Environmental test constant-temperature container, control method, storage medium and control device

Abstract

The embodiment of the invention discloses an environment test constant-temperature container, a control method, a storage medium and a control device, the environment test constant-temperature container comprises a container main body, a liquid medium temperature control assembly and a semiconductor temperature control assembly, a material can be arranged in the container main body, then the liquid medium temperature control assembly is started, and the semiconductor temperature control assembly is started; a liquid temperature control medium is supplied to the medium flow accommodating space of the container main body through the liquid medium temperature control assembly, and the temperature control medium can heat the container main body, so that the temperature control of the experiment accommodating space is preliminarily adjusted; the liquid medium temperature control assembly can be controlled to stop working, then the semiconductor temperature control assembly is started, and temperature compensation is conducted on the experiment containing space through the semiconductor temperature control assembly. And the thermal compensation cover body above the transparent cover body of the container main body can be controlled to carry out heat preservation and temperature compensation on the transparent cover body, so that the temperature consistency of the whole experiment accommodating space is favorably realized.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of environmental test containers, and in particular to an environmental test constant temperature container, a control method, a storage medium, and a control device. Background Art

[0002] During environmental testing of certain specialty materials or temperature-sensitive materials, small and micro-scale test vessels are often used for environmental simulation. These vessels often contain sealed atmospheres or vacuum conditions, requiring extremely precise temperature control within a narrow temperature range. Temperature control methods often employ resistance heaters wrapped in insulation to achieve temperature control and maintenance. Other temperature control technologies employ external heaters to heat the interior of the container, raising the temperature of the contents through heat exchange. For example, heat pipes wrapped around the sealed container heat the interior through heat exchange. Cooling methods often utilize a combination of rapid heat transfer within the sealed container and refrigeration equipment. These heating and cooling methods result in larger equipment size, resulting in longer temperature equilibration times and difficulties in precise temperature control. Temperature fluctuations can be significant throughout the entire sealed environment. Under certain conditions, radiation from certain test materials cannot be prevented from irradiating the heating and other temperature control components, significantly shortening their service life. Furthermore, the containers occupy a large space, making them inconvenient to store in confined environments. Summary of the Invention

[0003] The Summary of the Invention introduces a series of simplified concepts that will be further described in the Detailed Description of the Invention. This section of the invention is not intended to limit the key features and essential features of the claimed technical solution, nor is it intended to determine the scope of protection of the claimed technical solution.

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art or related art.

[0005] To this end, a first aspect of the present invention provides an environmental test constant temperature container.

[0006] A second aspect of the present invention provides a method for controlling an environmental test constant temperature container.

[0007] A third aspect of the present invention provides a computer-readable storage medium.

[0008] A fourth aspect of the present invention provides a control device.

[0009] In view of this, according to a first aspect of an embodiment of the present application, an environmental test constant temperature container is proposed, comprising:

[0010] A container body, wherein an experimental accommodation space is formed in the container body, and a wall surface of the container body is in a sandwich shape, wherein a medium flow accommodation space is formed in the sandwich shape;

[0011] a liquid medium temperature control component, the liquid medium temperature control component being connected to the medium flow accommodating space on the wall surface and being used for supplying temperature control medium to the medium flow accommodating space;

[0012] A semiconductor temperature control component is arranged on the outer wall of the container body and is connected to the wall surface of the container body through the medium flow accommodating space.

[0013] In a feasible embodiment, the liquid medium temperature control component includes:

[0014] Liquid medium refrigerator;

[0015] a liquid inlet pipe, one end of which is connected to the output end of the liquid medium refrigerator, and the other end of which is connected to the bottom of the container body;

[0016] A liquid outlet pipe, one end of which is connected to the top of the container body, and the other end of which is connected to the input end of the liquid medium refrigerator.

[0017] In a feasible embodiment, the environmental test constant temperature container further includes:

[0018] A transparent cover body is provided on the top of the container body;

[0019] A thermal compensation cover is connected to the outer wall of the transparent cover.

[0020] In a feasible embodiment, the semiconductor temperature control component includes:

[0021] a semiconductor temperature control piece, the semiconductor temperature control piece passing through the medium flow accommodating space and connected to the wall surface of the container body;

[0022] a heat dissipation plate, the heat dissipation plate being arranged on a side of the semiconductor temperature control plate away from the container body;

[0023] A heat dissipation fan is connected to the heat dissipation plate.

[0024] In a feasible embodiment, the semiconductor temperature control component includes:

[0025] A sealed frame is provided in which the semiconductor temperature control plate and at least a portion of the heat dissipation plate are embedded. The sealed frame is sealed and connected to the container body. A guide groove is formed on the sealed frame.

[0026] According to a second aspect of the embodiments of the present application, a control method of an environmental test constant-temperature container is provided, which is used for controlling the environmental test constant-temperature container according to any one of the above technical solutions, and the control method comprises:

[0027] In response to the constant-temperature maintaining instruction, the liquid medium temperature control component is controlled to preliminarily adjust the internal temperature of the experimental accommodation space in the container body based on a target temperature corresponding to the constant-temperature maintaining instruction.

[0028] The semiconductor temperature control component is controlled to precisely adjust the internal temperature of the experimental accommodation space in the container body.

[0029] In a possible implementation, the step of controlling the liquid medium temperature control component to preliminarily adjust the internal temperature of the experimental accommodation space in the container body based on the target temperature corresponding to the constant-temperature maintaining instruction comprises:

[0030] The supply temperature of the temperature control medium is determined based on the target temperature corresponding to the constant-temperature maintaining instruction.

[0031] The supply flow rate of the temperature control medium is determined based on a difference between the current temperature in the experimental accommodation space and the target temperature.

[0032] In the case that the temperature control medium reaches the supply temperature, the liquid medium temperature control component is controlled to supply the temperature control medium to the container body at the supply flow rate until the temperature in the container body reaches the target temperature.

[0033] In a possible implementation, the step of controlling the semiconductor temperature control component to precisely adjust the internal temperature of the experimental accommodation space in the container body comprises:

[0034] The liquid medium temperature control component is turned off, and the semiconductor temperature control component is started.

[0035] The operating temperature of the semiconductor temperature control component is controlled based on the external environment temperature, so as to perform temperature compensation on the container body, and the container body is maintained at the target temperature.

[0036] According to a third aspect of the embodiments of the present application, a computer readable storage medium is provided, which comprises:

[0037] The computer readable storage medium stores a computer program, which implements the control method according to any one of the above technical solutions.

[0038] According to a fourth aspect of the embodiments of the present application, a control device is provided, which comprises:

[0039] The memory stores a computer program.

[0040] a processor, configured to execute the computer program;

[0041] Wherein, when the processor executes the computer program, it implements the control method described in any of the above technical solutions.

[0042] Compared with the prior art, the present invention has at least the following beneficial effects:

[0043] The embodiment of the present application provides an environmental test constant temperature container, which includes a container body, a liquid medium temperature control component, and a semiconductor temperature control component. Based on this, when it is necessary to conduct a temperature environment test on certain special materials or temperature-sensitive materials, the material can be placed in the container body, and then the liquid medium temperature control component is turned on. The liquid temperature control medium is supplied to the medium flow holding space of the container body through the liquid medium temperature control component. The temperature control medium can heat the container body to achieve a preliminary rapid temperature control of the experimental holding space. After the temperature of the experimental holding space reaches the desired temperature, the liquid medium temperature control component can be controlled to stop working and the semiconductor temperature control component can be turned on. The semiconductor temperature control component is used to compensate the temperature of the experimental holding space, ensuring that the experimental holding space is maintained at the required temperature and ensuring the reliability of the environmental test. The environmental test constant temperature container can achieve equipment miniaturization, rapid and accurate temperature rise and fall, and radiation resistance. It is equipped with a rapid temperature control method of liquid circulation in the interlayer to achieve rapid and accurate temperature control and temperature maintenance inside the closed container body. The heating method is simple, the heating accessories occupy very little space, and the radiation resistance is excellent, meeting the equipment miniaturization and stability control requirements of storage containers.

[0044] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are specifically listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present application. The same reference symbols are used throughout the drawings to represent the same components. In the drawings:

[0046] Figure 1 A schematic structural diagram of an environmental test constant temperature container according to an embodiment of the present application;

[0047] Figure 2 A schematic structural diagram of a semiconductor temperature control assembly of an environmental test constant temperature container according to an embodiment of the present application;

[0048] Figure 3 A schematic structural diagram of a cross-section of a container body of an environmental test constant temperature container according to an embodiment of the present application;

[0049] Figure 4 A schematic flowchart of a method for controlling an environmental test constant temperature container according to an embodiment of the present application;

[0050] Figure 5 A schematic diagram of temperature changes in an environmental test constant temperature container in an operating state according to an embodiment of the present application;

[0051] Figure 6 A schematic diagram of temperature changes in another operating state of an environmental test constant temperature container according to an embodiment of the present application;

[0052] Figure 7 A block diagram of a computer-readable storage medium according to an embodiment of the present invention;

[0053] Figure 8 This is a structural block diagram of a control device according to an embodiment of the present application.

[0054] in, Figures 1 to 3 The corresponding relationship between the reference numerals and component names is as follows:

[0055] 110 container body, 120 liquid medium temperature control component, 130 semiconductor temperature control component, 140 thermal compensation cover;

[0056] 121 liquid medium refrigerator, 122 liquid inlet pipe, 123 liquid outlet pipe;

[0057] 131 semiconductor temperature control sheet, 132 heat sink, 133 cooling fan, 134 sealing frame. DETAILED DESCRIPTION

[0058] In the following description, a number of specific details are provided to provide a more thorough understanding of the technical solutions provided by the present invention. However, it is obvious to those skilled in the art that the technical solutions provided by the present invention can be implemented without one or more of these details.

[0059] It should be noted that the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit exemplary embodiments according to the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should also be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of the features, wholes, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0060] Exemplary embodiments of the present invention will now be described in greater detail with reference to the accompanying drawings. However, these exemplary embodiments may be implemented in a variety of different forms and should not be construed as being limited to the embodiments set forth herein. It should be understood that these embodiments are provided to make the disclosure of the present invention thorough and complete and to fully convey the concepts of these exemplary embodiments to those of ordinary skill in the art.

[0061] like Figures 1 to 3 As shown, according to the first aspect of the embodiment of the present application, an environmental test constant temperature container is proposed, including: a container body 110, an experimental accommodation space is formed in the container body 110, the wall of the container body 110 is in a sandwich shape, and a medium flow accommodation space is formed in the sandwich shape; a liquid medium temperature control component 120, the liquid medium temperature control component 120 is connected to the medium flow accommodation space on the wall, and is used to supply temperature control medium to the medium flow accommodation space; a semiconductor temperature control component 130, the semiconductor temperature control component 130 is arranged on the outer wall of the container body 110, and is connected to the wall of the container body 110 through the medium flow accommodation space.

[0062] The environmental test constant temperature container provided in the embodiment of the present application includes a container body 110, a liquid medium temperature control component 120 and a semiconductor temperature control component 130. Based on this, when it is necessary to conduct a temperature environment experiment on certain special materials or temperature-sensitive materials, the material can be set in the container body 110, and then the liquid medium temperature control component 120 is turned on. The liquid temperature control medium is supplied to the medium flow holding space of the container body 110 through the liquid medium temperature control component 120. The temperature control medium can heat the container body 110 to achieve preliminary adjustment of the temperature control of the experimental holding space. After the temperature of the experimental holding space reaches the expected temperature, the liquid medium temperature control component 120 can be controlled to stop working and the semiconductor temperature control component 130 can be turned on. The semiconductor temperature control component 130 is used to compensate the temperature of the experimental holding space to ensure that the experimental holding space is maintained at the required temperature and the reliability of the environmental test. This environmental test constant temperature container can achieve equipment miniaturization, fast and accurate temperature increase and decrease, and radiation resistance. It is equipped with a rapid temperature control method of liquid circulation in the interlayer to achieve temperature control and maintenance inside the closed container body 110. The temperature control method is fast and accurate, the heating method is simple, the heating accessories occupy very little space, and the radiation resistance is excellent, which meets the equipment miniaturization and stability control requirements of storage containers.

[0063] It is understandable that the temperature control medium can be water or silicone oil.

[0064] like Figures 1 to 3 As shown, in a feasible embodiment, the liquid medium temperature control component 120 includes: a liquid medium refrigerator 121; a liquid inlet pipe 122, one end of the liquid inlet pipe 122 is connected to the output end of the liquid medium refrigerator 121, and the other end is connected to the bottom of the container body 110; a liquid outlet pipe 123, one end of the liquid outlet pipe 123 is connected to the top of the container body 110, and the other end is connected to the input end of the liquid medium refrigerator 121.

[0065] In this technical solution, the structural composition of a liquid medium temperature control component 120 is further provided. The liquid medium temperature control component 120 may include a liquid medium refrigerator 121, a liquid inlet pipe 122 and a liquid outlet pipe 123. The temperature of the liquid temperature control medium can be adjusted by the liquid medium refrigerator 121, and then the temperature control medium is output to the interlayer of the container body 110 via the liquid outlet pipe 123, and flows in the medium flow holding space, and can exchange heat with the experimental holding space. The temperature control medium that has completed the surrounding can be returned to the liquid medium refrigerator 121 via the liquid outlet pipe 123, so that the temperature control medium is always maintained at the expected temperature, and then the temperature of the experimental holding space is better controlled, so that the experimental holding space can reach the expected test temperature as soon as possible.

[0066] In this technical solution, the liquid inlet pipe 122 is connected to the bottom of the container body 110, and the liquid outlet pipe 123 is connected to the top of the container body 110, so that the temperature control medium can be supplied by flowing from the bottom to the top, and the heat exchange effect is better.

[0067] like Figures 1 to 3 As shown, in a feasible embodiment, the environmental test constant temperature container further includes: a transparent cover body, which is arranged on the top of the container body 110; and a thermal compensation cover body 140, which is connected to the outer wall of the transparent cover body.

[0068] In this technical solution, the environmental test constant temperature container can also include a transparent cover and a thermal compensation cover 140. The transparent cover is connected to the top of the container body 110 and is sealed with the container body 110. The transparent cover can be used as a component of the container body 110, and the transparent cover can be heated and compensated by the setting of the thermal compensation cover 140. It is used in combination with the liquid medium temperature control component 120 and the semiconductor temperature control component 130 so that the temperature control of each part can be coordinated to achieve temperature consistency in the entire enclosed experimental space.

[0069] In some examples, the thermal compensation enclosure 140 may be made of a thermal silicone rubber heating plate.

[0070] In this technical solution, by attaching a transparent cover to at least a portion of the thermal compensation cover 140, heat exchange between the interior of the container body 110 and the exterior can be reduced, thereby reducing the temperature difference within the container body 110 and the thickness of the original insulation layer. This temperature control method is fast and accurate, the heating method is simple, the heating component takes up minimal space, and it has excellent radiation resistance, meeting the requirements of miniaturization and stability control for storage containers.

[0071] In some examples, the transparent cover may be a glass cover.

[0072] like Figures 1 to 3 As shown, in a feasible embodiment, the semiconductor temperature control component 130 includes: a semiconductor temperature control plate 131, which is connected to the wall of the container body 110 through the medium flow accommodating space; a heat sink 132, which is arranged on the side of the semiconductor temperature control plate 131 away from the container body 110; and a heat dissipation fan 133, which is connected to the heat sink 132.

[0073] This technical solution further provides the structural composition of a semiconductor temperature control assembly 130, which can include a semiconductor temperature control sheet 131, a heat sink 132, and a cooling fan 133. Based on this, during operation, the liquid medium temperature control assembly 120 controls the temperature of the entire experimental holding space by circulating and heating the temperature control medium in the interlayer of the container body 110. The liquid medium temperature control assembly 120 requires a predetermined temperature, while the semiconductor temperature control assembly 130 and a temperature sensor are connected to an industrial computer to form a signal feedback system. When the temperature in the experimental holding space exceeds the set temperature, the two temperature control assemblies cool the liquid temperature control medium in the base interlayer, thereby lowering the temperature in the container body 110, and vice versa. The semiconductor temperature control assembly 130 primarily utilizes the characteristics of semiconductors, liquid circulation temperature control, and heat exchange principles. A thermal compensation cover 140, heated by a separate temperature controller and set to a fixed temperature, covers the entire upper portion of the container to provide insulation.

[0074] During operation of the semiconductor temperature control assembly 130, the heat dissipation plate 132 and the cooling fan 133 dissipate heat for the semiconductor temperature control sheet 131, thereby extending the service life of the semiconductor temperature control sheet 131. Furthermore, the liquid medium refrigerator 121 of the liquid medium temperature control assembly 120 can be positioned away from the container body 110, similarly extending the service life of the liquid medium temperature control assembly 120. Furthermore, the temperature control medium can be completely isolated from the experimental accommodation space.

[0075] like Figures 1 to 3 As shown, in a feasible embodiment, the semiconductor temperature control component 130 includes: a sealed frame 134, a semiconductor temperature control plate 131 and at least a portion of the heat dissipation plate 132 are embedded in the sealed frame 134, the sealed frame 134 is sealedly connected to the container body 110, and a guide groove is formed on the sealed frame 134.

[0076] This technical solution further provides the structural components of a semiconductor temperature control assembly 130. The semiconductor temperature control assembly 130 may also include a sealing frame 134, which encapsulates the semiconductor temperature control chip 131 and the heat sink 132. The semiconductor temperature control assembly 130 is then connected to the container body 110 via the sealing frame 134, ensuring a tight seal and preventing the temperature control medium from leaking out. A guide groove is formed on the sealing frame 134, facilitating the flow of the temperature control medium along the outer wall of the sealing frame 134, allowing the temperature control medium to regulate the temperature of the experimental accommodation space.

[0077] The environmental test constant temperature container provided in the embodiment of the present application has at least the following beneficial effects:

[0078] The present invention can accurately control the temperature inside the container body 110. Heating devices are provided below, above, and outside the container body 110. The above design can ensure that the temperature inside the container body 110 is evenly distributed, and no temperature difference will occur, which will affect the application effect of the container body 110.

[0079] The temperature control device formed by the present invention occupies a small space in the container and has little impact on the miniaturized design of the container body 110 .

[0080] The present invention can quickly control the temperature inside the container body 110 to reach a preset temperature, and can reduce the heat exchange between the internal space and the external space of the container body 110, thereby achieving a long-term heat preservation effect.

[0081] The present invention separates the sample from the temperature control device through a liquid circulation design, which facilitates the inspection, maintenance or replacement of the temperature control device. The temperature control device does not come into direct contact with the radioactive sample, which can ensure the long-term normal use of the device when storing radioactive samples.

[0082] like Figure 4 As shown, according to the second aspect of the embodiment of the present application, a control method for an environmental test constant temperature container is proposed, which is used to control the environmental test constant temperature container as any of the above technical solutions. The control method includes:

[0083] Step 201: In response to a constant temperature maintenance instruction, based on a target temperature corresponding to the constant temperature maintenance instruction, controlling a liquid medium temperature control component to preliminarily adjust the internal temperature of the experimental accommodation space in the container body;

[0084] Step 202: Control the semiconductor temperature control component to precisely adjust the internal temperature of the experimental accommodation space in the container body.

[0085] The control method of the environmental test constant temperature container provided in the embodiment of the present application is applied to the environmental test constant temperature container of any of the above technical solutions, so the control method of the environmental test constant temperature container has all the beneficial effects of the environmental test constant temperature container of the above technical solutions.

[0086] The control method of the environmental test constant temperature container provided in the embodiment of the present application can place the material in the container body 110, and then start the liquid medium temperature control component 120 in response to the constant temperature maintenance instruction. The liquid medium temperature control component 120 supplies the liquid temperature control medium to the medium flow holding space of the container body 110, and the temperature control medium can heat the container body 110 to achieve preliminary temperature control of the experimental holding space. After the temperature of the experimental holding space reaches the expected temperature, the liquid medium temperature control component 120 can be controlled to stop working and the semiconductor temperature control component 130 can be turned on. The semiconductor temperature control component 130 compensates the temperature of the experimental holding space to ensure that the experimental holding space is maintained at the required temperature and ensure the reliability of the environmental test. The environmental test constant temperature container can achieve equipment miniaturization, fast and accurate temperature rise and fall, and radiation resistance. It is equipped with a fast temperature control method of liquid circulation in the interlayer to achieve fast and accurate temperature control and temperature maintenance inside the closed container body 110. The heating method is simple, the heating accessories occupy very little space, and the radiation resistance is excellent, meeting the equipment miniaturization and stability control requirements of the storage container.

[0087] In a feasible embodiment, in response to a constant temperature maintenance instruction, based on the target temperature corresponding to the constant temperature maintenance instruction, the steps of controlling the liquid medium temperature control component 120 to preliminarily adjust the internal temperature of the experimental holding space in the container body 110 include: in response to the constant temperature maintenance instruction, based on the target temperature corresponding to the constant temperature maintenance instruction, determining the supply temperature of the temperature control medium; based on the difference between the current temperature in the experimental holding space and the target temperature, determining the supply flow rate of the temperature control medium; when the temperature control medium reaches the supply temperature, controlling the liquid medium temperature control component 120 to supply the temperature control medium to the container body 110 at the supply flow rate until the temperature inside the container body 110 reaches the target temperature.

[0088] This technical solution further provides specific steps for preliminarily adjusting the internal temperature of the experimental holding space within the container body 110 based on the liquid medium temperature control component 120. The supply temperature of the temperature control medium can be determined based on the target temperature corresponding to the constant temperature maintenance instruction. When heating, the supply temperature can be equal to or greater than the target temperature. When cooling is required, the supply temperature can be lower than or equal to the target temperature. After the supply temperature is determined, the ambient temperature can be further collected. If the difference between the ambient temperature and the target temperature is large, the supply flow rate will increase. Conversely, if the difference between the ambient temperature and the target temperature is small, the supply flow rate will decrease. In other words, the supply flow rate is inversely proportional to the difference between the ambient temperature and the target temperature. Based on this, the temperature within the container body 110 can be quickly adjusted to improve response efficiency.

[0089] In a feasible embodiment, the steps of controlling the semiconductor temperature control component 130 and precisely adjusting the internal temperature of the experimental accommodation space in the container body 110 include: turning off the liquid medium temperature control component 120 and starting the semiconductor temperature control component 130; based on the external ambient temperature, controlling the operating temperature of the semiconductor temperature control component 130 to perform temperature compensation on the container body 110 so that the container body 110 is maintained at the target temperature.

[0090] This technical solution further provides specific steps for precisely adjusting the internal temperature of the experimental accommodation space within the container body 110 using the semiconductor temperature control assembly 130. After the liquid medium temperature control assembly 120 completes temperature adjustment of the experimental accommodation space within the container body 110 and reaches the target temperature, the liquid medium temperature control assembly 120 can be turned off, and the semiconductor temperature control assembly 130 can be used to compensate the temperature of the container body 110, so that the container body 110 is maintained at the target temperature. This configuration can reduce energy consumption while ensuring the reliability of temperature control.

[0091] It is understandable that, in response to the constant temperature maintenance instruction, the environmental test constant temperature container will be in two states: heating up or cooling down, and the control methods of the two are the same. Figure 5 and Figure 6 As shown, the horizontal axis is time and the vertical axis is temperature. Figure 5 The target temperature is set to 15°C. Figure 6 The target temperature set in is 30°C, and the temperature can be quickly adjusted by the device combined with the method provided in the embodiment of the present application. The environmental test constant temperature container provided in the embodiment of the present application is combined with the control method, which can control the temperature in the container body 110 to 10~130°C. Among them, the device can quickly reach the temperature in the range of 10~40°C within 40 minutes, and the temperature control accuracy is ≤±1°C; the storage device in the range of 40~70°C needs to reach within 80 minutes, but the accuracy of temperature control will drop to ≤±3°C; the temperature control in the container of 70~90°C takes about 2 hours.

[0092] like Figure 7 As shown, according to the third aspect of the embodiment of the present application, a computer-readable storage medium 301 is proposed, and the computer-readable storage medium 301 stores a computer program 302 to implement the control method of any of the above technical solutions.

[0093] The computer-readable storage medium 301 provided in the embodiment of the present application implements the control method of any of the above technical solutions, so the computer-readable storage medium 301 has all the beneficial effects of the control method of the above technical solutions, which will not be described in detail here.

[0094] Based on such understanding, the technical scheme of the present application can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (which can be a CD-ROM, a U disk, a mobile hard disk, etc.), and includes a plurality of instructions to make a computer device (which can be a personal computer, a server, or a network device, etc.) execute the method described in various implementation scenarios of the present application.

[0095] As shown in Figure 8 The fourth aspect of the embodiments of the present application proposes a control device, which comprises a memory 401 storing a computer program, and a processor 402 executing the computer program, wherein the processor 402 implements the control method of any of the above technical solutions when executing the computer program.

[0096] The control device provided by the embodiments of the present application implements the control method of any of the above technical solutions, so the control device has all the beneficial effects of the control method of the above technical solutions, which will not be repeated here.

[0097] In some examples, the control device can further include a user interface, a network interface, a camera, a radio frequency (RF) circuit, a sensor, an audio circuit, a WI-FI module, etc. The user interface can include a display, an input unit such as a keyboard, etc. The optional user interface can further include a USB interface, a card reader interface, etc. The network interface can optionally include a standard wired interface, a wireless interface (such as a WI-FI interface), etc.

[0098] In the exemplary embodiments, the control device can further include an input / output interface and a display device, wherein the communication between each functional unit can be completed through a bus. The memory 401 stores a computer program, and the processor 402 is configured to execute the program stored in the memory 401 to execute the method in the above embodiments.

[0099] The storage medium can further include an operating system and a network communication module. The operating system is a program for managing the hardware and software resources of the information processing entity device, and supports the running of information processing programs and other software and / or programs. The network communication module is used to realize the communication between the components in the storage medium and the communication with other hardware and software in the information processing entity device.

[0100] From the above description of the embodiments, those skilled in the art can clearly understand that the present application can be implemented by means of software plus a necessary general hardware platform, or by hardware.

[0101] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor 402 of a general-purpose computer, a special-purpose computer, an embedded computer, or other programmable data processing device to produce a machine, so that the instructions executed by the processor 402 of the computer or other programmable data processing device generate instructions for implementing the steps in the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0102] In the present invention, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "plurality" refers to two or more, unless expressly limited otherwise. Terms such as "installed," "connected," "connected," and "fixed" should be interpreted broadly. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; "connected" can mean a direct connection or an indirect connection through an intermediary. Those skilled in the art will understand the specific meanings of these terms in the present invention based on specific circumstances.

[0103] In the description of the present invention, it should be understood that the directions or positional relationships indicated by terms such as "up", "down", "left", "right", "front" and "back" are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limiting the present invention.

[0104] Throughout this specification, terms such as "one embodiment," "some embodiments," and "specific embodiments" mean that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0105] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. An environmental test constant temperature container, characterized in that: include: A container body, wherein an experimental accommodation space is formed in the container body, and a wall surface of the container body is in a sandwich shape, wherein a medium flow accommodation space is formed in the sandwich shape; a liquid medium temperature control component, the liquid medium temperature control component being connected to the medium flow accommodating space on the wall surface and being used for supplying temperature control medium to the medium flow accommodating space; A semiconductor temperature control component is arranged on the outer wall of the container body and is connected to the wall surface of the container body through the medium flow accommodating space.

2. The environmental test constant temperature container according to claim 1, characterized in that: The liquid medium temperature control component includes: Liquid medium refrigerator; a liquid inlet pipe, one end of which is connected to the output end of the liquid medium refrigerator, and the other end of which is connected to the bottom of the container body; A liquid outlet pipe, one end of which is connected to the top of the container body, and the other end of which is connected to the input end of the liquid medium refrigerator.

3. The environmental test constant temperature container according to claim 1, characterized in that: Also includes: A transparent cover body is provided on the top of the container body; A thermal compensation cover is connected to the outer wall of the transparent cover.

4. The environmental test constant temperature container according to claim 1, characterized in that: The semiconductor temperature control component includes: a semiconductor temperature control piece, the semiconductor temperature control piece passing through the medium flow accommodating space and connected to the wall surface of the container body; a heat dissipation plate, the heat dissipation plate being arranged on a side of the semiconductor temperature control plate away from the container body; A heat dissipation fan is connected to the heat dissipation plate.

5. The environmental test constant temperature container according to claim 4, characterized in that: The semiconductor temperature control component includes: A sealed frame is provided in which the semiconductor temperature control plate and at least a portion of the heat dissipation plate are embedded. The sealed frame is sealed and connected to the container body. A guide groove is formed on the sealed frame.

6. A method for controlling a constant temperature container for environmental testing, characterized in that: For controlling the environmental test constant temperature container according to any one of claims 1 to 5, the control method comprises: In response to a constant temperature maintenance instruction, controlling the liquid medium temperature control component to preliminarily adjust the internal temperature of the experimental accommodation space in the container body based on a target temperature corresponding to the constant temperature maintenance instruction; The semiconductor temperature control component is controlled to precisely adjust the internal temperature of the experimental accommodation space in the container body.

7. The control method according to claim 6, characterized in that: The step of controlling the liquid medium temperature control component to preliminarily adjust the internal temperature of the experimental accommodation space in the container body in response to the constant temperature maintenance instruction based on the target temperature corresponding to the constant temperature maintenance instruction includes: determining, in response to the constant temperature maintenance instruction, a supply temperature of the temperature control medium based on a target temperature corresponding to the constant temperature maintenance instruction; determining a supply flow rate of the temperature control medium based on a difference between a current temperature in the experimental accommodation space and the target temperature; When the temperature control medium reaches the supply temperature, the liquid medium temperature control component is controlled to supply the temperature control medium to the container body at the supply flow rate until the temperature inside the container body reaches the target temperature.

8. The control method according to claim 7, characterized in that: The step of controlling the semiconductor temperature control component to precisely adjust the internal temperature of the experimental accommodation space in the container body includes: Turn off the liquid medium temperature control component and start the semiconductor temperature control component; Based on the external ambient temperature, the operating temperature of the semiconductor temperature control component is controlled to perform temperature compensation on the container body so that the container body is maintained at the target temperature.

9. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program for implementing the control method according to any one of claims 6 to 8.

10. A control device, characterized in that: include: a memory storing a computer program; a processor, configured to execute the computer program; Wherein, when executing the computer program, the processor implements the control method according to any one of claims 6 to 8.

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