Resin composition, resin adhesive as well as preparation method and application of resin adhesive

Abstract

The invention relates to the technical field of membrane module packaging, in particular to a resin composition, a resin adhesive and a preparation method and application of the resin adhesive. The component A and the component B of the resin adhesive are mixed according to a specific ratio and then are used for packaging the hollow fiber membrane module, and the adhesive end sealing part of the obtained hollow fiber membrane module has excellent air tightness and pressure resistance and can be applied to the hollow fiber membrane application fields of gas separation, nanofiltration, water treatment, reverse osmosis and the like.

Description

Technical Field

[0001] The present invention relates to the technical field of membrane component packaging, and in particular to a resin composition, resin glue, and a preparation method and application thereof. Background Art

[0002] Hollow fiber membrane technology is one of the key technologies for addressing major global challenges, such as the water and energy crisis and environmental pollution. It also provides a crucial technical support for achieving high-quality development through energy conservation and emission reduction, clean production, and improved system efficiency and product quality. Hollow fiber membranes are widely used in water treatment applications, including upgrading water plants and improving sewage treatment plants, providing an effective means for recycling wastewater and ensuring drinking water safety. With the continuous decline in membrane material costs and improvements in process stability, the application of hollow fiber membranes in ultrafiltration water plants and membrane bioreactor technology is becoming increasingly widespread. In petrochemical applications, hollow fiber membrane technology has been widely adopted in areas such as oil refining, oilfield produced water and petrochemical wastewater treatment, production of petrochemical products and derivatives, pervaporation separation, and high-purity gas production, with a broad market potential. In biomedical applications, hollow fiber membranes are widely used in artificial kidneys (hemodialysis), artificial lungs (oxygenation membranes), blood component separation, and the separation and purification of traditional Chinese and Western medicines. In addition, hollow fiber membranes also have broad application prospects in food and beverage applications, environmental protection and resource recycling, and new energy industries.

[0003] The use of hollow fiber membrane components requires the use of glue to encapsulate the hollow fiber membrane fibers in metal, plastic and other shells. The glue not only needs to have good fluidity, but also cannot damage the membrane fibers. In addition, after encapsulation, it also needs to maintain good air tightness and pressure resistance.

[0004] However, the existing glue formula and packaging process are only suitable for the packaging of small-component hollow fiber membranes. For the packaging of membrane components with a diameter greater than 30 cm, there are still problems such as low yield, poor airtightness, and wire burning, which restricts large-scale development.

[0005] In view of this, the present invention is proposed. Summary of the Invention

[0006] In order to solve the above problems in the prior art, the present invention provides a resin composition, resin glue and its preparation method and application, which can not only take into account the corrosion resistance and thermal conductivity of the material, but also enhance the hydrophilicity and high and low temperature impact resistance of the material.

[0007] Based on this, the present invention has the following technical solutions: In a first aspect, the present invention provides a resin composition consisting of component A and component B; The A component includes resin X1, resin X2 and diluent Z; The B component includes a curing agent M and a coupling agent N; The diluent Z is composed of active diluent Z1 and inactive diluent Z2; the curing agent M is composed of curing agent M1, curing agent M2 and curing agent M3; The resin X1 is selected from one or more of bisphenol A epoxy resin, diaminodiphenylmethane tetraglycidylamine, and diglycidyl para-aminophenol; the resin X2 is selected from one or more of bisphenol F epoxy resin, aliphatic glycidyl ether epoxy resin, and aliphatic glycidyl ether epoxy resin; the curing agent M1 is selected from one or more of polyetheramine, 2-methylpentanediamine, 1,2-cyclohexanediamine, thiourea-modified m-phenylenediamine, hexamethylenediamine, and polyetherdiamine; the curing agent M2 is selected from one or more of 4,4'-diaminodiphenylmethane, 3,3'-diethyl-4,4'-diaminodiphenylmethane, and diethyltoluenediamine; the curing agent M3 is selected from one or more of 4,4'-diaminodicyclohexylmethane and 3,3'-diaminodiphenylmethane; in the component A, the mass ratio of the resin X1 to the resin X2 is (70-80):(10-15).

[0008] The present invention finds that by optimizing the resin and the curing agent and controlling the contents of the resin X1 and the resin X2, the glue can have a suitable viscosity and a good hardness after curing.

[0009] In the present invention, in the component A, the content of the resin X1 can be any value among 70wt%, 71wt%, 72wt%, 73wt%, 74wt%, 75wt%, 76wt%, 77wt%, 78wt%, 79wt% and 80wt%, or a numerical range with any two of the above values ​​as endpoints.

[0010] According to a resin composition provided by the present invention, in the component A, the content of the resin X1 is 70 wt % to 80 wt %.

[0011] In the present invention, the content of the resin X2 in the component A can be any value among 10wt%, 11wt%, 12wt%, 13wt%, 14wt%, and 15wt%, or a numerical range with any two of the above values ​​as endpoints.

[0012] According to a resin composition provided by the present invention, the mass ratio of the curing agent M1, the curing agent M2 and the curing agent M3 is (30-35): (40-45): (20-25).

[0013] The present invention finds that the synergy of the three curing agents can be beneficial to controlling the temperature of the glue curing process.

[0014] In the present invention, the content of the curing agent M1 in the component A can be any value among 30wt%, 31wt%, 32wt%, 33wt%, 34wt%, 35wt%, or a numerical range with any two of the above values ​​as endpoints.

[0015] In the present invention, the content of the curing agent M2 in the component A can be any value among 40wt%, 41wt%, 42wt%, 43wt%, 44wt%, 45wt%, or a numerical range with any two of the above values ​​as endpoints.

[0016] In the present invention, the content of the curing agent M3 in the component A can be any value among 20wt%, 21wt%, 22wt%, 23wt%, 24wt%, 25wt%, or a numerical range with any two of the above values ​​as endpoints.

[0017] According to a resin composition provided by the present invention, the reactive diluent Z1 is selected from one or more of 1,4-butanediol diglycidyl ether, polyethylene glycol diglycidyl ether, and Cardolite LITE 513DF.

[0018] According to a resin composition provided by the present invention, the inactive diluent Z2 is selected from one or more of diisobutyl ketone, methyl isobutyl ketone, and cyclohexanone.

[0019] More preferably, the mass ratio of the active diluent Z1 to the inactive diluent Z2 is (5-8):(1-3).

[0020] In the present invention, the content of the reactive diluent Z1 in the component A can be any value among 5wt%, 6wt%, 7wt%, 8wt%, or a numerical range with any two of the above values ​​as endpoints.

[0021] In the present invention, the content of the inactive diluent Z2 in the component A can be any value among 1 wt%, 2 wt%, and 3 wt%, or a numerical range with any two of the above values ​​as endpoints.

[0022] According to a resin composition provided by the present invention, the mass ratio of the component A to the component B is (10-15):1.

[0023] In the present invention, the mass ratio of the component A to the component B can be any ratio among 10:1, 11:1, 12:1, 13:1, 14:1, and 15:1, or a ratio range with any two of the above ratios as endpoints.

[0024] According to a resin composition provided by the present invention, the component A further contains a toughening agent Y, and the toughening agent Y is selected from one or more of styrene-butadiene copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-butylene-styrene block copolymer, and styrene-ethylene-propylene-styrene type block copolymer.

[0025] More preferably, in the component A, the content of the toughening agent Y is 2 wt% to 4 wt%.

[0026] In the present invention, the content of the toughening agent Y in the component A can be any value among 2wt%, 3wt%, and 4wt%, or a numerical range with any two of the above values ​​as endpoints.

[0027] According to a resin composition provided by the present invention, the coupling agent N is selected from one or more of tris(hydroxymethyl)nitromethane, 1,3,5-tris(hydroxymethyl)benzene, trimethylolpropane, and 1,3,5-trimethylbenzene.

[0028] More preferably, in the component B, the content of the coupling agent N is 1 wt% to 2 wt%.

[0029] According to the present invention, a resin composition is provided, which is composed of component A and component B in a mass ratio of (10-15):1; The A component includes the following components in parts by mass: Resin X1 70~80 parts, Resin X2 10~15 parts, Toughener Y 2 to 4 parts, Active diluent Z1 5 to 8 parts, Inactive diluent Z2 1 to 3 parts; The B component includes the following components in parts by mass: The curing agent M1 30 to 35 parts, The curing agent M2 40 to 45 parts, The curing agent M3 20 to 25 parts, The coupling agent N is 1 to 2 parts.

[0030] In a second aspect, the present invention provides a resin adhesive, the preparation method of which comprises mixing the resin composition at a temperature T1; preferably, the temperature T1 is 15°C to 20°C.

[0031] In the present invention, the temperature T1 can be any value among 15°C, 16°C, 17°C, 18°C, 19°C, and 20°C, or a numerical range with any two of the above values ​​as endpoints.

[0032] In a third aspect, the present invention provides a use of the resin composition or the resin glue in encapsulating a hollow fiber membrane module; the encapsulation step comprises: (1) Component A and component B are mixed at temperature T1 to obtain a resin glue; (2) pouring the resin glue into the hollow fiber membrane assembly to encapsulate the assembly; (3) The membrane assembly after glue encapsulation is first dried at temperature T2 for t1 hour, and then dried at temperature T3 for t2 hours.

[0033] Preferably, the temperature T2 is 4°C to 10°C, and the temperature T3 is 70°C to 90°C.

[0034] Preferably, t1 and t2 are each independently, the same or different, and are 20 to 40 hours.

[0035] In the present invention, the temperature T2 can be any value among 4°C, 5°C, 6°C, 7°C, 8°C, 9°C, and 10°C, or a numerical range with any two of the above values ​​as endpoints.

[0036] In the present invention, the temperature T3 can be any value among 70℃, 71℃, 72℃, 73℃, 74℃, 75℃, 76℃, 77℃, 78℃, 79℃, 80℃, 81℃, 82℃, 83℃, 84℃, 85℃, 86℃, 87℃, 88℃, 89℃, and 90℃, or a numerical range with any two of the above values ​​as endpoints.

[0037] The resin glue of the present invention is used for packaging hollow fiber membrane components, can achieve excellent air tightness and pressure resistance, and has good application prospects in the fields of gas separation, nanofiltration, water treatment, reverse osmosis, etc.

[0038] According to the present invention, the application of the resin composition or the resin glue in the encapsulation of hollow fiber membrane components is provided. The resin composition or the resin glue is suitable for the encapsulation of hollow fiber membrane components with a diameter of 5 cm to 60 cm, and more preferably, is suitable for the encapsulation of hollow fiber membrane components with a diameter of 30 cm to 60 cm.

[0039] Based on this, the technical solution of the present invention has the following beneficial effects: The present invention mixes component A and component B of the resin glue in a specific ratio and then uses them to encapsulate the hollow fiber membrane assembly. The resulting glue-sealed portion of the hollow fiber membrane assembly has excellent air tightness and pressure resistance, and can be used in hollow fiber membrane application fields such as gas separation, nanofiltration, water treatment, and reverse osmosis. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction is given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0041] Figure 1 This is a physical picture of the resin glue in Example 1 provided by the present invention.

[0042] Figure 2 This is a cross-sectional view of the hollow fiber membrane assembly encapsulated in Example 1 provided by the present invention. DETAILED DESCRIPTION

[0043] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0044] Unless otherwise specified, the various raw materials used in the examples and comparative examples are commercially available conventional raw materials, and the technical means used are conventional means well known to those skilled in the art.

[0045] Example 1 This embodiment provides a resin composition, which consists of component A and component B: The composition of its A component is as follows: Resin X1 is bisphenol A epoxy resin with a mass percentage of 70%; Resin X2 is an aliphatic glycidyl ether epoxy resin with a mass percentage of 15%; Toughener Y is a styrene-ethylene-propylene-styrene type block copolymer, with a mass percentage of 4%; The active diluent Z1 is 1,4-butanediol diglycidyl ether, with a mass percentage of 8%; The inactive diluent Z2 is cyclohexanone, with a mass percentage of 3%; The composition of its B component is as follows: Curing agent M1 is polyether diamine, with a mass percentage of 30%; Curing agent M2 is diethyltoluenediamine, with a mass percentage of 45%; Curing agent M3 is 3,3'-diaminodiphenylmethane, with a mass percentage of 24%; The coupling agent N is 1,3,5-tris(hydroxymethyl)benzene, and its mass percentage is 1%.

[0046] This embodiment also provides a resin glue prepared from the above resin composition, and the preparation method thereof includes: mixing component A and component B in a mass ratio of 10, stirring evenly at a temperature of 20° C., to obtain the resin glue.

[0047] This embodiment also provides a process for applying resin glue in the packaging of hollow fiber membrane modules. The packaging includes the following steps: (1) pouring the obtained resin glue into the hollow fiber membrane module to encapsulate the module; (2) The membrane assembly after glue encapsulation is first dried at 4°C for 40 hours, and then dried at 70°C for 40 hours to finally obtain a fully encapsulated membrane assembly.

[0048] The photo of the resin glue obtained in this example is as follows Figure 1 As shown, the cross section of the hollow fiber membrane module packaged in this embodiment is as follows Figure 2 shown.

[0049] Example 2 This embodiment provides a resin composition, which consists of component A and component B: The composition of its A component is as follows: Resin X1 is diglycidyl p-aminophenol, with a mass percentage of 80%; Resin X2 is bisphenol F epoxy resin, with a mass percentage of 10%; Toughener Y is styrene-butadiene copolymer, with a mass percentage of 2%; Active diluent Z1 is Cardolite LITE 513DF, with a mass percentage of 5%; The inactive diluent Z2 is diisobutyl ketone, with a mass percentage of 3%; The composition of its B component is as follows: Curing agent M1 is polyetheramine, with a mass percentage of 34%; Curing agent M2 is 4,4'-diaminodiphenylmethane, with a mass percentage of 44%; Curing agent M3 is 4,4'-diaminodicyclohexylmethane, with a mass percentage of 20%; Coupling agent N is tris(hydroxymethyl)nitromethane, with a mass percentage of 2%; This embodiment also provides a resin glue prepared from the above resin composition, and the preparation method thereof includes: mixing component A and component B in a mass ratio of 15, stirring evenly at a temperature of 15° C., to obtain the resin glue.

[0050] This embodiment also provides a process for applying resin glue in the packaging of hollow fiber membrane modules. The packaging includes the following steps: (1) pouring the obtained resin glue into the hollow fiber membrane module to encapsulate the module; (2) The membrane assembly after glue encapsulation is first dried at 10°C for 20 hours, and then dried at 90°C for 20 hours, and finally a fully encapsulated membrane assembly is obtained.

[0051] Example 3 This embodiment provides a resin composition, which consists of component A and component B: The composition of its A component is as follows: Resin X1 is diaminodiphenylmethane tetraglycidylamine, with a mass percentage of 76%; Resin X2 is an aliphatic glycidyl ether epoxy resin with a mass percentage of 13%; Toughener Y is styrene-isoprene-styrene block copolymer, with a mass percentage of 3%; Active diluent Z1 is polyethylene glycol diglycidyl ether, with a mass percentage of 7%; The inactive diluent Z2 is methyl isobutyl ketone, with a mass percentage of 1%; The composition of its B component is as follows: Curing agent M1 is 2-methylpentanediamine, with a mass percentage of 31%; Curing agent M2 is 3,3'-diethyl-4,4'-diaminodiphenylmethane, with a mass percentage of 42.5%; Curing agent M3 is 3,3'-diaminodiphenylmethane, with a mass percentage of 25%; Coupling agent N is trimethylolpropane, with a mass percentage of 1.5%; This embodiment also provides a resin glue prepared from the above resin composition, and the preparation method thereof includes: mixing component A and component B in a mass ratio of 1:3, stirring evenly at a temperature of 17° C. to obtain the resin glue.

[0052] This embodiment also provides a process for applying resin glue in the packaging of hollow fiber membrane modules. The packaging includes the following steps: (1) pouring the obtained resin glue into the hollow fiber membrane module to encapsulate the module; (2) The membrane assembly after glue encapsulation is first dried at 8°C for 30 hours, and then dried at 80°C for 30 hours, and finally a fully encapsulated membrane assembly is obtained.

[0053] Example 4 This embodiment provides a resin composition, which consists of component A and component B: The composition of its A component is as follows: Resin X1 is bisphenol A epoxy resin with a mass percentage of 74%; Resin X2 is an aliphatic glycidyl ether epoxy resin with a mass percentage of 12%; Toughener Y is styrene-ethylene-butylene-styrene block copolymer, with a mass percentage of 4%; The active diluent Z1 is 1,4-butanediol diglycidyl ether, with a mass percentage of 8%; The inactive diluent Z2 is diisobutyl ketone, with a mass percentage of 2%; The composition of its B component is as follows: Curing agent M1 is 1,2-cyclohexanediamine, with a mass percentage of 32%; Curing agent M2 is 4,4'-diaminodiphenylmethane, with a mass percentage of 43%; Curing agent M3 is 4,4'-diaminodicyclohexylmethane, with a mass percentage of 24%; The coupling agent N is 1,3,5-tris(hydroxymethyl)benzene, and its mass percentage is 1%; This embodiment also provides a resin glue prepared from the above resin composition, and the preparation method thereof includes: mixing component A and component B in a mass ratio of 1:4, stirring evenly at a temperature of 16° C., to obtain the resin glue.

[0054] This embodiment also provides a process for applying resin glue in the packaging of hollow fiber membrane modules. The packaging includes the following steps: (1) pouring the obtained resin glue into the hollow fiber membrane module to encapsulate the module; (2) The membrane assembly after glue encapsulation was first dried at 6°C for 35 hours, and then dried at 85°C for 25 hours to finally obtain a fully encapsulated membrane assembly.

[0055] Example 5 This embodiment provides a resin composition, a resin glue prepared therefrom, and applications thereof, which differs from Example 1 only in that the mass ratio of curing agent M1, curing agent M2, and curing agent M3 is 1:1:1.

[0056] Example 6 This embodiment provides a resin composition, a resin glue prepared therefrom, and applications thereof, which differs from Example 1 only in that the reactive diluent Z1 (1,4-butanediol diglycidyl ether) is replaced with an equal amount of cyclohexanediol diglycidyl ether.

[0057] Comparative Example 1 This comparative example provides a resin composition, a resin glue prepared therefrom, and applications thereof. The difference between this comparative example and Example 1 is that the mass ratio of resin X1 to resin X2 is 1:1.

[0058] Comparative Example 2 This comparative example provides a resin composition, a resin glue prepared therefrom, and an application thereof, which differs from Example 1 only in that: in the B component, the polyether diamine is replaced by an equal amount of diethyltoluenediamine.

[0059] Comparative Example 3 This comparative example provides a resin composition, a resin glue prepared therefrom, and an application thereof, which differs from Example 1 only in that bisphenol A epoxy resin is replaced with an equal amount of bisphenol S epoxy resin.

[0060] Comparative Example 4 This comparative example provides a resin composition, a resin glue prepared therefrom, and an application thereof. The difference between this comparative example and Example 1 is that the membrane assembly after glue potting and packaging is dried at a temperature of 30°C.

[0061] Comparative Example 5 Commercially available ordinary epoxy resin glue was purchased from Weiligute E51 epoxy resin.

[0062] Test example Performance Testing The hollow fiber membrane modules obtained in each embodiment and comparative example were subjected to air tightness test and pressure resistance test respectively.

[0063] The test method is as follows: Air tightness test: A certain pressure of gas is introduced into the prepared hollow fiber membrane assembly, and the air tightness of each part of the membrane assembly is detected with soap bubbles.

[0064] Pressure resistance test: Seal one end of the prepared hollow fiber membrane assembly and pass high-pressure gas into the other end to test the pressure resistance performance. If the membrane assembly can maintain no air leakage at a pressure of 1.5MPa for 24 hours, it is judged to have good pressure resistance. If the membrane assembly can maintain no air leakage at a pressure of 2.5MPa for 24 hours, it is judged to have excellent pressure resistance.

[0065] The test results are shown in Table 1: Table 1

[0066] From the above results, it can be seen that the hollow fiber membrane components prepared in the examples of the present invention have good air tightness and pressure resistance, among which Examples 1-3 are better than Example 4.

[0067] It should be noted that the endpoints of the ranges and any values ​​disclosed herein are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoints of each range, the endpoints of each range and individual point values, and the individual point values ​​can be combined with each other to obtain one or more new numerical ranges, and these numerical ranges should be considered to be specifically disclosed herein.

[0068] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A resin composition, characterized in that It consists of component A and component B; The A component includes resin X1, resin X2 and diluent Z; The B component includes a curing agent M and a coupling agent N; The diluent Z is composed of active diluent Z1 and inactive diluent Z2; the curing agent M is composed of curing agent M1, curing agent M2 and curing agent M3; The resin X1 is selected from one or more of bisphenol A epoxy resin, diaminodiphenylmethane tetraglycidylamine, and diglycidyl para-aminophenol; the resin X2 is selected from one or more of bisphenol F epoxy resin, aliphatic glycidyl ether epoxy resin, and aliphatic glycidyl ether epoxy resin; In the component A, the mass ratio of the resin X1 to the resin X2 is (70-80): (10-15); The curing agent M1 is selected from one or more of polyetheramine, 2-methylpentanediamine, 1,2-cyclohexanediamine, thiourea-modified m-phenylenediamine, hexamethylenediamine, and polyetherdiamine; the curing agent M2 is selected from one or more of 4,4'-diaminodiphenylmethane, 3,3'-diethyl-4,4'-diaminodiphenylmethane, and diethyltoluenediamine; the curing agent M3 is selected from one or more of 4,4'-diaminodicyclohexylmethane and 3,3'-diaminodiphenylmethane.

2. The resin composition according to claim 1, wherein In the component A, the content of the resin X1 is 70 wt % to 80 wt %.

3. The resin composition according to claim 1 or 2, characterized in that The mass ratio of the curing agent M1, curing agent M2 and curing agent M3 is (30-35): (40-45): (20-25).

4. The resin composition according to any one of claims 1 to 3, characterized in that The reactive diluent Z1 is selected from one or more of 1,4-butanediol diglycidyl ether, polyethylene glycol diglycidyl ether, and Cardolite LITE 513DF; and / or, the inactive diluent Z2 is selected from one or more of diisobutyl ketone, methyl isobutyl ketone, and cyclohexanone; Preferably, the mass ratio of the active diluent Z1 to the inactive diluent Z2 is (5-8):(1-3).

5. The resin composition according to any one of claims 1 to 5, characterized in that The mass ratio of the component A to the component B is (10-15):

1.

6. The resin composition according to any one of claims 1 to 5, characterized in that The component A further contains a toughening agent Y, wherein the toughening agent Y is selected from one or more of styrene-butadiene copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-butylene-styrene block copolymer, and styrene-ethylene-propylene-styrene type block copolymer; Preferably, in the component A, the content of the toughening agent Y is 2 wt% to 4 wt%; And / or, the coupling agent N is selected from one or more of tris(hydroxymethyl)nitromethane, 1,3,5-tris(hydroxymethyl)benzene, trimethylolpropane, and 1,3,5-trimethylbenzene; Preferably, in the component B, the content of the coupling agent N is 1 wt% to 2 wt%.

7. The resin composition according to claim 6, characterized in that It is composed of component A and component B in a mass ratio of (10~15):1; The A component includes the following components in parts by mass: Resin X1 70~80 parts, Resin X2 10~15 parts, Toughener Y 2 to 4 parts, Active diluent Z1 5 to 8 parts, Inactive diluent Z2 1 to 3 parts; The B component includes the following components in parts by mass: The curing agent M1 30 to 35 parts, The curing agent M2 40 to 45 parts, The curing agent M3 20 to 25 parts, The coupling agent N is 1 to 2 parts.

8. A resin glue, characterized in that: The preparation method comprises mixing the resin composition according to any one of claims 1 to 7 at a temperature T1; preferably, the temperature T1 is 15°C to 20°C.

9. Use of the resin composition according to any one of claims 1 to 7 or the resin glue according to claim 8 in encapsulating a hollow fiber membrane module; the encapsulating step comprising: (1) Component A and component B are mixed at temperature T1 to obtain a resin glue; (2) pouring the resin glue into the hollow fiber membrane assembly to encapsulate the assembly; (3) Dry the encapsulated membrane assembly at temperature T2 for t1 hour, and then at temperature T3 for t2 hours; Preferably, the temperature T2 is 4°C to 10°C, and the temperature T3 is 70°C to 90°C; Preferably, t1 and t2 are each independently, the same or different, and are 20 to 40 hours.

10. The use according to claim 9, characterized in that The resin composition according to any one of claims 1 to 7 or the resin glue according to claim 8 is suitable for the encapsulation of hollow fiber membrane modules with a diameter of 5 cm to 60 cm, and more preferably, suitable for the encapsulation of hollow fiber membrane modules with a diameter of 30 cm to 60 cm.

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