Chip capacitor sealing end drying device and working method thereof

Abstract

The invention discloses a chip capacitor end sealing and drying device and a working method thereof, and relates to the technical field of electronic component manufacturing equipment.The chip capacitor end sealing and drying device comprises an A-face processing unit, a B-face processing unit and a furnace discharging and cooling unit which are sequentially connected, the A-face processing unit comprises an A-face leveling front turnover mechanism, an A-face end sealing front leveling mechanism and an A-face end sealing machine, and the B-face processing unit comprises an A-face leveling front turnover mechanism, an A-face end sealing front leveling mechanism and an A-face end sealing machine; the A-surface treatment unit comprises an A-surface infrared drying furnace and a B-surface treatment unit, the outlet end of the A-surface treatment unit is provided with an A-surface end-sealing rear furnace-entering lifting mechanism, a first hot air circulating pipe is arranged above the A-surface infrared drying furnace, the B-surface treatment unit comprises a B-surface leveling front turnover mechanism, a B-surface end-sealing front leveling mechanism and a B-surface end-sealing machine, and the outlet end of the B-surface treatment unit is provided with a B-surface end-sealing rear furnace-entering lifting mechanism. And a second hot air circulating pipe is arranged above the B-surface infrared heating drying furnace. The problems that an end sealing drying system is large in occupied area, low in production efficiency, poor in drying quality and difficult to maintain are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component manufacturing equipment, and in particular to a chip capacitor termination drying device and a working method thereof. Background Art

[0002] Existing chip capacitor termination and drying technology generally utilizes a hot air drying system in which a termination machine and drying oven are connected in a straight line. In this system, the termination and drying processes operate in series, with a Ferris wheel-style drying device typically used to process the terminated components. Specifically, the existing system connects the termination machine and drying oven in a straight line. After termination, the components are conveyed into the Ferris wheel-style drying oven, where hot air circulation circulates to dry the slurry.

[0003] For example, the Chinese authorized patent "A Drying Device for Chip Capacitor Capacitor Termination" with announcement number CN221197945U includes a heating box, a drying conveying assembly, a filter box, and a circulating fan. The drying conveying assembly is arranged between the heating box and the filter box. The heating box is provided with a drying outlet and a circulating gas inlet, and the filter box is provided with a filtering inlet and a filtering outlet. The drying outlet and the filtering inlet are arranged relative to each other, and the drying conveying assembly is located between the drying outlet and the filtering inlet. The filtering outlet, the circulating fan, and the circulating gas inlet are connected in sequence through a pipeline, and the circulating fan is used to pass the drying gas collected and filtered by the filter box into the heating box. The recycling and utilization of the drying gas are realized respectively, so that the drying gas is fully utilized and the waste of electric heating resources is avoided. In addition, the drying gas is recycled in the device, which can greatly improve the workshop environment of the chip capacitor.

[0004] Although the above-mentioned existing technology has achieved the basic function of end sealing and drying, the straight-line splicing layout causes the equipment to occupy a large area, making it difficult to deploy in space-constrained scenarios such as high-purity workshops; under the Ferris wheel-style drying method, the slurry after end sealing is prone to sag at the end of the component due to gravity, and improper control of the hot air speed will further aggravate the problem, resulting in unstable quality of chip capacitor end sealing; at the same time, the serial workflow leads to low production efficiency and insufficient equipment utilization rate. The maintenance of the drying furnace also has the defect of inconvenient operation due to structural layout problems. Therefore, it does not meet existing needs. In this regard, we propose a chip capacitor end sealing and drying device and a working method thereof. Summary of the Invention

[0005] The purpose of the present invention is to provide a chip capacitor end-sealing and drying device to solve the problems of large footprint, low production efficiency, poor drying quality and difficult maintenance proposed in the above background technology. By optimizing the equipment layout and drying process, the purpose of saving space, improving efficiency and improving product quality is achieved.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a chip capacitor end-sealing drying device and a working method thereof, comprising an A-side processing unit, a B-side processing unit and a furnace-discharging cooling unit connected in sequence, the A-side processing unit comprising an A-side flattening front flipping mechanism, an A-side flattening front end-sealing mechanism, and an A-side end-sealing machine, the A-side end-sealing machine comprising two first slurry dipping mechanisms, an A-side end-sealing back-entry furnace lifting mechanism is provided at the outlet end of the A-side processing unit, and its output end is connected to the A-side infrared drying furnace on one side through a first furnace-entry transverse manipulator, a first hot air circulation pipe is provided above the A-side infrared drying furnace, the output end of the A-side infrared drying furnace is connected to the A-side furnace-discharging cooling mechanism, the B-side processing unit comprising a B-side flattening front flipping mechanism, a B-side flattening front flipping mechanism, a B-side end-sealing front flattening mechanism, and a B-side end-sealing machine. A face A pre-sealing flattening mechanism and a face B sealing machine, the face B sealing machine includes two second slurry dipping mechanisms, the outlet end of the face B processing unit is provided with a face B post-sealing furnace lifting mechanism, and its output end is connected to the face B infrared heating and drying furnace through a second furnace entry transverse movement robot, a second hot air circulation pipe is provided above the face B infrared heating and drying furnace, the output end of the face B infrared heating and drying furnace is connected to the face B furnace exit cooling mechanism, the furnace exit cooling unit includes a furnace exit cooling rack, the face B furnace exit cooling mechanism is docked with the furnace exit cooling rack, the face A pre-leveling flipping mechanism and the face B pre-leveling flipping mechanism are used to flip the end plate one hundred and eighty degrees, the first furnace entry transverse movement robot and the second furnace entry transverse movement robot are used to send the end plate into the corresponding drying furnace.

[0007] Preferably, the slurry dipping mechanisms of the A-side sealing machine and the B-side sealing machine adopt a symmetrically arranged double slurry dipping structure, and the first slurry dipping mechanism and the second slurry dipping mechanism both include a slurry tank and a liquid level control system to coat the sealing slurry on one end of the chip capacitor.

[0008] Preferably, the infrared drying furnace on side A and the infrared heating drying furnace on side B both adopt a composite heating method of infrared heating rods and hot air circulation. The first hot air circulation pipe and the second hot air circulation pipe are respectively connected to the hot air circulation system inside the drying furnace, which can form hot air convection from top to bottom and form three-dimensional heating in conjunction with infrared radiation.

[0009] Preferably, the A-side pre-leveling flipping mechanism and the B-side pre-leveling flipping mechanism both use a flipping bracket rotated by a cylinder to accurately flip the end plate 180 degrees.

[0010] Preferably, the A-side processing unit and the B-side processing unit are arranged in parallel on the same rack, and the A-side infrared drying furnace and the B-side infrared heating drying furnace are respectively located at the outlet end of the end sealing machine, forming a compact layout.

[0011] Preferably, the A-side furnace cooling mechanism and the B-side furnace cooling mechanism both include air cooling channels and cooling waste gas outlets. The cooling waste gas outlets are connected to the waste gas treatment system to discharge the volatile gases generated during the drying process in real time, and at the same time accelerate the cooling of the end plate through air cooling.

[0012] Preferably, the first furnace-entry transverse moving robot and the second furnace-entry transverse moving robot are used to grab the end-sealing plates and place them on the conveyor belt of the drying furnace, forming synchronous control with the end-sealing machine and the drying furnace.

[0013] Preferably, the heating temperature range of the infrared drying oven is 80-150° C., and the hot air speed is controlled at 1-3 m / s, which is adjusted in real time by a PID temperature control system and a wind speed sensor.

[0014] The working method of the chip capacitor termination drying device includes the following steps: Step 1, A-side processing stage: flipping the end surface to be sealed: the end-sealing plate after implantation enters the end-sealing machine, and the end-sealing plate is first flipped by the A-side leveling front flipping mechanism so that the end-sealing surface faces upward; surface leveling treatment: after flipping again, the end-sealing plate with the end-sealing surface facing downward is conveyed to the A-side end-sealing front leveling mechanism for surface leveling to ensure the end-sealing accuracy; end-sealing slurry coating: the leveled end-sealing plate enters the A-side end-sealing machine and is coated with the end-sealing slurry: the end-sealing slurry coating on the A-side is completed synchronously by the two first slurry dipping mechanisms inside it; Step 2, A-side drying and cooling stage: The manipulator grabs and synchronously flips and lifts it to the furnace entrance: The end-sealed plate after A-side end sealing is lifted to the furnace entrance position by the furnace lifting mechanism after A-side end sealing; infrared and hot air three-dimensional drying: The first furnace entry transverse movement manipulator grabs the end-sealed plate and places it on the conveyor belt of the A-side infrared drying furnace. The first hot air circulation pipe above the drying furnace cooperates with infrared heating to perform three-dimensional drying of the end-sealed plate; cooling and cooling: After the drying is completed, the end-sealed plate reaches the A-side furnace discharge cooling mechanism and is cooled by air cooling and other methods; Step 3, B side processing stage: flip and switch the end-sealing surface: the cooled end-sealing plate is flipped again 180 degrees by the B side pre-leveling flipping mechanism and switched to the B side end-sealing state; B side leveling and end-sealing: after entering the B side pre-end-sealing leveling mechanism for leveling, the B side end-sealing is completed by the two second slurry dipping mechanisms of the B side end-sealing machine; Step 4, B side drying and discharging stage: lifting and sending into the drying furnace: the end-sealed plate after B side sealing is lifted to the furnace mouth by the B side end-sealed furnace lifting and turning mechanism, and the second furnace entry transverse movement robot sends it into the B side infrared heating drying furnace, and uses the second hot air circulation pipe and infrared heating to dry; cooling and discharging: the dried end-sealed plate is cooled by the B side furnace discharging cooling mechanism, and finally placed on the furnace discharging cooling rack, completing the entire end-sealing and drying parallel process.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention arranges the drying furnace at the outlet of the end-sealing machine to form a parallel working structure, changing the longitudinal extension mode of the traditional straight-line splicing layout, thereby greatly reducing the overall space occupied by the equipment. This intensive layout mode can achieve the coordinated operation of the end-sealing and drying processes without the need for additional site expansion. It is suitable for production scenarios with high requirements for space utilization in high-purity workshops, saving site costs for enterprises while creating the possibility of deploying more equipment.

[0016] 2. The parallel operation of the end-capping and drying processes in this invention eliminates the time bottleneck of traditional serial processes. After end-capping, components can be directly transferred to the drying oven by a robotic arm, reducing intermediate waiting steps and making the overall production process more compact. Furthermore, the infrared hot air drying oven combines infrared heating with hot air circulation. Compared with traditional Ferris wheel-style drying, it provides more uniform heat conduction and higher drying efficiency, avoiding production line stagnation caused by drying process delays, and fundamentally improving equipment operation stability and production efficiency.

[0017] 3. During the drying process, the components of this invention are placed with the chip facing upward, directly facing the heater and hot air. This completely avoids the slurry sagging caused by gravity or uneven wind speed in traditional side-on drying methods. This ensures a more even distribution of slurry after chip capacitor termination, significantly reducing product defect rates. Furthermore, the structural design of the infrared hot air drying oven fully considers maintenance needs. Compared with traditional drying ovens, its internal component inspection space is more open, and the maintenance process is more simplified, effectively extending the equipment maintenance cycle and reducing the difficulty and cost of daily maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A top view of the present invention; Figure 2 It is a rear view of the present invention; Figure 3 It is a front view of the present invention.

[0019] In the figure: 1. Flipping mechanism before leveling surface A; 2. Leveling mechanism before end sealing surface A; 3. End sealing machine for surface A; 4. Elevating mechanism for entering furnace after end sealing surface A; 5. Transverse moving robot for first entering furnace; 6. Infrared drying furnace for surface A; 7. First hot air circulation pipe; 8. Cooling mechanism for surface A after exiting furnace; 9. Leveling mechanism before end sealing surface B; 10. End sealing machine for surface B; 11. Elevating mechanism for entering furnace after end sealing surface B; 12. Transverse moving robot for second entering furnace; 13. Infrared heating and drying furnace for surface B; 14. Second hot air circulation pipe; 15. Cooling mechanism for surface B after exiting furnace; 16. Cooling rack for exiting furnace; 17. First slurry dipping mechanism; 18. Second slurry dipping mechanism; 19. Cooling exhaust gas outlet; 20. Flipping mechanism before leveling surface B. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0021] See also Figure 1-3 , an embodiment provided by the present invention: a chip capacitor terminal sealing and drying device, comprising an A-side processing unit, a B-side processing unit and a furnace cooling unit connected in sequence, the A-side processing unit comprising an A-side flattening front flipping mechanism 1, an A-side flattening front end sealing mechanism 2, and an A-side end sealing machine 3, the A-side end sealing machine 3 comprising two first slurry dipping mechanisms 17, an A-side end sealing back furnace lifting mechanism 4 is provided at the outlet end of the A-side processing unit, and its output end is connected to an A-side infrared drying furnace 6 on one side through a first furnace entry transverse moving manipulator 5, a first hot air circulation pipe 7 is provided above the A-side infrared drying furnace 6, and the output end of the A-side infrared drying furnace 6 is connected to the A-side furnace cooling mechanism 8, the B-side processing unit comprising a B-side flattening front flipping mechanism 20, a B-side flattening front end sealing mechanism 9, a B-side end sealing mechanism End machine 10, B side end sealing machine 10 includes two second slurry dipping mechanisms 18, the outlet end of the B side processing unit is provided with a B side end sealing rear furnace lifting mechanism 11, the output end of which is connected to the B side infrared heating and drying furnace 13 through the second furnace entry transverse movement robot 12, a second hot air circulation pipe 14 is provided above the B side infrared heating and drying furnace 13, the output end of the B side infrared heating and drying furnace 13 is connected to the B side furnace exit cooling mechanism 15, the furnace exit cooling unit includes a furnace exit cooling rack 16, the B side furnace exit cooling mechanism 15 is docked with the furnace exit cooling rack 16, the A side pre-leveling flipping mechanism 1 and the B side pre-leveling flipping mechanism 20 are used to flip the end plate 180 degrees, the first furnace entry transverse movement robot 5 and the second furnace entry transverse movement robot 12 are used to send the end plate into the corresponding drying furnace; The end-sealed plate is first flipped by the A-side pre-leveling flipping mechanism 1, then leveled by the A-side pre-end-sealing leveling mechanism 2. It then passes through the two first slurry dipping mechanisms 17 of the A-side end-sealing machine 3 to complete the A-side end-sealing. It is then lifted by the A-side post-end-sealing furnace lifting mechanism 4 and transported by the first furnace transverse manipulator 5 to the A-side infrared drying furnace 6 for drying. It is then cooled by the A-side exit cooling mechanism 8, then flipped by the B-side pre-leveling flipping mechanism 20, and the B-side processing flow repeats. Finally, it is cooled by the B-side exit cooling mechanism 15 and placed on the exit cooling rack 16. Benefits: This allows for parallel end-sealing and drying operations, sharing racks and space, significantly saving space and improving production efficiency.

[0022] See also Figure 2 and Figure 3 The slurry dipping mechanism of the A-side sealing machine 3 and the B-side sealing machine 10 adopts a symmetrically arranged double slurry dipping structure. The first slurry dipping mechanism 17 and the second slurry dipping mechanism 18 both include a slurry tank and a liquid level control system to coat one end of the chip capacitor with the sealing slurry; The capping slurry is stored in a slurry tank, and the liquid level control system maintains a stable liquid level in the slurry tank, so that one end of the chip capacitor can be evenly coated with the capping slurry when passing through the slurry dipping mechanism. The capping slurry can be applied to both ends of the chip capacitor, improving the efficiency and uniformity of the capping.

[0023] See also Figure 1 、 Figure 2 As with 3, the infrared drying oven 6 for side A and the infrared heating drying oven 13 for side B both adopt a composite heating method of infrared heating rods and hot air circulation. The first hot air circulation pipe 7 and the second hot air circulation pipe 14 are respectively connected to the hot air circulation system inside the drying oven, which can form a top-down hot air convection and form three-dimensional heating with infrared radiation; The infrared heating rods emit infrared radiation to heat the end-capping plates. The hot air circulation system delivers hot air into the drying oven through the first and second hot air circulation ducts 7 and 14, creating a top-down convection flow of hot air. This combined heating method, combined with the infrared radiation, heats and dries the end-capping plates in three dimensions. This combined heating method accelerates drying and improves drying uniformity, avoiding the inadequate or uneven drying that can occur with a single heating method.

[0024] See also Figure 1 Both the A-side pre-leveling flip mechanism 1 and the B-side pre-leveling flip mechanism 20 utilize a pneumatic cylinder-driven flipping bracket to precisely flip the end plate 180 degrees. The rotating cylinder flip bracket rotates, driving the end plate 180 degrees. Precise control of the cylinder ensures an accurate flip angle, ensuring the end-capped surface of the chip capacitor faces upward, facing the heater. This prevents slurry sagging caused by gravity during traditional Ferris wheel drying.

[0025] See also Figure 1 The A-side processing unit and the B-side processing unit are arranged in parallel on the same rack. The A-side infrared drying oven 6 and the B-side infrared heating drying oven 13 are located at the exit of the end-sealing machine, creating a compact layout. The A-side processing unit and the B-side processing unit are arranged in parallel on the same rack. The exit of the end-sealing machine is directly connected to the corresponding infrared drying oven, allowing the sealed end-capped boards to quickly enter the drying oven for drying. Compared to traditional straight-line splicing systems, this compact layout reduces floor space and allows for the deployment of more equipment within a limited space.

[0026] Furthermore, the A-side furnace cooling mechanism 8 and the B-side furnace cooling mechanism 15 both include an air cooling channel and a cooling waste gas outlet 19. The cooling waste gas outlet 19 is connected to the waste gas treatment system to discharge the volatile gases generated during the drying process in real time, and at the same time accelerate the cooling of the end plate through air cooling. The end plate is cooled by forced air cooling in the air cooling channel, and the volatile gases generated during the cooling process enter the waste gas treatment system through the cooling waste gas outlet 19 for treatment.

[0027] Furthermore, the first furnace-entering transverse moving robot 5 and the second furnace-entering transverse moving robot 12 are used to grab the end-sealed plates and place them on the conveyor belt of the drying furnace, forming synchronous control with the end-sealing machine and the drying furnace.

[0028] Furthermore, the infrared drying oven's heating temperature range is 80-150°C, and the hot air speed is controlled at 1-3m / s. This is adjusted in real time by a PID temperature control system and a wind speed sensor. The PID temperature control system adjusts the heating power of the infrared heating rod in real time based on the set temperature range and feedback from the temperature sensor to control the heating temperature. The wind speed sensor monitors the hot air speed and feeds the data back to the control system, adjusting the fan speed in real time to maintain the hot air speed within the range of 1-3m / s. This prevents slurry sagging caused by excessively high or low temperatures or improper wind speeds, ensuring the quality of the chip capacitor terminations.

[0029] The working method of the chip capacitor termination drying device includes the following steps: Step 1, A-side processing stage: flipping the end surface to be sealed: the end-sealing plate after implantation enters the end-sealing machine, and the end-sealing plate is first flipped by the A-side pre-leveling flipping mechanism 1 so that the end-sealing surface faces upward; surface leveling treatment: after flipping again, the end-sealing plate with the end-sealing surface facing downward is conveyed to the A-side pre-end-sealing leveling mechanism 2 for surface leveling to ensure the end-sealing accuracy; end-sealing slurry coating: the leveled end-sealing plate enters the A-side end-sealing machine 3, and the end-sealing slurry coating is completed: the end-sealing slurry coating of the A-side is completed synchronously by the two first slurry dipping mechanisms 17 inside it; Step 2, A-side drying and cooling stage: the manipulator grabs and synchronously flips and lifts it to the furnace entrance: the end-sealed plate after A-side sealing is lifted to the furnace entrance position by the A-side end-sealed furnace lifting mechanism 4; infrared and hot air three-dimensional drying: the first furnace entry transverse movement manipulator 5 grabs the end-sealed plate and places it on the conveyor belt of the A-side infrared drying furnace 6, and the first hot air circulation pipe 7 above the drying furnace cooperates with infrared heating to perform three-dimensional drying of the end-sealed plate; cooling and cooling: after the drying is completed, the end-sealed plate reaches the A-side furnace discharging cooling mechanism 8 and is cooled by air cooling or other means; Step 3, B side processing stage: flipping and switching the end-sealing surface: the cooled end-sealed plate is flipped again 180 degrees by the B side pre-leveling flipping mechanism 20 and switched to the B side end-sealing state; B side leveling and end-sealing: after entering the B side pre-end-sealing leveling mechanism 9 for leveling, the B side end-sealing is completed by the two second slurry dipping mechanisms 18 of the B side end-sealing machine 10; Step 4, B side drying and discharging stage: lifting and sending into the drying furnace: the end-sealed plate after B side sealing is lifted to the furnace mouth by the B side end-sealed furnace lifting mechanism 11, and the second furnace-entering transverse robot 12 sends it into the B side infrared heating drying furnace 13, and uses the second hot air circulation pipe 14 and infrared heating to dry it; cooling and discharging: the dried end-sealed plate is cooled by the B side furnace discharging cooling mechanism 15, and finally placed on the furnace discharging cooling rack 16, completing the entire end-sealing and drying parallel process.

[0030] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A chip capacitor end-sealing and drying device, comprising an A-side processing unit, a B-side processing unit and a furnace-discharging cooling unit connected in sequence, wherein the A-side processing unit comprises an A-side pre-leveling flipping mechanism (1), an A-side pre-sealing flattening mechanism (2), and an A-side end-sealing machine (3), wherein the A-side end-sealing machine (3) comprises two first slurry dipping mechanisms (17), an A-side end-sealing post-furnace lifting mechanism (4) is provided at the outlet end of the A-side processing unit, and an A-side infrared drying furnace (6) on one side is connected to the A-side infrared drying furnace (6) via a first furnace-feeding transverse manipulator (5), a first hot air circulation pipe (7) is provided above the A-side infrared drying furnace (6), and an output end of the A-side infrared drying furnace (6) is connected to the A-side furnace-discharging cooling mechanism (8), the B-side processing unit comprises a B-side pre-leveling flipping mechanism (20), a B-side pre-sealing flattening mechanism (9), and a B-side end-sealing machine (10), wherein the B-side The end sealing machine (10) includes two second slurry dipping mechanisms (18), the outlet end of the B-side processing unit is provided with a B-side end sealing rear furnace lifting mechanism (11), the output end of which is connected to the B-side infrared heating and drying furnace (13) through a second furnace entry transverse moving robot (12), a second hot air circulation pipe (14) is provided above the B-side infrared heating and drying furnace (13), the output end of the B-side infrared heating and drying furnace (13) is connected to the B-side furnace exit cooling mechanism (15), the furnace exit cooling unit includes a furnace exit cooling rack (16), the B-side furnace exit cooling mechanism (15) is docked with the furnace exit cooling rack (16), the A-side pre-leveling flipping mechanism (1) and the B-side pre-leveling flipping mechanism (20) are used to flip the end sealing plate 180 degrees, and the first furnace entry transverse moving robot (5) and the second furnace entry transverse moving robot (12) are used to send the end sealing plate into the corresponding drying furnace.

2. The chip capacitor terminal sealing and drying device according to claim 1, characterized in that: The slurry dipping mechanisms of the A-side sealing machine (3) and the B-side sealing machine (10) adopt a symmetrically arranged double slurry dipping structure, and the first slurry dipping mechanism (17) and the second slurry dipping mechanism (18) both include a slurry tank and a liquid level control system to apply the sealing slurry to one end of the chip capacitor.

3. The chip capacitor terminal sealing and drying device according to claim 2, characterized in that: The infrared drying furnace (6) on the A side and the infrared heating drying furnace (13) on the B side both adopt a composite heating method of infrared heating rods and hot air circulation. The first hot air circulation pipe (7) and the second hot air circulation pipe (14) are respectively connected to the hot air circulation system inside the drying furnace, which can form hot air convection from top to bottom and form three-dimensional heating in combination with infrared radiation.

4. The chip capacitor terminal sealing and drying device according to claim 3, characterized in that: The A-side pre-leveling flip mechanism (1) and the B-side pre-leveling flip mechanism (20) both use a flip bracket rotated by a cylinder to accurately flip the end plate 180 degrees.

5. The chip capacitor terminal sealing and drying device according to claim 4, characterized in that: The A-side processing unit and the B-side processing unit are arranged in parallel on the same frame, and the A-side infrared drying furnace (6) and the B-side infrared heating drying furnace (13) are respectively located at the outlet end of the end sealing machine, forming a compact layout.

6. The chip capacitor terminal sealing and drying device according to claim 5, characterized in that: The A-side out-of-furnace cooling mechanism (8) and the B-side out-of-furnace cooling mechanism (15) both comprise an air cooling channel and a cooling waste gas outlet (19). The cooling waste gas outlet (19) is connected to a waste gas treatment system to discharge volatile gases generated during the drying process in real time, while accelerating the cooling of the end plate through air cooling.

7. The chip capacitor terminal sealing and drying device according to claim 6, characterized in that: The first furnace-entry transverse moving manipulator (5) and the second furnace-entry transverse moving manipulator (12) are used to grab the end-sealing plates and place them on the conveyor belt of the drying furnace, forming synchronous control with the end-sealing machine and the drying furnace.

8. The chip capacitor terminal sealing and drying device according to claim 7, characterized in that: The heating temperature range of the infrared drying oven is 80-150°C, and the hot air speed is controlled at 1-3m / s, which is adjusted in real time by a PID temperature control system and a wind speed sensor.

9. The operating method of the chip capacitor terminal sealing and drying device according to claim 8, characterized in that: The steps include: Step 1, A-side processing stage: flipping the end surface to be sealed: the end plate after implantation enters the end sealing machine, and the end plate is first flipped by the A-side leveling front flipping mechanism (1) so that the end surface to be sealed faces upward; surface leveling treatment: after flipping again, the end plate with the end surface to be sealed facing downward is transported to the A-side end sealing front leveling mechanism (2) for surface leveling to ensure end sealing accuracy; coating end sealing slurry: the leveled end plate enters the A-side end sealing machine (3) for coating end sealing slurry: the end sealing slurry coating of the A-side is completed synchronously by the two first slurry dipping mechanisms (17) inside the end sealing machine; Step 2, drying and cooling stage of side A: the manipulator grabs and synchronously flips and lifts it to the furnace entrance: the end plate after side A is sealed is lifted to the furnace entrance position by the furnace lifting mechanism (4) after side A is sealed; infrared and hot air three-dimensional drying: the first furnace entry transverse manipulator (5) grabs the end plate and places it on the conveyor belt of the infrared drying furnace (6) of side A, and the first hot air circulation pipe (7) above the drying furnace cooperates with infrared heating to perform three-dimensional drying of the end plate; cooling and cooling: after the drying is completed, the end plate reaches the cooling mechanism (8) of side A and is cooled by air cooling or other means; Step 3, B-side processing stage: flipping and switching the end-sealing surface: the cooled end-sealing plate is flipped again by 180 degrees through the B-side pre-leveling flipping mechanism (20) and switched to the B-side end-sealing state; B-side leveling and end-sealing: after entering the B-side pre-end-sealing leveling mechanism (9) for leveling, the B-side end-sealing is completed through the two second slurry dipping mechanisms (18) of the B-side end-sealing machine (10); Step 4, B side drying and discharging stage: lifting and sending into the drying furnace: the end-sealed plate after B side sealing is lifted to the furnace mouth by the B side end-sealed furnace lifting mechanism (11), and the second furnace-entering transverse manipulator (12) sends it into the B side infrared heating drying furnace (13), and uses the second hot air circulation pipe (14) and infrared heating to dry it; cooling and discharging: the dried end-sealed plate is cooled by the B side furnace discharging cooling mechanism (15), and finally placed on the furnace discharging cooling rack (16), completing the entire end-sealing and drying parallel process.

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