Photosensitive resin, photocuring composition and application of photocuring composition

Abstract

The invention belongs to the technical field of materials, and particularly relates to photosensitive resin, a photocuring composition and application of the photocuring composition. The photosensitive resin is at least polymerized by an olefin unsaturated compound containing an epoxy group, unsaturated carboxylic acid and a photocuring monomer. Based on the photosensitive resin provided by the invention, the photocuring composition has excellent adhesive force and anti-swelling performance, adhesive layer falling, pattern deformation and the like in the developing process are reduced, and finally complete, high-precision and clear patterns are obtained.

Description

Technical Field

[0001] The present invention belongs to the technical field of materials, and in particular relates to a photosensitive resin, a photocurable composition and an application of the photocurable composition. Background Art

[0002] Photolithography refers to a micro-fabrication technology that utilizes the chemical sensitivity of photolithographic materials (particularly photoresists) under the influence of visible light, ultraviolet light, electron beams, etc. to transfer the pattern designed on the mask to the pattern on the substrate through processes such as exposure, development, and etching. Photolithography is the foundation of modern semiconductors, microelectronics, and information industries. It is also widely used in pan-semiconductor industries such as flat panel displays, light-emitting diodes, advanced packaging, magnetic heads, and precision sensors. Photoresist is the core key to forming patterns in photolithography. Photoresist, also known as photoresist, is a material that has chemical sensitivity to light (including visible light, ultraviolet light, electron beams, etc.). After being exposed to light or other radiation, it undergoes a chemical reaction to form a photosensitive material with different solubility.

[0003] Photoresist is mainly composed of solvents, film-forming resins, photoinitiators, additives and other parts. Resin is one of the largest components in photoresist, and its performance plays a decisive role in the overall performance of photoresist. Existing photoresist resins are prone to swelling during the development process, resulting in unclear edges of the pattern, deviations in line width control, and even pattern deformation or peeling. The performance of photoresist directly determines the resolution, color reproduction and image accuracy of the display panel. As new display technologies have increasingly higher requirements for screen resolution, existing photoresist resins have difficulty achieving ideal performance in these aspects due to the problem of swelling during development. Therefore, developing a photoresist that can effectively solve the problems of swelling and shedding during development is of great significance to meeting the high-precision pattern requirements of high-resolution display screen manufacturing. Summary of the Invention

[0004] To address the shortcomings of the prior art, the present invention provides a photosensitive resin, a photocurable composition, and applications of the photocurable composition. Based on the photosensitive resin provided by the present invention, the photocurable composition exhibits excellent adhesion and anti-swelling properties, reducing adhesive layer shedding and pattern deformation during development, ultimately resulting in a complete, high-precision, and clear pattern.

[0005] The technical solutions provided by the present invention are as follows:

[0006] A photosensitive resin is formed by polymerizing at least an olefinic unsaturated compound containing an epoxy group, an unsaturated carboxylic acid, and a photocurable monomer, wherein the general formula of the photocurable monomer is as shown in Formula 1:

[0007]

[0008] A is a closed-chain hydrocarbon having at least two polycyclic rings, each of which is the same or different, and at least one of which is a six-membered ring or a five-membered ring;

[0009] R1 and R2 are independently selected from maleimide groups, and the N on each maleimide group is connected to A in the structural formula shown in Formula 1.

[0010] Preferably, m+n=1 or 2, m is 0 or 1, and n is 0 or 1, that is, the photocurable monomer represented by Formula 1 is preferably a monofunctional maleimide monomer or a difunctional maleimide monomer.

[0011] Specifically, in the structure of the closed-chain hydrocarbon:

[0012] In addition to the at least one polycyclic ring being a six-membered ring or a five-membered ring, the closed-chain hydrocarbon A further comprises at least one polycyclic ring selected from the following structures: any one or more of a cycloalkane having 3 to 20 carbon atoms, an aromatic hydrocarbon having 6 to 30 carbon atoms, a cycloalkane having 3 to 20 carbon atoms and having a heteroatom, or an aromatic hydrocarbon having 6 to 30 carbon atoms and having a heteroatom;

[0013] The connection method of the six-membered ring or five-membered ring and one or more polycyclic rings is selected from one of the following methods: connection through a direct bond, -X- or sharing one or more carbon atoms; X is selected from an alkyl group with 1 to 5 carbon atoms, a carbonyl group or a heteroatom.

[0014] Specifically, the six-membered ring is selected from cyclohexyl and phenyl.

[0015] The cycloalkane having 3 to 20 carbon atoms is preferably a monocycloalkane group having 5 to 7 carbon atoms. Examples of the monocycloalkane group having 5 to 7 carbon atoms include cyclopentane, cyclohexane, and the like.

[0016] The aromatic hydrocarbon having 6 to 30 carbon atoms is selected from phenyl or polycyclic aromatic hydrocarbons, and the aromatic rings in the polycyclic aromatic hydrocarbons are connected by direct bonds and / or by at least one pair of covalent bonds.

[0017] When the six-membered ring is selected from cyclohexyl, the cyclohexyl group is connected to a cycloalkane having 3 to 20 carbon atoms through a direct bond, -X-, or a polycyclic closed-chain hydrocarbon that shares one or more carbon atoms, and X is selected from an alkyl group having 1 to 5 carbon atoms, a keto group, or a heteroatom.

[0018] Furthermore, preferably, the closed-chain hydrocarbon is selected from a spirocyclic alkane having one common carbon or a bridged cyclic alkane having at least two common carbons. Examples of polycyclic closed-chain hydrocarbons include bridged cyclooctane, adamantane, bridged cyclononane, bridged cyclodecane, norbornane, spiropentanes, and spiroheptanes.

[0019] When the six-membered ring is selected from phenyl:

[0020] The closed-chain hydrocarbon is selected from a phenyl group and the aromatic hydrocarbon having 6 to 30 carbon atoms connected by a direct bond, -X-, or sharing one or more carbon atoms, and X is selected from an alkyl group, a keto group, or a heteroatom having 1 to 5 carbon atoms.

[0021] The aromatic hydrocarbon having 6 to 30 carbon atoms is selected from phenyl groups and polycyclic aromatic hydrocarbons connected by direct bonds and / or at least one pair of covalent bonds.

[0022] The polycyclic aromatic hydrocarbons connected by direct bonds or / and at least one pair of covalent bonds include 2, 3 or 4 phenyl groups. Examples of polycyclic aromatic hydrocarbons include, but are not limited to, substituted or unsubstituted biphenyl groups, substituted or unsubstituted terphenyl groups, substituted or unsubstituted quaterphenyl groups, substituted or unsubstituted naphthalene groups, substituted or unsubstituted anthracenyl groups, substituted or unsubstituted pyrenyl groups, substituted or unsubstituted benzanthryl groups, and the like.

[0023] Herein, heteroatom refers to any one or more combinations of N, O, and S.

[0024] The heterocycloalkane having 3 to 20 carbon atoms and having a heteroatom is preferably a monoheterocycloalkane having 5 to 7 carbon atoms and having a heteroatom; the aromatic hydrocarbon having 6 to 30 carbon atoms and having a heteroatom is preferably a heterophenyl group having a heteroatom. Exemplary monoheterocycloalkane and heterophenyl groups include, but are not limited to, furan, pyrrole, thiophene, oxazole, isoxazole, thiazole, isothiazole, pyridine, pyran, pyrimidine, and the like.

[0025] The closed-chain hydrocarbon has 2-5 rings. Specifically, the closed-chain hydrocarbon has 2, 3, 4 or 5 polycyclic rings.

[0026] Preferably, A contains at least one reactive substituent group that can react with an epoxy group, a carboxyl group, or a maleimide group. The single molecular chain obtained by polymerization contains an epoxy group, a carboxyl group, or a maleimide group, which can improve the bonding between the molecular chains.

[0027] Preferably, the reactive group can be selected from hydroxyl, amine, carboxyl, vinyl, acrylic and the like.

[0028] Specifically, the epoxy-containing olefinic unsaturated compound is selected from the compound shown in Formula 2:

[0029]

[0030] R3 is selected from H or methyl, and R4 is selected from substituted or unsubstituted linear alkylene groups having 1 to 20 carbon atoms.

[0031] Examples of the epoxy group-containing olefinic unsaturated compound include glycidyl methacrylate, 2-methyl-2-(2-oxolanyl)ethyl 2-acrylate, 2-methyl-3-(2-oxolanyl)propyl 2-acrylate, and 2-methyl-4-(2-oxetanyl)butyrate 2-acrylate.

[0032] Furthermore, the unsaturated carboxylic acid contains an alkyl chain with an olefin at the end. The alkylene chain in the main chain of the unsaturated carboxylic acid is preferably C 1-20 Examples of the unsaturated carboxylic acid include (meth)acrylic acid, (meth)butenoic acid, (meth)pentenoic acid, (meth)hexenoic acid, (meth)heptenoic acid, (meth)octenoic acid, (meth)nonenoic acid, (meth)decenoic acid, and (meth)undecenoic acid.

[0033] The monomers used for synthesizing the resin provided by the present invention further include any one or more of aryl vinyl compounds, alkyl (meth)acrylates, and aryl (meth)acrylates.

[0034] The aryl vinyl compound preferably contains a substituted or unsubstituted phenyl group, a substituted or unsubstituted C 8-30 polycyclic aromatic groups.

[0035] C 8-30 The polycyclic aromatic group is preferably a polycyclic aromatic group formed by 2-4 aromatic groups connected by a direct bond, -X-, or by sharing one or more carbon atoms, wherein X is selected from an alkyl group having 1 to 5 carbon atoms, a keto group, or a heteroatom.

[0036] For example, the aromatic vinyl compounds include, but are not limited to, styrene, methylstyrene, m-methylstyrene, p-methylstyrene, p-methoxystyrene, distyrene, and the like.

[0037] Preferably, the alkyl (meth)acrylate contains C 15-30 of long-chain alkyl groups.

[0038] The term "substituted" as used herein refers to the replacement of at least one hydrogen atom in a functional group with a hydroxyl group, a nitro group, an imine group (=NH, =NR, wherein R is C 1-10 alkyl), carboxyl, C 1-20 Alkyl, C 6-30 Aryl substitution.

[0039] Preferably, the resin is copolymerized by an olefin unsaturated compound containing an epoxy group, an unsaturated carboxylic acid, a photocurable monomer represented by Formula 1, an aromatic vinyl compound, and an alkyl (meth)acrylate.

[0040] Specifically, in the photosensitive resin, the weight percentage of the photocurable monomer represented by Formula 1 is 1%-10%.

[0041] Specifically, the photosensitive resin further comprises 5%-25% by weight of an olefin unsaturated compound containing an epoxy group; 3%-10% by weight of an unsaturated carboxylic acid; 1%-10% by weight of an aromatic vinyl compound; and 1%-10% by weight of an alkyl (meth)acrylate.

[0042] The photosensitive resin provided by the present invention preferably has a weight average molecular weight Mw of 1900-20000, more preferably, a weight average molecular weight Mw of 4500-15000.

[0043] In a second aspect, the present invention provides a photocurable composition comprising the following components in parts by weight: 5-30 parts of the above-mentioned photosensitive resin, 0.1-5 parts of a photopolymerization initiator, 5-30 parts of a resin monomer, 30-70 parts of a solvent, and 0.1-5 parts of an auxiliary agent. The auxiliary agent is selected from any one or more of a pigment, a surfactant, a photoacid generator, an adhesion enhancer, a defoamer, a leveling agent, a plasticizer, an antioxidant, a stabilizer, or an inhibitor.

[0044] In a third aspect, the present application provides an application of a photocurable composition, wherein the photocurable composition is used in a display device.

[0045] Display devices may include thin film transistor liquid crystal displays, organic light emitting diode displays, quantum dot light emitting diode displays, and micro light emitting diode displays.

[0046] The photocurable composition provided by the present invention is applied to black photoresist, color photoresist, protective film photoresist, PS spacer and the like in display devices.

[0047] The resin provided by the present invention increases interchain entanglement between polymer photoresist molecules due to the presence of epoxy groups, can effectively improve the crosslinking density of the resin, reduce internal stress or expansion, and thus reduce the swelling of the photocurable composition during the development process, thereby showing high resolution and precise patterns. In addition, the polar groups represented by the reactive groups modified on the repeating structural units can provide an appropriate number of hydrogen bonds to increase the glass transition temperature while ensuring good adhesion to the substrate, and improve the resin's good solubility in the developer and etching resistance. DETAILED DESCRIPTION

[0048] The principles and features of the present invention are described below. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0049] If the specific conditions are not specified in the examples, the experiments were carried out under conventional conditions or those recommended by the manufacturer. All reagents or instruments used, if the manufacturer is not specified, are commercially available conventional products.

[0050] Photosensitive resin embodiment 1:

[0051] S1: Add 10 parts by weight of propylene glycol methyl ether acetate to a 500 ml reaction bottle, stir at 200 rpm, protect with nitrogen, and heat to 120°C;

[0052] S2: In a three-necked flask, add 2.5 parts by weight of azobisisobutyronitrile and 13 parts by weight of propylene glycol methyl ether acetate, stir at 500 rpm, weigh 20 parts by weight of hexyl methacrylate monomer, 2 parts by weight of 4-phenylethylene monomer, 5 parts by weight of N-adamantane maleimide monomer, and 8 parts by weight of glycidyl methacrylate monomer and add them to the three-necked flask. After the solution is completely dissolved, add 5 parts by weight of methacrylic acid monomer to the reaction flask, stir for 15 minutes, replace with nitrogen three times, and stir for 15 minutes;

[0053] S3: The solution obtained in S2 was added dropwise to the reaction bottle in S1 for 3 hours. After the reaction was carried out at 120°C for 1 hour, the temperature was lowered to 95°C.

[0054] S4: Weigh 0.25 parts by weight of azobisisobutyronitrile, dissolve it in 1 part by weight of propylene glycol methyl ether acetate, add it to the reaction flask, and react at 95°C for 1 hour; weigh 0.25 parts by weight of azobisisobutyronitrile again, dissolve it in 1 part by weight of propylene glycol methyl ether acetate, add it to the reaction flask, and react at 95°C for 2 hours;

[0055] S5: cooling to 70° C., adding 32 parts by weight of propylene glycol methyl ether acetate, stirring for 1 hour, and cooling to room temperature to obtain a photosensitive resin 1 having a weight average molecular weight Mw of 11250.

[0056] The structural formula of N-adamantane maleimide is as follows:

[0057]

[0058] Photosensitive resin embodiment 2:

[0059] The same preparation method as in Resin Example 1 was used to prepare the photosensitive resin 2, except that N-adamantane maleimide was replaced with N-biphenyl maleimide to obtain a photosensitive resin 2 having a weight average molecular weight Mw of 11290. The structural formula of N-biphenyl maleimide is as follows:

[0060]

[0061] Photosensitive resin embodiment 3:

[0062] The same preparation method as that of Resin Example 1 was used to prepare the photosensitive resin 3, except that N-adamantane maleimide was replaced by N-4-benzoic acid phenyl maleimide, to obtain a photosensitive resin 3 having a weight average molecular weight Mw of 11200.

[0063] The structural formula of N-4-benzoic acid phenylmaleimide is as follows:

[0064]

[0065] Photosensitive resin embodiment 4:

[0066] The same preparation method as in Resin Example 1 was used to prepare the photosensitive resin 4, except that N-adamantane maleimide was replaced with N-fluorenone maleimide to obtain a photosensitive resin 4 with a weight average molecular weight Mw of 11320. The structural formula of N-fluorenone maleimide is as follows:

[0067]

[0068] Photosensitive resin embodiment 5:

[0069] The same preparation method as that of Resin Example 1 was used to prepare the photosensitive resin 5, except that N-adamantane maleimide was replaced by N-benzocyclopentyl maleimide, to obtain a photosensitive resin 5 having a weight average molecular weight Mw of 11230.

[0070] The structural formula of N-benzocyclopentylmaleimide is as follows:

[0071]

[0072] Photosensitive resin embodiment 6:

[0073] The same preparation method as that of Resin Example 1 was used to prepare the photosensitive resin 6, except that N-adamantanemaleimide was replaced by N-naphthalenemaleimide, to obtain a photosensitive resin 6 having a weight average molecular weight Mw of 11180.

[0074] The structural formula of N-naphthalenemaleimide is as follows:

[0075]

[0076] Photosensitive resin embodiment 7:

[0077] The same preparation method as that of Resin Example 1 was used to prepare the photosensitive resin 7, except that N-adamantane maleimide was replaced by N-(5-hydroxynaphthalene) maleimide, to obtain a photosensitive resin 7 having a weight average molecular weight Mw of 11260.

[0078] The structural formula of N-(5-hydroxynaphthalene)maleimide is as follows:

[0079]

[0080] Photosensitive resin embodiment 8:

[0081] The same preparation method as that of Resin Example 1 was used to prepare the photosensitive resin 8, except that N-adamantane maleimide was replaced by N-(3-fluorofuryl) maleimide, to obtain a photosensitive resin 8 having a weight average molecular weight Mw of 11170.

[0082] The structural formula of N-(3-fluorofuryl)maleimide is as follows:

[0083]

[0084] Photosensitive resin embodiment 9:

[0085] The same preparation method as that of Resin Example 1 was used to prepare the photosensitive resin 9, except that N-adamantanemaleimide was replaced by N-(4-morpholinyl)phenylmaleimide and butyl methacrylate was replaced by octadecyl methacrylate, to obtain a photosensitive resin 9 with a weight average molecular weight Mw of 11150.

[0086] The structural formula of N-(4-morpholinyl)phenylmaleimide is as follows:

[0087]

[0088] Photosensitive resin embodiment 10:

[0089] The same preparation method as that of Resin Example 1 was used to prepare the photosensitive resin 10, except that N-adamantanemaleimide was replaced by N-(4-quinolyl)maleimide, to obtain a photosensitive resin 10 with a weight average molecular weight Mw of 11130.

[0090] The structural formula of N-(4-quinolinyl)maleimide is as follows:

[0091]

[0092] Photosensitive resin embodiment 11:

[0093] The same preparation method as that of Resin Example 1 was used to prepare the photosensitive resin 11, except that N-adamantane maleimide was replaced by N-benzodioxole maleimide, to obtain a photosensitive resin 11 with a weight average molecular weight Mw of 11260.

[0094] The structural formula of N-benzodioxole maleimide is as follows:

[0095]

[0096] Photosensitive resin embodiment 12:

[0097] The same preparation method as that of Resin Example 1 was used to prepare the photosensitive resin 12, except that N-adamantane maleimide was replaced by 4,4'-biphenyl bismaleimide, to obtain a photosensitive resin 12 having a weight average molecular weight Mw of 11260.

[0098] The structural formula of 4,4'-biphenyl bismaleimide is as follows:

[0099]

[0100] Photosensitive resin embodiment 13:

[0101] The same preparation method as that of Resin Example 1 was used to prepare the photosensitive resin 13, except that N-adamantane maleimide was replaced by 3,3'-bismaleimide diphenyl ether, to obtain a photosensitive resin 13 having a weight average molecular weight Mw of 11190.

[0102] The structural formula of 3,3'-bismaleimide diphenyl ether is as follows:

[0103]

[0104] Photosensitive resin embodiment 14:

[0105] The same preparation method as that of Resin Example 3 was used to prepare the photosensitive resin 14, except that hexyl methacrylate was replaced with behenyl methacrylate, to obtain a photosensitive resin 14 with a weight average molecular weight Mw of 11150.

[0106] Photosensitive resin embodiment 15:

[0107] The same preparation method as that of Resin Example 3 was used to prepare the photosensitive resin 15, except that 4-distyrene was not added and its amount was replaced by propylene glycol methyl ether acetate, to obtain a photosensitive resin 15 with a weight average molecular weight Mw of 11080.

[0108] Resin Comparative Example 1:

[0109] The same preparation method as that of Resin Example 1 was used to prepare the photosensitive resin D1, except that N-adamantanemaleimide was replaced by N-phenylmaleimide, to obtain a photosensitive resin D1 having a weight average molecular weight Mw of 11140.

[0110] The structural formula of N-phenylmaleimide is as follows:

[0111]

[0112] Resin Comparative Example 2:

[0113] The same preparation method as that of Resin Example 1 was used to prepare the photosensitive resin D2, except that N-adamantane maleimide was replaced by 4-phenol maleimide, to obtain a photosensitive resin D2 with a weight average molecular weight Mw of 11080.

[0114] The structural formula of 4-phenol maleimide is as follows:

[0115]

[0116] Resin Comparative Example 3:

[0117] The same preparation method as that of Resin Example 1 was used to prepare the photosensitive resin D3, except that N-adamantanemaleimide was replaced by N-cyclohexylmaleimide, to obtain a photosensitive resin D3 with a weight average molecular weight Mw of 11130.

[0118] Resin Comparative Example 4:

[0119] The same preparation method as that of Resin Example 1 was used to prepare the photosensitive resin D4, except that glycidyl methacrylate was not added and its amount was replaced by propylene glycol methyl ether acetate, to obtain a photosensitive resin D4 with a weight average molecular weight Mw of 11210.

[0120] Preparation Example 1 of Photocurable Composition:

[0121] 60 parts by weight of propylene glycol methyl ether acetate, 10 parts of photosensitive resin 1, 19 parts by weight of butyl methacrylate, 7 parts by weight of bisether fluorene acrylate and 2 parts by weight of polyether modified polydimethylsiloxane were added into a reaction kettle and stirred. The temperature was controlled at about 35° C. and stirred evenly. Then, 2 parts by weight of isopropylthioxanthone (ITX) was added and stirred evenly to obtain a photosensitive resin composition.

[0122] Preparation Examples 2-15 of Photocurable Compositions

[0123] The method is the same as Example 1 for preparing the photocurable composition, except that photosensitive resins 2 to 15 are used instead of photosensitive resin 1.

[0124] Comparative Examples 1-4 of Preparation of Photocurable Compositions:

[0125] The method is the same as Example 1 for preparing the photocurable composition, except that the photosensitive resin 1 is replaced by photosensitive resins D1 to D4 respectively.

[0126] Performance testing:

[0127] Adhesion: A 100 mm square glass substrate was cleaned with pure water and dried in an oven at 160°C. The dried glass substrate was coated with the resin composition obtained in the Examples and Comparative Examples using a rotary coater. After UV curing, a 10 μm thick coating film was obtained. The sample was tested using the cross-cutting method.

[0128] Swelling: The photocurable composition was evenly applied to a cleaned glass substrate by spin coating to obtain a 5 μm thick sample. The sample was immersed in a 2.38% TMAH (tetramethylammonium hydroxide) developer at a temperature of 23 ± 1°C for 5-60 seconds. The film thickness was then measured and the swelling ratio was calculated.

[0129] Resolution: The resolution of the sample was tested using an optical microscope (the minimum line width at which the photocurable composition can be imaged);

[0130] Film retention: The glass substrate surface was irradiated with a UV cleaner for 1 minute and cleaned with deionized water. The photocurable composition was then evenly applied to the glass substrate surface by spin coating. Pre-baking was performed at 110°C for 150 seconds to obtain a 1.8μm thick film. Exposure was performed using 365nm UV light with a mask at a distance of 0μm from the coating. Development was performed with a 2.38% TMAH (tetramethylammonium hydroxide) developer at 23°C for 40 seconds, followed by rinsing with water and drying. The film was then baked after development and tested for film retention.

[0131] The test results are shown in Table 1:

[0132] Table 1

[0133]

[0134] As can be seen from the table above, with reference to Examples 1-15 and Comparative Examples 1-4, the addition of a resin monomer containing a polycyclic structure and a resin photocurable composition synthesized with glycidyl methacrylate exhibits superior adhesion, pattern accuracy, and film retention. With reference to Examples 1-15 and Comparative Examples 1-4, the photosensitive resin provided herein, when added to a photocurable composition, exhibits excellent adhesion, anti-swelling properties, high resolution, and development film retention, with good developability, thereby yielding a complete, high-precision pattern.

[0135] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A photosensitive resin, characterized in that: It is formed by polymerizing at least an olefinic unsaturated compound containing an epoxy group, an unsaturated carboxylic acid, and a photocurable monomer, wherein the photocurable monomer has a structure shown in Formula 1: A is a closed-chain hydrocarbon having at least two polycyclic rings, each of which is the same or different, and at least one of which is a six-membered ring or a five-membered ring; R1 and R2 are independently selected from maleimide groups, and the N on each maleimide group is connected to A in the structural formula shown in Formula 1; m+n=1 or 2, m is 0 or 1, and n is 0 or 1.

2. The photosensitive resin according to claim 1, wherein Among the closed-chain hydrocarbons: At least one of the polycyclic rings is selected from any one or more of cycloalkanes having 3 to 20 carbon atoms, aromatic hydrocarbons having 6 to 30 carbon atoms, cycloalkanes having 3 to 20 carbon atoms with heteroatoms, or aromatic hydrocarbons having 6 to 30 carbon atoms with heteroatoms; The connection mode between the multiple polycyclic rings is selected from one or more of the following modes: connection through a direct bond, -X-, or sharing one or more carbon atoms; X is selected from an alkylene group with 1 to 5 carbon atoms, a carbonyl group, or a heteroatom.

3. The photosensitive resin according to claim 2, wherein: The six-membered ring is selected from cyclohexyl or phenyl; The cycloalkane having 3 to 20 carbon atoms is selected from monocycloalkane groups having 5 to 7 carbon atoms; The heterocycloalkane having 3 to 20 carbon atoms is selected from a monoheterocycloalkane group having 5 to 7 carbon atoms; The aromatic hydrocarbon having 6 to 30 carbon atoms is selected from phenyl or polycyclic aromatic hydrocarbons, and the aromatic rings in the polycyclic aromatic hydrocarbons are connected by direct bonds and / or by at least one pair of covalent bonds.

4. The photosensitive resin according to claim 1, wherein: The closed-chain hydrocarbon has 2 to 5 polycyclic rings.

5. The photosensitive resin according to claim 1, wherein: The closed-chain hydrocarbon also contains at least one reactive substituent group that can react with an epoxy group, a carboxyl group, or a maleimide group.

6. The photosensitive resin according to claim 1, wherein: The epoxy-containing olefinic unsaturated compound is selected from the compound shown in Formula 2: R3 is selected from H or methyl, and R4 is selected from substituted or unsubstituted linear alkylene groups having 1 to 20 carbon atoms.

7. The photosensitive resin according to claim 1, wherein: The unsaturated carboxylic acid contains an alkyl chain terminated in an olefin.

8. The photosensitive resin according to claim 1, wherein: The reactants involved in the polymerization further include any one or more of an aromatic vinyl compound monomer, an alkyl (meth)acrylate monomer or an aryl (meth)acrylate monomer.

9. A photocurable composition, characterized in that include: The photosensitive resin according to any one of claims 1 to 8, a photopolymerization initiator, a resin monomer, a solvent and an auxiliary agent.

10. A display device, characterized in that: A film layer formed from the photocurable composition according to claim 9.

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