A loading chamber structure with tab detection function

Abstract

The application discloses a loading chamber structure with a tab detection function, and belongs to the technical field of semiconductor detection. The chamber structure comprises a cavity, the cavity is provided with an inlet and an outlet allowing a wafer to enter and leave, a bracket assembly is arranged in the cavity, the bracket assembly is symmetrically arranged on both sides of a wafer moving path and used for jointly supporting the wafer, and a laser sensor is arranged outside the cavity and used for detecting the front and back positions of the wafer moving direction. The application can be suitable for efficient and stable transmission of the wafer in a vacuum environment, and solves the technical problem that the wafer deviates from the bracket and is not detected in time in the existing vacuum transmission system.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor detection, and particularly relates to a loading chamber structure with tab detection function. BACKGROUND

[0002] In a wafer manufacturing process, when the wafer reaches the equipment end, it needs to be placed into the Loadlock (transfer chamber) of the equipment by a robot or manually. When the mechanical arm places the wafer into the corresponding card slot, the vibration of the motor and the inertia during movement may cause the magazine (wafer rack) to tilt downward toward the feeding end of the wafer rack during the horizontal placement process of the mechanical arm. When manually placing the wafer, it is not possible to enter the slot from the horizontal position as the robot does, which may cause the wafer rack to tilt downward at the feeding end, resulting in the phenomenon of wafer protruding into the card slot and the tab formed by the wafer rack.

[0003] Most of the prior art directly observes the centering condition of the wafer by the naked eye after the system runs for a period of time. However, it is time-consuming and laborious to observe the centering condition of the wafer by the naked eye, and at the same time, since most LL chamber structures are compact and have many components, the condition of the wafer on the carrier is not easy to observe, and the maintenance personnel are prone to misjudge the wafer state, causing certain economic losses.

[0004] US12330289B2 discloses a method for determining the center position of a semiconductor wafer, which carries the semiconductor wafer by an executor at the end of a mechanical arm. The executor is provided with a specific aperture, which is partially blocked by the wafer when the wafer is loaded. The system moves the mechanical arm to align the aperture with a sensor, and detects the change in the blocking state by the sensor, and synchronously records the position data. The processor dynamically calculates the actual center coordinates of the wafer according to the position data, and finally places the wafer accurately at the target position, so as to ensure that the calculated center coincides with the preset center. The core technology lies in that the dynamic positioning and accurate alignment of the center of the wafer are realized by using the inherent structure of the executor combined with real-time blocking detection. The applicant believes that there is still room for improvement in this scheme: the executor integrated at the end of the mechanical arm is not conducive to the entry and exit of the mechanical arm into the narrow wafer conveying channel, and has limitations on the structure of the cavity inlet and outlet; the overall system is complex, and multiple parameters need to be linked to calculate and diagnose, which is not easy to maintain. Therefore, there is an urgent need for a solution that can monitor the position of the wafer in real time and timely find the tab problem. SUMMARY

[0005] The application aims to provide a loading chamber structure with tab detection function and a wafer tab detection method, which has the advantages of real-time monitoring of wafer position, timely discovery of tab problems and improvement of detection efficiency.

[0006] The technical scheme adopted by the application to achieve the above-mentioned purpose is as follows:

[0007] A loading chamber structure with tab detection function, comprising: a cavity, the cavity is provided with an entrance and an exit allowing wafers to enter and leave, a carrier assembly is arranged in the cavity, the carrier assembly is symmetrically arranged on both sides of the wafer moving path for jointly supporting the wafer, a laser sensor is arranged outside the cavity, the laser sensor is used for detecting the front and rear positions of the wafer moving direction.

[0008] Preferably, the entrance direction is different from the exit direction, so that the path of the wafer entering the cavity intersects with the path of the wafer leaving the cavity and there is an included angle, the included angle is an obtuse angle, and each carrier assembly is distributed along the straight line where the angle bisector of the included angle is located.

[0009] Preferably, the carrier assembly comprises a support plate, and the support plate of one carrier assembly is provided with a limiting column at the edge, so that the wafer is limited to deviate by a specified distance on one side in the moving path, and the specified distance ranges from 1mm to 4mm.

[0010] Preferably, the laser sensor has at least two groups, and the number of each group of laser sensors is two and located on both sides of the wafer, at least one group of laser sensors is arranged along the path of the wafer entering the cavity, and at least one group of laser sensors is arranged along the path of the wafer leaving the cavity.

[0011] Preferably, the emitting end of the laser sensor is perpendicular to the wafer, and when the wafer is supported by the carrier assembly, the detection range of the laser sensor is the position where the wafer deviates by a fixed distance on one side along the moving direction, and the fixed distance ranges from 1mm to 4mm.

[0012] Preferably, the cavity has at least two and is arranged in a stacked manner, and the carrier assemblies in each cavity are arranged at equal intervals in the stacking direction, so that multiple parallel wafers can be loaded in the same cavity.

[0013] Preferably, the cavity has a cover plate, the cover plate is provided with an opening, the opening is provided with a transparent glass, the transparent glass is located between the opening and the laser sensor, and the laser sensor detects the tab of the wafer through the transparent glass.

[0014] Preferably, the opening is provided with a pressing member, and the transparent glass is installed in the opening through the pressing member to realize the sealing treatment of the cavity at the opening.

[0015] Preferably, the carrier assembly further comprises a mounting block, the support plate is connected with the inner wall of the cavity through the mounting block, and the symmetrically arranged support plates are independent of each other and do not contact each other.

[0016] Preferably, a wafer tab detection method is applied to the loading chamber structure with tab detection function, comprising the following steps: step one: the robot carries the wafer into the cavity from the entrance, and places the wafer on the bracket assembly; step two: the laser sensor detects the tab of the wafer in the moving path direction, and triggers an alarm signal when the laser sensor detects that the wafer tab exceeds the preset distance; step three: the robot carries the detected wafer out of the cavity from the exit.

[0017] Compared with the prior art, the present application has the following beneficial effects: the separate inlet and outlet design avoids path overlap, shortens the transmission cycle and improves the throughput; the external laser sensor is easy to maintain and avoids vacuum pollution; the symmetrical bracket and the laser sensor cooperate to realize left and right limiting and front and rear monitoring, and the detection is more comprehensive; the obtuse path and the angle bisector support layout reduces mechanical complexity and offset risk; the limiting column constrains the offset with a simple mechanical structure, reducing the cost; the rotating ring drives the sensor to detect the arc trajectory, improving efficiency and accuracy; the pneumatic driving rotating ring realizes dynamic detection and cleans the transparent glass, improving stability; the multi-cavity stacking design improves space utilization. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a whole schematic diagram of a loading chamber structure with tab detection function;

[0019] Figure 2 It is a schematic diagram of the arrangement position of two groups of laser sensors;

[0020] Figure 3 It is a schematic diagram of the position of transparent glass and laser sensor;

[0021] Figure 4 It is a schematic diagram of the bracket assembly supporting the wafer;

[0022] Figure 5 It is a schematic diagram of the direction of the entrance and the exit;

[0023] Figure 6 It is a schematic diagram of the structure of the compression member of the second embodiment of the present application;

[0024] Figure 7 It is a schematic diagram of the structure of the baffle and the spring in the third embodiment of the present application;

[0025] Figure 8 It is a schematic diagram of the position of the sheet body and the laser sensor in the third embodiment of the present application.

[0026] Corresponding to the cavity 1, the cover plate 11, the entrance 21, the exit 22, the bracket assembly 3, the support plate 31, the limiting column 32, the mounting block 33, the laser sensor 4, the transparent glass 5, the compression member 6, the inner ring 61, the outer ring 62, the rotating ring 7, the sheet body 71, the air pipe 72, the spring 73, and the baffle 8. DETAILED DESCRIPTION

[0027] The technical solutions of the present application will be further described in detail in combination with the specific embodiments and the drawings:

[0028] Obviously, the described embodiments are only part of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0029] Embodiment one:

[0030] A loading chamber structure with tab detection function, comprising: a cavity 1, the cavity 1 is provided with an entrance 21 and an exit 22 allowing the wafer to enter and leave, a cradle assembly 3 is arranged in the cavity 1, the cradle assembly 3 is symmetrically arranged on both sides of the wafer moving path, used for supporting the wafer together, a laser sensor 4 is arranged outside the cavity 1, the laser sensor 4 is used for detecting the front and back positions of the wafer moving direction. When the mechanical hand carries the wafer through the entrance 21 into the cavity 1, the symmetrically arranged cradle assembly 3 supports the wafer edge together. In the transmission process, the laser sensor 4 continuously monitors the projection position of the wafer front and back edge in the moving direction. If the installation position of the wafer on the cradle assembly 3 deviates by a certain distance, its edge will block the sensor detection area, triggering the signal to judge the deviation.

[0031] The above scheme adopts the design of separate entrance 21 and exit 22, avoiding the mechanical hand turning back operation caused by the overlapping of wafer entering and leaving path in the conventional single side port scheme, shortening the single transmission cycle, and improving the overall throughput of the system. And the laser sensor 4 is installed outside the cavity 1, without contacting the internal vacuum environment, which not only avoids the pollution of sensor material to the vacuum, but also facilitates the later maintenance and debugging, solving the problem of difficult maintenance of internal parts of the compact cavity 1. Combined with the physical limiting of the symmetric cradle and the active detection of the laser sensor 4, the left and right support limiting and real-time monitoring during the wafer transmission process are formed, which is more comprehensive than single direction detection, reducing the risk of equipment failure caused by tab.

[0032] The inlet 21 is oriented differently from the outlet 22, so that the path of the wafer into the cavity 1 intersects and forms an angle with the path of the wafer out of the cavity 1, the angle is an obtuse angle, and each carrier assembly 3 is distributed along a straight line where an angle bisector of the angle is located. When the carrier assembly 3 is distributed along the angle bisector, the support point is located on the center line of the wafer movement path, and the wafer is uniformly stressed on both sides during the entering and leaving processes, thereby avoiding the accumulation of unilateral deviation caused by the path mutation. When the wafer moves in the obtuse angle path, the symmetrical support of the carrier assembly 3 can offset the inertia deviation trend caused by the path turning. Compared with the prior art, the traditional wafer transmission path usually adopts a straight line or a right angle turning design, which causes the robot to frequently adjust the posture and the support points to be asymmetrically distributed. The combination of the obtuse angle path and the angle bisector support layout in the scheme reduces the mechanical motion complexity and offsets the deviation risk caused by the path turning through symmetrical support. Through the above technical scheme, the wafer position deviation probability during the turning process can be reduced, the number of robot posture adjustments can be reduced, and the wafer balance state in the movement path can be maintained through the symmetrical support structure, thereby avoiding the tab problem caused by unilateral stress.

[0033] The carrier assembly 3 includes a support plate 31, and the support plate 31 of one carrier assembly 3 is provided with a limiting column 32 at the edge, so that the wafer is limited to deviate by a specified distance on one side in the movement path. The specified distance ranges from 1 mm to 4 mm. The limiting column 32 refers to a cylindrical protruding structure fixed at the edge of the support plate 31, which can be made of stainless steel and then installed at the edge of the support plate 31 through threaded connection or welding. The carrier assembly 3 jointly bears the wafer through the symmetrically arranged support plates 31, and when the robot places the wafer on the support plate 31, the limiting column 32 is in parallel contact with the edge of the wafer. During the transmission of the wafer along the movement path, if the wafer deviates laterally due to robot error, the limiting column 32 will contact the edge of the wafer and prevent it from continuing to deviate beyond the specified distance. The distance between the limiting column 32 and the edge of the wafer is set to, for example, between 1 mm and 4 mm, which can allow slight position fluctuations of the wafer during normal movement and prevent the wafer from deviating from the support area due to excessive deviation.

[0034] The limiting column 32 arranged on the single support plate 31 allows the wafer to pass through, and the simple mechanical structure realizes physical restriction of unilateral deviation of the wafer, without the need for additional electronic detection devices to reduce the risk of wafer deviation from the support. Meanwhile, the integrated design of the limiting column 32 and the support plate 31 reduces the complexity of the internal components of the vacuum cavity 1, which is conducive to realizing stable sealing in a vacuum environment.

[0035] The laser sensor 4 has at least two groups, each group of laser sensor 4 has two and is located on both sides of the wafer, at least one group of laser sensor 4 is arranged along the path of the wafer into the cavity 1, and at least one group of laser sensor 4 is arranged along the path of the wafer leaving the cavity 1. The laser sensor 4 refers to a device for non-contact position detection using a laser beam, which can be realized by using a reflective sensor with a separate transmitting end and receiving end. The position of the wafer edge is determined by detecting whether the laser beam is blocked.

[0036] When the wafer enters the cavity 1 through the mechanical hand, the group of laser sensors 4 arranged along the entering path synchronously detects the front and rear ends of the wafer. If the wafer is offset by more than a certain range after being loaded on the support plate 31, the laser beam will be blocked and a signal will be triggered. Similarly, when the wafer leaves the cavity 1, the other group of laser sensors 4 arranged along the leaving path monitors the two sides of the wafer in real time. Since the two groups of sensors cover different moving stages, the detection blind area can be avoided. The present scheme realizes full-process dynamic monitoring of the wafer entering and leaving the cavity 1 through the cooperative layout of multiple sensors, effectively solving the problem that the wafer offset caused by the transmission error of the mechanical hand is not discovered in time.

[0037] The transmitting end of the laser sensor 4 is arranged perpendicular to the wafer. When the wafer is supported by the carrier assembly 3, the detection range of the laser sensor 4 is the position of the wafer offset by a fixed distance on one side along the moving direction of the wafer, and the fixed distance range is 1mm-4mm. The transmitting end perpendicular to the wafer refers to that the projection direction of the laser beam forms a 90-degree angle with the wafer plane, which can be realized by adjusting the angle of the laser sensor 4 using a mounting bracket. This arrangement can ensure that the detection beam forms a stable contact area with the wafer edge. The detection range refers to that the detection area of the laser sensor 4 covers the preset offset range of the wafer edge in the moving direction, which can be realized by adjusting the transmitting power or receiving sensitivity of the laser sensor 4. The range is set to 1mm-4mm to balance the detection accuracy and false alarm rate.

[0038] When the wafer is supported by the carrier assembly 3 and transmitted along the moving path, the laser beam emitted by the laser sensor 4 is projected to the detection area of the wafer edge. If the wafer is offset on one side, the edge will exceed the detection range of the laser sensor 4, and at this time the unblocked part of the laser beam will be captured by the receiving end and generate a signal change. When the offset reaches the upper limit of the fixed distance range, the system determines that the tab is abnormal and triggers the alarm mechanism.

[0039] The cavity 1 has at least two and is arranged in a stacked manner, and the carrier assemblies 3 in each cavity 1 are arranged at equal intervals in the stacking direction, so that multiple parallel wafers can be loaded in the same cavity 1.

[0040] The cavity 1 has a cover plate 11 provided with an opening, and a transparent glass 5 is arranged in the opening and located between the opening and the laser sensor 4. The laser sensor 4 detects the wafer through the transparent glass 5. The cover plate 11 refers to a closed structure covering the top of the cavity 1.

[0041] The cover plate 11 provides a detection channel for the laser sensor 4 through the opening, and the transparent glass 5 is embedded in the opening and covers the opening area. The laser sensor 4 is installed outside the cavity 1 and aligned with the opening. The laser beam emitted by the laser sensor 4 penetrates the transparent glass 5 and irradiates the wafer surface. The reflection signal is used to determine whether the wafer is offset. The transparent glass 5 is fixed between the opening by a pressing member 6, for example, a ring-shaped metal pressing ring is used in combination with a sealing rubber ring to press the glass edge against the inner wall of the opening. In this way, the optical detection function is realized while avoiding leakage of the vacuum environment in the cavity 1 due to the opening. Traditional detection schemes usually directly open a bare detection hole on the surface of the cavity 1 or use a non-sealed structure to install the sensor, which leads to easy pollution of the vacuum environment or pressure imbalance. However, the combination of the transparent glass 5 and the pressing member 6 in this scheme not only retains the detection capability of the laser sensor 4, but also maintains the vacuum integrity of the cavity 1 through physical isolation and sealing structure, solving the contradiction between detection function and sealing demand. Non-contact detection is achieved, which is suitable for semiconductor process scenarios with strict vacuum requirements.

[0042] The opening is provided with a pressing member 6, and the transparent glass 5 is installed in the opening through the pressing member 6 to realize the sealing treatment of the cavity 1 at the opening.

[0043] The bracket assembly 3 further comprises a mounting block 33, and the support plates 31 are connected to the inner wall of the cavity 1 through the mounting block 33. The symmetrically arranged support plates 31 are independent of each other and do not contact each other.

[0044] A wafer tab detection method applied to the above-mentioned wafer tab detection function of the loading chamber structure, comprising the following steps:

[0045] Step one: the robot carries the wafer into the cavity 1 from the inlet 21 and places the wafer on the bracket assembly 3

[0046] Step two: the laser sensor 4 detects the wafer tab in the moving path direction, and triggers an alarm signal when the laser sensor 4 detects that the wafer tab exceeds a preset distance. Step three: the robot carries the detected wafer out of the cavity 1 from the outlet 22.

[0047] Embodiment two:

[0048] On the basis of the embodiment one of the present application, the cavity 1 is externally provided with a rotating ring 7, the rotating ring 7 can rotate around the central axis, two laser sensors 4 are installed on the rotating ring 7, the two laser sensors 4 are symmetrically arranged along the plane where the axis of the rotating ring 7 is located, and the laser emission direction of the laser sensor 4 is towards the wafer edge area; each laser sensor 4 has an arc-shaped moving track between the two bracket assemblies 3, the moving track and the boundary of the maximum activity range of the wafer on the bracket assembly 3 are co-circular in the projection direction; when the wafer deviates from the maximum activity range in the moving direction, the wafer blocks the laser on the scanning path and triggers an alarm. The rotating ring 7 is provided with a rotating mechanism driven by a driver.

[0049] Wherein, the opening is an annular through groove, and the transparent glass 5 is annular, so that the circular track of the laser can always pass through the transparent glass 5.

[0050] The cavity 1 is fixedly provided with a baffle at both ends of the moving track, and the lower end of the rotating ring 7 is provided with a baffle body 71 to cooperate with the baffle to enable the laser sensor 4 to move along the arc-shaped moving track, thereby avoiding the laser sensor 4 from sweeping above the bracket assembly 3.

[0051] When the rotating mechanism drives the rotating ring 7 to rotate around the axis, the two symmetric laser sensors 4 are driven to move along the respective arc-shaped moving tracks, thereby continuously and linearly detecting the front and back positions of the wafer between the bracket assemblies 3. Without the need to increase additional sensor arrangement, the continuous dynamic wafer bump detection at multiple positions can be realized, the efficiency and accuracy of the bump detection are greatly improved, and the possibility of missed detection is reduced.

[0052] The above scheme realizes multi-point bump detection of the front and back positions of the wafer in the moving direction through two sensors, cooperates with the technical scheme that the left and right positions of the wafer in the moving direction are constrained by the limiting column 32, realizes dynamic detection of all positions of the wafer with bump risk, realizes high-precision and multi-point dynamic detection of the wafer bump under the premise of reducing the number and cost of hardware, and greatly improves the bump detection efficiency. The cooperation of the rotating ring 7 and the annular transparent glass 5 enables the two laser sensors 4 to share a connecting bracket, thereby saving longitudinal space.

[0053] Embodiment three:

[0054] On the basis of the embodiment two of the present application, the pressing member 6 includes an inner ring 61 and an outer ring 62, the rotating ring 7, the inner ring 61 and the outer ring 62 and the transparent glass 5 form an annular cavity, and the rotating mechanism includes: an air pipe 72, one end of which is communicated with the annular cavity, the other end of which is connected with a suction system, the baffle body 71 is arranged at intervals along the moving track, the baffle body 71 is located in the annular cavity, the baffle body 71 and the rotating ring 7 have an included angle in the radial direction, when the suction system sucks air through the air pipe 72, the airflow acts on the baffle body 71 to make the rotating ring 7 rotate in one direction; a spring 73 is installed on the baffle 8 to provide a restoring tension for the baffle body 71 when the suction stops.

[0055] When the suction system is started, air continuously leaves the annular cavity from the air pipe 72 and forms an air flow, and acts on the flake body 71, so that the flake body 71 drives the rotating ring to rotate in one direction. Under the limiting action of the baffle plate 8 on the flake body 71, the two laser sensors 4 move along the respective arc-shaped movement tracks, and detect the dynamic tab of the wafer. Under the continuous suction action, the flake body 71 moves in one direction and presses the spring 73 of the baffle plate 8. After the suction is completed, the flake body 71 loses the acting force, the spring 73 restores the deformation and reversely moves the flake body 71 in the annular cavity, thereby driving the rotating ring 7 to rotate reversely, so that the laser sensor 4 returns to the initial detection position to obtain the displacement distance of the next dynamic tab detection.

[0056] The above scheme realizes the reciprocating movement of the laser sensor 4 on the respective arc-shaped movement tracks, which can be realized by only one-time suction. Compared with the contact type rotary driving mode, the vibration interference transmission is reduced, which is conducive to the position stability of the wafer on the bracket assembly 3, reduces the risk of tab, and the air flow driving mode of the suction system continuously sucks the air flow in the annular cavity through the air pipe 72, which is conducive to cleaning the attached dust on the transparent glass 5 to realize the cleaning of the transparent glass 5, facilitates the laser of the laser sensor 4 to pass through, reduces the risk of scattering of the laser passing through the transparent glass 5 being disturbed by dust, improves the accuracy of the dynamic tab detection of the laser sensor 4, and also can clean the debris generated by the rotary friction between the rotating ring 7 and the compression member 6, improve the rotating fluency, avoid jamming, improve the continuity and fluency of the dynamic detection.

[0057] It is apparent for those skilled in the art that the present application is not limited to the details of the above-described exemplary embodiments, but can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all aspects as illustrative and not restrictive, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended to encompass all changes falling within the meaning and scope of the equivalent elements of the claims. Any reference signs in the claims should not be considered as limiting the claims involved.

Claims

1. A loading chamber structure with a tab detection function, comprising a cavity (1), characterized in that: The cavity (1) is provided with an inlet (21) and an outlet (22) for allowing the wafer to enter and exit. A bracket assembly (3) is provided inside the cavity (1). The bracket assemblies (3) are symmetrically arranged on both sides of the wafer movement path to jointly support the wafer. A laser sensor (4) is provided outside the cavity (1). The laser sensor (4) is used to detect the forward and backward positions of the wafer in the direction of movement. The inlet (21) faces a different direction than the outlet (22), causing the path of the wafer entering the cavity (1) to intersect with the path of the wafer leaving the cavity (1) at an obtuse angle. Each of the bracket assemblies (3) is distributed along the straight line containing the angle bisector of the angle. The cavity (1) is provided with a rotating ring (7) which can rotate around its central axis. Two laser sensors (4) are installed on the rotating ring (7). The two laser sensors (4) are symmetrically arranged along the plane of the axis of the rotating ring (7). The laser emission direction of the laser sensors (4) is towards the edge region of the wafer. Each laser sensor (4) has an arc-shaped movement trajectory between the two bracket assemblies (3). The movement trajectory is concircular in the projection direction with the boundary of the maximum allowable range of motion of the wafer on the bracket assembly (3). The rotating ring (7) is provided with a rotating mechanism to drive its rotation. The cavity (1) has a cover plate (11). The cover plate (11) has an opening. A transparent glass (5) is provided in the opening. The opening is an annular through groove. The transparent glass (5) is annular so that the circular trajectory of the laser can always pass through the transparent glass (5).

2. The loading chamber structure with tab detection function according to claim 1, characterized in that: The bracket assembly (3) includes a support plate (31), and the support plate (31) of the bracket assembly (3) is provided with a limiting post (32) at the edge, so that the wafer is restricted to offset by a specified distance on one side in the moving path, the specified distance being 1mm to 4mm.

3. The loading chamber structure with tab detection function according to claim 1, characterized in that: The laser sensor (4) has at least two sets, each set of laser sensors (4) consists of two laser sensors located on both sides of the wafer. At least one set of laser sensors (4) is arranged along the path from the wafer into the cavity (1), and at least one set of laser sensors (4) is arranged along the path from the wafer out of the cavity (1).

4. The loading chamber structure with tab detection function according to claim 1, characterized in that: The laser sensor (4) is arranged perpendicular to the wafer. When the wafer is supported by the bracket assembly (3), the detection range of the laser sensor (4) is the position of the wafer offset by a fixed distance on one side along its moving direction. The fixed distance range is 1mm to 4mm.

5. A loading chamber structure with a tab detection function according to claim 1, characterized in that: The cavity (1) has at least two and is stacked one on top of the other. The bracket assembly (3) in each cavity (1) is equally spaced in the stacking direction, so that multiple parallel wafers can be loaded in the same cavity (1).

6. A loading chamber structure with a tab detection function according to claim 1, characterized in that: The transparent glass (5) is located between the opening and the laser sensor (4), and the laser sensor (4) performs bump detection on the wafer through the transparent glass (5).

7. A loading chamber structure with a tab detection function according to claim 1, characterized in that: A clamping element (6) is provided inside the opening, and the transparent glass (5) is installed inside the opening through the clamping element (6) to achieve the sealing treatment of the cavity (1) at the opening.

8. A loading chamber structure with a tab detection function according to claim 2, characterized in that: The bracket assembly (3) also includes a mounting block (33), and the support plate (31) is connected to the inner wall of the cavity (1) through the mounting block (33). The symmetrically arranged support plates (31) are independent of each other and do not contact each other.

9. A wafer bump detection method, applied to a loading chamber structure with bump detection function as described in any one of claims 1-8, characterized in that, Includes the following steps: Step 1: The robotic arm carries the wafer into the cavity from the inlet and places the wafer on the tray assembly; Step 2: The laser sensor detects the bumps on the wafer along the moving path. When the laser sensor detects that the wafer bumps exceed a preset distance, an alarm signal is triggered. Step 3: The robotic arm carries the inspected wafer out of the cavity from the exit.

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