Thin film type CCS and preparation method thereof

Abstract

The invention belongs to the technical field of new energy battery modules, and particularly relates to a thin film type CCS and a preparation method thereof. The preparation method of the film type CCS comprises the following steps: (1) coating or pasting a UV viscosity-reducing adhesive layer on a carrier film to obtain a carrier adhesive film; (2) processing the carrier adhesive film into a shape required by a battery module PACK; (3) attaching an acquisition circuit assembly to the UV viscosity-reducing adhesive layer of the carrier adhesive film in the step (2) to obtain an adhesive film assembly; and (4) irradiating the adhesive film assembly obtained in the step (2) through ultraviolet light, so that the UV viscosity-reducing adhesive which is not shielded by the acquisition circuit assembly loses viscosity, and the film type CCS is obtained. According to the preparation process of the CCS, a UV viscosity-reducing adhesive layer pasting processing process is adopted to replace a traditional hot pressing and hot riveting process, and the preparation process has the advantages of being simple in process and equipment, high in production efficiency and low in cost.

Description

Technical Field

[0001] The present invention belongs to the technical field of new energy battery modules, and in particular relates to a thin film CCS and a preparation method thereof. Background Art

[0002] In the new energy battery module pack busbar industry, the Cell Contact System (CCS) is a highly integrated, safe, lightweight, and neatly laid out structural component that integrates voltage and temperature data acquisition, overcurrent protection, cell electrical connection, and structural support. Currently, CCS products primarily utilize two integrated configurations: an insulating carrier (such as an injection-molded bracket, blister-formed separator, or insulating flat plate) coupled with a hot riveting process; and an insulating film coupled with a hot pressing process. Both CCS configurations present significant challenges, including high equipment investment, complex processes, and low production efficiency.

[0003] Patent CN119447939A discloses a CCS hot riveting process, which uses multiple, unified hot riveting components for one or two standardized products to improve efficiency. Patents CN118496791A and CN116505204A both disclose the use of hot-pressed adhesive films to secure data acquisition circuit components. However, traditional hot riveting and hot pressing processes require expensive equipment and complex processing steps, resulting in high production costs and low efficiency. Therefore, there is an urgent need to develop a new CCS structure and its preparation method to address these issues. Summary of the Invention

[0004] In view of the technical problems of large equipment investment, complex process and low efficiency in the existing CCS preparation process, the primary purpose of the present invention is to provide a method for preparing thin-film CCS with low cost, simple process and high production efficiency.

[0005] Another object of the present invention is to provide a thin film CCS prepared by the above method.

[0006] The purpose of the present invention is achieved through the following technical solutions:

[0007] A method for preparing a thin film CCS comprises the following steps:

[0008] (1) coating or laminating a UV adhesive layer on a carrier film to obtain a carrier film;

[0009] (2) Processing the carrier film into the shape required by the battery module PACK;

[0010] (3) attaching the collection circuit assembly to the UV-reducing adhesive layer of the carrier adhesive film in step (2) to obtain an adhesive film assembly;

[0011] (4) The adhesive film component obtained in step (2) is irradiated with ultraviolet light to make the UV-reducing adhesive that is not blocked by the collection circuit component lose its viscosity, thereby obtaining a thin film CCS.

[0012] Furthermore, the carrier film in step (1) is made of PET, PI, PC material, and is red, black, dark blue, navy blue or other colors with good light-shielding effect.

[0013] Furthermore, the thickness of the carrier film in step (1) is 0.1-2 mm.

[0014] Furthermore, the UV viscosity-reducing adhesive in step (1) is a UV light-curing acrylic adhesive. Its product characteristics are high adhesion and good adhesion before UV irradiation, and polymerization and cross-linking curing are triggered after UV irradiation, and the adhesion is significantly reduced and the viscosity is lost. The present invention utilizes this product characteristic of UV viscosity-reducing adhesive to attach the collection circuit component to the UV viscosity-reducing adhesive layer of the carrier adhesive film, and then uses ultraviolet light irradiation to make the UV viscosity-reducing adhesive that is not blocked by the collection circuit component lose its viscosity, preventing dust and dirt from adhering, and no additional treatment is required. The UV viscosity-reducing adhesive part that adheres to the collection circuit component still maintains high viscosity to fix the collection circuit component. The thin-film CCS structure prepared by the above method is light and stable, and the preparation process is simple, the production efficiency is high, and the cost is low.

[0015] Further preferably, the adhesion of the UV viscosity-reducing adhesive before UV irradiation is 500-5000 gf / 25 mm, and the adhesion after UV irradiation is reduced to 0-10 gf / 25 mm.

[0016] Furthermore, the thickness of the UV viscosity-reducing adhesive layer in step (1) is 0.005 mm to 0.1 mm.

[0017] Furthermore, the coating or lamination of the UV viscosity-reducing adhesive layer in step (1) is performed by a roll-to-roll process.

[0018] Furthermore, the acquisition circuit assembly in step (3) includes a conductive line assembly and a plurality of conductive bus bars connected to the conductive line assembly.

[0019] Further preferably, the conductive circuit assembly includes an FPC (flexible printed circuit), an FFC (flexible flat cable) or an FDC (flexible die-cut circuit board); the conductive bus connection bar includes an aluminum bar or a copper bar; the conductive bus connection bar is connected to the conductive circuit assembly by direct connection or through a nickel sheet.

[0020] Furthermore, the ultraviolet light irradiation in step (4) refers to irradiation with a UV light source with a wavelength of 250-450nm for 2-3s.

[0021] A thin film CCS is prepared by the above method.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] (1) Process simplification: The preparation process of CCS of the present invention only requires a UV light source and simple tooling, eliminating the high equipment investment in traditional hot pressing and hot riveting processes.

[0024] (2) Cost reduction: The UV-reducing adhesive layer coated or laminated on the carrier film of the present invention can be produced by a roll-to-roll method, which greatly reduces the cost of raw materials.

[0025] (3) Improved efficiency: The preparation process of the present invention is simpler than the traditional hot pressing and hot riveting process. Compared with the traditional adhesive film, there is no need to design and cut the adhesive film according to the shape and layout of different acquisition circuit components, which significantly improves production efficiency.

[0026] (4) Quality assurance: The UV adhesive layer loses its stickiness after being exposed to UV light, preventing dust and dirt from adhering, and no additional treatment is required. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 Schematic diagram of the overall structure of the thin film CCS obtained in Example 1.

[0028] Figure 2 Schematic diagram of the decomposition structure of the thin film CCS obtained in Example 1. DETAILED DESCRIPTION

[0029] The present invention will be described in further detail below with reference to the embodiments and drawings, but the embodiments of the present invention are not limited thereto.

[0030] Example 1

[0031] A method for preparing a thin film CCS comprises the following steps:

[0032] (1) A black PET material with a thickness of 0.5 mm was selected as a carrier film; a UV-reducing adhesive with a thickness of 0.05 mm (ST-025ADG from Suzhou Xin Guang Yi Electronics Co., Ltd.; the adhesive force before UV irradiation was 1150 gf / 25 mm, and the adhesive force after UV irradiation was reduced to 3 gf / 25 mm) was coated on the carrier film by a roll-to-roll process to form a carrier adhesive film.

[0033] (2) Processing the carrier film into the shape required by the battery module PACK.

[0034] (3) The FPC conductive circuit assembly connected by the aluminum bar is precisely attached to the UV-reducing adhesive layer of the carrier adhesive film in step (2) to obtain an adhesive film assembly.

[0035] (4) The product is irradiated with a UV LED light source with a wavelength of 365 nm for 3 seconds. The UV adhesive that is not blocked by the aluminum bar and the FPC conductive circuit components loses its viscosity, and a finished film-type CCS is obtained. The overall structure diagram and the decomposition structure diagram of the obtained film-type CCS are shown in Figure 2. Figure 1 and Figure 2 shown.

[0036] Example 2

[0037] A method for preparing a thin film CCS comprises the following steps:

[0038] (1) A navy blue PI material with a thickness of 1.0 mm was selected as a carrier film; a UV-reducing adhesive with a thickness of 0.03 mm (ST-025ADG from Suzhou Xin Guang Yi Electronics Co., Ltd.; the adhesion before UV irradiation was 1150 gf / 25 mm, and the adhesion after UV irradiation was reduced to 3 gf / 25 mm) was coated on the carrier film by a roll-to-roll process to form a carrier adhesive film.

[0039] (2) Processing the carrier film into the shape required by the battery module PACK.

[0040] (3) The FPC conductive circuit assembly connected by the aluminum bar is precisely attached to the UV-reducing adhesive layer of the carrier adhesive film in step (2) to obtain an adhesive film assembly.

[0041] (4) The product is irradiated with a UV LED light source with a wavelength of 365 nm for 3 seconds. The UV adhesive that is not blocked by the aluminum bar and the FPC conductive circuit components loses its viscosity, and a finished film-type CCS is obtained.

[0042] Example 3

[0043] A method for preparing a thin film CCS comprises the following steps:

[0044] (1) A black PET material with a thickness of 0.2 mm was selected as a carrier film; a UV-reducing adhesive with a thickness of 0.035 mm (ST-025ADG from Suzhou Xinguangyi Electronics Co., Ltd.; the adhesive force before UV irradiation was 1150 gf / 25 mm, and the adhesive force after UV irradiation was reduced to 3 gf / 25 mm) was applied to the carrier film by a roll-to-roll process to form a carrier adhesive film.

[0045] (2) Processing the carrier film into the shape required by the battery module PACK.

[0046] (3) The FFC conductive circuit assembly connected by the aluminum bar through the nickel sheet is precisely attached to the UV de-viscosity adhesive layer of the carrier adhesive film in step (2) to obtain an adhesive film assembly.

[0047] (4) The product is irradiated with a UV LED light source with a wavelength of 365 nm for 2 seconds. The UV viscosity-reducing adhesive that is not blocked by the aluminum bar and the FFC conductive circuit components loses its viscosity, and a finished film-type CCS is obtained.

[0048] Example 4

[0049] A method for preparing a thin film CCS comprises the following steps:

[0050] (1) A black PC material with a thickness of 0.1 mm was selected as a carrier film; a UV-reducing adhesive with a thickness of 0.005 mm (ST-025ADG from Suzhou Xin Guang Yi Electronics Co., Ltd.; the adhesive force before UV irradiation was 1150 gf / 25 mm, and the adhesive force after UV irradiation was reduced to 3 gf / 25 mm) was coated on the carrier film by a roll-to-roll process to form a carrier adhesive film.

[0051] (2) Processing the carrier film into the shape required by the battery module PACK.

[0052] (3) The FFC conductive circuit assembly connected by the copper bar through the nickel sheet is precisely attached to the UV de-viscosity adhesive layer of the carrier adhesive film in step (2) to obtain an adhesive film assembly.

[0053] (4) The product is irradiated with a UV LED light source with a wavelength of 365 nm for 2 seconds. The UV viscosity-reducing adhesive that is not blocked by the copper bar and FFC conductive circuit components loses its viscosity, and a finished film-type CCS is obtained.

[0054] Example 5

[0055] A method for preparing a thin film CCS comprises the following steps:

[0056] (1) A dark blue PC material with a thickness of 2 mm was selected as a carrier film; a UV-reducing adhesive with a thickness of 0.1 mm (ST-025ADG from Suzhou Xinguangyi Electronics Co., Ltd.; the adhesion before UV irradiation was 1150 gf / 25 mm, and the adhesion after UV irradiation was reduced to 3 gf / 25 mm) was applied to the carrier film by a roll-to-roll process to form a carrier adhesive film.

[0057] (2) Processing the carrier film into the shape required by the battery module PACK.

[0058] (3) The FDC conductive circuit assembly connected by the aluminum bar through the nickel sheet is precisely attached to the UV de-viscosity adhesive layer of the carrier adhesive film in step (2) to obtain an adhesive film assembly.

[0059] (4) The product was irradiated with a UV LED light source with a wavelength of 365 nm for 3 seconds. The UV viscosity-reducing adhesive that was not blocked by the aluminum bar and the FDC conductive circuit components lost its viscosity, and a finished film-type CCS was obtained.

[0060] The above embodiments are preferred implementations of the present invention, but the implementations of the present invention are not limited to the above embodiments. Any other changes, modifications, substitutions, combinations, and simplifications that do not deviate from the spirit and principles of the present invention should be considered as equivalent replacement methods and are included in the scope of protection of the present invention.

Claims

1. A method for preparing a thin film CCS, characterized in that: The method comprises the following preparation steps: (1) coating or laminating a UV adhesive layer on a carrier film to obtain a carrier film; (2) Processing the carrier film into the shape required by the battery module PACK; (3) attaching the collection circuit assembly to the UV-reducing adhesive layer of the carrier adhesive film in step (2) to obtain an adhesive film assembly; (4) The adhesive film component obtained in step (2) is irradiated with ultraviolet light to make the UV-reducing adhesive that is not blocked by the collection circuit component lose its viscosity, thereby obtaining a thin film CCS.

2. The method for preparing a thin film CCS according to claim 1, characterized in that: The carrier film in step (1) is made of PET, PI, or PC material and is red, black, dark blue, or navy blue in color.

3. The method for preparing a thin film CCS according to claim 2, characterized in that: The thickness of the carrier film is 0.1-2 mm.

4. The method for preparing a thin film CCS according to claim 1, characterized in that: The UV viscosity-reducing adhesive in step (1) is a UV light-curing acrylic adhesive, and its adhesion before UV irradiation is 500-5000gf / 25mm, and its adhesion after UV irradiation is reduced to 0-10gf / 25mm.

5. The method for preparing a thin film CCS according to claim 1, characterized in that: The thickness of the UV viscosity-reducing adhesive layer in step (1) is 0.005mm-0.1mm.

6. The method for preparing a thin film CCS according to claim 1, characterized in that: The coating or lamination of the UV viscosity-reducing adhesive layer in step (1) is performed by a roll-to-roll process.

7. The method for preparing a thin film CCS according to claim 1, characterized in that: The acquisition circuit assembly in step (3) includes a conductive line assembly and a plurality of conductive bus bars connected to the conductive line assembly.

8. The method for preparing a thin film CCS according to claim 7, characterized in that: The conductive circuit component includes FPC, FFC or FDC; the conductive bus bar includes aluminum bar or copper bar; the conductive bus bar is connected to the conductive circuit component by direct connection or through a nickel sheet.

9. The method for preparing a thin film CCS according to claim 1, characterized in that: The ultraviolet light irradiation in step (4) refers to irradiation with a UV light source with a wavelength of 250-450nm for 2-3s.

10. A thin film CCS, characterized in that: It is prepared by the method according to any one of claims 1 to 9.

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