Bearing device, reaction chamber and semiconductor equipment

Abstract

The invention discloses a bearing device, a reaction chamber and semiconductor equipment, relates to the technical field of semiconductor equipment, and is used for solving the technical problem that the levelness of a chuck during actual operation is inconsistent with the levelness during adjustment and measurement. The bearing device is used for being connected with a fixing assembly and comprises a first mounting mechanism, a second mounting mechanism and a bearing body. The bearing body is used for supporting the chuck. The first mounting mechanism and the second mounting mechanism are arranged on the two opposite sides of the bearing body and connected with the bearing body. The first mounting mechanism or / and the second mounting mechanism is / are used for driving the bearing main body to move in the vertical direction under the driving of the driving part; the first mounting mechanism and the second mounting mechanism are both fixedly connected with the fixing assembly, so that when the chuck in the horizontal state in the atmospheric environment is in the vacuum environment, the bearing body still enables the chuck to be in the horizontal state under the supporting of the first mounting mechanism and the second mounting mechanism.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor equipment, and in particular to a carrier device, a reaction chamber, and a semiconductor device. Background Art

[0002] The semiconductor manufacturing process involves multiple process steps, and wafers need to be transferred between different equipment and workstations. The carrier device can accurately adjust the wafer from one height position to another, so that it can accurately reach the designated processing or inspection station. For example, in thin film production, the carrier device lowers the chuck carrying the wafer to a position convenient for loading. After the robot places the wafer to be processed on the chuck, the carrier device lifts the wafer to the appropriate height so that it is in the predetermined position in the cavity so that it can cooperate with other components for thin film growth. Advanced semiconductor thin film production processes have extremely high requirements for indicators such as film thickness uniformity and composition consistency. This requires the carrier device to have high precision, stable operation and other performance to meet the strict requirements of semiconductor equipment for wafer position control.

[0003] During wafer processing, semiconductor equipment will pre-emptively vacuum the chamber and fill it with specific gases to create an environment suitable for thin film growth. To achieve the lifting and lowering of the wafer, the supporting device in related technologies usually includes: a linear guide rail connected to the chamber and a supporting body suitable for supporting the chuck. The supporting body is set on one side of the linear guide rail and connected to the slider inside the linear guide rail. In this way, the slider can be driven by the driving component to achieve the lifting and lowering of the wafer.

[0004] In the prior art, the adjustment mechanism uses a cantilever beam structure supported on one side. During debugging in an atmospheric environment, the supporting body mainly bears the weight of the chuck (directed vertically downward). At this time, the chuck can be adjusted to a horizontal state through the adjustment mechanism. However, when the chuck that has been leveled in the atmospheric environment is transferred to a vacuum environment, the vacuum adsorption force causes the force direction of the supporting body to change to a vertical upward direction. This change in force direction can cause uncontrollable deformation of the supporting body, and the structure of the supporting device is unstable, causing the actual horizontality of the chuck to deviate from the debugging state, ultimately affecting the process effect. Summary of the Invention

[0005] The present application discloses a carrying device, a reaction chamber and a semiconductor device, which are used to solve the technical problem that the levelness of a chuck during actual operation is inconsistent with the levelness during adjustment.

[0006] In the first aspect, the present application provides a carrying device, which includes a device for connecting to a fixed component, and the carrying device includes: a first mounting mechanism, a second mounting mechanism and a carrying body; the carrying body is used to support a chuck; the first mounting mechanism and the second mounting mechanism are arranged on opposite sides of the carrying body, and the first mounting mechanism and the second mounting mechanism are both connected to the carrying body; the first mounting mechanism and / or the second mounting mechanism are used to drive the carrying body to move in a vertical direction under the drive of a driving component; the first mounting mechanism and the second mounting mechanism are both fixedly connected to the fixed component, so that when the chuck that is in a horizontal state in an atmospheric environment is in a vacuum environment, the carrying body still keeps the chuck in a horizontal state under the support of the first mounting mechanism and the second mounting mechanism.

[0007] By disposing the first and second mounting mechanisms on either side of the carrier body and connecting them to the carrier body, and enabling precise vertical adjustment under the action of a driving component, the chuck, which is horizontal in atmospheric conditions, can be placed in a vacuum environment. Although the forces acting on the carrier body change, the horizontal forces of the first deformation of the first mounting mechanism and the second deformation of the second mounting mechanism can still offset each other. This effectively overcomes the problem of chuck tilting due to structural deformation in a vacuum environment, allowing the chuck to always remain horizontal and improving the structural stability of the carrier device. This, in turn, helps to enhance the stability of film production, improve film quality, reduce scrap rates, and increase production efficiency.

[0008] In one possible embodiment, the first and second mounting mechanisms are constructed from the same material and structure. This identical material and structure ensures highly consistent mechanical properties. Under the gravity of the load-bearing body and the chuck, the two mechanisms can withstand loads with identical deformation and stress distribution, ensuring consistent deformation characteristics under vacuum. This balances forces on both sides of the load-bearing body, further ensuring the chuck's levelness during actual operation is consistent with its levelness during testing.

[0009] In a possible implementation, the first mounting mechanism and the second mounting mechanism are different in at least one of material and structure, and the one with greater bending stiffness between the first mounting mechanism and the second mounting mechanism is located closer to the load-bearing body.

[0010] When at least one of the materials and structures of the first mounting mechanism and the second mounting mechanism is different, and the one with greater bending stiffness is closer to the carrier body, then asymmetric deformation in a vacuum environment can be compensated for in a targeted manner, and the deformation can be actively offset and the horizontality of the chuck can be maintained through differentiated stiffness design.

[0011] Furthermore, according to mechanical principles, a mechanism with high bending stiffness can better resist bending deformation. Placing it close to the load-bearing body allows the mechanism to more directly bear the bending moment exerted on the load-bearing body. For example, when the load-bearing body supports a heavy chuck, a high-bending stiffness mechanism close to the load-bearing body can quickly dissipate the bending moment generated by the chuck's weight, reducing deformation of the load-bearing body and preventing chuck level deviation caused by excessive bending, thereby ensuring that the chuck remains level during operation.

[0012] In one possible embodiment, both the first and second mounting mechanisms are slidably connected to the carrier body. Thus, by slidably connecting the first and second mounting mechanisms to the carrier body, the relative displacement between the mounting mechanisms (i.e., the first and second mounting mechanisms) and the carrier body can be adjusted, thereby adapting to deformation in a vacuum environment and maintaining dynamic balance of the chuck.

[0013] In a possible implementation, the first mounting mechanism and the second mounting mechanism are arranged in parallel.

[0014] Since the first mounting mechanism and the second mounting mechanism are arranged in parallel, the two mounting mechanisms can better cooperate with each other when driving the bearing body to move. Under the action of the driving component, the first mounting mechanism and the second mounting mechanism can slide synchronously along the bearing body, driving the bearing body to move smoothly in the vertical direction. Compared with the non-parallel setting, the two mounting mechanisms arranged in parallel will not cause mutual interference due to inconsistent directions during the movement, and can more accurately control the displacement and speed of the bearing body. In addition, when fine-tuning the chuck position, the synchronous movement of the two parallel mounting mechanisms can ensure that the chuck always remains horizontal during the movement, avoiding the tilt of the chuck due to differences in the movement of the mechanisms, and improving the accuracy and smoothness of the operation.

[0015] In one possible embodiment, the first mounting mechanism includes a first mounting member, a first slide rail, and a first slider. The first mounting member is fixedly connected to the first slide rail, the first slide rail is slidably connected to the first slider, and the first slider is fixedly connected to the support body. Thus, by providing a linkage structure of the first mounting member, the first slide rail, and the first slider in the first mounting mechanism, the linear motion of the driving component can be converted into stable lifting of the support body, thereby efficiently transmitting power and reducing movement friction.

[0016] In one possible embodiment, the second mounting mechanism includes a second mounting member, a second slide rail, and a second slider, wherein the second mounting member is fixedly connected to the second slide rail, the second slide rail is slidably connected to the second slider, and the second slider is fixedly connected to the supporting body. Thus, by providing a linkage structure between the second mounting member, the second slide rail, and the second slider in the second mounting mechanism, the linear motion of the driving member can be converted into stable lifting of the supporting body, thereby efficiently transmitting power and reducing movement friction.

[0017] In one possible embodiment, a mounting groove is provided on a side of the second mounting member facing the first mounting mechanism, and at least a portion of the second slide rail is disposed within the mounting groove. Thus, by providing the mounting groove on the second mounting member to accommodate the slide rail, the positioning accuracy and assembly stability of the slide rail can be improved, thereby enhancing the overall structural rigidity and reducing vibration offset.

[0018] In one possible embodiment, the surface of the second mounting member facing away from the second slide rail is a first surface, and the first surface is provided with reinforcing ribs. The reinforcing ribs and mounting locating grooves are located on opposite sides of the second mounting member. By providing the reinforcing ribs on the second mounting member and locating the reinforcing ribs and mounting locating grooves on opposite sides of the second mounting member, the deformation resistance of the slide rail mounting area can be specifically enhanced, thereby suppressing chuck tilt caused by localized deformation of the second mounting member in a vacuum environment.

[0019] In one possible embodiment, the first mounting mechanism includes a first mounting member, a first slide rail, and a first slider. The first mounting member is fixedly connected to the first slide rail, the first slide rail is slidably connected to the first slider, and the first slider is fixedly connected to the carrier body. The first and second slide rails are arranged in parallel, and the first mounting member and the second mounting member are arranged in parallel. Thus, by arranging the first and second slide rails and the corresponding mounting members in parallel, the motion trajectories of the two sides of the carrier body are consistent, thereby preventing twisting or jamming during horizontal adjustment of the chuck and enhancing the mechanical reliability of the carrier device.

[0020] In one possible embodiment, the carrier body includes: a first connecting mechanism, a support member, and a carrier. The first connecting mechanism is fixedly connected to both the first slider and the second slider, the first connecting mechanism is fixedly connected to the support member, and the support member is fixedly connected to the carrier. In this way, by designing the carrier body as a split structure (such as the first connecting mechanism, the support member, and the carrier), stress concentration in a vacuum environment can be dispersed, thereby reducing the risk of overall deformation and facilitating modular maintenance.

[0021] In one possible embodiment, the first connecting mechanism includes a first connecting member and a second connecting member. The first connecting member is fixedly connected to the first slider, the second connecting member is fixedly connected to the second slider, the first connecting member and the second connecting member are fixedly connected, and the support member is fixedly connected to at least one of the first connecting member and the second connecting member. In this way, the first connecting mechanism uses a split connecting member and a linked support member, which can flexibly adapt to slider layouts of different sizes, enhance structural compatibility, and improve assembly accuracy.

[0022] In one possible embodiment, the first mounting member is provided with a first limiting structure for limiting the range of movement of the first slider; or / and the second mounting member is provided with a second limiting structure for limiting the range of movement of the second slider. Thus, by providing limiting structures on the mounting members, the travel of the slider can be constrained, preventing overtravel damage and ensuring a controllable range of chuck lifting.

[0023] In one possible embodiment, the first mounting member is provided with a first limiting structure, the first limiting structure including a first limiting member and a second limiting member, the first limiting member and the second limiting member being spaced apart along the extension direction of the first slide rail to jointly define the movement range of the first slider; or / and, the second mounting member is provided with a second limiting structure, the second limiting structure including a third limiting member and a fourth limiting member, the third limiting member and the fourth limiting member being spaced apart along the extension direction of the second slide rail to jointly define the movement range of the second slider. By adopting a dual limiting member structure with spaced apart positions, the dual limiting member structure can accurately define the movement range of the slider, thereby providing dual protection and position calibration for the slider, thereby improving the safety of the slider movement.

[0024] In a second aspect, the present application provides a reaction chamber comprising: a chamber body and the carrier device described in the first aspect, wherein a portion of the carrier body is disposed through the chamber body, and a first mounting mechanism and a second mounting mechanism are both fixedly connected to the chamber body. By integrating the carrier device into the reaction chamber and fixing the mounting mechanisms to the chamber body, a seamless transition between vacuum and atmospheric environments can be achieved for the chuck, thereby improving semiconductor process stability and chamber sealing.

[0025] In one possible embodiment, the reaction chamber further includes a third connector, which is connected to the chamber body, fixedly connected to the first mounting member, and fixedly connected to the second mounting member. The addition of the third connector, which uniformly secures the mounting members on both sides to the chamber, enhances the integrity of the overall structure, reduces vibration transmission, and improves the chamber's seismic resistance.

[0026] In one possible embodiment, the support member includes a connecting rod connected between the first connecting mechanism and the carrier; the reaction chamber further includes a first adjustment assembly connected to the first connecting mechanism, configured to adjust the angle of the connecting rod in a direction opposite to the tilt direction of the connecting rod when the connecting rod tilts relative to the chamber. Thus, by providing the first adjustment assembly to reversely correct the tilt of the connecting rod, installation errors or deformations can be dynamically compensated, thereby maintaining the carrier in a horizontal state in real time and improving the levelness of the carrier.

[0027] In one possible embodiment, the first adjustment assembly includes multiple pressure structures spaced apart and connected to the first connecting mechanism. Each pressure structure is partially located within the gap between the first connecting mechanism and the connecting rod, and the length of the portion of each pressure structure located within the gap is adjustable. Thus, by adjusting the gap between the connecting rods using multiple pressure structures, local fine-tuning can be achieved, thereby correcting the platform angle and improving the levelness of the platform.

[0028] In one possible embodiment, the pressing structure includes a first pressing member, a second pressing member, a third pressing member, and a fourth pressing member, which are evenly spaced circumferentially along the central axis of the connecting rod. By evenly arranging the four pressing members, the tilt correction requirements can be met in all directions, and the load on the platform can be balanced in all directions.

[0029] In one possible embodiment, the carrier body includes a carrier; the reaction chamber further includes a second adjustment assembly connected to the first connecting mechanism. The second adjustment assembly is configured to adjust the center point of the projection of the connecting rod on the first plane so that the center point of the projection of the carrier on the first plane coincides with the center point of the projection of the cavity on the first plane when the center point of the projection of the carrier on the first plane is offset from the center point of the projection of the cavity on the first plane. The first plane is a plane perpendicular to the first connecting mechanism and the arrangement direction of the cavity. By calibrating the center offset between the carrier and the cavity using the second adjustment assembly, cumulative assembly errors can be eliminated and alignment accuracy can be ensured.

[0030] In one possible embodiment, the second adjustment assembly includes: a housing and a threaded adjustment member, the housing being connected to the first connecting mechanism, a limit chamber being disposed within the housing, and an opening being provided on the housing that communicates with the limit chamber; the threaded adjustment member including a connected screw portion and a restraining portion, the restraining portion being disposed within the limit chamber and movable along the extension direction of the opening; and an internally threaded hole being provided on the connecting rod, the screw portion being disposed through the opening and threadedly connected to the internally threaded hole. The coordinated design of the threaded adjustment member and the limit chamber enables adjustment of the connecting rod position, thereby improving alignment accuracy.

[0031] In one possible embodiment, two sets of second adjustment assemblies are provided, with the screw portions of the two sets of second adjustment assemblies arranged axially perpendicularly. By using the two perpendicularly arranged second adjustment assemblies, the in-plane X / Y offset can be independently adjusted, enabling precise positioning with multiple degrees of freedom.

[0032] In a third aspect, the present application provides a semiconductor device comprising the reaction chamber described in the second aspect. By integrating the optimized reaction chamber into the semiconductor device, the stability of the semiconductor production process environment can be ensured, thereby improving the overall yield and reliability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0034] Figure 1 A schematic diagram of the three-dimensional structure of a reaction chamber provided in an embodiment of the present application;

[0035] Figure 2 Provided in the embodiments of this application Figure 1 Left side view of the middle reaction chamber;

[0036] Figure 3 Provided in the embodiments of this application Figure 2 Cross-section along AA direction;

[0037] Figure 4 Provided in the embodiments of this application Figure 1 A partial structural diagram of the first mounting mechanism;

[0038] Figure 5 Provided in the embodiments of this application Figure 1 A front view of a reaction chamber;

[0039] Figure 6 Provided in the embodiments of this application Figure 1 A bottom view of the carrying device;

[0040] Figure 7 Provided in the embodiments of this application Figure 6 Enlarged view of middle area D;

[0041] Figure 8 Provided in the embodiments of this application Figure 5 An enlarged view of region B;

[0042] Figure 9Provided in the embodiments of this application Figure 5 Cross-sectional view along CC direction;

[0043] Figure 10 Provided in the embodiments of this application Figure 1 A schematic structural diagram of the second regulating component in FIG.

[0044] Figure 11 Provided in the embodiments of this application Figure 5 Cross-sectional view along EE direction.

[0045] Description of reference numerals:

[0046] 10000-Semiconductor equipment;

[0047] 1000-reaction chamber;

[0048] 100-carrying device; 200-cavity (fixed component);

[0049] 10-first mounting mechanism; 11-first mounting member; 11A-third surface; 113-first position-limiting structure; 1131-first position-limiting member; 1132-second position-limiting member; 12-first slide rail; 12A-first end wall; 12B-first side wall; 12C-second side wall; 121-slide groove; 1211-first slide groove; 1212-second slide groove; 13-first slider; 131-first sliding portion; 132-second sliding portion; 133-connecting portion;

[0050] 20 - second mounting mechanism; 21 - second mounting member; 21A - first surface; 21B - second surface; 211 - mounting positioning groove; 212 - reinforcing rib; 213 - second limiting structure; 2131 - third limiting member; 2132 - fourth limiting member; 22 - second slide rail; 23 - second slider;

[0051] 30 - carrying body; 31 - first connecting mechanism; 311 - first connecting member; 3111 - first substrate; 3112 - second substrate; 312 - second connecting member; 3121 - first connecting block; 3122 - second connecting block; 32 - supporting member; 321 - connecting rod; 33 - carrier;

[0052] 40- third connecting piece;

[0053] 50- bellows;

[0054] 60-first adjustment assembly; 61-pressing structure; 611-first pressing member; 612-second pressing member; 613-third pressing member; 614-fourth pressing member;

[0055] 70 - second adjustment assembly; 71 - housing; 711 - position limiting chamber; 7111 - first inner wall; 7112 - second inner wall; 7112A - operation hole; 712 - opening; 72 - threaded adjustment member; 721 - screw portion; 722 - constraint portion;

[0056] 73-chuck;

[0057] 74- driving components;

[0058] 75-Stand. DETAILED DESCRIPTION

[0059] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0060] In the description of this application, the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limiting this application.

[0061] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. Throughout this application, unless otherwise specified, "plurality" means two or more.

[0062] In the description of this application, it should be noted that, unless otherwise specified or limited, the terms "connected" and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0063] In the embodiments of this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be interpreted as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0064] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0065] In order to facilitate understanding of the carrier device, reaction chamber and semiconductor equipment provided in the embodiments of the present application, some technical terms involved in the embodiments of the present application are briefly explained below.

[0066] Thin film: A relatively thin layer of material with specific functions and properties, typically ranging from a few nanometers to a few microns in thickness, deposited on the surface of a semiconductor substrate or other medium using specific process technologies during the semiconductor manufacturing process. This includes semiconductor material films such as silicon (Si), germanium (Ge), and gallium arsenide (GaAs), as well as metal material films such as aluminum (Al), copper (Cu), and gold (Au). It can also include insulating material films such as silicon oxide (SiO2) and silicon nitride (Si3N4).

[0067] Wafer: The silicon wafer used to make silicon semiconductor circuits. The starting material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon seed crystals, and then slowly pulled out to form a cylindrical single crystal. The silicon ingot is then ground, polished, and sliced ​​to form a silicon wafer, also known as a wafer.

[0068] Carrier: The carrier plays a key role in the transportation, processing, and testing of wafers. For example, in the thin film deposition process in wafer manufacturing, the carrier adjusts the position of the wafer so that it is in a predetermined position in the reaction chamber so that it can cooperate with other components to grow thin films.

[0069] The carrier device described in the embodiments of the present application is mainly used in semiconductor equipment, such as equipment used in chip manufacturing and packaging and testing processes. For example, semiconductor equipment includes lithography equipment, etching and deposition equipment, coating equipment, ion implantation equipment, polishing equipment, cleaning equipment, epitaxial equipment, magnetron sputtering equipment, etc. For example, in the lithography equipment, the carrier device can accurately adjust the height of the wafer so that it reaches the optimal focusing distance between the lens or mask of the lithography equipment, ensuring that the lithography pattern can be accurately transferred to the wafer, improving the resolution and accuracy of the lithography, and the carrier device is crucial for manufacturing smaller chip structures. For example, in the etching and deposition equipment, the carrier device can accurately place the wafer in a specific position in the reaction chamber (also referred to as the reaction chamber) according to the process requirements to ensure uniform interaction between the wafer surface and the reaction gas or plasma, thereby achieving a uniform etching or deposition effect and improving the consistency and performance stability of the chip structure on the wafer. For example, in the polishing equipment, the carrier device is used to control the contact pressure and relative position between the wafer and the polishing pad. Through precise lifting and lowering adjustment, it can be ensured that the wafer surface is subjected to uniform pressure during the polishing process, thereby achieving high-precision surface flattening.

[0070] See also Figure 1 , Figure 1 A schematic diagram of the three-dimensional structure of a reaction chamber provided in an embodiment of the present application, the semiconductor device 10000 includes a reaction chamber 1000 and a vacuum device (not shown in the figure), the vacuum device is used to evacuate the reaction chamber 1000, so that a vacuum environment is formed in the reaction chamber 1000, and the reaction chamber 1000 provides a processing environment for the wafer. The reaction chamber 1000 includes a carrying device 100 and a cavity 200, the carrying device 100 is partially arranged in the cavity 200, and the carrying device 100 is fixedly connected to the chuck 73. The carrying device 100 includes an adjusting mechanism (i.e., a first adjusting component and a second adjusting component described later) and a carrying body 30, the adjusting mechanism is connected to the carrying body 30, the carrying body 30 is arranged in the reaction chamber 1000, for supporting the chuck 73, and the adjusting mechanism is arranged outside the reaction chamber 1000, for adjusting the horizontality of the chuck 73 and the height of the chuck 73.

[0071] In the prior art, the adjustment mechanism adopts a cantilever beam structure with single-side support. When debugging in an atmospheric environment, the supporting body 30 mainly bears the gravity of the chuck 73 (directed vertically downward). At this time, the chuck 73 can be made horizontal by the adjustment mechanism. However, when the chuck 73 that has been leveled in the atmospheric environment is transferred to a vacuum environment, the vacuum adsorption force causes the force direction of the supporting body 30 to change to vertically upward. Due to the asymmetric support characteristics of the single-sided cantilever beam structure, this change in force direction will cause the supporting body 30 to produce uncontrollable deformation, thereby causing the actual horizontality of the chuck 73 to deviate from the debugging state, ultimately affecting the stability of the process.

[0072] Based on this, an embodiment of the present application provides a carrying device 100 for solving the problem that the levelness of the chuck 73 supported by the carrying body 30 of the carrying device 100 during actual operation is inconsistent with the levelness during adjustment.

[0073] Example 1

[0074] See also Figure 1 、 Figure 2 and Figure 3 , Figure 2 The embodiment of the present application provides Figure 1 Left side view of the middle reaction chamber; Figure 3 The embodiment of the present application provides Figure 2 Cross-sectional view along the AA direction. The carrying device 100 includes a first mounting mechanism 10, a second mounting mechanism 20, and a carrying body 30. The carrying body 30 is used to support the chuck 73; the first mounting mechanism 10 and the second mounting mechanism 20 are arranged on opposite sides of the carrying body 30, and the first mounting mechanism 10 and the second mounting mechanism 20 are both connected to the carrying body 30; the first mounting mechanism 10 and / or the second mounting mechanism 20 are used to drive the carrying body 30 to move in the vertical direction under the drive of the driving component 74; the first mounting mechanism 10 and the second mounting mechanism 20 are both fixedly connected to the fixing assembly, so that when the chuck 73, which is in a horizontal state in the atmospheric environment, is in a vacuum environment, the carrying body 30, supported by the first mounting mechanism 10 and the second mounting mechanism 20, still keeps the chuck 73 in a horizontal state.

[0075] Specifically, the supporting body 30 is used to support the chuck 73, which can be made of high-strength rigid material (such as stainless steel, aluminum alloy or ceramic) to reduce deformation. Part of the supporting body 30 is passed through the cavity 200 to support the chuck 73, wherein part of the supporting body 30 is located in the cavity 200, and the part of the supporting body 30 located in the cavity 200 is fixedly connected to the chuck 73, and part of the supporting body 30 is located outside the cavity 200, and the part of the supporting body 30 located outside the cavity 200 is movably connected to the adjustment mechanism (i.e., the first adjustment component and the second adjustment component described later). Exemplarily, the supporting body 30 can be fixedly connected to the chuck 73 by welding, threaded connection, hinged connection, riveting, etc., which is not limited in the embodiments of the present application.

[0076] Specifically, the first and second mounting mechanisms 10 and 20 are components that drive the vertical movement of the support body 30. They can utilize precision linear guides, ball screws, or piezoelectric ceramic drive mechanisms to ensure the accuracy of vertical movement. The first and second mounting mechanisms 10 and 20 are located on opposite sides of the support body 30, that is, the support body 30 is located between the first and second mounting mechanisms 10 and 20.

[0077] Please continue reading Figure 1 and Figure 3 The first mounting mechanism 10 and the second mounting mechanism 20 are respectively connected to the carrier body 30. Specifically, the first mounting mechanism 10 and the second mounting mechanism 20 are respectively connected to the carrier body 30 to enable the carrier body 30 to move up and down, thereby driving the wafer to rise and fall, facilitating the transport equipment to pick up and place the wafer. Exemplarily, the first mounting mechanism 10 or the second mounting mechanism 20 includes a fixed portion and a movable portion, the fixed portion being connected to the fixed component, and the movable portion being fixedly connected to the carrier body 30.

[0078] The first mounting mechanism 10 and the second mounting mechanism 20 are fixedly connected to the fixed component. The connection method of the first mounting mechanism 10 and the second mounting mechanism 20 to the fixed component 200 can be the same or different, and the embodiment of the present application does not limit this. Exemplarily, the fixed component can be a cavity 200, so that the first mounting mechanism 10 and the second mounting mechanism 20 can maintain stability by utilizing the rigidity of the cavity 200 itself. Exemplarily, the fixed component can be a fixed base (not shown in the figure) in the semiconductor device 10000, and the fixed base is connected to the machine of the semiconductor device 10000 through a seismic mounting foot, which can isolate external vibrations and provide rigid support for the carrier body 30. The first mounting mechanism 10 and the second mounting mechanism 20 may include but are not limited to being fixedly connected to the fixed component by means of clipping, threading, welding, riveting, etc.

[0079] The first mounting mechanism 10 and / or the second mounting mechanism 20 are used to drive the carrier body 30 to move in the vertical direction under the drive of the driving component 74. That is, one or both of the first mounting mechanism 10 and the second mounting mechanism 20 are used to drive the carrier body 30 to move in the vertical direction under the drive of the driving component 74, thereby driving the chuck 73 to rise and fall in the vertical direction to adjust the position of the wafer. The first mounting mechanism 10 and the second mounting mechanism 20 can use precision linear guides, ball screws or piezoelectric ceramic drive mechanisms to ensure the accuracy of vertical movement. Under the action of the driving component 74 (such as a servo motor, a stepper motor or a cylinder), the first mounting mechanism 10 and / or the second mounting mechanism 20 can independently or synchronously adjust the vertical position of the carrier body 30 to adjust the horizontality of the chuck 73.

[0080] In an atmospheric environment, the first mounting mechanism 10 and the second mounting mechanism 20 are adjusted by an adjustment mechanism (i.e., the first and second adjustment assemblies described below) to bring the chuck 73 into a horizontal position. When the semiconductor device 10000 enters a vacuum environment, the vacuum suction force changes the direction of force acting on the carrier body 30 from downward (gravity) to upward (sucking force). At this point, due to the symmetrical force design, the deformation of the first mounting mechanism 10 and the second mounting mechanism 20 offsets each other in the horizontal direction, ensuring that when the vacuum suction force is applied, the deformation components of the mounting mechanisms on both sides are self-balanced in the horizontal plane, thereby maintaining the horizontal position of the chuck 73.

[0081] In the embodiment of the present application, the first mounting mechanism 10 and the second mounting mechanism 20 are arranged on both sides of the carrier body 30 and connected to the carrier body 30, and precise vertical adjustment is achieved under the action of the driving component 74. Therefore, when the chuck 73, which is in a horizontal state in the atmospheric environment, is placed in a vacuum environment, although the force applied to the carrier body 30 changes, the horizontal force components of the first deformation of the first mounting mechanism 10 and the second deformation of the second mounting mechanism 20 can still offset each other. Therefore, the problem of structural deformation in a vacuum environment causing the chuck 73 to tilt is effectively overcome, so that the chuck 73 can always maintain a horizontal state, and the structural stability of the carrier device 100 is improved. This is conducive to improving the stability of film production, improving film quality, reducing scrap rate, and increasing production efficiency.

[0082] In some embodiments of the present application, the first mounting mechanism 10 and the second mounting mechanism 20 are made of the same material and structure. This structural identity refers to the same geometric structure of the first mounting mechanism 10 and the second mounting mechanism 20, which includes the same shape and size. Optionally, this geometric identity may also include the same fitting tolerance and precision. This ensures that the first mounting mechanism 10 and the second mounting mechanism 20 have exactly the same assembly tolerance with the carrier body 30, ensuring consistent movement precision.

[0083] Because the first and second mounting mechanisms 10 and 20 are made of the same material and structure, their mechanical properties are highly consistent. This allows them to withstand loads under the gravity of the support body 30 and chuck 73 with the same degree of deformation and stress distribution, ensuring consistent deformation characteristics in a vacuum environment. This balances the forces on both sides of the support body 30, further ensuring that the levelness of the chuck 73 during actual operation is consistent with that achieved during testing.

[0084] In other embodiments of the present application, the first mounting mechanism 10 and the second mounting mechanism 20 are different in at least one of material and structure, and the one with greater bending stiffness between the first mounting mechanism 10 and the second mounting mechanism 20 is closer to the supporting body 30 .

[0085] Optionally, the first mounting mechanism 10 and the second mounting mechanism 20 are made of different materials, while the first mounting mechanism 10 and the second mounting mechanism 20 have the same structure. Since the first mounting mechanism 10 and the second mounting mechanism 20 have the same structure, the consistency of the movement and force transmission paths of the two can be ensured. The different materials allow the first mounting mechanism 10 and the second mounting mechanism 20 to achieve a reasonable distribution of the load on the load-bearing body based on the difference in the mechanical properties of the materials. For example, high-rigidity, high-strength alloy steel can be used for the first mounting mechanism 10, so that it bears the main vertical load and bending moment, while the second mounting mechanism 20 uses a lightweight but tough aluminum alloy to assist in bearing part of the load and reduce the overall weight. When carrying a chuck 73 with a large load mass, the first mounting mechanism 10 made of alloy steel can effectively support the weight of the chuck 73 by virtue of its high strength and high rigidity, reducing the deformation of the load-bearing body, while the second mounting mechanism 20 made of aluminum alloy can reduce the overall inertia of the device while ensuring a certain load-bearing capacity, so that the drive component 74 can more easily drive the load-bearing body 30 to move, thereby improving the movement response speed.

[0086] For example, if the material of the first mounting mechanism 10 has a greater stiffness than the material of the second mounting mechanism 20, the first mounting mechanism 10 is positioned closer to the carrier body 30 than the second mounting mechanism 20. Because the first mounting mechanism 10 is made of a more rigid material, placing it closer to the carrier body 30 demonstrates that, according to the principle of mechanical leverage, a material with greater stiffness has greater resistance to deformation. Therefore, when the chuck 73 carries a heavy object, the first mounting mechanism 10, located closer to the carrier body 30, can quickly absorb the primary load and transmit the force to the fixed component with minimal deformation, thereby improving the operational stability of the semiconductor device 10000. The second mounting mechanism 20, however, is positioned farther from the carrier body 30, serving as auxiliary support and effectively reducing overall deformation of the carrier device 1000. The more rigid first mounting mechanism 10, when subjected to force, experiences minimal deformation, effectively maintaining the stability of the carrier body 30. Meanwhile, the less rigid second mounting mechanism 20, located farther from the carrier body 30, exhibits relatively minimal impact on the levelness and stability of the carrier body 30, even if it undergoes some deformation. Through the cooperation of the first mounting mechanism 10 and the second mounting mechanism 20 , the overall structure of the carrier device 100 can still maintain high rigidity and stability when bearing a large load, thereby improving the operational stability of the semiconductor device 10000 .

[0087] For example, the stiffness of the material of the first mounting mechanism 10 is smaller than the stiffness of the material of the second mounting mechanism 20 . Therefore, the second mounting mechanism 20 is closer to the supporting body 30 than the first mounting mechanism 10 .

[0088] Because the second mounting mechanism 20 is made of highly rigid material and is located close to the carrier body 30, it can quickly absorb the primary load generated by the chuck 73. During mechanical transmission, high-rigidity materials exhibit minimal deformation, effectively transmitting force to the mounting assembly and improving the operational stability of the semiconductor device 10000. The first mounting mechanism 10, however, is spaced further from the carrier body 30, serving as auxiliary support. The coordination of the first mounting mechanism 10 and the second mounting mechanism 20 allows the carrier device 100 to maintain high rigidity and stability even when subjected to significant loads, thereby enhancing the operational stability of the semiconductor device 10000.

[0089] The first mounting mechanism 10 and the second mounting mechanism 20 may be made of titanium alloy, aluminum alloy, bearing steel, stainless steel, etc., which is not limited in this embodiment of the present application.

[0090] Alternatively, the first mounting mechanism 10 and the second mounting mechanism 20 may have different structures, but be made of the same material. In this way, the first mounting mechanism 10 and the second mounting mechanism 20 may be appropriately configured based on their respective load conditions, and the coordination of the two ensures the stability of the supporting body 30 and prevents the chuck 73 from tilting.

[0091] For example, if the rigidity of the first mounting mechanism 10 is greater than that of the second mounting mechanism 20, the first mounting mechanism 10 is closer to the carrier body 30 than the second mounting mechanism 20. Because the first mounting mechanism 10 is rigid and close to the carrier body 30, its higher rigidity allows the first mounting mechanism 10 to maintain a stable motion during acceleration, deceleration, or start-stop moments, reducing the impact of inertial forces on the carrier body 30. This effectively suppresses shaking and offsetting of the carrier body 30 during movement, ensuring that the chuck 73 remains stable during high-speed movement, preventing wafer packaging failures due to vibration or displacement deviation, and improving production yield.

[0092] For example, the rigidity of the first mounting mechanism 10 is less than that of the second mounting mechanism 20. Then, the second mounting mechanism 20 is closer to the load-bearing body 30 than the first mounting mechanism 10. The second mounting mechanism 20 has high rigidity and is arranged close to the load-bearing body 30, and can quickly bear the main load of the chuck 73 and the workpiece. The first mounting mechanism 10 has low rigidity and is farther away from the load-bearing body 30 than the second mounting mechanism 20. As an auxiliary support, it can share the remaining load without causing local stress concentration due to excessive force. Through the coordinated work of the first mounting mechanism 10 and the second mounting mechanism 20, the stress distribution of the load-bearing body 30 is made more uniform, the fatigue loss of the load-bearing body 30 is reduced, and the overall service life of the load-bearing device 100 is extended.

[0093] Optionally, the first mounting mechanism 10 and the second mounting mechanism 20 may have different structures and materials. Thus, by combining different structures and materials, the first mounting mechanism 10 and the second mounting mechanism 20 can be specifically configured to bear different types of loads, thereby improving the overall stability of the carrying device 100 and reducing the risk of tilting of the chuck 73.

[0094] When at least one of the materials and structures of the first mounting mechanism 10 and the second mounting mechanism 20 is different, and the one with greater bending stiffness is closer to the carrier body 30, then the asymmetric deformation in the vacuum environment can be compensated for in a targeted manner, and the deformation can be actively offset and the horizontality of the chuck 73 can be maintained through differentiated stiffness design.

[0095] Furthermore, according to mechanical principles, a mechanism with high bending stiffness can better resist bending deformation. Placing it near the support body 30 allows the mechanism to more directly bear the bending moment exerted on the support body 30. For example, when the support body 30 supports a heavy chuck 73, the high bending stiffness mechanism near the support body 30 can quickly dissipate the bending moment generated by the weight of the chuck 73, reducing deformation of the support body 30 and preventing horizontal deviation of the chuck 73 due to excessive bending, thereby ensuring that the chuck 73 remains level during operation.

[0096] In some embodiments of this application, please refer to Figure 1 and Figure 3 , the first mounting mechanism 10 and the second mounting mechanism 20 are both slidably connected to the carrier body 30. Among them, the first mounting mechanism 10 and the second mounting mechanism 20 can be slidably connected by a slide rail and slider mechanism. For the convenience of description, the embodiment of the present application is not described here for the time being, and reference can be made to the description below. In this way, by slidingly connecting the first mounting mechanism 10 and the second mounting mechanism 20 to the carrier body 30, the relative displacement adjustment between the mounting mechanism (i.e., the first mounting mechanism 10 and the second mounting mechanism 20) and the carrier body 30 is achieved, which can adapt to the deformation of the vacuum environment and maintain the dynamic balance of the chuck 73.

[0097] In one possible implementation, see Figure 1 and Figure 3 , the first mounting mechanism 10 and the second mounting mechanism 20 are arranged in parallel. Among them, the parallel arrangement includes that the first mounting structure and the second mounting mechanism 20 are arranged completely in parallel, and the first mounting mechanism 10 and the second mounting mechanism 20 are arranged close to parallel. The first mounting mechanism 10 and the second mounting mechanism 20 are arranged close to parallel, which means that the angle between the extension line of the first mounting mechanism 10 and the second mounting mechanism 20 is less than or equal to 5 degrees. In addition, the first mounting mechanism 10 and the second mounting mechanism 20 can be arranged in parallel in the vertical direction. In this way, when the chuck 73 carries the wafer, gravity can be directly and evenly transferred to the two mechanisms (i.e., the first mounting mechanism 10 and the second mounting mechanism 20), avoiding the tilting or twisting deformation of the bearing body 30 due to uneven force, so that the bearing body 30 can achieve a more uniform force distribution when bearing a vertical load.

[0098] Since the first mounting mechanism 10 and the second mounting mechanism 20 are arranged in parallel, the two mounting mechanisms can better cooperate when driving the supporting body 30 to move. Under the action of the driving component 74, the first mounting mechanism 10 and the second mounting mechanism 20 can slide synchronously along the supporting body 30, driving the supporting body 30 to move smoothly in the vertical direction. Compared with the non-parallel arrangement, the two mounting mechanisms arranged in parallel will not cause mutual interference due to inconsistent directions during the movement, and can more accurately control the displacement and speed of the supporting body 30. In addition, when fine-tuning the position of the chuck 73, the synchronous movement of the two mounting mechanisms arranged in parallel can ensure that the chuck 73 always remains horizontal during the movement, avoiding the tilt of the chuck 73 due to the difference in the movement of the mechanisms, thereby improving the accuracy and smoothness of the operation. In another possible embodiment, the first mounting mechanism 10 and the second mounting mechanism 20 can also be arranged in a non-parallel manner.

[0099] In one possible structural design, please continue to see Figure 1 、 Figure 2 and Figure 3 The first mounting mechanism 10 includes a first mounting member 11, a first slide rail 12, and a first slider 13. The extension direction of the first slide rail 12 is consistent with the lifting direction of the chuck 73. Thus, the chuck 73 always moves along the extension direction of the first slide rail 12 during the lifting process, thus preventing the position of the chuck 73 from shifting due to directional deviation.

[0100] In addition, the first slide rail 12 is slidably connected to the first slider 13. In one possible structural design, the first slide rail 12 is provided with a slide groove 121, and the first slider 13 is slidably arranged along the extension direction of the slide groove 121. The first slider 13 is fixedly connected to the support body 30. Optionally, the first slider 13 can be fixedly connected to the support body 30 by screws. In this way, during equipment maintenance, if the first slider 13 or a related part of the support body 30 malfunctions, the screw fixing method facilitates disassembly and maintenance. Simply remove the screws to separate the first slider 13 from the support body 30, making it easier for maintenance personnel to inspect or replace the first slider 13, the first slide rail 12, or the support body 30. Compared with non-detachable connection methods, this can shorten maintenance time and reduce production losses caused by equipment downtime. Optionally, the first slider 13 can also be fixedly connected to the support body 30 by bonding, welding, clamping, etc. In this way, the connection strength between the first slider 13 and the carrier body 30 is high, ensuring that the first slider 13 can stably cooperate with the carrier body 30 during the lifting and lowering process of the chuck 73.

[0101] Also, see Figure 1 , the first mounting member 11 is connected to the cavity 200, and the connection between the first mounting member 11 and the cavity 200 includes but is not limited to bonding, threaded connection, welding, clamping, integral molding, etc. The first mounting member 11 is located on the side of the first slide rail 12 away from the bearing body 30, and is fixedly connected to the first slide rail 12. The connection between the first mounting member 11 and the first slide rail 12 includes but is not limited to bonding, threaded connection, welding, clamping, etc. In addition, the first mounting member 11 can be a plate-like structure, a columnar structure, etc., which is not limited in this application. Since the first mounting member 11 is connected to the cavity 200, and is located on the side of the first slide rail 12 away from the bearing body 30, and is connected to the first slide rail 12, then the first mounting member 11 can effectively support the first slide rail 12, thereby enhancing the overall stability of the bearing device 100 and improving the service life of the bearing device 100.

[0102] In this way, by setting a linkage structure of the first mounting member 11, the first slide rail 12 and the first slider 13 in the first mounting mechanism 10, the linear motion of the driving component 74 can be converted into a stable lifting and lowering of the supporting body 30, which can efficiently transmit power and reduce movement friction.

[0103] Figure 4 Provided in the embodiments of this application Figure 1 Partial structural diagram of the first mounting mechanism in FIG. , in a possible structural design, please refer to Figure 3 and Figure 4At least two slide grooves 121 are provided on the first slide rail 12, and the first slide rail 12 includes: a first end wall 12A, a first side wall 12B and a second side wall 12C. The first end wall 12A is arranged toward the supporting body 30, and the first side wall 12B is provided with a first slide groove 1211, and at least a portion of the first slider 13 is slidably provided in the first slide groove 1211. That is, the first slider 13 can slide along the extension direction of the first slide groove 1211. The second side wall 12C and the first side wall 12B are respectively connected to the two opposite edges of the first end wall 12A, and the second side wall 12C is provided with a second slide groove 1212, and at least a portion of the first slider 13 is slidably provided in the second slide groove 1212. The extension direction of the first slide groove 1211 is consistent with the extension direction of the second slide groove 1212.

[0104] It should be noted that the extension direction of the first slide groove 1211 is consistent with the extension direction of the second slide groove 1212, which may include that the extension direction of the first slide groove 1211 is parallel to the extension direction of the second slide groove 1212, or the angle between the extension direction of the first slide groove 1211 and the extension direction of the second slide groove 1212 is less than or equal to 10°.

[0105] Because the first slide rail 12 provides dual-sided guidance for the first slider 13 by providing the first and second slide grooves 1211, 1212 on the first and second side walls 12B, 12C, respectively, compared to a system with only one slide groove 121, the first slider 13 can better maintain a straight trajectory during movement, reducing the possibility of sway and deviation, thereby improving the guidance accuracy and stability of the connection between the support body 30 and the slide rail. Furthermore, the dual-sided slide grooves 121 more evenly distribute the load borne by the first slider 13 across the contact surfaces of the first and second slide grooves 1211, 1212, thereby improving the load-bearing capacity of the support body 30 and reducing tilt of the support body 30, thereby reducing tilt of the chuck 73 and improving the machining accuracy and quality of the semiconductor device 10000.

[0106] Please continue reading Figure 4The first slider 13 includes a first sliding portion 131, a second sliding portion 132, and a connecting portion 133. The first sliding portion 131 is slidably disposed in the first sliding groove 1211 and can slide along the extension direction of the first sliding groove 1211. The second sliding portion 132 is slidably disposed in the second sliding groove 1212 and can slide along the extension direction of the second sliding groove 1212. The connecting portion 133 is connected to the first sliding portion 131 and the second sliding portion 132 and is disposed between the first slide rail 12 and the carrier body 30. Among them, the connecting part 133 is fixedly connected to the first sliding part 131 and the second sliding part 132. Exemplarily, the connecting part 133 can be fixedly connected to the first sliding part 131 and the second sliding part 132 by bonding, threading, welding, clamping, etc. Exemplarily, the connecting part 133 can also be an integrally molded structure with the first sliding part 131 and / or the second sliding part 132, that is, the connecting part 133 and the first sliding part 131 and / or the second sliding part 132 are a structural component as a whole.

[0107] Since the first sliding portion 131 cooperates with the first sliding groove 1211 and the second sliding portion 132 cooperates with the second sliding groove 1212, the movement of the first slider 13 is constrained and guided from opposite sides, reducing the possibility of the first slider 13 running off, shaking or swinging during the sliding process, thereby ensuring the high stability and accuracy of the sliding.

[0108] In another possible structural design, the first slide rail 12 is provided with only a single slide groove 121, which can be provided on the first end wall 12A. The first slider 13 is provided with a single sliding portion, which slides in the single slide groove 121. In this way, the structure of the first slide rail 12 is simple, and production and assembly are convenient, thereby reducing the manufacturing cost of the carrying device 100.

[0109] In some embodiments of this application, please refer to Figure 3 The second mounting mechanism 20 includes a second mounting member 21, a second slide rail 22, and a second slider 23. The second mounting member 21 is fixedly connected to the second slide rail 22, the second slide rail 22 is slidably connected to the second slider 23, and the second slider 23 is fixedly connected to the supporting body 30. The structures of the second mounting member 21, the second slide rail 22, and the second slider 23 can be referred to the above description of the first mounting member 11, the first slide rail 12, and the first slider 13, and will not be described in detail in this embodiment of the present application.

[0110] In this way, by setting a linkage structure of a second mounting member 21, a second slide rail 22 and a second slider 23 in the second mounting mechanism 20, the linear motion of the driving component 74 can be converted into a stable lifting and lowering of the supporting body 30, which can efficiently transmit power and reduce movement friction. In addition, by setting sliding mechanisms (first mounting mechanism 10 and second mounting mechanism 20) on both sides of the supporting body 30 at the same time, since the sliding mechanisms arranged on both sides can offset the overload problem caused by unilateral force, it is ensured that the supporting body 30 remains in a horizontal state during the lifting process, thereby avoiding the supporting body 30 from getting stuck or tilting during the lifting process.

[0111] In some embodiments of this application, please refer to Figure 1 The second mounting member 21 is provided with a mounting positioning groove 211 on a side facing the first mounting mechanism 10. At least a portion of the second slide rail 22 is disposed within the mounting positioning groove 211. The mounting positioning groove 211 is adapted to limit the translational freedom of the second slide rail 22 in at least one direction. Thus, by providing the mounting positioning groove 211 on the second mounting member 21 to accommodate the second slide rail 22, the overall structural rigidity can be enhanced, vibration offset can be reduced, and the positioning accuracy and assembly stability of the second slide rail 22 can be improved.

[0112] The extending direction of the installation positioning groove 211 is consistent with the extending direction of the second slide rail 22 . This facilitates the installation of the second slide rail 22 in the installation positioning groove 211 , thereby improving the installation accuracy of the second slide rail 22 .

[0113] Optionally, the shape of the mounting positioning groove 211 is adapted to match the second slide rail 22. For example, when the wall of the second slide rail 22 facing the mounting positioning groove 211 is rectangular, the shape of the mounting positioning groove 211 can be a rectangle adapted to the second slide rail 22. In this way, when the shape of the mounting positioning groove 211 is adapted to the second slide rail 22, the two can achieve a larger area of ​​contact. Compared to the case where the shapes do not match, the contact area between the mounting positioning groove 211 and the second slide rail 22 is greatly improved. The larger contact area can evenly distribute the load on the contact surface between the mounting positioning groove 211 and the second slide rail 22, avoiding local stress concentration.

[0114] Optionally, the shape of the mounting locating groove 211 may not match that of the second slide rail 22. For example, when the projection of the second slide rail 22 on the plane where the mounting locating groove 211 is located is a rectangle, the shape of the mounting locating groove 211 may be a square. The mounting locating groove 211 may also accommodate other components, but this embodiment of the application is not limited to this. In this way, the second mounting locating groove 211 can achieve the positioning of multiple components, improve the assembly accuracy of multiple components, and improve production efficiency.

[0115] In addition, in a possible structural design, the depth of the installation positioning groove 211 can be smaller than the thickness of the second slide rail 22 (that is, the dimension of the second slide rail 22 along the depth direction of the installation positioning groove 211). In this way, the second slide rail 22 is not completely embedded in the installation positioning groove 211, and the side wall of the second slide rail 22 facing away from the installation positioning groove 211 extends out of the installation positioning groove 211. Then, the second slider 23 arranged on the side of the second slide rail 22 facing away from the installation positioning groove 211 is not easily interfered with by the installation positioning groove 211, and there is no need to consider the installation positioning groove 211 interfering with the sliding of the second slider 23, which facilitates design and processing.

[0116] In another possible structural design, the depth of the installation positioning groove 211 can be equal to the thickness of the second slide rail 22 (that is, the dimension of the second slide rail 22 along the depth direction of the installation positioning groove 211). Since the depth of the installation positioning groove 211 is equal to the thickness of the second slide rail 22, the second slide rail 22 can be completely embedded in the installation positioning groove 211, thereby forming a tightly fitting structure. Compared with the design in which the depth is less than the thickness of the second slide rail 22, its anti-slip performance is significantly improved. In addition, the second slider 23 arranged on the side of the second slide rail 22 away from the installation positioning groove 211 is not easily interfered with by the installation positioning groove 211, and there is no need to consider the installation positioning groove 211 interfering with the sliding of the second slider 23, which is convenient for design and processing.

[0117] In another possible structural design, the depth of the mounting and positioning groove 211 can be greater than the thickness of the second slide rail 22 (i.e., the dimension of the second slide rail 22 along the depth direction of the mounting and positioning groove 211). In this way, the second slide rail 22 can be prevented from falling out of the mounting and positioning groove 211 during operation of the semiconductor device 10000. In addition, the mounting and positioning groove 211 can provide a large anti-overturning moment, limiting the vertical displacement of the second slide rail 22, ensuring that the semiconductor device 10000 can maintain stable operation under complex stress conditions.

[0118] In some embodiments of this application, please continue to refer to Figure 1 、 Figure 2 and Figure 3 The surface of the second mounting member 21 facing away from the second slide rail 22 is the first surface 21A. Reinforcing ribs 212 are provided on the first surface 21A. The reinforcing ribs 212 and the mounting positioning grooves 211 are located on opposite sides of the second mounting member 21. By providing the reinforcing ribs 212 on the second mounting member 21 and arranging the reinforcing ribs 212 and the mounting positioning grooves on opposite sides of the second mounting member 21, the deformation resistance of the mounting area of ​​the second slide rail 22 can be specifically enhanced, thereby suppressing tilting of the chuck 73 caused by local deformation of the second mounting member 21 in a vacuum environment.

[0119] For example, Figure 1As shown, the extending direction of the reinforcing rib 212 is consistent with the extending direction of the second slide rail 22. It is understandable that when the second mounting member 21 is provided with the mounting positioning groove 211 on the side facing the second slide rail 22, the provision of the mounting positioning groove 211 will undoubtedly reduce the overall strength of the second mounting member 21. However, by aligning the extending direction of the reinforcing rib 212 with the extending direction of the second slide rail 22 in the present embodiment, the overall strength of the second mounting member 21 can be improved, reducing the impact of the mounting positioning groove 211 on the strength of the second mounting member 21.

[0120] In addition, optionally, the shape of the reinforcing rib 212 can be plate-shaped, so that the contact area with the second mounting member 21 can be increased, and the bearing capacity of the second mounting member 21 can be improved. Figure 1 As shown, the shape of the reinforcing rib 212 can also be strip-shaped. In this way, the strip-shaped reinforcing rib 212 can evenly distribute the load to the entire structure, avoid stress concentration, and extend the service life of the semiconductor device 10000.

[0121] Furthermore, the orthographic projection of the reinforcing rib 212 on the first surface 21A coincides with the orthographic projection of the mounting positioning groove 211 on the first surface 21A. Thus, when the second mounting member 21 is subjected to external forces, the reinforcing rib 212 can partially absorb the stress, reducing the risk of deformation and damage to the second mounting member 21, thereby extending the service life of the second mounting member 21. Furthermore, because the orthographic projection of the reinforcing rib 212 on the first surface 21A coincides with the orthographic projection of the mounting positioning groove 211 on the first surface 21A, the reinforcing rib 212 can provide additional support for the mounting positioning groove 211, thereby improving the stability of the second mounting member 21.

[0122] In one possible implementation, please refer to Figure 1 and Figure 3 The first mounting mechanism 10 includes a first mounting member 11, a first slide rail 12, and a first slider 13. The first mounting member 11 is fixedly connected to the first slide rail 12, which is slidably connected to the first slider 13. The first slider 13 is fixedly connected to the supporting body 30. The first slide rail 12 and the second slide rail 22 are arranged in parallel. The first slide rail 12 and the second slide rail 22 can be arranged in parallel in the vertical direction. This ensures that the first slider 13 and the second slider 23 slide in the same direction, preventing the first slider 13 and the second slider 23 from sliding out of sync and causing jamming.

[0123] Also, see Figure 1, the first mounting member 11 and the second mounting member 21 are arranged in parallel. Specifically, the second mounting member 21 includes: a first surface 21A and a second surface 21B arranged opposite to each other, the first surface 21A is the surface of the second mounting member 21 described above on the side away from the second slide rail 22, and the second surface 21B is the surface of the second mounting member 21 on the side close to the second slide rail 22. The first mounting member 11 includes a third surface 11A, which is a side surface of the first mounting member 11 close to the first slide rail 12. The third surface 11A is arranged in parallel with the second surface 21B. In this way, it can be ensured that the first slide rail 12 installed on the third surface 11A is arranged in parallel with the second slide rail 22 arranged on the second surface 21B, thereby avoiding sliding jamming of the double slide rails due to non-parallel settings.

[0124] Among them, the first mounting member 11, the first slide rail 12 and the first slider 13, the first mounting member 11 is fixedly connected to the first slide rail 12, the first slide rail 12 is slidingly connected to the first slider 13, and the structural features of the first slider 13 being fixedly connected to the supporting body 30 can be referred to the above description, and the embodiments of the present application will not be repeated here one by one.

[0125] In this way, by setting the first slide rail 12, the second slide rail 22 and the corresponding mounting parts in parallel, the consistency of the movement trajectory on both sides of the supporting body 30 can be ensured, thereby avoiding twisting or jamming when the chuck 73 is adjusted horizontally, and enhancing the mechanical reliability of the supporting device 100.

[0126] Figure 5 The embodiment of the present application provides Figure 1 The front view of the reaction chamber 1000 is shown in FIG. Figure 3 and Figure 5 In some embodiments of the present application, the carrying body 30 includes: a first connecting mechanism 31, a support member 32 and a carrier 33, the first connecting mechanism 31 is fixedly connected to the first slider 13 and the second slider 23, and the first connecting mechanism 31 is fixedly connected to the support member 32, the support member 32 is fixedly connected to the carrier 33, and the carrier 33 is used to support the chuck 73.

[0127] Please continue to see Figure 3 , the support member 32 includes a connecting rod 321, and the connecting rod 321 is connected between the first connecting mechanism 31 and the carrier 33. That is, part of the connecting rod 321 is located in the cavity 200 and is fixedly connected to the carrier 33. Exemplarily, the connecting rod 321 may include but is not limited to being fixedly connected to the carrier 33 by means of threaded connection, clamping, riveting, gluing, etc. In addition, another part of the connecting rod 321 is located outside the cavity 200 and is fixedly connected to the first connecting mechanism 31. The fixed connection between the connecting rod 321 and the first connecting mechanism 31 can refer to the connection method between the connecting rod 321 and the carrier mentioned above, and the embodiments of the present application will not be repeated one by one.

[0128] In this way, when the first connecting mechanism 31 slides along with the slider (ie, the first slider 13 and / or the second slider 23 ), the first connecting mechanism 31 drives the connecting rod 321 and the carrier 33 to slide along with it, thereby achieving the lifting of the wafer on the chuck 73 .

[0129] In addition, the first connecting mechanism 31 is fixedly connected to the support member 32 , and the fixed connection method between the support member 32 and the carrier 33 can be the same or different, and this embodiment of the application does not limit this.

[0130] Optionally, the first connecting mechanism 31 and the support member 32, and the support member 32 and the carrier 33 can be fixedly connected by screws. In this way, during equipment maintenance, if the first connecting mechanism 31, the support member 32 or the carrier 33 fails, the screw fixing method is convenient for disassembly and maintenance. Just unscrew the screws to separate them, which is convenient for maintenance personnel to check or replace. Compared with the non-detachable connection method, the maintenance time can be shortened and the production loss caused by equipment downtime can be reduced. Optionally, the first connecting mechanism 31 and the support member 32, and the support member 32 and the carrier 33 can also be fixedly connected by bonding, welding, clamping, etc. In this way, the connection strength of the first connecting mechanism 31, the support member 32 and the carrier 33 is high, ensuring that during the lifting and lowering process of the chuck 73, the carrier body 30 can work stably with the carrier wafer.

[0131] In this way, by designing the carrier body 30 as a split structure (such as the first connecting mechanism 31, the support member 32, and the carrier 33), the stress concentration in the vacuum environment can be dispersed, thereby reducing the risk of overall deformation and facilitating modular maintenance.

[0132] In one possible implementation, see Figure 3 and Figure 5 The first connecting mechanism 31 includes a first connecting member 311 and a second connecting member 312. The first connecting member 311 is fixedly connected to the first slider 13, the second connecting member 312 is fixedly connected to the second slider 23, the first connecting member 311 is fixedly connected to the second connecting member 312, and the carrier 33 is fixedly connected to at least one of the first connecting member 311 and the second connecting member 312.

[0133] Specifically, the first connecting member 311 may be a substrate with a plate-like structure. The first connecting member 311 may include: a first substrate 3111 and a second substrate 3112 connected to each other. The second substrate 3112 is connected to the support member 32 , and the first substrate 3111 is connected to the first slider 13 .

[0134] The connection method between the first substrate 3111 and the support member 32, the connection method between the first substrate 3111 and the first slider 13, and the connection method between the first substrate 3111 and the second substrate 3112 can be completely the same, partially the same, or completely different, and this embodiment of the application does not limit this. In this way, an appropriate connection method can be reasonably selected according to the stress conditions of each component to improve the structural stability of the support device.

[0135] For the convenience of description, the embodiment of the present application is described by taking the connection between the first substrate 3111 and the second substrate 3112 as an example. The connection between the first substrate 3111 and the support member 32 and the connection between the first substrate 3111 and the first slider 13 can all refer to the connection between the first substrate 3111 and the second substrate 3112.

[0136] Optionally, the first substrate 3111 and the second substrate 3112 can be an integrally formed structure, that is, the first substrate 3111 and the second substrate 3112 are an integral structural component. In this way, when producing the carrying device, there is no need to assemble the first substrate 3111 and the second substrate 3112, which is conducive to reducing the production process. Optionally, the first substrate 3111 can also be fixedly connected to the second substrate 3112 by bonding, threading, welding, clamping, etc. In this way, since the first substrate 3111 and the second substrate 3112 are separate structures before production and processing, the space occupied by the first substrate 3111 and the second substrate 3112 during transportation is smaller, which is conducive to improving transportation efficiency.

[0137] Also, see Figure 3 , the first substrate 3111 is arranged toward the first slider 13. Specifically, the largest surface of the first substrate 3111 is arranged toward the first slider 13. The first substrate 3111 is arranged in the vertical direction, and the first substrate 3111 is connected between the first substrate 3111 and the first slider 13. The first substrate 3111 can be fixedly connected to the connecting portion 133 of the first slider 13, wherein the manner in which the first substrate 3111 can be fixedly connected to the connecting portion 133 of the first slider 13 can refer to the connection between the first substrate 3111 and the second substrate 3112 described above, and the embodiments of the present application will not be described in detail here. Since the largest surface of the first substrate 3111 is arranged toward the first slider 13, the fitting area when the first substrate 3111 and the first slider 13 are connected is larger, and thus, if the first mounting mechanism 10 is subjected to a tilting force, the second substrate 3112 can better resist the tilt, thereby reducing the probability of changes in the horizontality of the support member 32 and the first mounting mechanism 10.

[0138] Also, see Figure 3The second substrate 3112 is disposed toward the support member 32. Specifically, the largest surface of the second substrate 3112 is disposed toward the support member 32. The second substrate 3112 is disposed horizontally and connected to the first substrate 3111 and the support member 32. In this manner, the horizontally disposed second substrate 3112 can stably support the support member 32 and the stage 33 in the horizontal direction, preventing uneven force on certain areas of the second substrate 3112 from tilting and causing increased stress, thereby improving the structural stability of the supporting device 100.

[0139] In one possible implementation, please refer to Figure 3 The second connecting member 312 includes a first connecting block 3121 and a second connecting block 3122 connected to each other. The second connecting block 3122 is fixedly connected to the second slider 23, and the first connecting block 3121 is connected to the first base plate 3111. The arrangement direction of the first connecting block 3121 and the second connecting block 3122 is consistent with the extension direction of the second slide rail 22, that is, the arrangement direction of the first connecting block 3121 and the second connecting block 3122 is consistent with the lifting direction of the carrying device 100. The arrangement direction of the first connecting block 3121 and the second base plate 3112 can also be consistent with the extension direction of the second slide rail 22. The first connecting block 3121 and the second base plate 3112 can be fixedly connected by a connecting member, such as a screw connection or a bolt connection. In this way, the gravity of the first connecting mechanism 31 and the support member 32 can act directly on the first connecting block 3121. Compared with other arrangement directions of the first connecting block 3121 and the second substrate 3112 (for example, the first connecting block 3121 and the second substrate 3112 are arranged in a horizontal direction), the shear force of the gravity of the first connecting mechanism 31 and the support member 32 on the connecting member (for example, a screw) connected between the first connecting block 3121 and the first substrate 3111 can be reduced, thereby improving the overall stability of the supporting device 100.

[0140] Optionally, the first connecting block 3121 can be fixedly connected to the second connecting block 3122 by bonding, threading, welding, clamping, etc. Optionally, the first connecting block 3121 and the second connecting block 3122 can be integrally formed, that is, the first connecting block 3121 and the second connecting block 3122 are a single structural unit. The effect thereof can be referred to the connection between the first substrate 3111 and the second substrate 3112 described above, and the present embodiment will not be repeated here.

[0141] In one possible structural setting, please continue to see Figure 1 and Figure 3, the first slider 13 and the second slider 23 are both located on the side of the second substrate 3112 away from the cavity 200. In this way, the fulcrum of the support member 32 on the first substrate 3111, the connection point between the first slider 13 and the first substrate 3111, and the connection point between the second slider 23 and the second connecting member 312 are arranged in a triangle. In this way, the oblique support can disperse the force of the middle part that needs support (i.e., the gravity of the first connecting mechanism 31, the supporting member 32 and the carrier 33) to different directions. In this way, by utilizing the stability principle of the triangle, the first slider 13 and the second slider 23 can better withstand the force from above and the side, thereby enhancing the stability of the overall structure. In addition, please refer to Figure 3 The first connector 311 is fixedly connected to the second connector 312. Optionally, the first connector 311 and the second connector 312 can be an integrally formed structure, that is, the first connector 311 and the second connector 312 are an integral structural member. In this way, there is no need to assemble the first connector 311 and the second connector 312, which is conducive to reducing the production process. Optionally, the first connector 311 can be fixedly connected to the second connector 312 by bonding, threading, welding, clamping, etc. In this way, the first connector 311 and the second connector 312 are connected by assembly, and the first connector 311 and the second connector 312 occupy less space during transportation, which is conducive to improving transportation efficiency.

[0142] The support member 32 is fixedly connected to at least one of the first connecting member 311 and the second connecting member 312. For example, the support member 32 can be connected to the first connecting member 311 or the second connecting member 312 by screw threads. In this way, the connection method is easy to disassemble and convenient for later maintenance. For example, the support member 32 can also be connected to the first connecting member 311 or the second connecting member 312 by welding. In this way, the connection strength is high, which is conducive to improving the service life of the supporting device 100. For example, the support member 32 can also be connected to the first connecting member 311 or the second connecting member 312 by means of clamping, bonding, etc., which will not be described in detail in the embodiments of the present application.

[0143] In this way, the first connecting mechanism 31 adopts a split connecting member and a linkage supporting member 32, which can flexibly adapt to the layout of sliders of different sizes, thereby enhancing structural compatibility and improving assembly accuracy.

[0144] In some embodiments of this application, please refer to Figure 3 and Figure 5 The first mounting member 11 is provided with a first limiting structure 113, and the first limiting structure 113 is used to limit the moving range of the first slider 13; or / and, the second mounting member 21 is provided with a second limiting structure 213, and the second limiting structure 213 is used to limit the moving range of the second slider 23.

[0145] Among them, the structures of the first limiting structure 113 and the second limiting structure can be the same or different, and this application does not limit this. For example, the first limiting structure 113 and the second limiting structure can be block structures, plate structures, etc., and this application does not limit this.

[0146] In this way, by providing a limiting structure on the mounting member, the movement stroke of the slider can be constrained, overtravel damage can be prevented, and the lifting range of the chuck 73 can be controlled.

[0147] In one possible implementation, please refer to Figure 3 and Figure 5 The first mounting member 11 is provided with a first limiting structure 113, and the first limiting structure 113 includes a first limiting member 1131 and a second limiting member 1132. The first limiting member 1131 and the second limiting member 1132 are arranged at intervals along the extension direction of the first slide rail 12 to jointly limit the moving range of the first slider 13, wherein the moving range is the moving range of the first slider 13 on the first slide rail 12.

[0148] Optionally, the first limiting member 1131 and the second limiting member 1132 can both be block-shaped structures, that is, the first limiting member 1131 is a first limiting block, and the second limiting member 1132 is a second limiting block. The first limiting block is fixedly connected to the first mounting member 11 and is located between the first slide rail 12 and the cavity 200. The second limiting block is fixedly connected to the first mounting member 11 and is located at the end of the first slide rail 12 facing away from the cavity 200. In this way, the first limiting block and the second limiting block can cooperate to limit the sliding of the first slider 13 within a suitable range, so that the first slider 13 has two positioning base points, thereby improving the sliding accuracy of the first slider 13. Optionally, the first limiting member 1131 and the second limiting member 1132 can also be irregular three-dimensional structures, which is not limited in the embodiments of the present application. In this way, the irregular three-dimensional structure can make full use of the space at the carrier device 100 and meet the personalized needs of the carrier device 100.

[0149] Also, please continue to read Figure 3 A second limiting structure 213 is provided on the second mounting member 21. The second limiting structure 213 includes a third limiting member 2131 and a fourth limiting member 2132. The third limiting member 2131 and the fourth limiting member 2132 are arranged at intervals along the extension direction of the second slide rail 22 to jointly limit the moving range of the second slider 23.

[0150] Among them, the third limiting member 2131 and the fourth limiting member 2132 can refer to the description of the first limiting member 1131 and the second limiting member 1132 mentioned above, and the embodiment of the present application will not be described here in detail.

[0151] In this way, by adopting a dual-limiting structure arranged at intervals, the dual-limiting structure can accurately define the movement range of the slider. Then, when the slider (i.e., the first slider 13 and the second slider 23) may move out of control due to an unexpected situation (such as a control system failure) during the lifting process, the first limiting structure 113 and the second limiting structure 213 can act as a blocking structure to prevent the slider from colliding with other components, thereby protecting other components of the semiconductor device 10000 from damage. In addition, limiting the movement of the slider between the first limiting structure 113 and the second limiting structure 213 helps to improve the accuracy and stability of its movement. For example, when lifting a wafer, the second slider 23 moves between the first limiting structure 113 and the second limiting structure 213, allowing the carrier 100 to accurately stop the wafer at the specified position every time, reducing errors and uncertainties.

[0152] Example 2

[0153] See also Figure 1 、 Figure 2 and Figure 3 , Figure 1 FIG1 shows a schematic diagram of the three-dimensional structure of a reaction chamber provided in an embodiment of the present application. Figure 2 The embodiment of the present application provides Figure 1 Left view of the reaction chamber. Figure 3 The embodiment of the present application provides Figure 2 In the cross-sectional view along the AA direction, the semiconductor device 10000 includes a reaction chamber 1000, and the reaction chamber 1000 includes a carrier 100 and a cavity 200. Part of the carrier 100 is arranged in the cavity 200, and the first mounting mechanism 10 and the second mounting mechanism 20 are both fixedly connected to the cavity 200.

[0154] Optionally, the carrier device 100 may be connected to a fixing assembly. Optionally, the fixing assembly may be a cavity 200. For example, the carrier device 100 may be connected to the bottom wall of the cavity 200. Optionally, the fixing assembly may further include: a cavity 200 and a bracket 75, wherein the bottom wall of the cavity 200 may be connected to the carrier device 100 via the bracket 75, thereby improving the connection strength between the cavity 200 and the carrier device 100. Optionally, the fixing assembly may also be other structures such as a fixed base, which is not limited in this embodiment of the present application.

[0155] In addition, a vacuum environment can be formed in the cavity 200. It is understandable that semiconductor manufacturing processes, such as chemical vapor deposition (CVD) and physical vapor deposition (PVD), need to be carried out in a vacuum environment. Under vacuum conditions, the probability of collision between reaction gas molecules and between molecules and the substrate surface is greatly reduced, allowing gas molecules to move more freely, thereby reaching the substrate surface more evenly, improving the uniformity and quality of thin film deposition. In addition, the vacuum environment can also accelerate the reaction process, improve process efficiency, shorten the production cycle, and reduce production costs.

[0156] In the embodiment of the present application, by integrating the carrier device 100 into the reaction chamber 1000, a seamless transition of the chuck 73 between vacuum and atmospheric environments can be achieved, thereby improving the stability of the semiconductor process and the sealing of the chamber.

[0157] In some embodiments of this application, please continue to refer to Figure 1 、 Figure 3 and Figure 5 The reaction chamber 1000 includes a third connecting member 40, which is connected to the chamber body 200, fixedly connected to the first mounting member 11, and fixedly connected to the second mounting member 21. The reaction chamber 1000 also includes a third connecting member 40, which is connected between the bracket 75 and the carrying device 100.

[0158] Among them, the third connecting member 40 can be a plate-like structure, and the third connecting member 40 with a plate-like structure is connected between the bracket 75 and the carrying device 100. Since the third connecting member 40 has a plate-like structure, the connection area between the third connecting member 40 and the carrying device and the bracket 75 is larger, which is beneficial to ensuring the connection strength between the third connecting member 40 and the bracket 75 and the carrying device 100.

[0159] In addition, if Figure 5 As shown, the third connecting member 40 is fixedly connected to the bracket 75. For example, the third connecting member 40 can be fixedly connected to the bracket 75 by bolts, which facilitates later disassembly and maintenance and improves installation accuracy. For example, the third connecting member 40 can also be fixedly connected to the bracket 75 by welding. In this way, the connection strength between the third connecting member 40 and the bracket 75 is high, which is conducive to improving the service life of the reaction chamber 1000. For example, the third connecting member 40 can also be fixedly connected to the bracket 75 by means of clamping, riveting, or gluing, etc., which will not be described in detail in the present embodiment.

[0160] In addition, the third connecting member 40 is fixedly connected to the first mounting member 11, and the third connecting member 40 is fixedly connected to the second mounting member 21. The fixed connection method of the third connecting member 40 and the first mounting member 11, and the fixed connection method of the third connecting member 40 and the second mounting member 21 can refer to the above-mentioned fixed connection method of the third connecting member 40 and the bracket 75, and the embodiments of the present application will not repeat them one by one.

[0161] Among them, the third connecting member 40 and the bracket 75 are fixedly connected, the third connecting member 40 and the first mounting member 11, and the third connecting member 40 and the second mounting member 21 can be fixedly connected by welding, threaded connection, riveting or clamping, etc., and the embodiments of the present application do not limit this. In addition, the third connecting member 40 can be a plate-like structure or a block structure, and the embodiments of the present application do not limit this.

[0162] In this way, by adding a third connecting member 40 to uniformly fix the mounting mechanisms on both sides (i.e., the first mounting mechanism 10 and the second mounting mechanism 20) and the cavity 200, the integrity of the overall structure can be enhanced, the vibration transmission can be reduced, and the seismic resistance of the reaction chamber 1000 can be improved.

[0163] In some embodiments of this application, please refer to Figure 3 The support member 32 includes a connecting rod 321, which is connected between the first connecting mechanism 31 and the carrier 33. Part of the connecting rod 321 is located inside the cavity 200 and is fixedly connected to the carrier 33, thereby providing fixed support for the carrier 33. The other part of the connecting rod 321 is located outside the cavity 200 and is fixedly connected to the first connecting mechanism 31.

[0164] Among them, the connection method between the connecting rod 321 and the first connecting mechanism 31 and the connection method between the connecting rod 321 and the carrier 33 can be the same or different. The embodiment of the present application does not limit this and can be set according to specific circumstances.

[0165] Exemplarily, the connection between the connecting rod 321 and the first connecting mechanism 31 and the connection between the connecting rod 321 and the carrier 33 can be fixedly connected by bolts, which is convenient for later disassembly and maintenance, and can improve the installation accuracy. Exemplarily, the connection between the connecting rod 321 and the first connecting mechanism 31 and the connection between the connecting rod 321 and the carrier 33 can also be fixedly connected by welding, so that the connection strength between the connecting rod 321 and the first connecting mechanism 31 and the connection strength between the connecting rod 321 and the carrier 33 is high, which is conducive to improving the service life of the reaction chamber 1000. Exemplarily, the connection between the connecting rod 321 and the first connecting mechanism 31 and the connection between the connecting rod 321 and the carrier 33 can also be fixedly connected by means of clamping, riveting or gluing, etc., which will not be described in detail in the embodiments of the present application.

[0166] In this way, when the first connecting mechanism 31 slides along with the slider, the first connecting mechanism 31 drives the connecting rod 321 and the carrier 33 to slide along with it, thereby achieving the lifting of the wafer on the chuck 73 .

[0167] It can be understood that the cavity 200 is provided with a through hole suitable for the connecting rod 321 to pass through, and the cavity 200 needs to form a vacuum cavity 200 when the semiconductor device 10000 is working. In this way, when the cavity 200 is evacuated, it is easy for external gas to enter the cavity 200 through the gap between the connecting rod 321 and the through hole.

[0168] Based on this, in some embodiments of this application, please refer to Figure 3 The carrier device 100 also includes a bellows 50, which is connected between the first connecting mechanism 31 and the cavity 200, and the portion of the connecting rod 321 extending out of the cavity 200 is passed through the bellows 50. The bellows 50 is suitable for sealing the cavity 200, ensuring the sealing of the cavity 200, preventing gas leakage, and providing a vacuum environment for the semiconductor manufacturing process. In addition, during the operation of the semiconductor device 10000, due to factors such as temperature changes, mechanical vibrations, and equipment installation errors, a certain degree of displacement or deformation will occur. The bellows 50 can absorb these displacements through its own expansion and contraction and deformation, compensate for the relative movement between pipes or equipment components, avoid equipment damage due to stress concentration, and ensure the normal operation of the semiconductor device 10000.

[0169] Furthermore, based on the carrier device 100 of the present application, when the cavity 200 is evacuated and the first connecting mechanism 31 is relatively far from the cavity 200 (i.e., located on the side of the slide hole away from the cavity 200), the first connecting mechanism 31 is primarily subject to the vacuum suction force exerted on it by the cavity 200 (i.e., the force exerted by the bellows 50 due to the reduction of gas in the space within the bellows 50, causing the bellows 50 to contract), its own gravity, and the elastic restoring force exerted on it by the bellows 50. Specifically, initially, the first connecting mechanism 31 is relatively far from the cavity 200, the bellows 50 is in a stretched state, and the direction of the elastic force acting on the bellows 50 is vertically upward; as the first connecting mechanism 31 continues to move upward (i.e., toward the side closer to the cavity 200), the elastic restoring force exerted on it by the bellows 50 gradually decreases until it becomes zero. Afterwards, under the action of vacuum suction, the first connecting mechanism 31 continues to move upward, and the state of the bellows 50 gradually changes from tension to compression, and the direction of the elastic force of the bellows 50 gradually changes to vertically downward (that is, toward the side away from the cavity 200). As the first connecting mechanism 31 continues to move upward, during the entire dynamic operation process, since the vacuum force and the gravity of the first connecting mechanism 31 and the carrier 33 do not change, the elastic force changes of the bellows 50 are transmitted by the first connecting mechanism 31 to the mounting parts on both sides (that is, the first mounting part 11 and the second mounting part 21).

[0170] In the embodiment of the present application, since the first mounting member 11 and the second mounting member 21 are respectively subjected to forces acting perpendicularly in the vertical direction, the deformations of the first mounting member 11 and the second mounting member 21 in the horizontal direction are opposite. After the deformations of the two cancel each other out, the first connecting mechanism 31 can avoid a position difference (i.e., tilt) in the horizontal direction. In addition, the supporting device 100 of the embodiment of the present application can meet the requirements of the dynamic change of the force acting on the bellows 50, and the horizontality of the first connecting mechanism 31 and the carrier 33 remains in a good state. Thus, not only is the stepless lifting and lowering adjustment of the first connecting mechanism 31 and the carrier 33 achieved, but the horizontality of the first connecting mechanism 31 and the carrier 33 at different heights is also met.

[0171] See also Figure 6 and Figure 7 , Figure 6 The embodiment of the present application provides Figure 1 Bottom view of the carrying device, Figure 7 The embodiment of the present application provides Figure 6 An enlarged view of region D in the middle. In some embodiments of the present application, the reaction chamber 1000 further includes a first adjustment assembly 60, which is connected to the first connecting mechanism 31 and is configured to adjust the angle of the connecting rod 321 in a direction opposite to the tilt direction of the connecting rod 321 when the connecting rod 321 is tilted relative to the chamber 200. In other words, when the angle between the extending direction of the connecting rod 321 and the horizontal plane of the chamber 200 is acute or obtuse, the first adjustment assembly 60 can adjust the connecting rod in a direction opposite to the tilt direction of the connecting rod 321, so that the angle between the extending direction of the connecting rod 321 and the horizontal plane of the chamber 200 is a right angle.

[0172] Also, see Figure 6 and Figure 7 The first adjustment component 60 is connected to the first connecting mechanism 31. The first adjustment component 60 may include but is not limited to being connected to the first connecting mechanism 31 by means of threaded connection, clamping, welding, riveting, etc., and reference may be made to the connection between the above-mentioned connecting rod 321 and the first connecting mechanism 31. The embodiments of the present application will not go into details about this.

[0173] Specifically, the first adjustment assembly 60 can be connected to the second base plate 3112 of the first connecting mechanism 31. For example, the first adjustment assembly 60 can be fixedly connected to the second base plate 3112 via bolts. This ensures a high degree of connection precision between the first adjustment assembly 60 and the second base plate 3112, and facilitates disassembly and maintenance of the first adjustment assembly 60 and the second base plate 3112. By configuring the first adjustment assembly 60 to reversely correct the tilt of the connecting rod 321, installation errors or deformations can be dynamically compensated, thereby maintaining the levelness of the platform 33 in real time and improving the levelness of the platform 33.

[0174] In one possible implementation, see Figure 7 The first adjustment component 60 includes: a plurality of top-pressing structures 61 arranged at intervals and connected to the first connecting mechanism 31, wherein the top-pressing structure 61 can be a connecting member with an external thread. Exemplarily, the top-pressing structure 61 can be a bolt, a screw, etc., which is not limited in this application.

[0175] Furthermore, a portion of each pressing structure 61 is located within the gap between the first connecting mechanism 31 and the connecting rod 321, and the length of the portion of each pressing structure 61 located within the gap is adjustable. That is, the length of the pressing structure 61 extending into the gap can be increased or decreased. As the length of the pressing structure 61 extending into the gap gradually increases, the force exerted by the pressing structure 61 against the connecting rod 321 gradually increases, thereby enabling fine-tuning of the angle of the connecting rod 321 (i.e., the angle between the extending direction of the connecting rod 321 and the horizontal plane of the cavity 200).

[0176] For example, when the pressing structure 61 is a bolt, the bolt can be threadedly connected to the second base plate 3112, with the bolt's shank positioned between the second base plate 3112 and the connecting rod 321. Thus, when the bolt is rotated, the force exerted by the shank on the connecting rod 321 increases or decreases, causing the angle of the connecting rod 321 to change. This allows for fine-tuning of the angle of the connecting rod 321.

[0177] Thus, by providing the first adjustment assembly 60 to reversely correct the tilt of the connecting rod 321, installation errors or deformations can be dynamically compensated, thereby maintaining the platform 33 in a horizontal state in real time and improving the levelness of the platform 33. For example, if the connecting rod 321 tilts to the lower left, the extension length of the right-side pressing structure 61 can be increased, pushing the connecting rod 321 upward, thereby achieving precise adjustment of the angle of the connecting rod 321.

[0178] In one possible structural design, see Figure 7 The top pressing structure 61 includes: a first top pressing member 611, a second top pressing member 612, a third top pressing member 613 and a fourth top pressing member 614. The first top pressing member 611, the second top pressing member 612, the third top pressing member 613 and the fourth top pressing member 614 are evenly arranged at circumferential intervals along the central axis of the connecting rod 321.

[0179] Because the four pressing members are evenly distributed along the circumference of the central axis of connecting rod 321, they can apply pressing forces to connecting rod 321 from four different directions. This ensures that no matter which direction connecting rod 321 tilts, at least one pressing member can effectively adjust it, thereby improving the levelness of platform 33. For example, when connecting rod 321 tilts downward and to the right, the pressing member on the left side can press against it to level the left and right sides of connecting rod 321, thereby achieving angle adjustment of connecting rod 321.

[0180] In another possible structural design, the plurality of pressing members may be provided in the form of 3, 5, 6, or 7 pressing members, which is not limited in this application. The plurality of pressing members may be evenly spaced along the circumference of the central axis of the connecting rod 321. In this way, no matter which direction the connecting rod 321 tilts, at least one pressing member can effectively adjust the tilt.

[0181] It should be noted that in many semiconductor manufacturing processes, such as etching and coating, the plasma within chamber 200 interacts with the wafer surface on stage 33. If chamber 200 and stage 33 are not arranged concentrically, the distance between the plasma source and different areas of the wafer surface will vary, resulting in uneven distribution of plasma density and energy across the wafer surface. This can lead to inconsistent etching rates or coating thicknesses across different areas of the wafer, impacting chip performance and yield.

[0182] See also Figure 8 、 Figure 9 and Figure 10 , Figure 8 An enlarged view of region B of the diagram provided in the embodiments of the present application is shown. Figure 9 The embodiment of the present application provides Figure 5 Cross-sectional view along CC direction, Figure 10 The embodiment of the present application provides Figure 1 In some embodiments of the present application, the reaction chamber 1000 further includes a second adjustment assembly 70, which is connected to the first connecting mechanism 31. The second adjustment assembly 70 may be connected to the first connecting mechanism 31 by, but is not limited to, threaded connection, clamping, welding, riveting, etc., as described above. The connection between the connecting rod 321 and the first connecting mechanism 31 is referred to above, and will not be further described in detail in the embodiments of the present application.

[0183] Specifically, the second adjustment assembly 70 can be connected to the second base plate 3112 of the first connection mechanism 31. For example, the second adjustment assembly 70 can be fixedly connected to the second base plate 3112 by bolts. In this way, the connection between the second adjustment assembly 70 and the second base plate 3112 is highly precise and the disassembly and maintenance of the second adjustment assembly 70 and the second base plate 3112 are facilitated.

[0184] Also, see Figure 3 、 Figure 8 、 Figure 9 and Figure 10 The second adjustment assembly 70 is used to adjust the center point of the projection of the connecting rod 321 on the first plane P when the center point Q1 of the projection of the stage 33 on the first plane P is offset from the center point Q2 of the projection of the cavity 200 on the first plane P, so that the center point Q1 of the projection of the stage 33 on the first plane P coincides with the center point Q2 of the projection of the cavity 200 on the first plane P. The first plane P is a plane perpendicular to the arrangement direction of the first connecting mechanism 31 and the cavity 200. In other words, if the cavity 200 and the stage 33 are not arranged concentrically, the center point of the projection of the connecting rod 321 on the first plane P can be adjusted to achieve concentric arrangement of the cavity 200 and the stage 33.

[0185] In this way, when the projection center point Q1 of the stage 33 on the first plane P is misaligned with the projection center point Q2 of the chamber 200 on the first plane P, the second adjustment assembly 70 can adjust the projection center point of the connecting rod 321 on the first plane P. This ensures that the stage 33 and the chamber 200 are precisely aligned on a plane perpendicular to the arrangement of the first connecting mechanism 31 and the chamber 200. This eliminates cumulative assembly errors and ensures alignment accuracy. Furthermore, this ensures that the wafer is correctly positioned within the reaction chamber 1000, thereby improving wafer processing and inspection accuracy and avoiding the production of defective products due to positional deviations.

[0186] For some possible implementations, see Figure 10 The second adjustment component 70 includes a shell 71 and a threaded adjustment member 72. The shell 71 is connected to the first connecting mechanism 31. A limit chamber 711 is provided in the shell 71. An opening 712 communicating with the limit chamber 711 is provided on the shell 71; the threaded adjustment member 72 includes a connected screw portion 721 and a constraint portion 722. The constraint portion 722 is provided in the limit chamber 711 and is movably provided along the extension direction of the opening 712; an internal threaded hole is provided on the connecting rod 321, and the screw portion 721 passes through the opening 712 and is threadedly connected to the internal threaded hole.

[0187] Specifically, the shape of the shell 71 can be a regular three-dimensional structure, such as a cuboid, a cube, a cylinder, etc. The shape of the shell 71 can also be an irregular three-dimensional structure, such as a combination of a cylinder and a cuboid, a combination of a cylinder and a triangular prism, etc. The embodiment of the present application does not limit this.

[0188] In addition, the housing 71 is connected to the first connecting mechanism 31. Specifically, the housing 71 can be fixedly connected to the second substrate 3112 of the first connecting mechanism 31. The connection method between the housing and the second substrate 3112 includes but is not limited to threaded connection, welding or riveting, etc., which will not be described in detail in this embodiment of the application.

[0189] Among them, a limited position chamber 711 is set in the shell 71, for example, Figure 10 As shown, the limiting chamber 711 can be close to a cylindrical shape, and the limiting chamber 711 is suitable for accommodating part of the threaded adjustment member 72. In this way, when the threaded adjustment member 72 is rotated and adjusted, the limiting chamber 711 can be prevented from interfering with the rotational movement of the threaded adjustment member 72. In addition, as Figure 10 As shown, along the extension direction of the threaded adjustment member 72, the internal length of the limiting chamber 711 is smaller than the length of the threaded adjustment member 72. In this way, the threaded adjustment member 72 can be prevented from falling into the limiting chamber 711, which facilitates the installation of the second adjustment component 70.

[0190] Also, see Figure 10 The shell 71 is provided with an opening 712 communicating with the limiting chamber 711. For example, the opening can be rectangular, circular, etc., which is not limited in the embodiment of the present application.

[0191] Please continue reading Figure 10 The threaded adjustment member 72 includes a connected screw portion 721 and a restraining portion 722. The screw portion 721 includes a rod body and external threads disposed thereon. The restraining portion 722 is disposed within the limiting chamber 711 and is movable within the limiting chamber 711 along the extension direction of the opening 712. The connecting rod 321 is provided with an internally threaded hole. The screw portion 721 extends through the opening 712 and is threadedly connected to the internally threaded hole.

[0192] For example, when the threaded adjustment member 72 is a bolt, the constraint portion 722 may be a nut of the bolt. In this way, a standard bolt may be used as the threaded adjustment member, eliminating the need for a non-standard threaded adjustment member 72 , thereby reducing the manufacturing cost of the reaction chamber 1000 .

[0193] The screw portion 721 can extend out of the limiting chamber 711 through the opening 712 , while the restraining portion 722 cannot extend out of the limiting chamber 711 through the opening 712 . The restraining portion 722 is confined within the limiting chamber 711 .

[0194] Exemplarily, when the opening 712 is circular and the threaded adjustment member 72 is a bolt, the diameter of the opening 712 is greater than or equal to the diameter of the screw portion 721 and smaller than the radial dimension of the constraint portion 722. In this way, the constraint portion 722 can be prevented from moving outside the limiting chamber 711, causing the adjustment function of the second adjustment component 70 to fail.

[0195] Please continue to see Figure 10 The limiting chamber 711 includes a first inner wall 7111 and a second inner wall 7112 disposed opposite each other, wherein both the first inner wall 7111 and the second inner wall 7112 can be planar. During the movement of the threaded adjustment member 72, the first inner wall 7111 and the second inner wall 7112 will abut against the restraining portion 722 of the threaded adjustment member 72. Since both the first inner wall 7111 and the second inner wall 7112 are planar, when the threaded adjustment member 72 abuts against the first inner wall 7111 and the second inner wall 7112, the threaded adjustment member 72 is protected from the eccentric force of the first inner wall 7111 and the second inner wall 7112, thereby improving the adjustment accuracy of the second adjustment assembly 70.

[0196] In addition, an opening 712 is provided on the first inner wall 7111, and an operating hole 7112A is provided on the second inner wall 7112. The orthographic projection area of ​​the constraint portion 722 on the second inner wall 7112 is larger than the orthographic projection area of ​​the operating hole 7112A on the second inner wall 7112, and the orthographic projection area of ​​the constraint portion 722 on the first inner wall 7111 is larger than the orthographic projection area of ​​the opening 712 on the first inner wall 7111. The operating hole 7112A is suitable for passing a rotating member to rotate the constraint portion 722. For example, the rotating member can be a tool such as a wrench or a screwdriver that can rotate the threaded adjustment member 72.

[0197] In this way, when the projection center point of the stage 33 on the first plane P is offset from the projection center point of the cavity 200 on the first plane P, the threaded adjustment member 72 can be rotated to make the projection center point of the stage 33 on the first plane P coincide with the projection center point of the cavity 200 on the first plane P. Exemplarily, when the second adjustment component 70 is arranged on the right side of the connecting rod 321, and the projection center point of the platform 33 on the first plane P is located on the right side of the projection center point of the cavity 200 on the first plane P, the threaded adjustment member 72 can be rotated by the rotating member to move the threaded adjustment member 72 toward the operating hole 7112A until the constraint portion 722 abuts against the second inner wall 7112. Then, the threaded adjustment member 72 is continued to be rotated, and the threaded adjustment member 72 cannot continue to move toward the operating hole 7112A. In this way, the rotating threaded adjustment member 72 will push the connecting rod 321 to move to the left side, so that the projection center point of the platform 33 connected to the connecting rod 321 on the first plane P and the projection center point of the cavity 200 on the first plane P gradually approach each other until the two coincide. Therefore, the position of the connecting rod can be adjusted and the accuracy of the alignment can be improved.

[0198] Exemplarily, when the second adjustment component 70 is arranged on the right side of the connecting rod 321, and the projection center point of the carrier 33 on the first plane P is located on the left side of the projection center point of the cavity 200 on the first plane P, the threaded adjustment member 72 can be rotated by the rotating member to move the threaded adjustment member 72 toward the opening 712 until the constraint portion 722 abuts against the first inner wall 7111. Then, the threaded adjustment member 72 is continued to be rotated, and the threaded adjustment member 72 cannot continue to move toward the opening 712. In this way, the rotating threaded adjustment member 72 will push the connecting rod 321 to move to the right side, so that the projection center point of the carrier 33 connected to the connecting rod 321 on the first plane P and the projection center point of the reaction chamber 1000 on the first plane P gradually approach each other until the two coincide.

[0199] See also Figure 11 , Figure 11 Provided in the embodiments of this application Figure 5 In the cross-sectional view along the EE direction, in some embodiments of the present application, two sets of second adjustment assemblies 70 are provided, and the axial directions of the screw portions 721 of the two sets of second adjustment assemblies 70 are arranged perpendicularly. That is, the planes on which the two second adjustment assemblies 70 are located are perpendicular to the movement direction of the supporting body 30.

[0200] Since the screw rods 721 of the two sets of second adjustment components 70 are arranged axially vertically, the connecting rod 321 can be adjusted in two mutually perpendicular directions to achieve precise positioning with multiple degrees of freedom. Figure 11In the XY plane shown, one set of second adjustment components 70 can achieve fine adjustment of the position of the connecting rod 321 in the X-axis direction, and another set of second adjustment components 70 can achieve fine adjustment of the connecting rod 321 in the Y-axis direction, so that the projection center point of the carrier 33 on the first plane P can coincide with the projection center point of the reaction chamber 1000 on the first plane P, meeting the high-precision position alignment requirements of the semiconductor device 10000.

[0201] In other embodiments of the present application, the second adjustment components 70 may be provided in three, four, or five groups, etc., which are not limited in the present application. The multiple groups of second adjustment components 70 may be evenly spaced along the circumference of the connecting rod 321. In this way, no matter which direction the stage 33 is eccentric (i.e., the projection center of the stage 33 on the first plane P is offset from the projection center of the reaction chamber 1000 on the first plane P), at least one second adjustment component 70 can effectively adjust it.

[0202] Example 3

[0203] The semiconductor device 10000 provided in the embodiments of the present application includes any of the reaction chambers 1000 provided in the embodiments of the present application. For example, the reaction chamber 1000 may be an etching chamber, and the semiconductor device 10000 may be an etching device. If the reaction chamber 1000 is a plasma etching chamber, the semiconductor device 10000 may be a plasma etching device.

[0204] In the embodiment of the present application, by integrating the reaction chamber 1000 of the carrier 100 into the semiconductor device 10000, the environmental stability of semiconductor product (such as wafer) processing can be guaranteed, thereby improving the working stability of the semiconductor device 10000.

[0205] The above preferred embodiments further illustrate the objectives, technical solutions and advantages of the present invention in detail. It should be understood that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A carrying device for connecting with a fixing assembly, characterized in that: include: A first mounting mechanism, a second mounting mechanism and a carrying body; the carrying body is used to support the chuck; The first mounting mechanism and the second mounting mechanism are arranged on opposite sides of the carrying body, and both the first mounting mechanism and the second mounting mechanism are connected to the carrying body; The first mounting mechanism and / or the second mounting mechanism are used to drive the carrying body to move in a vertical direction under the drive of the driving component; The first mounting mechanism and the second mounting mechanism are both fixedly connected to the fixing assembly, so that when the chuck that is in a horizontal state in the atmospheric environment is in a vacuum environment, the supporting body still keeps the chuck in a horizontal state under the support of the first mounting mechanism and the second mounting mechanism.

2. The carrying device according to claim 1, characterized in that: The first mounting mechanism and the second mounting mechanism are different in at least one of material and structure, and the one with greater bending rigidity between the first mounting mechanism and the second mounting mechanism is located closer to the carrying body.

3. The carrying device according to claim 1 or 2, characterized in that: The first mounting mechanism includes: a first mounting member, a first slide rail and a first slider, the first mounting member is fixedly connected to the first slide rail, the first slide rail is slidably connected to the first slider, and the first slider is fixedly connected to the carrying body; the second mounting mechanism includes: a second mounting member, a second slide rail and a second slider, the second mounting member is fixedly connected to the second slide rail, the second slide rail is slidably connected to the second slider, and the second slider is fixedly connected to the carrying body.

4. The carrying device according to claim 3, characterized in that: A mounting positioning groove is provided on a side of the second mounting member facing the first mounting mechanism, and at least a portion of the second slide rail is disposed in the mounting positioning groove.

5. The carrying device according to claim 3 or 4, characterized in that: The surface of the second mounting member on the side facing away from the second slide rail is a first surface. Reinforcement ribs are provided on the first surface. The reinforcement ribs and the mounting positioning grooves are provided on opposite sides of the second mounting member.

6. The carrying device according to any one of claims 3 to 5, characterized in that: The first slide rail and the second slide rail are arranged in parallel, and the first mounting member and the second mounting member are arranged in parallel.

7. The carrying device according to any one of claims 3 to 6, characterized in that: The carrying body includes a first connecting mechanism, a support member and a carrier, the first connecting mechanism is fixedly connected to both the first slider and the second slider, the first connecting mechanism is fixedly connected to the support member, and the support member is fixedly connected to the carrier.

8. The carrying device according to claim 7, characterized in that: The first connecting mechanism includes a first connecting member and a second connecting member, the first connecting member is fixedly connected to the first slider, the second connecting member is fixedly connected to the second slider, the first connecting member is fixedly connected to the second connecting member, and the carrier is fixedly connected to at least one of the first connecting member and the second connecting member.

9. A reaction chamber, characterized in that: include: A cavity and the carrying device according to any one of claims 1 to 8, wherein part of the carrying device is arranged through the cavity, and the first mounting mechanism and the second mounting mechanism are both fixedly connected to the cavity.

10. The reaction chamber according to claim 9, characterized in that: The reaction chamber further includes a third connecting member, which is connected to the cavity body, fixedly connected to the first mounting member, and fixedly connected to the second mounting member.

11. The reaction chamber according to claim 9 or 10, characterized in that: The support member includes a connecting rod connected between the first connecting mechanism and the carrier; The reaction chamber further includes a first adjustment component connected to the first connection mechanism, and configured to adjust the angle of the connecting rod in a direction opposite to the tilting direction of the connecting rod when the connecting rod tilts relative to the chamber.

12. The reaction chamber according to claim 11, characterized in that The first adjustment component includes a plurality of pressing structures arranged at intervals and connected to the first connecting mechanism, each of the pressing structures is partially located in the gap between the first connecting mechanism and the connecting rod, and the length of the portion of each pressing structure located in the gap is adjustable.

13. The reaction chamber according to claim 12, characterized in that: The pressing structure includes a first pressing member, a second pressing member, a third pressing member and a fourth pressing member, and the first pressing member, the second pressing member, the third pressing member and the fourth pressing member are evenly spaced along the circumference of the central axis of the connecting rod.

14. The reaction chamber according to any one of claims 9 to 13, characterized in that: The reaction chamber further includes a second adjustment component, which is connected to the first connecting mechanism. The second adjustment component is used to adjust the position of the center point of the projection of the connecting rod on the first plane when the center point of the projection of the carrier on the first plane is offset from the center point of the projection of the cavity on the first plane, so that the center point of the projection of the carrier on the first plane coincides with the center point of the projection of the cavity on the first plane. The first plane is a plane perpendicular to the arrangement direction of the first connecting mechanism and the cavity.

15. A semiconductor device, characterized in that: Comprising the reaction chamber according to any one of claims 9 to 14.

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