Rotary laminating method, storage medium and related device

Abstract

The invention relates to the technical field of circuit board production, and discloses a rotary laminating method, a storage medium and a related device. The method comprises the following steps: attaching a calibration sheet to a calibration plate at an attaching angle of 0 degree; photographing the attached calibration plate to obtain a zero reference deviation between the camera and the suction cup; the calibration piece is attached to the calibration plate with the preset calibration angle as the attaching angle; photographing the calibration plate attached at each calibration angle to obtain a rotation deviation corresponding to each calibration angle; fitting the calibration sheet for multiple times at different angles, and compensating the fitting position by the rotation deviation of the calibration angle closest to the fitting angle and the zero reference deviation during fitting to obtain actual fitting deviations at multiple different angles; and calculating the fitting precision of the equipment by using a plurality of actual fitting deviations, and if the fitting precision meets the requirement, using the deviation obtained by calibration for position compensation of actual fitting. According to the method, the fitting precision can be improved, and the quality and consistency of products are ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board production, and in particular to a rotational bonding method, a storage medium and related devices. Background Art

[0002] During the manufacturing process of circuit boards or flexible circuit boards, it is often necessary to mount components such as reinforcement sheets or other flexible circuit boards on the products. In order to ensure the mounting accuracy, existing mounting equipment usually uses visual positioning to locate the angle and position of the products and components to be mounted. However, the existing mounting equipment mainly relies on manual visual inspection to detect the mounting accuracy after each debugging, which is greatly affected by subjective factors such as fatigue and experience differences. It is impossible to guarantee the consistency and accuracy of the test results, and it is difficult to meet the high-precision FPC production needs. In addition, different products may have different mounting angle requirements, and different mounting angles often have different deviations. However, existing equipment often uses the same compensation value to compensate for the mounting positions of different mounting angles during the mounting process, resulting in inconsistent mounting accuracy at different mounting angles, and it is impossible to achieve high-precision rotational bonding. Summary of the Invention

[0003] In order to overcome the deficiencies of the prior art, the present invention aims to provide a rotational bonding method that can improve the rotational bonding accuracy of products and improve the quality and consistency of products.

[0004] To solve the above problems, the technical solution adopted by the present invention is as follows: a rotation bonding method, comprising the following steps: Position, absorb and attach the calibration piece, attaching it to the calibration plate at a 0° attachment angle; The calibration plate after bonding is positioned by the camera, and the deviation between the calibration piece pattern and the calibration plate pattern is calculated to obtain the zero reference deviation between the suction cup and the upper camera; Set multiple calibration angles, position, absorb and fit the calibration piece multiple times, and fit the calibration piece to the calibration plate at multiple calibration angles as fitting angles in turn; The calibration plate after lamination at different calibration angles is positioned by the camera, and the deviation between the calibration piece pattern and the calibration plate pattern is calculated to obtain the rotation deviation at each calibration angle; The calibration piece is then positioned, sucked, and attached multiple times, and attached to the calibration plate at multiple different attachment angles. Each time the attachment is made, the attachment position is compensated using the zero reference deviation and the rotation deviation corresponding to the calibration angle closest to the attachment angle. The camera is used to locate the calibration plate after compensation at different lamination angles, and the deviation between the calibration piece pattern and the calibration plate pattern is calculated to obtain a set of actual lamination deviation values. The device's fitting accuracy is calculated based on the actual fitting deviation value. If the device's fitting accuracy meets the requirements, the zero reference deviation and the rotation deviation of each calibration angle obtained through calibration are saved. The saved zero reference deviation and the rotation deviation corresponding to the calibration angle closest to the actual bonding angle are used to compensate the bonding position of the actual bonding product to complete the bonding of the actual product.

[0005] Compared with the existing technology, the beneficial effect of the present invention is that: this mounting method uses a camera to locate and calculate the rotational deviation between the calibration piece and the calibration plate at different calibration angles, and calculates the equipment's fitting accuracy based on the rotational deviation, thereby obtaining the equipment's objective fitting accuracy without manual intervention, making it convenient for operators to adjust the equipment's fitting accuracy to a unified standard, and ensuring the fitting accuracy and consistency of the products produced. Furthermore, by saving the rotational deviation of the calibration piece at different calibration angles, the closest calibration angle is calculated based on the actual fitting angle during actual fitting, and the fitting position is dynamically compensated with the rotational deviation of the closest calibration angle, thereby ensuring the mounting accuracy at different mounting angles and further improving the quality and consistency of product mounting.

[0006] In the above-mentioned rotational fitting method, the fitting accuracy of the device is calculated based on the actual fitting deviation value. If the fitting accuracy of the device meets the requirements, the zero reference deviation obtained by calibration and the rotational deviation of each calibration angle are saved, and the fitting accuracy of the device is expressed by calculating the CPK value.

[0007] In the above-mentioned rotational bonding method, a circle is divided into multiple calibration angles with equal angular intervals, the calibration piece is positioned, sucked and bonded multiple times, and the calibration piece is rotated through multiple calibration angles in turn and then bonded to the calibration plate. In the step, a circle is divided into eight calibration angles of 0°, 45°, 90°, 135°, 180°, 225°, 270°, and 315° with an angular interval of 45°.

[0008] The rotational bonding method described above includes the steps of positioning the calibration plate after bonding at different calibration angles using a camera, calculating the deviation between the calibration sheet pattern and the calibration plate pattern, and obtaining the rotational deviation at each calibration angle, further comprising: The pattern of the calibration piece after fitting according to different calibration angles is fitted with the rotation center of the fitting circle. The fitted rotation center is compared with the average of the rotation deviations of multiple calibration angles. If the difference between the two does not exceed the set threshold, the next step is continued; if the difference between the two exceeds the set threshold, the calibration is terminated and the cause is investigated.

[0009] In the above-mentioned rotational bonding method, the steps of compensating the bonding position of the actual bonding product using the stored zero reference deviation and the rotational deviation corresponding to the calibration angle closest to the actual bonding angle to complete the bonding of the actual product include: Take photos of the product through the upper camera and locate the position and angle of the product; The upper camera takes a picture of the components to be mounted in the tray or frame and locates the position of the components to be mounted; Control the suction cup to pick up the component according to the position and angle of the component to be mounted; The lower camera takes a picture of the component sucked by the suction cup to locate the position and angle of the component on the suction cup; The actual placement angle of the component is calculated based on the product angle and the preset placement angle, and the rotation angle of the suction cup is calculated based on the difference between the actual placement angle and the angle of the component on the suction cup. The rotation of the suction cup is controlled according to the rotation angle; Calculate the expected placement position of the component based on the position of the product; Calculate the calibration angle closest to the actual placement angle, and use the rotation deviation of the closest calibration angle and the zero reference deviation to compensate for the expected placement position to obtain the actual placement position; Place the components on the product according to the actual mounting position.

[0010] In the above-mentioned rotational bonding method, the calibration plate after bonding is positioned by a camera, the deviation between the calibration piece pattern and the calibration plate pattern is calculated, and the step of obtaining the zero-position reference deviation between the suction cup and the upper camera is performed. The zero-position reference deviation is the average of multiple deviations obtained after the calibration piece is bonded at a bonding angle of 0° for multiple times.

[0011] In the above-mentioned rotational bonding method, the calibration plate after bonding at different calibration angles is positioned by a camera, the deviation between the calibration piece pattern and the calibration plate pattern is calculated, and the rotational deviation at each calibration angle is obtained. The rotational deviation is the average of multiple deviations obtained after the calibration piece is bonded at multiple corresponding calibration angles.

[0012] A storage medium stores a computer program, which, when called and executed by a processor, implements the above-mentioned rotation and bonding method.

[0013] A rotational bonding control device includes a memory and a processor, wherein the memory is electrically connected to the processor, and the processor can implement the above-mentioned rotational bonding method by calling and executing a computer program in the memory.

[0014] A mounting device comprises the above-mentioned rotational mounting control device.

[0015] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Flowchart of the rotation bonding method according to an embodiment of the present invention.

[0017] Figure 2 Schematic diagram of the calibration plate.

[0018] Figure 3 Schematic diagram of the calibration piece.

[0019] Figure 4 This is a schematic diagram of attaching the calibration sheet to the calibration plate.

[0020] Figure 5 This is a principle block diagram of a rotational lamination control device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0021] The embodiments of the present invention are described in detail below. Figure 1 , an embodiment of the present invention provides a rotation bonding method, comprising the following steps: Position, absorb and attach the calibration piece, attaching it to the calibration plate at a 0° attachment angle; The calibration plate after bonding is positioned by the camera, and the deviation between the calibration piece pattern and the calibration plate pattern is calculated to obtain the zero reference deviation between the suction cup and the upper camera; Divide 360° into multiple calibration angles, perform multiple positioning, suction and lamination on the calibration piece, and laminate the calibration piece onto the calibration plate using multiple calibration angles as lamination angles. The calibration plate after lamination at different calibration angles is positioned by the camera, and the deviation between the calibration piece pattern and the calibration plate pattern is calculated to obtain the rotation deviation at each calibration angle; The calibration piece is then positioned, sucked, and attached multiple times, and attached to the calibration plate at multiple different attachment angles. Each time the attachment is made, the attachment position is compensated using the zero reference deviation and the rotation deviation corresponding to the calibration angle closest to the attachment angle. The camera is used to locate the calibration plate after compensation at different lamination angles, and the deviation between the calibration piece pattern and the calibration plate pattern is calculated to obtain a set of actual lamination deviation values. The device's fitting accuracy is calculated based on the actual fitting deviation value. If the device's fitting accuracy meets the requirements, the zero reference deviation and the rotation deviation of each calibration angle obtained through calibration are saved. The saved zero reference deviation and the rotation deviation corresponding to the calibration angle closest to the actual bonding angle are used to compensate the bonding position of the actual bonding product to complete the bonding of the actual product.

[0022] This rotational bonding method calculates the bonding accuracy of the equipment by measuring the actual bonding deviation between the calibration sheet and the calibration plate after bonding at multiple different bonding angles. This eliminates the influence of human factors during equipment accuracy assessment, thereby obtaining a more objective bonding accuracy of the equipment, making it easier for operators to adjust the bonding accuracy of the equipment to a unified standard, and ensuring the quality and consistency of products produced by multiple equipment and multiple shifts. At the same time, during the bonding process, according to the actual bonding angle, the rotational deviation corresponding to the calibration angle closest to the actual bonding angle is selected to compensate for the calculated bonding position, avoiding the situation where there are large discrepancies in the bonding accuracy at different bonding angles when using a unified compensation parameter. This method measures the rotational deviation at multiple different calibration angles and dynamically compensates the bonding position according to the rotational deviation of the calibration angle close to the bonding angle during bonding, ensuring that the equipment has high bonding accuracy when bonding products with different bonding angles, further improving the bonding quality of the products and the consistency of the bonded products.

[0023] It is understandable that, referring to Figures 2 to 4 During the calibration process of the zero reference deviation and the rotational deviation, a plurality of MARK points with different calibration angles should be provided on the calibration plate so as to calibrate the rotational deviations at different angles. The calibration piece should be provided with a pattern with a direction so that the angle of the calibration piece can be identified by the visual algorithm. At the same time, the calibration piece should be provided with a pattern that matches the MARK points on the calibration plate so as to facilitate the positioning of the calibration piece and the calculation of the deviation between the calibration piece and the calibration plate after fitting. In this embodiment, 360° is divided into eight calibration angles of 0°, 45°, 90°, 135°, 180°, 225°, 270°, and 315° at an angular interval of 45°. Therefore, a circle of solid dots spaced 45° apart from each other should be provided on the calibration plate as MARK points. Correspondingly, an arrow-shaped pattern is provided on the calibration sheet, and four through holes with diameters slightly larger than the solid dots on the calibration plate are provided around the arrow-shaped pattern. When the bonding sheets are stacked and bonded on the calibration plate, the solid dots at the corresponding positions can be exposed from the through holes. The material of the calibration plate and the calibration sheet should be consistent with the actual products and components to be mounted, so as to eliminate the influence of different materials on the calibration accuracy. In this embodiment, the equipment is mainly used for bonding FPC film sheets, so the calibration plate should be made of FPC and the calibration sheet should be made of film sheets. It can be understood that the smaller the interval between the calibration angles and the greater the number of calibration angles, the more accurate the dynamic compensation of the bonding position during actual bonding. The calibration angle can be set according to the distribution of the mounting angles of the actual product.

[0024] It is understood that the accuracy of the device can be expressed by calculating the variance, standard deviation, and other parameters of the actual alignment deviation after compensation for multiple alignments at different calibration angles. In this embodiment, the CPK (Process Capability Index) value of the device is calculated based on multiple actual alignment deviations to indicate the alignment accuracy of the device. The CPK value is calculated as follows: (1) Where USL is the upper specification limit, which is the upper limit of the rotation deviation in this embodiment, and LSL is the lower specification limit, which is the lower limit of the rotation deviation in this embodiment. is the mean of the rotation deviations at different calibration angles, is the standard deviation of the rotational deviations at multiple different calibration angles. It is understood that in some embodiments, the CPK value can also be calculated based on the deviation factor. It is understood that after rotational alignment, the actual alignment deviation includes three deviations: X-axis deviation, Y-axis deviation, and angular deviation. Therefore, the CPK value actually includes the CPK value of the X-axis deviation, the CPK value of the Y-axis deviation, and the CPK value of the angular deviation. When all three CPK values ​​are higher than the set standard values, it is determined that the device's alignment accuracy meets the requirements.

[0025] It is understood that in some embodiments, in order to further improve the accuracy of the zero reference deviation and rotational deviation obtained by calibration, each deviation needs to be fitted multiple times, and the average of the multiple deviation values ​​after the multiple fittings is calculated, and the average is used as the zero reference deviation and rotational deviation used during the final compensation. In the present embodiment, each calibration angle is fitted three times, and the average of the deviations after the three fittings is used as the rotational deviation of the corresponding angle, or the zero reference deviation at 0°. It is understood that when fitting calibration sheets with different calibration angles, it is advisable to compensate the calculated fitting position according to the zero reference deviation during fitting, so that the rotational deviation corresponding to each calibration angle can be calculated directly by a visual algorithm based on the patterns on the calibration sheet and the calibration plate.

[0026] In this embodiment, to further ensure the accuracy of the calculated fitting accuracy, after obtaining the rotational deviation of each calibration angle, it is necessary to fit the rotation center according to the coordinates of the pattern after each fitting, and calculate the difference between the rotation center and the average of multiple rotational deviations. If the difference does not exceed 0.01, it is considered that there is no major problem with the equipment accuracy; if the difference exceeds 0.01, it is considered that there is a problem with the rotational accuracy of the production equipment, and the calibration needs to be interrupted. The visual template for positioning and identifying the calibration piece and the product is checked for manufacturing problems, the rotation axis accuracy and hardware parameter settings of the suction cup are problematic, and the rigidity of the driving mechanism that drives the suction cup to move is insufficient, resulting in the calibration piece being unable to stop steadily when taking pictures. After troubleshooting the cause and reconfiguring the relevant electrical parameters of the equipment, the calibration process is repeated. Similarly, if the CPK value of the equipment calculated after calibration does not meet the requirements, the equipment commissioning personnel need to adjust the relevant compensation or set parameters based on commissioning experience, and then re-calibrate the process, repeating the calibration and commissioning process until the CPK value of the equipment exceeds the set CPK value.

[0027] It is understandable that before calibration, it is necessary to first set the basic parameters of the camera, take photos of the calibration plate and calibration film, make a positioning template for visual positioning based on the photos, and set the shooting position of each camera. The specific steps of the above preparatory work are common knowledge in this field and will not be repeated here. After calibration is completed, during the actual bonding process, the upper camera is first used to take a photo of the product on the bonding work platform to obtain the position and angle of the product; then the component to be bonded in the material frame or material tray is photographed and positioned, and the suction cup is controlled to move to the corresponding coordinate according to the positioning result to pick up the component to be bonded; after the suction cup has absorbed the component to be bonded, it moves to the photo position of the lower camera, and the lower camera is used to take a photo of the component on the suction cup to position it, and the rotation angle of the suction cup is calculated according to the angle of the component picked up by the suction cup, the angle of the product and the set bonding angle, and the rotation of the suction cup is controlled according to the rotation angle; at the same time, the expected mounting position of the component is calculated according to the product drawing and the position of the product, and the difference between the actual angle of the component and all the calibration angles is calculated, the absolute value of the difference is compared, and the calibration angle closest to the actual angle is found, and the expected mounting position is compensated according to the rotation deviation and zero reference deviation corresponding to the calibration angle to obtain the actual mounting position; finally, according to the actual mounting position, the suction cup is controlled to mount the component on the product.

[0028] Based on the same inventive concept, an embodiment of the present invention further provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the above-mentioned rotation and bonding method can be implemented.

[0029] In some possible embodiments, various aspects of the rotational bonding method provided by the present invention can also be implemented in the form of a program product, which includes program code. When the program product is run on the device, the program code is used to enable the control device to execute the steps of the rotational bonding method according to various exemplary embodiments of the present application described above in this specification.

[0030] Based on the same invention concept, Figure 5 An embodiment of the present invention also provides a control device for implementing the above-mentioned rotational bonding method, including a processor and a memory, the memory being electrically connected to the processor, and the processor being used to implement the above-mentioned rotational bonding method when executing a computer program stored in the memory.

[0031] In one possible design, the processor may include one or more processing units, and the processor and memory may be implemented on the same chip or separately on separate chips. The processor may be a general-purpose processor, such as a central processing unit (CPU), a digital signal processor, an application-specific integrated circuit, a field programmable gate array or other programmable logic device, a discrete gate or transistor logic device, or a discrete hardware component, and may implement or execute the various methods, steps, and logic block diagrams disclosed in the embodiments of the present application. The general-purpose processor may be a microprocessor or any conventional processor, etc. The steps of the rotational bonding method disclosed in conjunction with the embodiments of the present application may be directly embodied as being executed by a hardware processor, or may be executed by a combination of hardware and software modules in the processor.

[0032] As a non-volatile computer-readable storage medium, memory can be used to store non-volatile software programs, non-volatile computer executable programs and modules.Memory can include at least one type of storage medium, for example, can include flash memory, hard disk, multimedia card, card-type memory, random access memory (Random Access Memory, RAM), static random access memory (Static Random Access Memory, SRAM), programmable read-only memory (Programmable Read Only Memory, PROM), read-only memory (Read Only Memory, ROM), electrically erasable programmable read-only memory (Electrically Erasable Programmable Read-Only Memory, EEPROM), magnetic storage, disk, optical disk, etc. Memory is any other medium that can be used to carry or store desired program code in the form of instructions or data structures and can be accessed by a computer, but is not limited thereto. The memory in the embodiment of the present application can also be a circuit or other arbitrarily capable of implementing a storage function, for storing program instructions and / or data.

[0033] By programming a processor, the code corresponding to the rotational bonding method described in the aforementioned embodiment can be embedded in the chip, enabling the chip to execute the steps of the rotational bonding method described in the embodiment of the present invention when running. Designing and programming a processor is well known to those skilled in the art and will not be further described here.

[0034] Based on the same inventive concept, an embodiment of the present invention also provides a mounting device for mounting film sheets on flexible circuit boards, comprising the above-mentioned rotary bonding control device, as well as a mounting work platform, a mounting work head, an upper camera, and a lower camera. The mounting work head, the upper camera, and the lower camera are all controlled by the rotary bonding control device. The above-mentioned rotary bonding method can be implemented under the control of the rotary bonding control device to bond the film sheet to a preset mounting position on the flexible circuit board with higher precision.

[0035] It should be noted that in the description of the present invention, "several" means one or more, "more" means two or more, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. If there are descriptions of "first," "second," and so on, these are used solely to distinguish technical features and are not to be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0036] The present application is described with reference to the flowcharts and / or block diagrams of the methods, apparatus (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the steps in the flowchart and / or block diagram. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0037] These computer program instructions may also be stored in a computer readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.

[0038] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing the instructions executed on the computer or other programmable device for implementing the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0039] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0040] The above embodiments are only preferred embodiments of the present invention and cannot be used to limit the scope of protection of the present invention. Any non-substantial changes and replacements made by technicians in this field on the basis of the present invention fall within the scope of protection required by the present invention.

Claims

1. A rotational bonding method, characterized in that: The steps include: Position, absorb and attach the calibration piece, attaching it to the calibration plate at a 0° attachment angle; The calibration plate after bonding is positioned by the camera, and the deviation between the calibration piece pattern and the calibration plate pattern is calculated to obtain the zero reference deviation between the suction cup and the upper camera; Set multiple calibration angles, position, absorb and fit the calibration piece multiple times, and fit the calibration piece to the calibration plate at multiple calibration angles as fitting angles in turn; The calibration plate after lamination at different calibration angles is positioned by the camera, and the deviation between the calibration piece pattern and the calibration plate pattern is calculated to obtain the rotation deviation at each calibration angle; The calibration piece is then positioned, sucked, and attached multiple times, and attached to the calibration plate at multiple different attachment angles. Each time the attachment is made, the attachment position is compensated using the zero reference deviation and the rotation deviation corresponding to the calibration angle closest to the attachment angle. The camera is used to locate the calibration plate after compensation at different lamination angles, and the deviation between the calibration piece pattern and the calibration plate pattern is calculated to obtain a set of actual lamination deviation values. The device's fitting accuracy is calculated based on the actual fitting deviation value. If the device's fitting accuracy meets the requirements, the zero reference deviation and the rotation deviation of each calibration angle obtained through calibration are saved. The saved zero reference deviation and the rotation deviation corresponding to the calibration angle closest to the actual bonding angle are used to compensate the bonding position of the actual bonding product to complete the bonding of the actual product.

2. The rotation bonding method according to claim 1, characterized in that: The device's fitting accuracy is calculated based on the actual fitting deviation value. If the device's fitting accuracy meets the requirements, the zero reference deviation obtained by calibration and the rotational deviation of each calibration angle are saved, and the device's fitting accuracy is represented by calculating the CPK value.

3. The rotation bonding method according to claim 1, characterized in that: In the steps of dividing a circle into multiple calibration angles, positioning, sucking and laminating the calibration piece multiple times, rotating the calibration piece in sequence through multiple calibration angles, and laminating it to the calibration plate, a circle is divided into eight calibration angles of 0°, 45°, 90°, 135°, 180°, 225°, 270°, and 315° at equal angle intervals of 45°.

4. The rotation bonding method according to claim 1, characterized in that: The method further comprises positioning the calibration plate after lamination at different calibration angles by using a camera, calculating the deviation between the calibration sheet pattern and the calibration plate pattern, and obtaining the rotational deviation at each calibration angle. The pattern of the calibration piece after fitting according to different calibration angles is fitted with the rotation center of the fitting circle. The fitted rotation center is compared with the average of the rotation deviations of multiple calibration angles. If the difference between the two does not exceed the set threshold, the next step is continued; if the difference between the two exceeds the set threshold, the calibration is terminated and the cause is investigated.

5. The rotation bonding method according to claim 1, characterized in that: The steps of compensating the bonding position of the actual bonding product using the stored zero reference deviation and the rotation deviation corresponding to the calibration angle closest to the actual bonding angle to complete the bonding of the actual product include: Take photos of the product through the upper camera and locate the position and angle of the product; The upper camera takes a picture of the components to be mounted in the tray or frame and locates the position of the components to be mounted; Control the suction cup to pick up the component according to the position and angle of the component to be mounted; The lower camera takes a picture of the component sucked by the suction cup to locate the position and angle of the component on the suction cup; The actual placement angle of the component is calculated based on the product angle and the preset placement angle, and the rotation angle of the suction cup is calculated based on the difference between the actual placement angle and the angle of the component on the suction cup. The rotation of the suction cup is controlled according to the rotation angle; Calculate the expected placement position of the component based on the position of the product; Calculate the calibration angle closest to the actual placement angle, and use the rotation deviation of the closest calibration angle and the zero reference deviation to compensate for the expected placement position to obtain the actual placement position; Place the components on the product according to the actual mounting position.

6. The rotation bonding method according to claim 1, characterized in that: In the step of positioning the calibration plate after bonding by using a camera, calculating the deviation between the calibration piece pattern and the calibration plate pattern, and obtaining the zero-position reference deviation between the suction cup and the upper camera, the zero-position reference deviation is the average of multiple deviations obtained after the calibration piece is bonded at a bonding angle of 0° for multiple times.

7. The rotation bonding method according to claim 1, characterized in that: The calibration plate after being bonded at different calibration angles is positioned by a camera, the deviation between the calibration piece pattern and the calibration plate pattern is calculated, and the rotational deviation at each calibration angle is obtained. The rotational deviation is the average of multiple deviations obtained after the calibration piece is bonded at multiple corresponding calibration angles.

8. A storage medium storing a computer program, characterized in that: When the computer program is called and executed by a processor, the rotation and bonding method according to any one of claims 1 to 7 is implemented.

9. A rotational fitting control device, characterized in that: The invention comprises a memory and a processor, wherein the memory is electrically connected to the processor, and the processor can implement the rotational bonding method according to any one of claims 1 to 7 by calling and executing a computer program in the memory.

10. A mounting device, characterized in that: The invention comprises a rotational fit control device according to claim 9.

Images