Cable core main body structure for silo temperature and humidity monitoring and assembling method thereof

Abstract

The invention discloses a silo temperature and humidity monitoring cable core main body structure and an assembly method thereof, the silo temperature and humidity monitoring cable core main body structure comprises a skeleton and a plurality of structural members, the plurality of structural members are arranged at intervals along the length direction of the skeleton, and temperature and humidity sensor modules are installed in temperature and humidity chip acquisition windows of the structural members; two wires are laid on the framework in the length direction, the wires are electrically connected with pins corresponding to the temperature and humidity sensor modules respectively, and the framework is sleeved with a 304 stainless steel woven mesh pipe used for wrapping the framework, the structural member and the wires. The framework, the structural member and the temperature and humidity sensor module adopt a quick-insertion clamping structure, so that the installation is convenient, additional fasteners are not needed, and the assembly process is remarkably simplified; the 304 stainless steel woven mesh pipe protective sleeve with the mesh pipe diameter smaller than 0.3 mm can effectively block high-concentration dust of the silo, guarantee sufficient exchange of internal air and external air, avoid local humidity retention and restrain dew formation at the same time.

Description

Technical Field

[0001] The present invention relates to the technical field of industrial automation monitoring, and in particular to a cable core main body structure for silo temperature and humidity monitoring and an assembly method thereof. Background Art

[0002] The existing silo temperature and humidity monitoring system welds the sensor to a cable, places it in a plastic tube, and then drills air holes at the sensor location in the plastic tube. This results in a complex production process and a high damage rate, especially inside the silo, where there is a high dust environment and drastic humidity fluctuations. The temperature and humidity sensors are easily damaged by dust contamination and condensation, making long-term reliable operation of the temperature and humidity sensors a major challenge.

[0003] Therefore, how to prevent dust intrusion and condensation in the cable core due to humidity and temperature is a technical problem that needs to be solved urgently. Summary of the Invention

[0004] The purpose of the present invention is to provide a cable core main structure and assembly method for silo temperature and humidity monitoring, which has reliable performance, a single bus carrying multiple point sensors, and has the functions of easy assembly, dust resistance and anti-condensation.

[0005] The present invention achieves the above-mentioned purpose through the following technical solutions:

[0006] A cable core main structure for monitoring temperature and humidity in a silo comprises a skeleton and structural members, wherein a plurality of the structural members are spaced apart along the length direction of the skeleton, and a temperature and humidity sensor module is installed in each temperature and humidity chip collection window of the structural member. Two wires are laid along the length direction of the skeleton, and the wires are electrically connected to the corresponding pins of each temperature and humidity sensor module respectively. A 304 stainless steel braided mesh tube is provided on the skeleton for wrapping the skeleton, structural members and the wires.

[0007] Preferably, the mesh tube pore size of the 304 stainless steel braided mesh tube is less than 0.3 mm. Such a setting can not only effectively block the high concentration of dust in the silo, but also ensure sufficient exchange of internal and external air, avoid local humidity retention, and inhibit condensation formation.

[0008] Preferably, the structural parts are made of ABS material, the distance between adjacent structural parts is 2 meters, the skeleton is a solid fiberglass rod, the wires are pure copper wires insulated with Teflon, and the wires use a single bus protocol for simultaneously transmitting power and communication signals.

[0009] Preferably, the structural member is provided with an elastic clamping groove and a temperature and humidity chip collection window, and the elastic clamping groove is matched with the skeleton, and the temperature and humidity sensor module is matched with the temperature and humidity chip collection window. In this way, the skeleton, the structural member and the temperature and humidity sensor module adopt a quick plug-in structure, which is convenient to install. Moreover, the temperature and humidity chip collection window can provide protection for the temperature and humidity sensor module, so that the temperature and humidity sensor module is not easily subjected to external pressure or impact during use, thereby facilitating long-term use of the temperature and humidity sensor module.

[0010] Preferably, the structural member is provided with an elastic clamping groove and a temperature and humidity chip collection window, and the elastic clamping groove is matched with the skeleton, and the temperature and humidity sensor module is matched with the temperature and humidity chip collection window. In this way, the skeleton, the structural member and the temperature and humidity sensor module adopt a quick plug-in structure, which is convenient to install. Moreover, the temperature and humidity chip collection window can provide protection for the temperature and humidity sensor module, so that the temperature and humidity sensor module is not easily subjected to external pressure or impact during use, thereby facilitating long-term use of the temperature and humidity sensor module.

[0011] Preferably, the temperature and humidity sensor module comprises a PCB board and a temperature and humidity sensor chip, the PCB board is fixedly provided with a temperature and humidity sensor chip, an MCU chip, an LDO voltage stabilizer and two pins; the MCU chip is electrically connected with the temperature and humidity sensor chip and the LDO voltage stabilizer respectively, the positive and negative electrodes of the LDO voltage stabilizer are electrically connected with one pin respectively, and the wires are electrically connected with the corresponding pins respectively. In this way, the LDO voltage stabilizer provides stable power supply for the temperature and humidity sensor chip and the MCU chip, and the MCU chip is used for converting the collected temperature and humidity data into a single bus protocol format and transmitting it to the wire.

[0012] Preferably, the temperature and humidity sensor chip is provided with a dustproof and breathable film, which further prevents dust from affecting the working of the temperature and humidity sensor chip.

[0013] A method for assembling a cable core main body structure for monitoring the temperature and humidity of a silo, comprising the following steps:

[0014] Step one, prepare a glass steel solid rod with a length of 30 meters and a diameter of 4 mm as a skeleton;

[0015] Step two, make the structural member: the structural member is provided with an elastic clamping groove and a temperature and humidity chip collection window, and the structural member is provided with a wire clamping groove and a wire clamping buckle at both ends and along both sides of the temperature and humidity chip collection window;

[0016] Step three, a plurality of structural members are clamped on the outer wall of the skeleton along the length direction of the skeleton at intervals of m through the elastic clamping grooves;

[0017] Step 4: Assemble the temperature and humidity sensor module: mount the temperature and humidity sensor chip, the MCU chip, the LDO regulator, and the two pins on corresponding positions of the PCB board so that the MCU chip is electrically connected to the temperature and humidity sensor chip and the LDO regulator respectively;

[0018] Step 5: snap the temperature and humidity sensor modules into the temperature and humidity chip collection windows;

[0019] Step 6: Lay two wires along the length of the frame, install the wires in the corresponding wire slots and wire buckles, and secure them. Notches are formed on the wires at locations opposite to the pins to expose the wire cores. The wires are then electrically connected to the corresponding pins of the temperature and humidity sensor modules.

[0020] Step seven: The skeleton is covered with a 304 stainless steel braided mesh tube, the skeleton, the structural parts and the wires are all wrapped in the 304 stainless steel braided mesh tube, and then the 304 stainless steel braided mesh tube is sealed at both ends.

[0021] Preferably, the wires are fixedly connected to the corresponding pins by welding.

[0022] Preferably, the temperature and humidity sensor chip, the MCU chip, the LDO regulator and the two pins are fixedly connected to the PCB board using UV glue, and the temperature and humidity sensor module is fixedly connected to the temperature and humidity chip acquisition window using UV glue.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] 1. The frame, structural parts and temperature and humidity sensor module adopt a quick-insert card structure, which is easy to install and does not require additional fasteners, significantly simplifying the assembly process. In addition, the setting of the temperature and humidity chip collection window can provide protection for the temperature and humidity sensor module.

[0025] 2. The use of a 304 stainless steel braided mesh tube protective cover with a mesh tube pore size of less than 0.3mm can not only effectively block the high-concentration dust in the silo, but also ensure sufficient exchange of internal and external air. At the same time, it avoids local humidity retention and inhibits condensation. It provides a stable working environment for the temperature and humidity sensor module, significantly extending the service life of the temperature and humidity sensor module while improving the accuracy of the detection data. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0027] Figure 1 This is a three-dimensional diagram of the main structure of a cable core for monitoring temperature and humidity in a silo according to the present invention;

[0028] Figure 2 These are the front view and bottom view of the main structure of the cable core for monitoring temperature and humidity in a silo according to the present invention;

[0029] Figure 3 This is a schematic diagram of the connection structure of the skeleton, structural parts, temperature and humidity sensor modules and wires of the cable core main structure for silo temperature and humidity monitoring according to the present invention;

[0030] Figure 4 This is a three-dimensional diagram of the structural components of the main structure of a cable core for monitoring temperature and humidity in a silo according to the present invention;

[0031] Figure 5 This is a three-dimensional diagram of a temperature and humidity sensor module of a cable core main structure for monitoring temperature and humidity in a silo as described in the present invention.

[0032] The following are the descriptions of the reference numerals:

[0033] 1. Skeleton; 2. Structural parts; 201. Elastic slot; 202. Temperature and humidity chip acquisition window; 203. Wire slot, 204. Wire buckle; 3. Temperature and humidity sensor module; 301. PCB board; 302. Temperature and humidity sensor chip; 303. MCU chip; 304. LDO voltage regulator; 305. Pin; 4. Wire; 5. 304 stainless steel braided mesh tube. DETAILED DESCRIPTION

[0034] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0035] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0036] The present invention will be further described below in conjunction with the accompanying drawings:

[0037] Example 1

[0038] like Figure 1-5 As shown, a main structure of a cable core for monitoring temperature and humidity in a silo includes a skeleton 1 and a structural member 2. A plurality of structural members 2 are arranged at intervals along the length direction of the skeleton 1. Temperature and humidity sensor modules 3 are installed in the temperature and humidity chip collection windows 202 of the structural member 2. Two wires 4 are laid along the length direction of the skeleton 1, and the wires 4 are electrically connected to the corresponding pins 305 of each temperature and humidity sensor module 3. A 304 stainless steel braided mesh tube 5 is covered on the skeleton 1 for wrapping the skeleton 1, structural member 2 and wire 4.

[0039] Specifically, the mesh tube pore size of the 304 stainless steel braided mesh tube 5 is less than 0.3 mm, which can effectively block the high-concentration dust in the silo, and ensure sufficient exchange of internal and external air, avoid local humidity retention, and inhibit condensation formation.

[0040] Furthermore, the structural member 2 is made of ABS material, the distance between adjacent structural members 2 is 2 meters, the skeleton 1 is a solid fiberglass rod, the wire 4 is a pure copper wire insulated with Teflon, and the wire 4 adopts a single bus protocol for simultaneously transmitting power and communication signals.

[0041] Furthermore, an elastic card slot 201 and a temperature and humidity chip acquisition window 202 are provided on the structural member 2, and the elastic card slot 201 matches the skeleton 1, and the temperature and humidity sensor module 3 matches the temperature and humidity chip acquisition window 202. In this way, the skeleton 1, the structural member 2 and the temperature and humidity sensor module 3 adopt a quick-insert card structure, which is easy to install. Moreover, the setting of the temperature and humidity chip acquisition window 202 can provide protection for the temperature and humidity sensor module 3, so that the temperature and humidity sensor module 3 is not easily squeezed or impacted by external force during use, which facilitates the long-term use of the temperature and humidity sensor module 3.

[0042] Furthermore, wire slots 203 and wire buckles 204 are provided at both ends of the structural member 2 and along both sides of the temperature and humidity chip collection window 202. The wires 4 are respectively installed in the corresponding wire slots 203 and wire buckles 204. Such a setting facilitates the fixation and regularity of the wires 4 and prevents the wires 4 from being disconnected from the pins 305 due to external force during use.

[0043] Furthermore, the temperature and humidity sensor module 3 includes a PCB board 301 and a temperature and humidity sensor chip 302, and the temperature and humidity sensor chip 302, the MCU chip 303, the LDO regulator 304 and two pins 305 are fixedly arranged on the PCB board 301; and the MCU chip 303 is electrically connected to the temperature and humidity sensor chip 302 and the LDO regulator 304 respectively, and the positive and negative poles of the LDO regulator 304 are electrically connected to a pin 305 respectively, and the wire 4 is electrically connected to the corresponding pin 305 respectively, and the LDO regulator 304 provides a stable power supply for the temperature and humidity sensor chip 302 and the MCU chip 303, and the MCU chip 303 is used to convert the collected temperature and humidity data into a single bus protocol format and transmit it to the wire 4.

[0044] Furthermore, a dust-proof and breathable membrane is provided on the temperature and humidity sensor chip 302 to further prevent dust from affecting the operation of the temperature and humidity sensor chip 302 .

[0045] A method for assembling a cable core main structure for monitoring temperature and humidity in a silo, comprising the following steps:

[0046] Step 1: Prepare a 30-meter-long, 4-mm-diameter fiberglass solid rod as the skeleton 1;

[0047] Step 2: Make the structural member 2: The structural member 2 is provided with an elastic slot 201 and a temperature and humidity chip collection window 202. Wire slots 203 and wire buckles 204 are provided at both ends of the structural member 2 and along both sides of the temperature and humidity chip collection window 202.

[0048] Step 3: Attach multiple structural members 2 to the outer wall of the frame 1 at intervals of 2 meters along the length direction of the frame 1 through the elastic slots 201;

[0049] Step 4: Assemble the temperature and humidity sensor module 3: Mount the temperature and humidity sensor chip 302, MCU chip 303, LDO voltage regulator 304, and two pins 305 on corresponding positions on the PCB board 301 so that the MCU chip 303 is electrically connected to the temperature and humidity sensor chip 302 and the LDO voltage regulator 304 respectively;

[0050] Step 5: snap the temperature and humidity sensor modules 3 into each temperature and humidity chip collection window 202;

[0051] Step 6: Lay two wires 4 along the length of the frame 1. Secure the wires 4 in their corresponding wire slots 203 and wire buckles 204. Notches are made on the wires 4 opposite the corresponding pins 305 to expose the wires 4. The wires 4 are then electrically connected to the corresponding pins 305 of each temperature and humidity sensor module 3.

[0052] Step seven: The skeleton 1 is covered with a 304 stainless steel braided mesh tube 5, the skeleton 1, the structural member 2 and the wire 4 are all wrapped in the 304 stainless steel braided mesh tube 5, and then the 304 stainless steel braided mesh tube 5 is sealed at both ends.

[0053] Furthermore, the wire 4 is fixedly connected to the corresponding pin 305 by welding.

[0054] Furthermore, the temperature and humidity sensor chip 302, the MCU chip 303, the LDO regulator 304 and the two pins 305 are fixedly connected to the PCB board 301 using UV glue, and the temperature and humidity sensor module 3 is fixedly connected to the temperature and humidity chip collection window 202 using UV glue.

[0055] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and modifications fall within the scope of the invention as claimed.

Claims

1. A cable core main structure for silo temperature and humidity monitoring, comprising a skeleton (1) and a structural member (2), characterized in that: A plurality of the structural members (2) are arranged at intervals along the length direction of the frame (1); a temperature and humidity sensor module (3) is installed in each temperature and humidity chip acquisition window (202) of the structural member (2); two wires (4) are laid along the length direction of the frame (1), and the wires (4) are electrically connected to the corresponding pins (305) of each temperature and humidity sensor module (3); and a 304 stainless steel braided mesh tube (5) is provided on the frame (1) for wrapping the frame (1), the structural member (2) and the wires (4).

2. The cable core main structure for monitoring temperature and humidity in a silo according to claim 1 is characterized by: The pore size of the 304 stainless steel braided mesh tube (5) is less than 0.3 mm.

3. The cable core main structure for monitoring temperature and humidity in a silo according to claim 1 is characterized by: The structural member (2) is made of ABS material, the distance between adjacent structural members (2) is 2 meters, the skeleton (1) is a solid fiberglass rod, the wire (4) is a pure copper wire insulated with Teflon, and the wire (4) adopts a single bus protocol.

4. The cable core main structure for monitoring temperature and humidity in a silo according to claim 1 is characterized by: The structural member (2) is provided with an elastic card slot (201) and the temperature and humidity chip acquisition window (202), the elastic card slot (201) matches the skeleton (1), and the temperature and humidity sensor module (3) matches the temperature and humidity chip acquisition window (202).

5. The cable core main structure for monitoring temperature and humidity in a silo according to claim 4, characterized in that: Wire slots (203) and wire buckles (204) are provided at both ends of the structural member (2) and along both sides of the temperature and humidity chip collection window (202), and the wires (4) are respectively installed in the corresponding wire slots (203) and wire buckles (204).

6. The cable core main structure for monitoring temperature and humidity in a silo according to claim 4, characterized in that: The temperature and humidity sensor module (3) comprises a PCB board (301) and a temperature and humidity sensor chip (302); the temperature and humidity sensor chip (302), an MCU chip (303), an LDO voltage regulator (304) and two pins (305) are fixedly arranged on the PCB board (301); the MCU chip (303) is electrically connected to the temperature and humidity sensor chip (302) and the LDO voltage regulator (304), respectively; the positive and negative poles of the LDO voltage regulator (304) are electrically connected to one pin (305), respectively; and the wires (4) are electrically connected to the corresponding pins (305).

7. The cable core main structure for monitoring temperature and humidity in a silo according to claim 6, characterized in that: The temperature and humidity sensor chip (302) is provided with a dustproof and breathable membrane.

8. The method for assembling a cable core main structure for monitoring temperature and humidity in a silo according to any one of claims 1 to 7, characterized in that The following steps are involved: Step 1: Prepare a fiberglass solid rod with a length of 30 meters and a diameter of 4 mm as the skeleton (1); Step 2: manufacturing the structural member (2): the structural member (2) is provided with an elastic card slot (201) and a temperature and humidity chip collection window (202); both ends of the structural member (2) and along both sides of the temperature and humidity chip collection window (202) are provided with wire card slots (203) and wire buckles (204); Step three, snapping a plurality of the structural members (2) onto the outer wall of the frame (1) at intervals of 2 m along the length direction of the frame (1) through the elastic snap grooves (201); Step 4, assembling the temperature and humidity sensor module (3): mounting the temperature and humidity sensor chip (302), the MCU chip (303), the LDO voltage regulator (304), and the two pins (305) on corresponding positions of the PCB board (301) so that the MCU chip (303) is electrically connected to the temperature and humidity sensor chip (302) and the LDO voltage regulator (304), respectively; Step 5: snapping the temperature and humidity sensor modules (3) into the temperature and humidity chip acquisition windows (202); Step 6: Two wires (4) are laid along the length direction of the frame (1), and the wires (4) are respectively installed in the corresponding wire slots (203) and the wire buckles (204) for fixing. Notches are opened on the wires (4) at positions corresponding to the pins (305) to expose the cores of the wires (4), and the wires (4) are respectively electrically connected to the corresponding pins (305) of the temperature and humidity sensor modules (3); Step seven: The skeleton (1) is covered with a 304 stainless steel braided mesh tube (5), the skeleton (1), the structural member (2) and the wire (4) are all wrapped in the 304 stainless steel braided mesh tube (5), and then the 304 stainless steel braided mesh tube (5) is sealed at both ends.

9. The method for assembling a cable core main structure for monitoring temperature and humidity in a silo according to claim 8, characterized in that: The wire (4) is fixedly connected to the corresponding pin (305) by welding.

10. The method for assembling a cable core main structure for monitoring temperature and humidity in a silo according to claim 8, characterized in that: The temperature and humidity sensor chip (302), the MCU chip (303), the LDO voltage regulator (304) and the two pins (305) are fixedly connected to the PCB board (301) using UV glue, and the temperature and humidity sensor module (3) is fixedly connected to the temperature and humidity chip acquisition window (202) using UV glue.

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