A slitting apparatus for silicon carbide ceramic production

Abstract

The application discloses a slitting equipment based on silicon carbide ceramic product production and relates to the technical field of silicon wafer processing. The slitting equipment comprises a base, a diamond wire cutting machine, a positioning adjusting mechanism and a cooling pipe, and further comprises a wire processing mechanism which is installed on the top of the base and is used for cleaning the diamond wire in the diamond wire cutting machine, a wire separation mechanism which is connected with the wire processing mechanism and is used for separating the metal cleaned from the diamond wire, and a cooling liquid separation mechanism which is installed on the top of the base and is used for separating the metal in the cooling liquid. The slitting equipment based on silicon carbide ceramic product production can timely remove the impurities outside the diamond wire, avoids the problem that the impurities outside the diamond wire gather at the guide wheel in the diamond wire cutting machine and cause the diamond wire to fluctuate and jump, and further avoids the problem that the fluctuation of the silicon wafer cutting surface causes the unevenness of the cutting surface.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer processing technology, and more specifically to a slitting device based on the production of silicon carbide ceramic products. Background Technology

[0002] Silicon carbide ceramic products include silicon wafers. With the development of new energy, the application of photovoltaic equipment has become extremely popular. The silicon wafers of photovoltaic equipment need to be cut according to specific production needs during processing. Diamond wire is usually used to cut the silicon wafers.

[0003] In the process of cutting silicon wafers, existing slitting equipment cannot remove impurities from the outside of the diamond wire in a timely manner. This causes these impurities to accumulate at the guide roller, which in turn causes the diamond wire to fluctuate and jump. This phenomenon further causes fluctuations in the cut surface of the silicon wafer, ultimately resulting in an uneven cut surface. Summary of the Invention

[0004] The purpose of this invention is to provide a slitting device based on silicon carbide ceramic products, in order to solve the problem that in the existing technology, impurities on the outside of the diamond wire are difficult to remove in time during the silicon wafer cutting process, causing these impurities to easily accumulate at the guide roller, which in turn causes the diamond wire to fluctuate and jump. This phenomenon further causes fluctuations in the silicon wafer cutting surface, ultimately resulting in an uneven cutting surface.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a slitting device for the production of silicon carbide ceramic products, comprising a base, a diamond wire cutting machine, a positioning and adjustment mechanism, and a cooling pipe, and further comprising:

[0006] The wire handling mechanism, mounted on top of the base, is used to clean the diamond wire in the diamond wire cutting machine.

[0007] The online separation mechanism, which is connected to the wire processing mechanism, is used to separate the metal removed from the diamond wire;

[0008] The coolant separation mechanism, mounted on top of the base, is used to separate metal from the coolant.

[0009] Furthermore, the line processing mechanism includes a first fixed seat mounted on the top of the base, a cleaning block rotatably connected inside the first fixed seat, and a drive assembly for driving the cleaning block to rotate;

[0010] The cleaning block has a through-hole groove that is compatible with diamond wire.

[0011] Furthermore, the drive assembly includes a first motor mounted on the outer wall of one side of the first fixed base and a first gear respectively fixedly sleeved on the outside of the output shaft of the first motor and the outside of the cleaning block;

[0012] The two first gears mesh with each other.

[0013] Furthermore, the online separation mechanism includes a second fixed seat mounted on the top of the base, a fixed sleeve mounted inside the second fixed seat, a plurality of first electromagnetic rollers disposed inside the fixed sleeve, and a displacement assembly for driving the first electromagnetic rollers to move.

[0014] One end of the cleaning block is rotatably connected to the inside of the fixed sleeve;

[0015] The outer wall of the fixed sleeve has multiple discharge ports.

[0016] Furthermore, the displacement assembly includes a slide rod fixed to one end of the first electromagnet roller, a driven block fixedly sleeved outside the slide rod, and a gear ring rotatably connected inside the fixed sleeve.

[0017] A spring is fixedly connected to the outer wall of one side of the driven block, and the other end of the spring is fixedly connected to the inner wall of the fixed sleeve.

[0018] A drive block is fixedly connected to the outer wall of one side of the gear ring. An oblique groove is opened on the outer wall of the drive block. The oblique groove cooperates with the driven block. A second motor is installed at one end of the fixed sleeve. A second gear is fixedly sleeved on the outside of the output shaft of the second motor. The second gear meshes with the gear ring.

[0019] Furthermore, multiple housings are installed on the inner wall of the fixed sleeve, and a first weighing module is installed at the bottom of the housing. One end of the first weighing module can be connected to the output end of the drive motor to drive the first weighing module to flip so as to discharge the metal on the top of the first weighing module. The other end of the first electromagnetic roller is equipped with an L-shaped baffle, which is slidably connected inside the fixed sleeve.

[0020] Furthermore, an industrial camera is mounted on the outer wall of the first mounting base, and the industrial camera is located below the diamond wire.

[0021] Furthermore, the coolant separation mechanism includes a manifold box installed on the top of the base, a second electromagnet roller rotatably connected inside the manifold box, and a second weighing module disposed below the second electromagnet roller;

[0022] One end of the second weighing module slides to the outside of the junction box, and a cylinder is installed on the top of the base, with the extended end of the cylinder fixedly connected to one end of the second weighing module.

[0023] Compared with the prior art, the slitting equipment for silicon carbide ceramic product manufacturing provided by the present invention has the following beneficial effects:

[0024] 1. During the silicon wafer cutting process, the centrifugal force generated when the cleaning block rotates throws out various impurities on the outer wall of the right side of the cleaning block. By removing the impurities outside the diamond wire in time, the accumulation of impurities outside the diamond wire at the guide wheel in the diamond wire cutting machine is avoided, which causes the diamond wire to fluctuate and jump. This also avoids the problem of uneven cut surface caused by fluctuation of the silicon wafer cutting surface.

[0025] 2. When the cleaning block rotates and throws out impurities, multiple first electromagnetic rollers adsorb metal fragments from the impurities. The first weighing module weighs the substrate worn off from the diamond wire. When the cooling pipe discharges coolant to cool the cutting area, a second electromagnetic roller adsorbs metal fragments from the coolant. The second weighing module weighs the substrate worn off from the diamond wire. During the silicon wafer cutting process, an industrial camera takes real-time pictures of the outside of the diamond wire. The computer system performs image analysis on the diamond wire and combines the weight of the worn diamond wire substrate from the first and second weighing modules to comprehensively determine when to replace the diamond wire. This avoids the problem of the diamond wire not being replaced in time, which affects the silicon wafer cutting effect. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0027] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0028] Figure 2 This is a schematic diagram of the line processing mechanism and the line separation mechanism of the present invention;

[0029] Figure 3 This is a schematic diagram of the external structure of the cleaning block and fixing sleeve of the present invention;

[0030] Figure 4 This is a first-view schematic diagram of the internal structure of the fixing sleeve of the present invention;

[0031] Figure 5 This is a second-view structural diagram of the internal structure of the fixing sleeve of the present invention;

[0032] Figure 6 This is a schematic diagram of the displacement component structure of the present invention;

[0033] Figure 7 This is a schematic diagram of the coolant separation mechanism of the present invention.

[0034] Explanation of reference numerals in the attached figures:

[0035] 1. Base; 2. Diamond wire cutting machine; 3. Positioning and adjustment mechanism; 4. Cooling pipe; 5. First fixed seat; 6. Cleaning block; 7. Wire groove; 8. First motor; 9. First gear; 10. Second fixed seat; 11. Fixed sleeve; 12. First electromagnet roller; 13. Waste discharge port; 14. Slide rod; 15. Driven block; 16. Gear ring; 17. Spring; 18. Drive block; 19. Second motor; 20. Second gear; 21. Housing; 22. Cylinder; 23. Baffle; 24. Industrial camera; 25. Combiner box; 26. Second electromagnet roller; 27. Second weighing module. Detailed Implementation

[0036] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0037] Example: Please refer to Figures 1-7 A slitting device for silicon carbide ceramic product manufacturing includes a base 1, a diamond wire cutter 2, a positioning and adjustment mechanism 3, and a cooling pipe 4. The diamond wire cutter 2, the positioning and adjustment mechanism 3, and the cooling pipe 4 are all mounted on the top of the base 1. The diamond wire cutter 2 is existing technology and is used to cut blocky silicon blocks into silicon wafers. The base material of the diamond wire can be tungsten iron alloy. The positioning and adjustment mechanism 3 is existing technology and includes: a clamping assembly for clamping and fixing the silicon block; and a displacement assembly for driving the silicon block to move forward at equal distances to control the thickness of the silicon wafer cutting. The lifting assembly is used to drive the silicon block to move upward so as to cooperate with the diamond wire to cut the silicon block. The clamping assembly includes a box mounted on the top of the base 1, a support plate set on the top of the box, and two hydraulic cylinders mounted on the top of the support plate. The extended ends of the two hydraulic cylinders are fixedly connected to clamping blocks. The displacement assembly includes an electric push rod mounted on the top of the support plate and a push block mounted on the extended end of the electric push rod. The push block is located between the two clamping blocks, and the width of the push block is smaller than the width of the silicon block. The lifting assembly includes a hydraulic cylinder mounted inside the box, and the extended end of the hydraulic cylinder is fixedly connected to the bottom of the support plate.

[0038] Also includes:

[0039] The wire processing mechanism, installed on the top of the base 1, is used to clean the diamond wire in the diamond wire cutting machine 2. The wire processing mechanism includes a first fixed seat 5 installed on the top of the base 1, a cleaning block 6 rotatably connected inside the first fixed seat 5, and a drive assembly for driving the cleaning block 6 to rotate. The cleaning block 6 has a through-hole wire groove 7 that is adapted to the diamond wire. The drive assembly includes a first motor 8 installed on the outer wall of one side of the first fixed seat 5 and first gears 9 respectively fixedly sleeved on the outside of the output shaft of the first motor 8 and the outside of the cleaning block 6. The two first gears 9 mesh with each other.

[0040] The diamond wire is installed through the wire groove 7. During the movement of the diamond wire, the wire groove 7 removes impurities such as metal debris, silicon powder, and coolant from the outside of the diamond wire to the right side of the cleaning block 6. The first motor 8 drives the first gear 9 outside its output shaft to rotate. Through the meshing action between the two first gears 9, the cleaning block 6 is driven to rotate. The centrifugal force generated when the cleaning block 6 rotates throws out the impurities on the outer wall of the right side of the cleaning block 6. By removing the impurities from the outside of the diamond wire in a timely manner, the accumulation of impurities at the guide wheel in the diamond wire cutting machine 2 is avoided, which would cause the diamond wire to fluctuate and jump. This also avoids the problem of uneven cut surface caused by fluctuation of the silicon wafer cutting surface.

[0041] The wire separation mechanism, connected to the wire processing mechanism, is used to separate the metal removed from the diamond wire. The wire separation mechanism includes a second fixed base 10 mounted on top of the base 1, a fixed sleeve 11 mounted inside the second fixed base 10, multiple first electromagnetic rollers 12 disposed inside the fixed sleeve 11, and a displacement assembly for driving the first electromagnetic rollers 12 to move. One end of a cleaning block 6 is rotatably connected to the inside of the fixed sleeve 11. Multiple waste discharge ports 13 are provided on the outer wall of the fixed sleeve 11. The displacement assembly includes a slide rod 14 fixedly connected to one end of the first electromagnetic roller 12, a driven block 15 fixedly sleeved outside the slide rod 14, and a gear ring 16 rotatably connected inside the fixed sleeve 11. A spring 17 is fixedly connected to the outer wall of one side of the driven block 15, and the other end of the spring 17 is connected to the fixed sleeve 11. The inner wall is fixedly connected; a drive block 18 is fixedly connected to the outer wall of one side of the gear ring 16. An oblique groove is opened on the outer wall of the drive block 18, which cooperates with the driven block 15. A second motor 19 is installed at one end of the fixed sleeve 11. A second gear 20 is fixedly connected to the outside of the output shaft of the second motor 19. The second gear 20 meshes with the gear ring 16. Multiple housings 21 are installed on the inner wall of the fixed sleeve 11. A first weighing module is installed at the bottom of the housing 21. A slide rod 14 is slidably connected inside the housing 21. One end of the first weighing module can be connected to the output end of the drive motor to drive the first weighing module to flip so as to discharge the metal on the top of the first weighing module. An L-shaped baffle 23 is installed at the other end of the first electromagnetic roller 12. The baffle 23 is slidably connected inside the fixed sleeve 11.

[0042] When the cleaning block 6 rotates and throws out impurities, multiple first electromagnetic rollers 12 adsorb metal fragments in the impurities, and other impurities are discharged through the discharge port 13. When the silicon wafer is cut and the wear of the diamond wire needs to be detected, the second motor 19 is controlled to drive the second gear 20 to rotate. Through the meshing action between the second gear 20 and the gear ring 16, the gear ring 16 is driven to rotate, which in turn drives the drive block 18 to rotate along the circular track. During this process, the inclined groove outside the drive block 18 drives each driven block 15 to move to the right in sequence, and then the slide rod 14 drives the first electromagnetic roller 12 to move into the interior of the housing 21. Then the power to the first electromagnetic roller 12 is cut off, and the metal fragments outside the first electromagnetic roller 12 fall to the top of the first weighing module. The first weighing module weighs the substrate worn off from the diamond wire. After the drive block 18 passes the driven block 15, the rebound force of the spring 17 drives the first electromagnetic roller 12 to move to the left and reset.

[0043] There can be multiple drive blocks 18, which correspond to multiple driven blocks 15, and thus drive each driven block 15 to move to the right simultaneously when the gear ring 16 rotates.

[0044] A coolant separation mechanism is installed on the top of the base 1 to separate metal from the coolant. The coolant separation mechanism includes a manifold 25 installed on the top of the base 1, a second electromagnet roller 26 rotatably connected inside the manifold 25, and a second weighing module 27 disposed below the second electromagnet roller 26. A drive motor is installed on the outer wall of the manifold 25 and connected to one end of the second electromagnet roller 26 to drive the second electromagnet roller 26 to rotate. One end of the second weighing module 27 slides to the outside of the manifold 25. A cylinder 22 is installed on the top of the base 1, and the extended end of the cylinder 22 is fixedly connected to one end of the second weighing module 27.

[0045] During the silicon wafer cutting process, cooling pipe 4 discharges coolant to cool the cutting area and simultaneously flushes various debris generated during cutting into the manifold 25. As the second electromagnet roller 26 rotates, it adsorbs metal debris in the coolant. When the silicon wafer cutting is completed and the wear of the diamond wire needs to be detected, the second weighing module 27 is moved into the manifold 25 by controlling cylinder 22. By de-energizing the second electromagnet roller 26, the metal debris outside the second electromagnet roller 26 falls onto the top of the second weighing module 27, and the second weighing module 27 weighs the substrate worn off from the diamond wire.

[0046] An industrial camera 24 is mounted on the outer wall of the first fixed base 5, and the industrial camera 24 is located below the diamond wire.

[0047] During the silicon wafer cutting process, an industrial camera 24 takes real-time pictures of the exterior of the diamond wire, and an electronic computer system performs image analysis on the diamond wire. Combined with the weight of the wear of the diamond wire substrate by the first weighing module and the second weighing module 27, the timing of diamond wire replacement is determined.

[0048] Working Principle: During the movement of the diamond wire, impurities such as metal debris, silicon powder, and coolant on the outside of the diamond wire are removed by the wire groove 7 and placed on the right side of the cleaning block 6. The first motor 8 drives the first gear 9 on the outside of its output shaft to rotate. The meshing action between the two first gears 9 drives the cleaning block 6 to rotate. The centrifugal force generated by the rotation of the cleaning block 6 throws out the impurities on the outer right wall of the cleaning block 6. By removing impurities from the outside of the diamond wire in a timely manner, the accumulation of impurities at the guide wheel in the diamond wire cutting machine 2 is prevented, thus avoiding the problem of diamond wire fluctuation and skipping. To avoid the problem of uneven cut surfaces caused by silicon wafer dicing fluctuations, when the cleaning block 6 rotates and throws out impurities, multiple first electromagnetic rollers 12 adsorb metal fragments from the impurities, while other impurities are discharged through the discharge port 13. When the silicon wafer dicing is completed and the wear of the diamond wire needs to be checked, the second motor 19 is controlled to drive the second gear 20 to rotate. Through the meshing action between the second gear 20 and the gear ring 16, the gear ring 16 is driven to rotate, which in turn drives the drive block 18 to rotate along a circular trajectory. During this process, the inclined grooves on the outside of the drive block 18 sequentially drive each driven block 15 to... The slide bar 14 moves the first electromagnet roller 12 into the housing 21, and then the power to the first electromagnet roller 12 is cut off. Metal debris outside the first electromagnet roller 12 falls to the top of the first weighing module, which weighs the substrate worn off from the diamond wire. During silicon wafer cutting, the cooling pipe 4 discharges coolant to cool the cutting area and simultaneously flushes various debris generated during cutting into the manifold 25. The second electromagnet roller 26, during its rotation, adsorbs metal debris from the coolant. After silicon wafer cutting is complete, the wear condition of the diamond wire needs to be assessed. During testing, the second weighing module 27 is moved into the junction box 25 by the control cylinder 22. By de-energizing the second electromagnet roller 26, metal debris outside the second electromagnet roller 26 falls onto the top of the second weighing module 27. The second weighing module 27 weighs the substrate worn off from the diamond wire. During the silicon wafer cutting process, the outside of the diamond wire is photographed in real time by the industrial camera 24. The image of the diamond wire is analyzed by the computer system. The weight of the worn diamond wire substrate by the first weighing module and the second weighing module 27 is combined to determine the timing of diamond wire replacement.

[0049] It should be noted that the device structure and accompanying drawings of this invention mainly describe the principle of the invention. The technical details of the device's power mechanism, power supply system, and control system are not fully described. However, those skilled in the art, understanding the principles of the invention, can clearly understand the specifics of its power mechanism, power supply system, and control system. The control method described in the application is automatic control via a controller, and the controller's control circuit can be implemented through simple programming by those skilled in the art. The above description only illustrates certain exemplary embodiments of the invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of this invention.

[0050] In the description of this invention, it should be understood that the orientations or positional relationships indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing this invention and simplifying the description. They are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0051] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified. Furthermore, the terms "installed," "connected," and "linked" should be interpreted broadly; for example, they may refer to a fixed connection, a detachable connection, or an integral connection; they may refer to a mechanical connection or an electrical connection; they may refer to a direct connection or an indirect connection through an intermediate medium; and they may refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

Claims

1. A slitting device for silicon carbide ceramic product manufacturing, comprising a base, a diamond wire cutting machine, a positioning and adjustment mechanism, and a cooling pipe, characterized in that, Also includes: The wire handling mechanism, mounted on top of the base, is used to clean the diamond wire in the diamond wire cutting machine. The online separation mechanism, which is connected to the wire processing mechanism, is used to separate the metal removed from the diamond wire; A coolant separation mechanism, mounted on top of the base, is used to separate metals from the coolant; The wire processing mechanism includes a first fixed seat mounted on the top of the base, a cleaning block rotatably connected inside the first fixed seat, and a drive assembly for driving the cleaning block to rotate; the cleaning block has a through-hole wire groove that is adapted to the diamond wire. The drive assembly includes a first motor mounted on the outer wall of one side of the first fixed base and first gears respectively fixedly sleeved on the outside of the output shaft of the first motor and the outside of the cleaning block; the two first gears mesh with each other; The online separation mechanism includes a second fixed seat installed on the top of the base, a fixed sleeve installed inside the second fixed seat, multiple first electromagnetic rollers disposed inside the fixed sleeve, and a displacement assembly for driving the first electromagnetic rollers to move; one end of the cleaning block is rotatably connected to the inside of the fixed sleeve; multiple waste discharge ports are provided on the outer wall of the fixed sleeve; The coolant separation mechanism includes a manifold box installed on the top of the base, a second electromagnet roller rotatably connected inside the manifold box, and a second weighing module disposed below the second electromagnet roller. One end of the second weighing module slides to the outside of the junction box, and a cylinder is installed on the top of the base, with the extended end of the cylinder fixedly connected to one end of the second weighing module.

2. The slitting equipment for silicon carbide ceramic product manufacturing according to claim 1, characterized in that, The displacement assembly includes a slide rod fixedly connected to one end of the first electromagnet roller, a driven block fixedly sleeved outside the slide rod, and a gear ring rotatably connected inside the fixed sleeve. A spring is fixedly connected to the outer wall of one side of the driven block, and the other end of the spring is fixedly connected to the inner wall of the fixed sleeve. A drive block is fixedly connected to the outer wall of one side of the gear ring. An oblique groove is opened on the outer wall of the drive block. The oblique groove cooperates with the driven block. A second motor is installed at one end of the fixed sleeve. A second gear is fixedly sleeved on the outside of the output shaft of the second motor. The second gear meshes with the gear ring.

3. A slitting device for silicon carbide ceramic product manufacturing according to claim 2, characterized in that, Multiple housings are installed on the inner wall of the fixed sleeve, and a first weighing module is installed at the bottom of the housing.

4. A slitting device for silicon carbide ceramic product manufacturing according to claim 3, characterized in that, An industrial camera is mounted on the outer wall of the first mounting base, and the industrial camera is located below the diamond wire.

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