Laser device expanded on plastic vacuum forming machine and high-speed plastic vacuum forming machine

Abstract

The invention discloses a laser device for expanding on a plastic vacuum forming machine and a high-speed plastic vacuum forming machine, and belongs to the technical field of plastic vacuum forming machines. The cross-shaped sliding table is fixedly connected to the fixing frame; the cutting head is fixedly connected to the cross-shaped sliding table, and the cutting head is connected with a laser cutting system; the ejection mechanism is connected to the fixing frame; the device is fixed and expanded on the plastic vacuum forming machine through the fixing frame, the cutting head connected with the laser cutting system is matched with the cross-shaped sliding table to cut and punch a product subjected to plastic vacuum forming, and the material jacking mechanism is used for jacking, stacking and storing the cut plastic vacuum forming product, so that the whole device has good expansibility and can be quickly matched on the plastic vacuum forming machine for use; and aiming at plastic uptake products of different specifications, the speed of replacing the cutting procedure is far higher than that of replacing the stamping die, so that long-time shutdown of the plastic uptake machine is avoided, and the working hours are further saved.

Description

Technical Field

[0001] The invention belongs to the technical field of blister machines, and in particular relates to a laser device for expansion on a blister machine and a high-speed blister machine. Background Art

[0002] A blister machine, also known as a thermoplastic forming machine, is a machine that vacuum-forms heated and plasticized thermoplastic coils such as PVC, PE, PP, PET, and HIPS into various shapes of high-end packaging boxes, frames, and other products. Using the vacuum suction generated by a vacuum pump, softened thermoplastic sheets such as PVC and PET are vacuum-formed through molds into various shapes of vacuum covers, blister trays, and blister shells.

[0003] At present, after the blister forming process, the product will be sent to the matching stamping blanking device for cutting. Cutting products of different specifications requires replacing different stamping dies, which increases the cost of the mold. In addition, the mold replacement process is cumbersome, causing the blister machine to stop for a long time and resulting in wasted working hours. In addition, in order to meet the use requirements, some blister products need to be laser marked, which requires adding a separate laser marking process. Similarly, visual inspection of the product also requires adding a separate process. Summary of the Invention

[0004] The purpose of the present invention is to solve the above-mentioned problems and to propose a laser device and a high-speed blister machine for expansion on the blister machine.

[0005] On the one hand, in order to achieve the above-mentioned purpose, the present invention adopts the following technical solution: a laser device for expanding on a blister machine, comprising:

[0006] A fixed frame, which is mounted on the blister machine via a linear slide;

[0007] A cross slide, which is fixedly connected to the fixed frame;

[0008] A cutting head, which is fixedly connected to the cross slide and connected to the laser cutting system;

[0009] The lifting mechanism is connected to the fixing frame.

[0010] As a further description of the above technical solution:

[0011] A laser galvanometer is fixedly connected to the cross slide, and the laser galvanometer is connected to a laser marking system.

[0012] As a further description of the above technical solution:

[0013] A machine vision camera is fixedly connected to the cross slide.

[0014] As a further description of the above technical solution:

[0015] The machine vision camera is a CCD.

[0016] As a further description of the above technical solution:

[0017] The machine vision camera is connected to a compensation light source.

[0018] As a further description of the above technical solution:

[0019] The ejection mechanism includes multiple ejection cylinders and multiple flat pressure heads. The multiple ejection cylinders are arranged in a straight line and slidably connected to the fixed frame. The multiple flat pressure heads are respectively fixedly connected to the telescopic ends of the multiple ejection cylinders.

[0020] As a further description of the above technical solution:

[0021] A controller is fixedly connected to the fixing frame, and the controller is electrically connected to the laser cutting system, the laser marking system and the machine vision camera.

[0022] On the other hand, in order to achieve the above-mentioned purpose, the present invention adopts the following technical solution: a high-speed blister machine, which is a high-speed blister machine equipped with a laser device.

[0023] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0024] 1. In the present invention, the fixed frame is extended on the blister machine, and the cutting head connected to the laser cutting system is used in conjunction with the cross slide to cut and punch the blister products. The ejection mechanism ejects and stacks the cut blister products, so that the device as a whole has good scalability and can be quickly used on the blister machine, thereby saving the investment in stamping dies. For blister products of different specifications, the speed of changing the cutting program is much faster than that of changing the stamping die, thereby avoiding long-term shutdown of the blister machine and saving working hours.

[0025] 2. In the present invention, by extending the laser galvanometer and machine vision camera of the laser marking system on the cross slide, the blister product can be marked at the same time as the laser cutting. The machine vision camera can be used to perform visual inspection on the cut product, thereby saving the subsequent separate inspection process. The machine vision camera can also obtain the coordinate position of the product to provide compensation for the laser marking and improve the marking accuracy.

[0026] 3. In the present invention, the flat pressure head acts on the laser-cut products through the expansion and contraction of the material cylinder, thereby completing the stacking and storage of the products. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A schematic diagram of the overall structure of a laser device for expansion on a blister machine Figure 1 .

[0028] Figure 2 A schematic diagram of the overall structure of a laser device for expansion on a blister machine Figure 2 .

[0029] Figure 3 The present invention is a control block diagram for a laser device extended on a blister machine.

[0030] Legend:

[0031] 1. Fixed frame; 2. Cross slide; 3. Cutting head; 4. Ejection mechanism; 41. Ejection cylinder; 42. Flat pressure head; 5. Laser galvanometer; 6. Machine vision camera; 7. Compensation light source; 8. Controller. DETAILED DESCRIPTION

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0033] See also Figure 1-3 The present invention provides a technical solution: a laser device for expansion on a blister machine and a high-speed blister machine, comprising:

[0034] A fixed frame 1 is mounted on the blister machine via a linear slide;

[0035] A cross slide 2 is fixedly connected to the fixed frame 1. The cross slide 2 is composed of an X-axis slide and a Y-axis slide. When in use, the X-axis slide is arranged horizontally and the Y-axis slide is arranged vertically.

[0036] A cutting head 3, which is fixedly connected to the cross slide 2 and connected to a laser cutting system;

[0037] A material ejection mechanism 4 is connected to the fixing frame 1 and is used for stacking and storing the cut blister products;

[0038] The cross slide 2 is fixedly connected to a laser galvanometer 5, and the laser galvanometer 5 is connected to a laser marking system;

[0039] A machine vision camera 6 is fixedly connected to the cross slide 2. The machine vision camera 6 can be used to perform visual inspection on the cut product, thereby saving the subsequent separate inspection process. The machine vision camera 6 can also obtain the coordinate position of the product to provide compensation for laser marking and improve the accuracy of marking.

[0040] The machine vision camera 6 is a CCD, which has low noise and high sensitivity characteristics;

[0041] The machine vision camera 6 is connected to a compensation light source 7 to facilitate the machine vision camera 6 to obtain a more accurate product image;

[0042] The ejection mechanism 4 includes a plurality of ejection cylinders 41 and a plurality of flat pressure heads 42. The plurality of ejection cylinders 41 are arranged in a straight line and slidably connected to the fixed frame 1. The plurality of flat pressure heads 42 are respectively fixedly connected to the telescopic ends of the plurality of ejection cylinders 41. The telescopic movement of the ejection cylinders 41 enables the flat pressure heads 42 to act on the products cut by the laser, thereby completing the ejection, stacking and storage of the products.

[0043] The fixing frame 1 is fixedly connected to a controller 8 , and the controller 8 is electrically connected to the laser cutting system, the laser marking system and the machine vision camera 6 .

[0044] The present invention provides a technical solution: a high-speed blister machine, which is a high-speed blister machine equipped with a laser device.

[0045] Working principle: First, the laser cutting system (not shown in the figure) can be a fiber laser cutting machine, the laser marking system (not shown in the figure) can be a fiber laser marking machine, and the machine vision camera 6 is a CCD. Secondly, the fixed frame 1 is extended and installed on the high-speed blister machine through a linear slide (not shown in the figure). Secondly, the product after blister processing by the high-speed blister machine is transmitted to the cross slide 2. The cross slide 2 cooperates with the linear slide connected to the blister machine to control the position movement of the cutting head 3, and then laser cutting and laser punching are performed. Then, during the process, the laser galvanometer 5 can mark the product, and the machine vision camera 6 can be used to perform visual inspection on the cut product, thereby saving the subsequent separate inspection process. The machine vision camera 6 can also obtain the coordinate position of the product, provide compensation for laser marking, and improve the accuracy of marking. For blister products of different specifications, the speed of changing the cutting program is much faster than changing the stamping die, thereby avoiding the long-term shutdown of the blister machine and saving working hours. Finally, the extension and contraction of the ejecting cylinder 41 enables the flat pressure head 42 to act on the product cut by the laser, completing the ejecting and stacking of the product.

[0046] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A laser device for expansion on a blister machine, characterized in that: include: A fixed frame (1) is mounted on the blister machine via a linear slide; A cross slide (2) fixedly connected to the fixed frame (1); A cutting head (3) is fixedly connected to the cross slide (2), and the cutting head (3) is connected to a laser cutting system; A lifting mechanism (4) is connected to the fixing frame (1).

2. A laser device for expansion on a blister machine according to claim 1, characterized in that: A laser galvanometer (5) is fixedly connected to the cross slide (2), and the laser galvanometer (5) is connected to a laser marking system.

3. A laser device for expansion on a blister machine according to claim 2, characterized in that: A machine vision camera (6) is fixedly connected to the cross slide (2).

4. A laser device for expansion on a blister machine according to claim 3, characterized in that: The machine vision camera (6) is a CCD.

5. A laser device for expansion on a blister machine according to claim 4, characterized in that: The machine vision camera (6) is connected to a compensation light source (7).

6. A laser device for expansion on a blister machine according to claim 5, characterized in that: The ejection mechanism (4) comprises a plurality of ejection cylinders (41) and a plurality of flat pressure heads (42); the plurality of ejection cylinders (41) are arranged in a straight line and slidably connected to the fixed frame (1); and the plurality of flat pressure heads (42) are respectively fixedly connected to the telescopic ends of the plurality of ejection cylinders (41).

7. A laser device for expansion on a blister machine according to claim 6, characterized in that: A controller (8) is fixedly connected to the fixing frame (1), and the controller (8) is electrically connected to the laser cutting system, the laser marking system and the machine vision camera (6).

8. A high-speed blister machine according to any one of claims 1 to 7, which is a high-speed blister machine equipped with a laser device.

Images