FPC single-sided board and manufacturing method thereof

Abstract

According to the FPC single-sided board and the manufacturing method thereof, the FPC single-sided board manufactured through the steps of base material preparation, cover film preparation, film pasting and pressing and the like effectively controls the deformation behavior in the attaching process, and the structural flatness and the attaching precision of the FPC single-sided board are greatly improved. Through double optimization of material selection and purchase and a manufacturing process, the warping degree of a finished FPC single-sided board can be stably controlled within 3 mm, the automatic feeding requirement of client display module binding equipment is met, and the material throwing rate is remarkably reduced; meanwhile, the problems that in a traditional technology, the warping rate is high, and the rejection rate of finished products is large are effectively solved, and the rework rate caused by warping in a factory is reduced to 3% from original 80%. And not only are the assemblability and the mass production consistency of the FPC single-sided board product improved, but also the binding efficiency of the client and the overall production yield of a factory are greatly improved.

Description

Technical Field

[0001] The present application relates to the technical field of FPC preparation, and in particular to an FPC single-sided board and a method for manufacturing the same. Background Art

[0002] Flexible printed circuits (FPCs), with their compact size, lightweight, and bendability, have become indispensable components in modern electronic devices. In the display module sector, FPCs are widely used in consumer electronics products such as smartphones, tablets, and wearable devices, connecting components such as displays, touchscreen modules, and backlights. With the rapid development of emerging technologies such as 5G, the Internet of Things, and artificial intelligence, demand for FPCs in display modules continues to grow.

[0003] At present, traditional FPC processes usually do not carry out detailed optimization of film material preparation, lamination steps and thermal stress release in the lamination process, and lack an effective warping control mechanism. For FPC single-sided panels that need to be bonded to display screens, the warping problem is particularly prominent. When the warping exceeds 3mm, the FPC single-sided panel cannot be smoothly loaded into the client's automatic bonding equipment, resulting in a significant increase in the rejection rate, seriously affecting the production cycle and the qualified rate of finished products. At the same time, the rework rate caused by warping within the factory is also high. For some batches, the rework rate is even as high as 80%, which poses a great challenge to manufacturing yield and cost control. Therefore, there is an urgent need for a single-sided FPC panel production method with high flatness and warping control capabilities for single-sided module products to meet the high automation and low fault tolerance requirements of customer assembly processes. Summary of the Invention

[0004] This application aims to solve at least one of the technical problems existing in the prior art. It provides a single-sided FPC board and a method for manufacturing the same, which can improve the warping of the single-sided FPC board, control the warping degree within 3mm, and significantly reduce the rework rate caused by the warping of the single-sided FPC board in the factory.

[0005] The FPC manufacturing method according to the embodiment of the first aspect of the present application includes: S1. Substrate Preparation: Dry film lamination, pattern exposure, DES treatment, and punching are performed on both sides of the flexible copper-clad laminate. S2. Cover film preparation: The cover film raw material and the blue film are laminated by a laminating machine and formed into a pre-treated cover film by rolling; S3. Film lamination: S3.1 Pre-attachment: Align the cover film and the flexible copper clad laminate and perform preliminary attachment; S3.2 Cold Pressing: Apply light pressure to the FPC after false bonding to achieve initial bonding; S3.3 Film tearing: Tear off the blue film on the surface of the cover film of the FPC after false pressing; S3.4 First Lamination: Attach the matte release film and perform lamination to ensure that the cover film and the flexible copper clad laminate are firmly attached; S3.5 First curing: Curing the FPC to form a single FPC panel.

[0006] According to some embodiments of the present application, in S1, the flexible copper clad laminate includes a polyimide-based film, a first copper foil and a second copper foil, the first copper foil and the second copper foil are respectively arranged on both sides of the polyimide-based film, and a circuit pattern structure is formed on the first copper foil during the exposure process and the DES process, and the second copper foil is completely etched.

[0007] According to some embodiments of the present application, the cover film raw material includes a thickness of Adhesive layer and polyimide film layer with a thickness of 0.5 mil.

[0008] According to some embodiments of the present application, the laminating machine includes a first feeding mechanism, a second feeding mechanism, an upper roller, a lower roller and a receiving mechanism. The first feeding mechanism and the second feeding mechanism are arranged on the same plane, and the covering film raw material and the blue film are respectively arranged on the first feeding mechanism and the second feeding mechanism. The upper roller and the lower roller cooperate to stack and roll the covering film raw material and the blue film to form a pretreated covering film, and the receiving mechanism receives the pretreated covering film.

[0009] According to some embodiments of the present application, in S2, after the pre-treated covering film is formed, the pre-treated covering film is further processed by cutting, drilling, punching and transferring and laminating.

[0010] According to some embodiments of the present application, in S1, the DES processing further includes AOI processing, in which the circuit pattern structure is inspected by automatic optical inspection.

[0011] According to some embodiments of the present application, step S4 is further included. Surface treatment: sandblasting, immersion gold, and silk screen processing are performed on the FPC single-sided board after film lamination and lamination.

[0012] According to some embodiments of the present application, the steps are further included: S5. Reinforcement treatment: S5.1 Attach PI reinforcement sheet; S5.2 Remove the protective film from the PI reinforcement sheet; S5.3 Second Lamination: Laminating the PI reinforcement sheet and the FPC single-sided board; S5.4 Second curing: performing heat curing treatment on the laminated FPC single panel.

[0013] According to some embodiments of the present application, the steps are further included: S6. Finished product inspection: Appearance inspection and quality inspection are carried out by FQC and FQA.

[0014] According to the FPC single-sided board of the embodiment of the second aspect of the present application, the FPC single-sided board is manufactured by the FPC single-sided board manufacturing method described in any one of the above embodiments.

[0015] The FPC single-sided board and the manufacturing method thereof according to the embodiments of the present application have at least the following beneficial effects: The FPC single-panel manufacturing method of the present application effectively controls the deformation behavior during the bonding process of the FPC single-panel produced through the steps of substrate preparation, cover film preparation, and film lamination, and greatly improves the structural flatness and bonding accuracy of the FPC single-panel. Through the dual optimization of material selection and manufacturing process, the warping of the finished product of the FPC single-panel can be stably controlled within 3mm, meeting the automated loading requirements of the client display module binding equipment and significantly reducing the rejection rate; at the same time, the present application also effectively solves the problems of high warping rate and high scrap rate of finished products in traditional processes, reducing the rework rate caused by warping in the factory from the original 80% to 3%. Not only does it improve the assemblability and mass production consistency of FPC single-panel products, it also greatly improves the client's binding efficiency and the overall production yield of the factory. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present application is further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a front view of a single-sided FPC in the prior art; Figure 2 for Figure 1 Schematic diagram of the reverse side; Figure 3 This is a schematic diagram of the process structure of a flexible copper clad laminate in S1 according to an embodiment of the present application; Figure 4 This is a flow chart of a method for manufacturing an FPC according to an embodiment of the present application; Figure 5 This is a schematic diagram of the process structure of a flexible copper clad laminate in S1 according to an embodiment of the present application; Figure 6 This is a front view of a single-sided FPC panel according to an embodiment of the present application; Figure 7 for Figure 6 A schematic diagram from another angle; Figure 8 This is a schematic diagram of the back side of an FPC single-sided board according to an embodiment of the present application; Figure 9 for Figure 8 A schematic diagram from another angle; Figure 10 forFigure 8 Schematic diagram from another angle.

[0017] Reference numerals: Blue film 1; covering film raw material 2; pre-treated covering film 3; first feeding mechanism 11; second feeding mechanism 12; upper roller 13; lower roller 14; material receiving mechanism 15. DETAILED DESCRIPTION

[0018] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0019] In the description of this application, it should be understood that if the terms "center", "middle", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of such features. In the description of this application, unless otherwise specified, "multiple" means two or more.

[0020] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0021] In the existing technology, the traditional FPC process usually does not carry out detailed optimization of the film material preparation, lamination steps and thermal stress release in the film lamination process, and lacks an effective warping control mechanism. For single-panel FPCs that need to be bonded to the display screen, the warping problem is particularly prominent. Figure 1 and Figure 2As shown, existing single-sided FPCs exhibit particularly severe warpage. When warpage exceeds 3mm, the FPCs cannot be smoothly loaded into the client's automated bonding equipment, significantly increasing the rejection rate and severely impacting production timelines and finished product yields. Furthermore, the internal factory repair rate due to warpage remains high, reaching as high as 80% for some batches, posing significant challenges to manufacturing yield and cost control.

[0022] Refer to the following Figures 3 to 10 The FPC single-sided board and its manufacturing method in the embodiment of the present application are described.

[0023] according to Figure 3 and Figure 4 As shown, the FPC single-panel manufacturing method of the embodiment of the first aspect of the present application includes the following steps: S1. Substrate Preparation: Double-sided copper-clad flexible laminates are used as raw material. The flexible laminates are placed in a roll-to-roll (RTR) machine and dry film laminated to both sides. After dry film lamination, pattern exposure and DES (development, etching, and stripping) are performed. Punching is performed on the flexible laminates. Positioning holes are punched into the laminates to facilitate precise alignment of the flexible laminate and cover film during lamination and lamination in step S3.

[0024] S2. Cover film preparation: The cover film raw material 2 and the blue film 1 are laminated by a laminating machine and then rolled to form a pre-treated cover film 3.

[0025] S3. Film lamination: S3.1 False pasting: Align the prepared pre-treated cover film 3 with the positioning holes on the flexible copper clad laminate through a false pasting machine, and preliminarily attach the cover film to the surface of the flexible copper clad laminate to complete the alignment and temporary fixation.

[0026] S3.2 Cold pressing: The FPC substrate after false lamination is sent to the vacuum lamination equipment and cold pressed under low temperature and low pressure conditions to initially eliminate bubbles between the cover film and the surface of the FPC substrate and achieve initial bonding.

[0027] S3.3 Film tearing: tear off the blue film 1 attached to the surface of the cold-pressed FPC substrate to expose the actual cover film surface in preparation for the subsequent formal first pressing.

[0028] S3.4 First Lamination: A matte release film is attached to the exposed surface of the cover film and subjected to high-temperature lamination treatment to ensure a firm fit between the cover film and the flexible copper clad laminate and further improve the surface flatness.

[0029] S3.5 First curing: The laminated FPC substrate is thermally cured to further stabilize the bonding structure and complete the shaping to form a single FPC panel.

[0030] The FPC single-panel manufacturing method of this application not only ensures high-precision alignment and reliable bonding between the cover film and the flexible copper-clad laminate, but also effectively eliminates problems such as warping, bubbles, and film wrinkling. The resulting FPC single-panel has a stable structure and high surface flatness, effectively reducing warpage of the FPC single-panel and significantly improving the finished product yield.

[0031] according to Figure 4 As shown, in one embodiment of the present application, the flexible copper-clad laminate comprises a polyimide base film, a first copper foil, and a second copper foil, respectively disposed on the upper and lower sides of the polyimide base film. In step S1, substrate preparation, dry film is first applied to the first and second copper foil surfaces of the flexible copper-clad laminate. The dry film is a photosensitive dry film capable of forming a circuit pattern through exposure. The flexible copper-clad laminate is then fed into a roll-to-roll (RTR) exposure machine for pattern exposure. During pattern exposure, only the first copper foil surface is exposed, resulting in a patterned circuit design, while the second copper foil surface remains unpatterned. After exposure, the copper foil is selectively patterned using a DES process. On the first copper foil surface, after development, the unprotected areas are etched to form a circuit pattern, retaining the required circuit copper layer. Finally, the remaining dry film is removed, revealing the circuit pattern. On the second copper foil surface, since pattern protection is not applied, the entire copper foil is completely etched away during the etching step, leaving only the base film, forming an insulating surface.

[0032] By utilizing double-sided flexible copper-clad laminates, selective pattern exposure and etching processes preserve only the circuit structure on the first copper foil surface, simplifying the single-layer copper cladding process and lamination required for traditional single-sided FPCs. Furthermore, the complete removal of the second copper foil effectively reduces warping caused by material thickness variations, helping to improve the flatness and stability of single-sided FPC panels.

[0033] according to Figure 2 and Figure 5 As shown, in one embodiment of the present application, the cover film raw material 2 is a two-layer structure specifically including: a polyimide film layer and a glue layer. In the prior art, FPC single-sided boards often use a cover film consisting of a 15μm thick glue layer and a 0.5mil polyimide film for lamination and lamination. However, according to Figure 1 and Figure 2 As can be seen from the existing structural diagram, conventional cover films often have a large warpage problem (up to 5.0mm) after hot pressing and curing, which makes it impossible to smoothly load the product into the client's automatic binding equipment, causing serious material throwing and directly affecting the efficiency of automated assembly. At the same time, the proportion of product rework due to warpage tolerance remains high, with the rework rate of some batches reaching 30% or even higher, increasing manufacturing costs and reducing the overall yield. To solve the above problems, this application proposesFigures 6 to 10 As shown in the figure, an optimized coverlay structure is proposed, using a 25μm-thick adhesive layer and a 0.5-mil-thick polyimide film layer. This significantly enhances structural stability and warpage suppression after lamination while maintaining coverlay flexibility. Actual production data shows that when the adhesive layer thickness is optimized to 25μm, the warpage of finished FPC single-panel panels is stably controlled between 0.7 and 2.6mm, and the warpage defect rate is reduced to 0%. In multiple batches, there has been no return for repair or customer rejection.

[0034] To fully evaluate the superiority of the glue layer thickness optimization solution of this application, Table 1 compares the warpage performance of FPC single-panel panels with different glue layer thicknesses (the polyimide film thickness is 0.5 mil): Table 1:

[0035] As shown in Table 1, when the adhesive layer thickness is too small (e.g., 15μm), it lacks sufficient buffering and stress absorption capacity, which can easily lead to uneven tensile strain in the film after hot pressing, causing significant warping. When the adhesive layer is too thick (e.g., above 30μm), internal stress accumulation in the material exacerbates structural instability. Based on extensive testing, this application has established 25μm as the optimal thickness, ensuring optimal stress release and structural balance during the lamination process. This results in optimal coordination in structural design, material selection, and actual finished product warpage control.

[0036] Therefore, by adopting the optimized covering film structure in this application and optimizing the manufacturing method and process, the warping risk of the FPC single panel is significantly reduced, the flatness and structural stability of the finished product are improved, and the smooth loading of the FPC single panel in the client device is ensured, material throwing is avoided, and the efficiency of automated binding is improved, while the rework and scrapping costs within the factory are greatly reduced.

[0037] according to Figure 5 As shown, in one embodiment of the present application, the laminating machine includes a first feeding mechanism 11, a second feeding mechanism 12, an upper roller 13, a lower roller 14 and a receiving mechanism. The first feeding mechanism 11 and the second feeding mechanism 12 are arranged at the front end of the laminating machine and are located on the same horizontal plane. The covering film raw material 2 is arranged on the first feeding mechanism 11, and the first feeding mechanism 11 is used to convey the covering film raw material 2; the blue film 1 is arranged on the second feeding mechanism 12, and the second feeding mechanism 12 is used to convey the blue film 1. The upper roller 13 and the lower roller 14 are arranged adjacent to each other, and the covering film raw material 2 and the blue film 1 are stacked and rolled under the joint pressing of the upper roller 13 and the lower roller 14 to form a pre-treated covering film 3. The pre-treated covering film 3 is conveyed to the receiving mechanism 15, and the receiving mechanism receives the pre-treated covering film 3.

[0038] The laminating machine automatically laminates the cover film raw material 2 with the blue film 1. Synchronous feeding by the feed mechanism, stable lamination by rollers, and unified rewinding by the take-up mechanism ensure uniform lamination of the pre-treated cover film 3, free of bubbles and misalignment. This lays the foundation for subsequent false lamination, cold pressing, and high-temperature lamination, effectively improving the overall yield rate of single-sided FPC production.

[0039] In some embodiments, the blue film 1 is specifically made of high-temperature resistant polyethylene terephthalate (PET) material.

[0040] according to Figure 3 As shown, in one embodiment of the present application, in step S2, in the preparation of the covering film, after the preliminary rolling is completed to form the pre-treated covering film 3, the pre-treated covering film 3 is also subjected to cutting, drilling, punching and transfer lamination. The pre-treated covering film 3 output by the laminating machine is cut according to the specifications of the FPC substrate, and the continuous pre-treated covering film 3 is cut into a single film sheet of a fixed size. The pre-treated covering film 3 after cutting is drilled to punch positioning holes. The covering film after drilling is punched to trim the edges according to the required lamination area. The above-mentioned formed covering film is transferred to the platform to be laminated and preliminarily positioned. The cutting, drilling, punching and transfer lamination processes prepare for the subsequent step S3 lamination lamination, which can improve the accuracy of subsequent false lamination, reduce lamination bubbles, and lay a key foundation for the final lamination quality and the flatness of the finished FPC single panel.

[0041] according to Figure 3 As shown, in one embodiment of the present application, in the step S1 substrate preparation, the DES treatment also includes AOI treatment, which checks the circuit pattern structure through automatic optical inspection, timely detects and screens out defective circuit patterns, effectively improves the yield, and provides important guarantees for the overall quality control of the FPC single panel.

[0042] according to Figure 3 As shown, in one embodiment of the present application, the FPC single-panel manufacturing method further includes step S4. Surface treatment: sandblasting, immersion gold, and silk screen processing are performed on the FPC single-panel after film lamination. The FPC single-panel after the first lamination is completed is placed in a sandblasting device, and the surface of the FPC single-panel is evenly sandblasted to remove surface impurities, providing a basis for subsequent immersion gold. The sandblasted FPC single-panel is subjected to immersion gold processing. The FPC single-panel after immersion gold is subjected to silk screen processing.

[0043] according to Figure 3 As shown, in one embodiment of the present application, the FPC single-panel manufacturing method further includes the steps of: S5. Reinforcement treatment: S5.1 Attaching PI reinforcement sheet: Align the PI reinforcement sheet pre-cut according to specifications with the reinforcement area of ​​the FPC single panel, and use the attachment machine to attach the PI reinforcement sheet to the surface of the FPC single panel.

[0044] S5.2 After the attachment is completed, remove the protective film of the PI reinforcement sheet.

[0045] S5.3 Second lamination: A layer of matte release film is attached to the surface of the FPC single-sided board with the PI reinforcement sheet, and high-temperature lamination is performed.

[0046] S5.4 Second curing: After the second lamination, the FPC single panel is subjected to a thermal curing treatment.

[0047] Through the reinforcement treatment in step S5, the present application can enhance the support strength and structural rigidity of the FPC single-sided board.

[0048] according to Figure 3 As shown, in one embodiment of the present application, the FPC single-panel manufacturing method further includes the steps of: S6. Finished product inspection: Appearance inspection and quality inspection are carried out by FQC and FQA.

[0049] After the inspection is completed, the FPC single panel will be packaged and put into storage.

[0050] Passing the final FQC and FQA inspections can significantly improve the shipment qualification rate of FPC single-panel panels.

[0051] In some embodiments, testing and punching are performed between step S5 of the reinforcement process and step S6 of the finished product inspection. The reinforced FPC single-sided board is tested for conductivity, short circuit, impedance, and other characteristics to ensure acceptable circuit performance. After testing, the FPC single-sided board is cut into individual finished FPC single-sided boards according to a predetermined pattern.

[0052] The following are the specific steps of the FPC single-panel production method for this application: S1: Substrate preparation: S1.1 Dry film attachment; S1.2 Graphic exposure processing; S1.3 DES processing (development, etching, stripping); S1.4 AOI processing; S1.5 Punching process.

[0053] S2: Cover film preparation: S2.1 Selection of covering film raw material 2; S2.2 Covering film raw material 2 and blue film 1 are stacked and pressed together; S2.3 cutting; S2.4 drilling; S2.5 punching; S2.6 Transfer and fit.

[0054] S3: Film lamination: S3.1 Fake stickers; S3.2 Cold pressing; S3.3 tearing off the film; S3.4 first pressing; S3.5 First curing.

[0055] S4: Surface treatment: S4.1 Sandblasting; S4.2 immersion gold; S4.3 silk screen.

[0056] S5: Reinforcement treatment: S5.1 Attach PI reinforcement sheet; S5.2 Remove the PI reinforced protective film; S5.3 second pressing; S5.4 Second curing.

[0057] S6 test.

[0058] S7 punching.

[0059] S8: Finished product inspection: S8.1 FQC inspection; S8.2 FQA inspection.

[0060] S9: Packing and storage.

[0061] according to Figures 3 to 5 As shown, the FPC single-sided board of the embodiment of the second aspect of the present application is manufactured by the FPC single-sided board manufacturing method of any of the above embodiments.

[0062] The FPC single panel and its manufacturing method of the present application are particularly suitable for the bonding and binding process of single-sided display module products. By carrying out system optimization in aspects such as material selection, film material pretreatment, film lamination and process path control, the problem that traditional single panels are prone to warping and cannot be automatically bonded after high-temperature lamination is effectively solved. The present application controls the warping degree of the finished FPC single panel to within 3mm, so that the FPC single panel can pass through the automatic machine loading operation smoothly, greatly reducing the client's rejection rate. At the same time, the present application significantly improves the internal yield rate of the factory, reduces the warping repair rate from 80% to 3%, effectively improves production efficiency and terminal assembly yield, and has good practicality and promotion value.

[0063] In the description of the application, the description of the terms "one embodiment", "some examples", "some embodiments", "illustrative embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the application. In the description of the application, the illustrative description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0064] The embodiments of the application described above in connection with the accompanying drawings are merely illustrative, and the application is not limited to the above-described embodiments, but various changes can be made within the knowledge of those skilled in the art without departing from the spirit of the application.

Claims

1. A method for manufacturing a single-sided FPC, characterized in that: The following steps are involved: S1. Substrate Preparation: Dry film lamination, pattern exposure, DES treatment, and punching are performed on both sides of the flexible copper-clad laminate. S2. Cover film preparation: The cover film raw material and the blue film are laminated by a laminating machine and formed into a pre-treated cover film by rolling; S3. Film lamination: S3.1 Pre-attachment: Align the cover film and the flexible copper clad laminate and perform preliminary attachment; S3.2 Cold Pressing: Apply light pressure to the FPC after false bonding to achieve initial bonding; S3.3 Film tearing: Tear off the blue film on the surface of the cover film of the FPC after false pressing; S3.4 First Lamination: Attach the matte release film and perform lamination to ensure that the cover film and the flexible copper clad laminate are firmly attached; S3.5 First curing: Curing the FPC to form a single FPC panel.

2. The method for manufacturing a single-sided FPC according to claim 1, wherein: In S1, the flexible copper clad laminate includes a polyimide base film, a first copper foil and a second copper foil, the first copper foil and the second copper foil are respectively arranged on both sides of the polyimide base film, a circuit pattern structure is formed on the first copper foil during the exposure process and the DES process, and the second copper foil is completely etched.

3. The method for manufacturing a single-sided FPC according to claim 1, wherein: The covering film raw material includes a thickness of Adhesive layer and polyimide film layer with a thickness of 0.5 mil.

4. The method for manufacturing a single-sided FPC according to claim 1, wherein: The laminating machine includes a first feeding mechanism, a second feeding mechanism, an upper roller, a lower roller and a receiving mechanism. The first feeding mechanism and the second feeding mechanism are arranged on the same plane. The covering film raw material and the blue film are arranged on the first feeding mechanism and the second feeding mechanism respectively. The upper roller and the lower roller cooperate to stack and roll the covering film raw material and the blue film to form a pretreated covering film. The receiving mechanism receives the pretreated covering film.

5. The method for manufacturing a single-sided FPC according to claim 1, wherein: In said S2, after the pre-treated covering film is formed, the pre-treated covering film is further processed by cutting, drilling, punching and transferring and laminating.

6. The method for manufacturing a single-sided FPC according to claim 2, wherein: In S1, the DES process further includes AOI processing to inspect the circuit pattern structure through automatic optical inspection.

7. The method for manufacturing a single-sided FPC according to claim 1, wherein: The method further includes step S4. Surface treatment: performing sandblasting, immersion gold and silk screen processing on the FPC single-sided board after film lamination and lamination.

8. The method for manufacturing a single-sided FPC according to claim 7, wherein: Also includes the steps: S5. Reinforcement treatment: S5.1 Attach PI reinforcement sheet; S5.2 Remove the protective film from the PI reinforcement sheet; S5.3 Second Lamination: Laminating the PI reinforcement sheet and the FPC single-sided board; S5.4 Second curing: performing heat curing treatment on the laminated FPC single panel.

9. The method for manufacturing a single-sided FPC according to claim 8, wherein: Also includes the steps: S6. Finished product inspection: Appearance inspection and quality inspection are carried out by FQC and FQA.

10. An FPC single-sided board, characterized by: The FPC single-sided board is manufactured by the FPC single-sided board manufacturing method according to any one of claims 1 to 9.

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