circuit boards or circuit board assemblies in the first shell 1. Therefore, it can be continued to refer to Figure 1a and Figure 2 In the present application, the first flexible circuit board 604 passes through the hinge mechanism 3 , so that part of the first flexible circuit board 604 is accommodated in the first shell 1 , and part of the first flexible circuit board 604 is accommodated in the second shell 2 .

[0060] You can continue to refer to Figure 4a The electronic device further includes a second flexible circuit board 7, a portion of which is located on the side of the first magnetic conductive material layer 605 facing away from the first flexible circuit board 604. Furthermore, the thickness of the portion of the first flexible circuit board 604 that opposes the portion of the second flexible circuit board 7 is thinner than the thickness of the remaining portions of the first flexible circuit board 604. In other words, the portion of the first flexible circuit board 604 that opposes the portion of the second flexible circuit board 7 in the thickness direction of the second housing 2 is thinned. The space freed up in the second housing 2 by the thinning of the portion of the first flexible circuit board 604 can be used to accommodate other components. This improves the space utilization of the second housing 2 and facilitates the functional diversification of the electronic device.

[0061] In the present application, the specific arrangement of the second flexible circuit board 7 is not limited. For example, the second flexible circuit board 7 can also pass through the hinge mechanism 3, and then part of the second flexible circuit board 7 is accommodated in the first shell 1, and part of the second flexible circuit board 7 is accommodated in the second shell 2, so that the second flexible circuit board 7 can be used to be electrically connected to other circuit boards or circuit board assemblies in the first shell 1 and the second shell 2 for realizing the functions of the functional module.

[0062] Also refer to Figure 5 , Figure 5 This is a cross-sectional view of another structure of an electronic device provided in an embodiment of the present application. It can be understood that Figure 5 The cross-sectional view of the electronic device shown is Figure 4a The cross-sectional views of the electronic devices shown are cut in the same direction. Figure 5 In the embodiment, a portion of the second flexible circuit board 7 is also located on the side of the first magnetic conductive material layer 605 away from the first flexible circuit board 604, but is not connected to the first flexible circuit board 604. Figure 4a The electronic devices shown differ in that Figure 5In the illustrated electronic device, the thickness of a portion of the second flexible circuit board 7 is thinner than the thickness of the remaining portion of the second flexible circuit board 7. In other words, the portion of the second flexible circuit board 7 that opposes the first flexible circuit board 604 in the thickness direction of the second housing 2 is thinned. The space freed up in the second housing 2 by the thinning of the portion of the second flexible circuit board 7 can be used to house other components. This improves the space utilization of the second housing 2 and facilitates the functional diversification of the electronic device.

[0063] Figure 5 Other structures of the electronic device shown can be configured with reference to any of the above embodiments, and will not be described in detail here.

[0064] The above is only an exemplary description of the arrangement of the first flexible circuit board assembly 6 and the second flexible circuit board 7. In practical applications, the arrangement of the first flexible circuit board assembly 6 and the second flexible circuit board 7 is not limited to this. Figure 6 , Figure 6 This is a cross-sectional view of another structure of an electronic device provided in an embodiment of the present application. Figure 6 In the X-direction shown in FIG, that is, along the axial direction of the rotating shaft mechanism 3, the second flexible circuit board 7 is spaced apart from the first flexible circuit board 604. Furthermore, the first magnetic conductive material layer 605 of the first flexible circuit board assembly 6 covers at least a portion of the second flexible circuit board 7, and the first flexible circuit board 604 and the second flexible circuit board 7 are located on either side of the first magnetic conductive material layer 605. This reduces signal interference from the magnetic components in the second flexible circuit board 7 with the NFC module 601 and wireless charging module 602 in the first flexible circuit board assembly 6, thereby ensuring the functionality of the NFC module 601 and wireless charging module 602.

[0065] like Figure 6 As shown, along the -X direction, which is also along the axial direction of the rotating shaft mechanism 3, the projection of the first flexible circuit board assembly 6 covers at least a portion of the projection of the second flexible circuit board 7. In this way, the space occupied by the first flexible circuit board assembly 6 and the second flexible circuit board 7 in the thickness direction of the second shell 2 can at least partially overlap, which is conducive to reducing the thickness of the second shell 2 and thus facilitating the thin design of the electronic device.

[0066] It is worth mentioning that in Figure 6 In the electronic device shown, part of the first magnetic conductive material layer 605 can be bent and overlapped with the second magnetic conductive material layer 607, so that the space occupied by the first magnetic conductive material layer 605 and the second flexible circuit board 7 in the thickness direction of the second shell 2 can at least partially overlap, which is conducive to reducing the thickness of the second shell 2.

[0067] Figure 6Other structures of the electronic device shown can be configured with reference to any of the above embodiments, and will not be described in detail here.

[0068] Based on the description of the electronic device provided by the present application in the above embodiments, in actual applications, the arrangement of the first flexible circuit board assembly 6 and the second flexible circuit board 7 in the electronic device can be adjusted according to specific scenarios. For example, the relative positions of the first flexible circuit board assembly 6 and the second flexible circuit board 7 along the X-direction can be interchanged. In addition, the electronic device may further include a third flexible circuit board, a fourth flexible circuit board, or other flexible circuit boards. Each flexible circuit board can be arranged similarly to the first flexible circuit board 604 or the second flexible circuit board 7, or other possible arrangements can be adopted. These arrangements will not be described in detail here, but should be understood to fall within the scope of protection of the present application.

[0069] It is understandable that the above only describes part of the structure of the electronic device provided in the embodiment of the present application. On this basis, other structures can be set according to specific needs. For example, refer to Figure 7 , Figure 7 This is a cross-sectional view of another structure of an electronic device provided in an embodiment of the present application. Figure 4a Compared to the electronic devices shown, Figure 7 The electronic device shown in FIG further includes a graphite heat dissipation layer 8, which is located on the side of the second magnetic conductive material layer 607 away from the first flexible circuit board 604, and along the -Y direction, the projection of the graphite heat dissipation layer 8 falls within the projection range of the second magnetic conductive material layer 607. Figure 7 In the embodiment, the graphite heat dissipation layer 8 can be bonded to the surface of the second magnetic conductive material layer 607 on the side away from the first flexible circuit board 604, and the graphite heat dissipation layer 8 can also penetrate Figure 1a The shaft mechanism 3 shown in the figure makes part of the graphite heat dissipation layer 8 located in the first shell 1, and part of the graphite heat dissipation layer 8 located in the second shell 2, so that the area of ​​the graphite heat dissipation layer 8 is larger to improve its heat dissipation efficiency.

[0070] The specific arrangement of the graphite heat dissipation layer 8 in the electronic device is not limited to this. For example, Figure 8 In the electronic device shown, the graphite heat dissipation layer 8 may also be located between the first flexible circuit board assembly 6 and the second flexible circuit board 7, wherein the graphite heat dissipation layer 8 may not be bonded to the first flexible circuit board assembly 6 and the second flexible circuit board 7, so as to enhance the flexibility of the arrangement of the graphite heat dissipation layer 8. Figure 9 In the electronic device shown, the graphite heat dissipation layer 8 can also be located on the side of the second flexible circuit board 7 away from the first flexible circuit board assembly 6. Figure 8 and Figure 9 In the electronic device shown, the graphite heat dissipation layer 8 can also penetrate Figure 1a The shaft mechanism 3 shown in the figure makes part of the graphite heat dissipation layer 8 located in the first shell 1, and part of the graphite heat dissipation layer 8 located in the second shell 2, so that the area of ​​the graphite heat dissipation layer 8 is larger to improve its heat dissipation efficiency.

[0071] The electronic device provided in this application may also be provided with various other possible structures, which are not listed here one by one, but they should all be understood to fall within the scope of protection of this application.

[0072] The electronic device provided in the present application reduces the number of FPCs in the electronic device by integrating the NFC module 601, the wireless charging module 602 and the wired charging module 603 into the first flexible circuit board, which is beneficial to improving the integration of the electronic device and thus facilitating the thin design of the entire electronic device.

[0073] The above are only specific embodiments of the present application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An electronic device, characterized in that: The device comprises a first housing, a second housing, a hinge mechanism, and a first flexible circuit board assembly, wherein the first housing and the second housing are rotatably connected via the hinge mechanism, wherein: The first flexible circuit board assembly includes an NFC module, a wireless charging module, a wired charging module and a first flexible circuit board. The NFC module, the wireless charging module and the wired charging module are all arranged on the first flexible circuit board, and the NFC module, the wireless charging module and the wired charging module are all accommodated in the second shell.

2. The electronic device according to claim 1, wherein The first flexible circuit board includes a first surface and a second surface disposed opposite to each other. The first flexible circuit board assembly further includes a first magnetic conductive material layer disposed on the first surface.

3. The electronic device according to claim 2, wherein: Along the direction from the first surface to the second surface, the first magnetic conductive material layer covers at least a portion of the wired charging module, the NFC module, and the wireless charging module.

4. The electronic device according to claim 2 or 3, wherein: The first flexible circuit board assembly further includes a second magnetic conductive material layer, and the second magnetic conductive material layer is disposed on the second surface.

5. The electronic device according to claim 4, wherein: Along the direction from the second surface to the first surface, the projection of the second magnetic conductive material layer covers the projection of the wired charging module, and the second magnetic conductive material layer is staggered with the coil of the NFC module and the coil of the wireless charging module.

6. The electronic device according to claim 4 or 5, characterized in that: The thickness of a portion of the first magnetic conductive material layer that is arranged opposite to the second magnetic conductive material layer is smaller than the thickness of other portions of the first magnetic conductive material layer.

7. The electronic device according to any one of claims 4 to 6, wherein: The first magnetic conductive material layer is made of nanocrystal, nanoamorphous, ferrite or silicon steel sheet; the second magnetic conductive material layer is made of nanocrystal, nanoamorphous, ferrite or silicon steel sheet.

8. The electronic device according to any one of claims 1 to 7, wherein: The electronic device also includes a second flexible circuit board, a portion of which is located on a side of the first magnetic conductive material layer facing away from the first flexible circuit board; the thickness of the portion of the first flexible circuit board that is arranged opposite to the portion of the second flexible circuit board is less than the thickness of other portions of the first flexible circuit board.

9. The electronic device according to any one of claims 1 to 7, wherein: The electronic device also includes a second flexible circuit board, a portion of which is located on a side of the first magnetic conductive material layer away from the first flexible circuit board, and a thickness of the portion of the second flexible circuit board is smaller than a thickness of other portions of the second flexible circuit board.

10. The electronic device according to any one of claims 2 to 7, wherein: The electronic device further includes a second flexible circuit board. Along the axial direction of the rotating shaft mechanism, the first flexible circuit board assembly and the second flexible circuit board are spaced apart.

11. The electronic device according to claim 10, wherein: Along the axial direction of the rotating shaft mechanism, the projection of the first flexible circuit board assembly covers at least a portion of the projection of the second flexible circuit board.

12. The electronic device according to claim 10 or 11, wherein: The first magnetic conductive material layer covers at least a portion of the second flexible circuit board, and the first flexible circuit board and the second flexible circuit board are located on both sides of the first magnetic conductive material layer.

13. The electronic device according to any one of claims 1 to 12, wherein: The first flexible circuit board passes through the hinge mechanism, a portion of the first flexible circuit board is accommodated in the first housing, and a portion of the first flexible circuit board is accommodated in the second housing.

14. The electronic device according to any one of claims 1 to 13, wherein: The electronic device further includes a first flexible display screen, which continuously covers the first shell, the second shell and the hinge mechanism, and is fixedly connected to the first shell and the second shell.

15. The electronic device according to claim 14, wherein: The electronic device further includes a second flexible display screen, which is disposed on the first housing, and the second flexible display screen and the first flexible display screen are located on opposite sides of the first housing.

16. The electronic device according to any one of claims 1 to 15, wherein: The electronic device further includes a battery, and the battery is accommodated in the second housing.

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