Small-size high-power power supply system based on high-density integration

Abstract

The invention relates to the technical field of power supplies, and discloses a small-size high-power power supply system based on high-density integration, and the system comprises a power conversion module which employs a three-dimensional stacked integrated structure, enables gallium nitride or silicon carbide power semiconductor devices to be vertically stacked through a flip chip technology, and enables the power conversion module to be connected with a power supply module; the adjacent devices are electrically connected through a plurality of layers of metal interconnection lines; and the heat dissipation module comprises a micro heat dissipation fin array and a micro fan, and the micro heat dissipation fin array is integrally formed by adopting a micro-nano machining technology. According to the power conversion module, the advantages in the aspects of performance, energy efficiency, reliability and the like are remarkable, in space utilization and power density, the three-dimensional stacking framework and the flip chip process of the power conversion module greatly reduce the device size, and the embedded heat dissipation channel is matched with the micro heat dissipation fin array, so that efficient heat dissipation and high power output are achieved in a limited space; high-power output of a small-size power supply is realized, the miniaturization requirement of equipment is met, and the applicability of the power supply is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of power supply, and in particular to a small-volume, high-power power supply system based on high-density integration. Background Art

[0002] A small-volume, high-power power supply refers to an energy conversion device that achieves high-power output in a compact space, taking into account the technical characteristics of "miniaturization" and "power maximization". Its core is to compress the volume of components such as transformers and capacitors through high-frequency conversion technology (such as switching power supplies replacing traditional linear power supplies), new semiconductor materials (silicon carbide, gallium nitride) and integrated design, while improving energy conversion efficiency (up to more than 90%). It is commonly used in aerospace equipment, portable medical equipment, high-performance servers and other scenarios, and must meet stringent heat dissipation designs (such as liquid cooling and phase change materials) to solve the heat generation problem caused by increased power density. Compared with traditional power supplies, it has significant advantages in areas such as drone endurance optimization and miniaturization of on-board power supplies for new energy vehicles. It represents an important direction for the development of power supply technology towards "lightweight and high efficiency", and it is necessary to balance the technical contradictions between volume, power, heat dissipation and cost.

[0003] Currently, most power supplies are limited by their production processes, and their power and volume are often positively correlated. This results in high-power power supplies being generally large in size, seriously affecting their adaptability to actual usage scenarios. At the same time, as the core component of the equipment's energy supply, once a traditional power supply fails, it will directly cause the equipment to shut down. To this end, we propose a small-volume, high-power power supply system based on high-density integration. Summary of the Invention

[0004] (1) Technical problems solved

[0005] In response to the shortcomings of the existing technology, the present invention provides a small-volume, high-power power supply system based on high-density integration, which solves the problem that most existing power supplies are limited by production processes, and their power and volume are often positively correlated, resulting in high-power power supplies generally being bulky, seriously affecting their adaptability to actual usage scenarios. At the same time, as the core component of the equipment's energy supply, once a traditional power supply fails, it will directly lead to equipment shutdown.

[0006] (2) Technical solution

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions: a small-volume, high-power power supply system based on high-density integration, comprising:

[0008] Power conversion module: Adopting a three-dimensional stacked integrated architecture, gallium nitride or silicon carbide power semiconductor devices are vertically stacked through a flip-chip process, and adjacent devices are electrically connected using multi-layer metal interconnect lines;

[0009] Heat dissipation module: includes a micro heat dissipation fin array and a micro fan. The micro heat dissipation fin array is integrally formed using micro-nano processing technology and fits tightly onto the power conversion module.

[0010] Control module: Using system-level packaging technology, the voltage detection circuit, current detection circuit, overvoltage protection circuit, overcurrent protection circuit and PWM modulation circuit and other functional circuits are integrated into the same package;

[0011] Input / output interface module: adopts a multi-layer three-dimensional connector design, through interlayer insulation isolation and vertical conduction structure, the input and output lines are staggered in three-dimensional space;

[0012] Intelligent management module: This includes a load prediction unit that adjusts the power allocation strategy in advance by monitoring the load change rate and analyzing historical data statistics. It also includes a dynamic power consumption optimization unit that automatically adjusts the operating frequency and voltage of each module based on real-time load conditions.

[0013] Energy recovery module: includes a multi-stage LC resonant network, stores the recovered energy in a micro supercapacitor array, and feeds the stored energy back to the output end through an intelligent charging circuit;

[0014] Data storage module: stores the data analyzed by the intelligent management module;

[0015] Redundant protection module: adopts a distributed fault detection architecture and sets up independent fault monitoring units in each key module.

[0016] Preferably, the output end of the control module is electrically connected to a power conversion module, and the control module is used to monitor and adjust the working state of the power conversion module in real time to achieve high-precision control of the power supply system. The output end of the power conversion module is electrically connected to an input-output interface module, and the output end of the input-output interface module is electrically connected to an energy recovery module for recovering surge energy and standby loss energy generated inside the power supply system. The output end of the energy recovery module is electrically connected to the input end of the power conversion module, and the output end of the control module is electrically connected to a heat dissipation module. The output end of the heat dissipation module is electrically connected to the input end of the power conversion module, and the output end of the power conversion module is electrically connected to the input end of the control module. The advantages in performance, energy efficiency, reliability, etc. are significant. In terms of space utilization and power density, the three-dimensional stacking architecture and flip-chip process of the power conversion module greatly reduce the size of the device. The embedded heat dissipation channel cooperates with the micro heat dissipation fin array to achieve efficient heat dissipation and high power output in a limited space, realize small-volume power supply with high power output, meet the miniaturization requirements of equipment, and improve the applicability of the power supply.

[0017] Preferably, the control module includes a redundant protection module, an intelligent management module, a data storage module, a main control unit and a backup control unit. The intelligent management module reduces energy consumption and improves power supply response speed through load prediction and dynamic power consumption optimization. The energy recovery module realizes energy recycling and improves overall energy efficiency. The control module uses system-level packaging technology to integrate functional circuits such as voltage detection, current detection, overvoltage protection, overcurrent protection and PWM modulation into the same package, and adopts a multi-level redundant circuit design. The main control unit monitors and adjusts the working status of the power conversion module in real time to achieve high-precision control. Once the main control unit fails, the backup control unit immediately takes over automatically and seamlessly to maintain normal operation of the system.

[0018] Preferably, an embedded heat dissipation channel is provided inside the power conversion module, and the heat dissipation channel is connected to the micro heat dissipation fin array on the surface of the module, so as to achieve efficient heat dissipation and power conversion while reducing the volume of the module; a nano-dielectric composite material insulation layer is also provided inside the power conversion module, and the nano-dielectric composite material insulation layer is wrapped around the outside of the power semiconductor device and the metal interconnection line.

[0019] Preferably, the spacing between the fins in the heat dissipation module is no more than 1.5 mm, and the thickness does not exceed 4 mm. The micro fan is integrated in the hollow area of ​​the heat dissipation fin array to accelerate air flow and improve heat dissipation efficiency. The fins, micro fans and phase change heat dissipation layer in the heat dissipation module form a composite heat dissipation system, which can quickly dissipate heat, effectively avoid performance degradation and device damage caused by overheating, and extend the service life of the system. The redundant design of the control module realizes precise control and seamless fault switching, avoids equipment shutdown, and ensures stable operation of the system.

[0020] Preferably, a phase change heat dissipation layer is provided in the heat dissipation module, and the phase change heat dissipation layer is arranged between the micro heat dissipation fin array and the power conversion module. When the temperature of the power conversion module rises, the phase change heat dissipation layer undergoes phase change to absorb heat, thereby enhancing the heat dissipation effect.

[0021] Preferably, the control module adopts a multi-level redundant circuit design. When the main control unit fails, the backup control unit automatically and seamlessly takes over the control function. The control module uses system-level packaging technology to integrate functional circuits such as voltage detection, current detection, overvoltage protection, overcurrent protection and PWM modulation into the same package, and adopts a multi-level redundant circuit design. The main control unit monitors and adjusts the working status of the power conversion module in real time to achieve high-precision control. Once the main control unit fails, the backup control unit immediately and automatically takes over seamlessly to maintain normal operation of the system.

[0022] Preferably, the input and output interface module is provided with an adaptive impedance matching circuit, which can automatically adjust the interface output impedance according to the impedance characteristics of the external connection device, reduce signal reflection, and improve power transmission efficiency. The multi-layer three-dimensional layout of the input and output interface module saves space, and the adaptive impedance matching circuit improves power transmission efficiency. The load prediction unit in the intelligent management module continuously monitors the load change rate, and combines historical data for statistical analysis to predict load demand in advance and dynamically adjust the power allocation strategy. The dynamic power consumption optimization unit automatically adjusts the operating frequency and voltage of each module according to the real-time load conditions to reduce energy consumption. The energy recovery module recovers the surge energy and standby loss energy generated inside the power supply system through a multi-stage LC resonant network, stores it in a micro supercapacitor array, and then feeds it back to the output end through the intelligent charging circuit to achieve energy recycling.

[0023] Preferably, the data storage module realizes the storage of power supply operation data to facilitate subsequent maintenance operations. The data storage module is responsible for recording the data analyzed by the intelligent management module and various parameters of the power supply operation to provide data support for subsequent maintenance.

[0024] Preferably, the redundant protection module includes multiple backup power supply channels. When the main power supply channel fails, it automatically switches to the backup channel. The distributed monitoring and backup power supply channels of the redundant protection module ensure power supply continuity and provide solid protection for the stable operation of the equipment. The modules work closely together to achieve high-density integration, small size, and high-power stable power output.

[0025] In summary, the technical effects and advantages of the present invention are as follows:

[0026] 1. The present invention has significant advantages in terms of performance, energy efficiency, reliability, etc. In terms of space utilization and power density, the three-dimensional stacking architecture and flip-chip process of the power conversion module greatly reduce the size of the device. The embedded heat dissipation channel and the micro heat dissipation fin array cooperate to achieve efficient heat dissipation and high power output in a limited space, realizing a small-volume power supply with high power output, meeting the needs of miniaturization of equipment, and improving the applicability of the power supply.

[0027] 2. In the present invention, the fins, micro fans and phase change heat dissipation layer in the heat dissipation module form a composite heat dissipation system, which can quickly dissipate heat, effectively avoid performance degradation and device damage caused by overheating, and extend the service life of the system. The redundant design of the control module realizes precise control and seamless switching of faults, avoids equipment shutdown, and ensures stable operation of the system.

[0028] 3. In the present invention, the multi-layer three-dimensional layout of the input and output interface modules saves space, the adaptive impedance matching circuit improves power transmission efficiency, the intelligent management module reduces energy consumption and improves power supply response speed through load prediction and dynamic power consumption optimization, and the energy recovery module realizes energy recycling and improves overall energy efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a schematic diagram of the system structure of a small-volume, high-power power supply system based on high-density integration according to the present invention;

[0030] Figure 2 This is a sub-flow chart of the control module operation in the small-volume, high-power power supply system based on high-density integration of the present invention;

[0031] Figure 3 This is a sub-flow chart of the operation of the heat dissipation module in the high-density integrated small-volume, high-power power supply system of the present invention. DETAILED DESCRIPTION

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0033] refer to Figure 1-Figure 3 The high-density integrated, small-volume, high-power power supply system shown includes:

[0034] Power conversion module: Adopting a three-dimensional stacked integrated architecture, gallium nitride or silicon carbide power semiconductor devices are vertically stacked through a flip-chip process, and adjacent devices are electrically connected using multi-layer metal interconnect lines;

[0035] Heat dissipation module: includes a micro heat dissipation fin array and a micro fan. The micro heat dissipation fin array is integrally formed using micro-nano processing technology and fits tightly onto the power conversion module.

[0036] Control module: Using system-level packaging technology, the voltage detection circuit, current detection circuit, overvoltage protection circuit, overcurrent protection circuit and PWM modulation circuit and other functional circuits are integrated into the same package;

[0037] Input / output interface module: adopts a multi-layer three-dimensional connector design, through interlayer insulation isolation and vertical conduction structure, the input and output lines are staggered in three-dimensional space;

[0038] Intelligent management module: including load prediction unit, through load change rate monitoring and historical data statistical analysis, advance adjustment power distribution strategy; also including dynamic power consumption optimization unit, according to real-time load condition automatic adjustment each module working frequency and voltage;

[0039] Energy recovery module: including multistage LC resonance network, the energy stored in the micro super capacitor array is recovered, and the stored energy is fed back to the output end through the intelligent charging circuit;

[0040] Data storage module: the data analyzed by the intelligent management module is stored;

[0041] Redundancy protection module: a distributed fault detection architecture is adopted, and independent fault monitoring units are arranged in each key module.

[0042] The output end of the control module is electrically connected with the power conversion module, the control module is used for real-time monitoring and adjusting the working state of the power conversion module, realizing high-precision control of the power supply system, the output end of the power conversion module is electrically connected with the input and output interface module, the output end of the input and output interface module is electrically connected with the energy recovery module, which is used for recovering the surge energy and standby loss energy generated in the power supply system, the output end of the energy recovery module is electrically connected with the input end of the power conversion module, the output end of the control module is electrically connected with the heat dissipation module, the output end of the heat dissipation module is electrically connected with the input end of the power conversion module, the output end of the power conversion module is electrically connected with the input end of the control module, which has obvious advantages in performance, energy efficiency and reliability, and in space utilization and power density, the three-dimensional stacking architecture and flip chip technology of the power conversion module greatly reduce the device volume, the embedded heat dissipation channel cooperates with the micro heat dissipation fin array to realize efficient heat dissipation and high power output in limited space, realize small volume power supply high power output, meet the demand of equipment miniaturization, and improve the applicability of the power supply.

[0043] The control module includes a redundancy protection module, an intelligent management module, a data storage module, a main control unit and a backup control unit, the intelligent management module reduces energy consumption and improves power supply response speed through load prediction and dynamic power consumption optimization, the energy recovery module realizes energy recycling and improves overall energy efficiency, the control module uses system-level packaging technology to integrate voltage detection, current detection, overvoltage protection, overcurrent protection and PWM modulation function circuits in the same package, and adopts multi-level redundant circuit design, the main control unit monitors and adjusts the working state of the power conversion module in real time, realizing high-precision control, once the main control unit fails, the backup control unit immediately and automatically takes over seamlessly, maintaining normal operation of the system.

[0044] The power conversion module is internally provided with an embedded heat dissipation channel, the heat dissipation channel is communicated with a micro heat dissipation fin array on the surface of the module, so that high-efficiency heat dissipation and power conversion are realized while the volume of the module is reduced; the power conversion module is further provided with a nanometer dielectric composite insulation layer, which is wrapped outside the power semiconductor device and the metal interconnection circuit.

[0045] The spacing between the fins in the heat dissipation module is not greater than 1.5 mm, and the thickness is not more than 4 mm, the micro fan is integrated in the hollow area of the heat dissipation fin array, which is used to accelerate air flow and improve heat dissipation efficiency, the fins, micro fans and phase change heat dissipation layer in the heat dissipation module form a composite heat dissipation system, which quickly leads out heat, effectively avoids performance degradation and device damage caused by overheating, prolongs the service life of the system, the redundant design of the control module realizes precise control and seamless switching, avoids the shutdown of the equipment, and ensures the stable operation of the system.

[0046] The phase change heat dissipation layer is arranged between the micro heat dissipation fin array and the power conversion module, when the temperature of the power conversion module rises, the phase change heat dissipation layer absorbs heat by phase change, and the heat dissipation effect is enhanced.

[0047] The control module adopts multi-level redundant circuit design, when the main control unit fails, the standby control unit automatically takes over the control function, the control module uses system-level packaging technology to integrate voltage detection, current detection, overvoltage protection, overcurrent protection and PWM modulation function circuits in the same package, and adopts multi-level redundant circuit design, the main control unit monitors and adjusts the working state of the power conversion module in real time, realizes high-precision control, and once the main control unit fails, the standby control unit automatically takes over seamlessly to maintain normal operation of the system.

[0048] The input and output interface module is provided with an adaptive impedance matching circuit, which can automatically adjust the interface output impedance according to the impedance characteristics of the external connected equipment, reduce signal reflection, and improve power transmission efficiency, the multi-layer three-dimensional layout of the input and output interface module saves space, the adaptive impedance matching circuit improves the power transmission efficiency, the load prediction unit in the intelligent management module continuously monitors the load change rate, and combines historical data for statistical analysis to predict the load demand in advance, dynamically adjusts the power distribution strategy, and the dynamic power consumption optimization unit automatically adjusts the working frequency and voltage of each module according to the real-time load condition, reduces the energy consumption, the energy recovery module recovers the surge energy and standby loss energy generated inside the power supply system through a multi-stage LC resonance network, stores them in the micro super capacitor array, and then feeds them back to the output end through the intelligent charging circuit, realizing the recycling of energy.

[0049] Among them, the data storage module realizes the storage of power supply operation data, which is convenient for subsequent maintenance operations. The data storage module is responsible for recording the data analyzed by the intelligent management module and various parameters of power supply operation, providing data support for subsequent maintenance.

[0050] Among them, the redundant protection module includes multiple backup power supply channels. When the main power supply channel fails, it will automatically switch to the backup channel. The distributed monitoring and backup power supply channels of the redundant protection module ensure power supply continuity and provide solid protection for the stable operation of the equipment. The modules work closely together to achieve high-density integration, small size, and high-power stable power output.

[0051] The working principle of this invention is as follows: The power conversion module adopts a three-dimensional stacked integrated architecture, using a flip-chip process to vertically stack gallium nitride or silicon carbide power semiconductor devices. Adjacent devices are electrically connected through multi-layer metal interconnect lines, significantly reducing the module size and improving power density. At the same time, the embedded heat dissipation channels inside the module are connected to the micro-heat dissipation fin array on the surface. Combined with the nano-dielectric composite insulation layer wrapped around the outside, this achieves both efficient heat dissipation and electrical safety.

[0052] The heat dissipation module uses micro-nano processing technology to form an integrated micro-fin array that fits tightly to the power conversion module. The fin spacing is no more than 1.5 mm and the thickness does not exceed 4 mm. A micro fan integrated into the hollow area quickly removes heat. The phase change heat dissipation layer set between the two undergoes a phase change when the power conversion module temperature rises, absorbing a large amount of heat, further enhancing the heat dissipation effect and ensuring the stability of the system under high-power operation.

[0053] The control module uses system-level packaging technology to integrate functional circuits such as voltage detection, current detection, overvoltage protection, overcurrent protection, and PWM modulation into the same package. It also adopts a multi-level redundant circuit design. The main control unit monitors and adjusts the working status of the power conversion module in real time to achieve high-precision control. If the main control unit fails, the backup control unit will automatically and seamlessly take over to maintain normal system operation.

[0054] The input and output interface modules use multi-layer stereo connectors. Through interlayer insulation isolation and vertical conduction structure, the input and output lines are staggered in three-dimensional space to save space. The built-in adaptive impedance matching circuit can sense the impedance characteristics of external connected devices in real time and automatically adjust the interface output impedance to reduce signal reflection and improve power transmission efficiency.

[0055] The load prediction unit in the intelligent management module continuously monitors the load change rate and performs statistical analysis based on historical data to predict load demand in advance and dynamically adjust the power allocation strategy. The dynamic power consumption optimization unit automatically adjusts the operating frequency and voltage of each module based on real-time load conditions to reduce energy consumption. The energy recovery module recovers surge energy and standby loss energy generated within the power supply system through a multi-stage LC resonant network, stores it in a micro-supercapacitor array, and then feeds it back to the output end through an intelligent charging circuit to achieve energy recycling.

[0056] The data storage module is responsible for recording the data analyzed by the intelligent management module and various parameters of the power supply operation, providing data support for subsequent maintenance. The redundant protection module adopts a distributed fault detection architecture, sets up independent fault monitoring units in each key module, and is equipped with multiple backup power supply channels. When the main power supply channel fails, it can quickly and automatically switch to the backup channel to ensure uninterrupted power supply. The modules work closely together to achieve high-density integration, small size, and high-power stable power output.

[0057] The electrical components mentioned in this article are all connected to an external main controller and 220V mains electricity, and the main controller can be a conventional known device that performs control such as a computer.

[0058] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A small-volume, high-power power supply system based on high-density integration, characterized by: include: Power conversion module: Adopting a three-dimensional stacked integrated architecture, gallium nitride or silicon carbide power semiconductor devices are vertically stacked through a flip-chip process, and adjacent devices are electrically connected using multi-layer metal interconnect lines; Heat dissipation module: includes a micro heat dissipation fin array and a micro fan. The micro heat dissipation fin array is integrally formed using micro-nano processing technology and fits tightly onto the power conversion module. Control module: Using system-level packaging technology, the voltage detection circuit, current detection circuit, overvoltage protection circuit, overcurrent protection circuit and PWM modulation circuit and other functional circuits are integrated into the same package; Input / output interface module: adopts a multi-layer three-dimensional connector design, through interlayer insulation isolation and vertical conduction structure, the input and output lines are staggered in three-dimensional space; Intelligent management module: This includes a load prediction unit that adjusts the power allocation strategy in advance by monitoring the load change rate and analyzing historical data statistics. It also includes a dynamic power consumption optimization unit that automatically adjusts the operating frequency and voltage of each module based on real-time load conditions. Energy recovery module: includes a multi-stage LC resonant network, stores the recovered energy in a micro supercapacitor array, and feeds the stored energy back to the output end through an intelligent charging circuit; Data storage module: stores the data analyzed by the intelligent management module; Redundant protection module: adopts a distributed fault detection architecture and sets up independent fault monitoring units in each key module.

2. The high-density integrated small-volume, high-power power supply system according to claim 1, characterized in that: The output end of the control module is electrically connected to the power conversion module. The control module is used to monitor and adjust the working status of the power conversion module in real time to achieve high-precision control of the power supply system. The output end of the power conversion module is electrically connected to the input-output interface module. The output end of the input-output interface module is electrically connected to the energy recovery module for recovering surge energy and standby loss energy generated inside the power supply system. The output end of the energy recovery module is electrically connected to the input end of the power conversion module. The output end of the control module is electrically connected to the heat dissipation module. The output end of the heat dissipation module is electrically connected to the input end of the power conversion module. The output end of the power conversion module is electrically connected to the input end of the control module.

3. The high-density integrated small-volume, high-power power supply system according to claim 1, characterized in that: The control module includes a redundant protection module, an intelligent management module, a data storage module, a main control unit and a backup control unit.

4. The high-density integrated small-volume, high-power power supply system according to claim 1, characterized in that: The power conversion module is internally provided with an embedded heat dissipation channel, which is connected to the array of micro-heat dissipation fins on the surface of the module to achieve efficient heat dissipation and power conversion while reducing the module volume; the power conversion module is also provided with a nano-dielectric composite material insulation layer, which is wrapped around the outside of the power semiconductor device and the metal interconnection line.

5. The high-density integrated small-volume, high-power power supply system according to claim 1, characterized in that: The spacing between the fins in the heat dissipation module is no more than 1.5 mm, and the thickness does not exceed 4 mm. The micro fan is integrated into the hollow area of ​​the heat dissipation fin array to accelerate air flow and improve heat dissipation efficiency.

6. The high-density integrated small-volume, high-power power supply system according to claim 1, characterized in that: The heat dissipation module is provided with a phase change heat dissipation layer, which is arranged between the micro heat dissipation fin array and the power conversion module. When the temperature of the power conversion module rises, the phase change heat dissipation layer undergoes phase change to absorb heat and enhance the heat dissipation effect.

7. The high-density integrated small-volume, high-power power supply system according to claim 1, characterized in that: The control module adopts a multi-level redundant circuit design. When the main control unit fails, the backup control unit automatically and seamlessly takes over the control function.

8. The high-density integrated small-volume, high-power power supply system according to claim 1, characterized in that: The input and output interface module is provided with an adaptive impedance matching circuit, which can automatically adjust the interface output impedance according to the impedance characteristics of the external connection device, reduce signal reflection, and improve power transmission efficiency.

9. The high-density integrated small-volume, high-power power supply system according to claim 1, characterized in that: The data storage module stores power supply operation data, making subsequent maintenance operations more convenient.

10. The high-density integrated small-volume, high-power power supply system according to claim 1, characterized in that: The redundant protection module includes multiple backup power supply channels, and when a main power supply channel fails, it automatically switches to the backup channel.

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