Electronic input / output device with improved heat dissipation

Abstract

The invention relates to an input / output electronic device (100) with improved heat dissipation for a pump and / or pumping system, the input / output electronic device (100) comprising: an electronic control board (2) having a plurality of components (21) and one or more vias (23); a heat sink (3) configured to dissipate heat generated by the electronic control board (2); a thermally conductive insulating element (6) interposed between the electronic control board (2) and the heat sink (3) in order to enhance the transfer of heat emitted from the via (23) in the direction of the heat sink (3), in which the component (21) is arranged on a surface of the electronic control board (2) opposite the surface facing the heat sink (3).

Description

[0001] The present invention relates to an electronic input / output device, and in particular to an electronic input / output device with improved heat dissipation with respect to current. Technical Field

[0002] The present invention belongs to the technical field of electronic devices for pumps and pumping systems, in particular to the technical field of electronic devices for controlling the input and output of electric current, such as inverters or similar devices. Background Art

[0003] It is known in the industry that pumping systems, and pumps in particular, require electronic input / output devices such as current inverters or converters in order for them to function correctly.

[0004] Although these devices are generally known in any electronic field and industry, they still have some limitations when applied to pumps or pumping systems.

[0005] These limitations are due to the need to create such electronic input / output devices according to specific size or positioning constraints of components.For example, conventional electronic input / output devices are limited by the size and placement of the electronic control board located within them.

[0006] These constraints also relate to the specific and necessary arrangement that the components of the electronic board must adopt in order to guarantee the proper functioning of the electronic input / output device with regard to parameters such as heat dissipation and electromagnetic radiation.

[0007] However, other disadvantages are related to the lack of compactness of the internal components of the electronic input / output device, thus leading to an increase in size and overall dimensions.

[0008] Conventional electronic input / output devices also have some disadvantages due to their assembly and installation.

[0009] In more detail, currently securing and connecting the internal components of these devices, such as electronic boards and dissipators, is complex and not very repeatable.

[0010] In fact, according to the prior art, the electronic board and the heat sink, due to their layout, must be fixed by means of fastening elements positioned manually by the user assembling the components, making these operations more expensive, less repeatable and not possible to automate.

[0011] Another limitation lies in the fact that, according to the prior art, the heat sink faces the surface of the electronic control board where the components are present, which makes assembly and disassembly of the various components even more complicated, time-consuming and labor-intensive.

[0012] This complexity forces humans to perform these actions manually in a way that cannot be automated and is not very repeatable.

[0013] This arrangement of placing the heat sink close to components of the electronic control board also complicates the placement of the electrically insulated thermal conductor on the electronic board due to the poor flatness of the surface of the electronic board facing the heat sink.

[0014] Therefore, there is a need to create electronic input / output devices, such as current inverters or converters, having improved characteristics and performance. Summary of the Invention

[0015] Therefore, an object of the present invention is to provide an electronic input / output device with improved heat dissipation, which can solve the above-mentioned drawbacks and key problems.

[0016] Another object of the present invention is to create an electronic input / output device with improved heat dissipation that is more efficient, longer lasting, and has better heat spreading than prior art devices.

[0017] A further object of the invention is to provide an electronic input / output device with improved heat dissipation, which allows the efficiency of the heat sink to be increased and the thermal resistance to be reduced.

[0018] Another object of the invention is to create an electronic input / output device with improved heat dissipation, which allows using components of the electronic board as heat sink enhancement.

[0019] A further object of the present invention is to provide an electronic input / output device with improved heat dissipation, which is easy to connect and disconnect.

[0020] Another object of the invention is to create an electronic input / output device with improved heat dissipation, which simplifies and optimizes the assembly of the components.

[0021] A further object of the present invention is to provide an electronic input / output device with improved heat dissipation, which makes the production and assembly process simpler, faster, cheaper, more repeatable and even automatic.

[0022] Another object of the invention is to create an electronic input / output device with improved heat dissipation, which simplifies the connection and fixing between the heat sink and the electronic board.

[0023] A further object of the invention is to provide an electronic input / output device with improved heat dissipation, which allows the electronic components of the electronic control board to be arranged in a more compact manner and allows the electromagnetic radiation of these components to be reduced.

[0024] Another object of the invention is to create an electronic input / output device with improved heat dissipation, which allows the electronic components of the electronic control board to be arranged on opposite sides of the heat sink, thus reducing interference.

[0025] Another object of the invention is to create an electronic input / output device with improved heat dissipation, which allows the electronic components of an electronic board to be arranged in a close position to have a single and narrow heat dissipation and radiation area.

[0026] A further object of the invention is to provide an electronic input / output device with improved heat dissipation which, by virtue of the advantages achieved, is easy and economical to manufacture.

[0027] These and other objects are achieved by an electronic input / output device with improved heat dissipation according to the appended independent claims.

[0028] Further detailed features are set forth in the attached dependent claims.

[0029] Therefore, an object of the present invention is to provide an input / output electronic device with improved heat dissipation for a pump and / or pumping system, the input / output electronic device comprising: an electronic control board having a plurality of components and one or more vias; a heat sink configured to dissipate heat generated by the electronic control board; a thermally conductive insulating element placed between the electronic control board and the heat sink to enhance the transfer of heat transferred from the vias in the direction of the heat sink, wherein one or more of the components are arranged on a surface of the electronic control board opposite to the surface facing the heat sink.

[0030] In a preferred embodiment, the through-holes in the one or more vias are filled with the same material as that of the electronic control board.

[0031] Preferably, the vias are capped.

[0032] Still, preferably, the thermally conductive insulating element is a resilient thermally conductive pad or SilPad. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The invention will now be described, for purposes of illustration and not limitation, in accordance with preferred embodiments thereof and with particular reference to the accompanying drawings, in which:

[0034] - Figure 1 is a cross-sectional view of internal components of an electronic input / output device with improved heat dissipation according to the present invention;

[0035] - Figure 2 is a top view of an electronic control board having an electronic input / output device with improved heat dissipation according to the present invention;

[0036] - Figure 3 Shown Figure 2 Details of the electronic control panel in the;

[0037] - Figure 4 is an exploded view of an electronic input / output device with improved heat dissipation according to the present invention;

[0038] - Figure 5 is a cross-sectional view of an electronic input / output device with improved heat dissipation according to the present invention;

[0039] - Figure 6A and Figure 6B are two side views of the exterior of an electronic input / output device with improved heat dissipation according to the present invention. DETAILED DESCRIPTION

[0040] With reference to the mentioned figures, preferred embodiments of the electronic input / output device with improved heat dissipation according to the invention are shown.

[0041] With reference to the above drawings, the electronic input / output device with improved heat dissipation of the present invention is indicated by reference numeral 100. In a first embodiment of the present invention, the electronic input / output device comprises: a housing 1, an electronic control board 2, and a heat dissipation member 3. The housing 1 is used to accommodate various components ( Figure 5 ).

[0042] Reference Figure 4 In a preferred embodiment, the housing 1 includes a frame 11 and a cover 12 .

[0043] Advantageously, the plate frame 11 and the cover 12 are fixed by means of suitable fastening elements 13 .

[0044] Advantageously again, the cover 12 may have an opening 15 to allow at least a portion of the heat sink 3 to escape.

[0045] Advantageously again, the board frame 11 is shaped so as to have one or more seats in which the components 21 of the electronic control board 2 are arranged.

[0046] These seats allow the electronic board 2 to be housed in a more compact manner and allow the volume of the electronic device 100 to be reduced as a whole.

[0047] In detail, the housing 1 and in particular the floor frame 11 are shaped so as to accommodate the components present on the board 2 and to support the board 2 itself so that the board 2 is as close as possible to the heat sink.

[0048] The housing 1 may further include a display 4 , which is used for allowing a user to view parameters, signals and information, and is used for controlling and managing electronic input / output devices.

[0049] exist Figure 4 and Figure 6A In the embodiment visible in FIG, the display 4 is present on the cover 12 of the housing 1 .

[0050] Advantageously, the display 4 may be placed in a portion of the housing 1 that is easily accessible to a user.

[0051] Even more advantageously, the display 4 is of the touch screen type and has a layout and interface that is highly understandable and intuitive to the user.

[0052] Refer again Figure 4 Preferably, the gasket 5 is located between the housing 1 and the heat sink 3 .

[0053] Other pads may be present in other positions depending on needs and requirements.

[0054] The heat sink 3 and the electronic control board 2 are fixed to each other by means of further fastening elements 14 .

[0055] The heat sink 3 may have protruding elements 31 that can be interlocked into corresponding holes present in the housing 1 in order to improve the fixation between the heat sink 3 and the housing 1 .

[0056] In the embodiment visible in the figures, the heat sink 3 is interlocked to the cover 12 .

[0057] In order to optimize the space, the electronic control board 2 is arranged with the component 21 facing towards the motor, ie towards the opposite side of the heat sink 3 .

[0058] Reference Figure 1 , shows a cross-section of the internal components of an electronic input / output device 100 with improved heat dissipation.

[0059] In more detail, it can be observed that there is a thermally conductive insulating element 6 between the electronic control board 2 , which has at least one component 21 emitting heat to be dissipated, and the heat sink 3 .

[0060] The thermally conductive insulating element 6 is in contact with the wall of the electronic board 2 (in particular, the wall in which the component 21 is not present) and with the heat sink 3 so as to create thermal contact between the two elements.

[0061] In a preferred embodiment of the present invention, the heat conducting insulating element 6 is a resilient heat conducting pad or SilPad.

[0062] Advantageously, the thermally conductive insulating element 6 is elastic.

[0063] Refer again Figure 2 It can be seen that the electronic board 2 has a plurality of layers 22 .

[0064] The electronic control board 2 may actually be of a single-layer or multi-layer type.

[0065] The electronic control board 2 and in particular the layer 22 are traversed by one or more vias 23 .

[0066] In the case of a multi-layer electronic board 2 , the via hole 23 may penetrate all layers of the electronic board, or the via hole 23 may be a blind hole or a buried hole 23 .

[0067] The variety of the vias 23 depends on the configuration and usage requirements of the electronic board 2 of the input / output device 100 .

[0068] In the embodiment observable in the figures, the electronic control board 2 is completely traversed from one end to the other by one or more through holes 23 .

[0069] The vias 23 not only allow the electronic connection of the layers 22 of the electronic control board 2 , but also allow the heat generated by the component 21 and other components of the device 100 to pass through the same electronic control board 2 .

[0070] The via 23 actually has a cover of a conductive metal material (eg copper) inside which there is a through hole. The metal cover material allows electrical connection between two or more stacked layers of the electronic board 2, while the through hole allows heat to pass through the electronic board 2.

[0071] In more detail, the vias 23 allow heat to be transferred through the electronic board 2 towards the heat sink 3 .

[0072] In a preferred embodiment, the vias 23 are capped to improve heat transfer.

[0073] Advantageously, by covering, the electronic board 2 can be used as a reinforcement structure for the heat sink 3 .

[0074] In another embodiment, the through-holes 23 in each via are filled with the same material as the layers of the electronic control board 2 .

[0075] This advantageously allows heat to be dissipated even in a direction transverse to the via 23 itself.

[0076] The thermally conductive insulating element 6 also facilitates heat transfer to the heat sink 3 while preventing electronic conduction.

[0077] Advantageously, the thermally conductive insulating element 6 also allows filling the spaces present on the surface of the electronic board 2 facing the heat sink 3 , thus compensating for unevenness of this surface of the electronic board 2 .

[0078] In fact, on the surface of the electronic board 2 facing the heat sink 3 , the electronic board 2 may be concave or convex due to the presence of printed circuits, soldering, etc.

[0079] Air is usually present in these spaces, which reduces the transfer of heat towards the heat sink 3 .

[0080] The thermally conductive insulating element 6 instead allows filling these spaces, eliminating air, to reduce thermal resistance and improve thermal conduction.

[0081] Advantageously again, the thermally conductive insulating element 6 allows the flatness of the electronic board 2 to be improved, thereby creating a flat conductive surface with which the heat sink 3 can come into contact more effectively.

[0082] Furthermore, the thermally conductive insulating element 6 and the vias 23 facilitate the transfer of heat from the component 21 even if they are arranged on the wall of the electronic board 2 opposite to that on which the heat sink 3 is located.

[0083] This aspect allows the electronic board to be placed so that its components 21 are located on the opposite side relative to the heat sink 3 , but at the same time ensures optimal heat dissipation through the electronic input / output device 100 .

[0084] In fact, the heat generated by the component 21 is transferred toward the heat sink 3 through the vias 23 .

[0085] Advantageously, in this way, the heat sink 3 can also be placed so that a portion of the heat sink 3 protrudes from the housing 1 ( Figure 5 and Figure 6A ) and in contact with air.

[0086] In fact, thanks to the vias 23 and the thermally conductive insulating element 6 , the heat generated by the component 21 can pass through the electronic board 2 and reach the heat sink 3 situated towards the outside of the housing 1 .

[0087] In the absence of these aspects, as occurs in conventional electronic input / output devices, the heat sink 3 must be on the side of the electronic board 2 where the component 21 is present, since otherwise it would not be able to effectively dissipate the heat generated.

[0088] Such placement increases the size and overall dimensions of known electronic input / output devices, thereby increasing the complexity of assembling the components and reducing their overall performance.

[0089] Furthermore, an electronic input / output device without the vias 23 and the thermally conductive insulating element 6 would be forced to place the heat sink close to the motor, which would also generate heat, thereby reducing the performance of the heat sink and the pump itself.

[0090] In contrast, the electronic input / output device 100 according to the present invention allows the heat sink to be placed in contact with the air and on the opposite side relative to the motor and the component 21 of the electronic board 2, thereby facilitating the assembly of the electronic input / output device 100 and reducing the size of the electronic input / output device 100.

[0091] In fact, the electronic input / output device 100 with improved heat dissipation allows creating a more simplified and efficient layout of components, which increases the efficiency and performance of the device 100 and reduces its size.

[0092] Advantageously, the arrangement of the components of the electronic input / output device 100 according to the present invention allows for simpler and more automated assembly.

[0093] These layout advantages also allow the display to be placed in a location that is more easily accessible to the user.

[0094] Still advantageously, according to the present invention, better thermal separation from the motor can be achieved to further improve the heat dissipation of the heat sink 3 and the performance of the electronic input / output device 100 .

[0095] Still advantageously, it is possible to create an electronic input / output device 100 having a simple and non-bulky shape.

[0096] Advantageously, the electronic input / output device 100 allows a more compact arrangement of the components 21 to be obtained, which corresponds to a lower radiation of electromagnetic waves.

[0097] This low electromagnetic wave radiation allows obtaining numerous EMC certifications.

[0098] From the description given, the characteristics and advantages of the electronic input / output device with improved heat dissipation, object of the present invention, are clear.

[0099] Finally, it is clear that many other modifications could be made to the device discussed without departing from the principle of novelty inherent in the concept of the invention, and that in a practical implementation of the invention, the materials, shapes, and dimensions of the details shown can be any according to requirements and that they can be replaced by other equivalent substitutes.

[0100] When features and techniques mentioned in any claim are followed by reference numerals, these reference numerals are included only for the purpose of improving the intelligibility of the claim and, therefore, these reference numerals have no limiting effect on the interpretation of each element identified by way of example by these reference numerals.

Claims

1. An input / output electronics (100) for a pump and / or pumping system with improved heat dissipation, the input / output electronics (100) comprising: - an electronic control board (2) having a plurality of components (21) and one or more vias (23); - a heat sink (3) configured to dissipate heat generated by the electronic control board (2); - a heat-conducting insulating element (6), which is placed between the electronic control board (2) and the heat sink (3) to enhance the transfer of heat from the via hole (23) to the heat sink (3), The invention is characterized in that one or more components (21) are arranged on a surface of the electronic control board (2) opposite to a surface facing the heat sink (3).

2. The input / output electronic device (100) according to claim 1, characterized in that The through-holes in the one or more vias (23) are filled with the same material as that of the electronic control board (2).

3. The input / output electronic device (100) according to claim 1, characterized in that The one or more vias (23) are capped.

4. The input / output electronic device (100) according to claim 1, characterized in that The heat-conducting insulating element (6) is an elastic heat-conducting pad or SilPad.

Images