Cleaning device and cleaning method

Abstract

The invention relates to a cleaning device and a cleaning method. The cleaning device and the cleaning method are used for cleaning a semiconductor substrate with a cutting channel. The cleaning device comprises a movable track and a cleaning piece. The moving track is movable to align at least a portion of the moving track with the scribe line. The cleaning piece is connected with the moving track. And when at least part of the moving track is aligned with the cutting channel, at least part of the cleaning piece extends into the cutting channel and can move along the moving track to clean the cutting channel.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor substrate cutting, and in particular to a cleaning device and a cleaning method. Background Art

[0002] During the semiconductor manufacturing process, semiconductor substrates (e.g., wafers) are cut into multiple dies. Debris generated during the cutting process and residues from applied solvents are likely to remain on the surface of the semiconductor substrate and in the cut streets formed during the cutting process, necessitating a subsequent cleaning process. In related art, the entire semiconductor substrate surface is typically cleaned by spraying chemical solvents and rinsing. However, this cleaning method cannot effectively remove residues in the cut streets, thereby reducing the yield of the die. Summary of the Invention

[0003] The present application provides a cleaning device and a cleaning method for effectively cleaning residues in saw streets formed after sawing a semiconductor substrate, thereby improving the yield of bare chips.

[0004] To achieve the above technical objectives, the present application provides, in one aspect, a cleaning device for cleaning a semiconductor substrate having a scribe line formed thereon. The cleaning device includes a movable track and a cleaning member. The movable track is movable until at least a portion of the movable track is aligned with the scribe line. The cleaning member is connected to the movable track. When at least a portion of the movable track is aligned with the scribe line, at least a portion of the cleaning member extends into the scribe line and is movable along the movable track to clean the scribe line.

[0005] To achieve the aforementioned technical objectives, the present application further provides a cleaning method. The cleaning method comprises: moving a movable track of a cleaning device until at least a portion of the movable track is aligned with a scribe line of a semiconductor substrate; and, when at least a portion of the movable track is aligned with the scribe line, extending at least a portion of a cleaning member of the cleaning device into the scribe line and moving along the movable track to clean the scribe line. The cleaning member is connected to the movable track.

[0006] In the present application, the cleaning device includes a movable track and a cleaning member. The movable track can be moved to align at least a portion of the movable track with the cutting path of the semiconductor substrate. The cleaning member is connected to the movable track. When at least a portion of the movable track is aligned with the cutting path, at least a portion of the cleaning member extends into the cutting path and is movable along the movable track to clean the cutting path. In this way, the present application provides a cleaning member connected to the movable track, so that when the movable track is aligned with the cutting path, at least a portion of the cleaning member can extend into the cutting path and move along the movable track, thereby accurately and effectively cleaning the cutting path, so as to efficiently remove residues in the cutting path, reduce the contamination of the cut bare chips by these residues, and improve the yield of the produced bare chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 is a schematic diagram of a semiconductor substrate after cutting according to some embodiments of the present application;

[0008] Figure 2 is a schematic structural diagram of a cleaning device according to some embodiments of the present application;

[0009] Figure 3 is a schematic structural diagram of a moving track according to other embodiments of the present application;

[0010] Figure 4 is a schematic structural diagram of a cleaning element according to some embodiments of the present application;

[0011] Figure 5 is a schematic diagram of the positions of two cleaning parts according to some embodiments of the present application;

[0012] Figure 6 is a schematic flow chart of a cleaning method according to some embodiments of the present application;

[0013] Figure 7 According to some embodiments of this application Figure 6 Schematic diagram of the process of step S40 in ;

[0014] Figure 8 According to other embodiments of this application Figure 6 Schematic diagram of the process of step S40 in ;

[0015] Figure 9 It is a flow chart of the cleaning method according to other embodiments of the present application. DETAILED DESCRIPTION

[0016] The following describes the embodiments of the present application in detail with reference to the accompanying drawings.

[0017] In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

[0018] The term "and / or" in this document simply describes a relationship between related objects, indicating that three possible relationships exist. For example, "A and / or B" can mean: A exists alone, A and B exist simultaneously, or B exists alone. Furthermore, the character " / " in this document generally indicates that the related objects are in an "or" relationship. Furthermore, "many" in this document means two or more than two.

[0019] The terms "first," "second," and "third" in this application are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of such features. In the description of this application, "multiple" means at least two, for example, two, three, etc., unless otherwise specified in some embodiments. All directional indications in the embodiments of this application (such as up, down, left, right, front, back...) are only used to explain the relative positional relationship, movement, etc. between the components under a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0020] In related art, a semiconductor substrate can be cut into multiple dies through a dicing process. The dicing process can be mechanical dicing, laser dicing, or other dicing methods. After dicing, dicing lanes may be formed on the semiconductor substrate. These dicing lanes separate the semiconductor substrate into multiple dies.

[0021] refer to Figure 1 , Figure 1 FIG. 1 is a schematic structural diagram of a semiconductor substrate 10 having a plurality of dicing streets formed thereon according to some embodiments of the present application. Figure 1 As shown, a plurality of scribe lines 100 are formed on a semiconductor substrate 10. The scribe lines 100 may include a plurality of first scribe lines 110 extending along a first direction X and a plurality of second scribe lines 120 extending along a second direction Y. Two adjacent first scribe lines 100 and two adjacent second scribe lines 120 may collectively define a device region, which forms a die after dicing the semiconductor substrate 10. The present application does not impose any specific restrictions on the shape or material of the semiconductor substrate 10. For example, the semiconductor substrate 10 may be a wafer.

[0022] Specifically, the first direction X and the second direction Y may intersect, that is, they may not be parallel to each other. In some embodiments, the first direction X and the second direction Y may be perpendicular to each other. Accordingly, the first dicing lane 110 and the second dicing lane 120 may define a rectangular device area. This application does not limit the specific intersection angle between the first direction X and the second direction Y.

[0023] During the dicing process, various additives, such as dicing fluid, lubricants, and antioxidants, may need to be applied to the semiconductor substrate 10. This process may also generate debris. Residues of these additives and / or debris may be deposited in the dicing streets 100. Related technologies often fail to effectively clean these residues from the dicing streets 100. These residues may contaminate the die during subsequent processing, thereby affecting the die yield.

[0024] In order to solve the above technical problems, the present application proposes a new cleaning device for cleaning a semiconductor substrate 10 having a dicing street 100 formed thereon.

[0025] refer to Figure 2 , Figure 2 Schematic diagram of the structure of the cleaning device 20 according to some embodiments of the present application. Figure 2 As shown, the cleaning device 20 includes a movable track 23 and a cleaning member 24. The movable track 23 can be moved so that at least a portion of the movable track 23 is aligned with the cutting street 100. The cleaning member 24 is movably connected or fixedly connected to the movable track 23. When at least a portion of the movable track 23 is aligned with the cutting street 100, at least a portion of the cleaning member 24 can extend into the cutting street 100 and can be moved along the movable track 23 to clean the cutting street 100. In some embodiments, when at least a portion of the movable track 23 is aligned with the cutting street 100, the cleaning member 24 can be moved toward the semiconductor substrate 10 so that at least a portion of the cleaning member 24 extends into the cutting street 100 to perform a cleaning operation on the cutting street 100.

[0026] In some embodiments, the cleaning member 24 is movably connected to the movable track 23 and movable along the movable track 23 to more fully clean the dicing street 100. When cleaning the dicing street 100, the cleaning member 24 can be disposed on a side of the movable track 23 close to the semiconductor substrate 10.

[0027] In the above technical solution of the present application, a movable track 23 and a cleaning member 24 are provided that are interconnected. The movable track 23 can be moved to at least partially align with the dicing street 100, thereby allowing at least a portion of the cleaning member 24 to extend into the dicing street 100. The cleaning member 24 can also be moved along the movable track 23 to perform a deep cleaning of the dicing street 100. This can eliminate residues remaining in the dicing street 100, reduce contamination of the die by these residues, and improve the die yield.

[0028] In some embodiments, the cleaning device 20 may further include a first support member 21. The movable track 23 may be connected to the first support member 21, for example, movably connected or fixedly connected.

[0029] In some embodiments, the movable rail 23 can be fixedly connected to the first support member 21. The first support member 21 can be configured to translate or rotate within a horizontal plane defined by the first direction X and the second direction Y, thereby moving the movable rail 23 above the semiconductor substrate 10 and driving the movable rail 23 to translate or rotate so that at least a portion of the movable rail 23 is aligned with one of the plurality of first scribe lines 110 or one of the plurality of second scribe lines 120 above the semiconductor substrate 10. The first support member 21 can also be configured to move up and down, thereby driving the movable rail 23 away from or closer to the semiconductor substrate 10.

[0030] like Figure 2 As shown, the first support member 21 of the cleaning device 20 includes a base 211 and a cantilever 213 connected to each other. The movable rail 23 is fixedly connected to the cantilever 213. The cantilever 213 is movable relative to the base 211 to move the movable rail 23 to at least partially align with the cutting path 100 and / or to drive the cleaning member 24 to at least partially extend into the cutting path 100.

[0031] In some embodiments, the cantilever 213 may be a first robotic arm. The first robotic arm may be configured to have at least three degrees of freedom to achieve translation (including up and down and left and right movement) and rotation. The first robotic arm may have an end effector. The end effector is fixedly connected to the movable track 23 to drive the movable track 23 to move. Optionally, the movable track 23 may also be considered the end effector of the first robotic arm. This application does not limit the specific implementation and other details of the first robotic arm.

[0032] like Figure 2 As shown, the cleaning device 20 further includes a cleaning liquid applicator 25. The cleaning liquid applicator 25 is used to apply cleaning liquid to the semiconductor substrate 10. For example, the cleaning liquid can be applied to the surface of the semiconductor substrate 10 or to the scribe lines 100 after dicing. The cleaning liquid applicator 25 applies cleaning liquid to the semiconductor substrate 10 alternately with the cleaning element 24 cleaning the scribe lines 100. The cleaning liquid applicator 25 can be a cleaning liquid nozzle, etc.

[0033] In some embodiments, the cleaning device 20 further includes a second support member 22 , and the cleaning liquid application portion 25 may be connected to the second support member 22 .

[0034] Similar to the cantilever 213 of the first support member 21, Figure 2 The second support member 22 shown in the figure can be a second robotic arm. The second robotic arm can share the same base 211 as the first robotic arm, that is, the second support member 22 can be connected to the base 211. It should be understood by those skilled in the art that the second support member 22 can also include a base 211 different from that of the first robotic arm, and this application does not impose any specific limitations on this.

[0035] The second robotic arm can also be configured to have at least three degrees of freedom to achieve three kinds of motion: translation (including up and down and left and right movement) and rotation. The second robotic arm can have an end effector. The end effector is fixedly connected to the cleaning liquid applicator 25, or the cleaning liquid applicator 25 itself is the end effector of the second robotic arm. The second robotic arm can move to drive the cleaning liquid applicator 25 to move close to the cutting road 100 or the surface of the semiconductor substrate 10 to apply the cleaning liquid, and can also move to drive the cleaning liquid applicator 25 away from the semiconductor substrate 10. The present application also does not limit the specific implementation and other details of the second robotic arm.

[0036] like Figure 2 As shown, the movable track 23 includes a first track 231 and a second track 232 extending in different directions, and a connecting portion 233 connecting the first track 231 and the second track 232. The cleaning member 24 can move from the first track 231 to the second track 232 along the connecting portion 233, or from the second track 232 to the first track 231 along the connecting portion 233. The connecting section between the first track 231 and the connecting portion 233 may include an arcuate section to achieve a tangential connection or smooth transition between the first track 231 and the connecting portion 233. The connecting section between the second track 232 and the connecting portion 233 may also include an arcuate section to achieve a tangential connection or smooth transition between the second track 232 and the connecting portion 233.

[0037] In some embodiments, when at least a portion of the movable rail 23 is aligned with the cutting street 100, the first rail 231 extends along the first direction X, and the second rail 232 extends along the second direction Y. Thus, when the first support member 21 drives the first rail 231 to align with either the first cutting street 110 or the second cutting street 120, and the intersection of the first rail 231 and the second rail 232 aligns with the corresponding intersection of the first cutting street 110 and the second cutting street 120, the second rail 232 can also align with the other of the first cutting street 110 and the second cutting street 120. This reduces the number of times the first support member 21 moves to align the movable rail 23 with the cutting street 100, thereby improving the alignment accuracy and cleaning efficiency of the cleaning device 20 on the cutting street 100.

[0038] Similarly, by setting the first track 231 and the second track 232 extending in different directions, the cleaning member 24 is allowed to move between the first track 231 and the second track 232 to achieve cleaning of the first cutting path 110 and the second cutting path 120. The number of movements required by the first support member 21 to achieve alignment of the moving track 23 with the cutting path 100 can also be reduced, thereby improving the alignment accuracy and cleaning efficiency of the cleaning device 20.

[0039] like Figure 2As shown, the connecting portion 233 is an arc-shaped connecting portion 233 , the first track 231 and the second track 232 are linear tracks, and both ends of each of the first track 231 and the second track 232 are connected to the arc-shaped connecting portion 233 .

[0040] Alternatively, the connecting portion 233 may be a linear track, and the first track 231 and the second track 232 may be arc tracks respectively. This application does not impose any specific restrictions on the shapes of the first track 231, the second track 232, and the connecting portion 233, and those skilled in the art may set them as needed.

[0041] In other embodiments, the movable track 23 may also be in other forms, such as Figure 3 , Figure 3 2 is a schematic structural diagram of the movable track 23 according to other embodiments of the present application.

[0042] For ease of display, Figure 3 The Z direction shown in is perpendicular to the surface direction of the semiconductor substrate 10, or the up and down direction. Figure 3 As shown, the moving track 23 includes a screw motor 234. The cleaning member 24 is sleeved on a screw 2341 of the screw motor 234 and is configured to be driven by the screw motor 234 to move along the screw 2341.

[0043] The screw motor 234 can convert rotational motion into linear motion. Specifically, the screw motor 234 may include a screw 2341 and a motor 2342. The screw 2341 is a cylindrical rod with a threaded surface. The motor 2342 may be a stepper motor, servo motor, or the like, configured to provide rotational motion. The screw 2341 may be integrated into the motor 2342 or connected to the motor via a coupling or the like. The screw 2341 can rotate under the drive of the motor 2342.

[0044] The cleaning member 24 may include a fixing portion 241 at one end thereof, and the fixing portion 241 may be a nut, which is sleeved on the screw rod 2341 and engages with the thread on the screw rod 2341 so as to move axially along the screw rod 2341 when the screw rod 2341 rotates, so that when the screw rod 2341 is aligned with the cutting path 100, it partially extends into the cutting path 100 to achieve cleaning of the cutting path 100.

[0045] In some embodiments, the screw motor 234 further includes a limiting mechanism (not shown) that can limit the nut and the cleaning member 24 including the nut to move only along the axial direction of the screw 2341 rather than rotating around the screw 2341 .

[0046] In some embodiments, the cleaning device 20 may include only one movable track 23. The first support member 21 may be used to drive the movable track 23 to rotate so that the movable track 23 is aligned with the first cutting street 110 or the second cutting street 120, respectively.

[0047] refer to Figure 4 , Figure 4 2 is a schematic structural diagram of the cleaning element 24 according to some embodiments of the present application.

[0048] In some embodiments, when at least a portion of the movable rail 23 is aligned with the scribe line 100, a portion of the cleaning member 24 may extend into the scribe line 100, while another portion of the cleaning member 24 may cover the surface of the semiconductor substrate 10 on both sides of the scribe line 100. In this way, when the cleaning member 24 cleans the scribe line 100, residues in the scribe line 100 are prevented from spreading to the surfaces of the semiconductor substrate 10 on both sides of the scribe line 100 and causing contamination.

[0049] like Figure 4 As shown, one end of the cleaning member 24 may include a fixing portion 241 for connecting to the movable track 23, and the other end of the cleaning member 24 may include a cleaning head 242. The fixing portion 241 may be, for example, a nut fixed to the screw 2341 of the screw motor 234, or a driving mechanism to drive itself to move along the movable track 23, or other forms may be used. The cleaning head 242 can be used to extend into the dicing street 100 of the semiconductor substrate 10 to perform a cleaning operation.

[0050] In some embodiments, the cleaning head 242 may be a brush, for example. The brush may be made of a material such as PVA (Polyvinyl Alcohol) sponge, silicone rubber, or a polymer material, and this application does not impose any specific limitation on this.

[0051] In some embodiments, the cleaning head 242 may further include an ultrasonic transducer (not shown) that can generate ultrasonic waves to remove residues adhering to the cutting street 100 through ultrasonic vibrations.

[0052] like Figure 4 As shown, the cleaning member 24 may further include a residue removal portion 243. The residue removal portion 243 may be disposed behind or in front of the cleaning head 242 along the direction of movement of the cleaning head 242 when cleaning the cutting path 100. The residue removal portion 243 is configured to extend into the cutting path 100 when the cleaning member 24 extends into the cutting path 100, and to follow the cleaning member 24 as it moves along the movable track 23 to recover residues cleaned by the cleaning member 24. The residue removal portion 243 may be connected to the movable track 23 or the cleaning member 24, or may be disposed separately.

[0053] In some embodiments, the residue removal unit 243 may be a negative pressure adsorption head or an electrostatic adsorption head to adsorb the residue from the dicing street 100 .

[0054] In the embodiment of the present application, the number of cleaning parts 24 may be one, two or more.

[0055] refer to Figure 5 , Figure 5 Schematic diagram of the positions of two cleaning elements 24 according to some embodiments of the present application. There are two cleaning elements 24, namely a first cleaning element and a second cleaning element. The two cleaning elements 24 can move from opposite ends of the same track toward the center or from the center toward opposite ends of the same track.

[0056] In some embodiments, the first cleaning member and the second cleaning member have a first relative position and a second relative position, and are movable between the first relative position and the second relative position.

[0057] Specifically, such as Figure 5 As shown, the first relative position is a position pair {P11, P12} corresponding to the two ends of a movable track 23. The second relative position is a position pair {P21, P22} corresponding to the middle part of the same movable track 23. Wherein, the position P11 in the first relative position is at one end of the movable track 23, and the position P12 in the first relative position is at the other end of the movable track 23. The two positions {P21, P22} in the second relative position are close to each other at the middle part of the movable track 23. The movable track 23 can be the first track 231 or the second track 232. At this time, when the first relative position, the first cleaning part and the second cleaning part are respectively located at the two ends of the same movable track 23 (for example, the first track 231 or the second track 232). And when the second relative position, the first cleaning part and the second cleaning part are both located at the middle part of the same movable track 23 (for example, the first track 231 or the second track 232).

[0058] In other embodiments, the first relative position may be the position pair {P21, P22} corresponding to the middle of the movable track 23, and the second relative position may be the position pair {P11, P12} corresponding to the ends of the movable track 23. In this case, in the first relative position, the first cleaning member and the second cleaning member are both located in the middle of the same movable track 23, while in the second relative position, the first cleaning member and the second cleaning member are respectively located at the ends of the same movable track 23.

[0059] refer to Figure 6 , Figure 6 It is a schematic flow chart of a cleaning method according to some embodiments of the present application.

[0060] The cleaning method of the present application can be based on the cleaning device 20 described in the above embodiment of the present application, and is used to clean a semiconductor substrate 10 formed with a cutting street 100. The cleaning device 20 may include a movable track 23 and a cleaning member 24. The movable track 23 can be moved so that at least a portion of the movable track 23 is aligned with the cutting street 100. The cleaning member 24 is connected to the movable track 23. When at least a portion of the movable track 23 is aligned with the cutting street 100, at least a portion of the cleaning member 24 extends into the cutting street 100 and is movable along the movable track 23 to clean the cutting street 100.

[0061] like Figure 6 As shown, the cleaning method in the present application may include the following steps.

[0062] S20 : ​​moving the moving track 23 of the cleaning device 20 until at least a portion of the moving track 23 is aligned with the scribe line 100 of the semiconductor substrate 10 .

[0063] As mentioned above, reference Figure 1 , the dicing street 100 includes a first dicing street 110 extending along a first direction X and a second dicing street 120 extending along a second direction Y. Figure 2 The movable track 23 includes a first track 231 extending along the first direction X and a second track 232 extending along the second direction Y. Moving the movable track 23 of the cleaning device 20 so that at least a portion of the movable track 23 is aligned with the scribe line 100 of the semiconductor substrate 10 includes aligning the first track 231 with one of the first scribe lines 110 or aligning the second track 232 with one of the second scribe lines 120.

[0064] In some embodiments, the cleaning device 20 may further include a first support member 21. The structure and connection relationship of the first support member 21 can be described in the aforementioned embodiments. The first support member 21 may be connected to a movable rail 23. The first support member 21 or the cantilever 213 of the first support member 21 may be movable to drive the movable rail 23 to at least partially align with the cutting street 100.

[0065] S40: When at least a portion of the movable track 23 is aligned with the cutting path 100 , the cleaning member 24 of the cleaning device 20 is at least partially extended into the cutting path 100 and movable along the movable track 23 to clean the cutting path 100 , wherein the cleaning member 24 is connected to the movable track 23 .

[0066] In some embodiments, after the movable rail 23 moves to be at least partially aligned with the cutting street 100 , the first support member 21 may drive the movable rail 23 downward to move the cleaning member 24 to at least partially extend into the cutting street 100 .

[0067] In some embodiments, such as Figure 4The cleaning head 242 of the cleaning member 24 is shown to extend into the cutting street 100 .

[0068] refer to Figure 1 and Figure 2 The cutting path 100 includes a first cutting path 110 extending along a first direction X and a second cutting path 120 extending along a second direction Y. The first direction X intersects the second direction Y. The movable track 23 includes a first track 231 extending along the first direction X, a second track 232 extending along the second direction Y, and a connecting portion 233 connecting the first track 231 and the second track 232. The cleaning member 24 can move from the first track 231 to the second track 232 along the connecting portion 233, or from the second track 232 to the first track 231 along the connecting portion 233. Figure 7 According to some embodiments of this application Figure 6 Flow chart of step S40 in FIG. Figure 7 As shown, in the case where the cleaning member 24 is movable from the first track 231 to the second track 232 along the connecting portion 233 , step S40 may include the following steps.

[0069] S41 : The cleaning member 24 is at least partially extended into the first cutting street 110 and moves along the first track 231 to clean the first cutting street 110 .

[0070] In some embodiments, the movable track 23 may be lowered to drive the cleaning member 24 to at least partially extend into the first cutting street 110 . The cleaning member 24 then moves along the movable track 23 to clean the first cutting street 110 .

[0071] S42 : removing the cleaning member 24 from the first cutting street 110 , and moving the cleaning member 24 along the connecting portion 233 to the second track 232 .

[0072] In some embodiments, the movable track 23 may rise to drive the cleaning member 24 away from the first cutting street 110 . The cleaning member 24 then moves along the movable track 23 to the second track 232 .

[0073] In some embodiments, after the cleaning member 24 leaves the first cutting street 110 , a cleaning step may be performed on the cleaning member 24 itself to prevent the cleaning member 24 from bringing residues into the second cutting street 120 .

[0074] S43 : The cleaning member 24 is at least partially extended into the second cutting street 120 , and moves along the second track 232 to clean the second cutting street 120 .

[0075] Similar to step S41 , the movable track 23 may be lowered again to drive the cleaning member 24 to at least partially extend into the second cutting street 120 . The cleaning member 24 then moves along the movable track 23 to clean the second cutting street 120 .

[0076] In some embodiments, after cleaning the first scribe line 110 and the second scribe line 120, the cleaning method may return to step S20, wherein the first support member 21 may drive the first rail 231 to align with another first scribe line 110, and simultaneously drive the second rail 232 to align with another second scribe line 120. The cleaning method then repeats steps S41-S43, and so on, until the cleaning device 20 has cleaned all scribe lines 100.

[0077] In some embodiments, when the cleaning member 24 is movable from the second track 232 to the first track 231 along the connecting portion 233, similar to Figure 7 In the illustrated operation, step S40 may include: causing the cleaning member 24 to at least partially extend into the second cutting street 120 and move along the second track 232 to clean the second cutting street 120; removing the cleaning member 24 from the second cutting street 120 and moving the cleaning member 24 along the connecting portion 233 to the first track 231; and causing the cleaning member 24 to at least partially extend into the first cutting street 110 and move along the first track 231 to clean the first cutting street 110. After cleaning the second cutting street 120 and the first cutting street 110, the cleaning method may return to step S20.

[0078] In other embodiments, reference Figure 5 As described above, there are two cleaning members 24, and the two cleaning members 24 have a first relative position and a second relative position. In this case, the two cleaning members 24 can move from the two ends of the same track toward the middle or move from the middle of the same track toward the two ends. Figure 8 , Figure 8 According to other embodiments of this application Figure 6 Flow chart of step S40 in FIG. Figure 8 As shown, step S40 may include the following steps.

[0079] S61 : The two cleaning members 24 are respectively at least partially extended into the first cutting path 110 , and are respectively moved from the first relative position to the second relative position along the first track 231 .

[0080] The first relative position may be a starting cleaning position of the two cleaning members 24 .

[0081] The movable track 23 can be lowered to drive the two cleaning members 24 to at least partially extend into the first cutting path 110. The two cleaning members 24 can move in coordination to simultaneously reach the second relative position, ie, the position where cleaning is completed.

[0082] In this step, the two cleaning members 24 may be moved from both ends to the middle of the same first cutting street 110 for cleaning, or may be moved from the middle to both ends of the same first cutting street 110 for cleaning.

[0083] S62 : removing the two cleaning members 24 from the first cutting lane 110 , and returning the two cleaning members 24 from the second relative position to the first relative position along the first track 231 .

[0084] The movable track 23 can rise to drive the two cleaning members 24 to leave the first cutting path 110. During or after this process, the two cleaning members 24 can return to the first relative position along the movable track 23.

[0085] S63 : Move the two cleaning members 24 along the connecting portion 233 to the two ends of the second track 232 , and extend the two cleaning members 24 at least partially into the second cutting path 120 .

[0086] In some embodiments, before the two cleaning members 24 are respectively moved along the connecting portion 233 to the second track 232 , the two cleaning members 24 may be cleaned.

[0087] The movable rail 23 may then descend to drive the two cleaning members 24 at least partially into the second cutting street 120 .

[0088] S64: moving the two cleaning members 24 along the second track 232 from the first relative position to the second relative position.

[0089] The two cleaning members 24 can move along the second track 232 from the first relative position to the second relative position to complete cleaning of the second cutting street 120 .

[0090] Similar to step S61 , in step S64 , the two cleaning members 24 may be moved from both ends toward the middle of the same second cutting street 120 for cleaning, or may be moved from the middle toward both ends of the same second cutting street 120 for cleaning.

[0091] In some embodiments, after cleaning the first scribe line 110 and the second scribe line 120, the cleaning method may return to step S20, wherein the first support member 21 may drive the first rail 231 to align with another first scribe line 110, and simultaneously drive the second rail 232 to align with another second scribe line 120. The wafer cleaning method then repeats steps S61-S64, and so on, until the cleaning device 20 has cleaned all scribe lines 100.

[0092] In this embodiment, by providing two cleaning members 24 to clean the first track 231 and / or the second track 232 simultaneously, the cleaning speed of the dicing street 100 can be accelerated, thereby improving the production efficiency of the bare chips.

[0093] Figure 9 FIG is a flow chart of a cleaning method for cleaning a semiconductor substrate according to other embodiments of the present application. Figure 9 Before step S20 , the cleaning method may further include step S10 : cleaning the surface of the semiconductor substrate 10 .

[0094] In some embodiments, a cleaning liquid may be sprayed on the surface of the semiconductor substrate 10 and then the surface of the semiconductor substrate 10 is cleaned. The present application does not limit the specific cleaning method.

[0095] In some embodiments, reference Figure 2 , you can use Figure 2 The second support member 22 drives the cleaning liquid applying part 25 to move above the semiconductor substrate 10 , sprays the cleaning liquid on the surface of the semiconductor substrate 10 , and then cleans the surface of the semiconductor substrate 10 .

[0096] In some embodiments, after cleaning all the scribe lines 100 , the cleaning device 20 may clean the surface of the semiconductor substrate 10 again to eliminate contamination of the surface of the semiconductor substrate 10 caused by the cleaning process of the scribe lines 100 , thereby further improving the yield of the bare chips.

[0097] The semiconductor substrate cleaning method of the present application can effectively remove residues in the sawing street 100 , prevent these residues from contaminating the surface of the semiconductor substrate 10 , and improve the yield of the manufactured bare chips.

[0098] The above description of the various embodiments tends to emphasize the differences between the various embodiments. The same or similar aspects can be referenced with each other and will not be repeated herein for the sake of brevity.

Claims

1. A cleaning device for cleaning a semiconductor substrate having a dicing street formed thereon, characterized in that: The cleaning device comprises: a movable track movable to align at least a portion of the movable track with the cutting street; and A cleaning member is connected to the movable track; when at least a portion of the movable track is aligned with the cutting path, at least a portion of the cleaning member extends into the cutting path and is movable along the movable track to clean the cutting path.

2. The cleaning device according to claim 1, characterized in that The cutting streets include first cutting streets extending along a first direction and second cutting streets extending along a second direction, wherein the first direction intersects the second direction; The movable track includes a first track extending along the first direction, a second track extending along the second direction, and a connecting portion connecting the first track and the second track; The cleaning member is movable from the first track to the second track along the connecting portion, or from the second track to the first track along the connecting portion.

3. The cleaning device according to claim 2, characterized in that The connecting portion is an arc-shaped connecting portion, the first rail and the second rail are linear rails, and both ends of each of the first rail and the second rail are respectively connected to the arc-shaped connecting portion.

4. The cleaning device according to claim 2, characterized in that: The number of the cleaning parts is two; The two cleaning members move toward each other from the two ends of the same track toward the middle or move away from each other from the middle to the two ends of the same track.

5. The cleaning device according to claim 1, characterized in that The device further comprises a cleaning liquid applying portion, wherein the cleaning liquid applying portion applies cleaning liquid to the semiconductor substrate and the cleaning member cleans the cutting street alternately.

6. The cleaning device according to claim 1, characterized in that When at least a portion of the movable track is aligned with the cutting street, a portion of the cleaning member extends into the cutting street, and another portion of the cleaning member covers the surface of the semiconductor substrate on both sides of the cutting street.

7. The cleaning device according to claim 1, characterized in that It also includes a first support member connected to the movable track, the first support member includes a base and a cantilever connected to each other, and the movable track is fixedly connected to the cantilever; The cantilever is movable relative to the base to drive the movable rail to move to at least partially align with the cutting path and / or drive the cleaning member to at least partially extend into the cutting path.

8. The cleaning device according to claim 1, characterized in that The cleaning device further includes a residue removal portion; The residue removing portion is used to extend into the cutting path when the cleaning member extends into the cutting path, and to follow the cleaning member to move along the moving track to recover the residues cleaned by the cleaning member.

9. A cleaning method, characterized in that: include: moving a movable track of the cleaning device so that at least a portion of the movable track is aligned with a scribe line of the semiconductor substrate; When at least a portion of the movable track is aligned with the cutting street, at least a portion of a cleaning member of the cleaning device is extended into the cutting street and is movable along the movable track to clean the cutting street, wherein the cleaning member is connected to the movable track.

10. The cleaning method according to claim 9, characterized in that The cutting streets include first cutting streets extending along a first direction and second cutting streets extending along a second direction, wherein the first direction intersects the second direction; The movable track includes a first track extending along the first direction, a second track extending along the second direction, and a connecting portion connecting the first track and the second track; The cleaning member is movable from the first track to the second track along the connecting portion, or from the second track to the first track along the connecting portion.

11. The cleaning method according to claim 9, characterized in that The number of the cleaning parts is two; The two cleaning members move toward each other from the two ends of the same track toward the middle or move away from each other from the middle to the two ends of the same track.

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