Piezoelectric ceramic atomization sheet

Abstract

The piezoelectric ceramic atomization piece comprises an upper-layer piezoelectric ceramic piece, an upper-layer metal piece, a middle-layer piezoelectric ceramic piece, a lower-layer metal piece and a lower-layer piezoelectric ceramic piece which are sequentially arranged in a stacked mode. The Young modulus of the upper layer piezoelectric ceramic piece, the Young modulus of the middle layer piezoelectric ceramic piece and the Young modulus of the lower layer piezoelectric ceramic piece are sequentially arranged in a gradient mode. Thus, compared with a piezoelectric ceramic atomization piece in the related technology, the Young modulus of the upper layer piezoelectric ceramic piece, the Young modulus of the middle layer piezoelectric ceramic piece and the Young modulus of the lower layer piezoelectric ceramic piece of the piezoelectric ceramic atomization piece are changed in a gradient mode, so that the Young modulus difference of every two adjacent layers of piezoelectric ceramic pieces is in smooth transition; therefore, generation and expansion of microcracks of all layers of piezoelectric ceramic pieces are effectively restrained, the structural stability and the anti-fatigue performance of the piezoelectric ceramic atomization piece are improved, and then the piezoelectric ceramic atomization piece is not prone to damage.

Description

Technical Field

[0001] The present application relates to the field of atomization technology, and in particular to a piezoelectric ceramic atomizer. Background Art

[0002] Piezoelectric ceramic atomizers can convert electrical energy into high-frequency mechanical vibrations through the inverse piezoelectric effect, causing cavitation and atomization of the liquid. However, in related technologies, the piezoelectric ceramic atomizers are susceptible to microcracks caused by stress concentration under high-frequency vibration, which can lead to damage to the piezoelectric ceramic atomizers. Summary of the Invention

[0003] The embodiments of the present application provide a piezoelectric ceramic atomizer that can solve at least one of the above-mentioned technical problems.

[0004] An embodiment of the present application provides a piezoelectric ceramic atomizer sheet, comprising an upper piezoelectric ceramic sheet, an upper metal sheet, an intermediate piezoelectric ceramic sheet, a lower metal sheet, and a lower piezoelectric ceramic sheet stacked in sequence; wherein the Young's modulus of the upper piezoelectric ceramic sheet, the Young's modulus of the intermediate piezoelectric ceramic sheet, and the Young's modulus of the lower piezoelectric ceramic sheet are arranged in a gradient manner.

[0005] In some embodiments, the Young's modulus of the lower piezoelectric ceramic sheet, the Young's modulus of the middle piezoelectric ceramic sheet, and the Young's modulus of the upper piezoelectric ceramic sheet decrease in sequence.

[0006] In some embodiments, the Young's modulus of the upper piezoelectric ceramic sheet is 50 GPa-60 GPa; The Young's modulus of the intermediate layer piezoelectric ceramic sheet is 70 GPa-80 GPa; The Young's modulus of the lower piezoelectric ceramic sheet is 90 GPa-100 GPa.

[0007] In some embodiments, the upper piezoelectric ceramic sheet, the middle piezoelectric ceramic sheet, and the lower piezoelectric ceramic sheet cooperate to form a receiving through hole, and the receiving through hole penetrates the upper piezoelectric ceramic sheet, the middle piezoelectric ceramic sheet, and the lower piezoelectric ceramic sheet; The upper metal sheet includes a first atomizing portion, a first supporting portion, and a first connecting portion connected in sequence, the first atomizing portion and the first supporting portion are located in the accommodating through hole, and the first connecting portion is clamped between the upper piezoelectric ceramic sheet and the middle piezoelectric ceramic sheet; the lower metal sheet includes a second atomizing portion, a second supporting portion, and a second connecting portion connected in sequence, the second atomizing portion and the second supporting portion are located in the accommodating through hole, and the second connecting portion is clamped between the upper piezoelectric ceramic sheet and the middle piezoelectric ceramic sheet; Along the radial direction of the piezoelectric ceramic atomizing sheet, the first supporting portion is arranged in a wave shape, and / or the second supporting portion is arranged in a wave shape.

[0008] In some embodiments, the first atomizing portion is provided to protrude from the middle piezoelectric ceramic sheet toward the upper piezoelectric ceramic sheet.

[0009] In some embodiments, the first atomization portion is provided with a plurality of first atomization through holes, each of the first atomization through holes passes through the first atomization portion, and the aperture of each first atomization through hole gradually decreases from the middle piezoelectric ceramic sheet toward the upper piezoelectric ceramic sheet.

[0010] In some embodiments, the second atomizing portion is provided to protrude from the middle piezoelectric ceramic sheet toward the lower piezoelectric ceramic sheet.

[0011] In some embodiments, the second atomization portion is provided with a plurality of second atomization through holes, each of which passes through the second atomization portion, and the aperture of each of the second atomization through holes gradually increases from the middle piezoelectric ceramic sheet toward the lower piezoelectric ceramic sheet.

[0012] In some embodiments, the second atomizing portion includes an atomizing sub-portion and a reflux sub-portion, the atomizing sub-portion is arranged around the reflux sub-portion, and the plurality of second atomizing through holes are arranged in the atomizing sub-portion; The reflux sub-section is provided with a plurality of reflux holes, each of the reflux holes passes through the reflux sub-section, and the aperture of the reflux holes gradually decreases from the middle piezoelectric ceramic sheet toward the lower piezoelectric ceramic sheet.

[0013] In some embodiments, the upper piezoelectric ceramic sheet, the upper metal sheet, the middle piezoelectric ceramic sheet, the lower metal sheet, and the lower piezoelectric ceramic sheet are bonded in sequence.

[0014] In the piezoelectric ceramic atomizer provided in the embodiment of the present application, the piezoelectric ceramic atomizer includes an upper piezoelectric ceramic sheet, an upper metal sheet, an intermediate piezoelectric ceramic sheet, a lower metal sheet and a lower piezoelectric ceramic sheet stacked in sequence; wherein the Young's modulus of the upper piezoelectric ceramic sheet, the Young's modulus of the intermediate piezoelectric ceramic sheet and the Young's modulus of the lower piezoelectric ceramic sheet are arranged in a gradient manner. In this way, compared with the piezoelectric ceramic atomizer sheet in the related art, the Young's modulus of the upper piezoelectric ceramic sheet, the Young's modulus of the middle piezoelectric ceramic sheet and the lower piezoelectric ceramic sheet of the piezoelectric ceramic atomizer sheet of the present application show a gradient change, so that the difference in Young's modulus of the two adjacent piezoelectric ceramic sheets transitions smoothly, which significantly reduces the stress concentration phenomenon caused by the sudden change in material stiffness of the piezoelectric ceramic sheet during high-frequency vibration, helps to reduce the risk of local high stress areas at the interface or inside, thereby effectively inhibiting the initiation and expansion of microcracks in each layer of piezoelectric ceramic sheets, improving the structural stability and fatigue resistance of the piezoelectric ceramic atomizer sheet, and making the piezoelectric ceramic atomizer sheet less prone to damage. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0016] Figure 1 This is a schematic diagram of the structure of the piezoelectric ceramic atomizer provided in an embodiment of the present application.

[0017] Figure 2 for Figure 1 Schematic cross-sectional view of a medium-pressure electric ceramic atomizer.

[0018] Figure 3 for Figure 2 Schematic diagram of the structure of the medium-pressure electric ceramic atomizer from another perspective.

[0019] Figure 4 for Figure 2 Enlarged schematic diagram of point A in the middle.

[0020] Description of Figure Numbers: 10. Piezoelectric ceramic atomizing sheet; 100. Upper piezoelectric ceramic sheet; 101. Through hole; 200. Upper metal sheet; 210. First atomizing section; 211. First atomizing through hole; 220. First supporting section; 230. First connecting section; 300. Middle piezoelectric ceramic sheet; 400. Lower metal sheet; 410. Second atomizing section; 411. Atomizing sub-section; 411a. Second atomizing through hole; 412. Return sub-section; 412a. Return through hole; 420. Second supporting section; 430. Second connecting section; 500. Lower piezoelectric ceramic sheet.

[0021] The realization of the objectives, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solutions and advantages of this application clearer, the following part will further describe the embodiments of this application in detail with reference to the accompanying drawings.

[0023] When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application, as detailed in the appended claims.

[0024] In the description of this application, it should be understood that the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances. In addition, in the description of this application, unless otherwise specified, "multiple" refers to two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the previous and subsequent associated objects are in an "or" relationship.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" as used herein includes any and all combinations of one or more of the relevant listed items.

[0026] Piezoelectric ceramic atomizers utilize the inverse piezoelectric effect of piezoelectric ceramics to convert electrical energy into high-frequency mechanical vibrations, thereby inducing liquid cavitation and achieving efficient atomization. However, the inventors discovered that in related art, the piezoelectric ceramic atomizers are susceptible to microcrack propagation due to stress concentration under high-frequency vibration, resulting in easy damage to the piezoelectric ceramic atomizers.

[0027] For this reason, see Figures 1 to 4 The present invention provides a piezoelectric ceramic atomizer 10. The piezoelectric ceramic atomizer 10 includes an upper piezoelectric ceramic sheet 100, an upper metal sheet 200, an intermediate piezoelectric ceramic sheet 300, a lower metal sheet 400, and a lower piezoelectric ceramic sheet 500, which are stacked in sequence. The Young's modulus of the upper piezoelectric ceramic sheet 100, the Young's modulus of the intermediate piezoelectric ceramic sheet 300, and the Young's modulus of the lower piezoelectric ceramic sheet 500 are arranged in a gradient. For example, the Young's modulus of the upper piezoelectric ceramic sheet 100, the Young's modulus of the intermediate piezoelectric ceramic sheet 300, and the Young's modulus of the lower piezoelectric ceramic sheet 500 increase or decrease in sequence.

[0028] In this way, compared with the piezoelectric ceramic atomizer sheet in the related art, the Young's modulus of the upper piezoelectric ceramic sheet 100, the Young's modulus of the middle piezoelectric ceramic sheet 300 and the Young's modulus of the lower piezoelectric ceramic sheet 500 of the piezoelectric ceramic atomizer sheet 10 of the present application show a gradient change, so that the difference in the Young's modulus of the two adjacent piezoelectric ceramic sheets transitions smoothly, which significantly reduces the stress concentration phenomenon caused by the sudden change in material stiffness of the piezoelectric ceramic sheet during high-frequency vibration, helps to reduce the risk of local high stress areas at the interface or inside, thereby effectively inhibiting the initiation and expansion of microcracks in each layer of piezoelectric ceramic sheets, improving the structural stability and fatigue resistance of the piezoelectric ceramic atomizer sheet 10, and making the piezoelectric ceramic atomizer sheet 10 not easy to be damaged.

[0029] In addition, under high-frequency alternating vibration conditions, the mechanical impedance mismatch between different material layers is a key factor in causing energy reflection, interface peeling, and structural fatigue. This application reduces the stiffness difference between two adjacent layers of piezoelectric ceramic sheets through the gradient design of Young's modulus, thereby improving the mechanical compatibility between the layers. This structure reduces the reflectivity of vibration waves when propagating between layers, improves the transmission efficiency of mechanical vibration energy, and reduces local heating caused by energy loss, thereby improving the overall vibration response performance and electro-mechanical conversion efficiency of the piezoelectric ceramic atomizer 10.

[0030] Furthermore, by configuring the Young's modulus of the upper piezoelectric ceramic sheet 100, the middle piezoelectric ceramic sheet 300, and the lower piezoelectric ceramic sheet 500 to increase in a gradient structure, a top-down, gradually enhanced mechanical support environment is constructed within the multilayer stack. This gradient modulus design changes the distribution of stress concentration at interfaces or edges in conventional homogeneous piezoelectric ceramics under high-frequency vibration, allowing for smooth axial transmission of vibration stress. This effectively mitigates local stress peaks caused by sudden changes in material stiffness and significantly reduces the risk of microcrack initiation and expansion within the piezoelectric ceramic atomizer sheet 10 and at the interfaces between layers.

[0031] It is understood that the Young's modulus gradient distribution of the upper piezoelectric ceramic sheet 100, the middle piezoelectric ceramic sheet 300, and the lower piezoelectric ceramic sheet 500 can be precisely adjusted by controlling the microscopic density and porosity of the ceramic body. In the case of a potassium sodium niobate (KNN)-based ceramic system, the density of the ceramic is positively correlated with its Young's modulus: higher material density results in denser internal grains, lower porosity, and a greater macroscopic Young's modulus. Conversely, introducing an appropriate amount of porosity into the material decreases the overall stiffness and the Young's modulus.

[0032] During the manufacturing process, the porosity of each ceramic layer can be independently controlled by adjusting process parameters such as the pressing pressure, sintering temperature, holding time, and the addition of pore-forming agents. For example, the lower piezoelectric ceramic sheet 500 is formed under high pressure and fully sintered at high temperature to achieve a low-porosity, high-density microstructure, resulting in a high Young's modulus of 90–100 GPa and providing excellent mechanical support. The middle piezoelectric ceramic sheet 300 is sintered and densified using moderate sintering conditions, retaining a small number of evenly distributed micropores, keeping its Young's modulus within the range of 70–80 GPa, thus serving as a mechanical transition. The upper piezoelectric ceramic sheet 100, by introducing controllable porosity or reducing the degree of sintering, forms a relatively loose porous structure with high porosity and low density, reducing the Young's modulus to 50–60 GPa. This facilitates the generation of greater mechanical strain under electric field excitation, thereby enhancing the vibration output amplitude.

[0033] Porosity regulation not only affects Young's modulus but also has a positive impact on the vibration energy transfer characteristics. The appropriately introduced microporous structure acts as a local stress buffer, absorbing some elastic wave energy during high-frequency vibration, suppressing the concentrated reflection of stress waves, and further reducing shear stress and delamination risks at the interface. This structural design achieves "functional-structural integration" regulation, optimizing the mechanical compatibility of multilayer devices without sacrificing piezoelectric performance.

[0034] The Young's modulus gradient distribution of the upper piezoelectric ceramic sheet 100, the middle piezoelectric ceramic sheet 300, and the lower piezoelectric ceramic sheet 500 can be controlled by adjusting the material composition. KNN-based ceramics can be significantly modified by doping with elements such as Li, Ta, and Sb to alter their crystal structure and mechanical properties. For example, appropriate Li doping can reduce the lattice constant of KNN ceramics, increase the bonding strength between grains, and thereby increase the Young's modulus. Excessive doping, however, can cause lattice distortion, introduce microcracks, and reduce overall stiffness. Therefore, by precisely controlling the doping ratio, the Young's modulus of the ceramic can be adjusted within a certain range.

[0035] When a high-frequency alternating current signal is applied between the upper piezoelectric ceramic sheet 100 and the lower piezoelectric ceramic sheet 500, the upper piezoelectric ceramic sheet 100, the middle piezoelectric ceramic sheet 300, and the lower piezoelectric ceramic sheet 500 simultaneously generate an inverse piezoelectric effect under the action of the electric field, inducing high-frequency mechanical vibration. This vibration, transmitted through the interlayers, drives the upper metal sheet 200 and the lower metal sheet 400 to produce a bending or longitudinal composite vibration mode, causing the liquid attached to their surfaces to undergo cavitation and break into micron-sized droplets. Because the Young's modulus of the upper piezoelectric ceramic sheet 100, the middle piezoelectric ceramic sheet 300, and the lower piezoelectric ceramic sheet 500 are set in a gradient, the mechanical stress generated during vibration is smoothly transferred between the layers, avoiding the formation of stress concentration points at the interface due to sudden changes in stiffness. Furthermore, the middle piezoelectric ceramic sheet 300 acts as a modulus transition layer, significantly reducing the peak shear and tensile stresses between the layers.

[0036] In some embodiments, during operation, the liquid first completes primary atomization on the lower metal sheet 400 to generate initial droplets; the initial droplets migrate upward under the action of the vibration-induced airflow and enter the space between the upper metal sheet 200 and the lower metal sheet 400, and are secondary refined and broken by the upper metal sheet 200 to achieve graded atomization.

[0037] In some embodiments, the Young's modulus of the lower piezoelectric ceramic sheet 500, the Young's modulus of the intermediate piezoelectric ceramic sheet 300, and the Young's modulus of the upper piezoelectric ceramic sheet 100 decrease in sequence, forming a gradient distribution with gradually decreasing stiffness from bottom to top. Specifically, the lower piezoelectric ceramic sheet 500 has a higher Young's modulus, providing good structural stiffness and load-bearing capacity, which can effectively resist the mechanical stress generated during high-frequency vibration and maintain the stability of the overall structure. The Young's modulus of the intermediate piezoelectric ceramic sheet 300 is between the Young's modulus of the lower piezoelectric ceramic sheet 500 and the Young's modulus of the upper piezoelectric ceramic sheet 100. As a mechanical transition layer, it alleviates the stiffness difference between the high modulus layer and the low modulus layer, making the stress more uniform and smooth during the interlayer transmission process, reducing the stress concentration phenomenon caused by material mutation. In addition, the Young's modulus of the upper piezoelectric ceramic sheet 100 is the smallest, and it is more likely to undergo elastic deformation under the action of the electric field, has a higher strain response capability, and can produce a larger vibration displacement. Because the upper piezoelectric ceramic sheet 100 is adjacent to the upper metal sheet 200, its significant deformation capacity can be efficiently transferred to the upper metal sheet 200, enhancing the vibration amplitude and dynamic response of the upper metal sheet 200 during operation, thereby strengthening the disturbance and shearing effect of the liquid at the edge of the micropores, promoting the rapid rupture of the liquid film and the generation of fine and uniform droplets, improving atomization efficiency and atomization quality. In this way, the structural design with a decreasing Young's modulus from bottom to top not only inhibits the initiation and expansion of microcracks and improves the fatigue resistance and service life of the piezoelectric ceramic atomizer sheet 10, but also further enhances the overall atomization effect of the piezoelectric ceramic atomizer sheet 10 by optimizing the deformation characteristics of the upper piezoelectric ceramic sheet 10.

[0038] In some embodiments, the Young's modulus of the upper piezoelectric ceramic sheet 100, the middle piezoelectric ceramic sheet 300, and the lower piezoelectric ceramic sheet 500 of the piezoelectric ceramic atomizer sheet 10 is distributed in a decreasing gradient from bottom to top. Specifically, the Young's modulus of the upper piezoelectric ceramic sheet 100 is 50 GPa to 60 GPa, the Young's modulus of the middle piezoelectric ceramic sheet 300 is 70 GPa to 80 GPa, and the Young's modulus of the lower piezoelectric ceramic sheet 500 is 90 GPa to 100 GPa.

[0039] Specifically, the Young's modulus of the upper piezoelectric ceramic sheet 100 is 50GPa to 60GPa, and the Young's modulus of the upper piezoelectric ceramic sheet 100 can be but not limited to 50GPa, 52GPa, 54GPa, 56GPa, 58GPa or 60GPa. The upper piezoelectric ceramic sheet 100 has a low Young's modulus, and the material exhibits good flexibility and high strain response characteristics. Under electric field excitation, the upper piezoelectric ceramic sheet 100 can produce a large mechanical deformation, effectively improving the vibration displacement amplitude. Since the upper piezoelectric ceramic sheet 100 is in direct contact with the upper metal sheet 200, its significant deformation ability can be efficiently transferred to the upper metal sheet 200, enhancing the dynamic vibration intensity of the upper metal sheet 200 during operation, strengthening the disturbance and shearing effect of the liquid at the microporous structure, promoting the rupture of the liquid film, and forming small, uniform droplets, thereby improving the atomization efficiency and atomization quality.

[0040] The Young's modulus of the intermediate layer piezoelectric ceramic sheet 300 is between 70 GPa and 80 GPa, forming a mechanical transition layer between the upper low modulus material and the lower high modulus material. The Young's modulus of the intermediate layer piezoelectric ceramic sheet 300 can be, but is not limited to, 70 GPa, 72 GPa, 74 GPa, 76 GPa, 78 GPa or 80 GPa. The intermediate layer piezoelectric ceramic sheet 300 assumes the function of stress transfer and distribution regulation during vibration, alleviates the stiffness difference between the upper piezoelectric ceramic sheet 100 and the lower piezoelectric ceramic sheet 500, and avoids stress concentration at the interface caused by sudden change in stiffness. The presence of the intermediate layer piezoelectric ceramic sheet 300 enables the multilayer structure to maintain good interlayer bonding stability under high-frequency alternating loads, reduces the risk of microcracks initiating in the interface area, and improves the durability of the overall structure.

[0041] The Young's modulus of the lower piezoelectric ceramic sheet 500 is 90GPa to 100GPa, which has high stiffness and structural strength, can effectively support the entire multi-layer stacked structure, and maintain the stability of the geometric shape during high-frequency vibrations. The Young's modulus of the lower piezoelectric ceramic sheet 500 can be, but is not limited to, 90GPa, 92GPa, 94GPa, 96GPa, 98GPa or 100GPa. The lower piezoelectric ceramic sheet 500 assumes the main mechanical bearing function, resisting the combined effects of external constraints and internal vibration stresses, and preventing the structure from failing due to excessive local deformation. The high modulus lower layer is also conducive to electrode connection and uniform distribution of the electric field, ensuring the stability of the electrical energy-mechanical energy conversion of the piezoelectric ceramic sheet during long-term operation.

[0042] See also Figures 2 to 4In some embodiments, the upper piezoelectric ceramic sheet 100, the middle piezoelectric ceramic sheet 300, and the lower piezoelectric ceramic sheet 500 of the piezoelectric ceramic atomization sheet 10 cooperatively form a through-hole 101 that extends through the center region of the upper piezoelectric ceramic sheet 100, the middle piezoelectric ceramic sheet 300, and the lower piezoelectric ceramic sheet 500 along the axial direction of the piezoelectric ceramic atomization sheet 10. The through-hole 101 provides a mounting area and a deformation avoidance space for the upper metal sheet 200 and the lower metal sheet 400, avoiding mechanical interference between the metal sheets (the upper metal sheet 200 and the lower metal sheet 400) and the ceramic layers (the upper piezoelectric ceramic sheet 100, the middle piezoelectric ceramic sheet 300, and the lower piezoelectric ceramic sheet 500) during vibration, while ensuring the geometric compatibility and movement freedom of the multi-layer structure under high-frequency working conditions.

[0043] The upper metal sheet 200 includes a first atomization portion 210, a first support portion 220, and a first connecting portion 230 connected in sequence. The first atomization portion 210 is located in the center region of the upper metal sheet 200 and is used to realize the atomization function. The surface of the first atomization portion 210 is provided with an array of micron-level through-holes 101 to support the formation of fine mist droplets under the action of vibration. The first support portion 220 is arranged around the outer peripheral edge of the first atomization portion 210, connects the first atomization portion 210 and the first connecting portion 230, and bears the functions of vibration transmission and structural support.

[0044] The first support portion 220 extends in a wave shape along the radial direction of the piezoelectric ceramic atomization sheet 10. The profile of the first support portion 220 is composed of continuous convex arc segments and concave arc segments, forming a periodically undulating elastic structure. This wave-shaped design endows the first support portion 220 with good radial flexibility and axial stiffness. When the piezoelectric ceramic sheet generates high-frequency vibration, the first support portion 220 can absorb part of the transverse shear stress and slight displacement deviation, playing a buffering and shock-absorbing role, reducing the concentration of stress at the interface between the metal and the ceramic, and inhibiting crack initiation.

[0045] The first support portion 220 adopts a ring structure that extends in a wave shape along the radial direction, so that the first support portion 220 has excellent elastic deformation capability. Under the high-frequency driving of the piezoelectric ceramic layer (such as the upper piezoelectric ceramic sheet 100, the middle piezoelectric ceramic sheet 300, or the lower piezoelectric ceramic sheet 500), the first support portion 220 can generate greater axial vibration displacement, thereby driving the first atomization portion 210 to realize greater mechanical oscillation, significantly improving the vibration intensity and liquid breaking capability of the first atomization portion 210, and improving the overall atomization efficiency.

[0046] The wavy first support part 220 effectively reduces the mechanical impedance mismatch between the upper metal sheet 200 and the piezoelectric ceramic layer. Due to the significant difference in mechanical parameters such as Young's modulus and density between metal and ceramic, the traditional planar connection structure is prone to interface reflection and energy loss during vibration. The first support part 220, through its periodic undulating geometry, forms a spring-like mechanical response characteristic, enhances the interlayer dynamic coupling capability, reduces the reflection and dissipation of vibration energy at the interface, and improves the electro-mechanical energy conversion efficiency.

[0047] In addition, the wavy first support part 220 has good stress dispersion function. Under the action of periodic expansion and contraction vibration of the piezoelectric ceramic layer, alternating stress is generated inside the multilayer structure. The wavy structure redistributes the concentrated stress along the wave crest and trough direction through local bending and tensile deformation, avoids excessive accumulation of stress in local area, effectively alleviates the shear stress and peeling force at the interface between the upper metal sheet 200 and the piezoelectric ceramic layer. This stress buffering mechanism significantly reduces the fatigue damage rate of the upper metal sheet 200, inhibits crack initiation and propagation, and prolongs the service life of the piezoelectric ceramic atomization sheet 10.

[0048] The first connecting part 230 is located at the outer edge of the first support part 220, surrounds the first support part 220, and is firmly clamped between the upper piezoelectric ceramic sheet 100 and the intermediate piezoelectric ceramic sheet 300 by interlayer pressing, which helps to realize the mechanical fixation and electrical connection of the upper metal sheet 200, ensures efficient transmission of vibration energy from the piezoelectric ceramic layer to the first atomization part 210, and at the same time maintains the integrity of the structure.

[0049] The lower metal sheet 400 includes a second atomization part 410, a second support part 420 and a second connecting part 430 connected in sequence. The second atomization part 410 is located in the central region of the lower metal sheet 400 and is used to realize the atomization function. The surface is provided with an array of micron-level through holes 101 to support the formation of fine mist droplets under the action of vibration. The second support part 420 is arranged around the outer peripheral edge of the second atomization part 410, connects the second atomization part 410 and the second connecting part 430, and bears the vibration transmission and structure support functions.

[0050] The second support part 420 extends in a wavy shape along the radial direction of the piezoelectric ceramic atomization sheet 10, and the profile of the second support part 420 is composed of continuous convex arc segments and concave arc segments, forming a periodically undulating elastic structure. This wavy design gives the second support part 420 good radial compliance and axial stiffness. When the piezoelectric ceramic sheet produces high-frequency vibration, it can absorb part of the transverse shear stress and slight displacement deviation, play a buffering and shock-absorbing role, reduce the concentration of stress at the interface between metal and ceramic, and inhibit crack initiation.

[0051] The second support portion 420 has a wave-shaped annular structure extending in the radial direction. The profile of the second support portion 420 is composed of continuous convex and concave arc segments, forming a periodically undulating elastic structure, so that the second support portion 420 has excellent elastic deformation capability. Under the high-frequency driving of the piezoelectric ceramic layer (e.g., the upper piezoelectric ceramic sheet 100, the middle piezoelectric ceramic sheet 300, or the lower piezoelectric ceramic sheet 500), the second support portion 420 can generate greater axial vibration displacement, thereby driving the second atomization portion 410 to achieve greater mechanical oscillation, significantly improving the vibration intensity and liquid breaking capability of the second atomization portion 410, and improving the overall atomization efficiency.

[0052] The wave-shaped second support portion 420 effectively reduces the mechanical impedance mismatch between the lower metal sheet 400 and the piezoelectric ceramic layer. Due to the significant difference in mechanical parameters such as Young's modulus and density between metal and ceramic, the traditional planar connection structure is prone to interface reflection and energy loss during vibration. The second support portion 420 has a periodically undulating geometry, forming a spring-like mechanical response characteristic, enhancing the interlayer dynamic coupling capability, reducing the reflection and dissipation of vibration energy at the interface, and improving the electrical-mechanical energy conversion efficiency.

[0053] In addition, the wave-shaped second support portion 420 has good stress dispersion function. Under the action of periodic expansion and contraction of the piezoelectric ceramic layer, alternating stress is generated inside the multilayer structure. The wave structure redistributes the concentrated stress along the wave crest and trough direction through local bending and tensile deformation, avoiding excessive accumulation of stress in local areas, effectively relieving the shear stress and peeling force at the interface between the lower metal sheet 400 and the piezoelectric ceramic layer. This stress buffering mechanism significantly reduces the fatigue damage rate of the lower metal sheet 400, inhibits crack initiation and propagation, and prolongs the service life of the piezoelectric ceramic atomization sheet 10.

[0054] The second connection portion 430 is located at the outer edge of the second support portion 420 and surrounds the second support portion 420. It is firmly clamped between the lower metal sheet 400 and the middle piezoelectric ceramic sheet 300 by interlayer pressing, which helps to achieve mechanical fixation and electrical connection of the lower metal sheet 400, ensures efficient transmission of vibration energy from the piezoelectric ceramic layer to the second atomization portion 410, and maintains the integrity of the structure.

[0055] Please refer to Figure 2 In some embodiments, the first atomization portion 210 is protrudingly arranged from the middle piezoelectric ceramic sheet 300 to the upper piezoelectric ceramic sheet 100, forming a curved structure protruding outward, so that the geometric surface area of the first atomization portion 210 is greater than the projected area of the plane where the first support portion 220 is located. Under the same installation space, the effective surface area available for carrying liquid and atomization is significantly increased.

[0056] The raised arrangement of the first atomizing section 210 significantly increases the actual surface area under the same projected area, thereby expanding the effective atomization area. The increased atomization area supports the arrangement of more atomizing micropores, thereby improving the atomization volume and output efficiency per unit time. Driven by high-frequency vibration, the liquid forms a dynamic liquid film on the curved surface of the first atomizing section 210. Due to the expansion effect of the curved surface, the liquid is more evenly distributed, avoiding local accumulation of liquid or drying up, and improving the continuity and stability of atomization. At the same time, the curved surface of the first atomizing section 210 is conducive to the rapid separation of droplets from the atomizing surface after formation, reducing backflow and secondary aggregation, and improving the fineness and dispersion of atomization.

[0057] During operation, the piezoelectric ceramic layer generates high-frequency vibrations, which are transmitted through the clamping parts to the upper metal sheet 200 and the lower metal sheet 400. Because the upper metal sheet 200 is located at the top and the first atomizing portion 210 protrudes upward, it directly faces the user or the mist outlet channel and is responsible for the main atomization output function.

[0058] In some embodiments, the first atomizing portion 210 of the upper metal sheet 200 of the piezoelectric ceramic atomizing sheet 10 is provided with a plurality of first atomizing through holes 211, all of which extend through the thickness of the first atomizing portion 210 to form a channel for liquid atomization. The aperture of each first atomizing through hole 211 gradually decreases in the axial direction from the middle piezoelectric ceramic sheet 300 toward the upper piezoelectric ceramic sheet 100, forming a tapered hole structure with a conical inner wall. The inlet end of the first atomizing through hole 211 is located on the side of the first atomizing portion 210 close to the middle piezoelectric ceramic sheet 300, and has a larger aperture; the outlet end of the first atomizing through hole 211 is located on the outer surface of the first atomizing portion 210 facing the upper piezoelectric ceramic sheet 100, and has a smaller aperture.

[0059] The tapered structure of the first atomizing through-hole 211 optimizes the flow behavior of the liquid in the micropores and the pressure distribution during the atomization process. Under the action of vibration, the piezoelectric ceramic layer drives the upper metal sheet 200 to generate high-frequency mechanical oscillations, and the liquid moves from the large-diameter end to the small-diameter end of the pore. As the cross-sectional area of ​​the pore gradually decreases, the flow rate of the liquid in the outlet area accelerates, forming a local high pressure difference, enhancing the shear force and injection kinetic energy of the liquid at the micropore outlet, and helping the liquid to quickly stretch and break into fine droplets when it leaves the atomizing surface, significantly improving the atomization efficiency and droplet uniformity.

[0060] Furthermore, the tapered aperture design of the first atomizing through-hole 211 improves the capillary control of the liquid. The larger inlet aperture facilitates rapid replenishment of liquid from the liquid storage area to the micropores, improving liquid supply efficiency. The smaller outlet aperture enhances the surface tension's restraining effect on the liquid surface, preventing un-atomized liquid from dripping in the absence of vibration, thereby enhancing the atomizer's leak-proof performance and operational safety. At the moment of vibration initiation, the smaller liquid bridge at the outlet is more easily destroyed by high-frequency disturbances, achieving a rapid mist initiation response.

[0061] The tapered structure of the first atomizing through-hole 211 works synergistically with the convex surface of the first atomizing portion 210. The convex surface expands the effective atomization area, accommodating more atomizing through-holes 101; the tapered design of each through-hole 101 further enhances single-hole atomization performance. This combination achieves a high-density micropore layout and high-quality atomization output, making the piezoelectric ceramic atomizer 10 more suitable for precision atomization applications requiring high atomization volume, fine mist particles, and low residue.

[0062] In some embodiments, the second atomizing portion 410 of the lower metal sheet 400 of the piezoelectric ceramic atomizing sheet 10 is convexly arranged from the intermediate piezoelectric ceramic sheet 300 toward the lower piezoelectric ceramic sheet 500, forming an arc-shaped curved surface structure extending axially downward. This convex shape gives the outer surface of the second atomizing portion 410 a dome-shaped or parabolic shape, with its geometric center located closer to the lower piezoelectric ceramic sheet 500 than the surrounding connection area, forming a downward-facing primary atomizing working surface.

[0063] The raised structure of the second atomizing section 410 significantly increases the actual surface area under the same projected area, effectively expanding the area available for carrying liquid and performing atomization reactions. The increased atomization area supports a higher density of atomization micropores, increases the amount of liquid involved in atomization per unit time, and enhances the initial atomization capability of the atomizer. Under high-frequency vibration excitation, the liquid forms a dynamic liquid film on the raised surface. The curved surface structure facilitates the uniform spreading of the liquid, avoids localized accumulation of liquid or drying up, and improves the utilization rate of the liquid and the continuity of the atomization process.

[0064] The raised second atomizing section 410 exhibits excellent mechanical response characteristics during vibration. Due to its structural elastic deformation capability, it generates a composite axial and radial vibration mode when driven by the piezoelectric ceramic layer. This enhances the disturbance intensity around the micropores, promotes shear and cavitation effects at the orifices, and achieves efficient atomization. The curved surface also helps droplets quickly detach from the atomizing surface after formation, reducing backflow and secondary aggregation, and improving atomization dispersion and spray uniformity.

[0065] The second atomizing section 410 is provided with a plurality of second atomizing through-holes 411a extending through its thickness. The second atomizing through-holes 411a extend axially through the raised area and serve as channels for liquid atomization. These through-holes 101 can adopt straight holes, inverted cones, or right cone structures, and are optimized according to the liquid properties and target droplet size. In actual operation, the liquid is first directed to the surface of the second atomizing section 410, where it is initially atomized under the action of vibration to generate an initial droplet group.

[0066] The downwardly protruding second atomizing section 410 serves as a primary atomizing unit, providing pretreatment for the subsequent atomization process. The initially atomized droplets migrate upward under the influence of airflow or vibration-induced flow, entering the upper metal sheet 200 region above them, where they undergo secondary fine atomization by the first atomizing section 210. This hierarchical atomization mechanism optimizes the atomization process in stages through spatial layout and structural design, improving overall atomization fineness, output stability, and energy efficiency.

[0067] The raised structure of the second atomizing section 410 is manufactured through precision stamping, etching, or electroforming processes to ensure geometric accuracy and structural consistency. Its curvature radius, wall thickness, and edge transition parameters are optimized based on vibration modes, material properties, and fluid behavior, balancing improved atomization performance with long-term structural durability. This design fully utilizes three-dimensional space to increase atomization density without increasing the device's planar dimensions, making it suitable for applications requiring high atomization efficiency, miniaturization, and reliability.

[0068] In some embodiments, the second atomizing portion 410 of the lower metal sheet 400 of the piezoelectric ceramic atomizing sheet 10 is provided with a plurality of second atomizing through-holes 411a. All second atomizing through-holes 411a extend through the thickness of the second atomizing portion 410 and are axially distributed in a curved area that protrudes from the middle piezoelectric ceramic sheet 300 toward the lower piezoelectric ceramic sheet 500. The aperture of each second atomizing through-hole 411a gradually increases from the side of the middle piezoelectric ceramic sheet 300 toward the side of the lower piezoelectric ceramic sheet 500, forming a tapered contraction structure with a large aperture at the inlet end and a small aperture at the outlet end. The inner wall of the tapered channel presents a smoothly transitioned cohesive conical surface to avoid flow obstruction or stress concentration.

[0069] The tapered structure of the second atomizing through hole 411a optimizes the flow behavior and atomization characteristics of the liquid in the primary atomization stage. Under the high-frequency vibration excitation of the piezoelectric ceramic layer, the lower metal sheet 400 generates mechanical oscillations, and the liquid enters from the large-diameter end of the through hole 101. In the process of moving toward the small-diameter end, the flow cross-sectional area gradually decreases, and the fluid speed continues to accelerate, forming an accelerated jet. This acceleration effect significantly enhances the shear force and injection kinetic energy of the liquid in the outlet area, prompting the liquid film to quickly stretch and break when it leaves the atomizing surface, achieving efficient initial atomization and generating an initial droplet group with small particle size and uniform distribution.

[0070] The tapered channel design improves both the liquid supply capacity and the leak-proof performance. The larger inlet aperture reduces the flow resistance of the liquid from the liquid supply channel into the micropores, which is conducive to rapid liquid replenishment and improves the liquid supply efficiency of the primary atomization; the smaller outlet aperture enhances the surface tension constraint of the liquid at the outlet of the atomization surface, effectively preventing liquid dripping due to gravity or capillary pressure difference in a non-vibration state, and improving the sealing reliability of the piezoelectric ceramic atomizer 10 when it is stationary or tilted. At the moment of vibration initiation, the smaller liquid bridge size at the outlet is more easily destroyed by high-frequency disturbances, achieving a rapid mist start response and reducing the generation of initial large droplets.

[0071] The constricted structure of the second atomizing through-holes 411a and the downwardly convex shape of the second atomizing portion 410 work synergistically. The convex curve expands the effective surface area of ​​the primary atomization region, supporting a higher density of second atomizing through-holes 411a and increasing the number of atomization points per unit area. The tapered design of each through-hole 101 further enhances single-hole atomization performance. This combination achieves both high-throughput liquid processing and high-quality primary atomization, providing a stable, fine source of initial droplets for the subsequent secondary atomization process.

[0072] During operation, the liquid is initially atomized in the second atomization section 410. The resulting initial droplets migrate upward due to vibration-induced airflow or capillary transport, entering the upper metal sheet 200 region. The first atomization section 210, through its inherent structure (e.g., the raised ridges and tapering holes 101), performs a secondary fine-scale fragmentation on the migrating droplets, achieving graded atomization. This structural design significantly improves overall atomization fineness, output uniformity, and energy efficiency through the coordinated optimization of channel geometry and spatial layout.

[0073] In some embodiments, the second atomizing portion 410 of the lower metal sheet 400 of the piezoelectric ceramic atomizing sheet 10 includes an atomizing sub-section 411 and a reflux sub-section 412. The atomizing sub-section 411 is arranged around the reflux sub-section 412, and the two together constitute a composite functional area of ​​the second atomizing portion 410. The atomizing sub-section 411 is located in the peripheral area of ​​the second atomizing portion 410 and assumes the primary atomization function. A plurality of second atomizing through holes 411a are distributed in the thickness direction of the atomizing sub-section 411, penetrating its downwardly convex curved surface structure. The aperture of each second atomizing through hole 411a gradually decreases from the side of the middle layer piezoelectric ceramic sheet 300 toward the side of the lower layer piezoelectric ceramic sheet 500, forming a tapered contraction channel with a large inlet end and a small outlet end, which is conducive to the accelerated spraying of the liquid at the outlet and the breakage into fine droplets, thereby achieving efficient primary atomization.

[0074] The reflux sub-section 412 is located in the center of the second atomizing section 410 and is surrounded by the atomizing sub-section 411, forming a functional area for liquid circulation and dynamic regulation. The reflux sub-section 412 is provided with multiple reflux holes 412a, all of which extend through the thickness of the reflux sub-section 412 and axially penetrate its raised structure. The diameter of each reflux hole 412a gradually decreases from the side of the middle piezoelectric ceramic sheet 300 toward the side of the lower piezoelectric ceramic sheet 500, forming a tapered channel with a conical inner wall. This decreasing aperture structure plays a key role in the liquid reflux process.

[0075] The tapered design of the reflux hole 412a significantly enhances the directional selectivity and controllability of the liquid reflux. When the piezoelectric ceramic layer is not stimulated, the liquid tends to flow downward under gravity or capillary action. However, due to the small aperture of the outlet end of the reflux hole 412a, the liquid is subject to strong surface tension at the outlet, forming a stable meniscus, which effectively prevents uncontrolled dripping of the liquid and improves the sealing performance of the piezoelectric ceramic atomizer 10 in the standby or tilted state. During the vibration process, the piezoelectric ceramic sheet generates high-frequency mechanical oscillations. Under the action of inertial force and vibration acceleration, the liquid overcomes the surface tension and flows from the large diameter end to the small diameter end, achieving directional reflux.

[0076] The gradually decreasing aperture structure from top to bottom also optimizes the fluid dynamics during the reflux process. After the liquid enters the large-diameter end of the reflux orifice 412a, the flow area gradually decreases and the flow rate gradually increases, forming an accelerated flow state. This helps to quickly propel unatomized or condensed droplets away from the atomization surface and into the liquid storage chamber or liquid supply channel below, completing recirculation. This acceleration effect prevents liquid from stagnating within the reflux subsection 412, reducing the risk of liquid accumulation and localized dry burning, and improving system thermal management and long-term operational stability.

[0077] Furthermore, the structure of the tapered return flow hole 412a and the tapered second atomizing through-hole 411a of the atomizing sub-section 411 achieve functional synergy and structural unity. Both utilize a tapered design, allowing for simultaneous molding using the same processing technique (such as laser micromachining, electroforming, or anisotropic etching), ensuring manufacturing consistency and process compatibility. This design also ensures that the return flow sub-section 412 exhibits similar mechanical response characteristics during vibration to those of the atomizing sub-section 411, reducing stress mismatch caused by structural differences and improving the overall vibration synchronization and structural durability of the underlying metal sheet 400.

[0078] The cooperative layout of the atomization sub-portion 411 and the backflow sub-portion 412 optimizes the distribution and flow path of the liquid on the surface of the second atomization portion 410. The liquid first enters the atomization sub-portion 411 from the central area through the backflow sub-portion 412 or the edge liquid supply channel, migrates to the periphery under the action of vibration, and participates in atomization; the liquid that is not completely atomized or the condensed liquid droplets return through the central backflow through hole 412a, forming a dynamic circulation mode of "outward atomization and inward backflow". This fluid management mechanism improves the atomization response speed and continuous working ability, and is especially suitable for application scenarios with long-time operation or large liquid supply fluctuations.

[0079] In some embodiments, the upper piezoelectric ceramic sheet 100, the upper metal sheet 200, the intermediate piezoelectric ceramic sheet 300, the lower metal sheet 400, and the lower piezoelectric ceramic sheet 500 of the piezoelectric ceramic atomization sheet 10 are arranged in sequence along the axial direction, and are firmly connected by bonding between layers. The bonding process ensures the integrity and cooperative motion ability of the multi-layer structure during high-frequency vibration, prevents relative slipping or loosening between layers, and improves the transmission efficiency of vibration energy and structural stability.

[0080] The bonding uses a high-temperature-resistant and high-elasticity microelectronic adhesive. The adhesive material has good shear strength, fatigue resistance, and environmental resistance, and can maintain bonding reliability under high temperature, high humidity, and long-term alternating stress conditions. Common bonding materials include epoxy resin modified glue, silicone packaging glue, or polyimide adhesive, which are selected according to process temperature and service environment. The thickness of the bonding layer is controlled in the range of 5 μm to 20 μm, which ensures sufficient bonding strength and avoids increasing vibration damping or stress transmission lag due to excessive thickness of the glue layer.

[0081] The upper piezoelectric ceramic sheet 100 and the upper metal sheet 200 are fixed by bonding, which ensures that the connecting portion of the upper metal sheet 200 is stably clamped and mechanically coupled. The intermediate piezoelectric ceramic sheet 300 is located between the upper metal sheet 200 and the lower metal sheet 400, and is bonded with both of them, forming a symmetrical support structure of the upper and lower metal sheets. The lower piezoelectric ceramic sheet 500 and the lower metal sheet 400 are also connected by bonding, completing the packaging of the entire laminated structure.

[0082] In some embodiments, the upper piezoelectric ceramic sheet 100, the intermediate piezoelectric ceramic sheet 300, and the lower piezoelectric ceramic sheet 500 are made of lead-free piezoelectric ceramic materials. The lead-free piezoelectric ceramic material can be a potassium sodium niobate-based system or a sodium bismuth titanate-based system, etc. Lead-free design significantly reduces potential harm to the environment and human health.

[0083] In some embodiments, the upper metal sheet 200 and the lower metal sheet 400 can be made of stainless steel or titanium alloy, etc.

[0084] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of this application, it should be understood that if the terms "up", "down", "left", "right", etc. indicate directions or positional relationships, they are based on the directions or positional relationships shown in the drawings. This is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limiting this application. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0085] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A piezoelectric ceramic atomizing sheet, characterized in that: It comprises an upper piezoelectric ceramic sheet, an upper metal sheet, an intermediate piezoelectric ceramic sheet, a lower metal sheet and a lower piezoelectric ceramic sheet stacked in sequence; wherein the Young's modulus of the upper piezoelectric ceramic sheet, the Young's modulus of the intermediate piezoelectric ceramic sheet and the Young's modulus of the lower piezoelectric ceramic sheet are arranged in a gradient manner.

2. The piezoelectric ceramic atomizing sheet according to claim 1, characterized in that: The Young's modulus of the lower piezoelectric ceramic sheet, the Young's modulus of the middle piezoelectric ceramic sheet, and the Young's modulus of the upper piezoelectric ceramic sheet decrease in sequence.

3. The piezoelectric ceramic atomizing sheet according to claim 2, characterized in that: The Young's modulus of the upper piezoelectric ceramic sheet is 50 GPa-60 GPa; The Young's modulus of the intermediate layer piezoelectric ceramic sheet is 70 GPa-80 GPa; The Young's modulus of the lower piezoelectric ceramic sheet is 90 GPa-100 GPa.

4. The piezoelectric ceramic atomizing sheet according to claim 1, characterized in that: The upper piezoelectric ceramic sheet, the middle piezoelectric ceramic sheet and the lower piezoelectric ceramic sheet cooperate to form a receiving through hole, and the receiving through hole penetrates the upper piezoelectric ceramic sheet, the middle piezoelectric ceramic sheet and the lower piezoelectric ceramic sheet; The upper metal sheet includes a first atomizing portion, a first supporting portion, and a first connecting portion connected in sequence, the first atomizing portion and the first supporting portion are located in the accommodating through hole, and the first connecting portion is clamped between the upper piezoelectric ceramic sheet and the middle piezoelectric ceramic sheet; the lower metal sheet includes a second atomizing portion, a second supporting portion, and a second connecting portion connected in sequence, the second atomizing portion and the second supporting portion are located in the accommodating through hole, and the second connecting portion is clamped between the upper piezoelectric ceramic sheet and the middle piezoelectric ceramic sheet; Along the radial direction of the piezoelectric ceramic atomizing sheet, the first supporting portion is arranged in a wave shape, and / or the second supporting portion is arranged in a wave shape.

5. The piezoelectric ceramic atomizing sheet according to claim 4, characterized in that: The first atomizing portion is protruded from the middle piezoelectric ceramic sheet toward the upper piezoelectric ceramic sheet.

6. The piezoelectric ceramic atomizing sheet according to claim 5, characterized in that: The first atomizing portion is provided with a plurality of first atomizing through holes, each of which passes through the first atomizing portion, and the aperture of each of the first atomizing through holes gradually decreases from the middle piezoelectric ceramic sheet toward the upper piezoelectric ceramic sheet.

7. The piezoelectric ceramic atomizing sheet according to claim 4, characterized in that: The second atomizing portion is protruded from the middle piezoelectric ceramic sheet toward the lower piezoelectric ceramic sheet.

8. The piezoelectric ceramic atomizing sheet according to claim 7, characterized in that: The second atomizing portion is provided with a plurality of second atomizing through holes, each of which passes through the second atomizing portion, and the aperture of each of the second atomizing through holes gradually increases from the middle piezoelectric ceramic sheet toward the lower piezoelectric ceramic sheet.

9. The piezoelectric ceramic atomizing sheet according to claim 8, characterized in that: The second atomizing portion includes an atomizing sub-portion and a reflux sub-portion, the atomizing sub-portion is arranged around the reflux sub-portion, and the plurality of second atomizing through holes are arranged in the atomizing sub-portion; The reflux sub-section is provided with a plurality of reflux holes, each of the reflux holes passes through the reflux sub-section, and the aperture of the reflux holes gradually decreases from the middle piezoelectric ceramic sheet toward the lower piezoelectric ceramic sheet.

10. The piezoelectric ceramic atomizing sheet according to any one of claims 1 to 9, characterized in that: The upper piezoelectric ceramic sheet, the upper metal sheet, the middle piezoelectric ceramic sheet, the lower metal sheet and the lower piezoelectric ceramic sheet are bonded in sequence.

Images