A disassembling device for waste circuit boards and a disassembling method thereof

Abstract

This invention relates to the field of waste circuit board dismantling, and particularly to a dismantling device and method for waste circuit boards. The dismantling device includes a lower tray, the lower end of which is slidably connected to a horizontal sliding plate in a vertical direction. The horizontal sliding plate is slidably connected to a horizontal slide rail. An upper pressure plate is provided at the upper end of the lower tray. A solder melting chamber is opened in the middle of the lower tray. A vent pipe is fixedly connected to the upper end of the upper pressure plate. The vent pipe is an inverted U-shaped pipe. A disc-shaped separation chamber is fixedly installed at the other end of the vent pipe. A through groove is opened on the outer side of the upper pressure plate. Multiple cooling pipes are provided at the lower end of the separation chamber. A cooling mechanism is provided in the cooling pipes. This invention can solve the problems of slow circuit board dismantling and the harm of metal vapor to personnel in the prior art.

Description

Technical Field

[0001] This invention relates to the field of waste circuit board dismantling, and particularly to a dismantling device and method for waste circuit boards. Background Technology

[0002] A circuit board, also known as a printed circuit board, is a core component of electronic devices. It mainly consists of a substrate on which electronic components such as resistors, capacitors, and chips are mounted. By printing copper foil lines inside the board, the circuit board connects the pins of the components to form a current path, enabling signal transmission and functional collaboration.

[0003] Some components on circuit boards contain precious metals such as gold, silver, and palladium. These precious metals have very high recycling value and can be used to manufacture new electronic products or in other manufacturing industries. Meanwhile, the motherboard of the circuit board contains resin and metals such as copper. Copper, as an important industrial raw material, has wide applications in electronics, construction, and transportation. Resin, on the other hand, can be used as a raw material for recycled plastics to manufacture new plastic products.

[0004] Soldering is widely used in the manufacturing of circuit boards. Therefore, the solder must first be melted before disassembling the circuit board. Existing technologies include two methods: one is to place the circuit board directly in a heating furnace and heat it until the solder melts, then remove the electronic components by vibration; the other is to place the soldered ends of the circuit board directly on the molten solder to melt it. Of these methods, heating in a heating furnace is relatively slow and complex, while directly separating the components from the molten solder generates a large amount of metal vapor, posing a significant health hazard to operators. Summary of the Invention

[0005] This invention provides a dismantling device for waste circuit boards, which can solve the problems of slow dismantling of circuit boards and the harm to personnel caused by metal vapor in the prior art.

[0006] A dismantling device for waste circuit boards, comprising:

[0007] The lower tray has its lower end slidably connected to the horizontal slide plate in the vertical direction, and the horizontal slide plate is slidably connected to the horizontal slide rail.

[0008] An upper pressure plate is disposed at the upper end of the lower tray and corresponds to the lower tray;

[0009] A vent pipe is provided. A molten solder cavity is provided in the middle of the lower tray. A vent pipe is fixedly connected to the upper end of the upper pressure plate. The vent pipe is an inverted U-shaped pipe. A disc-shaped separation cavity is fixedly installed at the other end of the vent pipe. A through groove is provided on the upper pressure plate at the position on the outside of the lower tray.

[0010] The cooling pipes are fixedly connected to the separation chamber and are evenly distributed along the circumference of the separation chamber. A cooling mechanism is provided in each cooling pipe.

[0011] Preferably, a centrifugal fan is rotatably connected to the separation chamber at the corresponding vent outlet, and multiple grease filter plates are fixedly installed in the middle of the centrifugal fan from top to bottom, with the throughput of the grease filter plates decreasing sequentially from top to bottom.

[0012] Preferably, a filter scraper is rotatably connected to the middle of the cooling pipe. The side wall of the filter scraper is provided with a filter scraping groove along its axial direction. Multiple filter scraping grooves are evenly distributed along the circumference of the filter scraper. The side of the filter scraping groove is inclined. A first swing gear is fixedly installed at the upper end of the filter scraper. A second swing gear is rotatably connected to the lower bottom plate of the separation chamber. The second swing gear meshes with the first swing gear. A torsion spring is installed at the rotatable connection between the second swing gear and the lower bottom plate of the separation chamber. A swing fan plate is fixedly installed at the upper end of the second swing gear.

[0013] Preferably, a plurality of wind baffles are arranged sequentially from top to bottom on the filter scraper cylinder. The wind baffles are rotatably connected to the side of the filter scraper cylinder. A torsion gear is fixedly connected to the side of the filter scraper cylinder through the wind baffles. A fixed gear is fixedly arranged on the cooling pipe corresponding to the torsion gear. The torsion gear meshes with the fixed gear.

[0014] Preferably, the surface of the wind baffle plate is provided with stepped wind baffle grooves.

[0015] Preferably, the cooling mechanism includes a cooling ring pipe, a cooling straight pipe, and cooling branch pipes. The cooling ring pipe is fixedly installed at the upper and lower ends of the cooling pipe. The cooling ring pipe is coaxial with the cooling pipe. Two cooling ring pipes are connected by a cooling straight pipe. Multiple cooling straight pipes are evenly distributed along the circumference of the cooling pipe. Multiple cooling branch pipes are evenly distributed along the axial direction of the cooling pipe. The cooling straight pipes are connected by multiple cooling branch pipes.

[0016] Preferably, a collection box is provided at the lower end of the cooling pipe, the collection box is connected to the cooling pipe, the collection box is divided into two layers, the upper layer is a ventilation chamber and the lower layer is a collection chamber, and a number of slots are provided between the ventilation chamber and the collection chamber.

[0017] Preferably, a partition plate is slidably connected in the vertical direction in the molten solder cavity, and a spring is fixedly connected between the partition plate and the bottom surface of the molten solder cavity. A plurality of leakage rods are provided in the middle of the partition plate, and the leakage rods are fixedly connected to the bottom surface of the molten solder cavity. A bonding plate is provided in the upper pressure plate corresponding to the partition plate, and the bonding plate is slidably bonded to the inner side of the molten solder cavity.

[0018] Preferably, an electromagnet is provided at the lower end of the upper pressure plate at a position located in the middle of the bonding plate.

[0019] The present invention also provides a method for dismantling waste circuit boards applicable to the above-mentioned dismantling equipment for waste circuit boards, comprising the following steps;

[0020] S1: Add tin to the molten tin chamber and melt it into a liquid. Place the circuit board to be disassembled into the molten tin chamber and then place it on the upper end of the lower tray through the upper pressure plate.

[0021] S2: The volatile tin metal vapor enters the upper pressure plate through the through groove on the lower pressure plate, then enters the vent pipe, and then enters the cooling pipe from the vent pipe;

[0022] S3: Cooling tin metal to a low temperature in the cooling pipe will trigger the transformation from white tin to gray tin. At this time, the tin becomes very brittle and turns into powder, which is then discharged from the cooling pipe.

[0023] Beneficial effects:

[0024] 1. This invention involves allowing volatile tin metal vapor to enter the upper pressure plate through a slot on the lower pressure plate, then into a vent pipe, and finally into a cooling pipe. In the cooling pipe, the tin vapor is rapidly cooled. As the tin solidifies and condenses, it easily adheres to the cooling pipe. Cooling it to a low temperature in the cooling pipe triggers the transformation from white tin to gray tin. At this point, the tin becomes very brittle and turns into powder, which is then discharged from the cooling pipe. This process of cleaning tin vapor also achieves a self-cleaning function.

[0025] 2. This invention causes airflow to impact the oscillating fan plate, which in turn drives the rotation of the second oscillating gear, which in turn drives the rotation of the first oscillating gear. During the rotation of the oscillating fan plate driven by the wind, the torsion spring is compressed, and the airflow is unstable. Thus, under the combined action of the wind and the torsion spring, the oscillating fan plate will oscillate back and forth, which will drive the first oscillating gear, the second oscillating gear, and the filter scraper to oscillate. During the oscillation, the filter scraper grooves on the filter scraper will rub back and forth against the side of the cooling pipe, thereby further preventing the metal particles condensed by tin metal vapor from condensing on the side of the cooling pipe.

[0026] 3. In this invention, during the upward movement of the lower tray to the upper pressure plate, the bonding plate comes into contact with the partition plate, and the partition plate moves downward, thereby separating the drain rod from the partition plate. The molten solder then flows out from the slot where the drain rod is placed. When the lower tray moves away from the upper pressure plate, the partition plate moves upward, and the molten solder flows back into the lower end of the partition plate. The above technical solution can effectively reduce the evaporation of molten solder vapor when placing the circuit board. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0028] Figure 2 This is a schematic diagram of the assembly of the lower tray and the upper pressure plate in this invention;

[0029] Figure 3 This is a schematic diagram of the internal structure of the separation cavity in this invention;

[0030] Figure 4 for Figure 3 A partial structural diagram at point A in the middle;

[0031] Figure 5 This is a schematic diagram of the cooling mechanism in this invention;

[0032] Figure 6 This is a schematic diagram of the installation of the cooling pipe and the filter scraper in this invention;

[0033] Figure 7 for Figure 6 A schematic diagram of the partial structure at point B in the middle;

[0034] Figure 8 This is a schematic diagram of the windbreak plate in this invention;

[0035] Figure 9 This is a schematic diagram showing the installation of the torsion gear and the stationary gear.

[0036] Explanation of reference numerals in the attached figures:

[0037] 1. Lower tray; 11. Melting solder chamber; 12. Horizontal slide plate; 13. Horizontal slide rail; 14. Divider plate; 15. Drain rod; 2. Upper pressure plate; 3. Vent pipe; 4. Separation chamber; 41. Centrifugal fan; 411. Grease filter plate; 5. Cooling pipe; 51. Cooling mechanism; 511. Cooling ring pipe; 512. Cooling straight pipe; 513. Cooling branch pipe; 52. Filter scraper; 521. Filter scraper groove; 522. First swing gear; 523. Second swing gear; 524. Swing fan plate; 525. Baffle plate; 5251. Baffle groove; 526. Torsional gear; 527. Fixed gear; 6. Collection box; 61. Vent chamber; 62. Collection chamber. Detailed Implementation

[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] To solve the technical problems proposed in this invention.

[0040] like Figures 1 to 9 As shown, a robotic arm for dismantling waste circuit boards includes:

[0041] The lower tray 1, the lower end of which is slidably connected in the vertical direction to the horizontal slide plate 12, and the horizontal slide plate 12 is slidably connected in the horizontal slide rail 13;

[0042] Upper pressure plate 2, which is disposed at the upper end of the lower tray 1 and corresponds to the lower tray 1;

[0043] Vent pipe 3, the lower tray 1 has a molten solder cavity 11 in the middle, the upper end of the upper pressure plate 2 is fixedly connected to a vent pipe 3, the vent pipe 3 is an inverted U-shaped pipe, the other end of the vent pipe 3 is fixedly installed with a disc-shaped separation cavity 4, and the upper pressure plate 2 has a through groove on the outer side of the lower tray 1.

[0044] Cooling pipe 5, which is fixedly connected to the separation chamber 4 and is evenly distributed along the circumference of the separation chamber 4, and a cooling mechanism 51 is provided in the cooling pipe 5.

[0045] It should be noted that during the disassembly of the circuit board, a heating device is centrally installed in the lower tray 1. Tin is added to the molten tin chamber 11 and melted into liquid. The circuit board to be disassembled is placed in the molten tin chamber 11, and then placed on the upper end of the lower tray 1 via the upper pressure plate 2. In this way, during the melting of the molten tin on the circuit board, the evaporation of metal vapor can be prevented. At the same time, during the placement and removal of the circuit board, the evaporated tin metal vapor enters the upper pressure plate 2 through the through groove on the lower pressure plate, and then enters the vent pipe 3, and from the vent pipe 3 into the cooling pipe 5. In the cooling pipe 5, the tin vapor is cooled extremely quickly. During the process of tin solidifying, it is easy to adhere to the cooling pipe 5. Cooling it to a low temperature in the cooling pipe 5 will cause the transformation from white tin to gray tin. At this time, the tin becomes very brittle and turns into powder, which is then discharged from the cooling pipe 5. In this way, the cleaning process of tin vapor can also achieve a self-cleaning function.

[0046] like Figure 1 , Figure 2 and Figure 3 As shown, a centrifugal fan 41 is rotatably connected to the separation chamber 4 at the position corresponding to the outlet of the vent pipe 3. Multiple grease filter plates 411 are fixedly installed in the middle of the centrifugal fan 41 from top to bottom, and the throughput of the grease filter plates 411 decreases from top to bottom.

[0047] It should be noted that during the process of melting solder on the electronic components on the circuit board, resin volatilization is also caused. The rotation of the centrifugal fan 41 can accelerate the air flow speed in the ventilation pipe 3, thereby generating a stronger suction at the lower end of the upper pressure plate 2, thus better absorbing the metal vapor. When the gas containing metal vapor impacts the filter plate 411, the filter plate 411 will absorb the resin. At the same time, air and metal vapor will enter the separation chamber 4 from the side of the centrifugal fan 41, thus accelerating the treatment of waste gas and absorbing the generated resin. Multiple filter plates 411 with different throughput rates can perform multi-layer treatment of the resin, thereby obtaining a better treatment effect.

[0048] like Figures 3 to 7 As shown, a filter scraper cylinder 52 is rotatably connected to the middle of the cooling pipe 5. A filter scraper groove 521 is formed on the side wall of the filter scraper cylinder 52 along its axial direction. Multiple filter scraper grooves 521 are evenly distributed along the circumference of the filter scraper cylinder 52. The side of the filter scraper groove 521 is inclined. A first swing gear 522 is fixedly installed at the upper end of the filter scraper cylinder 52. A second swing gear 523 is rotatably connected to the lower bottom plate of the separation chamber 4. The second swing gear 523 meshes with the first swing gear 522. A torsion spring is installed at the rotatable connection between the second swing gear 523 and the lower bottom plate of the separation chamber 4. A swing fan plate 524 is fixedly installed at the upper end of the second swing gear 523.

[0049] When the airflow enters the cooling pipe 5 from the separation chamber 4, the airflow impacts the oscillating fan plate 524. The oscillating fan plate 524 drives the rotation of the second oscillating gear 523, which in turn drives the rotation of the first oscillating gear 522. During the rotation of the oscillating fan plate 524 driven by the wind, the torsion spring is compressed, and the airflow is unstable. Thus, under the combined action of the wind and the torsion spring, the oscillating fan plate 524 will oscillate back and forth, and it will drive the first oscillating gear 522, the second oscillating gear 523, and the filter scraper 52 to oscillate. During the oscillation, the filter scraper groove 521 on the filter scraper 52 will rub back and forth with the side of the cooling pipe 5, thereby further preventing the metal particles condensed by tin metal vapor from condensing on the side of the cooling pipe 5.

[0050] like Figures 6 to 9As shown, multiple baffles 525 are arranged sequentially from top to bottom on the filter scraper cylinder 52. The baffles 525 are rotatably connected to the side of the filter scraper cylinder 52. A torsion gear 526 is fixedly connected to the baffles 525 through the side of the filter scraper cylinder 52. A fixed gear 527 is fixedly arranged on the cooling pipe 5 corresponding to the torsion gear 526. The torsion gear 526 meshes with the fixed gear 527.

[0051] By setting multiple baffles 525, airflow can be effectively impeded, allowing metal vapor to remain in the cooling pipe 5 for a longer time, preventing tin metal from being in a gaseous state, which would be detrimental to tin metal collection. At the same time, under the guidance of the baffles 525, the gas will rush towards the side wall of the cooling pipe 5, thereby increasing the cooling speed. Meanwhile, during the rotation of the filter scraper 52, the torsion gear 526 will mesh with the fixed gear 527, which will drive the baffles 525 to rotate. When the baffles 525 rotate, the angle at which the airflow impacts the baffles 525 will be changed, thereby preventing tin metal from accumulating on the baffles 525.

[0052] The surface of the wind baffle 525 is provided with stepped wind baffle grooves 5251.

[0053] It should be noted that the above-mentioned technical means can further impede the flow rate of gas in the cooling pipe 5.

[0054] like Figure 5 As shown, the cooling mechanism 51 includes a cooling ring pipe 511, a cooling straight pipe 512, and cooling branch pipes 513. The cooling ring pipe 511 is fixedly installed at the upper and lower ends of the cooling pipe 5. The cooling ring pipe 511 is coaxial with the cooling pipe 5. Two cooling ring pipes 511 are connected by a cooling straight pipe 512. Multiple cooling straight pipes 512 are evenly distributed along the circumference of the cooling pipe 5. Multiple cooling branch pipes 513 are evenly distributed along the axial direction of the cooling pipe 5. The cooling straight pipes 512 are connected by multiple cooling branch pipes 513.

[0055] It should be noted that when cooling metal vapor through cooling pipe 5, by injecting low-temperature liquid from the lower cooling ring pipe 511, the cooling ring pipe 511 will gradually diffuse into the cooling straight pipe 512 and the cooling branch pipe 513, and finally flow out from the upper cooling ring pipe 511, so that cooling pipe 5 will be cooled in all directions.

[0056] like Figure 1 , Figure 2 and Figure 3As shown, a collection box 6 is provided at the lower end of the cooling pipe 5. The collection box 6 is connected to the cooling pipe 5. The collection box 6 is divided into two layers. The upper layer is the ventilation chamber 61, and the lower layer is the collection chamber 62. Several slots are provided between the ventilation chamber 61 and the collection chamber 62.

[0057] It should be noted that when tin metal vapor flows out of cooling pipe 5, it has already been converted into solid. At this time, the tin metal will enter the collection chamber 62 from the slot under the impact of the airflow, thus facilitating the collection of tin metal.

[0058] like Figure 1 and Figure 2 As shown, a partition plate 14 is slidably connected in the vertical direction in the molten solder cavity 11. A spring is fixedly connected between the partition plate 14 and the bottom surface of the molten solder cavity 11. A plurality of leakage rods 15 are provided in the middle of the partition plate 14. The leakage rods 15 are fixedly connected to the bottom surface of the molten solder cavity 11. A bonding plate is provided in the upper pressure plate 2 corresponding to the partition plate 14. The bonding plate is slidably bonded to the inner side of the molten solder cavity 11.

[0059] It should be noted that during the process of the lower tray 1 moving upward to the pressure plate, the bonding plate will come into contact with the partition plate 14. The partition plate 14 moves downward, thereby separating the drain rod 15 from the partition plate 14. The molten solder will then flow out from the slot where the drain rod 15 is placed. When the lower tray 1 moves away from the upper pressure plate, the partition plate 14 will move upward, and the molten solder will flow back into the lower end of the partition plate 14. The above technical solution can effectively reduce the evaporation of molten solder vapor when placing the circuit board.

[0060] An electromagnet is installed at the lower end of the upper pressure plate 2, located in the middle of the bonding plate.

[0061] After the solder on the circuit board is melted, the circuit board can be directly separated from the lower tray 1 by the attraction generated by the electromagnet. When the lower tray 1 is removed, the circuit board can be taken off directly.

[0062] The present invention also provides a method for dismantling waste circuit boards applicable to the above-mentioned dismantling equipment for waste circuit boards, comprising the following steps;

[0063] S1: Add tin to the molten tin chamber 11 and melt it into liquid. Place the circuit board to be disassembled into the molten tin chamber 11 and then place it on the upper end of the lower tray 1 through the upper pressure plate 2.

[0064] S2: The volatile tin metal vapor enters the upper pressure plate 2 through the through groove on the lower pressure plate, then enters the vent pipe 3, and then enters the cooling pipe 5 through the vent pipe 3;

[0065] S3: Cooling tin metal to a low temperature in cooling pipe 5 will trigger the transformation from white tin to gray tin. At this time, tin becomes very brittle and turns into powder, which is then discharged from cooling pipe 5.

[0066] In the description of this invention, it should be understood that the terms "upper," "lower," "left," and "right," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation or specific orientational structure and operation. Therefore, they should not be construed as limitations on the invention. Furthermore, "first" and "second" are only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "multiple" means two or more.

[0067] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0068] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. A dismantling device for waste circuit boards, characterized in that, include: The lower tray (1) is slidably connected in the vertical direction to the horizontal slide plate (12), and the horizontal slide plate (12) is slidably connected in the horizontal slide rail (13); Upper pressure plate (2), the upper pressure plate (2) is disposed at the upper end of the lower tray (1) and corresponds to the lower tray (1); Vent pipe (3), the middle of the lower tray (1) is provided with a molten solder cavity (11), the upper end of the upper pressure plate (2) is fixedly connected to a vent pipe (3), the vent pipe (3) is an inverted U-shaped pipe, the other end of the vent pipe (3) is fixedly installed with a disc-shaped separation cavity (4), and the upper pressure plate (2) is provided with a through groove on the outer side of the lower tray (1); Cooling pipe (5), the cooling pipe (5) is fixedly connected to the separation chamber (4) and a plurality of them are evenly distributed along the circumference of the separation chamber (4), and a cooling mechanism (51) is provided in the cooling pipe (5); The separation chamber (4) is rotatably connected to a centrifugal fan (41) at the outlet of the corresponding air pipe (3). Multiple grease filter plates (411) are fixedly installed in the middle of the centrifugal fan (41) from top to bottom, and the throughput of the grease filter plates (411) decreases from top to bottom. A filter scraper (52) is rotatably connected to the middle of the cooling pipe (5). A filter scraper groove (521) is opened on the side wall of the filter scraper (52) along its axial direction. Multiple filter scraper grooves (521) are evenly distributed along the circumference of the filter scraper (52). The side of the filter scraper groove (521) is inclined. A first swing gear (522) is fixedly installed at the upper end of the filter scraper (52). A second swing gear (523) is rotatably connected to the lower bottom plate of the separation chamber (4). The second swing gear (523) meshes with the first swing gear (522). A torsion spring is installed at the rotatable connection between the second swing gear (523) and the lower bottom plate of the separation chamber (4). A swing fan plate (524) is fixedly installed at the upper end of the second swing gear (523). Multiple baffles (525) are arranged sequentially from top to bottom on the filter scraper cylinder (52). The baffles (525) are rotatably connected to the side of the filter scraper cylinder (52). A torsion gear (526) is fixedly connected to the side of the filter scraper cylinder (52) through the baffles (525). A fixed gear (527) is fixedly arranged on the cooling pipe (5) corresponding to the torsion gear (526). The torsion gear (526) meshes with the fixed gear (527).

2. The dismantling equipment for waste circuit boards according to claim 1, characterized in that, The surface of the wind baffle (525) is provided with stepped wind baffle grooves (5251).

3. The dismantling equipment for waste circuit boards according to claim 1, characterized in that, The cooling mechanism (51) includes a cooling ring pipe (511), a cooling straight pipe (512), and cooling branch pipes (513). The cooling ring pipe (511) is fixedly installed at the upper and lower ends of the cooling pipe (5). The cooling ring pipe (511) is coaxial with the cooling pipe (5). Two cooling ring pipes (511) are connected by a cooling straight pipe (512). Multiple cooling straight pipes (512) are evenly distributed along the circumference of the cooling pipe (5). Multiple cooling branch pipes (513) are evenly distributed along the axial direction of the cooling pipe (5). The cooling straight pipes (512) are connected by multiple cooling branch pipes (513).

4. The dismantling equipment for waste circuit boards according to claim 1, characterized in that, A collection box (6) is provided at the lower end of the cooling pipe (5). The collection box (6) is connected to the cooling pipe (5). The collection box (6) is divided into two layers. The upper layer is the ventilation chamber (61), and the lower layer is the collection chamber (62). Several slots are provided between the ventilation chamber (61) and the collection chamber (62).

5. The dismantling equipment for waste circuit boards according to claim 1, characterized in that, A partition plate (14) is slidably connected in the vertical direction in the molten solder cavity (11). A spring is fixedly connected between the partition plate (14) and the bottom surface of the molten solder cavity (11). A plurality of leakage rods (15) are provided in the middle of the partition plate (14). The leakage rods (15) are fixedly connected to the bottom surface of the molten solder cavity (11). A bonding plate is provided in the upper pressure plate (2) corresponding to the partition plate (14). The bonding plate is slidably bonded to the inner side of the molten solder cavity (11).

6. The dismantling equipment for waste circuit boards according to claim 5, characterized in that, An electromagnet is provided at the lower end of the upper pressure plate (2) at the position in the middle of the bonding plate.

7. A method for dismantling waste circuit boards, characterized in that, The dismantling method is based on a dismantling device for waste circuit boards as described in any one of claims 1-6, and includes the following steps; S1: Add tin to the molten tin chamber (11) and melt it into liquid. Place the circuit board to be disassembled into the molten tin chamber (11) and then place it on the upper end of the lower tray (1) through the upper pressure plate (2). S2: The volatile tin metal vapor enters the upper pressure plate (2) through the through groove on the lower pressure plate, then enters the vent pipe (3), and enters the cooling pipe (5) through the vent pipe (3); S3: Cooling tin metal to a low temperature in the cooling tube (5) will trigger the transformation from white tin to gray tin. At this time, tin will become very brittle and turn into powder, thus being discharged from the cooling tube (5).

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