Substrate separation apparatus, substrate processing apparatus and substrate separation method

Abstract

The invention provides a substrate separating apparatus, a substrate processing apparatus, and a substrate separating method, which can supply fluid to the periphery of a bonded substrate with good position precision and perform reliable separation. A substrate separation device 1 according to an embodiment is provided with: a holding unit 10 that holds and rotates a bonded substrate S to which a pair of substrates Sa, Sb are bonded; a nozzle 30 that separates the bonded substrate S by discharging a fluid toward the outer periphery of the rotating bonded substrate S; and a nozzle drive unit (40) that changes the ejection direction of the fluid from the nozzle (30) between a first direction, which is a direction along a tangent line to the outer periphery of the bonded substrate (S), and a second direction, which is a direction toward the center of the bonded substrate (S).

Description

Technical Field

[0001] The present invention relates to a substrate separation device, a substrate processing device and a substrate separation method. Background Art

[0002] In the manufacturing process of a three-dimensional semiconductor device, a technique of bonding and separating two substrates is used to copy a layer formed on one substrate to the other substrate, thereby forming a uniform thin film.

[0003] As a technology for separating such substrates, the following technology has been proposed: the opposite surfaces of a bonded substrate, which is composed of two substrates bonded together, are adsorbed and held by clamping with a pair of fixtures, and high-pressure water (water jet) is supplied from a nozzle toward the outer periphery of the bonded substrate while the substrate is rotated, thereby utilizing the wedge effect of the fluid to separate the bonded substrates.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 2002-353081 Summary of the Invention

[0007] Problems to be solved by the invention

[0008] The fluid supplied from the nozzle to the periphery of the bonded substrate as a water spray expands in a spray shape from the nozzle outlet. Therefore, if the distance between the nozzle and the periphery of the bonded substrate is large, it is difficult to supply the fluid to the appropriate position of the bonded substrate with good positional accuracy.

[0009] The present invention is made to solve the above-mentioned problems, and its object is to provide a substrate separating apparatus, a substrate processing apparatus, and a substrate separating method that can supply a fluid to the periphery of a bonded substrate with good positional accuracy and perform reliable separation.

[0010] Technical means to solve the problem

[0011] An embodiment of the present invention comprises: a holding portion for holding and rotating a bonded substrate to which a pair of substrates are bonded; a nozzle for separating the bonded substrates by ejecting a fluid toward the periphery of the rotating bonded substrate; and a nozzle driving portion for changing the ejection direction of the fluid from the nozzle between a first direction along a tangent line of the periphery of the bonded substrate and a second direction toward the center of the bonded substrate.

[0012] A substrate processing apparatus according to an embodiment includes: the substrate separating apparatus; and a surface processing apparatus for processing a surface of the separated substrate.

[0013] The substrate separation method of the embodiment includes: a rotation process, in which a holding part holds and rotates a bonded substrate to which a pair of substrates are bonded; a separation process, in which a liquid is ejected toward the periphery of the rotating bonded substrate through a nozzle to separate the bonded substrate; and a displacement process, in which a nozzle driving part changes the ejection direction of the fluid from the nozzle between a first direction along a tangent line of the periphery of the bonded substrate and a second direction toward the center of the bonded substrate.

[0014] Effects of the Invention

[0015] According to the embodiment of the present invention, a fluid can be supplied to the periphery of the bonded substrate with good positional accuracy, and reliable separation can be performed. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] [ Figure 1 ] is a side view showing the separation process of the substrate separation device according to the embodiment.

[0017] [ Figure 2 ] is a top view of the bonding substrate and the positioning part when the bonding substrate is moved in.

[0018] [ Figure 3 ] is a top view of the bonding substrate and the positioning portion when the bonding substrate is positioned before the separation process.

[0019] [ Figure 4 ] is a top view showing the displacement of the nozzle to the standby position, separation start position, and center separation position.

[0020] [ Figure 5 ] is a top view showing the bonded substrate, positioning portion and nozzle in the middle of separation of the bonded substrate.

[0021] [ Figure 6 ] is a top view of the bonded substrate, positioning portion, and nozzle when the center of the bonded substrate is separated.

[0022] [ Figure 7 ] is a flowchart showing the procedure for separating the bonded substrates of an embodiment.

[0023] [ Figure 8 ] is an explanatory diagram showing the steps of carrying in and separating the bonded substrates according to the embodiment.

[0024] [ Figure 9 ] is a top view showing a modified example of the displacement of the nozzle of the substrate separation device according to the embodiment.

[0025] [ Figure 10 ] is a top view of a substrate processing apparatus including a substrate separation apparatus according to an embodiment. DETAILED DESCRIPTION

[0026] The substrate separation device according to the embodiment will be described with reference to the accompanying drawings. The accompanying drawings are schematic diagrams, and the dimensions and ratios of the various parts are exaggerated for ease of understanding. Figure 1 As shown, the substrate separation device 1 is a device that separates the bonded substrates S by ejecting a fluid from a nozzle 30. Figure 1 The gripping portion 210 and the loading portion 220 located in the front are omitted. In the following description, the direction along the rotation axis of the laminated substrate S is referred to as the Z direction. In a plane perpendicular to the Z direction, the direction in which the fluid is ejected from the nozzle 30 is referred to as the Y direction, and the direction perpendicular thereto is referred to as the X direction. The rotation plane of the laminated substrate S is parallel to the XY plane. In this embodiment, the Z direction is the vertical direction, and the XY direction is the horizontal direction. However, the installation orientation of the substrate separation device 1 is not limited to this.

[0027] The bonding substrate S is a circular substrate formed by bonding a first substrate Sa and a second substrate Sb. The first substrate Sa has a bonding surface Sa1 and a surface Sa2 as the opposite side thereof. The second substrate Sb has a bonding surface Sb1 and a surface Sb2 as the opposite side thereof. That is, the bonding substrate S has a surface Sa2 and a surface Sb2, which are a pair of circular surfaces and are exposed surfaces on the opposite sides of the bonding surfaces of the first substrate Sa and the second substrate Sb. The first substrate Sa is, for example, a substrate on which a porous layer is formed on the surface of a semiconductor wafer, and a single crystal Si layer is further formed thereon. The second substrate Sb is, for example, a substrate on which a single crystal Si layer is formed on the surface of a semiconductor wafer. Such a first substrate Sa and the second substrate Sb are bonded via an insulating layer formed on the first substrate Sa or the second substrate Sb, thereby forming a bonding substrate S. In the following description, even if the first substrate Sa and the second substrate Sb are separated, the substrate is referred to as the bonded substrate S if the bonding surface Sa1 and the bonding surface Sb1 are overlapped.

[0028] The substrate separation device 1 separates the first substrate Sa from the porous layer of the bonded substrate S and forms a multi-layered single-crystal Si layer on the second substrate Sb. The substrate separation device 1 includes a holding unit 10, a positioning unit 20, a nozzle 30, a nozzle driving unit 40, a displacement detection unit 50, and a control device 100.

[0029] [Maintaining Department]

[0030] The holding unit 10 holds and rotates both surfaces (Sa2 and Sb2) of the laminated substrate S. The holding unit 10 includes a first holder 110 and a second holder 120 .

[0031] (First Fixer)

[0032] The first fixture 110 includes a first holding body 111 and a support mechanism 112. The first holding body 111 is a circular plate having a diameter smaller than the diameter of the surface to which the substrate S is bonded. The support mechanism 112 is connected to the center of the surface of the first holding body 111 via a support shaft 112a extending in the Z direction, rotatably supporting the first holding body 111 so that its center serves as the rotation center Ct. In this embodiment, the support shaft 112a is connected to a drive source for rotating the second holding body 121, described later, via a pulley and a timing belt, and rotates synchronously with the second holding body 121.

[0033] In this embodiment, the surface of the first holding member 111 fixed to the support shaft 112a faces upward, with the opposite surface facing downward. Furthermore, although not shown, the first holding member 111 includes a suction hole that opens on the surface that contacts the lamination substrate S. An exhaust device is connected to the suction hole, allowing one surface of the lamination substrate S (the exposed surface Sa2 of the first substrate Sa) to be sucked and held using negative pressure.

[0034] (Second Fixer)

[0035] The second fixture 120 includes a second holding body 121, a rotation drive unit 122, and a loading and unloading drive unit 123. The second holding body 121 is a circular plate having the same diameter as that of the first holding body 111. The rotation drive unit 122 rotates the bonded substrate S. A drive shaft 122a in the Z direction of the rotation drive unit 122 is connected to the center of the second holding body 121, and supports the second holding body 121 so that it can rotate. The rotation drive unit 122 includes a motor as a driving source for rotating the second holding body 121. The drive shaft 122a is the shaft of the motor, and the second holding body 121 rotates around the rotation center Ct as the motor operates.

[0036] In this embodiment, the surface of the second holding body 121 mounted on the drive shaft 122a is downward, and its opposite surface faces upward, facing the first holding body 111. That is, the first holding body 111 and the second holding body 121 are spaced apart and arranged facing each other with their rotation centers Ct aligned. Furthermore, although not shown, a suction hole is formed in the second holding body 121 on the surface that contacts the laminating substrate S. An exhaust device is connected to the suction hole, allowing the other surface of the laminating substrate S (the exposed surface Sb2 of the second substrate Sb) to be sucked and held using negative pressure.

[0037] The attachment / detachment drive unit 123 causes the holding unit 10 to hold the bonded substrate S. The attachment / detachment drive unit 123 moves the second holding member 121 in a direction of contact with and separation from the first holding member 111. The attachment / detachment drive unit 123 includes an air cylinder as a drive source. The bonded substrate S is inserted between the first and second holding members 111, 121, and the attachment / detachment drive unit 123 moves the second holding member 121 closer to the first holding member 111, thereby clamping and holding the bonded substrate S between the first and second holding members 111, 121.

[0038] [Positioning Department]

[0039] The positioning unit 20 positions the center Cs of the bonded substrate S at the rotation center Ct (see FIG. Figure 2 、 Figure 3 That is, the center Cs of the bonded substrate S, which is positioned between the first holding member 111 and the second holding member 121, is aligned with the rotation center Ct of the first holding member 111 and the second holding member 121. The positioning unit 20 includes a gripping portion 210, a placement portion 220, an axial drive portion 230, and an opening and closing drive portion 240.

[0040] (Grip)

[0041] The gripping portion 210 grips the outer periphery of the laminated substrate S. The outer periphery of the laminated substrate S is the side surface along the outer edge of the circumference. Multiple gripping portions 210 are arranged at equal intervals around the holding portion 10, i.e., along the outer periphery of the laminated substrate S held by the holding portion 10. In this embodiment, the gripping portions 210 are four upright pins.

[0042] (Loading section)

[0043] The loading section 220 loads the laminated substrate S. The loading section 220 has a loading surface that supports the laminated substrate S and is mounted with the gripping sections 210. Four loading sections 220 are provided, corresponding one to each gripping section 210. In this embodiment, the surface of the laminated substrate S held by the second holder 120, i.e., the exposed surface Sb2 of the second substrate Sb, is loaded.

[0044] (Axial drive unit)

[0045] The axial drive portion 230 moves the holding portion 210 and the loading portion 220 in an axial direction parallel to the rotation axis of the holding portion 10. The axial drive portion 230 includes a support portion 231, a force-applying portion 232, and an absorbing portion 233. The support portion 231 is a component that supports and stands upright the holding portion 210 and the loading portion 220 at the front end. The force-applying portion 232 is configured to be movable in the axial direction by a driving mechanism such as a cam that is rotated by a cylinder. The absorbing portion 233 is located between the force-applying portion 232 and the support portion 231, transmits the movement of the force-applying portion 232 to the support portion 231, and absorbs the vibration of the bonding substrate S. The absorbing portion 233 only needs to be able to absorb vibration, so for example, a compression spring, a leaf spring, an elastomer of rubber or resin, a cylinder, etc. can be used.

[0046] The opening and closing drive unit 240 moves the gripping unit 210 and the loading unit 220 between a closed position in which the gripping unit 210 is in contact with the outer periphery of the laminating substrate S, and an open position away from the outer periphery of the laminating substrate S. The gripping unit 210 is positioned so that the center Cs of the laminating substrate S is positioned at the rotation center Ct when the gripping unit 210 is in the closed position. The opening and closing drive unit 240 includes an arm 241, which moves in the radial direction of the laminating substrate S (centripetal and centrifugal directions relative to the rotation center Ct) by a drive mechanism such as a cam that rotates using a cylinder (not shown). The support unit 231 is connected to the arm 241 so as to be movable in the axial direction.

[0047] [nozzle]

[0048] The nozzle 30 separates the bonded substrate S into substrate Sa and substrate Sb by ejecting fluid toward the periphery of the rotating bonded substrate S. The nozzle 30 of this embodiment ejects fluid toward the periphery of the bonded substrate S held and rotated by the holding portion 10, and then ejects fluid toward the periphery of the bonded substrate S while it is positioned and stopped by the positioning portion 20.

[0049] The nozzle 30 of this embodiment is a spraying device for water jet processing that realizes processing by spraying water (water jet) as a high-pressure fluid onto an object. The nozzle 30 is connected to a supply device 31 including a pump for supplying high-pressure water via piping and valves. The nozzle 30 is configured to be able to spray high-pressure fluid, and the aperture is an extremely small diameter (0.1 mm to 1 mm). The wall thickness of the front end of the nozzle 30 has a thickness that can withstand high-pressure water (1 cm to 5 cm). Figure 4 As shown, the nozzle 30 has a nozzle opening at its front end disposed in a direction toward the outer periphery of the laminated substrate S, and the axis of the nozzle 30 is parallel to the rotation plane of the laminated substrate S.

[0050] [Nozzle drive unit]

[0051] like Figures 4 to 6As shown, the nozzle driving unit 40 changes the ejection direction of the fluid from the nozzle 30 between a first direction along a tangent line of the outer periphery of the laminated substrate S and a second direction toward the center Cs of the laminated substrate S. The nozzle driving unit 40 of this embodiment can move the nozzle 30 in a direction along the outer periphery of the laminated substrate S. The nozzle driving unit 40 includes a contact / separation mechanism 41 and a position adjustment mechanism 42.

[0052] (Contact / Separation Mechanism)

[0053] The contact / separation mechanism 41 reciprocates the nozzle 30 along the radial direction of the laminated substrate S and in the direction of contact with and separation from the outer periphery of the laminated substrate S. The contact / separation mechanism 41 of this embodiment moves the nozzle 30 along the Y direction. The contact / separation mechanism 41 can use, for example, a ball screw mechanism driven by a servo motor.

[0054] (Position adjustment mechanism)

[0055] The position adjustment mechanism 42 positions the nozzle 30 at a separation start position (see FIG. 1 ) along a tangent line of the outer periphery of the laminated substrate S held and rotated by the holding portion 10. Figure 4 The position of the nozzle 30 of the solid line), and the center separation position toward the center Cs of the bonding substrate S (refer to Figure 6 That is, the nozzle 30 moves along the X direction by the position adjustment mechanism 42. The position adjustment mechanism 42 can use a ball screw mechanism driven by a servo motor, for example.

[0056] By means of the contact / separation mechanism 41 and the position adjustment mechanism 42, as Figure 4 As shown, the nozzle 30 can move from the separation start position [a] to the center separation position [b] along an arc trajectory. Figure 4 The fluid is blown onto a portion of the periphery of the bonded substrate S shown in Ra. The so-called portion is an area of ​​a circular arc with a central angle of 90 degrees on the periphery of the bonded substrate S. In addition, the bonded substrate S rotates at least during the separation process of the periphery, so even if the fluid is sprayed onto a portion of the periphery, the sprayed fluid can reach the entire periphery. Moreover, as the bonded substrate S separates, the fluid also reaches the central part of the bonded substrate S from the gap between the first substrate Sa and the second substrate Sb. Before and after the separation of the bonded substrate S begins, the nozzle 30 is moved to the standby position [c] separated from the periphery of the bonded substrate S by the contact / separation mechanism 41 and the position adjustment mechanism 42.

[0057] The distance d between the ejection port of the nozzle 30 in the first direction and the periphery of the laminated substrate S is the same as the distance d between the ejection port of the nozzle 30 in the second direction and the periphery of the laminated substrate S. Thus, the ejection port of the nozzle 30 in the first direction and the ejection port of the nozzle 30 in the second direction can be brought as close to the periphery of the laminated substrate S as possible.

[0058] [Displacement detection unit]

[0059] like Figure 1 As shown, the displacement detecting unit 50 detects the change in the surface position of the bonded substrate S when the fluid is ejected through the nozzle 30. That is, the displacement detecting unit 50 detects the change in the surface position caused by the separation of the rotating bonded substrate S. The so-called change in surface position refers to the change in the position of at least any one of the substrate surfaces in the direction in which the first substrate Sa and the second substrate Sb are opened when the separation is carried out (in the height direction in the case of this embodiment). When the separation is carried out, the first substrate Sa and the second substrate Sb are separated, and the ends of each become a warped shape. That is, by detecting the change in the surface position of the bonded substrate S, the separation condition of the bonded substrate S can be detected. The displacement detecting unit 50 can use a sensor that detects the surface position of the bonded substrate S in a non-contact manner, such as a laser displacement sensor. The laser displacement sensor is a reflective sensor that detects the position of an object by using a light-receiving element to receive the reflected light of the laser light irradiated on the surface of the bonded substrate S. In addition, the laser displacement sensor can detect the position of the object in the desired area by scanning the surface. In this embodiment, the laser displacement sensor is detected by scanning from the periphery toward the center Cs. Figure 4 The position of the surface of the bonded substrate S in the sector-shaped area shown by Rb is detected.

[0060] The displacement detection units 50 are arranged one at each position sandwiching the laminated substrates S, so as to detect the surface positions of both surfaces of the laminated substrates S. In this embodiment, the displacement detection unit 50A mounted on the support mechanism 112 detects the position of the upper surface of the laminated substrate S (the exposed surface Sa2 of the first substrate Sa), and the displacement detection unit 50B mounted on the loading and unloading drive unit 123 detects the position of the lower surface of the laminated substrate S (the exposed surface Sb2 of the second substrate Sb).

[0061] [Control device]

[0062] The control device 100 controls the substrate separating apparatus 1 and controls the operations of the holding unit 10, positioning unit 20, nozzle 30, and nozzle driving unit 40. The control device 100 can be implemented by, for example, a dedicated electronic circuit or a computer running a predetermined program.

[0063] More specifically, the control device 100 controls the rotation and movement of the second holding body 121 by controlling the rotation drive unit 122 and the attachment and detachment drive unit 123. Furthermore, the control device 100 controls the movement of the gripping portion 210 and the placement portion 220 by controlling the axial drive unit 230 and the opening and closing drive unit 240. Furthermore, the control device 100 controls the discharge of fluid from the nozzle 30 and the movement of the nozzle 30 by controlling the supply device 31, the contact / separation mechanism 41, and the position adjustment mechanism 42.

[0064] In particular, the control device 100 of this embodiment controls the nozzle driving unit 40 based on changes in the surface position of the laminated substrate S detected by the displacement detection unit 50, thereby moving the nozzle 30. For example, the control device 100 detects the change in position at predetermined intervals or continuously through the displacement detection unit 50 and determines whether the detected change in position exceeds a predetermined threshold value, thereby determining the separation status of the laminated substrate S. If separation is determined, the nozzle driving unit 40 moves the nozzle 30 along the direction from the separation start position [a] toward the center separation position [b]. More specifically, for example, the displacement detection unit 50 detects the surface position of a portion of the laminated substrate S that covers at least one circumference, and if the change in position exceeds a predetermined threshold value, the nozzle 30 is moved. Alternatively, for example, the displacement detection unit 50 may detect the surface position of a portion of the laminated substrate S that covers at least one circumference, and if the average value of the change in position over the entire circumference exceeds a predetermined threshold value, the nozzle driving unit 40 moves the nozzle 30. Alternatively, for example, the nozzle may be moved if both the amount of change in the surface position of the first substrate Sa and the amount of change in the surface position of the second substrate Sb exceed a predetermined threshold value. Furthermore, for example, the nozzle 30 may be moved if the distance between the first substrate Sa and the second substrate Sb, calculated based on the surface positions of the first substrate Sa and the second substrate Sb, exceeds a predetermined threshold value. The predetermined threshold value is set based on the radial position of the bonded substrate S and is determined in advance through simulation or experimentation.

[0065] [action]

[0066] In the Figures 1 to 6 Based on the reference Figure 7 Flowchart, Figure 8 The operation of the substrate separation device 1 as described above is explained in the following diagram. Figure 8Ph1 is a fixed reference position of the lower surface of the first holding body 111, and Ph2 is the handover position, which is the position of the lower surface of the loading unit 220 when the loading unit 220 hands over the laminating substrate S to the robot M. Ps1 is the separation position, which is the height position of the lower surface of the second substrate Sb when the laminating substrate S is clamped by the first holding body 111 and the second holding body 121 and separated by the ejection of fluid from the nozzle 30 while being rotated. Ps2 is the receiving position, which is the position of the upper surface of the loading unit 220 when the positioning unit 20 receives the laminating substrate S from the holding unit 10.

[0067] First, the second holding body 121 is located at a position separated from the first holding body 111 ( Figure 8 (A)). In addition, the gripping portion 210 and the placing portion 220 are located at the handover position Ph2 and are also located at the open position. Figure 2 As shown, the robot arm M of the conveying device carries in the bonding substrate S and places the bonding substrate S on the placement portion 220 ( Figure 8 (B), step S101). The holding portion 210 is raised to raise the laminated substrate S ( Figure 8 (C) ), and then, the second holding body 121 rises and contacts the lower surface of the second substrate Sb, and the laminated substrate S is raised to be slightly separated from the mounting portion 220 ( Figure 8 (D), step S102).

[0068] like Figure 3 As shown, the gripping portion 210 is moved to the closed position to grip the periphery of the bonded substrate S, thereby positioning the center Cs of the bonded substrate S at the rotation center Ct ( Figure 8 (E), step S103). Afterwards, the grip portion 210 moves to the open position ( Figure 8 (F) ), retreats to the transfer position Ph2 together with the placement unit 220 ( Figure 8 (G), step S104). Then, the second holding body 121 rises, and the laminated substrate S is brought into contact with the first holding body 111 and held by clamping, so that the laminated substrate S is located at the separation position Ps1, and is sucked and held by the negative pressure of the suction hole ( Figure 8 (H), step S105).

[0069] In this state, the second holding body 121 is rotated to rotate the bonded substrate S together with the first holding body 111 (rotation process: step S106). Figure 4 As shown, the nozzle 30 moves from the standby position [c] to the separation start position [a] (step S107 ), and ejects the fluid toward the outer periphery of the bonded substrate S (separation process: step S108 ).

[0070] The displacement detection unit 50 detects the surface positions of the two surfaces of the bonding substrate S (detection process: step S109). When the control device 100 determines that the bonding surface Sa1 and the bonding surface Sb1 corresponding to the positions are separated (yes in step S110), as shown in FIG. Figure 5 As shown, the nozzle 30 moves in a manner that follows the separated area (shown by hatching in the figure). As the nozzle 30 moves, the detection position of the displacement detection unit 50 in the area Rb moves toward the center Cs of the bonded substrate S. (Displacement process: step S111). Figure 6 As shown, the nozzle 30 moves to the center separation position [b] and ejects fluid toward the center Cs via the periphery of the laminated substrate S. Then, when the control device 100 detects the elapse of a preset time until the center Cs is separated and determines that separation has reached the center Cs of the laminated substrate S (Yes in step S112), the ejection of fluid from the nozzle 30 is stopped (step S113). The rotation of the laminated substrate S is stopped by stopping the rotation of the first holding member 111 and the second holding member 121 (step S114).

[0071] Then, the negative pressure supplied to the first holding body 111 and the second holding body 121 is released, the second holding body 121 descends, and the bonded substrate S is transferred to the loading portion 220. The robot arm M of the conveying device pushes the bonded substrate S from the lower surface side of the bonded substrate S, and the robot arm M carries out the bonded substrate S (refer to FIG. Figure 8 (D) Figure 8 (C) Figure 8 (B), step S115).

[0072] [Effect]

[0073] (1) The substrate separation device 1 of this embodiment includes: a holding portion 10 for holding and rotating a bonded substrate S to which a pair of substrates Sa and Sb are bonded; a nozzle 30 for separating the bonded substrate S by ejecting a fluid toward the periphery of the rotating bonded substrate S; and a nozzle driving portion 40 for changing the ejection direction of the fluid from the nozzle 30 between a first direction along a tangent line of the periphery of the bonded substrate S and a second direction toward the center Cs of the bonded substrate S.

[0074] In addition, the substrate separation method of this embodiment includes: a rotation process, in which the holding unit 10 holds and rotates the bonded substrate S to which a pair of substrates Sa and Sb are bonded; a separation process, in which the nozzle 30 sprays fluid toward the periphery of the rotating bonded substrate S to separate the bonded substrate S; and a displacement process, in which the nozzle driving unit 40 changes the ejection direction of the fluid from the nozzle 30 between a first direction along the tangent of the periphery of the bonded substrate S and a second direction toward the center Cs of the bonded substrate S.

[0075] Therefore, from the start to the end of separation, the fluid from the nozzle 30 can be continuously ejected toward a portion of the laminated substrate S that is close to the laminated substrate S and capable of separation, as the separation progresses from the periphery toward the center Cs. This allows the fluid to be supplied to the laminated substrate S with good positional accuracy, and reliable separation can be achieved. Furthermore, if the fluid is continuously ejected only toward the center Cs of the laminated substrate S, high-pressure fluid may accumulate at the center Cs, causing cracks or notches. However, since the ejection direction starts along a tangent line and changes toward the center Cs, the fluid is easily discharged, minimizing damage to the laminated substrate S.

[0076] (2) The nozzle driving unit 40 moves the nozzle 30 in a direction along the outer periphery of the bonded substrate S. This allows the nozzle 30 to follow the separation portion while maintaining a distance from the outer periphery that can be separated by the ejected fluid.

[0077] (3) The ejection outlet of the nozzle 30 in the first direction and the ejection outlet of the nozzle 30 in the second direction are spaced the same distance d from the outer periphery of the lamination substrate S. Therefore, while avoiding interference between the ejection outlet of the nozzle 30 and the outer periphery of the lamination substrate S, a distance capable of being separated by the ejected fluid can be maintained.

[0078] (4) The substrate separation device 1 includes a displacement detection unit 50. The displacement detection unit 50 detects changes in the surface position of the bonded substrate S when the fluid is ejected from the nozzle 30. The nozzle driving unit 40 changes the ejection direction of the fluid from the nozzle 30 based on the changes in the surface position of the bonded substrate S detected by the displacement detection unit 50. Therefore, the ejection direction of the fluid from the nozzle 30 can be changed in a manner that follows the separation portion moving from the periphery of the bonded substrate S toward the center Cs. This prevents the nozzle 30 from moving while leaving an unseparated portion, thereby reducing separation defects. In addition, the ejection direction of the nozzle 30 can be changed or ejection can be stopped according to the progress of the separation, thereby preventing waste of fluid.

[0079] [Modification]

[0080] The following modifications are also applicable to this embodiment.

[0081] (1) If Figure 9 As shown, the nozzle driving unit 40 can also change the ejection direction of the nozzle 30 between a first direction and a second direction by rotating the nozzle 30 in a direction parallel to the rotation plane of the bonded substrate S. Specifically, by providing the nozzle driving unit 40 with a rotation mechanism having a drive source such as a motor connected to a drive shaft connected to the nozzle 30, a structure is formed in which the nozzle 30 can be driven in a θ direction. This reduces the moving area of ​​the nozzle 30 compared to the case where the nozzle 30 is horizontally moved in a direction orthogonal to the axis, thereby reducing the installation area of ​​the substrate separating apparatus 1.

[0082] (2) In the above-described method, the nozzle driving unit 40 continuously changes the ejection direction of the nozzle 30. However, the nozzle 30 may also be intermittently changed between the first direction and the second direction. For example, a plurality of stop positions may be set between the first direction and the second direction, and the nozzle 30 may temporarily stop at the plurality of stop positions and eject the fluid according to the progress of separation. Since the peripheral speed varies between the periphery and the center Cs of the bonded substrate S, if the ejection is continued continuously, there may be a portion where the ejection amount of the fluid becomes excessive. However, by stopping and ejecting at each stop position and moving after separation reaches the portion, waste of the fluid can be prevented and separation can be performed reliably.

[0083] (3) The detection of position changes by the displacement detection unit 50 is more accurate when detecting both surfaces of the bonded substrate S. However, since the surface positions of both bonded substrates S change during separation, the device can be simplified by using a configuration that detects changes in only one surface.

[0084] (4) The progress of separation of the bonded substrate S can also be determined based on the time previously determined by experiments or simulations. In this case, the control device 100 controls the nozzle driving unit 40 so that the nozzle 30 moves after a certain time has passed.

[0085] (5) The positioning portion 20 may be in contact with the outer periphery at three or more locations in order to position the laminated substrate S. In other words, the plurality of gripping portions 210 may be sufficient as long as they can position the center Cs of the circular laminated substrate S. Therefore, three or more gripping portions are sufficient.

[0086] (6) The axis of rotation of the laminated substrate S by the holding portion 10 is not limited to the vertical direction. For example, the following structure may be adopted: the holding portion 10 is configured so that the laminated substrate S rotates around an axis in the horizontal direction, and the nozzle 30 ejects fluid in the vertical direction toward the outer periphery of the laminated substrate S. The holding portion 10 only needs to be able to hold and rotate at least one of the two surfaces of the laminated substrate S. Therefore, the holding portion 10 may also be a structure that holds the laminated substrate S by any one of the first holding body 111 and the second holding body 121. In addition, the rotation drive portion 122 may be a structure that rotates any one of the first holding body 111 and the second holding body 121, or a structure that rotates both. The loading and unloading drive portion 123 may be a structure that moves any one of the first holding body 111 and the second holding body 121, or a structure that moves both.

[0087] (7) If Figure 10 As shown, the substrate separation apparatus 1 can be configured as part of a substrate processing apparatus 2. For example, the substrate processing apparatus 2 can be configured as an apparatus for processing substrates one by one: it includes multiple chambers 1a housing the substrate separation apparatus 1 and a surface processing apparatus 3 for processing the surfaces of the separated first and second substrates Sa and Sb. Multiple bonded substrates S, which were transported and stored in a cassette (Front Opening Unified Pod, FOUP) 1b in a previous process, are processed one by one in each chamber 1a. The surface processing apparatus 3 is, for example, a cleaning apparatus that cleans the surfaces of the separated first and second substrates Sa and Sb with a cleaning liquid. The bonded substrates S are removed one by one from the cassette 1b by a transfer robot 1c, temporarily placed in a buffer unit 1d, and then transported to each chamber 1a by a transfer robot 1e, where they are separated and cleaned. The surface processing apparatus 3 cleans the surfaces of the separated first and second substrates Sa and Sb with a cleaning liquid.

[0088] (8) The substrate separation device 1 is configured to separate a bonded substrate in which two semiconductor wafers are bonded together. However, the present invention is not limited to this embodiment. Any situation in which two substrates are bonded together and separated by the substrate separation device 1 can be applied. For example, the present invention can also be applied to a situation in which an element substrate bonded to a support substrate via an adhesive is separated. Alternatively, the present invention can be applied even when the substrate separation device 1 separates (splits) a single substrate into two. For example, the present invention can also be applied to a situation in which a substrate is separated from an ingot.

[0089] [Other embodiments]

[0090] The present invention is not limited to the above-described embodiments, but also includes other embodiments described above. In addition, the present invention also includes all or any combination of the above-described embodiments and other embodiments. Furthermore, various omissions, substitutions, and modifications may be made to these embodiments without departing from the scope of the invention, and such modifications are also included in the present invention.

[0091] Explanation of Figure Numbers

[0092] 1. Substrate separation device

[0093] 1a Chamber

[0094] Box 1b

[0095] 1c Transport Robot

[0096] 1d buffer unit

[0097] 1e Transport Robot

[0098] 2 Substrate processing equipment

[0099] 3 Surface treatment device

[0100] 10. Holding unit

[0101] 20 Positioning unit

[0102] 30 nozzles

[0103] 31 Supply device

[0104] 40 Nozzle drive unit

[0105] 41 Contact / Separation Mechanism

[0106] 42 Position adjustment mechanism

[0107] 50, 50A, 50B displacement detection unit

[0108] 60 fluid removal unit

[0109] 61, 61A, 61B Remove the nozzle

[0110] 62 Air supply device

[0111] 100 Control Device

[0112] 110 First Fixer

[0113] 111 First Holding Body

[0114] 112 Support mechanism

[0115] 112a Support shaft

[0116] 120 Second Fixer

[0117] 121 Second Holding Body

[0118] 122 Rotation drive unit

[0119] 122a Drive shaft

[0120] 123 Loading and unloading drive unit

[0121] 210 grip

[0122] 220 loading section

[0123] 230 Axial drive unit

[0124] 231 Pillar Department

[0125] 232 Force application part

[0126] 233 Absorption

[0127] 240 Opening and closing drive unit

[0128] 241 Arm

Claims

1. A substrate separation device, characterized in that have: a holding portion for holding and rotating a bonded substrate to which a pair of substrates are bonded; a nozzle for separating the bonded substrates by ejecting a fluid toward the outer periphery of the rotating bonded substrates; as well as The nozzle driving unit changes the ejection direction of the fluid from the nozzle between a first direction along a tangent line of the outer periphery of the bonded substrate and a second direction toward the center of the bonded substrate.

2. The substrate separation device according to claim 1, wherein: The nozzle driving unit moves the nozzle in a direction along the outer circumference of the bonded substrate.

3. The substrate separation device according to claim 1, wherein: The ejection outlets of the nozzle in the first direction and the ejection outlets of the nozzle in the second direction are spaced the same from the outer periphery of the laminated substrate.

4. The substrate separation device according to claim 1, wherein: The nozzle driving unit intermittently shifts the ejection direction of the nozzle between the first direction and the second direction.

5. The substrate separation device according to claim 1, wherein: The nozzle driving unit rotates the nozzle in a direction parallel to a rotation plane of the bonded substrate.

6. The substrate separation device according to claim 1, wherein: A displacement detection unit is provided for detecting a change in the surface position of the bonding substrate when the fluid is ejected through the nozzle. The nozzle driving unit moves the nozzle according to a change in the surface position of the bonded substrate detected by the displacement detecting unit.

7. A substrate processing device, characterized in that have: The substrate separation device according to any one of claims 1 to 6; as well as A surface treatment device is provided for treating the surface of the separated substrate.

8. A substrate separation method, characterized in that include: a rotating step in which a holding portion holds and rotates a bonded substrate to which a pair of substrates are bonded; a separation step of spraying liquid toward the outer periphery of the rotating bonded substrates through a nozzle to separate the bonded substrates; as well as In the displacement step, the nozzle driving unit changes the ejection direction of the fluid from the nozzle between a first direction along a tangent line of the outer periphery of the bonded substrate and a second direction toward the center of the bonded substrate.

Images