Double-pass vacuum lamination process of mixed substrate multilayer copper-embedded PCB (Printed Circuit Board)

Abstract

The invention, which relates to the technical field of the printed circuit technology, discloses a two-way vacuum pressing technology of a mixed-substrate multilayer copper-embedded PCB, and the technology comprises the steps: forming a positioning interface at the periphery of a copper-embedded groove, arranging guide channels at the groove wall and the groove bottom, processing a circumferential groove at the periphery of a copper-embedded part, and carrying out the light holding through a detachable holding layer, collecting the initial positioning information of the copper-embedded piece and the communication state of the guide channel; and pre-permeation resin is filled along the guide channel and is discharged under reduced pressure, and the copper-embedded part holding position and the stagnant gas identification mark are confirmed according to the gas outlet state of the guide channel and the interface wetting state. And second-process pressing is carried out through soft pressing surface combination, so that the pressure is transmitted on the positioning interface, the resin is discharged along the guide channel, and an interface shaping result and an interlayer combination state are output. And removing the detachable holding layer, carrying out steady-state and lossless confirmation, comparing the position of the copper-embedded part with an interface shaping result, and uniformly writing the copper-embedded part and the interface shaping result into a press-fit parameter card together with an interlayer bonding state for subsequent reuse and release.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit technology, in particular to a double-pass vacuum pressing process for a hybrid substrate multi-layer copper-embedded PCB. Background Art

[0002] In applications where high heat flux density and high reliability are required simultaneously, hybrid substrate multi-layer embedded copper circuit structures are used to establish a low-thermal-resistance heat conduction channel between the device heat source and the heat dissipation path, while taking into account the transmission requirements of high speed and large current. Typical scenarios include automotive power control, RF front-end, satellite payload and high-density power boards.

[0003] The existing process usually adopts the common practice of vacuum pressing after pocket milling, using the overall pressure and temperature rise curve to promote the flow of resin and encapsulate and solidify the embedded copper parts. However, the industry generally focuses on the empirical adjustment of the total pressure and temperature window, lacks the pre-configuration of the geometric contact boundary and the dispersion path before pressing, and rarely uses the same reference coordinate to collect position and connectivity information. Due to the combined influence of the rheological and thermal expansion differences of the mixed medium under heating, the geometric mutation of the embedded copper, the local pressure concentration and the disordered migration of residual gas, closed air pockets and local non-wetting are prone to occur in the first stage. The second process stage easily solidifies early defects into thin gaps and steps that are difficult to restore. The subsequent reflow soldering and thermal cycling accelerate the evolution of interface microcracks and interlayer delamination, and the thermal conductivity continuity of the power path and the impedance continuity of the high-speed link are simultaneously damaged; at the same time, the existing pressing pads are mostly based on equal pressure, lacking the design of compliant pressure transmission and surface shaping for positioning boundaries, and the detection side is mostly discrete images or routine inspection curves, lacking quantitative mapping with the same reference as manufacturing records, resulting in reliance on experience for intra-batch judgment and lack of callable items for inter-batch reuse, making it difficult to achieve yield, reliability and traceability.

[0004] In the double-pass vacuum pressing scenario of the hybrid substrate multi-layer embedded copper circuit structure, the combined effect of the first-pass heating and decompression causes the resin viscosity to decrease rapidly and form a significant drag and pressure gradient. When the geometric angles and roughness distribution of the groove wall and groove bottom change the local flow field, the embedded copper parts float up or move slightly laterally without the constraints of stable contact boundaries. At the same time, if a guide channel for discharge and pilot filling is not established before pressing, and a detachable holding layer is not formed to provide reversible holding, the residual gas will be retained at the junction of the copper and the medium and appear together with the non-wetted area, forming invisible air gaps and step morphologies that are difficult to directly observe with the naked eye. After entering the second pass, conventional pressure-equalizing hard loading cannot repair the displacement and air stagnation of the first pass, but instead further solidifies them into long-term weaknesses in the interface morphology and bonding ability. When subsequently undergoing reflow soldering or power thermal shock, these invisible thin gaps become preferential channels for thermal stress and moisture intrusion, inducing interlayer delamination and thermal path mismatch, and causing impedance jumps and increased radiation noise near the dielectric constant mutation in structures containing high-speed traces. The ultimate manifestation is increased solder rework, accelerated aging, reduced thermal stability of the entire device, and reduced signal margin. In addition, due to the lack of pre-collection of initial positioning information of embedded copper parts and the connectivity status of guide channels under the same reference coordinates, as well as the lack of process steps for compliant pressure transmission and interface shaping for the positioning interface, it is difficult for the manufacturing end to transcribe the key results of the first and second passes into reusable parameter records. As a result, qualified interface morphology and interlayer bonding strength cannot be stably reproduced between different batches. Quality judgment and process release remain based on empirical judgment for a long time, and technical risks are transferred to the assembly and service stages, making it difficult to correct them in a timely manner. Summary of the Invention

[0005] (1) Technical problems solved In response to the deficiencies of the prior art, the present invention provides a two-pass vacuum pressing process for a hybrid substrate multi-layer copper-embedded PCB, by collecting the initial positioning information of the copper-embedded parts and the connectivity status of the guide channels. The guide channels are filled with pre-infiltrated resin and discharged under reduced pressure, and the position of the copper-embedded parts and the air stagnation identification mark are confirmed according to the gas outlet status of the guide channels and the wetting status of the interface. The second pass pressing is carried out with a soft pressing surface combination, so that the pressure is transmitted at the positioning interface, the resin is discharged along the guide channel, and the interface shaping result and the interlayer bonding state are output. The detachable holding layer is removed and stabilized and non-destructively confirmed, the position of the copper-embedded parts is compared with the interface shaping result, and the interlayer bonding state is uniformly written into the pressing parameter card for subsequent reuse and release; thereby solving the technical problems recorded in the background technology.

[0006] (2) Technical solution To achieve the above objectives, the present invention is implemented through the following technical solutions: The double-pass vacuum lamination process for hybrid substrate multi-layer copper-embedded PCBs includes forming a positioning interface around the perimeter of the copper embedding groove, providing guide channels on the groove wall and bottom, machining a circumferential groove around the perimeter of the copper embedding component, and lightly holding the copper embedding component with a removable retaining layer. The initial positioning information of the copper embedding component and the connectivity status of the guide channels are simultaneously recorded. Pre-filling the bottom and periphery of the guide channel with pre-infiltrated resin, maintaining the removable retaining layer under reduced pressure; confirming the retaining position of the copper insert and the air stagnation identification mark based on the air outlet state and interface wetting state of the guide channel and recording them simultaneously; The soft pressing surface combination is replaced to perform a second pressing process, so that the pressure is transmitted to the positioning interface and the resin is discharged along the guide channel; the position of the embedded copper part, the gas discharge state of the guide channel and the wetting state of the interface are used as input to generate the interface shaping result and the interlayer bonding state; After removing the removable retaining layer, the stabilization treatment is performed and non-destructive confirmation is performed. The position of the copper embedment is compared with the interface shaping result, and the interlayer bonding state is written into the pressing parameter card. The initial positioning information of the copper embedment and the connectivity state of the guide channel are archived.

[0007] Furthermore, the positioning interface is micro-etched or plasma cleaned to remove surface contamination to form a clean contact surface; The guide channel verifies the continuity of the groove wall and the groove bottom, and uses the same tooling reference coordinate to record the connectivity status of the guide channel. The initial positioning information of the embedded copper part is archived synchronously with the reference coordinate.

[0008] Furthermore, the guide channel is formed by machining or laser processing and avoids the key route leading to the outer edge, and the circumferential groove is evenly distributed along the periphery of the positioning interface and is consistent with the groove wall morphology; The initial positioning information of the copper inlay includes a position vector, an initial positioning error and a grip coefficient, and is associated with the connectivity state of the guide channel.

[0009] Furthermore, the detachable holding layer is made of a material with low residue and capable of temperature-controlled release or mechanical peeling, and is disposed at the bottom of the groove near the positioning interface to lightly hold the inlaid copper part; When removing, the position is released along the preset path and recorded as a removal record set with the same reference coordinates. The holding position of the copper inlay is continuously measured before and after removal.

[0010] Furthermore, the pre-infiltration resin is compatible with the mixed medium and the surface of the copper embedded part, and has low volatility and controllable rheology; Under reduced pressure conditions, the bottom and periphery of the groove are first filled along the guide channel, and the gas outlet state and interface wetting state of the guide channel are recorded with the same reference, and the copper embedding holding position and the gas stagnation identification mark are generated according to binary rules.

[0011] Furthermore, the soft pressure surface assembly is composed of a compliant cushion layer, an isolation medium and a pressure-bearing sheet, and is placed in a corresponding area of ​​the positioning interface to form compliant pressure transmission; In the second-pass pressing, the second-pass pressure field is collected and a pressure sampling set is formed, and at the same time, it is combined with the compliance map, the target pressure distribution and the connectivity state of the guide channel to generate a second-pass integrated input package.

[0012] Furthermore, based on the second-process integration input package, shaping is implemented on the positioning interface to obtain a shaping curvature set consisting of the interface curvature radius and the wetting coverage, and the interface shaping result is exported at the same reference coordinate; the interlayer bonding state is calculated simultaneously and the bonding sufficiency index is attached, all of which are recorded in fields with the same name.

[0013] Furthermore, after removing the detachable retaining layer, a stabilization process is performed, and the stress attenuation and position convergence curves are recorded at the same reference coordinates according to a predetermined temperature range and load sequence to form a stabilization record set; at the same time, the connectivity status of the guide channel is checked to remain connected and archived synchronously.

[0014] Furthermore, non-destructive imaging is used to obtain the measured curvature radius and the measured wettability coverage at the same reference coordinates, and mapping and comparing them with the corresponding fields of the shaping curvature set to generate a non-destructive confirmation set; and a one-to-one reference relationship is established between the measured interlayer bonding state and the corresponding fields of the interface shaping result.

[0015] Furthermore, the non-destructive confirmation set and the stabilization record set as well as the interface shaping result, the interlayer bonding state, the second-process pressure field and other equivalent quantities are uniformly written into the pressing parameter card; The pressing parameter card is solidified with items including a release determination value, a reuse score, and a consistency confidence level, and is associated with the initial positioning information of the embedded copper component and the connectivity status of the guide channel.

[0016] (3) Beneficial effects The present invention provides a two-pass vacuum lamination process for a hybrid substrate multi-layer copper-embedded PCB, which has the following beneficial effects: By forming a positioning interface around the copper embedding groove, continuously setting guide channels, machining circumferential grooves and lightly holding it with a detachable holding layer, and collecting the initial positioning information of the embedded copper parts and the connectivity status of the guide channels, the starting geometry and the dispersion path are clearly defined and reusable. The embedded copper parts are constrained to the benefited area before heating, which suppresses floating and lateral displacement and reduces the causes of early invisible air gaps. The initial positioning information of the embedded copper parts and the connectivity status of the guide channels are recorded with the same reference coordinates.

[0017] Pre-infiltrated resin is used to directionally fill the guide channel and preferentially disperse it under reduced pressure. Combined with the reference record of the gas outlet state and the interface wetting state of the guide channel, the copper embedded part holding position and gas stagnation identification mark are generated in time, so that the resin front and gas migration sequence are ordered, thereby reducing the probability of regenerated cavity before the second process and improving the controllability of subsequent plastic surgery, while reducing the dependence on additional adjustment factors.

[0018] A soft pressure surface combination is introduced in the second process, and the positioning interface is used as the force reference. Relying on the compliance mapping, target pressure distribution and second-process pressure field in the second-process integration input package, the pressure consistency index is constructed. At the same time, the discharge potential energy is constrained to the main path of the guide channel, so that the pressure and flow are coordinated to point to the same beneficiary area, and gentle pressure transmission and stable discharge are achieved without changing the material system, so that pressure peaks in key areas are avoided and channels are prevented from being occupied by resin.

[0019] Based on the shaping curvature set, the interface curvature radius and wetting coverage are controlled and advanced, the interface shaping results are output and the interlayer bonding state and bonding sufficiency index are updated synchronously. The copper-dielectric interface is improved with both smooth transition and true adhesion. The stress concentration and microcrack expansion in the thermal cycle tend to converge, the high-speed impedance transition is smoothed, and the power density and signal quality are taken into account, thereby improving long-term reliability and thermal path continuity.

[0020] The removable holding layer is released in a reversible path, and the position convergence and residual stress attenuation are achieved through the steady-state record set. At the same time, the connectivity of the guide channel is verified to be intact, and the position of the embedded copper part remains stable near the positioning interface. The interface shaping results formed by the second process are consolidated in the time dimension, reducing the risk of re-instability in the subsequent assembly and reflow processes, so that the benefits of the previous process can be maintained during the life cycle. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the double-pass vacuum pressing process flow of the hybrid substrate multi-layer copper-embedded PCB of the present invention. DETAILED DESCRIPTION

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0023] See also Figure 1 The present invention provides a double-pass vacuum lamination process for a hybrid substrate multi-layer copper-embedded PCB, comprising: Step 1: Through the integrated prefabrication and verification of the positioning interface, guide channel, circumferential groove, and detachable retaining layer, the initial positioning information of the embedded copper part and the connectivity status of the guide channel are output, and both are passed to step 2 as the only reference.

[0024] The copper groove shape causes local discontinuities in geometry and material properties. If stable contact boundaries and escape paths are not established before pressing, resin drag during the heating phase will cause micro-displacement of the copper insert and hinder escape, which in turn forms steps and thin gaps during subsequent curing. To prevent this chain reaction, it is necessary to clearly answer the questions of where contact is stable, where the path is unobstructed, and where the resin is allowed to reach first, all before heating and decompression. This answer must be converted into measurable and transferable marks.

[0025] First, the positioning interface is defined by the joint geometry-energy constraint, so that the embedded copper part tends to the position with minimum energy in the absence of external force disturbance. Then, the guide channel is constructed using the flow-connectivity index, so that the subsequent gas and resin migration follows a low-resistance path. Circumferential grooves are then used to enhance anti-interference bite and map the geometric features into measurable contact energy. Finally, a detachable holding layer is used to provide reversible support and cushioning, and the measured position and connectivity mark are solidified into the initial positioning information of the embedded copper part and the connectivity state of the guide channel.

[0026] The positioning interface is not a simple edge line, but an interface entity that carries contact energy, curvature and disturbance response. In order to keep the embedded copper part close to the design reference in the absence of external force and slight disturbance, the curvature and adhesion work of the positioning interface are preset with the energy functional as the traction, so that the contact between the geometry and the material forms a stable attraction basin before pressing.

[0027] Specifically, the target functional Characterize the design quality of the positioning interface in the form of:

[0028] Where: total interfacial potential energy , a non-negative real number, characterizing the potential energy of the positioning interface under the current geometry and material combination; the curvature weight coefficient , is a positive real number, regulating the effect of curvature on the overall target; the interface curvature can , is a non-negative real number; adhesion weight coefficient , is a positive real number, which strengthens the contribution of adhesion work to stability; Adhesion work , is a non-negative real number that measures the bonding ability between the inlaid copper part and the substrate at the positioning interface.

[0029] Therefore, by minimizing the objective functional When processing the positioning interface, priority is given to obtaining a contact boundary with smooth curvature and sufficient adhesion; thus, the embedded copper part is locked in the vicinity of the designed position by the dual factors of geometry and energy before subsequent heating.

[0030] In order to convert the result into collectable data, the initial positioning vector Record the measured position of the copper insert relative to the positioning interface and use the initial positioning error represents the deviation from the benchmark and is defined as:

[0031] Where: Measurement positioning vector , is a two-dimensional or three-dimensional real vector, recording the measured position of the embedded copper part; the reference positioning vector , is a two-dimensional or three-dimensional real vector, representing the reference position of the positioning interface; the initial positioning error , is a non-negative real number that measures the deviation between the embedded copper part and the reference.

[0032] By minimizing the energy target, a smooth and highly adherent positioning interface is obtained, and then the geometric results are mapped into the core quantity of the initial positioning information of the embedded copper parts. Initial positioning error , providing directly referenced quantities for the pre-compression check in step 2.

[0033] The purpose of the guide channel is to provide a low-resistance path for the subsequent gas migration and directional entry of the pre-infiltration resin, in order to avoid the channel existing but not being connected in the overall topology, so as to connect the target Perform comprehensive measurement:

[0034] Where: Access weight coefficient , is a positive real number, emphasizing the priority of accessibility; accessibility , a real number between 0 and 1, representing the connectivity ratio of the guide channel from the bottom of the groove to the outer edge; the bending weight coefficient , is a positive real number, which suppresses excessive channel bending; Curvature , is a real number not less than 1; the resistance weight coefficient , is a positive real number, balancing the flow resistance; dissipating the resistance , is a non-negative real number that characterizes the difficulty of the flow of gas and pre-infiltrated resin in the channel.

[0035] Therefore, the guide channel is designed to reduce the connectivity target As a criterion, high accessibility, low bending and low resistance morphology are obtained first. Record the real connectivity relationship and use the connectivity rate As the core quantity of the guide channel connectivity status, it reserves a direct reference metric for determining the guide channel outlet status in step 2. After forming the positioning interface, micro-etching or plasma cleaning is performed to remove oxidation / contamination, and then a contact energy consistency check is performed; In order to form a measurable coordinate system consistent with the positioning interface, the connectivity function With the initial positioning vector The guide channel is placed in the same reference frame, so that subsequent images or detection data can be superimposed and compared under the same reference. The topography design of the guide channel is unified with the joint goal of connectivity and resistance, and the connectivity state of the guide channel is clearly defined as the connectivity rate. and connectivity function The combined expression provides a direct criterion for the release and stagnant gas identification mark in step 2.

[0036] The circumferential groove is located on the outer periphery of the copper insert and is a key geometric feature for resisting resin shear and perturbation torque. In order to transform the geometric feature into a measurable and comparable anti-disturbance capability, the grip coefficient is introduced. The coupling of adhesion work and normal contact force and the mapping of the amplification effect of the groove wall morphology on the anti-disturbance ability are:

[0037] Where: Adhesion work , is a non-negative real number that measures the adhesion ability on the positioning interface; the contact friction coefficient , a real number between 0 and 1, characterizing the friction characteristics between the sidewall of the circumferential groove and the embedded copper part; normal contact force , describes the normal compression degree of the embedded copper part on the positioning interface; disturbance torque , which approximately represents the small disturbance during heating or transportation; the morphology magnification factor , is a real number greater than 0, reflecting the amplification effect of the circumferential groove geometric angle and the side wall roughness on the grip.

[0038] Therefore, by increasing the grip coefficient The design principle can significantly improve the anti-disturbance capability of the embedded copper parts without changing the material system; thus the initial positioning error in the initial positioning information of the embedded copper parts is reduced. At the processing end, it is lowered to a more controllable range. As an auxiliary field in the initial positioning information of the embedded copper part, and the initial positioning vector Initial positioning error Simultaneous recording enables the contact and geometric position to form the same recording object. The geometric characteristics of the circumferential groove are quantified as and recorded in the same channel as the position error, so that the anti-interference capability can be directly involved in the release judgment and process reuse of subsequent steps.

[0039] The removable holding layer is used to gently hold the inlaid copper parts during the prefabrication stage. It must provide the necessary holding force and be removed without damage before entering the next stage. In order to achieve both, the holding stability index is constructed. With unified compliance, material stiffness and initial error constraints:

[0040] Where: Stiffness of the holding layer material , providing the support required for holding; the holding layer is soft , measures the compliance of the holding layer under load; initial positioning error , the position deviation of technical point A is used; error tolerance , is a positive real number that defines the upper bound of the acceptable initial deviation; the fixed stability index , is a non-negative real number, which comprehensively evaluates whether the fixation meets the dual requirements of position holding and reversibility.

[0041] Thus, when the stability index When the holding position is stable and a reversible detachment margin is reserved, the state of recording the initial positioning information of the embedded copper part is considered to be transferable; and then the connectivity rate is used to determine the transferability. and connectivity function The guide channel connectivity status is jointly generated, and the holding layer status is recorded in the same record.

[0042] In order to ensure the integration of data exchange with step 2, the initial positioning information of the embedded copper parts will be output. 〕Connection status with the guide channel〔 〕, and uniformly mark measurement references and timestamps to avoid name and semantic drift. The rigid-flexible ratio and position tolerance of the holding layer are unified, so that light holding does not introduce new stress concentration and can be removed non-destructively before entering the next step. At the same time, the related position information and connectivity information are integrated and output with the same name.

[0043] Focusing on the positioning interface, guide channel, circumferential groove, and detachable holding layer, the three paths of geometric contact, topological connectivity, and supported reversibility are coupled into the same prefabricated action chain: by minimizing the objective functional Obtain a smooth and highly adhesive positioning interface by minimizing the number of connected targets Obtain a high-access, low-resistance guide channel through the grip coefficient The geometric advantages of the circumferential groove are converted into anti-interference ability, and the stability index is Coordinate the rigid-flexible relationship and reversible detachment of lightweight retention. All of the above quantitative objects are recorded into the initial positioning information of the copper insert and the connectivity status of the guide channel, and archived together with the same reference, providing input that does not require secondary interpretation for the directional filling of pre-infiltration resin and the coordinated decompression and dispersion in step two.

[0044] The directional filling of the pre-infiltration resin and the coordinated decompression and dispersion are based on the existing input of the initial positioning information of the embedded copper parts and the connectivity status of the guide channel. The pilot flow of the pre-infiltration resin in the guide channel and the preferential dispersion of the trapped gas are organized in parallel, so that the gas discharge state of the guide channel and the interface wetting state are reach a predictable and deliverable state before the temperature is raised. The pre-infiltration resin is required to be compatible with the mixed medium, have low volatility, and have controllable rheology under reduced pressure. Step 2: Use the guide channel to construct a calculable pilot flow and priority dispersion order, so that the pre-infiltration resin can directionally fill the bottom and periphery of the groove under reduced pressure, generate the gas outlet state and interface wetting state of the guide channel in real time, and give the determination of the holding position of the embedded copper part and the air stagnation identification mark under the holding position of the detachable holding layer.

[0045] If pilot flow is not organized based on the connectivity of the guiding channels, the propulsion of the pre-infiltration resin will bifurcate due to the coupling of local pressure gradients and interfacial tension, inducing gas stagnation near the positioning interface. Once the trapped gas solidifies into thin gaps, it will accumulate fatigue during the subsequent thermal process. Therefore, it is necessary to translate pre-process quantities such as accessibility, connectivity function, grip coefficient, and retention stability index into process quantities that can be used to schedule the flow field and determine release, thereby solidifying the order of dispersion first, wetting later, and holding position as the process norm. First, based on the connectivity state of the guiding channel, the resin propulsion potential energy along the main direction of the connectivity function is constructed, so that the resin volume flow density and the pressure gradient are strictly in the same direction; then, the gas outlet state of the guiding channel is summarized by the gas outlet flux, and an integrated judgment is made through the pre-infiltration release degree; on this basis, the surface energy decomposition is used to drive the improvement of the interface wetting state, and the spatial distribution of the wetting is mapped into a boundary that can be accepted by subsequent compression; finally, the holding position of the embedded copper part is dynamically checked with the help of the grip coefficient and the equivalent stiffness of the holding layer to ensure that it remains in place under the action of flow shear and buoyancy.

[0046] The accessibility and promotion of the pilot flow and the construction of the resin driving field: When the accessibility and topological trunk are given by the connectivity of the guide channel, the propulsion potential energy should be concentrated in the trunk direction so that the pre-infiltration resin reaches the bottom and periphery of the groove first. Following the topological backbone, the propulsion term is constructed in the form of tangential projection so that it is consistent with the pressure field. The spatial gradient of is in the same direction, and the gain is modulated by the accessibility, thus achieving computable leader propulsion. Its core relationship is expressed as:

[0047] Where: Resin volume flow density : non-negative real number, representing the volume flow intensity of the pre-infiltrated resin per unit cross section; resin permeability : a positive real number, which comprehensively represents the equivalent permeability of the guiding channel and the groove bottom texture to resin penetration; Tangential unit vector : A set of unit vectors representing the connected functions The tangent direction of the main trunk direction; pressure field : real-valued scalar field, representing the spatial pressure distribution under reduced pressure conditions; topological gain coefficient : non-negative real number, connect function The trunk concentration is converted into propulsion gain; the pressure gradient , the gradient of the pressure field in space; Accessibility : A real number between 0 and 1, indicating the degree of connectivity of the guide channel from the bottom of the groove to the outer edge.

[0048] Through the gain modulation term The introduction of resin volume flow density A stronger push is achieved in the direction with better topological connectivity; thus, the pre-infiltrated resin can first fill the geometric dead corners and compress the gas space; thus, a visual boundary is created for the continuous observation of the gas outlet state of the guide channel. In order to align with the coordinates of the initial positioning information of the embedded copper part, the flow acquisition is based on the initial positioning vector Record the profile sequence for the origin to avoid misjudgment caused by inconsistent reference systems. Use the multiplicative coupling of dynamic terms and topological quantities to establish the resin propulsion priority and connect the rate Directly reflected in the resin volume flow density To reduce the uncertainty of subsequent judgments.

[0049] As the pre-infiltration resin advances, the gas moves out along the guide channel. It is necessary to construct a calculable guide channel gas outlet state to determine whether it is allowed to enter the cladding temperature increase. To this end, the exhaust index is defined is the normalized ratio of the channel normal gas flux to the equivalent resin flux:

[0050] Where: Exhaust index : a non-negative real number, measuring the release capacity of the average outgassing intensity per unit length of the guiding channel relative to the equivalent flux of the resin; channel length : positive real number, connected function The curve length of the gas velocity vector : vector field, representing the local velocity of the gas in the channel; normal unit vector : unit vector set, the outer normal direction of the channel cross section; channel cross-sectional area : Positive real number, equivalent flow cross section of the channel.

[0051] Thus, the exhaust index and accessibility Together they constitute the core metric of the gas outlet state of the guiding channel; and further define the pre-infiltration release degree Used to determine whether to enter the lamination heating stage:

[0052] Where: Pre-infiltration release : non-negative real number, comprehensively describing the common maturity of exhaust, connectivity and wetting; contact angle : Zero to A real number describing the instantaneous wetting of the pre-infiltrated resin at the positioning interface; accessibility : A real number between 0 and 1, indicating the degree of connectivity of the guide channel; exhaust index : A non-negative real number, representing the average air outlet capacity per unit length.

[0053] Therefore, when the pre-infiltration release Achieve established interface tolerances When conditions permit, mark the air stagnation identification mark If no gas stagnation is observed, otherwise a gas stagnation position index is generated and pre-infiltration is maintained. When the gas discharge state of the guide channel is continuous dissipation and the interface wetting state is not wetted and there is still a gas signal in the local area, it is marked as present; otherwise, it is marked as absent. Among them, the interface tolerance : Positive real number, used as process constant for release boundary; gas stagnation identification mark : Discrete state quantity, recording the existence of stagnant air and its spatial index.

[0054] Exhaust index Physical measurability and accessibility The topology can be solved by superposition, and then the contact angle is introduced As a multiplier for wettability maturity, it makes the release criteria concise and traceable, and uses a stagnant air identification mark Create clear output.

[0055] After the outgassing state of the guiding channel reaches the stable range, the improvement of the interface wetting state determines the integrity of the subsequent solidification interface. In order to combine the surface energy of the positioning interface and the texture effect of the circumferential groove into a computable wetting potential, the wetting potential is defined as is the combination of three-phase surface energy and texture factor:

[0056] Where: Wetting potential : Real number, positive value represents favorable spreading, negative value represents unfavorable spreading energy drive; solid-gas surface energy : represents the interface energy between the solid surface and the gas; solid-liquid surface energy : Indicates the interfacial energy between the positioning interface solid and the pre-infiltrated resin; liquid-gas surface energy : Indicates the interfacial energy between pre-infiltration resin and gas; Texture influence coefficient : positive real number, mapping the promotion effect of circumferential groove and groove bottom texture on effective wetting as a coefficient; contact angle : Zero to is a real number describing the wetting dynamics.

[0057] Therefore, by adjusting the texture influence coefficient The geometric origin and surface treatment combination make the wetting potential The favorable interval is reached at the end of the guide channel and the corner of the positioning interface; the pre-infiltrated resin forms a continuous thin layer at these key locations and eliminates micro-voids; and the spatial distribution of wetting is mapped to the wetting Recorded as a function of area:

[0058] Where: Wetting map : Real number, indicating the positioning interface domain Average wettability on the surface; : a positive real number, representing the inspected area of ​​the positioning interface; Through wetting potential With wetting mapping Combining the three-phase surface energy and texture effects into a single recordable indicator pair provides a dual spatial and energetic representation of the interfacial wetting state, facilitating its acquisition along with the pressure distribution in the next step. During pre-infiltration, the pre-infiltration resin exerts flow shear and buoyancy on the copper insert. Without verifying the holding stability, the copper insert's position may deviate from its initial positioning information.

[0059] Based on the grip coefficient of step 1 and the stiffness of the holding layer material and the flexibility of the retaining layer , define the equivalent stiffness of the holding layer for:

[0060] Among them, the equivalent stiffness of the holding layer : a positive real number, converting the rigid-flexible matching of the detachable retaining layer into a single force parameter; On this basis, the stability index Comprehensive check of stress margin:

[0061] Where: Stability index : A positive real number. When it is greater than the stability limit, it indicates that the position of the embedded copper can be confirmed; contact friction coefficient : A real number from 0 to 1, representing the friction characteristics between the positioning interface and the embedded copper part; normal contact force : non-negative real number, normal compression from clamping and deadweight; initial positioning error : non-negative real number, the positioning deviation from step 1, used to linearize the restoring force; equivalent shear force : non-negative real number, the flow force obtained by integrating the resin shear stress; buoyancy : A non-negative real number, the buoyancy component introduced by the density difference.

[0062] To specify the equivalent shear force , according to the contact surface to be tested Integral of the shear stress over :

[0063] Where: contact surface : positive real number, indicating the relative sliding surface between pre-infiltrated resin and embedded copper parts; resin shear stress : non-negative real number, related to the dynamic viscosity of the resin Local shear associated with velocity gradient; dynamic viscosity of the resin : A positive real number, representing the rheological characteristics of the pre-infiltration resin.

[0064] Therefore, when the stability index Not less than the stability limit When the exhaust index is reached, confirm that the position of the embedded copper parts meets the requirements; otherwise, maintain the removable holding layer unchanged and return to the pilot propulsion stage until the exhaust index is reached. With wetting mapping Meet interface tolerance The stability limit : A positive real number, serving as the process boundary for stability.

[0065] The dual-source disturbance of shear and lift is balanced by the three-element anti-disturbance of gripping, friction and holding, forming a identifiable holding position of the embedded copper parts, and recording this state together with the stagnant air identification mark. The common output is directly referenced by the next step.

[0066] Through the above treatment, the guide channel is no longer just a geometric channel, but is endowed with calculable propulsion order and drainage capabilities; the positioning interface and the circumferential groove not only define the contact boundary, but also through the wetting potential and grip coefficient It plays a role in energy and anti-interference. The detachable retaining layer is no longer passively held, but is supported by the equivalent stiffness of the retaining layer. and stability index Intervention into the holding position determination, forming the resin volume flow density To exhaust index , then wetting mapping and stability index When entering the second-stage integration and interface shaping of the soft pressure surface combination, the gas outlet state of the guide channel, the interface wetting state, the position of the embedded copper parts, and the stagnant gas identification mark can be used as the boundary and initial conditions. The contact pressure and solidification path are directly allocated based on this, achieving the orderly acceptance and improvement of the interface shaping results and the interlayer bonding state.

[0067] Under the premise of ensuring the copper insert maintains its position, the guide channel is in a state of air release, and the interface is wetted, a soft pressure surface combination is used to establish a compliant spatial pressure distribution and force transmission on the positioning interface, allowing the pre-infiltrated resin to complete residual dispersion and continuous flow along the guide channel, and forming a smooth, continuous, and stable transition interface at the junction of the copper and the dielectric. The soft pressure surface combination is a three-layer stack of compliant cushion layer + isolation dielectric + pressure plate. The materials can be conventionally selected from the elastomeric compliant cushion layer and metal / composite pressure plate. To this end, the position of the embedded copper parts is used as a constraint, the gas outlet state of the guide channel and the interface wetting state are used as the boundary conditions for release and shaping, and quantifiable pressure consistency indicators, dissipation potential energy and surface shaping energy are constructed, which are then converted into objective records of the interface shaping results and the interlayer bonding state.

[0068] Step 3: Accurately distribute the second-pass pressure through the combination of soft pressure surfaces, establish compliant contact at the positioning interface, rely on the guide channel to complete residual dispersion and resin flow, obtain the interface shaping result and the interlayer bonding state, and form an input-output relationship in the same semantic space with the result, the position of the embedded copper part, the air outlet state of the guide channel, and the interface wetting state.

[0069] If the second-pass pressure action only pursues nominal equalization, it can easily cause local overpressure and shear concentration near the positioning interface, leading to residual air stagnation and thin gaps at the end of the guide channel. Furthermore, if the shaping surface does not maintain positional coordination with the copper insert, the resin flow will be forced to bypass, resulting in localized regenerative cavities. Therefore, it is necessary to reshape the pressure path by leveraging the compliant properties of the soft pressure surface combination, so that pressure distribution and flow access complement each other. By minimizing the surface shaping energy, the interface morphology is gently and continuously pushed to the target state.

[0070] The copper insert's position determines the permissible range of the second-pass contact area and indentation depth; the guide channel's gas venting state determines the primary low-resistance channel for dissipation; and the interface wetting state determines the interface region where continued flow is permitted. Under the constraints of this triple information, the second-pass pressure field is modulated using a combination of soft pressure surfaces to establish a pressure consistency index and obtain a compliance mapping. Simultaneously, based on connectivity and wetting information, the dissipation potential is set to suppress the tendency of resin to reversely occupy the channel. Finally, the surface shaping energy is used to coordinate interface curvature, adhesion work, and contact work to generate the interface shaping result and update the interlayer bonding state.

[0071] The soft pressure surface conforms to the pressure transmission and pressure consistency structure: with the participation of the soft pressure surface combination, the second-stage pressure is not simply evenly distributed, but needs to be smoothly transmitted near the positioning interface, so that the normal and tangential components after loading can fit the geometric constraints of the embedded copper parts to maintain their position without destroying the low-resistance path of the guide channel.

[0072] To this end, a pressure consistency index is constructed to measure the degree of compliance of the soft pressure surface combination with the target pressure distribution, and to reversely infer the selection and arrangement of the soft pressure surface combination. Definition of pressure consistency index:

[0073] Second-pass pressure field , is a non-negative real number field, representing the pressure distribution after combined loading on the soft pressure surface; Adaptive Mapping , describing the ability of the local compliance characteristics of the soft pressure surface combination to modulate pressure, for example, in the form of the recommended continuous type (anisotropic Helmholtz) compliance mapping, the equivalent expression of the kernel convolution type (for fast implementation) and the discrete matrix type (FE / grid implementation); Target pressure distribution , is a non-negative real field, which is the pressure reference that needs to be satisfied by the copper insert to maintain its position, the air outlet state of the guide channel, and the wetting state of the interface; the pressure transfer weight , is a positive real field, which improves the consistency requirements in the positioning interface and key transition areas; the boundary smoothing coefficient , is a positive real number, which suppresses the sudden change of normal pressure on the positioning interface; Pressure zone , is the geometric area, integration domain; interface boundary , is a curve or surface that locates the boundary of the interface; the normal vector , is a unit vector representing the direction of the normal gradient.

[0074] Therefore, minimizing the pressure consistency index The process is to match the soft pressure surface combination with the required pressure transmission path; thus obtaining a gentle loading of the positioning interface and a low-disturbance coverage of the guide channel. In order to convert this indicator into usable data, the second-pass pressure field and Adaptive Mapping Sampling is done in the same reference to generate a pressure sampling set, which is recorded at the same coordinates as the embedded copper parts to form an input set that can be directly compared.

[0075] Pressure consistency index The structure of the soft pressure surface combination transforms the setting of the soft pressure surface combination from empirical adjustment to a compliant solution oriented to the target pressure distribution, avoiding uncontrollable pressure spikes in key areas.

[0076] Under the premise that the gas outlet state of the guiding channel is known and the interface wetting state can be judged, it is necessary to make the residual gas migrate first and then pre-infiltrate the resin for subsequent filling; if the resin flux seizes the channel, new stagnant gas will be formed at the channel bifurcation. To this end, the dispersion potential energy is defined as , so that the trend of gas outlet priority on the channel can be quantified. Settings:

[0077] Where: Channel curve , is a collection of curves, guiding the main path of the channel; outlet flux density , is a non-negative real field, describing the local dispersion intensity of the gas in the guide channel; resin flux density , is a non-negative real field, describing the local flow intensity of the pre-infiltrated resin in the guide channel; the flux balance coefficient , is a positive real number, which inhibits the premature occupation of the resin in the core area of ​​the channel; Positive operator , take the non-negative part of the expression to focus on punishing the disadvantage of outflow; channel weight , is a positive real number field, and the dispersion requirements are improved at the intersection of channels and the sections leading to the outer edge.

[0078] Thus, reducing the potential energy The process is equivalent to strengthening the dynamic order of gas first and resin later in the guide channel; and then combined with the aforementioned pressure consistency index The pressure is gently distributed, so that the residual gas near the positioning interface can be stably discharged along the predetermined path. and connectivity functions They are consistently annotated in the same channel coordinates and together with the pressure sample set form a second-pass integration input package, providing complete input for surface shaping and combined advancement.

[0079] To dissipate potential energy The process intention of gas outlet priority is converted into an optimizable quantity to avoid the regeneration cavity caused by the resin back-occupying the channel, which complements the pressure consistency.

[0080] Interface surface shaping energy and smooth transition construction: When the pressure sampling set and the second-process integration input package have been collected, it is necessary to push the interface from the rough contact state to the smooth transition state and maintain the position geometrically coherent with the embedded copper. To this end, a shaping energy functional is introduced to unify the curvature, adhesion work and contact work into the same goal; at the same time, the surface after shaping is constrained to not destroy the connectivity advantage of the guide channel. Set the shaping energy functional :

[0081] Curvature smoothness coefficient , is a positive real number, emphasizing the smoothness of the surface; the interface curvature radius , measures the local curvature of the positioning interface; curvature weight , is a positive real field, strengthening the shaping at the edge of the embedded copper and the corner of the material; the adhesion enhancement coefficient , is a positive real number, which improves the contribution of adhesion work; Adhesion work , is a non-negative real field, using the above definition and updating in the second process; wetting coverage , is a real number field ranging from 0 to 1, mapped from the interface wetting state; the contact work coefficient , is a positive real number, quantifying the contribution of pressure to shaping; normal pressure component , is a non-negative real field, from the second-order pressure field Decomposed normal component; normal displacement component , is a real field, and is the normal micro-displacement of the positioning interface during the shaping process.

[0082] Therefore, minimizing the shaping energy functional The process is to push the surface to a larger curvature radius in the wettable area with the least contact work, and at the same time improve the actual adhesion contribution of the interface; thus, the surface transitions from a sharp corner to a smooth connection, avoiding stress concentration in subsequent thermal cycles. Wetting coverage The same interface curve is discretized to generate a shaping curvature set, which is recorded in the same coordinates as the pressure sampling set, so that the interface shaping results can be derived from a unified set expression. By combining curvature, adhesion and contact work, the shaping behavior has a clear energy direction and a measurable goal, avoiding local flattening that relies solely on experience.

[0083] The smoothness of the surface is not enough to ensure long-term stability. It is also necessary to improve the bonding work and stress release path. To this end, a bonding sufficiency index is defined based on the shaping curvature set, so that the interlayer bonding state is no longer a fuzzy judgment, but a calculable and comparable quantity. Settings:

[0084] Where: Combination sufficiency index , is a real number that measures the quality of the inter-layer combination state; the combination weight coefficient , is a positive real number, strengthening the positive contribution of adhesion and wetting to the bonding; stress weight coefficient , is a positive real number, representing the adverse effect of tensile stress on the bond; tangential equivalent stress , is a non-negative real field, describing the interface tangential residual component; Shear coupling factor , is a positive real number, mapping the shear effect to the equivalent failure tendency; combined with the weight , is a positive real field, which improves the combination requirements in the key transition area.

[0085] Thus, improving the combination sufficiency index The process is to promote more complete adhesion and wetting coverage on the shaped surface, and try to transfer the tangential residual stress from the interface to a safer area in the body at the end of the second process; Pressure consistency index and dissipation potential energy The optimization direction of the sufficiency index is coordinated, without sacrificing the dissipation efficiency or introducing new stress concentration at the compression boundary. Combine the result with the shaping curvature and write it into the interface shaping result, and record the interlayer bonding state with the same name, which will serve as the direct source for recording to the pressing parameter card in step 4.

[0086] Combined adequacy index The bonding advancement and stress pre-distribution are written as a unified indicator to make the inter-layer bonding status comparable and traceable, which is convenient for subsequent stabilization and non-destructive confirmation comparison.

[0087] Step 3 is carried out around the soft pressure surface combination of two-process integration and interface shaping. First, the position of the embedded copper parts, the air outlet state of the guide channel, and the interface wetting state are taken as the same set of input constraints, and then the pressure consistency index is used. Organize the soft pressure surface combination to transmit pressure compliantly to dissipate potential energy Maintain the priority of the gas outlet on the channel, and then use the shaping energy functional Unify curvature, adhesion and contact work, and finally use the combined sufficiency index This quantitative characterization of the interlayer bonding state is achieved through the coordinated application of pressure transmission, gas venting priority, and surface shaping. Without changing the material system, this process drives the interface toward stability through a reasonable force and rheological order, thereby maintaining consistency and reproducibility under mass production conditions.

[0088] Without introducing any new disturbances, the removable retaining layer is removed, and the residual stress and rheological memory are slowly released through a controlled steady-state path, so that the position of the embedded copper part converges stably at the positioning interface; the interface shaping results and the interlayer bonding state are compared for consistency with the same coordinates and semantics through non-destructive imaging and field mapping, and the key quantities required for the comparison are uniformly deposited on the pressing parameter card together with early records such as the connectivity status of the guide channel and the initial positioning information of the embedded copper part.

[0089] Step 4: After removing the removable retaining layer and performing the stabilization process, the interface shaping results and the interlayer bonding state are updated with the non-destructive confirmation results of the same reference, thereby forming a consistency record and strategy entry that can be directly written into the pressing parameter card.

[0090] If the finished product is released directly after the second process, the untreated adhesion residue and shear memory may be reactivated under subsequent thermal loads, inducing micro-drifting of the embedded copper parts and re-cracking of the interface; at the same time, if the non-destructive confirmation only performs morphological interpretation without mapping with the same-name quantity in step three, the traceability of the interface shaping results will be weakened. To this end, it is necessary to remove the removable holding layer in a reversible manner, reduce the residual stress energy with a multi-dimensional path of time-temperature-load, and correspond the imaging quantity with the predicted quantity in step three with a consistency index, thereby turning the judgment of the interlayer bonding state into a symbol-driven comparison. The removable holding layer requires low residue, temperature-controlled release or mechanical peeling, and no damage to the positioning interface coating; the removal process records the tangential displacement trajectory to the removal record set with the same reference; First, under the geometric constraints specified by the holding position of the embedded copper part, the removable retaining layer is removed along a controlled path, and the contact energy change and tangential disturbance are recorded simultaneously; then, based on the curvature and wetting distribution of the interface shaping results, a steady-state path is selected to dissipate the residual stress energy and maintain the connectivity advantage of the guide channel; finally, non-destructive imaging is used to map the measured curvature, wetting coverage and bonding adequacy to a reference consistent with step three, completing the consistency evaluation and item precipitation of the pressing parameter card.

[0091] Under the premise that the copper insert holds the position as a geometric constraint, the process of removing the removable holding layer is designed as a controlled path, the goal of which is to release the holding effect without destroying the interface shaping results.

[0092] In order to make the path calculable and evaluable, the detachment path action is defined, taking into account the detachment rate, interface adhesion work change and tangential micro-displacement. Therefore, the following formula is introduced to define the detachment path action: :

[0093] Where: escape path parameter , including detachment progress, peeling angle, detachment load instruction and temperature range instruction, etc., which are continuous differentiable functions that characterize the process trajectory of removing the detachable holding layer; path rate , describing the instantaneous rate of detachment; the change of adhesion work , describing the release of adhesion energy along the path; tangential micro-displacement ,, describes the interface tangential disturbance; path rate weight , is a positive real number, suppressing the impact caused by too fast separation; Adhesion Release Weight , is a positive real number, which limits the stability of adhesion energy release; the tangential perturbation weight , is a positive real number, penalizing the accumulation of tangential disturbances; the termination moment of departure , is a positive real number that describes the length of time for the removal process.

[0094] Therefore, when the amount of escape path is reduced When planning the removal strategy for the criterion, the detachment rate, adhesion release and tangential disturbance are synchronously constrained to ensure that the position of the embedded copper part will not deviate from the previous embedded copper part holding position due to sudden micro-slip. Tangential micro displacement The data is discretized into a time series and aligned with the reference coordinates of the initial positioning information of the embedded copper part. A removal record set is written, which contains the change in adhesion work and micro-displacement trajectory, providing input for subsequent steady-state optimization.

[0095] By deviating from the path action The removal action is constrained to a smooth and reversible path, so that the removal of the detachable holding layer no longer depends on experience, avoiding secondary perturbations to the interface shaping results. After the removal is completed, based on the curvature and wetting distribution recorded in the interface shaping results, a steady-state path is selected that can dissipate the residual stress energy without destroying the connectivity of the guide channel. To this end, the residual energy functional is constructed by combining the stress energy density integral with the time weight kernel. :

[0096] Where: stress tensor field , is a symmetric second-order tensor field, describing the instantaneous stress during the steady-state process; the compliance tensor , is a fourth-order positive definite tensor that maps stress to energy density; the path weight kernel , is a positive function, according to the temperature path parameter Adjust the energy decay rate; structural domain , is the geometric area, the integration domain; the stabilization termination time , is a positive real number, describing the steady-state time course.

[0097] Thus, reducing the residual energy functional Means that along the escape path parameter Select a more favorable temperature-load sequence to make the stress tensor field Gradually attenuate and make the copper embedding position close to the copper embedding position. In practice, the position convergence curve is recorded in the same coordinate system, and the difference vector of the terminal copper embedding position and the previous benchmark is calculated as the core field of the steady-state record set; at the same time, the connectivity of the guide channel is checked to ensure that it is not blocked. The steady-state transformation is transformed from empirical insulation to planning with energy attenuation as the goal, so that the position and stress converge synchronously and the channel advantage is preserved.

[0098] After stabilization, the measured curvature and wetting coverage need to be mapped to a reference consistent with the interface shaping results, and the measured interlayer bonding state needs to be quantitatively compared with the previously calculated bonding sufficiency index.

[0099] To this end, a consistency index with Bregman divergence as the core is introduced to comprehensively measure the deviation of curvature, wetting and binding amount, so the consistency index is defined as :

[0100] Where: , Bregman divergence , metric two fields in convex generators Deviation under the measured curvature radius field , is a positive real number field, the curvature radius distribution obtained by non-destructive imaging; refer to the curvature radius field , is a positive real field, which comes from the curvature radius distribution of the interface shaping result; Wetting weight coefficient , is a positive real number, the importance of the balanced wetting term; the measured wetting coverage field , a real number field ranging from 0 to 1, the wet coverage distribution estimated by non-destructive imaging; refer to the wet coverage field , is a real number field from 0 to 1, the coverage distribution of the interface wetting state mapping; combined with the weight coefficient , is a positive real number, which improves the influence of combination deviation; the measured combination sufficiency index , is a real number, the bonding index obtained by non-destructive measurement; Therefore, reducing the consistency index This means that the measured field and the reference field are highly consistent under the same reference; thus, the imaging result is no longer an isolated picture, but a field that can directly update the interface shaping result and the interlayer bonding state. Write lossless confirmation set and The same coordinates are superimposed to facilitate subsequent parameter precipitation. Convert the results of non-destructive imaging into comparable numerical objects, making consistency an optimizable and traceable quantity.

[0101] Once the non-destructive confirmation set and the steady-state record set are complete, the quantities directly related to process decisions need to be deposited into the pressing parameter card in a unified format, and strategy entries and confidence levels that can be referenced for subsequent batches are provided. To this end, a strategy vector and mapping operator are defined to aggregate key objects into a parameter-transferable structure, and then calculate the confidence level:

[0102] Where: parameter card entry vector , is a vector, a set of callable entries in the compaction parameter card; Strategy Mapping Operator , mapping the strategy vector into entries, which can be in the form of linear-projection combination method, anisotropic kernel convolution + statistical summary, Bregman center of gravity summary and atlas topology mapping; strategy vector , carrying key objects; Adaptive Mapping , is a positive real field that characterizes the pressure compliance of the soft pressure surface combination; its specific form can be anisotropic Helmholtz type (PDE continuous form), anisotropic kernel convolution (Green kernel / Gaussian kernel implementation) or discrete matrix type (finite element / image grid implementation); Target pressure distribution , is a non-negative real number field, target pressure reference; two-way pressure field , is a non-negative real field, actual pressure distribution; connectivity , a real number between 0 and 1, is the core quantity of the channel connectivity state; connectivity function , represents the topology of the guiding channel; the grip coefficient , is a positive real number, representing the anti-interference ability of the circumferential groove; Holding stability index , is a non-negative real number, describing the holding effect of the detachable holding layer; the interface curvature radius , is a positive real field, the curvature of the interface shaping result; wetting coverage , is a real number field ranging from 0 to 1, representing the coverage of the interface wetting state. To facilitate process release, the confidence level is defined as a joint quantification of consistency and residual energy:

[0103] Where: consistency confidence , a real number between 0 and 1, expressing the reliability of the parameter entry; consistency weight , is a positive real number, regulating the influence of the consistency index; the residual energy weight , is a positive real number that adjusts the influence of residual energy; Therefore, by parameter card entry vector and consistency confidence The combined output of the press parameter card not only records items with consistent object names and clear meanings, but also includes confidence information that can be used to determine release thresholds. Items and confidence levels are referenced alongside the copper insert position, interface shaping results, and interlayer bonding status, allowing for direct reference for subsequent batches of the same type. Mapping and confidence levels consolidate scattered fields into meaningful items, ensuring the transferability of the press parameter card across batches.

[0104] Focusing on steady-state processing, non-destructive confirmation and parameter precipitation, first of all, the amount of action of the escape path The removal of the detachable holding layer is defined as a smooth and reversible process, and then the residual energy functional Stabilization is planned as an energy decay task, ensuring the convergence of the copper insert's position on the positioning interface while maintaining the connectivity of the guide channel. Through removal, stabilization, and non-destructive comparison, the reference is established as releasable evidence and a reusable item. Without changing the material system, a highly reproducible post-pressing processing chain is constructed through the triple perspectives of path, energy, and mapping.

[0105] Convert the lossless confirmation set, the steady-state record set, the interface shaping results, the interlayer bonding state and other equivalent quantities into release strategy items and reuse strategy items, together with the consistency confidence Write the pressing parameter card as a record for reference.

[0106] If release and reuse still rely on manual experience, the previous efforts to guide the channel connectivity status and the position of the embedded copper parts will be difficult to reflect consistent decision results; at the same time, if the pressure consistency index is not and dissipation potential energy When the release side is introduced, the morphology may be smooth but the residual energy is still high, which will induce the slow drift of the position of the embedded copper parts during subsequent thermal loads.

[0107] To this end, it is necessary to integrate the energy dimension and the consistency dimension with a resolvable decision function so that release and reuse have the same input name, the same semantics, and the same output format. Therefore, this step compresses the multi-source dimensions with an exponential mapping and controls the migration distance of the strategy with a divergence measure, thereby completing a computable transition from measured quantities to release items without introducing additional materials and equipment.

[0108] First, include the adaptive mapping , target pressure distribution , two-way pressure field The strategy vector including the following is taken as input, combined with the consistency confidence Construct a release judgment function to make the pressure consistency index and dissipation potential energy Get explicit trade-offs; then use the parameter card entry vector with reference entry vector The Bregman divergence between them generates a reuse score, and the visibility level of the reused items is determined accordingly; finally, the judgment value, score and key homonymous quantity are written into the pressing parameter card to form a field that can be directly called for subsequent batches. Release must be carried out after objective evidence is obtained for the interface shaping results and the interlayer bonding state, while considering the energy and channel information from step three. In order to avoid mutual masking of multiple factors, the pressure mismatch and outgassing disadvantage are compressed in the form of exponential decay, and then compared with the consistency confidence. Multiplication generates the judgment value, so the release judgment function is defined:

[0109] Where: Release judgment value , a real number between 0 and 1, measures whether the position and interface shaping results of this batch of embedded copper parts can be released; Pressure item weight , is a positive real number, adjusting the pressure consistency index Impact on judgment; channel item weight , is a positive real number, regulating the dissipation potential energy Impact on judgment; Therefore, when the nondestructive confirmation set gives a curvature radius consistent with the interface shaping result Wetting coverage and consistency confidence When it is higher, the release judgment value Pressure consistency index and dissipation potential energy The value of the decision-making process increases with the decrease of the threshold, thereby providing a single-value statement for release; thus, release no longer depends on a combination of discrete thresholds, but is integrated into a continuous and comparable decision-making quantity.

[0110] In terms of processing method, the pressure sampling set is mapped with the reference , using the second-pass integration input package to map out , and Combined adequacy index As a supporting field, it is combined to form a release strategy entry and written into the pressing parameter card. The three dimensions of energy, pressure and channel are converged into a single decision quantity, so that the release has the characteristics of homonymous input, synonymous output and commensurability.

[0111] Batch-to-batch process migration requires determining the current parameter card entry vector with reference entry vector Will the difference in the guide channel connectivity and the prior results of the copper insert position maintenance be destroyed? To balance directionality and interpretability, Bregman divergence is used to characterize the item differences, and exponential mapping compression is used as the reuse score, so the definition is:

[0112] Where: reuse score , a real number between 0 and 1, measuring the degree of reusability of the current batch of entries to the reference entries; scatter compression coefficient , is a positive real number that adjusts the attenuation strength of the divergence in the score; : Bregman divergence , is a non-negative real number, in the convex generator The directional gap of the measurement entry vector is: , is a vector,from the reference set of the same product family or the best,historical batch.

[0113] Furthermore, the reuse score As the main criterion, the visibility level of the reuse strategy entry is marked on the compression parameter card. Higher release decision value If the value remains high, it indicates that the current batch is consistent with the reference batch in terms of positioning interface morphology, channel topology and pressure transmission law, and is suitable for execution according to the reference item; then, when the reuse score Decline but combined with adequacy index If the performance is still good, the reuse can be limited to the selection items of the soft pressure surface combination, while the cautious call of the pre-infiltration resin related items is retained. and Align, calculate Bregman divergence Then write the reuse score and compare it with the release decision value Together, they trigger the automatic annotation of the item's visible level. Transforming the feasibility of cross-batch migration into a comparable score makes reuse no longer an empirical replication, but a selective activation based on divergence.

[0114] Release judgment value Convergent consistency confidence The key physical quantities of the second process ensure that the force and dispersion results on the positioning interface are equivalently translated into release evidence; the reuse side is scored by reuse Set the parameter card entry vector with reference entry vector Directional deviations are translated into visible annotations, ensuring clear scope and order for cross-batch item migration. This provides a directly usable basis for subsequent batch production and a traceable, semantically stable carrier for subsequent statistics or audits. By solidifying strategies through judgment and divergence, we achieve verifiable, reusable, and mass-production-oriented post-pressing processing conclusions without changing the material system.

[0115] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0116] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0117] In the several embodiments provided in this application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are merely schematic. For example, the division of the units is only for some logical functions. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0118] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0119] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. Double-pass vacuum lamination process for hybrid substrate multi-layer copper embedded PCB, characterized by: include, A positioning interface is formed around the copper embedding groove, a guide channel is set on the groove wall and the groove bottom, and a circumferential groove is machined on the outer periphery of the copper embedding part. The copper embedding part is lightly held by a detachable holding layer, and the initial positioning information of the copper embedding part and the communication status of the guide channel are simultaneously recorded; Pre-filling the bottom and periphery of the guide channel with pre-infiltrated resin, maintaining the removable retaining layer under reduced pressure; confirming the retaining position of the copper insert and the air stagnation identification mark based on the air outlet state and interface wetting state of the guide channel and recording them simultaneously; The soft pressing surface combination is replaced to perform a second pressing process, so that the pressure is transmitted to the positioning interface and the resin is discharged along the guide channel; the position of the embedded copper part, the gas outlet state of the guide channel, the wetting state of the interface, and the gas stagnation identification mark are used as input to generate the interface shaping result and the interlayer bonding state; After removing the removable retaining layer, the stabilization treatment is performed and non-destructive confirmation is performed. The position of the copper embedment is compared with the interface shaping result, and the interlayer bonding state is written into the pressing parameter card. The initial positioning information of the copper embedment and the connectivity state of the guide channel are archived.

2. The double-pass vacuum lamination process for a hybrid substrate multi-layer copper-embedded PCB according to claim 1, characterized in that: The positioning interface is micro-etched or plasma cleaned to remove surface contamination to form a clean contact surface; The guide channel verifies the continuity of the groove wall and the groove bottom, and uses the same tooling reference coordinate to record the connectivity status of the guide channel. The initial positioning information of the embedded copper part is archived synchronously with the reference coordinate.

3. The double-pass vacuum lamination process for a hybrid substrate multi-layer copper-embedded PCB according to claim 2, characterized in that: The guide channel is formed by machining or laser processing and avoids the key route leading to the outer edge. The circumferential groove is evenly distributed along the periphery of the positioning interface and is consistent with the groove wall morphology; The initial positioning information of the copper inlay includes a position vector, an initial positioning error and a grip coefficient, and is associated with the connectivity state of the guide channel.

4. The double-pass vacuum lamination process for a hybrid substrate multi-layer copper-embedded PCB according to claim 3, characterized in that: The detachable holding layer is made of a material with low residue and capable of temperature-controlled release or mechanical peeling, and is disposed at the bottom of the groove near the positioning interface to lightly hold the embedded copper part; When removing, the holding position is released along the preset path and recorded as a removal record set with the same reference coordinates. The holding position of the copper inlay is continuously measured before and after removal.

5. The double-pass vacuum lamination process for a hybrid substrate multi-layer copper-embedded PCB according to claim 4, characterized in that: The pre-infiltration resin is compatible with the mixed medium and the surface of the embedded copper part, and has low volatility and controllable rheology; Under reduced pressure conditions, the bottom and periphery of the groove are first filled along the guide channel, and the gas outlet state and interface wetting state of the guide channel are recorded with the same reference, and the copper embedding holding position and the gas stagnation identification mark are generated according to binary rules.

6. The double-pass vacuum lamination process for a hybrid substrate multi-layer copper-embedded PCB according to claim 5, characterized in that: The soft pressure surface assembly is composed of a compliant cushion layer, an isolation medium and a pressure-bearing sheet, and is placed in the corresponding area of ​​the positioning interface to form a compliant pressure transmission; In the second-pass pressing, the second-pass pressure field is collected and a pressure sampling set is formed, and at the same time, it is merged with the compliance map, the target pressure distribution and the connectivity state of the guide channel to generate a second-pass integrated input package.

7. The double-pass vacuum lamination process for a hybrid substrate multi-layer copper-embedded PCB according to claim 6, characterized in that: Performing shaping on the positioning interface based on the second-process integration input package to obtain a shaping curvature set consisting of an interface curvature radius and a wetting coverage, and deriving the interface shaping result at the same reference coordinate; The inter-layer bonding status and the bonding sufficiency index are calculated simultaneously, all recorded in fields with the same name.

8. The double-pass vacuum lamination process for a hybrid substrate multi-layer copper-embedded PCB according to claim 7, characterized in that: After removing the detachable retaining layer, a stabilization process is performed, and stress attenuation and position convergence curves are recorded at the same reference coordinate according to a predetermined temperature range and load sequence to form a stabilization record set; at the same time, the connectivity state of the guide channel is checked to remain connected and archived synchronously.

9. The double-pass vacuum lamination process for a hybrid substrate multi-layer copper-embedded PCB according to claim 8, characterized in that: Non-destructive imaging is used to obtain the measured curvature radius and the measured wettability at the same reference coordinates, and mapping and comparing them with the corresponding fields of the shaping curvature set to generate a non-destructive confirmation set; and a one-to-one reference relationship is established between the measured interlayer bonding state and the corresponding fields of the interface shaping result.

10. The double-pass vacuum lamination process for a hybrid substrate multi-layer copper-embedded PCB according to claim 9, characterized in that: The non-destructive confirmation set and the stabilization record set as well as the interface shaping results, the interlayer bonding state, the second-process pressure field and other equivalent quantities are uniformly written into the pressing parameter card; The pressing parameter card is solidified to include items such as release judgment value, reuse score and consistency confidence, pre-infiltration release degree, wetting potential, wetting mapping, and stability index, and is associated with the initial positioning information of the embedded copper part and the connectivity status of the guide channel.

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