Flexible flat cable mother board test equipment

Abstract

The invention discloses flexible flat cable mother board testing equipment, and aims to provide the flexible flat cable mother board testing equipment which is simple in structure and capable of realizing vacuum adsorption and high-precision pin setting test on a large-area and large-expansion-shrinkage-rate flexible flat cable mother board. The die comprises an upper die and a lower die, the lower die comprises a lower die bottom plate, a lower die fixing plate, a lower die floating plate and a carrier die set, the lower die fixing plate is connected with the upper end face of the lower die bottom plate, the lower die floating plate is in floating connection with the lower die fixing plate, the lower die floating plate is provided with a plurality of floating needle dies, and the carrier die set is provided with a plurality of floating needle dies. The carrier module is connected with the upper end face of the lower die floating plate, and the upper die pressing end drives a plurality of flexible flat cables on the carrier module to be matched with the corresponding floating needle dies. The invention is applied to the technical field of flexible flat cable testing.

Description

Technical Field

[0001] The present invention is applied to the technical field of flexible flat cable testing, and in particular relates to a flexible flat cable motherboard testing device. Background Art

[0002] With the widespread use of electronic devices, flexible flat cables, as important connector components, are crucial for their stable performance. During the production process, flexible flat cables require various performance tests, such as conductivity, resistance, and withstand voltage. However, existing testing equipment presents several challenges when testing flexible flat cable motherboards. These challenges include easily damaging the flexible flat cable during testing, affecting the accuracy of test results, and inconvenient testing modules for post-test maintenance or replacement. Therefore, there is a need for a testing device with a rational structure, simple operation, and effective protection for flexible flat cable motherboards. Furthermore, existing technologies often rely on manual fixture testing, which is not conducive to automation, resulting in low production capacity and low economic efficiency. A flexible flat cable motherboard testing device with a simple structure that can achieve vacuum suction and high-precision needle insertion testing for large-area, high-expansion and contraction flexible flat cable motherboards could address these challenges. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a flexible cable motherboard testing device with a simple structure that can realize vacuum adsorption and high-precision needle insertion testing of flexible cable motherboards with large areas and large expansion and contraction rates.

[0004] The technical solution adopted by the present invention is: the present invention includes an upper mold and a lower mold, the lower mold includes a lower mold base plate, a lower mold fixed plate, a lower mold floating plate and a carrier module, the lower mold fixed plate is connected to the upper end surface of the lower mold base plate, the lower mold floating plate is floatingly connected to the lower mold fixed plate, the lower mold floating plate is provided with a plurality of floating pin molds, the carrier module is connected to the upper end surface of the lower mold floating plate, and the upper mold pressing end drives a plurality of soft cables on the carrier module to cooperate with the corresponding floating pin molds.

[0005] Furthermore, the upper mold includes an upper mold pressure plate, an upper mold fixed plate, an upper mold floating plate and a pressing plate. The upper mold fixed plate is connected to the lower end surface of the upper mold pressure plate, the upper mold floating plate is floatingly connected to the lower end surface of the upper mold fixed plate, and the pressing plate is connected to the lower end surface of the upper mold floating plate. The pressing plate is provided with a number of pressing points, and the number of pressing points respectively cooperate with the soft cables at the corresponding positions of the carrier module.

[0006] Furthermore, the carrier module includes a carrier support plate, a carrier connecting plate and a product carrier plate. The carrier connecting plate is connected to the upper end surface of the carrier support plate, and the product carrier plate is connected to the upper end surface of the carrier connecting plate. The product carrier plate is provided with a plurality of product profiling acupoints, and the soft flat cable is conformed to the product profiling acupoints. Several floating needle mold probe ends are connected and conducted with the corresponding soft flat cables through the product profiling acupoints. The carrier connecting plate is provided with a plurality of limit blocks, and the product carrier plate is conformed to the plurality of limit blocks.

[0007] Furthermore, the floating needle mold includes a probe base plate and several floating probes. The probe base plate is arranged on the upper end of the lower mold floating plate. Several adapter modules are arranged on the lower end of the lower mold base plate. The two ends of several floating probes are respectively connected to the soft cable and the adapter module.

[0008] Furthermore, a plurality of vacuum adsorption modules are provided at the lower end of the bottom plate of the lower mold, and the adsorption ends of the vacuum adsorption modules cooperate with the adsorption surface of the flexible flat cable through the product-shaped acupuncture points.

[0009] Furthermore, a plurality of connecting pins are provided on both sides of the upper end surface of the upper mold pressing plate, and the movable end of the external lifting device is connected to the upper mold through the plurality of connecting pins.

[0010] Furthermore, a plurality of mounting positioning holes are provided on both sides of the bottom plate of the lower mold, and the plurality of mounting positioning holes are positioned and matched with the fixed ends of the external detection machine.

[0011] Furthermore, the lower end surface of the upper mold floating plate is provided with a plurality of press-fit positioning pins, and the upper end surface of the lower mold floating plate is provided with a plurality of press-fit positioning holes, and the plurality of press-fit positioning pins and the plurality of press-fit positioning holes are positioned and matched.

[0012] Furthermore, the lower mold base plate is provided with a code scanning module, and the code scanning module is inductively coordinated with the identification code on the carrier module.

[0013] Furthermore, a handle and a reinforcement support bar are provided on the upper end surface of the upper mold pressing plate.

[0014] The beneficial effects of the present invention are: the present application adopts a unique split pressing structure, which can be used in conjunction with an assembly line or automatic pressing equipment to perform automated pressing operations, and can simultaneously test products at multiple points, thereby increasing efficiency while greatly reducing the risk of product damage. The test carrier adopts a vacuum suction type, which greatly facilitates the realization of automation, mass production and other needs, improves the stability of production capacity testing, and can effectively prevent the situation of offset overvoltage caused by inaccurate positioning of the soft cable, and can effectively improve the factory yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1It is a stereoscopic view of the present invention; Figure 2 It is a three-dimensional view of another state of the present invention; Figure 3 is a cross-sectional view of another state of the present invention; Figure 4 is a three-dimensional view of the upper mold; Figure 5 is a three-dimensional view of the lower mold; Figure 6 is a three-dimensional view of the vehicle module; Figure 7 3D is a three-dimensional view of the floating needle mold. DETAILED DESCRIPTION

[0016] like Figures 1 to 7 As shown, in this embodiment, the present invention includes an upper mold 1 and a lower mold 2. The lower mold 2 includes a lower mold base plate 21, a lower mold fixed plate 22, a lower mold floating plate 23, and a carrier module 24. The lower mold fixed plate 22 is connected to the upper end surface of the lower mold base plate 21. The lower mold floating plate 23 is floatingly connected to the lower mold fixed plate 22. The lower mold floating plate 23 is provided with a plurality of floating pin molds 25. The carrier module 24 is connected to the upper end surface of the lower mold floating plate 23. The pressing end of the upper mold 1 drives the plurality of flexible flat cables 3 on the carrier module 24 to cooperate with the corresponding floating pin molds 25. It can be seen that the upper mold 1 and the lower mold 2 are configured as a split pressing structure, which can be used in conjunction with an assembly line or automatic pressing equipment for automated pressing operations. The carrier module 24 is provided with a plurality of product placement slots, which can simultaneously test flexible flat cables of multiple acupoints, which is more efficient. In addition, the anti-overpressure buffer structure can greatly reduce the risk of product damage.

[0017] like Figures 2 to 3 As shown, in this embodiment, the upper mold 1 includes an upper mold pressing plate 11, an upper mold fixed plate 12, an upper mold floating plate 13 and a pressing plate 14. The upper mold fixed plate 12 is connected to the lower end surface of the upper mold pressing plate 11, the upper mold floating plate 13 is floatingly connected to the lower end surface of the upper mold fixed plate 12, and the pressing plate 14 is connected to the lower end surface of the upper mold floating plate 13. The pressing plate 14 is provided with a plurality of pressing points 15, and the plurality of pressing points 15 respectively cooperate with the flexible flat cable 3 at the corresponding positions of the carrier module 24. It can be seen that the pressing plate 11 plays the role of overall support and force pressing. Through the buffer spring structure of the upper mold floating plate 13 and the upper mold fixed plate 12, combined with the floating effect of the lower mold floating plate 23, it can effectively provide a two-way buffering effect while the pressing points 15 are in contact with the corresponding pressing positions of the flexible flat cable 3, which can effectively avoid the situation where the product is damaged due to overpressure.

[0018] likeFigure 3 and Figure 6 As shown, in this embodiment, the carrier module 24 includes a carrier support plate 241, a carrier connection plate 242, and a product carrier plate 243. The carrier connection plate 242 is connected to the upper end surface of the carrier support plate 241, and the product carrier plate 243 is connected to the upper end surface of the carrier connection plate 242. The product carrier plate 243 is provided with a plurality of product-profiling acupoints 244, and the flexible flat cable 3 is conformed to the product-profiling acupoints 244. The probe ends of the plurality of floating needle molds 25 are connected and conductively connected to the corresponding flexible flat cable 3 through the product-profiling acupoints 244. The carrier connection plate 242 is provided with a plurality of limit blocks 245, and the product carrier plate 243 is limitedly engaged with the plurality of limit blocks 245. Thus, the product carrier plate 243 is provided with a plurality of groups of product-profiling acupoints 244 corresponding to the pressing acupoints 15, which can simultaneously achieve the positioning and pressing of multiple groups of products.

[0019] like Figure 3 and Figure 7 As shown, in this embodiment, the floating needle mold 25 includes a probe base plate 251 and several floating probes 252. The probe base plate 251 is mounted on the upper end of the lower mold floating plate 23. The lower end of the lower mold base plate 21 is equipped with several adapter modules 26. The two ends of the floating probes 252 are connected to the flexible flat cable 3 and the adapter modules 26, respectively. Thus, the probe base plate 251 limits the position of the floating probes 252, and the two ends of the floating probes 252 are connected to the flexible flat cable 3 and the adapter modules 26, respectively, to achieve power-on testing.

[0020] like Figure 5 As shown, in this embodiment, the lower end of the lower mold base plate 21 is provided with several groups of vacuum adsorption modules 27. The adsorption ends of the vacuum adsorption modules 27 cooperate with the adsorption surfaces of the flexible flat cable 3 through the product-contouring points 244. As can be seen, the product-contouring points 244 adsorb the flexible flat cable 3 when it is inserted, ensuring that the flexible flat cable 3 is stably fixed to the product-contouring points 244 and preventing it from shifting before the press-fit test.

[0021] like Figure 1 As shown, in this embodiment, a plurality of connecting pins 4 are provided on both sides of the upper end surface of the upper mold platen 11, and the movable end of the external lifting device is connected to the upper mold 1 via the connecting pins 4. Thus, it can be seen that the upper mold platen 11 is connected to the movable end of the external lifting mechanism via the connecting pins 4, so that the upper mold 1 can achieve downward pressure testing and upward material replacement.

[0022] like Figure 1As shown, in this embodiment, the lower mold base plate 21 is provided with a plurality of installation positioning holes 5, and the installation positioning holes 5 are fixedly positioned with the external detection machine. As can be seen, the installation positioning holes 5 can connect the lower mold 2 with the external transverse up-down feeding mechanism to realize automatic feeding test.

[0023] As shown, Figure 1 As shown, in this embodiment, the lower mold base plate 21 is provided with a plurality of installation positioning holes 5, and the installation positioning holes 5 are fixedly positioned with the external detection machine. As can be seen, the installation positioning holes 5 can connect the lower mold 2 with the external transverse up-down feeding mechanism to realize automatic feeding test.

[0024] As shown, Figure 1 As shown, in this embodiment, the lower mold base plate 21 is provided with a plurality of installation positioning holes 5, and the installation positioning holes 5 are fixedly positioned with the external detection machine. As can be seen, the installation positioning holes 5 can connect the lower mold 2 with the external transverse up-down feeding mechanism to realize automatic feeding test.

[0025] As shown, Figure 1 As shown, in this embodiment, the lower mold base plate 21 is provided with a plurality of installation positioning holes 5, and the installation positioning holes 5 are fixedly positioned with the external detection machine. As can be seen, the installation positioning holes 5 can connect the lower mold 2 with the external transverse up-down feeding mechanism to realize automatic feeding test.

[0026] The working principle of the present application is as follows: before the equipment is started, the lower mold 2 is connected with the external test machine or line body, the upper mold 1 is connected with the external lifting mechanism or mechanical hand, after assembly, the full-load product carrier plate 243 is placed on the carrier connecting plate 242, the vacuum adsorption module 27 starts to adsorb a plurality of soft wires 3 in the product profiling acupoint 244, when the vacuum adsorption module 27 adsorbs the pressure balance, the code scanning module 8 scans the product carrier plate 243 information, and executes the corresponding test program, the upper mold 1 is pressed down, and the pressing positioning pin 6 and the pressing positioning hole 7 are positioned, after the positioning is completed, a plurality of pressing acupoints 15 are in contact with the corresponding soft wires 3 and drive the soft wires 3 to be connected with a plurality of floating probes 252, so that a plurality of soft wires 3 are connected with the adapter module 26 and are tested by electricity, after the electricity test is completed, each component is reset, the soft wires 3 to be tested are replaced, and the above steps are repeated, so that the multi-acupoint synchronous test of the soft wire mother board can be realized.

[0027] Although the embodiments of the present invention are described with practical solutions, they do not limit the meaning of the present invention. For those skilled in the art, it is obvious to modify the implementation scheme and combine it with other solutions based on this description.

Claims

1. A flexible cable motherboard testing device, comprising an upper mold (1) and a lower mold (2), characterized in that: The lower mold (2) includes a lower mold base plate (21), a lower mold fixed plate (22), a lower mold floating plate (23) and a carrier module (24), wherein the lower mold fixed plate (22) is connected to the upper end surface of the lower mold base plate (21), the lower mold floating plate (23) is floatingly connected to the lower mold fixed plate (22), the lower mold floating plate (23) is provided with a plurality of floating pin molds (25), the carrier module (24) is connected to the upper end surface of the lower mold floating plate (23), and the pressing end of the upper mold (1) drives a plurality of soft cables (3) on the carrier module (24) to cooperate with the corresponding floating pin molds (25).

2. The flexible cable motherboard testing device according to claim 1, characterized in that: The upper mold (1) includes an upper mold pressing plate (11), an upper mold fixing plate (12), an upper mold floating plate (13) and a pressing plate (14), wherein the upper mold fixing plate (12) is connected to the lower end surface of the upper mold pressing plate (11), the upper mold floating plate (13) is floatingly connected to the lower end surface of the upper mold fixing plate (12), and the pressing plate (14) is connected to the lower end surface of the upper mold floating plate (13), and the pressing plate (14) is provided with a plurality of pressing points (15), and the plurality of pressing points (15) respectively cooperate with the soft flat cable (3) at the corresponding positions of the carrier module (24).

3. The flexible cable motherboard testing device according to claim 1, characterized in that: The carrier module (24) includes a carrier support plate (241), a carrier connecting plate (242) and a product carrier plate (243), wherein the carrier connecting plate (242) is connected to the upper end surface of the carrier support plate (241), and the product carrier plate (243) is connected to the upper end surface of the carrier connecting plate (242). The product carrier plate (243) is provided with a plurality of product-shaped acupuncture points (244), and the soft flat cable (3) is matched with the product-shaped acupuncture points (244). The probe ends of the plurality of floating needle molds (25) are connected and conducted with the corresponding soft flat cables (3) through the product-shaped acupuncture points (244). The carrier connecting plate (242) is provided with a plurality of limit blocks (245), and the product carrier plate (243) is matched with the plurality of limit blocks (245).

4. The flexible cable motherboard testing device according to claim 1, characterized in that: The floating needle mold (25) includes a probe base plate (251) and a plurality of floating probes (252), wherein the probe base plate (251) is arranged at the upper end of the lower mold floating plate (23), and a plurality of adapter modules (26) are arranged at the lower end of the lower mold base plate (21), and the two ends of the plurality of floating probes (252) are respectively connected to the flexible cable (3) and the adapter module (26).

5. The flexible cable motherboard testing device according to claim 3, characterized in that: A plurality of groups of vacuum adsorption modules (27) are provided at the lower end of the lower mold base plate (21), and the adsorption ends of the vacuum adsorption modules (27) cooperate with the adsorption surfaces of the flexible flat cable (3) through the product-shaped acupuncture points (244).

6. The flexible cable motherboard testing device according to claim 2, characterized in that: A plurality of connecting pins (4) are provided on both sides of the upper end surface of the upper mold pressing plate (11), and the movable end of the external lifting device is connected to the upper mold (1) via the plurality of connecting pins (4).

7. The flexible cable motherboard testing device according to claim 1, characterized in that: A plurality of mounting positioning holes (5) are provided on both sides of the lower mold base plate (21), and the plurality of mounting positioning holes (5) are positioned and matched with the fixed ends of the external detection machine.

8. The flexible cable motherboard testing device according to claim 2, characterized in that: The lower end surface of the upper die floating plate (13) is provided with a plurality of press-fit positioning pins (6), and the upper end surface of the lower die floating plate (23) is provided with a plurality of press-fit positioning holes (7), and the plurality of press-fit positioning pins (6) and the plurality of press-fit positioning holes (7) are positioned and matched.

9. The flexible cable motherboard testing device according to claim 1, characterized in that: The lower mold base plate (21) is provided with a code scanning module (8), and the code scanning module (8) is inductively matched with the identification code on the carrier module (24).

10. The flexible cable motherboard testing device according to claim 2, characterized in that: The upper end surface of the upper mold pressing plate (11) is provided with a handle (9) and a reinforcement support bar (10).

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