Semiconductor detection jig and use method thereof

Abstract

The invention provides a semiconductor detection tool and a use method thereof, and the tool comprises a pedestal which is connected with a vertical plate and is located in front of a wafer box door opening assembly along the Y direction; the key telescopic reference assembly is arranged on the vertical plate and comprises a key reference shaft capable of moving in the Y direction; the first dial indicator measuring assembly is used for presenting a reference value and a measured value, is arranged on the vertical plate and comprises a plurality of dial indicators distributed in the circumferential direction, when the key reference shaft is located in an area surrounded by all the spherical measuring heads, a reference state is formed, and in the reference state, readings of all the dial indicators are combined to form the reference value; the key reference head is detachably arranged on the wafer box door opening assembly and protrudes forwards from the surface of the wafer box door opening assembly. The problem that the position precision cannot be measured after the wafer box door opening assembly is installed and debugged is solved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor equipment, and in particular relates to a semiconductor testing fixture and a method of using the same. Background Art

[0002] Vertical furnace heat treatment equipment is a crucial process in semiconductor manufacturing. The front-opening interface mechanical unit is responsible for safely and precisely opening the wafer cassette, allowing the wafers inside to enter the semiconductor equipment. Because semiconductor manufacturing requires extremely high levels of environmental cleanliness and operational precision, the cassette opening equipment must ensure that the opening process does not cause contamination or physical damage to the wafers. Its stability, reliability, and durability are crucial to the proper operation of the furnace heat treatment process, as well as the stability of the entire process and product quality.

[0003] The front-opening interface mechanical unit door opening assembly is responsible for opening and closing the wafer cassette. When the wafer cassette is transported to the front-opening interface mechanical unit door opening assembly position by the robot, the positioning system first accurately positions it.

[0004] After positioning, the positioning system moves forward slowly, and the key and positioning pin will be accurately inserted into the key hole and pin hole on the wafer box opposite the door opening component panel of the front opening interface mechanical unit.

[0005] Then, the front-opening interface mechanical unit door opening component activates vacuum adsorption at the pin hole according to the preset program and instructions to adsorb the wafer box; the key in the keyhole slowly rotates to open the wafer box.

[0006] Then the door opening assembly of the front-opening interface mechanical unit moves backward and horizontally with the wafer box cover, and the wafer box cover is successfully opened.

[0007] During the entire process, the sealing and cleaning systems continue to work to maintain the cleanliness of the environment.

[0008] After the lid is opened, wafers can be transferred into the device through other equipment. When the wafers in the wafer cassette are processed, the front-opening interface mechanical unit door opening assembly will move the wafer cassette lid horizontally to the front of the wafer cassette, completing the operation of closing the wafer cassette cover (the process is the reverse of the wafer cassette lid opening process).

[0009] Throughout the entire process, the front-opening interface mechanical unit's door assembly plays a crucial role in opening and closing the wafer cassette lid and maintaining internal seals and cleanliness. The positioning of the door assembly's pins and keys, as well as the panel's position and verticality relative to the cassette's positioning system, are crucial. Improper positioning can cause physical damage to the cassette, even damaging the wafers within, while also compromising internal seals and cleanliness.

[0010] During traditional installation, due to the accumulated tolerances of machined parts, the door opening assembly of the front-hinged interface mechanical unit ultimately requires manual fine-tuning. This is difficult, and the post-adjustment status is difficult to inspect. Therefore, a jig device is needed to comprehensively inspect the assembly and installation accuracy of the door opening assembly of the front-hinged interface mechanical unit of semiconductor vertical furnace heat treatment equipment. Summary of the Invention

[0011] The purpose of the present invention is to provide a semiconductor inspection fixture and its use method, which solves the problems of the inability to measure the accuracy of the wafer box door opening assembly after installation and debugging, the uncertainty of the debugging process direction, and the lack of reference for component change data after debugging. It also unifies the differences after manual installation and debugging, and ensures the uniformity and stability of the door opening assembly performance. The technical solution adopted is: A semiconductor testing fixture, comprising: A base 1 connected to a riser 2, wherein the riser 2 is located in front of the wafer box door assembly 23 along the Y direction; a key telescopic reference assembly 3 , which is disposed on the front surface of the riser 2 and includes a key reference axis 15 movable along the Y direction; and a No. 1 dial indicator measuring assembly, for presenting reference values ​​and measured values, disposed on the front surface of the riser 2 and comprising a plurality of circumferentially distributed dial indicators 8, each including a spherical measuring head 9. A reference state is established when the key reference axis 15 is within an area A surrounded by all of the spherical measuring heads 9 and in contact with the spherical measuring heads 9. The aggregate readings of the dial indicators 8 in the reference state form the reference value. The key reference head 11 is capable of pushing the key reference shaft 15 forward along the Y direction to outside the area A. The key reference head 11 has an outer diameter equal to that of the key reference shaft 15 and is located behind the riser 2. The key reference head 11 is detachably mounted on the wafer cassette door assembly 23 and protrudes forward from the front surface of the wafer cassette door assembly 23. The key reference head 11 can pass through the No. 1 through hole in the riser 2. When the key reference head 11 is in contact with all the spherical measuring heads 9, a measuring state is formed; in the measuring state, the readings of each dial gauge are aggregated to form the measured value; During the conversion from the reference state to the measurement state, the key reference head 11 abuts against the key reference shaft 15 and pushes the key reference shaft 15 forward.

[0012] Preferably, the key telescopic reference assembly 3 further comprises: The No. 1 mounting seat 16 defines a No. 1 mounting cavity extending along the Y direction. The rear end surface of the No. 1 mounting cavity is open to allow the key reference shaft 15 to extend. The rear section of the No. 1 mounting cavity is embedded with a No. 1 guide sleeve 21, which is slidably connected to the key reference shaft 15. The front end surface of the No. 1 mounting cavity is fixedly provided with a No. 1 sealing plate 19, which defines a No. 1 access hole that cooperates with the key reference shaft 15. The No. 1 access hole is a through hole and communicates with the No. 1 mounting cavity. The first mounting seat 16 is fixedly arranged; The No. 1 compression spring 17 is used to reset the key reference shaft 15. It is located between the No. 1 spring baffle 18 and the No. 1 step. The No. 1 spring baffle 18 is embedded in the installation cavity and has a clearance fit with the key reference shaft 15. The No. 1 step is formed on the key reference shaft 15.

[0013] Preferably, a U-shaped groove is provided on the No. 1 mounting seat 16 , a guide wheel 20 is installed in the U-shaped groove, and the guide wheel 20 is connected to the key reference shaft 15 .

[0014] Preferably, the No. 1 micrometer measuring assembly further includes: Several fixed blocks 10 are arranged corresponding to the dial indicator 8, and each spherical measuring head 9 passes through the limit hole on the fixed block 10; the outer shell of each dial indicator 8 is embedded in the corresponding dial indicator mounting hole; all the fixed blocks 10 form a frame connected end to end, and the frame surrounds the No. 1 through hole; the frame is located in the area B surrounded by the dial indicator mounting hole, and a connecting piece is provided on its front end surface, and the area B is located in front of the No. 1 through hole on the vertical plate 2; the No. 1 mounting seat 16 is connected to the connecting piece.

[0015] Preferably, it further comprises: A pin telescopic reference axis assembly 4 is provided on the vertical plate 2 and includes a pin reference axis 22 movable along the Y direction; A second dial indicator measuring assembly, used to present reference values ​​and measured values, is provided on the vertical plate 2 and includes a plurality of dial indicators distributed along the circumference. A reference state is formed when the pin reference axis 22 is located within the area C surrounded by the spherical measuring heads of all the dial indicators and contacts all the spherical measuring heads. In the reference state, the readings of the various dial indicators are combined to form the reference value of the second dial indicator measuring assembly; The pin reference head 12 can push the pin reference axis 22 forward along the Y direction to outside the area C. It is located behind the vertical plate 2 and has an outer diameter equal to that of the pin reference axis 22. It is detachably mounted on the wafer box door opening assembly 23 and protrudes forward from the surface of the wafer box door opening assembly 23. When the pin reference head 12 contacts all the spherical measuring heads, a measuring state is formed. In the measuring state, the readings of each dial indicator are aggregated to form the measurement value of the second dial indicator measuring assembly. During the conversion from the reference state to the measurement state, the pin reference head 12 abuts against the pin reference shaft 22 and pushes the pin reference shaft 22 forward.

[0016] Preferably, the pin telescopic reference axis assembly 4 further comprises: The No. 2 mounting seat has a No. 2 mounting cavity extending along the Y direction, the rear end face of the No. 2 mounting cavity is open so that the pin reference shaft 22 extends out, and the rear section of the No. 2 mounting cavity is embedded with a No. 2 guide sleeve, which is slidably connected to the pin reference shaft 22; a No. 2 closing plate is fixedly provided on the front end face of the mounting cavity, and a No. 2 inlet and outlet hole is defined on the No. 2 closing plate, which cooperates with the pin reference shaft 22, and the No. 2 inlet and outlet hole is a through hole and communicates with the No. 2 mounting cavity; The second mounting seat is fixedly arranged; The No. 2 compression spring is used to reset the pin reference shaft 22. It is located between the No. 2 spring baffle and the step. The No. 2 spring baffle is embedded in the installation cavity and has a clearance fit with the pin reference shaft 22. The No. 2 step is formed on the pin reference shaft 22.

[0017] Preferably, the structure of the No. 2 micrometer measuring assembly is the same as that of the No. 1 micrometer measuring assembly.

[0018] Preferably, a first V-groove block 13 and a second V-groove block 14 are provided on the bottom surface of the base plate 1 , which are adapted to the wafer box carrier 24 for positioning the wafer box.

[0019] A method for using a semiconductor testing fixture comprises the following steps: The round box stage 24 moves along the Y direction toward the wafer box door opening assembly 23. During the conversion from the reference state to the measurement state, the key reference shaft 15 is supported by the key reference head 11, and the key reference shaft 15 moves forward. The key reference head 11 contacts each spherical measuring head 9, and the offset of the key reference head 11 is determined by analyzing the change in the dial indicator value; According to the change in the value, the position of the key reference head 11 is manually adjusted accordingly.

[0020] Compared with the prior art, the advantages of the present invention are: 1. The position state that is difficult to observe and adjust is numerically quantified; 2. The measured values ​​can be analyzed for a single target position status or the overall position status. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is the overall side view of the semiconductor inspection fixture; Figure 2 This is the overall front view of the semiconductor inspection fixture; Figure 3This is the overall right view of the semiconductor inspection fixture; Figure 4 This is the front view of the No. 1 micrometer detection component; Figure 5 This is the front view of the No. 2 micrometer detection component; Figure 6 Front view of the base plate; Figure 7 A cross-sectional view of the key telescopic reference shaft assembly; Figure 8 A cross-sectional view of the pin telescopic reference shaft assembly; Figure 9 This is a schematic diagram of the use of semiconductor inspection fixtures; Figure 10 This is the detection principle diagram of the No. 1 micrometer detection component; Figure 11 This is the measurement state diagram corresponding to the key telescopic reference shaft assembly; Figure 12 Measurement state diagram corresponding to the pin telescopic reference axis assembly.

[0022] Among them, 1-base, 2-vertical board; 3-key telescopic reference shaft assembly, 4-pin telescopic reference shaft assembly; 5-handle, 6-support connecting plate, 7-limiting block; 8-micrometer indicator, 9-spherical measuring head, 10-fixed block; 11-key reference head, 12-pin reference head; 13-No. 1 V-groove block, 14-No. 2 V-groove block; 15-key reference shaft, 16-No. 1 mounting seat, 17-No. 1 compression spring, 18-No. 1 spring baffle, 19-No. 1 sealing plate, 20-guide wheel, 21-No. 1 guide sleeve; 22-pin reference axis; 23- wafer box door opening assembly, 24- wafer box carrier. DETAILED DESCRIPTION

[0023] The following is a more detailed description of the semiconductor inspection fixture and its use method of the present invention, with reference to schematic diagrams. These diagrams illustrate preferred embodiments of the present invention. It should be understood that those skilled in the art may modify the present invention described herein while still achieving the beneficial effects of the present invention. Therefore, the following description should be understood as a general guide for those skilled in the art and not as a limitation of the present invention.

[0024] In this embodiment, the "key reference axis 15" is the reference key, which is the same as the center of the keyhole on the wafer box, and the "key reference head" is the measuring key, that is, the key to be detected on the wafer box door opening assembly.

[0025] The "pin reference axis 22" is the reference pin, which is the same as the center of the pin hole on the wafer box, and the "pin reference head" is the measuring pin, that is, the pin to be detected on the wafer box door opening assembly.

[0026] like Figures 1 to 12 , a semiconductor testing fixture, comprising: The base 1 can move along the Y direction with the wafer box carrier and is connected to the vertical plate 2. The vertical plate 2 is located in front of the wafer box door opening assembly 23 along the Y direction. A handle 5 is provided on the base. A supporting connecting plate 6 is provided between the base 1 and the vertical plate 2.

[0027] The bottom surface of base plate 1 is provided with V-grooved blocks 13 and 14, which mate with wafer cassette carrier 24 for positioning the wafer cassette. The V-grooved blocks are positioned by the precision-machined lower base plate, primarily to position the jig and establish a benchmark for accurate measurement of the door assembly of the front-opening interface mechanical unit.

[0028] The key telescopic reference assembly 3 is provided on the front surface of the vertical plate 2 and includes a key reference shaft 15 movable along the Y direction; the movable end of the key reference shaft 15 is located in front of the vertical plate 2; A No. 1 dial gauge measuring assembly, used to display reference and measured values, is mounted on vertical plate 2 and includes several circumferentially distributed dial gauges 8. A reference state is established when the key reference axis 15 is within and in contact with all spherical measuring heads 9 within area A encompassed by the spherical measuring heads 9. In this state, the aggregate readings of each dial gauge 8 form the reference value. The spherical measuring heads 9 are retractably mounted on the housing of the dial gauges 8. The structure of the dial gauges 8 is conventional.

[0029] The key reference head 11 can push the key reference axis 15 forward along the Y direction to the outside of area A. It is equal to the outer diameter of the key reference axis 15 and is located behind the vertical plate 2. It is detachably arranged on the wafer box door opening assembly 23 and protrudes forward from the surface of the wafer box door opening assembly 23; the key reference head 11 can pass through the No. 1 through hole on the vertical plate 2 to adapt to the No. 1 through hole; the No. 1 through hole is located behind areas A and B.

[0030] When the key reference head 11 contacts all the spherical measuring heads 9, a measuring state is formed; in the measuring state, the readings of each dial indicator are aggregated to form a measured value.

[0031] During the conversion from the reference state to the measurement state, the key reference head 11 passes forward through the No. 1 through hole on the vertical plate 2 , abuts against the key reference shaft 15 , and pushes the key reference shaft 15 forward.

[0032] In the reference state, the key reference axis 15 is located in area A and outside the No. 1 through hole; During the state switching process, the key reference head 11 passes through the No. 1 through hole and enters the area A surrounded by the spherical measuring head 9.

[0033] Figure 1 The machining accuracy of vertical plate 2, i.e., the positional accuracy of the four through holes (two No. 1 through holes and two No. 2 through holes) relative to the positioning reference, can ensure the positional accuracy of No. 2 through holes and No. 1 through holes. Vertical plate 2 provides the installation reference for the reference shaft telescopic assembly.

[0034] After the key reference axis 15 and the pin reference axis 22 are extended, they serve as the reference of their respective dial indicators. By fine-tuning the position of the dial indicator in the dial indicator mounting hole, the dial indicator measuring head is pressed against the calibration rod (reference axis), so that the values ​​of the four dial indicators are unified to the same specific value, which serves as the measurement reference value.

[0035] Specifically, the key telescopic reference component 3 also includes: The No. 1 mounting seat 16 defines a No. 1 mounting cavity extending along the Y direction. The rear end of the No. 1 mounting cavity is open to allow the key reference shaft 15 to extend. A No. 1 guide sleeve 21 is embedded in the front section of the No. 1 mounting cavity and is slidably connected to the key reference shaft 15. A No. 1 sealing plate 19 is fixedly mounted on the front end of the No. 1 mounting cavity. The No. 1 sealing plate 19 defines a No. 1 access hole that cooperates with the key reference shaft 15. The No. 1 access hole is a through hole and communicates with the No. 1 mounting cavity. Mounting seat No. 16, fixed setting; The No. 1 compression spring 17 is used to reset the key reference shaft 15. It is located between the No. 1 spring baffle 18 and the No. 1 step. The No. 1 spring baffle 18 is embedded in or fixed in the installation cavity and has a clearance fit with the key reference shaft 15. The No. 1 step is formed on the key reference shaft 15.

[0036] The initial state before the key reference shaft 15 and the key reference head 11 abut against each other, as shown in FIG. Figure 7 As shown, the No. 1 compression spring 17 is in a natural state or a compressed state.

[0037] Furthermore, a U-shaped groove is provided on the No. 1 mounting seat 16 , and a guide wheel 20 is installed in the U-shaped groove. The guide wheel 20 is connected to the key reference shaft 15 .

[0038] The No. 1 dial indicator measuring kit also includes: Several fixed blocks 10 are arranged corresponding to the dial indicator 8, and each spherical measuring head 9 passes through the limit hole on the fixed block 10; the outer shell of each dial indicator 8 is embedded in the corresponding dial indicator mounting hole; all the fixed blocks 10 form a frame connected end to end, the frame surrounds the No. 1 through hole, and the frame is located in the area B surrounded by the dial indicator mounting hole. A connecting piece is provided on its front end surface, and the area B is connected to the No. 1 through hole on the vertical plate 2; the mounting seat 16 is connected to the connecting piece.

[0039] Specifically, the No. 1 mounting seat 16 is fixed to the connecting piece, and its rear end is embedded in the connecting piece.

[0040] like Figure 1 As described above, the connecting piece is a cover plate, which is used to close area B.

[0041] In this embodiment, the No. 1 micrometer measuring assembly consists of four fixed blocks and four micrometers. The distance between the micrometer and the center can be changed to adapt to the change of the reference head.

[0042] The semiconductor testing fixture further comprises: A pin telescopic reference axis assembly 4 is provided on the vertical plate 2 and includes a pin reference axis 22 movable along the Y direction; The second dial indicator measuring assembly is used to present the reference value and the measured value. It is set on the vertical plate 2 and includes a plurality of dial indicators distributed along the circumference. When the pin reference axis 22 is located in the area C surrounded by the spherical measuring heads of all the dial indicators and contacts the measuring heads, a reference state is formed. In the reference state, the readings of each dial indicator are combined to form the reference value of the second dial indicator measuring assembly. The pin reference head 12 is used to push the pin reference axis 22 forward along the Y direction to outside the area C. The pin reference head 12 has an outer diameter equal to that of the pin reference axis 22 and is located behind the vertical plate 2. The pin reference head 12 is detachably mounted on the wafer box door assembly 23 and protrudes forward from the surface of the wafer box door assembly 23. The pin reference head 12 can pass through the second through hole on the vertical plate 2. When the pin reference head 12 contacts all the spherical measuring heads, a measuring state is formed; in the measuring state, the readings of each dial indicator are aggregated to form the measurement value of the second dial indicator measuring assembly.

[0043] During the conversion from the reference state to the measurement state, the pin reference head 12 passes forward through the No. 2 through hole on the vertical plate 2 and abuts against the pin reference axis 22 .

[0044] The pin telescopic reference axis assembly 4 also includes: The No. 2 mounting seat has a No. 2 mounting cavity extending along the Y direction, the rear end of the No. 2 mounting cavity is open so that the pin reference shaft 22 extends out. The front end of the No. 2 mounting cavity is embedded with a No. 2 guide sleeve, which is slidably connected to the pin reference shaft 22. A No. 2 closing plate is fixedly provided on the front end of the mounting cavity, and a No. 2 inlet and outlet hole is defined on the No. 2 closing plate, which cooperates with the pin reference shaft 22. The No. 2 inlet and outlet hole is a through hole and communicates with the No. 2 mounting cavity. Mount No. 2, fixed setting; The No. 2 compression spring is used to reset the pin reference shaft 22. It is located between the No. 2 spring baffle and the step. The No. 2 spring baffle is embedded in the installation cavity and has a clearance fit with the pin reference shaft 22. The No. 2 step is formed on the pin reference shaft 22.

[0045] The initial state before the pin reference shaft 22 and the pin reference head 12 collide with each other, as shown in FIG. Figure 8 As shown, the No. 1 compression spring 17 is in a natural state or a compressed state.

[0046] The No. 2 micrometer measuring assembly has the same structure and working principle as the No. 1 micrometer measuring assembly.

[0047] In the reference state, the pin reference axis 22 is located in area C and outside the second through hole; During the state switching process, the pin reference head 12 passes through the second through hole and enters the area surrounded by the spherical measuring head.

[0048] The front-opening interface mechanical unit door assembly is crucial for opening and closing the wafer cassette. After manual installation and commissioning, a jig is placed for testing.

[0049] The working principle of this fixture: Step 1: Place the jig on the wafer box carrier 24. At this time, the wafer box carrier 24 is in the exit state, and it is necessary to ensure that the jig is placed in place.

[0050] The wafer cassette carrier can be moved forward and backward relative to the position of the person standing. When the person places the wafer cassette, the carrier moves out (i.e., exits the state). After placement, the person operates the carrier to move it back in, and the carrier with the wafer cassette is pressed against the wafer cassette door assembly 23, preparing to open the wafer cassette.

[0051] The wafer box door opening assembly 23 is in the box opening position, and the cylinder pushes the wafer box carrier 24 to move along the Y direction toward the wafer box door opening assembly 23, and the limit block 7 is limited to the bottom.

[0052] Step 2: The changes of each micrometer can be manually observed. By analyzing the changes in the values ​​of each micrometer, the position, verticality and other parameter information of the front-opening interface mechanical unit door opening component (wafer box door opening component 23) relative to the wafer box carrier can be analyzed and determined.

[0053] The specific implementation of the No. 1 micrometer measurement component is as follows: 4 micrometers are set at each detection position, corresponding to the four directions of up, down, left and right. If the detection target position deviates, assuming it deviates to the left, the micrometer value on the left will increase, and the micrometer value on the right will decrease; assuming it deviates upward, the micrometer value on the upper side will increase, and the micrometer value on the lower side will decrease. Figure 10 .

[0054] When the jig is sent to the measurement position along the Y direction by the wafer box carrier 24 (the process of converting from the reference state to the measurement state), the reference axes at each position (key reference axis 15 and pin reference axis 22) are supported by the measurement target and the reference axes withdraw.

[0055] like Figure 11As shown, taking the measurement of the key reference head 11 as an example, the following is explained: The vertical plate 2 is equivalent to the wafer box to be opened by the door opening assembly 23.

[0056] The key reference head 11 also has the same outer diameter as the key reference shaft 15 .

[0057] Therefore, if the key on the wafer box door opening assembly 23 has no position deviation, when the key reference head 11 contacts the spherical measuring head 9 of the micrometer, the reading of the micrometer 8 will not change.

[0058] Thus, the measurement of the key of the wafer box door opening assembly 23 is achieved.

[0059] The key reference head 11 and pin reference head 12 enter the middle position of each dial indicator, replacing the reference axis position, thereby measuring the position and perpendicularity of each locating pin and key. By analyzing the changes in the dial indicator values, the offset of the detection target (locating pin and key) is determined, and the position of the detection target is manually adjusted accordingly.

[0060] At the same time, combined with the changes in the values ​​of multiple micrometers, it can easily reflect the overall tilt and distortion of the door opening assembly of the front-opening interface mechanical unit, and provide timely feedback to the operator to make corresponding adjustments.

[0061] The key telescopic reference shaft assembly 3 is implemented as follows: the reference shaft serves as the position and shape reference for each key point (key) of the front-opening interface mechanical unit door opening assembly. It is necessary to calibrate the values ​​of each micrometer in real time to ensure the accuracy of the measurement. At the same time, it is necessary to avoid the measured key reference head 11, so the reference shaft is telescopically guided by the No. 1 guide sleeve 21. A No. 1 compression spring 17 is installed behind the reference shaft so that the fixture can return to its initial position when it is withdrawn, thereby calibrating the micrometer. At the same time, there is a guide wheel 20 at the rear end of the key reference shaft to prevent the reference rod from rotating. By sliding in the U-shaped groove, it can both limit the rotation of the key reference shaft and move back and forth with the key reference shaft 15.

[0062] like Figure 12 As shown, the pin retractable reference shaft assembly 4 is implemented as follows: the reference shaft serves as the position and shape reference for each pin point (locating pin) in the door opening assembly of the front-opening interface mechanical unit. It requires real-time calibration of the micrometer values ​​to ensure measurement accuracy. At the same time, it must avoid the measured pin reference head 12, so a precision guide sleeve is used to guide the reference shaft. A compression spring is installed behind the reference shaft to return it to its initial position when the fixture is withdrawn, calibrating the micrometer. The pin standard shaft does not require rotational restriction.

[0063] Through three V-grooves (corresponding to the three V-grooves at the bottom of the wafer box), three positions are distributed at a certain angle. The overall structure is the same as the wafer box base, realizing precise positioning of the base.

[0064] After installation and commissioning of the front-hinged mechanical unit's door opening assembly, a final inspection is performed using a jig. The changes in the dial gauge values ​​of each measuring component are observed, analyzed, and the underlying device status information is analyzed. The front-hinged mechanical unit's door opening assembly structure is then manually adjusted, and the changes in the dial gauge values ​​are observed until they meet the design requirements. Once these meet the requirements, the test position is exited, and the reference rod is used to calibrate the dial gauge values.

[0065] The above description is merely a preferred embodiment of the present invention and does not limit the present invention in any way. Any person skilled in the art who, without departing from the scope of the present invention, makes any equivalent substitution, modification, or other changes to the technical solution and technical content disclosed in the present invention shall be deemed to be within the scope of the present invention and still fall within the scope of protection of the present invention.

Claims

1. A semiconductor testing fixture, characterized in that: include: A base (1) connected to a vertical plate (2), wherein the vertical plate (2) is located in front of the wafer box door assembly (23) along the Y direction; A key telescopic reference assembly (3) is arranged on the front surface of the vertical plate (2) and includes a key reference axis (15) movable along the Y direction; and a No. 1 micrometer measuring assembly for presenting a reference value and a measured value, which is arranged on the front surface of the vertical plate (2), and includes a plurality of micrometers (8) distributed along the circumference, the micrometers (8) including spherical measuring heads (9); when the key reference axis (15) is located in an area A surrounded by all the spherical measuring heads (9) and contacts the spherical measuring heads (9), a reference state is formed, and in the reference state, the readings of the various micrometers (8) are aggregated to form the reference value; The key reference head (11) can push the key reference shaft (15) forward to the outside of the area A along the Y direction. The key reference head (11) has an outer diameter equal to that of the key reference shaft (15). The key reference head (11) is located behind the vertical plate (2). The key reference head (11) is detachably arranged on the wafer box door opening assembly (23) and protrudes forward from the front surface of the wafer box door opening assembly (23). The key reference head (11) can pass through the No. 1 through hole on the vertical plate (2); When the key reference head (11) contacts all the spherical measuring heads (9), a measuring state is formed; in the measuring state, the readings of each dial gauge are aggregated to form the measured value; During the conversion from the reference state to the measurement state, the key reference head (11) abuts against the key reference shaft (15) and pushes the key reference shaft (15) forward.

2. The semiconductor testing fixture according to claim 1, characterized in that: The key telescopic reference assembly (3) further comprises: A No. 1 mounting seat (16) is provided with a No. 1 mounting cavity extending along the Y direction, the rear end surface of the No. 1 mounting cavity is open to allow the key reference shaft (15) to extend, and a No. 1 guide sleeve (21) is embedded in the rear section of the No. 1 mounting cavity, and the No. 1 guide sleeve (21) is slidably connected to the key reference shaft (15); a No. 1 sealing plate (19) is fixedly provided on the front end surface of the No. 1 mounting cavity, and a No. 1 inlet and outlet hole cooperating with the key reference shaft (15) is provided on the No. 1 sealing plate (19), and the No. 1 inlet and outlet hole is a through hole and communicates with the No. 1 mounting cavity; The first mounting seat (16) is fixedly arranged; A No. 1 compression spring (17) is used to reset the key reference shaft (15), and is located between a No. 1 spring baffle (18) and a No. 1 step. The No. 1 spring baffle (18) is embedded in the mounting cavity and is clearance-matched with the key reference shaft (15). The No. 1 step is formed on the key reference shaft (15).

3. The semiconductor testing fixture according to claim 2, characterized in that: A U-shaped groove is provided on the No. 1 mounting seat (16), a guide wheel (20) is installed in the U-shaped groove, and the guide wheel (20) is connected to the key reference shaft (15).

4. The semiconductor testing fixture according to claim 2, characterized in that: The No. 1 micrometer measuring assembly also includes: A plurality of fixed blocks (10) are provided corresponding to the micrometer (8), and each spherical measuring head (9) passes through a limit hole on the fixed block (10); the housing of each micrometer (8) is embedded in the corresponding micrometer mounting hole; all the fixed blocks (10) form a frame connected end to end, and the frame surrounds the No. 1 through hole; the frame is located in an area B surrounded by the micrometer mounting hole, and a connecting piece is provided on its front end surface, and the area B is located in front of the No. 1 through hole on the vertical plate (2); the No. 1 mounting seat (16) is connected to the connecting piece.

5. The semiconductor testing fixture according to claim 1, characterized in that: Further including: A pin telescopic reference axis assembly (4) is arranged on the vertical plate (2) and includes a pin reference axis (22) movable along the Y direction; A second micrometer measuring assembly, for presenting a reference value and a measured value, is provided on a vertical plate (2) and comprises a plurality of micrometers distributed along a circumferential direction. When the pin reference axis (22) is located within an area C surrounded by the spherical measuring heads of all the micrometers and in contact with all the spherical measuring heads, a reference state is formed. In the reference state, the readings of the various micrometers are aggregated to form the reference value of the second micrometer measuring assembly; and a pin reference head (12), which can push the pin reference axis (22) forward to the outside of the area C along the Y direction, is located behind the vertical plate (2) and has an outer diameter equal to that of the pin reference axis (22), and is detachably arranged on the wafer box door opening assembly (23) and protrudes forward from the surface of the wafer box door opening assembly (23); when the pin reference head (12) contacts all the spherical measuring heads, a measuring state is formed; in the measuring state, the readings of each micrometer are aggregated to form the measured value of the second micrometer measuring assembly; During the conversion from the reference state to the measurement state, the pin reference head (12) abuts against the pin reference shaft (22) and pushes the pin reference shaft (22) forward.

6. The semiconductor testing fixture according to claim 5, characterized in that: The pin telescopic reference shaft assembly (4) further comprises: A No. 2 mounting seat is provided with a No. 2 mounting cavity extending in the Y direction, the rear end face of the No. 2 mounting cavity is open to allow a pin reference shaft (22) to extend out, a No. 2 guide sleeve is embedded in the rear section of the No. 2 mounting cavity, and the No. 2 guide sleeve is slidably connected to the pin reference shaft (22); a No. 2 sealing plate is fixedly provided on the front end face of the mounting cavity, and a No. 2 inlet and outlet hole cooperating with the pin reference shaft (22) is provided on the No. 2 sealing plate, and the No. 2 inlet and outlet hole is a through hole and communicates with the No. 2 mounting cavity; The second mounting seat is fixedly arranged; A No. 2 compression spring is used to reset the pin reference shaft (22), and is located between a No. 2 spring baffle and a step. The No. 2 spring baffle is embedded in the mounting cavity and is clearance-matched with the pin reference shaft (22). The No. 2 step is formed on the pin reference shaft (22).

7. The semiconductor testing fixture according to claim 5, characterized in that: The structure of the No. 2 micrometer measuring assembly is the same as that of the No. 1 micrometer measuring assembly.

8. The semiconductor testing fixture according to claim 1, characterized in that: A first V-shaped groove block (13) and a second V-shaped groove block (14) are provided on the bottom surface of the base plate (1), which are adapted to a wafer box carrier (24) for positioning the wafer box.

9. A method for using a semiconductor testing fixture, comprising the following steps: The round box carrier (24) moves along the Y direction toward the wafer box door opening assembly (23). During the process of converting from the reference state to the measurement state, the key reference shaft (15) is supported by the key reference head (11), and the key reference shaft (15) moves forward. The key reference head (11) contacts each spherical measuring head (9), and the offset of the key reference head (11) is determined by analyzing the change in the dial indicator value; According to the change in the value, the position of the key reference head (11) is manually adjusted accordingly.

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