Device and method for rapidly detecting light spot uniformity of semiconductor laser

Abstract

The invention relates to a semiconductor laser light spot uniformity rapid detection device and method, and the device comprises a workbench, a feeding mechanism, a product fixing tray, displacement tables, a linear module, a discharging mechanism, a reflection assembly, a power supply assembly, a photosensitive plate, and an industrial camera. A linear module is arranged at the position, between the two displacement tables, of the workbench, a feeding mechanism and a discharging mechanism are correspondingly arranged at the positions, on one sides of the two displacement tables, of the workbench, a power supply assembly is arranged at the position, on one side of the linear module, of the workbench, and the power supply assembly is located between the feeding mechanism and the discharging mechanism; a reflection assembly is arranged on the workbench on the other side of the linear module, and a light-sensitive plate and an industrial camera are sequentially arranged on the light-emitting side of the reflection assembly. According to the invention, systematic test conditions can be formed, manual construction of a disordered test site is solved, potential safety hazards are solved, the light spots can be preprocessed, and the problem of large error of light spot uniformity test is solved.

Description

Technical Field

[0001] The invention relates to a semiconductor laser spot uniformity rapid detection device and a detection method, belonging to the technical field of laser testing. Background Art

[0002] Some specific lasers now have high requirements for spot uniformity, requiring spot uniformity testing for each product. Manual testing inevitably reduces production efficiency and increases costs. The collimated laser spot is generally very small. Direct testing with an instrument, limited by the instrument's receiving port, can result in significant errors, causing the amplified spot uniformity to fail to meet requirements. Furthermore, the spot energy density is high, and close-range testing can damage the instrument. Increasing attenuation can cause secondary fluctuations in the spot, making it impossible to determine accuracy.

[0003] In summary, the existing laser spot uniformity test has the following deficiencies: (1) It cannot form a systematic test, resulting in low test efficiency. (2) The spot is not pre-processed, resulting in low test accuracy. (3) The spot density is high, which can easily damage the test instrument.

[0004] Chinese patent document CN115077861A discloses a device for testing the uniformity of a laser output spot and its use method. The device comprises a motor base mounted on the motor base, which is mounted on a rotating base. The rotating base is connected to a displacement platform. The front of the displacement platform is evenly inlaid with photodetectors, and the back of the displacement platform is mounted on a data acquisition card. The motor and data acquisition card are both connected to a computer control unit. The photodetector includes a circuit board containing a photodiode, which is connected in series with a resistor, which is connected in parallel with the data acquisition card. This device is used to measure the light intensity at different locations within the spot in real time and provide feedback to the computer control unit to measure the uniformity of the entire spot. However, it does not consider the accuracy and efficiency of spot testing. Summary of the Invention

[0005] In response to the shortcomings of the existing technology, the present invention provides a semiconductor laser spot uniformity rapid detection device, which can form systematic test conditions. It not only solves the problem of manually building a messy test site and addressing safety hazards, but also can pre-process the light spot, solve the problem of large errors in light spot uniformity testing, and solve the defect that the test instrument is easily damaged.

[0006] The present invention also provides a detection method for the semiconductor laser spot uniformity rapid detection device.

[0007] The technical solutions of the present invention are as follows: A semiconductor laser spot uniformity rapid detection device includes a workbench, a loading mechanism, a product fixing tray, a translation stage, a linear module, a unloading mechanism, a reflective component, a power supply component, a photosensitive plate and an industrial camera, wherein: There are translation stages symmetrically arranged in the middle of the workbench, a linear module is arranged on the workbench in the middle of the two translation stages, a loading mechanism and an unloading mechanism are respectively arranged on the workbench on one side of the two translation stages, a power supply assembly is arranged on the workbench on one side of the linear module, and the power supply assembly is located in the middle of the loading mechanism and the unloading mechanism, a reflective assembly is arranged on the workbench on the other side of the linear module, and a photosensitive plate and an industrial camera are arranged on the light-emitting side of the reflective assembly in sequence.

[0008] According to the preferred embodiment of the present invention, the reflective assembly includes several reflectors and a light spot collimating lens. The reflectors are arranged according to the light path reflection path, and the mirror surfaces of the reflectors are arranged from small to large according to the light path reflection path to achieve reflection and amplification of the light spot. A light spot collimating lens is provided on the light output side of the last reflector.

[0009] According to a further preferred embodiment of the present invention, at least two reflectors are provided, and the combination of the reflectors can be freely adjusted according to the actual situation of the light spot to be magnified.

[0010] Preferably, according to the present invention, the loading mechanism includes a three-axis displacement platform A and a clamping claw, the three-axis displacement platform A is provided with a clamping claw, and the unloading mechanism has the same structure as the loading mechanism.

[0011] The gripper is installed on the z-axis displacement module in the three-axis displacement platform A. The x-axis displacement module can move left and right, the y-axis displacement module can move forward and backward, and the z-axis displacement module can move up and down to achieve smooth transfer of the product fixed pallet.

[0012] Preferably, according to the present invention, the product fixing tray includes a base plate, a semiconductor laser, an optical fiber and an optical fiber adapter. A semiconductor laser is provided on one side of the base plate, and the light emitting side of the semiconductor laser is connected to a optical fiber adapter through an optical fiber, and the light beam is output through the optical fiber adapter.

[0013] According to the present invention, it is further preferred that at least one semiconductor laser is provided, and multiple semiconductor lasers may be provided at one time to improve detection efficiency.

[0014] Preferably, according to the present invention, a groove is provided on the bottom plate, and the excess portion of the optical fiber is coiled and arranged in the groove, which is convenient for overall organization and avoids interference caused by the disordered optical fibers.

[0015] According to the preferred embodiment of the present invention, the power supply component includes a three-axis displacement platform B, a rotating platform, a fixed seat and a power supply electrode. The three-axis displacement platform is provided with a rotating platform, the rotating platform is fixed with a fixed seat, and a plurality of different types of power supply electrodes are provided on the fixed seat. By adjusting the position of the power supply electrode, the power supply needs of semiconductor lasers of different specifications can be met.

[0016] Preferably, according to the present invention, a position sensor is provided on one side of the middle portion of the linear module to ensure that the product fixing tray can accurately move to the test position.

[0017] The detection method of the semiconductor laser spot uniformity rapid detection device mentioned above comprises the following steps: (1) The personnel assemble the semiconductor laser to be tested in the product fixing tray, and then place the product fixing tray on the translation table on the side of the loading mechanism; (2) The loading mechanism starts, moves the clamping claw position, clamps the product fixed tray, and then transfers the product fixed tray to the upper side of the linear module. The linear module starts and moves the product fixed tray to the detection position; (3) The power supply component starts to power the semiconductor laser. The light beam is output to the reflective component and amplified by the reflector. The amplified laser spot is collimated into parallel light by the spot collimating lens and irradiated on the photosensitive plate. The industrial camera takes a picture of the spot on the photosensitive plate and then calculates the uniformity of the spot. (4) After the inspection is completed, the unloading mechanism starts and moves the product fixed tray to the displacement table on the other side, and the operator moves it to the next process.

[0018] The beneficial effects of the present invention are: The present invention proposes a new structure of semiconductor laser spot uniformity rapid detection equipment. It realizes automatic loading, testing, and unloading of products through the design of devices such as loading mechanisms, unloading mechanisms, straight lines, and modules. The operation is flexible and convenient, which significantly improves the testing efficiency. The reflective component and photosensitive plate design are used to amplify the light spot, reduce the unit energy density of the light spot, protect the industrial camera, and improve the testing accuracy. In addition, the industrial camera can also use pixel testing to judge the uniformity of the light spot. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 It is a schematic structural diagram of the feeding mechanism of the present invention; Figure 3 This is a schematic diagram of the product fixing tray structure of the present invention; Figure 4 This is a schematic diagram of the power supply assembly structure of the present invention; Figure 5 This is a schematic diagram of the installation position of the position sensor of the present invention; Among them: 1. Workbench; 2. Loading mechanism; 3. Product fixing tray; 4. Translation stage; 5. Linear module; 6. Unloading mechanism; 7. Reflection component; 8. Power supply component; 9. Photosensitive plate; 10. Industrial camera; 11. Position sensor; 21. Three-axis displacement platform A; 22. Gripper; 31. Base plate; 32. Semiconductor laser; 33. Optical fiber; 34. Optical fiber adapter; 71. Reflector; 72. Light spot collimating lens; 81. Three-axis displacement platform B; 82. Rotation platform; 83. Fixed seat; 84. Power supply electrode. DETAILED DESCRIPTION

[0020] The present invention will be further described below with reference to embodiments and accompanying drawings, but is not limited thereto.

[0021] For the convenience of description, if the words "up", "down", "left" and "right" appear in the present invention, they only indicate that they are consistent with the up, down, left and right directions of the drawings themselves, and do not limit the structure. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or component referred to needs to have a specific orientation, be constructed and operate in a specific orientation. Therefore, they cannot be understood as limiting the present invention.

[0022] Example 1: like Figure 1-5 As shown, this embodiment provides a semiconductor laser spot uniformity rapid detection device, including a workbench 1, a loading mechanism 2, a product fixing tray 3, a translation stage 4, a linear module 5, a unloading mechanism 6, a reflection component 7, a power supply component 8, a photosensitive plate 9 and an industrial camera 10, wherein: A displacement stage 4 is symmetrically arranged in the middle of the workbench 1, a linear module 5 is arranged on the workbench in the middle of the two displacement stages 4, a loading mechanism 2 and an unloading mechanism 6 are respectively arranged on the workbench 1 on one side of the two displacement stages 4, a power supply component 8 is arranged on the workbench on one side of the linear module 5, and the power supply component 8 is located in the middle of the loading mechanism 2 and the unloading mechanism 6, a reflection component 7 is arranged on the workbench on the other side of the linear module 5, and a photosensitive plate 9 and an industrial camera 10 are sequentially arranged on the light-emitting side of the reflection component 7.

[0023] The reflection assembly 7 includes 7 reflectors 71 and a light spot collimating lens 72. The reflectors 71 are arranged according to the light path reflection path. The mirror surfaces of the reflectors 71 are arranged from small to large according to the light path reflection path to achieve reflection and amplification of the light spot. A light spot collimating lens 72 is provided on the light output side of the last reflector.

[0024] The loading mechanism 2 includes a three-axis displacement platform A21 and a clamping jaw 22 . The three-axis displacement platform A21 is provided with the clamping jaw 22 . The unloading mechanism 6 has the same structure as the loading mechanism 2 .

[0025] The clamp 22 is installed on the z-axis displacement module in the three-axis displacement platform A21. The x-axis displacement module can move left and right, the y-axis displacement module can move forward and backward, and the z-axis displacement module can move up and down to achieve smooth transfer of the product fixed tray.

[0026] The product fixing tray 3 includes a base plate 31, a semiconductor laser 32, an optical fiber 33 and an optical fiber adapter 34. Three semiconductor lasers 32 are arranged side by side on one side of the base plate 31. The light-emitting side of the semiconductor laser 32 is connected to the optical fiber adapter 34 through the optical fiber 33, and the light beam is output through the optical fiber adapter 34.

[0027] A groove is provided on the bottom plate 31, and the excess portion of the optical fiber 33 is coiled and arranged in the groove, which is convenient for overall organization and avoids interference caused by the disorder of the optical fibers.

[0028] The power supply assembly 8 includes a three-axis displacement platform B81, a rotating platform 82, a fixed seat 83 and a power supply electrode 84. The three-axis displacement platform 81 is provided with a rotating platform 82, the rotating platform 82 is fixed with a fixed seat 83, and the fixed seat 83 is provided with multiple different types of power supply electrodes 84. By adjusting the position of the power supply electrode, the power supply needs of semiconductor lasers of different specifications can be met.

[0029] A position sensor 11 is provided on one side of the middle portion of the linear module 5 to ensure that the product fixing tray can accurately move to the test position.

[0030] The detection method of the semiconductor laser spot uniformity rapid detection device mentioned above comprises the following steps: (1) The personnel assemble the semiconductor laser to be tested in the product fixing tray 3, and then place the product fixing tray 3 on the displacement table 4 on one side of the loading mechanism 2; (2) The loading mechanism 2 starts, moves the clamping claw 22 to clamp the product fixing tray 3, and then transfers the product fixing tray to the upper side of the linear module 5. The linear module 5 starts and moves the product fixing tray 3 to the detection position; (3) The power supply component 8 is started to power the semiconductor laser 32. The light beam is output to the reflective component 7, reflected and amplified by the reflector 71. The amplified laser spot is collimated into parallel light by the spot collimating lens 72 and irradiated on the photosensitive plate 9. The industrial camera takes a picture of the light spot on the photosensitive plate and then calculates the uniformity of the light spot. (4) After the inspection is completed, the unloading mechanism 6 is started to move the product fixed tray to the displacement table on the other side, and the operator moves it to the next process.

[0031] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A semiconductor laser spot uniformity rapid detection device, characterized in that: It includes a workbench, a loading mechanism, a product fixing tray, a translation stage, a linear module, an unloading mechanism, a reflective component, a power supply component, a photosensitive plate and an industrial camera, among which: There are translation stages symmetrically arranged in the middle of the workbench, a linear module is arranged on the workbench in the middle of the two translation stages, a loading mechanism and an unloading mechanism are respectively arranged on the workbench on one side of the two translation stages, a power supply assembly is arranged on the workbench on one side of the linear module, and the power supply assembly is located in the middle of the loading mechanism and the unloading mechanism, a reflective assembly is arranged on the workbench on the other side of the linear module, and a photosensitive plate and an industrial camera are arranged on the light-emitting side of the reflective assembly in sequence.

2. The semiconductor laser spot uniformity rapid detection device according to claim 1, characterized in that: The reflective assembly includes several reflectors and a light spot collimating lens. The reflectors are arranged according to the light path reflection path, and the mirror surfaces are arranged from small to large according to the light path reflection path to achieve reflection and amplification of the light spot. A light spot collimating lens is set on the light output side of the last reflector.

3. The semiconductor laser spot uniformity rapid detection device according to claim 2, characterized in that: At least two reflectors are provided.

4. The semiconductor laser spot uniformity rapid detection device according to claim 2, characterized in that: The loading mechanism includes a three-axis displacement platform A and a clamping claw. The three-axis displacement platform A is provided with a clamping claw. The unloading mechanism has the same structure as the loading mechanism.

5. The semiconductor laser spot uniformity rapid detection device according to claim 4, characterized in that: The product fixing tray includes a base plate, a semiconductor laser, an optical fiber and an optical fiber adapter. A semiconductor laser is arranged on one side of the base plate. The light-emitting side of the semiconductor laser is connected to the optical fiber adapter through an optical fiber, and the light beam is output through the optical fiber adapter.

6. The semiconductor laser spot uniformity rapid detection device according to claim 5, characterized in that: At least one semiconductor laser is provided.

7. The semiconductor laser spot uniformity rapid detection device according to claim 5, characterized in that: A groove is provided on the bottom plate, and the excess part of the optical fiber is coiled and arranged in the groove.

8. The semiconductor laser spot uniformity rapid detection device according to claim 5, characterized in that: The power supply assembly includes a three-axis displacement platform B, a rotating platform, a fixed seat and a power supply electrode. The three-axis displacement platform is provided with a rotating platform, the rotating platform is fixed with a fixed seat, and a plurality of different types of power supply electrodes are provided on the fixed seat.

9. The semiconductor laser spot uniformity rapid detection device according to claim 8, characterized in that: A position sensor is provided on one side of the middle part of the linear module.

10. The detection method of the semiconductor laser spot uniformity rapid detection device according to claim 9, characterized in that: Here are the steps: (1) The personnel assemble the semiconductor laser to be tested in the product fixing tray, and then place the product fixing tray on the translation table on the side of the loading mechanism; (2) The loading mechanism starts, moves the clamping claw position, clamps the product fixed tray, and then transfers the product fixed tray to the upper side of the linear module. The linear module starts and moves the product fixed tray to the detection position; (3) The power supply component starts to power the semiconductor laser. The light beam is output to the reflective component and amplified by the reflector. The amplified laser spot is collimated into parallel light by the spot collimating lens and irradiated on the photosensitive plate. The industrial camera takes a picture of the spot on the photosensitive plate and then calculates the uniformity of the spot. (4) After the inspection is completed, the unloading mechanism starts and moves the product fixed tray to the displacement table on the other side, and the operator moves it to the next process.

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