Terminal backboard of integrated antenna, communication terminal and preparation method thereof

Abstract

The invention relates to the technical field of radio frequency packaging, and discloses a terminal backboard of an integrated antenna, which is electrically connected with a communication terminal through an antenna feed point layer, and is characterized in that a first surface of a cover plate is provided with a first integrated groove containing a first tuning chip, and a second surface of the cover plate is provided with a second integrated groove containing a second tuning chip; the first integration layer is arranged on the first surface and comprises a first antenna structure layer, and a first communication antenna is arranged in the first antenna structure layer and electrically connected with the first tuning chip; the second integration layer is arranged on the second surface and comprises a second antenna structure layer, a second communication antenna is arranged in the second antenna structure layer, and the second antenna structure layer is electrically connected with the second tuning chip; the first communication antenna and the second communication antenna are electrically connected with the antenna feed point layer. The communication terminal has the beneficial effects that the huge space on the surface of the cover plate of the communication terminal is fully utilized, the antenna integration degree in the communication terminal is effectively improved through superposition of multiple layers of communication antennas and pre-integration of the tuning chip, and the communication effect of the communication terminal is improved.

Description

Technical Field

[0001] The present application relates to the field of radio frequency packaging technology, and in particular to a terminal backplane with an integrated antenna, a communication terminal, and a preparation method thereof. Background Art

[0002] With the rapid development of wireless communication technology, the number of wireless communication standards is increasing. Each standard offers unique advantages in spectrum utilization, signal transmission rate, coverage, and network stability. Currently, integrating multiple communication standards into smart terminals has become a major development trend. This high level of integration enables smart terminals to selectively switch between communication standards, improving the efficiency and flexibility of data transmission. However, while the number of communication standards has increased, the physical dimensions of smart terminals have tended to be smaller. As a result, antennas for different communication standards occupy a significant portion of the internal space of smart terminals, posing difficulties and challenges to further antenna integration and design.

[0003] Based on relevant technologies, it is urgent to propose a new antenna integration method to adapt to the integration requirements of smart terminals for communication formats. Summary of the Invention

[0004] The present application provides a terminal backplane with an integrated antenna, a communication terminal, and a preparation method thereof, which fully utilizes the huge space on the surface of the communication terminal cover. Through the superposition of multiple layers of communication antennas and the pre-integration of tuning chips, the antenna integration level in the communication terminal is effectively improved, thereby enhancing the communication effect of the communication terminal.

[0005] In order to achieve the above objectives, the main technical solutions adopted in this application include:

[0006] In a first aspect, an embodiment of the present application provides a terminal backplane with an integrated antenna, wherein the terminal backplane is electrically connected to a communication terminal through an antenna feed layer, and the terminal backplane includes:

[0007] a cover plate, the cover plate having a first surface and a second surface opposite to each other, the first surface facing a side away from the communication terminal, the second surface facing the communication terminal, at least one first integrated groove being provided on the first surface, at least one second integrated groove being provided on the second surface, a first tuning chip being provided in the first integrated groove, and a second tuning chip being provided in the second integrated groove;

[0008] a first integrated layer, the first integrated layer being disposed on the first surface, the first integrated layer comprising at least one first antenna structure layer, the at least one first antenna structure layer being provided with a first communication antenna, the first communication antenna being electrically connected to the first tuning chip;

[0009] a second integrated layer, the second integrated layer being disposed on the second surface, the second integrated layer comprising at least one second antenna structure layer, the at least one second antenna structure layer being provided with a second communication antenna, the second communication antenna being electrically connected to the second tuning chip;

[0010] The antenna feed layer is provided on a surface of the first integrated layer close to the communication terminal, and the first communication antenna and the second communication antenna are electrically connected to the antenna feed layer respectively.

[0011] The terminal backplane with integrated antenna proposed in the embodiment of the present application utilizes the space on the surface of the communication terminal backplane to form multiple layers of antenna structure layers on different surfaces of the cover plate, and integrates multiple communication antennas in the antenna structure layers, thereby reducing the physical space occupied by multiple communication antennas in the communication terminal and reducing the size restrictions imposed on the communication terminal by the integrated antennas, thereby effectively improving the integration level of the communication antenna within a limited space and enhancing the communication effect of the communication terminal. Secondly, the present application also provides a tuning chip corresponding to the communication antenna in the cover plate. By pre-integration, the redundant design between the tuning chip and the communication antenna is reduced, the tuning effect of the tuning chip is optimized, and the communication quality of the communication terminal is improved. In addition, the pre-integration of the tuning chip can also omit the steps of mounting and debugging the tuning chip during subsequent use, reducing the complexity of the use process and facilitating the promotion and application of the terminal backplane.

[0012] Optionally, the number of the first communication antennas is more than two, and any one of the first communication antennas is located on one or more layers of the first antenna structure layer;

[0013] The antenna feed point layer is provided with first antenna feed points. The number of the first antenna feed points is equal to the number of the first communication antennas and corresponds to the first communication antennas respectively.

[0014] Optionally, a first connecting trace and a first integrated device are provided in the first antenna structure layer, and a pin of the first tuning chip faces a side away from the cover plate;

[0015] The first communication antenna is electrically connected to the first antenna feed point and the first tuning chip through the first connecting wire, and the first integrated device is electrically connected to the first connecting wire.

[0016] Optionally, the number of the second communication antennas is more than two, and any of the second communication antennas is located on one or more layers of the second antenna structure layer;

[0017] The antenna feed point layer is provided with a second antenna feed point. The number of the second antenna feed points is equal to the number of the second communication antennas and corresponds to the second communication antennas respectively.

[0018] Optionally, a second connecting trace and a second integrated device are provided in the second antenna structure layer, and the pins of the second tuning chip are oriented toward a side away from the cover plate;

[0019] The second communication antenna is electrically connected to the second antenna feed point and the second tuning chip through the second connecting wire, and the second integrated device is electrically connected to the second connecting wire.

[0020] Optionally, a connecting through hole is provided in the cover plate, and the connecting through hole is filled with a conductive medium;

[0021] One end of the connecting through hole is electrically connected to the first communication antenna, and the other end of the connecting through hole is electrically connected to the antenna feed point layer.

[0022] Optionally, a third tuning chip is further provided on a surface of the first integrated layer away from the cover plate, with pins of the third tuning chip facing the cover plate, and the third tuning chip is electrically connected to the first communication antenna.

[0023] Optionally, the line widths of the first communication antenna and the second communication antenna are in the order of millimeters, and the line distances between the first communication antennas, between the second communication antennas, and between the first communication antenna and the second communication antenna are in the order of centimeters.

[0024] In a second aspect, an embodiment of the present application provides a communication terminal, characterized in that it includes a terminal backplane according to any one of the above embodiments.

[0025] In a third aspect, an embodiment of the present application provides a method for preparing a terminal backplane, the method comprising:

[0026] Providing a cover plate; wherein the cover plate has a first surface and a second surface opposite to each other;

[0027] A connecting through hole is formed in the cover plate, a first integrated groove is formed on the first surface, and a first tuning chip is arranged in the first integrated groove; a second integrated groove is formed on the second surface, and a second tuning chip is arranged in the second integrated groove;

[0028] forming a first communication antenna and a first connecting trace on the first surface, and forming a first antenna structure layer by filling and depositing an insulating medium; repeating the step of forming the first antenna structure layer until the number of first communication antennas in the first antenna structure layer reaches a first antenna number threshold, thereby obtaining a first integrated layer;

[0029] forming a second communication antenna and a second connecting trace on the second surface, and forming a second antenna structure layer by filling and depositing an insulating medium; repeating the step of forming the second antenna structure layer until the number of second communication antennas in the second antenna structure layer reaches a second antenna number threshold, thereby obtaining a second integrated layer;

[0030] A plurality of antenna feed points are formed on the surface of the first integrated layer away from the cover plate, and an antenna feed point layer is formed by filling and depositing an insulating medium to obtain the terminal backplane. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the specific implementation methods or the description of the prior art. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0032] Figure 1 A schematic structural diagram of a terminal backplane with an integrated antenna provided in an embodiment of the present application;

[0033] Figure 2a Schematic diagram of the arrangement of antennas in the back panel of the terminal in an embodiment of the present application;

[0034] Figure 2b This is a schematic diagram of the hierarchy of antennas in the backplane of a terminal in an embodiment of the present application;

[0035] Figure 3 This is a schematic diagram of the structure of the single-sided integration of the antenna in the embodiment of the present application;

[0036] Figure 4 This is a schematic diagram of the structure of the single-sided integration of the antenna in the embodiment of the present application;

[0037] Figure 5 This is a schematic diagram of the structure of the integrated third tuning chip in the embodiment of the present application;

[0038] Figure 6 This is a schematic diagram of the structure of the integrated third tuning chip in the embodiment of the present application;

[0039] Figure 7 This is a process flow chart of the method for preparing the terminal backplane provided in an embodiment of the present application.

[0040] Among them, the figure numbers of the drawings in the specification are as follows: 100, cover plate, 110, first integrated groove, 111, first tuning chip, 120, second integrated groove, 121, second tuning chip, 130, connecting through hole, 200, first integrated layer, 210, first antenna structure layer, 211, first communication antenna, 212, first connecting trace, 213, first integrated device, 220, third tuning chip, 300, second integrated layer, 310, second antenna structure layer, 311, second communication antenna, 312, second connecting trace, 313, second integrated device, 400, antenna feeding point layer, 410, first antenna feeding point, 420, second antenna feeding point. DETAILED DESCRIPTION

[0041] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings provide embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of the present application more thorough and comprehensive.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0043] It should be understood that when an element or layer is referred to as being "on," "adjacent to," "connected to," or "coupled to" another element or layer, it can be directly on, adjacent to, connected to, or coupled to the other element or layer, or there can be intervening elements or layers. Conversely, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, doping types, and / or portions, these elements, components, regions, layers, doping types, and / or portions should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, doping type, or portion from another element, component, region, layer, doping type, or portion. Therefore, without departing from the teachings of the present invention, the first element, component, region, layer, doping type or portion discussed below may be represented as a second element, component, region, layer or portion; for example, the first doping type may be referred to as the second doping type, and similarly, the second doping type may be referred to as the first doping type; the first doping type and the second doping type are different doping types, for example, the first doping type may be P-type and the second doping type may be N-type, or the first doping type may be N-type and the second doping type may be P-type.

[0044] Spatially relative terms such as "under," "beneath," "beneath," "under," "above," "above," etc., may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that in addition to the orientations shown in the figures, spatially relative terms also include different orientations of the device in use and operation. For example, if the device in the drawings is turned over, the element or feature described as "under" or "beneath" or "beneath" the other elements will be oriented as "above" the other elements or features. Thus, the exemplary terms "under" and "under" can include both upper and lower orientations. In addition, the device can also include alternative orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.

[0045] As used herein, the singular forms "a," "an," and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include," "comprising," "having," and the like specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Also, in this specification, the term "and / or" includes any and all combinations of the relevant listed items.

[0046] With the rapid development of wireless communication technology, the number of wireless communication standards is increasing. Each standard offers unique advantages in spectrum utilization, signal transmission rate, coverage, and network stability. Currently, integrating multiple communication standards into smart terminals has become a major development trend. This high level of integration enables smart terminals to selectively switch between communication standards, improving the efficiency and flexibility of communication data transmission.

[0047] In related technologies, the external dimensions of smart terminals tend to be miniaturized, and the increase in the number of communication standards means an increase in the number of antennas, which in turn causes the antennas used for different communication standards to greatly occupy the internal space of the smart terminal. This not only brings size restrictions to the smart terminal, but the close distance between antennas also affects the communication quality of the antennas, bringing difficulties and challenges to the further integration and design of the antennas.

[0048] In addition, users usually operate smart terminals in a handheld manner, and the contact between the user's hand and the part of the smart terminal where the antenna is located causes the antenna to be affected by the holding effect, causing the radiation characteristics of the antenna to change and affecting the communication performance of the smart terminal, resulting in signal attenuation or a decrease in the quality of the receiving and transmitting signals in the smart terminal, thereby weakening the communication effect of the communication terminal.

[0049] Based on the above problems, the present application provides a terminal backplane with an integrated antenna, a communication terminal and a preparation method thereof, wherein the terminal backplane is electrically connected to the communication terminal through an antenna feed point layer, including: at least one first integrated groove provided with a first tuning chip is provided on the first surface of the cover plate, and at least one second integrated groove provided with a second tuning chip is provided on the second surface of the cover plate; the first integrated layer is arranged on the first surface, including at least one first antenna structure layer, in which a first communication antenna is provided, and is electrically connected to the first tuning chip; the second integrated layer is arranged on the second surface, including at least one second antenna structure layer, in which a second communication antenna is provided, and is electrically connected to the second tuning chip; the antenna feed point layer is arranged on the surface of the first integrated layer close to the communication terminal, and the first communication antenna and the second communication antenna are electrically connected to the antenna feed point layer respectively.

[0050] The terminal backplane with integrated antenna provided in the present application utilizes the space on the surface of the communication terminal backplane to form multiple layers of antenna structure layers on different surfaces of the cover plate, and integrates multiple communication antennas in the antenna structure layers, thereby reducing the physical space occupied by multiple communication antennas in the communication terminal and reducing the size limitation of the integrated antenna on the communication terminal, thereby effectively improving the integration level of the communication antenna within a limited space and enhancing the communication effect of the communication terminal.

[0051] Secondly, the present application also provides a tuning chip corresponding to the communication antenna in the cover plate, which reduces the redundant design between the tuning chip and the communication antenna through pre-integration, optimizes the tuning effect of the tuning chip, and improves the communication quality of the communication terminal.

[0052] In addition, the pre-integrated tuning chip can also omit the steps of mounting and debugging the tuning chip during subsequent use, reducing the complexity of the use process and facilitating the promotion and application of the terminal backplane.

[0053] The terminal backplane with integrated antenna provided in this specification can be applied to communication terminals that integrate multiple communication standards, including smartphones, smart wearable devices (virtual reality glasses, smart watches, etc.), notebooks, desktop computers, tablet computers, etc. It is understood that this application can also be used in other fields that require the number of communication standards in the communication terminal after adaptive modification, such as Internet of Things devices.

[0054] Embodiments of the invention are described herein with reference to cross-sectional views which are schematic illustrations of idealized embodiments (and intermediate structures) of the invention, such that variations in the shapes shown due to, for example, manufacturing techniques and / or tolerances are anticipated. Accordingly, embodiments of the invention should not be limited to the specific shapes of the regions shown herein, but rather include deviations in shapes due to, for example, manufacturing techniques. For example, an implanted region shown as a rectangle typically has rounded or curved features and / or an implant concentration gradient at its edges rather than a binary change from an implanted region to a non-implanted region. Similarly, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation occurs. Accordingly, the regions shown in the figures are schematic in nature, their shapes do not represent the actual shape of the region of the device, and do not limit the scope of the invention.

[0055] In this embodiment, a terminal backplane with an integrated antenna is provided, which can be used in the above-mentioned communication terminal. Figure 1 As shown, the terminal backplane is electrically connected to the communication terminal through the antenna feed layer, and the terminal backplane includes: a cover plate having a first surface and a second surface relative to each other, the first surface facing the side away from the communication terminal, and the second surface facing the communication terminal, at least one first integrated groove is provided on the first surface, and at least one second integrated groove is provided on the second surface, a first tuning chip is provided in the first integrated groove, and a second tuning chip is provided in the second integrated groove; a first integrated layer is provided on the first surface, the first integrated layer includes at least one first antenna structure layer, a first communication antenna is provided in at least one first antenna structure layer, and the first communication antenna is electrically connected to the first tuning chip; the second integrated layer is provided on the second surface, the second integrated layer includes at least one second antenna structure layer, a second communication antenna is provided in at least one second antenna structure layer, and the second communication antenna is electrically connected to the second tuning chip; the antenna feed layer is provided on the surface of the second integrated layer close to the communication terminal, and the first communication antenna and the second communication antenna are electrically connected to the antenna feed layer respectively.

[0056] Specifically, the terminal backplane includes a cover plate, a first integrated layer, a second integrated layer and an antenna feed point layer, wherein the first integrated layer and the second integrated layer are respectively arranged on both sides of the cover plate, and the antenna feed point layer is arranged on the surface of the second integrated layer close to the communication terminal, which is used to electrically connect the terminal backplane and the communication terminal, realize signal transmission between the communication antenna and the communication terminal, and ensure that the communication terminal can send and receive signals normally.

[0057] The cover plate can be made of glass, quartz, ceramic or the like, and is used to protect the internal components of the communication terminal and provide structural support for the communication terminal. The cover plate has opposite first and second surfaces, wherein the first surface faces away from the communication terminal and is used to dispose the first integrated layer; and the second surface faces the communication terminal and is used to dispose the second integrated layer. It can be understood that the second surface also faces the internal components of the communication terminal. In order to electrically connect the communication antenna in the terminal back plate with the communication terminal, an antenna feed point layer is disposed on the surface of the second integrated layer close to the communication terminal, and the communication antenna in the first integrated layer and the second integrated layer is electrically connected with the antenna feed point layer, so that the communication terminal can realize wireless communication.

[0058] Further, at least one first integrated recess is provided on the first surface of the cover plate, and a first tuning chip is disposed in the first integrated recess. The size of the slot of the first integrated recess matches the first tuning chip, the depth of the first integrated recess is less than the thickness of the cover plate, and is slightly greater than the height of the first tuning chip, so that the pin port of the first tuning chip disposed therein can be flush with the first surface, thereby facilitating electrical connection with the first communication antenna in the first integrated layer. Similarly, at least one second integrated recess is provided on the second surface of the cover plate, and a second tuning chip is disposed in the second integrated recess. The size of the slot of the second integrated recess matches the second tuning chip, the depth of the second integrated recess is less than the thickness of the cover plate, and is slightly greater than the height of the second tuning chip, so that the pin port of the second tuning chip disposed therein can be flush with the second surface, thereby facilitating electrical connection with the second communication antenna in the second integrated layer. It should be noted that when the first integrated recess and the second integrated recess are arranged opposite to each other in the thickness direction of the cover plate, they are independent of each other and do not form a continuous through slot in the cover plate.

[0059] The types of the first and second tuning chips can be impedance tuners or aperture tuners, and the positions at which the tuning chips are connected with the communication antennas can be designed according to the impedance matching requirements, the types of the communication antennas and their working frequency bands, and can be changed by adjusting the positions of the integrated recesses. It should be noted that the tuning chips have been debugged when integrated in the integrated recesses, and do not need to be adjusted subsequently, thereby effectively shortening the research and development cycle of the terminal back plate using the integrated antenna and the communication terminal, and improving the research and development efficiency.

[0060] The first integrated layer is disposed on the first surface of the cover plate and is used to integrate the first communication antenna in the terminal back plate. Figure 1The dotted line in the first integrated layer shown in the figure represents the boundary line between the first antenna structure layers. The first integrated layer includes at least one first antenna structure layer, and the multiple first antenna structure layers are superimposed on each other to form a hierarchical stacked structure. A first communication antenna is provided in the first antenna structure layer, and its operating frequency band is determined according to the 3GPP system. The first communication antenna is also electrically connected to the first tuning chip, so that the operating frequency of the first communication antenna can be adjusted to improve the signal transmission efficiency of the first communication antenna. It can be understood that any first communication antenna can be electrically connected to one first tuning chip or to multiple first tuning chips.

[0061] The first communication antenna can be formed by etching and redistribution layer (RDL) deposition processes. The etching process forms an antenna pattern on the first surface of the cover plate, and the RDL deposition process deposits metal at the antenna pattern to obtain the first communication antenna. Then, an insulating medium is filled around the first communication antenna to form the first antenna structure layer.

[0062] Similarly, the second integration layer is provided on the second surface of the cover plate, and is used to integrate the second communication antenna into the terminal backplane. Figure 1 The dotted line in the second integrated layer shown in the figure represents the boundary line between the second antenna structure layers. The second integrated layer includes at least one second antenna structure layer, and the multiple second antenna structure layers are superimposed on each other to form a hierarchical stacked structure. A second communication antenna is provided in the second antenna structure layer, and its operating frequency band is determined according to the 3GPP system. The second communication antenna is also electrically connected to the second tuning chip, so that the operating frequency of the second communication antenna can be adjusted to improve the signal transmission efficiency of the second communication antenna. It can be understood that any second communication antenna can be electrically connected to one second tuning chip or to multiple second tuning chips.

[0063] The second communication antenna can be formed by etching and redistribution layer deposition processes. The etching process forms an antenna pattern on the second surface of the cover plate, and the redistribution layer deposition process deposits metal at the antenna pattern to obtain the second communication antenna. Then, an insulating dielectric is filled around the second communication antenna to form the second antenna structure layer.

[0064] The materials of the first communication antenna and the second communication antenna can be metal materials such as copper, aluminum, copper-aluminum alloy or titanium-copper alloy, and the materials used to form the first antenna structure layer and the second antenna structure layer can be dielectric materials such as PI, ABF or silicon oxide.

[0065] Taking the first integrated layer as an example, the arrangement of the first communication antenna in the first integrated layer can be referred to Figure 2aAs shown, the position of any first communication antenna relative to the cover plate can be determined according to the actual scene requirements. The hierarchical relationship between the first communication antennas can refer to Figure 2b As shown, different first communication antennas may be located in the same first antenna structure layer or in different first antenna structure layers.

[0066] It should be noted that by integrating the communication antenna into the cover surface and specifically designing its position, the antenna can be located in an area not touched by the hand. This reduces the impact of the grip effect on the communication antenna's signal transmission when the user operates the smart terminal in a normal grip, thereby improving the signal transmission and reception quality of the communication terminal. Furthermore, the terminal backplane of this application also protects the communication antenna through an insulating medium, further reducing the impact of the user's hand on the communication antenna.

[0067] The terminal backplane with integrated antenna provided in this embodiment utilizes the space on the surface of the communication terminal backplane to form multiple layers of antenna structure layers on different surfaces of the cover plate, and integrates multiple communication antennas in the antenna structure layers, thereby reducing the physical space occupied by multiple communication antennas in the communication terminal and reducing the size limitation of the integrated antenna on the communication terminal, thereby effectively improving the integration level of the communication antenna within a limited space and enhancing the communication effect of the communication terminal.

[0068] Secondly, the present application also provides a tuning chip corresponding to the communication antenna in the cover plate, which reduces the redundant design between the tuning chip and the communication antenna through pre-integration, optimizes the tuning effect of the tuning chip, and improves the communication quality of the communication terminal.

[0069] In addition, the pre-integrated tuning chip can also omit the steps of mounting and debugging the tuning chip during subsequent use, reducing the complexity of the use process and facilitating the promotion and application of the terminal backplane.

[0070] As an embodiment of the present application, the number of first communication antennas is more than two, and any first communication antenna is located on one or more layers of the first antenna structure layer; a first antenna feed point is provided in the antenna feed point layer, and the number of the first antenna feed points is equal to the number of the first communication antennas, and corresponds to the first communication antennas respectively.

[0071] Specifically, the number of first communication antennas can be two or more. The first communication antennas can be a single-layer antenna pattern provided in any first antenna structure layer, or a complex multi-layer antenna structure provided in multiple first antenna structure layers. Different first communication antennas operate independently of each other, and the distance between the first communication antennas can be designed based on their structure and operating frequency band to avoid mutual interference between the different first communication antennas.

[0072] It should be noted that this application integrates multiple first communication antennas in a multi-layer first antenna structure layer, thereby improving the antenna integration level in the terminal backplane and reducing the area occupied by the communication antenna on the cover surface, so as to further reduce the external dimensions of the communication terminal.

[0073] Reference Figure 3 As shown, in some embodiments, the terminal backplane may only be integrated with the first communication antenna. In this case, the second integrated layer does not have a second communication antenna, but may be integrated with a functional circuit with specific functions to cooperate with the first communication antenna.

[0074] Furthermore, the number of the first antenna feed points in the antenna feed point layer is equal to the number of the first communication antennas. Any first communication antenna corresponds to a dedicated first antenna feed point, and different first communication antennas do not share the same first antenna feed point.

[0075] As an embodiment of the present application, a first connecting trace and a first integrated device are provided in the first antenna structure layer, and the pin of the first tuning chip is facing the side away from the cover plate; the first communication antenna is electrically connected to the first antenna feed point and the first tuning chip through the first connecting trace, and the first integrated device is electrically connected to the first connecting trace.

[0076] Specifically, the pins of the first tuning chip face away from the cover plate and are flush with the first surface of the cover plate, facilitating electrical connection between the first tuning chip and the first integrated layer. The first communication antenna and the first tuning chip are interconnected via a first connecting trace, enabling the first tuning chip to adjust the operating frequency of the first communication antenna, thereby improving the signal transmission and reception quality of the communication terminal.

[0077] Furthermore, a first integrated device is also provided in the first antenna structure layer, and the first integrated device is connected to the first communication antenna or the first tuning chip through a first connecting trace, thereby forming a functional circuit with specific functions to cooperate with the operation of the first communication antenna and the first tuning chip. The first integrated device can be a capacitor or inductor device for tuning the resonant frequency of the first communication antenna, or a device such as an antenna switch. Among them, the capacitor can be integrated through various semiconductor processes such as MIM capacitors, MOM capacitors or through-hole multilayer sandwich capacitors; the inductor can be realized as a planar spiral inductor or a 3D stereo inductor through processes such as RDL and RDL+TGV, thereby being integrated into the first antenna structure layer; the antenna switch can include types such as a transmit switch, a diversity receive switch and a channel switching switch.

[0078] As an embodiment of the present application, the number of second communication antennas is more than two, and any second communication antenna is located on one or more layers of the second antenna structure layer; a second antenna feed point is provided in the antenna feed point layer, and the number of the second antenna feed points is equal to the number of the second communication antennas, and corresponds to the second communication antennas respectively.

[0079] Specifically, the number of second communication antennas can be two or more. The second communication antennas can be a single-layer antenna pattern located in any second antenna structure layer, or a complex multi-layer antenna structure located in multiple second antenna structure layers. Different second communication antennas operate independently of each other, and the distance between the second communication antennas can be designed based on their structure and operating frequency band to avoid mutual interference between the different second communication antennas.

[0080] It should be noted that this application integrates multiple second communication antennas in a multi-layer second antenna structure layer, thereby improving the antenna integration level in the terminal backplane and reducing the area occupied by the communication antenna on the cover surface, so as to further reduce the external dimensions of the communication terminal.

[0081] Reference Figure 4 As shown, in some embodiments, the terminal backplane may also be integrated with only the second communication antenna. In this case, the first integrated layer does not have the first communication antenna, but may be integrated with a functional circuit with specific functions to cooperate with the second communication antenna.

[0082] Furthermore, the number of the second antenna feed points in the antenna feed point layer is equal to the number of the second communication antennas. Any second communication antenna has a dedicated second antenna feed point, and different second communication antennas do not share the same second antenna feed point.

[0083] As an embodiment of the present application, a second connecting trace and a second integrated device are provided in the second antenna structure layer, and the pin of the second tuning chip is facing the side away from the cover plate; the second communication antenna is electrically connected to the second antenna feed point and the second tuning chip through the second connecting trace, and the second integrated device is electrically connected to the second connecting trace.

[0084] Specifically, the pins of the second tuning chip face away from the cover plate and are flush with the second surface of the cover plate, facilitating electrical connection between the second tuning chip and the second integrated layer. The second communication antenna and the second tuning chip are interconnected via a second connecting trace, enabling the second tuning chip to adjust the operating frequency of the second communication antenna, thereby improving the signal transmission and reception quality of the communication terminal.

[0085] Furthermore, a second integrated device is provided in the second antenna structure layer, and the second integrated device is connected to the second communication antenna or the second tuning chip through a second connecting line, thereby forming a functional circuit with specific functions to cooperate with the operation of the second communication antenna and the second tuning chip. The second integrated device can be a capacitor or inductor device for tuning the resonant frequency of the second communication antenna, or a device such as an antenna switch. Among them, the capacitor can be integrated through various semiconductor processes such as MIM capacitors, MOM capacitors or through-hole multilayer sandwich capacitors; the inductor can be realized as a planar spiral inductor or a 3D stereo inductor through processes such as RDL and RDL+TGV, thereby being integrated into the second antenna structure layer; the antenna switch can include types such as a transmit switch, a diversity receive switch and a channel switching switch.

[0086] As an embodiment of the present application, a connecting through hole is provided in the cover plate, and the connecting through hole is filled with a conductive medium; one end of the connecting through hole is electrically connected to the first communication antenna, and the other end of the connecting through hole is electrically connected to the antenna feed point layer.

[0087] Specifically, the connecting through-hole enables electrical connection between the two ends of the cover plate through a conductive medium, thereby enabling electrical connection between the first communication antenna and the first antenna feed point in the antenna feed point layer, thereby achieving connection between the first communication antenna and the communication terminal. It should be noted that the end of the connecting through-hole near the first integrated layer can be electrically connected to the first communication antenna via a first connecting trace, and the end of the connecting through-hole near the second integrated layer can be electrically connected to the first antenna feed point via a second connecting trace.

[0088] As an embodiment of the present application, a third tuning chip is further provided on the surface of the first integrated layer away from the cover plate, the pins of the third tuning chip face the cover plate, and the third tuning chip is electrically connected to the first communication antenna.

[0089] Reference Figure 5 As shown, the tuning chip connected to the first communication antenna can also be set in the form of a patch on the surface of the first integrated layer away from the cover plate, and these tuning chips are used as the third tuning chip. The pins of the third tuning chip face the cover plate and are electrically connected to the first communication antenna. It is understandable that the third tuning chip can be directly electrically connected to the first communication antenna or electrically connected to the first communication antenna through the first connecting trace. The third tuning chip can also be electrically connected to the first integrated device, thereby forming a functional circuit with specific functions to cooperate with the operation of the first communication antenna.

[0090] It should be noted that the type of the third tuning chip can be an impedance tuner or an aperture tuner, and the position where the third tuning chip is connected to the first communication antenna can be designed according to the impedance matching requirements, the type of communication antenna and its operating frequency band, and can be changed by adjusting the position of the integrated groove.

[0091] Reference Figure 6 As shown, the first communication antenna can also be electrically connected to the first tuning chip and the third tuning chip at the same time. At this time, any first communication antenna can be electrically connected to multiple tuning chips, so that the first communication antenna can operate at a resonant frequency in multiple frequency bands, thereby improving the signal quality and flexibility of the first communication antenna.

[0092] As an embodiment of the present application, the line widths of the first communication antenna and the second communication antenna are in the order of millimeters, and the line distances between the first communication antennas, between the second communication antennas, and between the first communication antenna and the second communication antenna are in the order of centimeters.

[0093] Specifically, the communication terminal has certain restrictions on the wiring density in the antenna structure, requiring that the wiring density cannot be higher than a preset threshold, otherwise a strong coupling effect will occur between the communication antennas, resulting in the signal quality of the communication terminal being affected. At the same time, in order to ensure the effective transmission of the signal, the communication terminal usually has certain power requirements for the communication antenna, thereby stipulating the current and voltage of the communication antenna. Based on the above reasons, in this application, the line width of the first communication antenna and the second communication antenna is in the order of millimeters, and the line spacing between the first communication antenna, between the second communication antenna, and between the first communication antenna and the second communication antenna is approximately one-quarter wavelength or more of the signal, usually in the order of centimeters, to ensure the normal operation of the communication terminal.

[0094] The present application also provides a communication terminal, which includes the terminal backplane of any one of the above embodiments.

[0095] Reference Figure 7 As shown, the present application also provides a method for preparing a terminal backplane, which is used to prepare the terminal backplane of any of the above embodiments. The method comprises:

[0096] S710. Provide a cover plate; wherein the cover plate has a first surface and a second surface opposite to each other.

[0097] S720. Form a connecting through hole in the cover plate, form a first integrated groove on the first surface, and set a first tuning chip in the first integrated groove; form a second integrated groove on the second surface, and set a second tuning chip in the second integrated groove.

[0098] S730. Form a first communication antenna and a first connecting trace on the first surface, and form a first antenna structure layer by filling and depositing an insulating medium; repeat the steps of forming the first antenna structure layer until the number of first communication antennas in the first antenna structure layer reaches a first antenna number threshold, thereby obtaining a first integrated layer.

[0099] S740. Form a second communication antenna and a second connecting trace on the second surface, and form a second antenna structure layer by filling and depositing an insulating medium; repeat the step of forming the second antenna structure layer until the number of second communication antennas in the second antenna structure layer reaches the second antenna number threshold, thereby obtaining a second integrated layer.

[0100] S750. A plurality of antenna feed points are formed on the surface of the second integrated layer away from the cover plate, and an antenna feed point layer is formed by filling and depositing an insulating medium to obtain a terminal backplane.

[0101] Specifically, the location of the connecting through-hole in the cover plate can be determined based on the routing design of the first communication antenna in the first integrated layer and the second communication antenna in the second integrated layer to ensure effective electrical connection between the first communication antenna and the first antenna feed point. Similarly, the location of the first integrated groove and the second integrated groove can also be determined based on the routing design of the first and second communication antennas to ensure the tuning effect of the tuning chip on the communication antenna.

[0102] Furthermore, multiple layers of antenna structures are formed through metal deposition and insulating dielectric filling. The connecting traces or communication antennas between different antenna structure layers are connected by vias filled with conductive material. It is understood that the surfaces of the first and second integrated layers, each away from the cover plate, are covered with an insulating dielectric to provide protection for the communication antennas and reduce damage and impact to the communication antennas during user use.

[0103] Furthermore, the first communication antenna and the second communication antenna are both connected to the antenna feed points in the antenna feed point layer, and are connected to the communication terminal through the antenna feed points, thereby realizing signal transmission between the communication antenna and the communication terminal, ensuring that the communication terminal can send and receive signals normally.

[0104] It should also be noted that the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, commodity, or apparatus that includes a series of elements includes not only those elements but also other elements not explicitly listed, or includes elements inherent to such process, method, commodity, or apparatus. In the absence of further limitations, an element defined by the phrase "comprises a ..." does not exclude the presence of other identical elements in the process, method, commodity, or apparatus that includes the element.

[0105] The various embodiments in this specification are described in a progressive manner. Similar parts between the various embodiments can be referred to in conjunction with each other. Each embodiment focuses on the differences between the other embodiments. In particular, the system embodiments are generally similar to the method embodiments, so the description is relatively simple. For relevant parts, refer to the description of the method embodiments.

[0106] The foregoing is merely an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should all be included within the scope of the claims of the present application.

[0107] Although the embodiments of the present application have been described with reference to the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present application, and such modifications and variations shall fall within the scope defined by the appended claims.

Claims

1. A terminal backplane with an integrated antenna, characterized in that: The terminal backplane is electrically connected to the communication terminal through the antenna feed point layer, and the terminal backplane includes: a cover plate, the cover plate having a first surface and a second surface opposite to each other, the first surface facing a side away from the communication terminal, the second surface facing the communication terminal, at least one first integrated groove being provided on the first surface, at least one second integrated groove being provided on the second surface, a first tuning chip being provided in the first integrated groove, and a second tuning chip being provided in the second integrated groove; a first integrated layer, the first integrated layer being disposed on the first surface, the first integrated layer comprising at least one first antenna structure layer, the at least one first antenna structure layer being provided with a first communication antenna, the first communication antenna being electrically connected to the first tuning chip; a second integrated layer, the second integrated layer being disposed on the second surface, the second integrated layer comprising at least one second antenna structure layer, the at least one second antenna structure layer being provided with a second communication antenna, the second communication antenna being electrically connected to the second tuning chip; The antenna feed layer is provided on a surface of the first integrated layer close to the communication terminal, and the first communication antenna and the second communication antenna are electrically connected to the antenna feed layer respectively.

2. The terminal backplane according to claim 1, characterized in that: The number of the first communication antennas is more than two, and any of the first communication antennas is located on one or more layers of the first antenna structure layer; The antenna feed point layer is provided with first antenna feed points. The number of the first antenna feed points is equal to the number of the first communication antennas and corresponds to the first communication antennas respectively.

3. The terminal backplane according to claim 2, characterized in that: A first connecting trace and a first integrated device are provided in the first antenna structure layer, and a pin of the first tuning chip faces a side away from the cover plate; The first communication antenna is electrically connected to the first antenna feed point and the first tuning chip through the first connecting wire, and the first integrated device is electrically connected to the first connecting wire.

4. The terminal backplane according to claim 1, characterized in that: The number of the second communication antennas is more than two, and any of the second communication antennas is located on one or more layers of the second antenna structure layer; The antenna feed point layer is provided with a second antenna feed point. The number of the second antenna feed points is equal to the number of the second communication antennas and corresponds to the second communication antennas respectively.

5. The terminal backplane according to claim 4, characterized in that: A second connecting trace and a second integrated device are provided in the second antenna structure layer, and a pin of the second tuning chip faces a side away from the cover plate; The second communication antenna is electrically connected to the second antenna feed point and the second tuning chip through the second connecting wire, and the second integrated device is electrically connected to the second connecting wire.

6. The terminal backplane according to claim 1, characterized in that: The cover plate is provided with a connecting through hole, and the connecting through hole is filled with a conductive medium; One end of the connecting through hole is electrically connected to the first communication antenna, and the other end of the connecting through hole is electrically connected to the antenna feed point layer.

7. The terminal backplane according to claim 1, characterized in that: A third tuning chip is further provided on a surface of the first integrated layer away from the cover plate, with pins of the third tuning chip facing the cover plate, and the third tuning chip is electrically connected to the first communication antenna.

8. The terminal backplane according to claim 1, characterized in that: The line widths of the first communication antenna and the second communication antenna are in the order of millimeters, and the line distances between the first communication antennas, between the second communication antennas, and between the first communication antenna and the second communication antenna are in the order of centimeters.

9. A communication terminal, characterized in that: The terminal comprises the terminal back plate according to any one of claims 1 to 8.

10. A method for preparing a terminal backplane, characterized in that: The method comprises: Providing a cover plate; wherein the cover plate has a first surface and a second surface opposite to each other; A connecting through hole is formed in the cover plate, a first integrated groove is formed on the first surface, and a first tuning chip is arranged in the first integrated groove; a second integrated groove is formed on the second surface, and a second tuning chip is arranged in the second integrated groove; forming a first communication antenna and a first connecting trace on the first surface, and forming a first antenna structure layer by filling and depositing an insulating medium; repeating the step of forming the first antenna structure layer until the number of first communication antennas in the first antenna structure layer reaches a first antenna number threshold, thereby obtaining a first integrated layer; forming a second communication antenna and a second connecting trace on the second surface, and forming a second antenna structure layer by filling and depositing an insulating medium; repeating the step of forming the second antenna structure layer until the number of second communication antennas in the second antenna structure layer reaches a second antenna number threshold, thereby obtaining a second integrated layer; A plurality of antenna feed points are formed on the surface of the first integrated layer away from the cover plate, and an antenna feed point layer is formed by filling and depositing an insulating medium to obtain the terminal backplane.

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