Epoxy sleeve based on silicon dioxide, manufacturing method of epoxy sleeve and cable joint

Abstract

The invention discloses a silicon dioxide-based epoxy sleeve, an epoxy sleeve manufacturing method and a cable joint, the silicon dioxide-based epoxy sleeve comprises epoxy resin, a curing agent, aluminum oxide and silicon dioxide, and the size range of the silicon dioxide is 1-100 nm. By adding the nanoscale silicon dioxide, a more compact and uniform dispersion structure can be formed in an epoxy resin matrix. The structure can effectively prevent the expansion of cracks under the action of external force, and can improve the capability of the epoxy sleeve to bear different mechanical loads, thereby avoiding the situation that the cable is damaged or broken due to swinging or vibration, reducing the risk of cable breakage or fault, reducing the risk of combustion due to cable line fault, and prolonging the service life of the cable. The safety of the cable is improved, and potential safety hazards are reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of cable equipment, and in particular to a silicon dioxide-based epoxy sleeve, a method for manufacturing the epoxy sleeve, and a cable joint. Background Art

[0002] Cable joints connect cable segments and other electrical equipment through metal contacts, forming a pathway and ensuring insulation and sealing at the joints. The copper protective shell (copper shell) is a key component of the cable joint. It primarily consists of a flange-side copper shell, an explosion-proof copper shell, and an epoxy insulation element (epoxy sleeve). The cables at both ends are placed in the copper shells on either side, connected by the epoxy sleeve, which is primarily made of materials such as epoxy resin and alumina.

[0003] However, currently used materials and structures present the following technical challenges: First, under normal operating conditions, various environmental factors can cause the cable to swing or vibrate, forcing the epoxy sleeve to withstand mechanical loads such as the weight of the copper shell and vibrations from the outer casing, potentially causing damage or rupture. Second, cable line joint failures can easily lead to explosions accompanied by varying degrees of combustion, subjecting the epoxy sleeve to extreme impact loads and causing damage. This can easily affect nearby maintenance personnel and cable lines, posing a serious safety hazard. Improving the mechanical properties of epoxy insulation for cable joints is key to preventing accidents, with a particular emphasis on enhancing the interfacial bonding between epoxy resin and alumina through various modification methods. This research is urgently needed. Summary of the Invention

[0004] The present invention provides a silicon dioxide-based epoxy sleeve, a method for manufacturing the epoxy sleeve, and a cable connector, which can solve the technical problems of existing epoxy sleeves having low ability to withstand mechanical loads and potential safety hazards in use.

[0005] A first aspect of an embodiment of the present invention provides a silicon dioxide-based epoxy sleeve, the silicon dioxide-based epoxy sleeve comprising: epoxy resin, a curing agent, aluminum oxide and silicon dioxide, wherein the size of the silicon dioxide is in the range of 1 to 100 nm;

[0006] The mass fraction of the epoxy resin is: 90-110 parts;

[0007] The mass fraction of the curing agent is: 80-100 parts;

[0008] The mass fraction of the aluminum oxide is: 390-430 parts;

[0009] The mass fraction of the silicon dioxide is 3-30 parts.

[0010] By adding nano-silica, the present invention can form a denser and more uniformly dispersed structure within the epoxy resin matrix. This structure effectively prevents crack propagation under external forces, improving the epoxy casing's ability to withstand various mechanical loads. This in turn prevents damage or cracking due to cable swing or vibration, thereby reducing the risk of cable breakage or failure, as well as the risk of fires caused by cable line faults, thereby improving cable safety and reducing potential safety hazards.

[0011] In combination with the first aspect, in one implementation, the epoxy resin has a mass fraction of: 95-105 parts;

[0012] The mass fraction of the curing agent is: 85-95 parts;

[0013] The mass fraction of the aluminum oxide is: 410-420 parts;

[0014] The mass fraction of the silicon dioxide is 3-8 parts.

[0015] In combination with the first aspect, in one implementation, the epoxy resin has a mass fraction of: 95-105 parts;

[0016] The mass fraction of the curing agent is: 85-95 parts;

[0017] The mass fraction of the aluminum oxide is: 420-430 parts;

[0018] The mass fraction of the silicon dioxide is 3-8 parts.

[0019] In combination with the first aspect, in one implementation, the epoxy resin has a mass fraction of: 95-105 parts;

[0020] The mass fraction of the curing agent is: 85-95 parts;

[0021] The mass fraction of the aluminum oxide is: 405-415 parts;

[0022] The mass fraction of the silicon dioxide is 5-15 parts.

[0023] In combination with the first aspect, in one implementation, the epoxy resin has a mass fraction of: 95-105 parts;

[0024] The mass fraction of the curing agent is: 85-95 parts;

[0025] The mass fraction of the aluminum oxide is: 400-410 parts;

[0026] The mass fraction of the silicon dioxide is 10-20 parts.

[0027] In combination with the first aspect, in one implementation, the epoxy resin has a mass fraction of: 95-105 parts;

[0028] The mass fraction of the curing agent is: 85-95 parts;

[0029] The mass fraction of the aluminum oxide is: 390-410 parts;

[0030] The mass fraction of the silicon dioxide is 10-30 parts.

[0031] A second aspect of an embodiment of the present invention provides a method for manufacturing a silicon dioxide-based epoxy sleeve, which is applicable to the silicon dioxide-based epoxy sleeve as described above, and comprises:

[0032] performing a compounding treatment on silicon dioxide to obtain a first mixture;

[0033] Stirring the epoxy resin and the first mixture to obtain a second mixture;

[0034] adding a curing agent and aluminum oxide to the second mixture and uniformly mixing them to obtain a third mixture;

[0035] The third mixture is subjected to vacuum degassing treatment, curing treatment and demoulding treatment in sequence to obtain an epoxy sleeve.

[0036] In conjunction with the first aspect, in one implementation, the composite treatment of silicon dioxide to obtain a first mixture includes:

[0037] Cleaning the surface of the silicon dioxide to obtain a first material;

[0038] Adding a preset coupling agent to the first material and stirring for a first preset time to obtain a second material;

[0039] The second material is dried and the solvent is removed at the first preset temperature according to the second preset time to obtain a first mixture.

[0040] In conjunction with the first aspect, in one implementation, the stirring of the epoxy resin and the first mixture to obtain the second mixture includes:

[0041] Preheating the epoxy resin to obtain a third material;

[0042] performing vacuum degassing on the third material to obtain a fourth material;

[0043] The fourth material and the first mixture are mixed and stirred to obtain a second mixture.

[0044] A third aspect of an embodiment of the present invention provides a cable joint, comprising: a flange-side copper shell, an explosion-proof-side copper shell, and an epoxy sleeve manufactured according to the above-mentioned method for manufacturing a silica-based epoxy sleeve;

[0045] The epoxy sleeve is connected to the flange side copper shell and the explosion-proof side copper shell respectively.

[0046] Compared to the prior art, the embodiments of the present invention provide a silica-based epoxy sleeve, a method for manufacturing an epoxy sleeve, and a cable connector, which have the following beneficial effects: the silica-based epoxy sleeve disclosed in the present invention includes an epoxy resin, a curing agent, aluminum oxide, and silica, wherein the silica is nano-scale. By adding nano-scale silica, the present invention can form a denser and more uniform dispersion structure in the epoxy resin matrix. This structure can effectively prevent the expansion of cracks under the action of external forces, and can improve the ability of the epoxy sleeve to withstand different mechanical loads, thereby avoiding damage or rupture due to cable swing or vibration, thereby reducing the risk of cable breakage or failure, and also reducing the risk of burning due to cable line failure, so as to improve the safety of the cable and reduce potential safety hazards. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 This is a front view of a silicon dioxide-based epoxy sleeve provided by one embodiment of the present invention;

[0048] Figure 2 is a side view of a silicon dioxide-based epoxy sleeve provided by one embodiment of the present invention;

[0049] Figure 3 This is a diagram showing the mechanism of enhanced interface performance of silicon dioxide modified according to one embodiment of the present invention;

[0050] Figure 4 is a comparative schematic diagram of tensile properties provided by one embodiment of the present invention;

[0051] Figure 5 is a comparative schematic diagram of the compressive performance provided by an embodiment of the present invention;

[0052] Figure 6 1 is a flow chart of a method for manufacturing a silicon dioxide-based epoxy casing provided by one embodiment of the present invention;

[0053] Figure 7 This is an operational flow chart of a method for manufacturing a silicon dioxide-based epoxy casing provided by one embodiment of the present invention;

[0054] Figure 8 This is a schematic structural diagram of a silicon dioxide-based epoxy casing manufacturing device provided in one embodiment of the present invention;

[0055] Figure 9 The figure is a schematic structural diagram of a cable connector provided by one embodiment of the present invention. DETAILED DESCRIPTION

[0056] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0057] Cable joints connect cable segments and other electrical equipment through metal contacts, forming a pathway and ensuring insulation and sealing at the joints. The copper protective shell (copper shell) is a key component of the cable joint. It primarily consists of a flange-side copper shell, an explosion-proof copper shell, and an epoxy insulation element (epoxy sleeve). The cables at both ends are placed in the copper shells on either side, connected by the epoxy sleeve, which is primarily made of materials such as epoxy resin and alumina.

[0058] However, currently used materials and structures present the following technical challenges: First, under normal operating conditions, various environmental factors can cause the cable to swing or vibrate, forcing the epoxy sleeve to withstand mechanical loads such as the weight of the copper shell and vibrations from the outer casing, potentially causing damage or rupture. Second, cable line joint failures can easily lead to explosions accompanied by varying degrees of combustion, subjecting the epoxy sleeve to extreme impact loads and causing damage. This can easily affect nearby maintenance personnel and cable lines, posing a serious safety hazard. Improving the mechanical properties of epoxy insulation for cable joints is key to preventing accidents, with a particular emphasis on enhancing the interfacial bonding between epoxy resin and alumina through various modification methods. This research is urgently needed.

[0059] In order to solve the above problems, the following specific examples will be used to introduce and explain in detail a silicon dioxide-based epoxy sleeve, an epoxy sleeve manufacturing method, and a cable connector provided in the embodiments of the present application.

[0060] In order to solve the technical problem that the existing cable sleeve has low ability to withstand mechanical load and has potential safety hazards, Figures 1-2 , respectively showing a front view of a silica-based epoxy sleeve provided by one embodiment of the present invention and a side view of a silica-based epoxy sleeve provided by one embodiment of the present invention.

[0061] Wherein, as an example, the silicon dioxide-based epoxy sleeve may include:

[0062] The silicon dioxide-based epoxy sleeve comprises epoxy resin, curing agent, aluminum oxide and silicon dioxide.

[0063] The mass fraction of the epoxy resin may be: 90-110 parts;

[0064] The mass fraction of the curing agent can be: 80-100 parts;

[0065] The mass fraction of the aluminum oxide may be: 390-430 parts;

[0066] The mass fraction of the silicon dioxide can be 3-30 parts.

[0067] In one embodiment, the size of the silicon dioxide is in the range of 1 to 100 nm. Specifically, the silicon dioxide is nano-scale silicon dioxide.

[0068] In a specific operation mode, the epoxy resin may be HE-4815 epoxy resin, the aluminum oxide may be FG3 aluminum oxide, and the curing agent may be HH-4815 curing agent.

[0069] Reference Figure 3 , showing a diagram of the mechanism of enhanced interface performance of modified silicon dioxide provided by one embodiment of the present invention.

[0070] After adding nano-sized silicon dioxide (SiO2), the improvement of the mechanical properties of epoxy sleeves is mainly attributed to the size effect and interface effect of nanoparticles. Compared with traditional micron-sized fillers such as alumina, nano-SiO2 has a larger specific surface area and can form a denser and more uniform dispersion structure in the epoxy resin matrix. This structure can effectively prevent the expansion of cracks under the action of external forces, and enhance the material's fracture resistance and toughness through mechanisms such as "crack deflection" and "crack passivation". Figure 3 shown.

[0071] Furthermore, nano-SiO2 forms a good interfacial bond with the epoxy matrix, enhancing interfacial strength and thus more effectively transferring stress under load, reducing stress concentration. It also improves the thermal stability and aging resistance of the composite material. Compared to alumina, nano-SiO2 particles are more easily embedded in the interstices between resin molecules, acting as a "skeleton" support, further enhancing the overall mechanical properties of the composite material, such as tensile strength, flexural strength, and impact toughness.

[0072] In an optional first embodiment, the epoxy resin may have a mass fraction of 95-105 parts;

[0073] The mass fraction of the curing agent can be: 85-95 parts;

[0074] The mass fraction of the aluminum oxide may be: 410-420 parts;

[0075] The mass fraction of the silicon dioxide can be 3-8 parts.

[0076] Specifically, in one operation mode, the mass fraction of the epoxy resin may be: 100 parts;

[0077] The mass fraction of the curing agent can be: 90 parts;

[0078] The mass fraction of the aluminum oxide may be: 415 parts;

[0079] The mass fraction of the silicon dioxide can be 5 parts.

[0080] In an optional second embodiment, the epoxy resin may have a mass fraction of 95-105 parts;

[0081] The mass fraction of the curing agent can be: 85-95 parts;

[0082] The mass fraction of the aluminum oxide may be: 420-430 parts;

[0083] The mass fraction of the silicon dioxide can be 3-8 parts.

[0084] Specifically, in one operation mode, the mass fraction of the epoxy resin may be: 100 parts;

[0085] The mass fraction of the curing agent can be: 90 parts;

[0086] The mass fraction of the aluminum oxide may be: 420 parts;

[0087] The mass fraction of the silicon dioxide can be 5 parts.

[0088] In one embodiment, nano-silica can be used as a toughening agent, and the proportions of epoxy resin and alumina materials used in the epoxy sleeve can be modified, thereby enhancing the tensile strength, compressive strength, and impact resistance of the epoxy sleeve.

[0089] In an optional third embodiment, the epoxy resin is present in an amount of 95-105 parts by weight;

[0090] The mass fraction of the curing agent is: 85-95 parts;

[0091] The mass fraction of the aluminum oxide is: 405-415 parts;

[0092] The mass fraction of the silicon dioxide is 5-15 parts.

[0093] Specifically, in one operation mode, the mass fraction of the epoxy resin may be: 100 parts;

[0094] The mass fraction of the curing agent can be: 90 parts;

[0095] The mass fraction of the aluminum oxide may be: 410 parts;

[0096] The mass fraction of the silicon dioxide can be: 10 parts.

[0097] In an optional fourth embodiment, the epoxy resin is present in an amount of 95-105 parts by weight;

[0098] The mass fraction of the curing agent is: 85-95 parts;

[0099] The mass fraction of the aluminum oxide is: 400-410 parts;

[0100] The mass fraction of the silicon dioxide is 10-20 parts.

[0101] Specifically, in one operation mode, the mass fraction of the epoxy resin may be: 100 parts;

[0102] The mass fraction of the curing agent can be: 90 parts;

[0103] The mass fraction of the aluminum oxide may be: 405 parts;

[0104] The mass fraction of the silicon dioxide can be: 15 parts.

[0105] In an optional fifth embodiment, the epoxy resin may be present in an amount of 95-105 parts by mass;

[0106] The mass fraction of the curing agent can be: 85-95 parts;

[0107] The mass fraction of the aluminum oxide may be: 390-410 parts;

[0108] The mass fraction of the silicon dioxide can be 10-30 parts.

[0109] Specifically, in one operation mode, the mass fraction of the epoxy resin may be: 100 parts;

[0110] The mass fraction of the curing agent can be: 90 parts;

[0111] The mass fraction of the aluminum oxide may be: 400 parts;

[0112] The mass fraction of the silicon dioxide can be: 20 parts.

[0113] Reference Figures 4-5 , respectively showing a comparative schematic diagram of the tensile performance provided by an embodiment of the present invention and a comparative schematic diagram of the compressive performance provided by an embodiment of the present invention.

[0114] The tensile strength and compressive strength performance tests of the mechanical properties test specimens prepared in the above embodiments were carried out. The tensile properties of different specimens were as follows: Figure 4 The compressive properties of different samples are shown in Figure 5 As shown, it can be seen that the sample prepared by modification and doping with nano-silica has better mechanical properties.

[0115] In this embodiment, an embodiment of the present invention provides a silica-based epoxy sleeve, which has the following beneficial effects: the silica-based epoxy sleeve disclosed in the present invention includes an epoxy resin, a curing agent, aluminum oxide and silica, wherein the silica is nano-scale. By adding nano-scale silica, the present invention can form a more dense and uniform dispersion structure in the epoxy resin matrix. This structure can effectively prevent the expansion of cracks under the action of external forces, and can improve the ability of the epoxy sleeve to withstand different mechanical loads, thereby avoiding damage or cracking due to cable swinging or vibration, thereby reducing the risk of cable breakage or failure, and also reducing the risk of burning due to cable line failure, so as to improve the safety of the cable and reduce potential safety hazards.

[0116] In order to solve the technical problems of the prior art, the epoxy resin / alumina material used for epoxy sleeves is modified by nano-silica toughening agent, so that the tensile strength, compressive strength and impact resistance of epoxy sleeves are enhanced, thereby improving the mechanical properties of epoxy insulation parts. Figure 6 , showing a flow chart of a method for manufacturing a silicon dioxide-based epoxy sleeve provided by one embodiment of the present invention.

[0117] The method is applicable to silica-based epoxy sleeves as described in the above examples.

[0118] As an example, the method for manufacturing the epoxy sleeve based on silicon dioxide may include:

[0119] S11, performing a composite treatment on silicon dioxide to obtain a first mixture.

[0120] In one embodiment, silicon dioxide may be pre-compounded to obtain a first mixture.

[0121] Among them, the composite treatment may be a treatment for cleaning and improving stability.

[0122] As an example, the composite treatment of silicon dioxide to obtain the first mixture may include the following sub-steps:

[0123] S111. Clean the surface of the silicon dioxide to obtain a first material.

[0124] S112: adding a preset coupling agent to the first material and stirring for a first preset time to obtain a second material.

[0125] S113, drying the second material and removing the solvent at the first preset temperature according to the second preset time to obtain a first mixture.

[0126] In one embodiment, the surface of nano-scale silicon dioxide is treated by plasma, and the silicon dioxide is modified by a coupling agent.

[0127] In one method, nano-silica is placed in a dielectric barrier discharge (DBD) low-temperature plasma device to ensure uniform distribution of the nano-silica. The device is then treated for several minutes at room temperature, standard atmospheric pressure, and nitrogen, which simultaneously cleans the surface. A coupling agent is then added, with the amount of the coupling agent being 1.5-2.0% by mass of the nano-silica.

[0128] Next, the plasma-treated nano-silica is mixed with a coupling agent solution and stirred at room temperature for a first predetermined time to ensure that the coupling agent reacts with the surface groups of the silica. Finally, the homogeneous mixture is dried at the first predetermined temperature for a second predetermined time, and the solvent is removed to obtain nano-silica modified with the coupling agent, thereby obtaining a first mixture.

[0129] In a specific operation example, 20g of nano-silica can be placed in a dielectric barrier discharge (DBD) low-temperature plasma device with an output power of 100W to ensure that the nano-silica is evenly distributed and treated for 3-5 minutes at room temperature, standard atmospheric pressure, and nitrogen environment. Then, a silane coupling agent KH-550 is selected and added in an amount of 1.5-2.0% of the mass of the nano-silica. Next, the plasma-treated nano-silica is mixed with the coupling agent solution and stirred at room temperature for 30-60 minutes to ensure that the coupling agent reacts with the surface groups of the silica. Finally, the uniform mixture is dried at about 60°C for 2-4 hours to remove the solvent to obtain a first mixture.

[0130] S12, stirring the epoxy resin and the first mixture to obtain a second mixture.

[0131] In one embodiment, the stirring process may be a process of stirring the epoxy resin and the first mixture together.

[0132] As an example, the step of stirring the epoxy resin and the first mixture to obtain the second mixture may include the following sub-steps:

[0133] S121, preheating the epoxy resin to obtain a third material.

[0134] S122. Perform vacuum degassing on the third material to obtain a fourth material.

[0135] S123, mixing the fourth material and the first mixture and stirring to obtain a second mixture.

[0136] In one embodiment, epoxy resin and nano-silicon dioxide are premixed and processed by high shear stirring to uniformly disperse the nano-silicon dioxide in the epoxy resin.

[0137] In one operation mode, an epoxy resin can be preheated in a heating device and heated to a predetermined temperature to obtain a third material. Then, a vacuum degassing device is used to remove bubbles from the resin to ensure the uniformity of the mixture, thereby obtaining a fourth material. Next, nano-silica is added to the heated epoxy resin and stirred to obtain a second mixture.

[0138] In one specific example, an epoxy resin is preheated in a heating device to 60-70°C to obtain a third material. A vacuum degassing device is then used to remove air bubbles from the resin to ensure uniformity of the mixture, thereby obtaining a fourth material. Next, nanosilica is added to the heated epoxy resin and stirred at 300-500 rpm using a high-shear mixer to obtain a second mixture. The stirring time is set to 3-4 hours, and the ambient temperature is maintained at approximately 50°C.

[0139] S13, adding a curing agent and aluminum oxide to the second mixture and uniformly mixing them to obtain a third mixture.

[0140] In one embodiment, the curing agent, the aluminum oxide filler and the second mixture obtained by the high shear stirring method may be uniformly mixed.

[0141] S14, sequentially performing vacuum degassing treatment, curing treatment and demoulding treatment on the third mixture to obtain an epoxy sleeve.

[0142] Specifically, the third mixture can be subjected to a vacuum degassing treatment. A vacuum degassing device is used to remove bubbles in the mixture to ensure the uniformity of the mixture. Finally, the third mixture can be vacuum poured into a mold for curing. The curing process includes two stages. In the first stage of curing, the curing temperature is set to 120°C and the curing time is set to 2 hours. In the second stage of curing, the curing temperature is set to 110°C and the curing time is set to 24 hours.

[0143] Finally, the cured material can be demoulded to obtain the desired epoxy sleeve.

[0144] Referring to Figure 7 , a flow chart of an operation of a manufacturing method of a silica-based epoxy sleeve is shown.

[0145] In an embodiment, the operation flow of the manufacturing method of the silica-based epoxy sleeve can include the following steps:

[0146] First, add epoxy resin / silica in a container and mix.

[0147] Second, add epoxy resin in the container after mixing is completed.

[0148] Third, shear and stir the fused material in the container.

[0149] Fourth, add a curing agent in the container.

[0150] Fifth, mechanically stir the material after adding the curing agent.

[0151] Sixth, vacuum degassing the stirred material.

[0152] Seventh, pour the vacuum-degassed material into a mold.

[0153] Eighth, high-temperature curing of the material in the mold.

[0154] In this embodiment, the manufacturing method of the silica-based epoxy sleeve provided by the embodiment has the beneficial effect that the epoxy resin, the curing agent, the aluminum oxide, and the silica are mixed together to manufacture the epoxy sleeve, and by adding the nano-silica, a more compact and uniform dispersion structure can be formed in the epoxy resin matrix. This structure can effectively prevent crack propagation under external force, can improve the ability of the epoxy sleeve to withstand different mechanical loads, and can thus avoid damage or rupture due to cable swinging or vibration, thereby reducing the risk of cable breakage or failure and reducing the risk of burning due to cable line failure, to improve the safety of the cable and reduce safety hazards.

[0155] The embodiment of the present application also provides a manufacturing device for a silica-based epoxy sleeve, as shown in Figure 8 , a structure schematic diagram of a manufacturing device for a silica-based epoxy sleeve is shown.

[0156] The device is suitable for the silica-based epoxy sleeve described in the above embodiment, and as an example, the manufacturing device for the silica-based epoxy sleeve can include:

[0157] The composite module 201 is used for composite processing of the silica to obtain a first mixture.

[0158] A stirring module 202 is used to stir the epoxy resin and the first mixture to obtain a second mixture;

[0159] A mixing module 203 is configured to add a curing agent and aluminum oxide to the second mixture for uniform mixing to obtain a third mixture;

[0160] The demoulding module 204 is used to perform vacuum degassing, curing and demoulding on the third mixture in sequence to obtain the epoxy sleeve.

[0161] Optionally, the composite treatment of silicon dioxide to obtain a first mixture comprises:

[0162] Cleaning the surface of the silicon dioxide to obtain a first material;

[0163] Adding a preset coupling agent to the first material and stirring for a first preset time to obtain a second material;

[0164] The second material is dried and the solvent is removed at the first preset temperature according to the second preset time to obtain a first mixture.

[0165] Optionally, the stirring of the epoxy resin and the first mixture to obtain the second mixture comprises:

[0166] Preheating the epoxy resin to obtain a third material;

[0167] performing vacuum degassing on the third material to obtain a fourth material;

[0168] The fourth material and the first mixture are mixed and stirred to obtain a second mixture.

[0169] The embodiment of the present invention also provides a cable connector, see Figure 9 , shows a structural schematic diagram of a cable connector provided by an embodiment of the present invention.

[0170] Wherein, as an example, the cable joint may include: a flange side copper shell 1, an explosion-proof side copper shell 2, and an epoxy sleeve 3 manufactured according to the silicon dioxide-based epoxy sleeve manufacturing method described in the above embodiment;

[0171] The epoxy sleeve 3 is connected 2 to the flange side copper shell 1 and the explosion-proof side copper shell respectively.

[0172] Those skilled in the art can clearly understand that, for the sake of convenience and brevity, the specific working process of the device described above can refer to the corresponding process in the aforementioned method embodiment and will not be repeated here.

[0173] Furthermore, an embodiment of the present application also provides an electronic device, comprising: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, the method for manufacturing a silicon dioxide-based epoxy sleeve as described in the above embodiment is implemented.

[0174] Furthermore, an embodiment of the present application also provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer-executable program, and the computer-executable program is used to enable a computer to execute the method for manufacturing a silica-based epoxy sleeve as described in the above embodiment.

[0175] In the description of the embodiments of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper" and "lower" is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the embodiments of the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be understood as a limitation of the present invention. When an element such as a layer, region or substrate is referred to as being "on" or "above" another element, it can be directly on the other element, or there can be an intermediate element. In contrast, when an element is referred to as being "directly on" or "above" another element, there are no intermediate elements. It should also be understood that when an element is referred to as being "under" or "below" another element, it can be directly under or below the other element, or there can be an intermediate element. In contrast, when an element is referred to as being "directly under" or "below" another element, there are no intermediate elements. Unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in the present invention based on specific circumstances.

[0176] Those skilled in the art will appreciate that the embodiments of the present application may also provide computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware. Moreover, the present application may adopt the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage, CD-ROM, optical storage, etc.) that contain computer-usable program code.

[0177] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), apparatuses and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0178] These computer program instructions may also be stored in a computer readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.

[0179] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing the instructions executed on the computer or other programmable device for implementing the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0180] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A silicon dioxide-based epoxy sleeve, characterized in that: The silicon dioxide-based epoxy sleeve comprises: epoxy resin, curing agent, aluminum oxide and silicon dioxide, wherein the size of the silicon dioxide ranges from 1 to 100 nm; The mass fraction of the epoxy resin is: 90-110 parts; The mass fraction of the curing agent is: 80-100 parts; The mass fraction of the aluminum oxide is: 390-430 parts; The mass fraction of the silicon dioxide is 3-30 parts.

2. The silica-based epoxy sleeve according to claim 1, wherein The mass fraction of the epoxy resin is: 95-105 parts; The mass fraction of the curing agent is: 85-95 parts; The mass fraction of the aluminum oxide is: 410-420 parts; The mass fraction of the silicon dioxide is 3-8 parts.

3. The silica-based epoxy sleeve according to claim 1, wherein The mass fraction of the epoxy resin is: 95-105 parts; The mass fraction of the curing agent is: 85-95 parts; The mass fraction of the aluminum oxide is: 420-430 parts; The mass fraction of the silicon dioxide is 3-8 parts.

4. The silica-based epoxy sleeve according to claim 1, wherein The mass fraction of the epoxy resin is: 95-105 parts; The mass fraction of the curing agent is: 85-95 parts; The mass fraction of the aluminum oxide is: 405-415 parts; The mass fraction of the silicon dioxide is 5-15 parts.

5. The silica-based epoxy sleeve according to claim 1, wherein The mass fraction of the epoxy resin is: 95-105 parts; The mass fraction of the curing agent is: 85-95 parts; The mass fraction of the aluminum oxide is: 400-410 parts; The mass fraction of the silicon dioxide is 10-20 parts.

6. The silica-based epoxy sleeve according to claim 1, characterized in that The mass fraction of the epoxy resin is: 95-105 parts; The mass fraction of the curing agent is: 85-95 parts; The mass fraction of the aluminum oxide is: 390-410 parts; The mass fraction of the silicon dioxide is 10-30 parts.

7. A method for manufacturing a silicon dioxide-based epoxy casing, characterized in that: The method is applicable to the silica-based epoxy casing according to any one of claims 1 to 6, and the method comprises: performing a compounding treatment on silicon dioxide to obtain a first mixture; Stirring the epoxy resin and the first mixture to obtain a second mixture; adding a curing agent and aluminum oxide to the second mixture and uniformly mixing them to obtain a third mixture; The third mixture is subjected to vacuum degassing treatment, curing treatment and demoulding treatment in sequence to obtain an epoxy sleeve.

8. The method for manufacturing a silicon dioxide-based epoxy casing according to claim 7, wherein: The silicon dioxide is subjected to a composite treatment to obtain a first mixture, comprising: Cleaning the surface of the silicon dioxide to obtain a first material; Adding a preset coupling agent to the first material and stirring for a first preset time to obtain a second material; The second material is dried and the solvent is removed at the first preset temperature according to the second preset time to obtain a first mixture.

9. The method for manufacturing a silicon dioxide-based epoxy casing according to claim 7, wherein: The step of stirring the epoxy resin and the first mixture to obtain a second mixture comprises: Preheating the epoxy resin to obtain a third material; performing vacuum degassing on the third material to obtain a fourth material; The fourth material and the first mixture are mixed and stirred to obtain a second mixture.

10. A cable connector, characterized in that: The cable connector comprises: a flange side copper shell, an explosion-proof side copper shell, and an epoxy sleeve manufactured according to the method for manufacturing an epoxy sleeve based on silicon dioxide according to any one of claims 7 to 9; The epoxy sleeve is connected to the flange side copper shell and the explosion-proof side copper shell respectively.

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