Liquid metal packaging structure and its fabrication method, electronic devices

Abstract

This invention discloses a liquid metal encapsulation structure and its manufacturing method, as well as an electronic device, relating to the field of heat dissipation element technology. It includes: a liquid metal filling area for filling liquid metal between an electronic component and a heat sink; the heat sink covering the electronic component; a superhydrophobic reflux area located around the liquid metal filling area, used to agglomerate liquid metal overflowing from the liquid metal filling area based on its hydrophobicity and guide the agglomerated liquid metal backflow; a leakage detection area located around the superhydrophobic reflux area, used to detect liquid metal leaking from the superhydrophobic reflux area and trigger an alarm; and an absorption area located around the leakage detection area, used to control the oxidation reaction of liquid metal leaking from the leakage detection area, thereby blocking the flow of liquid metal in that area. Through the collaborative design of multiple functional areas, this effectively achieves liquid metal sealing and leakage prevention, avoiding risks such as equipment damage and business downtime caused by liquid metal leakage.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation element technology, and in particular to a liquid metal encapsulation structure and its manufacturing method, as well as electronic devices. Background Technology

[0002] As electronic components experience increasingly higher power consumption and heat flux density, liquid metal, due to its excellent filling properties and high thermal conductivity, is being used more and more widely as a thermal interface material in devices such as servers. However, because liquid metal is in a liquid state under normal operating conditions, if not properly sealed, it can flow onto the circuit board, causing serious consequences such as short circuits and device burnout. Traditional liquid metal packaging solutions mostly use simple enclosure structures, which have poor reliability; once leakage occurs, it can lead to damage to devices, circuit boards, and even the entire device. Summary of the Invention

[0003] This invention provides a liquid metal encapsulation structure and its manufacturing method, as well as an electronic device, to at least solve the problem that liquid metal leakage can easily lead to equipment damage in related technologies.

[0004] This invention provides a liquid metal packaging structure, comprising:

[0005] A liquid metal filling area is used to fill the space between the target electronic component and the heat sink; the heat sink covers the target electronic component;

[0006] The superhydrophobic reflux zone is located outside the liquid metal filling zone. It is used to agglomerate the liquid metal overflowing from the liquid metal filling zone based on its hydrophobicity and guide the agglomerated liquid metal to flow back.

[0007] The leakage detection area, located outside the superhydrophobic reflux area, is used to detect liquid metal leaking from the superhydrophobic reflux area and trigger an alarm.

[0008] The absorption zone, located outside the leakage detection zone, is used to control the oxidation reaction of liquid metal leaking from the leakage detection zone, thereby blocking the flow of liquid metal in the absorption zone.

[0009] The present invention also provides a method for fabricating a liquid metal encapsulation structure, comprising:

[0010] The target electronic component is placed in a preset mounting position on the substrate, and a heat sink is placed on the target electronic component; a gap is reserved between the heat sink and the target electronic component for filling with liquid metal.

[0011] Liquid metal is filled into the gap between the heat sink and the target electronic component to form a liquid metal filling area;

[0012] A superhydrophobic reflux zone is formed around the liquid metal filling area; the superhydrophobic reflux zone is used to agglomerate the liquid metal overflowing from the liquid metal filling area based on its hydrophobicity, and to guide the agglomerated liquid metal backflow.

[0013] A leakage detection zone is formed around the superhydrophobic reflux zone; the leakage detection zone is used to detect liquid metal leaking from the superhydrophobic reflux zone and trigger an alarm.

[0014] An absorption zone is formed around the leakage detection zone; the absorption zone is used to control the oxidation reaction of liquid metal leaking from the leakage detection zone, so as to block the flow of liquid metal in the absorption zone.

[0015] The present invention also provides an electronic device including the above-described liquid metal encapsulation structure.

[0016] The liquid metal encapsulation structure provided by this invention, through the collaborative design of multiple functional areas, effectively achieves liquid metal sealing and leakage prevention, producing multi-dimensional beneficial effects: First, the liquid metal filling area can stably fill the space between the target electronic component and the heat sink, reducing the initial leakage risk while ensuring heat dissipation; second, the superhydrophobic reflux area, based on its hydrophobicity, causes the overflowing liquid metal to agglomerate and guide its return, reducing the outward diffusion of leakage from the source and lowering the pressure of subsequent prevention and control; third, the leakage detection area detects liquid metal leaking from the superhydrophobic reflux area and triggers an alarm, achieving proactive real-time monitoring of leakage and ensuring that initial leaks can be detected in a timely manner; finally, the absorption area blocks the flow of leaking liquid metal by controlling its oxidation reaction, forming redundant leakage protection. The overall structure effectively avoids serious risks such as equipment damage and business downtime caused by liquid metal leakage, significantly improving the reliability and safety of the encapsulation structure and downstream equipment operation.

[0017] In addition, the present invention also provides a corresponding manufacturing method and electronic equipment for liquid metal packaging structures, which have the same or corresponding technical features as the liquid metal packaging structures mentioned above, and have the same effects. Attached Figure Description

[0018] To more clearly illustrate the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A schematic diagram of a liquid metal packaging structure provided in an embodiment of the present invention;

[0020] Figure 2This is a top view of the liquid metal packaging structure provided in an embodiment of the present invention;

[0021] Figure 3 This is a front view of the liquid metal packaging structure provided in an embodiment of the present invention;

[0022] Figure 4 This is a general schematic diagram of the heat sink assembly provided in an embodiment of the present invention;

[0023] Figure 5 This is a schematic diagram of the structure of the superhydrophobic recirculation region provided in an embodiment of the present invention;

[0024] Figure 6 This is a schematic diagram of contact angle measurement provided in an embodiment of the present invention;

[0025] Figure 7 This is a schematic diagram of a laser ablation pattern provided in an embodiment of the present invention;

[0026] Figure 8 A schematic diagram of the cuboid air column microstructure provided in an embodiment of the present invention;

[0027] Figure 9 This is an overall schematic diagram of the superhydrophobic reflow region with a lower inner area and a higher outer area provided in an embodiment of the present invention;

[0028] Figure 10 This is a schematic diagram of the structure of the leakage detection area provided in an embodiment of the present invention;

[0029] Figure 11 This is a schematic diagram of the structure of the leakage detection line provided in an embodiment of the present invention;

[0030] Figure 12 This is a schematic diagram of the absorption region provided in an embodiment of the present invention;

[0031] Figure 13 This is a schematic diagram of the structure of the inner sealing ring provided in an embodiment of the present invention;

[0032] Figure 14 This is a schematic diagram of the structure of the outer sealing ring provided in an embodiment of the present invention;

[0033] Figure 15 A flowchart illustrating the fabrication method of the liquid metal encapsulation structure provided in this embodiment of the invention.

[0034] Among them, 1 is the liquid metal filling area, 2 is the superhydrophobic reflux area, 3 is the leakage detection area, 4 is the absorption area, 5 is the leakage detection line, 6 is the inner sealing ring, 7 is the outer sealing ring, A is the target electronic component, and B is the heat sink. Detailed Implementation

[0035] With the rapid development of artificial intelligence and high-performance computing, the power density of electronic components is constantly increasing, leading to a dramatic increase in heat generation. For example, the thermal design power (TDP) of a single chip has exceeded 1400W, and the total power consumption of a multi-chip interconnected rack can reach 120-132kW. This exponentially increasing heat load is making traditional cooling solutions increasingly inadequate. Air cooling cannot handle heat densities exceeding 100kW per rack, and its airflow organization efficiency is low. Water cooling, due to its inherent physical properties, is difficult to efficiently transfer instantaneous heat, easily resulting in localized hot spots. Liquid metals (such as gallium-based alloys), with their ultra-high thermal conductivity and high boiling point, have become a key technology for solving this heat dissipation bottleneck. However, liquid metals have significant shortcomings in application. It poses a risk of electrochemical corrosion to common heat dissipation materials, and long-term use may lead to interface degradation; when exposed to air, it is prone to forming an oxide film, which increases the interface thermal resistance and affects the thermal conductivity; more critically, there are sealing and leakage issues. Most traditional liquid metal packaging solutions use simple enclosure structures with low reliability. Once leakage occurs, it can cause short circuits and burnout of electronic components, and even damage to equipment and business interruption.

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present invention.

[0037] It should be noted that, in the description of this invention, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., used in this invention are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0038] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0039] An embodiment of the present invention provides a liquid metal encapsulation structure. Figure 1 This is a schematic diagram of the liquid metal packaging structure provided in an embodiment of the present invention, as shown below. Figure 1 As shown, the liquid metal packaging structure may include:

[0040] Liquid metal filling area 1 is used to fill liquid metal between the target electronic component and the heat sink; the heat sink covers the target electronic component;

[0041] The superhydrophobic reflux zone 2 is located outside the liquid metal filling zone 1. It is used to agglomerate the liquid metal overflowing from the liquid metal filling zone 1 based on its hydrophobicity and guide the agglomerated liquid metal to reflux.

[0042] Leakage detection zone 3 is located outside the superhydrophobic reflux zone 2 and is used to detect liquid metal leaking from the superhydrophobic reflux zone 2 and trigger an alarm.

[0043] Absorption zone 4, located outside of leakage detection zone 3, is used to control the oxidation reaction of liquid metal leaking from leakage detection zone 3, thereby blocking the flow of liquid metal in absorption zone 4.

[0044] It should be noted that the liquid metal filling area 1 is the area coated with liquid metal, which is filled between the target electronic component and the heat sink; the liquid metal filling area 1 is a key functional area connecting the target electronic component (such as a chip) and the heat sink. Figure 2 This is a top view of the liquid metal packaging structure provided in an embodiment of the present invention, as shown below. Figure 2 As shown, the target electronic component A, as a heat source, continuously releases heat during operation. The heat sink, as a heat dissipation component, needs to cover the heat-generating surface of the target electronic component to achieve heat absorption and dissipation. However, since it is difficult to achieve an absolutely flat surface between the target electronic component A and the heat sink, there are often tiny gaps between them. The air remaining in these gaps has an extremely low thermal conductivity. The existence of the liquid metal filling area 1 is precisely to solve this problem. By filling this gap area with liquid metal, it can fully fill the tiny gaps and remove air, so that the heat generated by the electronic component can be quickly transferred to the heat sink covering it through the liquid metal. Then, the heat sink dissipates the heat to the external environment through convection, radiation, and other means, ultimately achieving efficient temperature control of the target electronic component.

[0045] Figure 3 This is a front view of the liquid metal packaging structure provided in an embodiment of the present invention, as shown below. Figure 3 As shown, the superhydrophobic reflux region 2 is a functional area surrounding the liquid metal filling region 1. Its function is to efficiently recover any liquid metal that may overflow from the liquid metal filling region 1 using its superhydrophobic properties, ensuring the stability of the heat dissipation system and the recycling of the liquid metal. For example... Figure 2As shown, the leakage detection zone 3, serving as the outermost safety protection area of ​​the liquid metal heat dissipation structure, is located outside the superhydrophobic reflux zone 2. Its function is to promptly detect liquid metal leaking out of the superhydrophobic reflux zone 2 that it fails to completely intercept, and to quickly trigger an alarm to avoid safety risks. The absorption zone 4, the outermost safety protection area of ​​the liquid metal heat dissipation structure, is located outside the leakage detection zone 3. Its function is to actively control the oxidation reaction of the leaking liquid metal, thereby physically altering the fluidity of the liquid metal and completely blocking its continued diffusion, forming a barrier for system safety protection.

[0046] Figure 4 A general schematic diagram of the heat sink assembly provided in an embodiment of the present invention is shown below. Figure 4 As shown, heat sink B can be a finned structure, with the bottom attached to the target electronic component A. The multi-layered fin design of heat sink B, in conjunction with the liquid metal filling area 1, allows the liquid metal to efficiently transfer heat from the target electronic component A to the bottom of heat sink B. The fins increase the heat dissipation area and accelerate the convection diffusion of heat into the air. The mounting configuration of heat sink B covering electronic component A provides basic support for the peripheral layout of the superhydrophobic reflux area 2, leakage detection area 3, and absorption area 4.

[0047] In the liquid metal encapsulation structure provided in this embodiment of the invention, the liquid metal filling area 1 can stably fill the space between the target electronic component and the heat sink, reducing the initial risk of leakage while ensuring heat dissipation. The superhydrophobic reflux area 2 uses hydrophobicity to agglomerate the overflowing liquid metal and guide it back, reducing the outward diffusion of leakage from the source and lowering the pressure of subsequent prevention and control. The leakage detection area 3 detects the liquid metal leaking from the superhydrophobic reflux area 2 and triggers an alarm, realizing active real-time monitoring of leakage and ensuring that initial leakage can be detected in time. The absorption area 4 blocks the flow of leaking liquid metal by controlling the oxidation reaction, forming redundant protection against leakage. Through the collaborative design of multiple functional areas, the overall structure can effectively achieve liquid metal sealing and leakage prevention, avoiding serious risks such as equipment damage and business interruption caused by liquid metal leakage, and significantly improving the reliability and safety of the encapsulation structure and downstream equipment operation.

[0048] Furthermore, in a specific implementation, in the liquid metal encapsulation structure provided in the embodiments of the present invention, the superhydrophobic reflux region 2 may include a superhydrophobic structure and a reflux structure; the superhydrophobic structure is used to cause the liquid metal overflowing from the liquid metal filling region 1 to agglomerate into droplets under the action of surface hydrophobicity; the reflux structure is used to guide the agglomerated liquid metal to flow back inward under the action of gravity, so that the agglomerated liquid metal flows back to the liquid metal filling region 1.

[0049] In implementation, the superhydrophobic recirculation region 2 effectively manages the overflowing liquid metal through the coordinated operation of the superhydrophobic structure and the recirculation structure. When liquid metal overflows from the liquid metal filling region 1 and comes into contact with the surface of the superhydrophobic structure, due to the surface hydrophobicity, the liquid metal cannot spread on its surface. Instead, it spontaneously agglomerates into droplets under the action of its own surface tension. This is because the interaction force between the superhydrophobic surface and the liquid metal is extremely small, causing the liquid metal to tend to contract into a spherical shape to reduce the surface area and lower the surface energy. The recirculation structure is designed based on the principle of gravity, and this region can be set as a structure with a certain tilt angle. After the liquid metal agglomerates into droplets, under the action of gravity, these droplets will flow inward along the path set by the recirculation structure, eventually flowing back to the liquid metal filling region 1 and re-participating in the heat conduction process between the target electronic component and the heat sink. Such a superhydrophobic reflux region 2 can effectively prevent liquid metal from overflowing and spreading to other areas of the target electronic components, avoiding faults such as short circuits caused by liquid metal contacting the circuit, and greatly improving the stability of the entire heat dissipation system; and it can also make the overflowed liquid metal recirculate and reuse, ensuring that the liquid metal filling region 1 always has sufficient heat conduction medium, continuously and efficiently transferring the heat generated by the electronic components to the heat sink, maintaining good heat dissipation efficiency, and reducing the loss of liquid metal.

[0050] Furthermore, in a specific implementation, in the liquid metal encapsulation structure provided in the embodiments of the present invention, the superhydrophobic structure is a surface functionalized structure formed by processing the substrate surface of the superhydrophobic reflux region 2 and increasing the contact angle between the liquid metal and the substrate surface, thereby agglomerating the liquid metal overflowing from the liquid metal filling region 1.

[0051] Figure 5 This is a schematic diagram of the superhydrophobic recirculation region provided in an embodiment of the present invention. Figure 5 As shown, the superhydrophobic structure of the superhydrophobic reflux region 2 can increase the contact angle between the liquid metal overflowing from the liquid metal filling area and the packaging structure by processing microstructures on the surface. This reduces the hydrophilicity and increases the hydrophobicity of the region, causing the overflowing liquid metal to agglomerate into droplets instead of spreading outwards. This prevents the leakage from spreading further outwards and avoids it from flowing into critical parts of electronic components, causing short circuits and corrosion, thus ensuring stable equipment operation. It also maintains a stable amount of liquid metal, ensuring heat dissipation efficiency and reducing maintenance costs. Furthermore, it reduces the risk of personnel contact and environmental pollution, improving safety.

[0052] Figure 6 This is a schematic diagram of contact angle measurement provided in an embodiment of the present invention. Figure 6As shown, a represents the solid phase, b the liquid phase, c the gas phase, and θ the contact angle. To ensure the effectiveness of the superhydrophobic structure, this invention designs corresponding microstructures in the superhydrophobic reflow region 2 and uses chemical surface treatment to achieve a low surface energy on the substrate surface. When the contact angle θ < 90°, it is hydrophilic; when θ > 90°, it is hydrophobic.

[0053] The solid-liquid contact fraction (f), also known as the solid proportion fraction or solid-liquid interface area fraction, is a key parameter describing the ratio of the actual contact area between a solid surface and a liquid to the apparent contact area. It plays an irreplaceable fundamental role in superhydrophobic surface design, quantitative analysis of material wettability, and control of interfacial behavior. Geometrically, the solid-liquid contact fraction (f) is expressed as f = actual solid-liquid contact area / apparent contact area. Its value ranges from 0 to f ≤ 1, directly corresponding to two extreme wetting states of the solid-liquid interface: when f = 1, the liquid completely covers and contacts the solid surface, with no air layer present. This state perfectly matches the Wenzel wetting model, where the liquid is either fully spread or tightly adhered to the solid surface; when f = 0, the liquid and solid surface are completely isolated by a continuous air layer, representing an ideal Cassie-Baxter wetting state, where the liquid merely floats above the microstructure of the solid surface without actual contact. In practical engineering applications of superhydrophobic surfaces, to ensure a stable surface contact angle greater than 150° (the core criterion for superhydrophobic surfaces), the solid-liquid contact fraction (f) can be controlled to be less than 0.08 (i.e., 8%). This threshold is a key indicator for balancing surface hydrophobicity and structural stability. From the perspective of interfacial physics, the apparent contact angle of a rough surface (f) The intrinsic contact angle (θ) and solid-liquid contact fraction (f) of a solid flat surface satisfy the classical interfacial thermodynamic relationship, expressed as:

[0054] ;

[0055] The above formula can be used to further derive the mechanism by which the solid-liquid contact fraction (f) regulates the surface hydrophobicity: the smaller the f value, the thicker and more uniformly distributed the air layer trapped by the microstructure of the solid surface, the more significant the suspension effect of the liquid on the surface, and the stronger the interface hydrophobicity; conversely, the larger the f value, the easier it is for the liquid to overcome the surface tension and penetrate into the interior of the solid surface microstructure, leading to the rupture of the air layer, which in turn causes a decrease in surface hydrophobicity, and in severe cases, it can cause the superhydrophobic performance to completely fail.

[0056] Furthermore, in specific implementation, in the liquid metal packaging structure provided in the embodiments of the present invention, the superhydrophobic structure can be formed by laser ablation of the pretreated metal surface to form a microstructure, followed by surface nickel plating or surface passivation treatment, and then immersing it in a pre-configured surface free energy solution for a set time period, and then taking it out and air drying it naturally.

[0057] In practice, the fabrication process of superhydrophobic structures involves using laser ablation to create microstructures on a pure copper surface, followed by immersion in a prepared low surface energy solution to achieve a stable hydrophobic surface. Specifically, this process may include the following steps:

[0058] First, the pretreated pure copper surface is placed under a laser for ablation. Figure 7 This is a schematic diagram of a laser ablation pattern provided in an embodiment of the present invention. Figure 7 As shown, the pattern on the pure copper surface after laser ablation can be an array of square patterns. Next, ultrasonic cleaning and drying are performed. Then, the pure copper undergoes surface treatment to prevent corrosion caused by prolonged contact with liquid metal. There are two main surface treatment options: nickel plating and passivation. Nickel plating forms a dense physical barrier on the copper surface, isolating it from direct contact with liquid metal. Furthermore, nickel spontaneously forms a passivation film, such as nickel oxide, in the air, further inhibiting the penetration of corrosive media. The nickel plating layer thickness can be greater than 50 micrometers. Surface passivation involves treatment with nitric acid and phosphate to generate a dense oxide film (such as cuprous oxide) on the copper surface. This approach blocks the corrosion path of liquid metal to copper at the chemical reaction level. The two methods can be flexibly selected according to the actual application scenario (such as cost and process complexity), providing reliable anti-corrosion protection for long-term contact between pure copper substrate and liquid metal, and avoiding system failure and increased maintenance costs caused by corrosion.

[0059] The preparation process of the low surface energy solution can include: mixing a 97% concentration 1H,1H,2H,2H-tridecylfluoro-N-octylsilane solution with anhydrous ethanol at a ratio of 1:100, and then magnetically stirring at room temperature for 6 hours. This ratio and process can ensure that the solution composition is uniform and stable, laying the foundation for subsequent hydrophobic surface construction. The preparation of the hydrophobic functional surface adopts a combination of microstructure construction and low surface energy modification. First, microstructures are processed on the pure copper surface by laser ablation to increase the surface roughness and enhance the hydrophobic potential. Then, the pure copper substrate is immersed in the above low surface energy solution at room temperature for 1 hour. After natural air drying, the low surface energy material will adhere to the microstructure surface. The two work together to give the pure copper surface stable hydrophobic properties, meeting the surface wettability requirements of scenarios such as superhydrophobic reflow regions.

[0060] In addition, the superhydrophobic reflux region 2 can be made of high thermal conductivity metals such as pure copper. The copper substrate not only undertakes the hydrophobic reflux function, but also plays an excellent role in thermal conductivity, which plays a role in temperature equalization between the chip and the heat sink. It can quickly conduct the high heat generated locally by the chip to a larger area of ​​the heat sink, eliminate the phenomenon of local heat concentration, avoid the heat dissipation efficiency bottleneck caused by excessive hot spot temperature, and thus further improve the thermal management capability of the entire heat dissipation system.

[0061] Furthermore, in a specific implementation, in the liquid metal encapsulation structure provided in the embodiments of the present invention, the superhydrophobic structure may include cuboid air column microstructures arranged in an array; the column width of each cuboid air column microstructure ranges from 10 micrometers to 20 micrometers; the distance between two adjacent cuboid air column microstructures ranges from 20 micrometers to 40 micrometers; and the height of each cuboid air column microstructure ranges from greater than or equal to 40 micrometers.

[0062] Figure 8 This is a schematic diagram of a cuboid air column microstructure provided in an embodiment of the present invention. Figure 8 As shown, the superhydrophobic microstructure in the superhydrophobic recirculation region 2 adopts an array of cuboid air column microstructures. The main control parameters include column width (W), column spacing (D), and column height (H). Table 1 shows the key geometric parameters of the cuboid air column microstructure, their preferred value ranges, and their mechanisms of action.

[0063] Table 1. Key Geometric Parameter Control of Rectangular Air Columns

[0064]

[0065] Among them, the following must be satisfied: .

[0066] As shown in the above equation, the f-value can be reduced by increasing the D / W ratio (i.e., the ratio of the spacing to the column width), allowing the liquid metal to suspend on the air cushion. In other words, the column width (W) and column spacing (D) are the core geometric parameters determining the solid-liquid contact fraction (f) and wetting behavior. These parameters directly affect the state of the liquid metal on the surface through changes in the D / W ratio. For the same apparent area, a wider column spacing (D) or a smaller column width (W) increases the proportion of air in the microstructure and decreases the proportion of solid area (the top of the column). This reduces the actual solid area that the liquid metal can contact, ultimately leading to a decrease in the f-value. When the f-value decreases to 0.08, the gaps in the surface microstructure trap a large amount of air, forming a stable air cushion. At this point, the liquid metal no longer penetrates into the microstructure gaps (i.e., it does not enter the Wenzel state) but suspends above the air cushion, only making small-area contact with the top of the column, forming a solid-liquid-gas three-phase interface state—the Cassie-Baxter state. In this state, the air cushion acts as an isolation layer, significantly reducing direct contact between the liquid metal and the solid surface. This not only prevents the liquid metal from corroding the solid substrate, but also ensures the fluidity of the liquid metal on the surface and the functional stability of the system by relying on the low thermal conductivity and hydrophobic effect of air.

[0067] Furthermore, in a specific implementation, in the liquid metal encapsulation structure provided in the embodiments of the present invention, the reflux structure can be located at the bottom of the superhydrophobic reflux region 2; the reflux structure is a slope-shaped structure with a continuously decreasing height along the liquid metal reflux path.

[0068] In practice, the structure at the bottom of the superhydrophobic reflux zone 2 can be inclined, with an overall structure that is lower on the inside and higher on the outside. The inner side (the side closer to the liquid metal filling zone 1) is lower, and the outer side (the side closer to the leakage detection zone 3) is higher. This inclined structure provides a gravity flow tendency for the liquid metal, and uses gravity to make the liquid metal reflux and prevent the leakage from spreading further. Figure 9 This is a schematic diagram of the overall superhydrophobic reflow region, showing a lower inner slope and a higher outer slope, provided in an embodiment of the present invention. Figure 9 As shown, the recirculation structure of the superhydrophobic recirculation zone 2 is a slope-like shape with a continuously decreasing height along the recirculation path of the agglomerated liquid metal. Its bottom surface gradually rises from the liquid metal filling zone 1 towards the direction away from that zone, forming an elevation difference between the liquid metal filling zone 1 and the surrounding area, thus creating a directional flow channel. This slope-like shape constructs a gravity-guided gradient through a preset inclination, utilizing the gravitational potential energy of the agglomerated liquid metal to guide its flow along the slope towards the liquid metal filling zone 1, achieving directional recirculation. Figure 9As shown, the slope α of the reflux structure can be between 0 and 5°. The presence of a slight slope allows the leaked liquid metal to flow back, which avoids the structural instability caused by an excessively large slope or the liquid metal flowing too fast and causing splashing, while ensuring that the slight slope can provide sufficient gravity driving force for the liquid metal.

[0069] Furthermore, in a specific implementation, in the liquid metal encapsulation structure provided in the embodiments of the present invention, the leakage detection area 3 may include a detection electrode; the detection electrode is used to detect whether the superhydrophobic reflux area 2 leaks liquid metal, and when a physical contact signal corresponding to the liquid metal is detected, the physical contact signal is converted into an electrical signal and an alarm is triggered by the circuit.

[0070] Figure 10 This is a schematic diagram of the leakage detection area provided in an embodiment of the present invention. In implementation, as... Figure 10 As shown, the leakage detection area 3 may include a detection electrode. This detection electrode is a sensing element in the liquid metal heat dissipation structure that detects leakage risk and triggers safety alarms, providing real-time and reliable monitoring support for leakage protection. When liquid metal leaks into the detection electrode area due to factors such as failure of the superhydrophobic reflux zone or extreme operating conditions, the good conductivity of the liquid metal will cause it to form physical contact with the detection electrode. At this time, the electrode will capture this physical contact signal (such as the resistance change or capacitance change caused by the conduction of liquid metal between the electrodes, or the conductivity change caused by the liquid metal covering the electrode surface), and convert this physical signal into an electrical signal (such as a current signal or voltage signal) that can be recognized by the circuit through the built-in signal conversion module. Subsequently, the electrical signal is transmitted to the system control unit through the circuit. If the signal strength or change amplitude reaches the preset leakage judgment threshold, the control unit will immediately trigger the alarm mechanism (such as audible and visual alarms, equipment management system background alarms, or even linkage equipment load reduction or shutdown) to achieve timely early warning of leakage risk.

[0071] Furthermore, in a specific implementation, in the liquid metal encapsulation structure provided in the embodiments of the present invention, an indium tin alloy layer is provided on the surface of the detection electrode; the indium tin alloy layer is used to adjust the contact resistance of the interface between the detection electrode and the liquid metal, and to adjust the surface tension of the liquid metal.

[0072] It should be noted that the main function and purpose of the leak detection zone is to detect and alarm on liquid metal that has seeped into the zone as the leak area expands further outward. Traditional copper and aluminum substrates have significant limitations due to their inherent material properties, making it difficult to meet the requirements for high-precision and high-reliability leak detection, specifically in terms of corrosion resistance, detection sensitivity, and signal stability. From the perspective of corrosion and oxidation risk, gallium-based liquid metals (such as gallium Ga and gallium indium tin Ga-In-Sn alloys) have strong reducing properties and readily undergo displacement reactions when in contact with copper and aluminum: copper digabide will form on the surface of the copper substrate. Intermetallic compounds can cause pitting defects on the electrode surface, accompanied by increased resistivity, weakening the electrode's conductivity. In humid environments, aluminum substrates react with gallium to form aluminum hydroxide and release hydrogen gas, accelerating substrate structural degradation and shortening electrode lifespan. Regarding detection sensitivity, copper (approximately 1.1 N / m) and aluminum (approximately 0.8 N / m) have high surface tensions, while liquid metals (such as gallium-based alloys) have surface tensions approximately 10 times that of water. Under the interaction of these two factors, liquid metals on copper and aluminum electrode surfaces tend to shrink into spherical droplets, making it difficult to spread and form a continuous liquid film. This results in the electrode failing to effectively contact the liquid metal to form a conductive path in the event of a small leak, significantly increasing the false negative rate. From a signal stability perspective, copper and aluminum form a galvanic cell structure upon contact with liquid metal, generating parasitic current interference. This disrupts the accuracy of resistance and capacitance signals during leak detection, easily leading to false alarms and affecting the system's judgment of the leak status. Therefore, this invention improves electrode performance from multiple dimensions by coating the detection electrode surface with an indium-tin alloy (such as indium-tin alloy or gallium-indium-tin alloy). Regarding conductivity and response speed, indium-tin alloys exhibit superior conductivity compared to single metals like pure indium or pure tin. Furthermore, the coating effectively reduces the contact resistance at the electrode-liquid metal interface, accelerating the current response speed when leakage occurs and enhancing the sensitivity of the detection signal. In terms of surface wettability control, the addition of indium significantly reduces the surface tension of the alloy coating (significantly lower than copper or aluminum, and compatible with the characteristics of liquid metal), allowing the coating to uniformly cover the electrode surface. This prevents the liquid metal from shrinking into spheres due to surface tension mismatch, reducing detection blind spots. Simultaneously, the low surface tension promotes rapid wetting of trace amounts of liquid metal on the electrode surface, forming a continuous conductive path. This ensures that even a small amount of leakage triggers a significant change in resistance or capacitance signals, greatly reducing the false negative rate. In addition, the indium tin alloy coating can also act as a physical barrier to isolate the electrode substrate from direct contact with the liquid metal, suppress the occurrence of displacement reaction and galvanic cell effect, improve the corrosion resistance of the electrode, avoid the interference of parasitic current on the detection signal, ensure the accuracy and stability of leakage detection, and provide reliable detection support for the safe operation of liquid metal heat dissipation structure.

[0073] Furthermore, in a specific implementation, in the liquid metal packaging structure provided in the embodiments of the present invention, the leakage detection area 3 has a groove; the detection electrode is integrated in the groove of the leakage detection area 3; the detection electrode is a leakage detection line or a leakage detection film.

[0074] In implementation, the leakage detection zone 3 can be equipped with a trench. This trench serves as a directional guide structure for the liquid metal, physically collecting the liquid metal leaking from the superhydrophobic reflux zone 2. When the liquid metal breaks through the reflux zone, it will spontaneously flow into the trench and along its path due to gravity and the constraint of the trench sidewalls. This prevents the liquid metal from randomly spreading and dispersing into tiny droplets on the surface of the detection zone, ensuring that the leakage is concentrated in the detection area. The detection electrode (leakage detection line or leakage detection membrane) is not exposed on the surface of the detection zone but is integrated inside the trench. This embedded design allows the electrode to directly contact the liquid metal collected in the trench. Figure 11 This is a schematic diagram of the leakage detection line provided in an embodiment of the present invention. The leakage detection line 5 can be a flexible conductive line, laid along the length of the trench to cover the entire trench area. The leakage detection film can be a thin conductive film material, such as a flexible printed circuit board (FPC), which is attached to the inner wall of the trench to form a planar detection area. The two electrode forms can be flexibly selected according to the trench size and detection accuracy requirements.

[0075] Furthermore, in a specific implementation, in the liquid metal encapsulation structure provided in the embodiments of the present invention, the absorption region 4 may include an anodic oxide layer; the anodic oxide layer is used to oxidize the liquid metal leaking from the leakage detection region 3 to generate a solid oxide, so as to form a solid film at the contact interface between the liquid metal and the anodic oxide layer.

[0076] Figure 12 This is a schematic diagram of the absorption region provided in an embodiment of the present invention. Figure 12 As shown, the absorption region 4 includes an anodic oxide layer. This anodic oxide layer is a functional protective layer formed by anodizing its surface. It can oxidize the liquid metal leaking from the leakage detection region 3 into a solid oxide, forming a dense solid film at the interface between the two, thus physically blocking the flow of liquid metal. Specifically, the surface of the absorption region 4 can be anodized to generate porous alumina. Layer, when gallium-based or other liquid metals come into contact with porous During the layering process, under the catalysis of alumina and the interfacial reaction, gallium in the liquid metal is rapidly oxidized to form solid gallium oxide. Thin film. This solid film is formed directly at the interface between the liquid metal and the anodic oxide layer. It adheres tightly to the surface of the anodic oxide layer and is also tightly bonded to the incompletely oxidized liquid metal. This fixes the originally fluid liquid metal into a solid or semi-solid state, preventing it from breaking through the absorption zone and spreading to other core areas of the electronic device. It completely eliminates the risk of short circuits and corrosion caused by the flow of liquid metal. Moreover, the reaction rate is moderate, so that it will not cause violent reactions due to excessively rapid oxidation, resulting in local overheating, nor will it leave flow hazards due to insufficient oxidation, ensuring a stable and reliable blocking effect.

[0077] Furthermore, in a specific implementation, the liquid metal packaging structure provided in the embodiments of the present invention may further include: an inner sealing ring located around the target electronic component; the inner sealing ring, the target electronic component, and the heat sink forming a liquid metal-filled cavity; and the area inside the liquid metal-filled cavity being the liquid metal-filled area 1.

[0078] In implementation, the central core of the liquid metal encapsulation structure can be the target electronic component, and the upper region of the target electronic component is the liquid metal coating area, such as... Figure 2 As shown, an inner sealing ring 6 can be provided around the target electronic component. The inner sealing ring 6, the target electronic component, and the heat sink are in close contact to form a liquid metal-filled cavity. The inner sealing ring 6 is the first barrier to prevent liquid metal from overflowing. Figure 13 This is a schematic diagram of the structure of the inner sealing ring provided in an embodiment of the present invention, as shown below. Figure 13 As shown, the inner sealing ring 6 can form a closed liquid metal filling cavity by cooperating with the heat sink around the target electronic component. This prevents unexpected leakage of liquid metal due to vibration and temperature changes during system operation, ensures that the liquid metal filling area 1 always has sufficient and evenly distributed heat-conducting medium, and the closed filling cavity can isolate external environmental interference and prevent impurities such as water vapor and dust in the air from entering the cavity and contacting the liquid metal.

[0079] Furthermore, in a specific implementation, in the liquid metal packaging structure provided in the embodiments of the present invention, the inner ring sealing surface of the superhydrophobic reflux region 2 forms a sealing structure with the inner layer sealing ring.

[0080] In implementation, the outer periphery of the inner sealing ring 6 is the superhydrophobic reflux zone 2. The inner ring area in the middle of the superhydrophobic reflux zone 2 is tightly fitted with the inner sealing ring to form a sealing structure. That is, an auxiliary seal is added at the boundary between the liquid metal filling zone 1 and the superhydrophobic reflux zone 2, which can effectively intercept the trace leakage caused by long-term wear, aging or assembly deviation of the inner sealing ring, reduce the contact between the liquid metal and the external environment, and at the same time avoid the superhydrophobic surface of the superhydrophobic reflux zone 2 from performance loss due to direct contact with the liquid metal of the liquid metal filling zone 1.

[0081] Furthermore, in a specific implementation, the liquid metal encapsulation structure provided in the embodiments of the present invention may further include: an outer sealing ring located around the absorption region 4; the outer sealing ring is used to block the liquid metal treated by the absorption region 4.

[0082] Figure 14 This is a schematic diagram of the structure of the outer sealing ring provided in an embodiment of the present invention, as shown below. Figure 14As shown, the outer sealing ring 7 can serve as the outermost protective sealing component of the liquid metal heat dissipation structure. Through its layout located around the absorption zone 4, it forms the last physical barrier to the liquid metal after it has been treated in the absorption zone, and can completely intercept any remaining liquid metal that has not been completely treated in the absorption zone 4.

[0083] Based on the same inventive concept, embodiments of the present invention also provide a method for manufacturing a liquid metal encapsulation structure. Figure 15 A flowchart illustrating the fabrication method of the liquid metal encapsulation structure provided in an embodiment of the present invention. Figure 15 As shown, the manufacturing method may include:

[0084] S1. Place the target electronic component in the preset mounting position on the substrate and cover the target electronic component with a heat sink; leave a gap between the heat sink and the target electronic component for filling with liquid metal.

[0085] In implementation, an insulating substrate (such as ceramic or high-temperature resistant resin) adapted to the size of the target electronic component can be selected as the basic carrier layer of the encapsulation structure. Oil, dust, and other impurities on the substrate surface are removed by wiping with alcohol and ultrasonic cleaning, followed by drying in an oven at 80℃ to 100℃ to ensure the substrate surface is clean and dry. The target electronic component is fixed to the pre-set mounting position on the substrate (thermal conductive adhesive can be used to assist in bonding, ensuring a tight fit between the component and the substrate). The heat sink is then precisely placed over the surface of the target electronic component and secured with screws or clips, ensuring a gap between the heat sink and the electronic component to accommodate the amount of liquid metal filling, thus completing the positioning of the heat dissipation assembly.

[0086] S2. Liquid metal is filled into the gap between the heat sink and the target electronic component to form a liquid metal filling area.

[0087] In practice, an inner sealing ring can be used to enclose a sealed liquid metal filling area around the gap between the heat sink and the target electronic component. The amount of liquid metal to be used is calculated according to the power to be dissipated, and the liquid metal is filled into the liquid metal filling area to ensure that the liquid metal completely fills the gap without any air bubbles remaining, thus completing the fabrication of the liquid metal filling area.

[0088] S3. A superhydrophobic reflux zone is formed around the liquid metal filling area. The superhydrophobic reflux zone is used to agglomerate the liquid metal overflowing from the liquid metal filling area based on its hydrophobicity and guide the agglomerated liquid metal to flow back.

[0089] In implementation, a superhydrophobic reflow zone is planned on the outer substrate surface, with the sealed frame of the liquid metal filling area as the inner boundary. The pretreated pure copper surface is placed under a laser for ablation, followed by surface treatment of the pure copper, namely surface nickel plating and surface passivation. Then, a solution is prepared according to a low surface energy solution preparation method (e.g., mixing 97% 1H,1H,2H,2H-tridecylfluoro-N-octylsilane solution with anhydrous ethanol at a ratio of 1:100 and stirring at room temperature for 6 hours). The substrate is immersed in the solution at room temperature for 1 hour, then removed and air-dried naturally, forming a superhydrophobic coating on the substrate surface of the superhydrophobic reflow zone. Simultaneously, on the side of the superhydrophobic reflow zone near the filling area, a tiny inclined guide channel is created using laser etching technology to guide the agglomerated liquid metal back to the liquid metal filling area, completing the fabrication of the superhydrophobic reflow zone.

[0090] S4. A leakage detection zone is formed around the superhydrophobic reflux zone; the leakage detection zone is used to detect liquid metal leaking from the superhydrophobic reflux zone and trigger an alarm.

[0091] In implementation, a leakage detection zone (with a width matching the reflow zone) is planned around the superhydrophobic reflux zone. A conductive layer (such as a copper layer) and an indium tin alloy plating layer are sequentially deposited on the substrate surface of the leakage detection zone using magnetron sputtering technology to form a detection electrode. The detection electrode is then connected to an external signal processing module (such as a resistance / capacitance detection circuit or an alarm device) via wires. The electrode conductivity and signal sensitivity are tested by energizing the device (simulating liquid metal dripping and confirming that changes in resistance / capacitance can trigger an alarm), thus completing the fabrication of the leakage detection zone.

[0092] S5. An absorption zone is formed around the leakage detection zone; the absorption zone is used to control the oxidation reaction of liquid metal leaking from the leakage detection zone, so as to block the flow of liquid metal in the absorption zone.

[0093] In implementation, an absorption zone (slightly wider than the leakage detection zone) is planned around the leakage detection zone. Aluminum foil is selected and cut to fit the shape of the absorption zone. The aluminum foil is then bonded to the surface of the substrate in the absorption zone, and an anodizing process is used to create porous surfaces on the aluminum foil. Layer. Passivation treatment is applied to the surface of the anodized aluminum foil to enhance porosity. Layer stability; finally, an outer sealing ring can be installed on the outermost edge of the absorption area to ensure a tight fit with the surrounding structure, thus completing the fabrication and assembly of the entire liquid metal encapsulation structure.

[0094] In the method for manufacturing the liquid metal encapsulation structure provided in this embodiment of the invention, the liquid metal encapsulation structure can be manufactured by performing the above steps. The liquid metal filling area can stably fill the space between the target electronic component and the heat sink, reducing the initial risk of leakage while ensuring heat dissipation. The superhydrophobic reflux area uses hydrophobicity to agglomerate the overflowing liquid metal and guide it back, reducing the outward diffusion of leakage from the source and lowering the pressure of subsequent prevention and control. The leakage detection area detects the liquid metal leaking from the superhydrophobic reflux area and triggers an alarm, realizing active real-time monitoring of leakage and ensuring that initial leakage can be detected in a timely manner. The absorption area blocks the flow of leaking liquid metal by controlling the oxidation reaction, forming redundant protection against leakage. This effectively achieves liquid metal sealing and leakage prevention, avoiding serious risks such as equipment damage and business downtime caused by liquid metal leakage, and significantly improving the reliability and safety of the encapsulation structure and downstream equipment operation.

[0095] Since the embodiments of the method for fabricating the liquid metal packaging structure correspond to the embodiments of the liquid metal packaging structure itself, the descriptions of the features in the embodiments corresponding to the method for fabricating the liquid metal packaging structure can be found in the relevant descriptions of the embodiments corresponding to the liquid metal packaging structure, and will not be repeated here. Furthermore, it has the same beneficial effects as the liquid metal packaging structure mentioned above.

[0096] Furthermore, in a specific implementation, in the above-mentioned method for fabricating the liquid metal encapsulation structure provided in this embodiment of the invention, the superhydrophobic recirculation region may include a superhydrophobic structure and a recirculation structure; the superhydrophobic structure, under the effect of surface hydrophobicity, causes the liquid metal overflowing from the liquid metal filling region to agglomerate into droplets; the recirculation structure guides the agglomerated liquid metal to flow back inwards through gravity, allowing the agglomerated liquid metal to flow back to the liquid metal filling region. The superhydrophobic structure is a surface functionalized structure formed by processing the substrate surface of the superhydrophobic recirculation region and increasing the contact angle between the liquid metal and the substrate surface, thereby causing the liquid metal overflowing from the liquid metal filling region to agglomerate. Furthermore, the superhydrophobic structure may be formed by laser ablation of a pretreated metal surface to form a microstructure, followed by surface nickel plating or surface passivation, and then immersing it in a pre-prepared surface free energy solution for a set time period, followed by natural air drying. The superhydrophobic structure can include an array of cuboid air column microstructures; the width of each cuboid air column microstructure ranges from 10 micrometers to 20 micrometers; the distance between two adjacent cuboid air column microstructures ranges from 20 micrometers to 40 micrometers; and the height of each cuboid air column microstructure is greater than or equal to 40 micrometers. The recirculation structure can be located at the bottom of the superhydrophobic recirculation region; the recirculation structure has a slope-like shape with continuously decreasing height along the liquid metal recirculation path.

[0097] Furthermore, in a specific implementation, in the method for fabricating the liquid metal encapsulation structure provided in the embodiments of the present invention, the leakage detection area may include a detection electrode; the detection electrode can detect whether liquid metal is leaking from the superhydrophobic reflux region, and when a physical contact signal corresponding to the liquid metal is detected, the physical contact signal is converted into an electrical signal and an alarm is triggered by the circuit. An indium tin alloy layer is disposed on the surface of the detection electrode; the indium tin alloy layer can adjust the contact resistance of the interface between the detection electrode and the liquid metal, and adjust the surface tension of the liquid metal. The leakage detection area has a trench; the detection electrode is integrated in the trench of the leakage detection area; the detection electrode is a leakage detection line or a leakage detection film.

[0098] Furthermore, in a specific implementation, in the above-mentioned method for manufacturing the liquid metal encapsulation structure provided in the embodiments of the present invention, the absorption region may include an anodic oxide layer; the anodic oxide layer can oxidize the liquid metal leaking from the leakage detection region to generate a solid oxide, so as to form a solid film at the contact interface between the liquid metal and the anodic oxide layer.

[0099] Furthermore, in a specific implementation, the method for manufacturing the liquid metal packaging structure provided in the embodiments of the present invention may further include: forming an inner sealing ring around the target electronic component; the inner sealing ring, the target electronic component, and the heat sink forming a liquid metal-filled cavity; and the area inside the liquid metal-filled cavity being a liquid metal-filled area.

[0100] Furthermore, in a specific implementation, the method for manufacturing the liquid metal encapsulation structure provided in the embodiments of the present invention may further include: forming an outer sealing ring around the absorption region; the outer sealing ring can block the liquid metal treated by the absorption region 4.

[0101] Based on the same inventive concept, embodiments of the present invention also provide an electronic device including the above-described liquid metal encapsulation structure. Since the principle by which this electronic device solves the problem is similar to that of the above-described liquid metal encapsulation structure, the implementation of this electronic device can refer to the implementation of the above-described liquid metal encapsulation structure; repeated details will not be elaborated further.

[0102] The present invention has provided a detailed description of a liquid metal packaging structure, its manufacturing method, and electronic device. Specific examples have been used to illustrate the principles and implementation methods of the invention. The descriptions of these embodiments are only intended to aid in understanding the method and core ideas of the invention. It should be noted that those skilled in the art can make various improvements and modifications to the invention without departing from its principles, and these improvements and modifications also fall within the protection scope of the invention.

Claims

1. A liquid metal encapsulation structure, characterized in that, include: Liquid metal filling area, used to fill the space between the target electronic component and the heat sink with liquid metal; The heat sink covers the target electronic component; An inner sealing ring is located around the target electronic component; the inner sealing ring, the target electronic component, and the heat sink form a liquid metal-filled cavity; the area inside the liquid metal-filled cavity is the liquid metal-filled area; The superhydrophobic reflux zone is located outside the liquid metal filling zone. It is used to agglomerate the liquid metal overflowing from the liquid metal filling zone based on its hydrophobicity and guide the agglomerated liquid metal to flow back. The leakage detection area, located outside the superhydrophobic reflux area, is used to detect liquid metal leaking from the superhydrophobic reflux area and trigger an alarm. The absorption zone, located outside the leakage detection zone, is used to control the oxidation reaction of liquid metal leaking from the leakage detection zone, thereby blocking the flow of liquid metal in the absorption zone.

2. The liquid metal packaging structure according to claim 1, characterized in that, The superhydrophobic reflow region includes a superhydrophobic structure and a reflow structure; The superhydrophobic structure is used to cause the liquid metal overflowing from the liquid metal filling area to agglomerate into droplets under the action of surface hydrophobicity; The reflux structure is used to guide the agglomerated liquid metal to flow back inward by gravity, so that the agglomerated liquid metal flows back to the liquid metal filling area.

3. The liquid metal packaging structure according to claim 2, characterized in that, The superhydrophobic structure is a surface functionalized structure formed by processing the substrate surface of the superhydrophobic reflux region and increasing the contact angle between the liquid metal and the substrate surface, thereby enabling the liquid metal overflowing from the liquid metal filling region to agglomerate.

4. The liquid metal packaging structure according to claim 3, characterized in that, The superhydrophobic structure is formed by laser ablation of a pretreated metal surface to create a microstructure, followed by surface nickel plating or passivation, and then immersion in a pre-prepared surface free energy solution for a set time period before being removed and air-dried.

5. The liquid metal packaging structure according to claim 2, characterized in that, The superhydrophobic structure includes cuboid air column microstructures arranged in an array; The column width of each of the aforementioned cuboid air column microstructures ranges from 10 micrometers to 20 micrometers; The distance between two adjacent cuboid air column microstructures ranges from 20 micrometers to 40 micrometers; The height range of each of the aforementioned cuboid air column microstructures is greater than or equal to 40 micrometers.

6. The liquid metal packaging structure according to claim 2, characterized in that, The reflux structure is located at the bottom of the superhydrophobic reflux zone; The reflux structure is a slope-shaped structure with a continuously decreasing height along the reflux path of the liquid metal.

7. The liquid metal packaging structure according to claim 1, characterized in that, The leakage detection area includes detection electrodes; The detection electrode is used to detect whether liquid metal is leaking in the superhydrophobic reflux region. When a physical contact signal corresponding to the liquid metal is detected, the physical contact signal is converted into an electrical signal and an alarm is triggered by the circuit.

8. The liquid metal packaging structure according to claim 7, characterized in that, The surface of the detection electrode is provided with an indium tin alloy layer; The indium-tin alloy layer is used to adjust the contact resistance between the detection electrode and the liquid metal interface, and to regulate the surface tension of the liquid metal.

9. The liquid metal packaging structure according to claim 7, characterized in that, The leakage detection area has grooves; the detection electrode is integrated within the grooves of the leakage detection area. The detection electrode is a leakage detection line or a leakage detection membrane.

10. The liquid metal packaging structure according to claim 1, characterized in that, The absorption region includes an anodic oxide layer; The anodic oxide layer is used to oxidize the liquid metal leaking from the leakage detection area to generate a solid oxide, thereby forming a solid film at the interface between the liquid metal and the anodic oxide layer.

11. The liquid metal packaging structure according to claim 1, characterized in that, The inner sealing surface of the superhydrophobic reflux zone forms a sealing structure with the inner sealing ring.

12. The liquid metal packaging structure according to claim 1, characterized in that, Also includes: The outer sealing ring is located around the absorption area; The outer sealing ring is used to block the liquid metal processed by the absorption zone.

13. A method for manufacturing a liquid metal encapsulation structure as described in any one of claims 1 to 12, characterized in that, include: The target electronic component is placed in a preset mounting position on the substrate, and a heat sink is placed over the target electronic component. A gap is reserved between the heat sink and the target electronic component for filling with liquid metal; An inner sealing ring is formed around the target electronic component; the inner sealing ring, the target electronic component, and the heat sink form a liquid metal-filled cavity; Liquid metal is filled into the gap between the heat sink and the target electronic component to form a liquid metal filling area; the area inside the cavity filled with liquid metal is the liquid metal filling area; A superhydrophobic reflux zone is formed around the liquid metal filling area; the superhydrophobic reflux zone is used to agglomerate the liquid metal overflowing from the liquid metal filling area based on its hydrophobicity, and to guide the agglomerated liquid metal backflow. A leakage detection zone is formed around the superhydrophobic reflux zone; the leakage detection zone is used to detect liquid metal leaking from the superhydrophobic reflux zone and trigger an alarm. An absorption zone is formed around the leakage detection zone; the absorption zone is used to control the oxidation reaction of liquid metal leaking from the leakage detection zone, so as to block the flow of liquid metal in the absorption zone.

14. An electronic device, characterized in that, Includes the liquid metal encapsulation structure as described in any one of claims 1 to 12.

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