Processing method of cuboid strip-shaped optical part

Abstract

The invention provides a machining method for a cuboid strip-shaped optical part. The machining method comprises the steps that a to-be-polished part is subjected to heating and cooling treatment; on the plane disc, the to-be-polished piece and the first disc matching piece are fixed to form a first machining assembly; after a first machining assembly arranged on the plane disc is repeatedly heated and cooled, the aperture shape of the surface shape of a first machining surface is detected, and a first measurement value is obtained; the first processing assembly is coated with a protection glue layer; a second matching disc is fixed to the first matching disc piece to form a second machining assembly; detecting the aperture shape of the surface shape of the first processing surface to obtain a second measurement value, and obtaining the aperture number variation according to the difference between the second measurement value and the first measurement value; and a second machining assembly is used for polishing the first machining face on the annular polishing machine according to the preset number of polishing circles, wherein the preset number of polishing circles is equal to the aperture number variable quantity. The problem that in the prior art, due to the fact that the surface shape of a long-strip-shaped optical part is uncontrollable in the machining process, the surface shape quality requirement of the part cannot be met is solved.

Description

Technical Field

[0001] The present application relates to the technical field of optical component processing, and more specifically, to a processing method for a rectangular parallelepiped strip optical component. Background Art

[0002] In the processing of optical lenses (such as polishing), the optical parts are usually processed by disk-forming or optical adhesive fixing methods. However, for medium and long optical parts, due to their long length, the use of existing disk-forming or optical adhesive fixing methods will introduce greater surface shape changes, making the surface shape processing uncontrollable.

[0003] The main disadvantage of the existing processing method is that stress is introduced into the long optical parts after the upper and lower plates or the photo-bonding. The residual stress can easily cause the surface deformation of the parts after processing, making the deformed surface value after processing 10-20 times the required surface value. The surface shape change after the lower plate or photo-bonding is uncontrollable, resulting in the inability to guarantee the surface quality requirements of the parts.

[0004] Therefore, the existing technology still needs to be improved and developed. Summary of the Invention

[0005] The purpose of the present application is to provide a method for processing rectangular parallelepiped strip optical parts, which solves the problem in the prior art that the surface shape of long strip optical parts cannot be controlled during the processing, resulting in the inability to ensure the surface quality requirements of the parts.

[0006] To achieve the above objectives, the technical solution adopted in this application is:

[0007] The present application provides a method for processing a rectangular parallelepiped strip optical component, comprising the steps of:

[0008] Perform temperature rise and fall treatment on the workpiece to be polished to eliminate the internal stress of the workpiece;

[0009] Providing a first matching disc, placing the first matching disc on the flat disc, placing the second processing surface of the workpiece to be polished against the positioning side surface of the first matching disc, placing the first processing surface of the workpiece to be polished against the flat disc, and fixing the workpiece to be polished and the first matching disc to form a first processing assembly;

[0010] After repeatedly heating and cooling a first processing assembly placed on a flat plate, detecting an aperture shape of a first processing surface in the first processing assembly to obtain a first measurement value;

[0011] Applying a protective adhesive layer on the first processing component;

[0012] Providing a second matching plate member, placing a connecting surface of the second matching plate against and fixing it to the positioning side surface of the first matching plate member, with the outer side surface of the second matching plate protruding from the second observation surface of the workpiece to be polished, thereby forming a second processing assembly;

[0013] Detecting the aperture shape of the first processing surface in the second processing assembly to obtain a second measurement value, and obtaining an aperture number change according to a difference between the second measurement value and the first measurement value;

[0014] The second processing assembly is placed in the ring polishing spacer, and the first processing surface is polished on the ring polishing machine according to a predetermined number of polishing circles, wherein the predetermined number of polishing circles is equal to the change in the aperture number.

[0015] In an optional embodiment, in the step of performing a temperature raising and lowering treatment on the workpiece to be polished to eliminate the internal stress of the workpiece to be polished, the temperature raising and lowering treatment is repeated for a predetermined number of times on the workpiece to be polished, wherein each temperature raising and lowering treatment step includes:

[0016] Heating the workpiece to be polished to a first preset temperature and keeping the temperature for a first predetermined time;

[0017] Cool the parts to be polished.

[0018] In an optional embodiment, a first matching disc is provided, the first matching disc is placed on the flat disc, the second processing surface of the workpiece to be polished is abutted against the positioning side surface of the first matching disc, the first processing surface of the workpiece to be polished is abutted against the flat disc, and the workpiece to be polished and the first matching disc are fixed to form a first processing assembly.

[0019] The bottom plane and the positioning side surface of the first matching plate member abutting against the plane plate are perpendicular to each other;

[0020] There are two positioning side surfaces, which are respectively located on both sides of the width direction of the first matching disc. The second processing surface of one workpiece to be polished is pressed against and fixed on one side positioning side surface of the first matching disc, and the second processing surface of another workpiece to be polished is pressed against and fixed on the other side positioning side surface of the first matching disc.

[0021] In an optional embodiment, the steps of providing a first matching disc, placing the first matching disc on the flat disc, placing the second processing surface of the workpiece to be polished against the positioning side surface of the first matching disc, placing the first processing surface of the workpiece to be polished against the flat disc, and fixing the workpiece to be polished and the first matching disc to form a first processing assembly further include:

[0022] Place the bottom plane of the first matching disc against the surface of the flat disc and observe the striations;

[0023] A first processing surface of the workpiece to be polished is placed against the surface of the planar disk, and striations are observed, and a second processing surface of the workpiece to be polished is placed against the positioning side surface of the first matching disk, and striations are observed;

[0024] placing the first mating disc and the workpiece to be polished on the flat disc for a second predetermined time to release the combined stress;

[0025] The first matching disc component and the component to be polished after stress release are bonded and fixed to form a first processing assembly.

[0026] In an optional embodiment, the step of bonding and fixing the first matching disc member and the workpiece to be polished after stress release to form a first processing assembly includes:

[0027] The multiple glue points at the junction of the first matching plate and the workpiece to be polished are bonded and fixed, wherein the multiple glue points include: end surface glue points located on the edge of the end surface of the workpiece to be polished on both sides and multiple side surface glue points located on the edge of the second processing surface of the workpiece to be polished, and the multiple side surface glue points are distributed at equal intervals.

[0028] In an optional embodiment, after the first processing component is repeatedly heated and cooled, the step of detecting the aperture shape of the surface of the first processing component to obtain the first measurement value includes:

[0029] Repeating the heating and cooling process for a predetermined number of times, wherein each heating and cooling process comprises: heating the first processing component to a second heating temperature and holding the temperature for a third predetermined time by the oven, and naturally cooling the first processing component;

[0030] placing the first processing component in a refrigerated environment at a predetermined temperature and maintaining the temperature for a fourth predetermined time;

[0031] The aperture shape of the first processing surface of the first processing component is detected to obtain a first measurement value.

[0032] In an optional embodiment, the step of applying a protective adhesive layer on the first processing component includes:

[0033] A protective adhesive layer is applied to the surface of the workpiece to be polished in the first processing assembly by intermittent coating.

[0034] In an optional embodiment, a second disc is provided, and a connecting surface of the second disc is abutted against and fixed to a positioning side surface of the first disc, with an outer side surface of the second disc protruding from a second observation surface of the workpiece to be polished, in the step of forming the second processing assembly:

[0035] The connecting surface and the outer side surface of the second matching plate are opposite to each other. The second matching plate is fixed to both ends of the positioning side surface of the first matching plate in the length direction through the connecting surface. The outer side surface of the second matching plate protrudes from the second observation surface of the workpiece to be polished.

[0036] In an optional embodiment, after the step of placing the second processing assembly in a ring polishing spacer and polishing the first processing surface on a ring polishing machine for a predetermined number of polishing cycles, the step further includes:

[0037] Soaking the polished second processing component to separate the first plate, the second plate and the polished workpiece and clean their surfaces;

[0038] The surface aperture and error of the first processing surface of the workpiece to be polished are detected by an interferometer to obtain a semi-finished workpiece that meets predetermined standards.

[0039] In an optional embodiment, after the step of detecting the surface aperture and error of the first processed surface by an interferometer and determining whether the aperture and error meet a predetermined standard, the method further includes:

[0040] Place the first processing surface of the semi-finished product against the positioning side surface of the first matching disc, place the second processing surface of the semi-finished product against the flat disc, and fix the semi-finished product and the first matching disc to form a third processing assembly;

[0041] Repeating the heating and cooling process for a predetermined number of times, wherein each heating and cooling process comprises: heating the third processing component to a second heating temperature and holding the temperature for a third predetermined time by the oven, and naturally cooling the third processing component;

[0042] detecting an aperture shape of a second processing surface of a third processing component to obtain a third measurement value;

[0043] The connecting surface of the second matching disc is pressed against and fixed to the positioning side surface of the first matching disc, and the outer side surface of the second matching disc protrudes from the first observation surface of the workpiece to be polished, thereby forming a fourth processing assembly;

[0044] Detecting the aperture shape of the second processing surface of the fourth processing component to obtain a fourth measurement value, and obtaining a second aperture number change according to a difference between the fourth measurement value and the third measurement value;

[0045] The fourth processing assembly is placed in the ring polishing spacer, and the second processing surface is polished on the ring polishing machine according to a predetermined number of polishing circles, wherein the predetermined number of polishing circles is equal to the variation of the second aperture number.

[0046] The present invention provides a method for processing rectangular, strip-shaped optical components, the beneficial effects of which include: first subjecting the component to be polished to a temperature ramp to achieve re-annealing of the component, thereby reducing or eliminating stress in the workpiece or the rough part itself, and maximizing the release of internal stress within the component to be polished. A first matching plate is then used to assist in positioning the component to be polished and secure it to form a first processing assembly. Repeated temperature ramping and heating / freezing are then used to accelerate aging, releasing stress during the securing process. This ensures firmness, increases the polishing area, and minimizes stress introduction. After obtaining a first measurement value for the aperture shape of the first processing surface in the first processing assembly, a second matching plate is fixed to form a second processing assembly. The second matching plate prevents the polished component from directly contacting the ring polishing spacer during processing, which could cause the component to loosen, thereby improving processing stability. A second measurement value is then obtained for the aperture shape of the first processing surface in the second processing assembly, and the aperture number change is calculated. Finally, the second processing assembly is placed in the ring polishing spacer for processing, and the predetermined number of polishing circles is equal to the aperture number change, thus achieving compensatory processing, thereby improving the surface quality of the processed surface during processing. Furthermore, the surface shape of slender optical components can be controlled and processed using a conventional polishing machine, solving the problem of surface shape change during processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0048] Figure 1 This is a schematic structural diagram of a rectangular parallelepiped strip optical component (part to be polished) according to an embodiment of the present application;

[0049] Figure 2 A schematic flow chart of the main steps of a method for processing a rectangular parallelepiped strip optical component provided in an embodiment of the present application;

[0050] Figure 3 A schematic flow chart showing the detailed steps of a method for processing a rectangular parallelepiped strip optical component provided in an embodiment of the present application;

[0051] Figure 4 A schematic diagram illustrating the principle of step S200 in a method for processing a rectangular parallelepiped strip-shaped optical component provided in an embodiment of the present application;

[0052] Figure 5 A schematic diagram illustrating the principle of step S240 in a method for processing a rectangular parallelepiped strip-shaped optical component provided in an embodiment of the present application;

[0053] Figure 6 A schematic diagram illustrating the principle of step S500 in a method for processing a rectangular parallelepiped strip-shaped optical component provided in an embodiment of the present application;

[0054] Figure 7 A schematic diagram of the structural principle of simultaneous processing and angle detection in a processing method for a rectangular parallelepiped strip optical component provided in an embodiment of the present application, wherein Figure 7 (a) is a schematic diagram of the structural principle from the left side perspective. Figure 7 (b) is a schematic diagram of the structural principle from a top-down perspective;

[0055] Figure 8 A schematic diagram illustrating the principle of step S700 in a method for processing a rectangular parallelepiped strip-shaped optical component provided in an embodiment of the present application;

[0056] Figure 9 This is a flowchart illustrating the detailed steps of step S900 in a method for processing a rectangular parallelepiped strip optical component provided in an embodiment of the present application.

[0057] Among them, the reference numerals in the figures are:

[0058] 100, workpiece to be polished; 110, first processing surface; 120, first observation surface; 130, second processing surface; 140, second observation surface; 200, plane disk; 210, support surface; 300, first processing assembly; 310, first matching disk member; 311, bottom plane; 312, positioning side; 313, air avoidance groove; 320, glue point; 321, end face glue point; 322, side face glue point; 400, second processing assembly; 410, second matching disk member; 411, connecting surface; 412, outer side; 600, marble spacer; 610, ring-polished spacer; 611, circular spacer; 612, limiting slot; 620, correction disk. DETAILED DESCRIPTION

[0059] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0060] It should be noted that when a component is referred to as being "fixed" or "set" on another component, it can be directly or indirectly on the other component. When a component is referred to as being "connected" to another component, it can be directly or indirectly connected to the other component. The terms "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate the orientation or position shown in the drawings, and are used only for convenience of description, and cannot be understood as a limitation on the technical solutions. The terms "first", "second" are only used for convenience of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0061] The professional terms involved in the present embodiment are explained as follows:

[0062] Elongated part: In the present processing scheme, it refers to an optical part with a length: width: thickness > 10:1:1.

[0063] Surface shape: PV (Peak to valley), also called peak-to-valley value, is a common index of optical surface shape quality. It refers to the height difference between the highest point and the lowest point in the sampling range (based on 2D profile or 3D data map) after removing the reference surface.

[0064] Aperture: The deviation value of the measured optical surface relative to the reference optical surface.

[0065] Error: The maximum deviation of the aperture stripe of the local area relative to the ideal aperture stripe.

[0066] Silica gel: A kind of glue that is still elastic after curing.

[0067] Acetone glue: A protective glue made by mixing resin glue and acetone solution.

[0068] For long strip-shaped optical lens parts, for example Figure 1The elongated bar-shaped part shown in the figure is a quartz cuboid, and the blank to be polished is 100. The shape of the blank to be polished 100 is consistent with the finished product profile, so the finished product part is compared with the blank to be polished 100. The overall length is 340mm, and the width and thickness are both 11mm. The requirement for any two perpendicular elongated surfaces in the overall structure is that the global aperture number is less than or equal to 4fr, and the error is less than or equal to 1.5fr; the perpendicularity is 90°±1'. If polishing is performed in a disc or optical glue manner by a ring polishing machine, the surface shape of the processed surface cannot be controlled, and the surface shape quality is poor. If ion beam or magnetorheological machine tool processing is used, the process price is expensive, and the processing equipment price for large-size parts is even more expensive. For those who use traditional processing methods and do not have ion beam or magnetorheological, they need to solve the polishing problem in terms of surface shape change. Therefore, in order to solve or improve the above problems, the following embodiments are proposed, as follows:

[0069] Please refer to Figure 1 , Figure 2 The embodiment proposes a processing method for processing the processing surface of the blank to be polished 100. Please refer to Figure 1 , taking the above-mentioned quartz cuboid elongated bar-shaped part as an example, among the six surfaces, the front end surface and the rear end surface do not require polishing. The other four side surfaces are polishing surfaces, among which the first observation surface 120 and the second observation surface 140 are in a polished state in the blank state and do not need to be polished, and can be used as auxiliary surfaces; and the first processing surface 110 and the second processing surface 130 are required surfaces, which need to be processed by the processing method. (For convenience, the edges marked with arrows represent the back surface or the surface hidden below) Among the four side surfaces, the first observation surface 120 is arranged opposite to the first processing surface 110, the second observation surface 140 is arranged opposite to the second processing surface 130, and the first processing surface 110 is arranged perpendicular to the second processing surface 130. The structure of the blank to be polished 100 before processing (blank) is the same as that of the cuboid bar-shaped optical part, so the structure of the blank to be polished 100 before processing is described according to the above-mentioned surfaces.

[0070] Please refer to Figure 2 The processing method of the cuboid bar-shaped optical part of the embodiment mainly includes the following steps:

[0071] Step S100, temperature rising and falling treatment is performed on the blank to be polished, so as to eliminate the internal stress of the blank to be polished.

[0072] The polishing piece 100 is repeatedly subjected to temperature rising and falling treatment for a predetermined number of times, wherein each temperature rising and falling treatment comprises: heating the polishing piece 100 to a first preset temperature and keeping the temperature for a first predetermined time. The polishing piece 100 is cooled. In the specific process, the polishing piece 100 is first soaked in acetone, cleaned, and placed in a heat preservation box. The first preset temperature is set to 300 DEG C, the polishing piece 100 is naturally heated and kept at the temperature for 3 hours, and then naturally cooled. The temperature rising and falling is repeated four times. In this way, the internal stress generated in the polishing piece 100 after the early processing or shaping can be released, thereby reducing or eliminating the stress of the processing and the blank itself, so that the stress is released as much as possible, and the influence of the initial stage internal stress in the later processing process is avoided.

[0073] Referring to Figure 1 , the first processing surface 110 and the second processing surface 130 of the polishing piece 100 are cleaned with acetone solution. Similarly, acetone is dropped on the cleaning surface, and the acetone is fully spread to ensure the cleanliness of the first processing surface 110 and the second processing surface 130 of the polishing piece 100.

[0074] In step S200, a first disc part is provided, the first disc part is placed on a plane disc, the second processing surface of the polishing piece is abutted against the positioning side surface of the first disc part, the first processing surface of the polishing piece is abutted against the plane disc, and the polishing piece and the first disc part are fixed to form a first processing assembly.

[0075] Referring to Figure 4 , the first disc part 310 and the plane disc 200 are prepared in advance. The plane disc 200 can adopt a light adhesive disc, and the upward surface of the light adhesive disc is a flat support surface 210. The light adhesive disc is cleaned with acetone solution, and the upper support surface 210 needs to be cleaned until a drop of acetone can be fully spread, which proves that the light adhesive disc has been cleaned and is ready for use.

[0076] Referring to Figure 4 , the first disc part 310 can adopt a long strip shape, and the length of the first disc part 310 is longer than the length of the polishing piece 100. Among the four side surfaces of the first disc part 310, the downward surface is a bottom plane 311, and the left and right side surfaces are positioning side surfaces 312, which are perpendicular to the bottom plane 311, and the perpendicularity is high in accuracy.

[0077] Referring to Figure 4Before use, clean the bottom surface 311, positioning side surface 312 of the first plate 310, and the support surface 210 (polished plastic surface) of the planar plate 200 with acetone. Similarly, drip acetone onto the wiping surface and spread it thoroughly to ensure product cleanliness. Also, before placing the workpiece 100 and the first plate 310, use a squirrel tail brush to remove hair and dust from all surfaces of the workpiece 100, the first plate 310, and the planar plate 200 to prevent them from affecting the fit of the parts.

[0078] See also Figure 2 、 Figure 3 Step S200 specifically includes steps S210 to S240, which are as follows:

[0079] Step S210: Place the bottom surface of the first matching disc against the surface of the planar disc and observe stripes. Observing stripes here means that the bottom surface of the first matching disc is placed against the surface of the planar disc and the operator observes 3 to 5 thick stripes on the upper surface of the first matching disc.

[0080] Step S220: The first processing surface of the workpiece to be polished is pressed against the surface of the flat disk, and stripes are observed; and the second processing surface of the workpiece to be polished is pressed against the positioning side surface of the first matching disk, and stripes are observed.

[0081] See also Figure 4 In the above process, the bottom plane 311 of the first matching disc member 310 contacts the supporting surface 210 of the flat disc 200. When the first matching disc member 310 is placed on the flat disc 200, interference fringes can be seen, indicating that the bottom plane 311 and the supporting surface 210 are in contact with each other with extremely high surface flatness without optical adhesive fixation. Then, the workpiece 100 to be polished is placed on the supporting surface 210 of the flat disk 200, and the second processing surface 130 of the workpiece 100 to be polished is tightly attached to the positioning side surface 312 on one side of the first matching disk 310, and interference fringes are seen without optical glue fixation; the first processing surface 110 of the workpiece 100 to be polished is tightly attached to the supporting surface 210 of the flat disk 200, and interference fringes are seen without optical glue fixation; since there are two left and right positioning side surfaces 312, the two positioning side surfaces 312 are respectively located on both sides of the width direction (left and right) of the first matching disk 310, after the second processing surface 130 of one workpiece 100 to be polished is pressed against the positioning side surface 312 on one side of the first matching disk 310 on the left side, the same method is used to press the second processing surface 130 of another workpiece 100 to be polished against the right positioning side surface 312 of the first matching disk 310.

[0082] Also, see Figure 4 , Figure 7In the middle (a), a clearance groove 313 is provided on the bottom plane 311 of the workpiece 100 to be polished. For example, a clearance groove 313 is provided at the front and rear ends of the bottom plane 311, so that the bottom plane 311 is divided into multiple sections. Figure 7 In the middle (b), when the left and right workpieces 100 to be polished are connected to the first matching plate 310, the left and right workpieces 100 to be polished are staggered to a certain position, so that one end of the left and right workpieces 100 to be polished is respectively located at the avoidance groove 313 ( Figure 7 In Figure (a), the angles of the workpieces 100 to be polished on the left and right sides can be detected simultaneously through the air-avoidance grooves 313 at both ends, thereby avoiding deviations between the reference and the part processing surface due to gaps in the bonding, which affects the final angle processing. In addition, the bottom plane 311 is divided into multiple sections by the air-avoidance grooves 313, and the multiple sections of the bottom plane 311 are distributed along the length direction of the first matching plate 310; the multiple sections of the bottom plane 311 in the length direction are on the same plane. When the bottom plane 311 is placed on the support surface 210 of the flat plate 200, only multiple small areas are in contact with the support surface 210 to achieve positioning, thereby avoiding the problem of using the entire lower surface as the positioning surface, which causes the plane accuracy to be unable to be guaranteed due to the large span, and thus achieving higher positioning accuracy.

[0083] Step S230: leaving the first mating disc and the workpiece to be polished on the flat disc for a second predetermined time to release the combined stress.

[0084] The second predetermined time can be 5 hours, so that the workpiece to be polished and the first matching disk are placed on the supporting surface of the flat disk (optical disk) and left to stand for 5 hours to ensure that the workpiece to be polished and the first matching disk naturally release the comprehensive stress, wherein the comprehensive stress is the internal stress of the workpiece to be polished itself, the stress caused by the operator's hand temperature contacting the workpiece to be polished, and the stress after the polishing workpiece and the disk surface are in contact and compressed.

[0085] Step S240 : bonding and fixing the first plate component and the workpiece to be polished after stress release to form a first processing assembly.

[0086] See also Figure 4 、 Figure 5 , use silicone to bond the parts, squeeze out silicone dots 320 with a diameter of about 3-4mm and a thickness of about 2-3mm, and dispense the glue at multiple locations to bond and fix the multiple glue dots 320 at the junction of the first matching plate 310 and the workpiece to be polished 100. Figure 5The plurality of glue points 320 include: an end surface glue point 321 located on the edge of the two end surfaces of the workpiece 100, and a plurality of side surface glue points 322 located on the edge of the second machined surface 130 of the workpiece 100, and the plurality of side surface glue points 322 are evenly distributed. For example, one end surface glue point 321 is located on the edge of the front end surface of the workpiece 100 which is located on the positioning side surface 312, one end surface glue point 321 is located on the edge of the rear end surface of the workpiece 100 which is located on the positioning side surface 312, and five side surface glue points 322 are located on the edge of the first observation surface 120 (upper surface) of the workpiece 100 which is located on the positioning side surface 312, and the five side surface glue points 322 are evenly distributed in the length direction. Thus, the workpiece 100 can be stably fixed on the first chuck 310, and the space between the glue points provides space for the release of internal stress, which is not easy to cause surface deformation.

[0087] In step S300, after repeatedly raising and lowering the temperature of the first machining assembly placed on the flat disc, the first measurement value of the light ring shape of the surface shape of the first machined surface in the first machining assembly is detected.

[0088] Referring to Figure 3 , the internal stress in the glue layer and the internal stress in the workpiece itself during the bonding process are released through aging after repeatedly raising and lowering the temperature, and then the surface shape is detected. Step S300 specifically includes steps S310-S340, as follows:

[0089] In step S310, the temperature raising and lowering process is repeatedly cycled for a predetermined number of times to release the internal stress of the first machining assembly. Each temperature raising and lowering process includes: heating the first machining assembly to a second heating temperature and maintaining the temperature for a third predetermined time through an oven, and naturally lowering the temperature of the first machining assembly.

[0090] In the above process, the flat disc and the first machining assembly are placed in the oven, the second heating temperature is set, for example, 40-50℃, the temperature is maintained for a third predetermined time, for example, 2h, and the natural temperature raising and lowering is performed through the oven. The temperature raising and lowering process is repeatedly cycled 5 times.

[0091] In step S320, the first machining assembly is placed in a freezing environment at a predetermined temperature and maintained for a fourth predetermined time.

[0092] Subsequently, the flat disc and the first machining assembly are placed in a freezing environment at -5-10℃, and maintained for a fourth predetermined time, for example, 24h. Through this process, the residual stress of each part in the first machining assembly is removed, and the stress of the glue is also released, completing the aging process. Through the process of applying silicone + heating / cooling to accelerate aging and release stress, the firmness is ensured, the polishing area is increased, and the stress is introduced more small.

[0093] During freeze-aging stress relief, there's a risk of condensation forming on both surfaces (the first and second) of the workpiece being polished. If this condensation creates corrosion marks on the first and second surfaces, both surfaces will subsequently be polished to remove the corrosion marks. Therefore, freeze-aging stress relief is used in this step to improve the stress relief effect. Step S330: Detect the aperture shape of the first surface of the first processing component to obtain a first measurement value.

[0094] The plane disk and the first processing component that have completed the aging process are subjected to a surface shape detection to obtain a first measurement value. For example, the aperture shape obtained by the detection is -1fr, and the error is 0.1fr.

[0095] Step S400: applying a protective adhesive layer on the first processing component.

[0096] The protective adhesive layer can be acetone adhesive, which is applied to the processed (polished) surface of the workpiece to be polished in the first processing assembly by intermittent application. By applying the acetone adhesive intermittently, with a certain interval between each application, the problem of large-scale surface shape changes on the surface of the first processing assembly caused by collective shrinkage when the acetone adhesive is fully applied can be reduced. Furthermore, during the application of the adhesive by the first processing assembly, the adhesive is applied in an inverted manner. During the inverted application, excess acetone adhesive can slide down and fall along the plane, thereby preventing excess acetone adhesive from accumulating on the first processing assembly. The protective adhesive layer can effectively protect the processed surface. By adopting the intermittent and inverted application of acetone adhesive, stress introduction is reduced while protecting the product, thereby reducing the impact on the surface shape of the workpiece to be polished.

[0097] Step S500: provide a second matching plate, place the connecting surface of the second matching plate against and fix it on the positioning side surface of the first matching plate, and the outer side surface of the second matching plate protrudes from the second observation surface of the workpiece to be polished, to form a second processing assembly.

[0098] See also Figure 6The second plate member 410 can be square-shaped, and thus has a connecting surface 411 and an outer side surface 412. The connecting surface 411 and the outer side surface 412 are opposed to each other, for example, representing the left and right sides of the second plate. Multiple second plates 410 are provided. When there is one workpiece 100 to be polished on the first processing assembly 300, two second plates 410 are provided. The two second plates 410 are fixed to the front and rear ends of the positioning side surface 312 of the first plate member 310 via the connecting surfaces 411. The outer side surfaces 412 of the second plates at each end protrude from the second viewing surface 140 of the workpiece 100 to be polished. The connecting surface 411 of the second matching disc component 410 and the positioning side surface 312 of the first matching disc component 310 are bonded together using 502 glue. The left and right widths of the second matching disc component 410 are greater than the left and right widths of the workpiece 100 to be polished, so that the outer side surface 412 of the second matching disc component 410 protrudes from the second observation surface 140 of the workpiece 100 to be polished in the left and right directions, thereby forming a second processing assembly 400. When the second processing assembly 400 is directly removed from the flat disc 200 and polishing is performed, the outer side surface 412 of the second matching disc component 410 can prevent the workpiece 100 to be polished from directly contacting the ring polishing spacer 610, causing the workpiece 100 to be polished in the second processing assembly 400 to loosen, affecting the processing progress.

[0099] Step S600: Detect the aperture shape of the first processing surface in the second processing assembly to obtain a second measurement value, and obtain the aperture number change according to the difference between the second measurement value and the first measurement value.

[0100] The second surface shape test is then performed on the first processed surface of the workpiece to be polished on the second processing assembly. The test direction is two directions to ensure the bonding strength and surface shape consistency of the workpiece to be polished. The surface shape of the product to be polished is the second measurement value. For example, the aperture shape is -1.3fr, with an error of 0.2fr.

[0101] Therefore, by comparing the first and second measurements, we can calculate that the change in aperture number is -0.3 f / 2.0, with an error of 0.1 f / 2. This means that the bonding process introduces a concave aperture change, which after removing the glue will shift to +0.3 f / 2.0, with an error of 0.1 f / 2. Therefore, the polishing process requires a -0.3 f / 2.0, with an error of 1.4 f / 2. Therefore, we can conclude that the change in aperture number before and after bonding determines the number of turns required for polishing during processing. The smaller the error, the better.

[0102] Step S700: placing the second processing assembly in a ring polishing spacer, and polishing the first processing surface on a ring polishing machine according to a predetermined number of polishing circles, wherein the predetermined number of polishing circles is equal to the change in aperture number.

[0103] See also Figure 8During processing, the second processing assembly 400, along with the ring polishing spacer 610, is placed within the marble spacer 600 of the ring polishing machine. The ring polishing machine's correction disk 620 is adjusted to achieve the desired surface shape. The thickness of the ring polishing spacer must be greater than the thickness of the workpiece to be polished + 5-10mm. During the polishing process, the change in aperture number is used as a standard for polishing, achieving compensatory processing, thereby ensuring the quality of the finished surface shape.

[0104] See also Figure 8 The ring polishing spacer 610 includes a circular spacer 611 with a plurality of rectangular limiting slots 612 arranged side by side. Each limiting slot 612 is used to accommodate a second processing assembly 400. The limiting slots 612 are arranged on both sides of the longitudinal direction to limit the front and rear end surfaces of the first matching plate 310, while the limiting slots 612 are arranged on both sides of the width direction to limit the outer surface 412 of the second matching plate 410. This prevents the front and rear end surfaces and the left (right) side of the workpiece 100 from contacting the limiting slots 612 during the processing, effectively protecting the workpiece 100.

[0105] See also Figure 4 、 Figure 7 Figures (a) and (b) in the middle also emphasize that this processing method can detect angles and process surface shapes simultaneously. This can be achieved by fixing the positions of the workpiece 100 to be polished and the first and second matching discs 310 and 410. When the left and right workpieces 100 to be polished are connected to the first matching disc 310, the left and right workpieces 100 to be polished are staggered by a certain position. For example, the front end of the left workpiece 100 to be polished is located at the front side of the clearance groove 313, and the rear end of the right workpiece 100 to be polished is located at the rear side of the clearance groove 313. This allows one end of the left and right workpieces 100 to be polished to be located in the middle of the clearance groove 313. In this way, during the polishing process, the angles of the left and right workpieces 100 to be polished can be directly detected through the clearance grooves 313 at both ends. The two workpieces 100 to be polished are detected simultaneously, avoiding the deviation between the positioning side surface 312 and the first processing surface 110 of the workpiece 100 to be polished due to gaps in the bonding, which affects the final angle processing.

[0106] Step S800: Soak the polished second processing assembly to separate the first plate, the second plate and the workpiece to be polished after polishing and clean their surfaces.

[0107] Step S810: Detecting the surface aperture and error of the first processing surface of the workpiece to be polished by an interferometer to obtain a semi-finished workpiece that meets a predetermined standard.

[0108] During this process, the second machining assembly is immersed in acetone for 2 hours to clean the surface of the part. The first and second mating discs are then separated from the part to be polished. An interferometer is used to test the surface aperture and error of the separated part. If the test passes, the semi-finished part with the first machined surface is obtained.

[0109] Step S900: Polishing the second processed surface of the semi-finished product. In this process, except that step S320 does not require freezing, the rest of the processing flow is the same as the processing flow of the first processed surface.

[0110] See also Figure 9 , the main steps are as follows:

[0111] Step S910: Place the first processing surface of the semi-finished part against the positioning side surface of the first matching disc, place the second processing surface of the semi-finished part against the flat disc, and fix the semi-finished part and the first matching disc to form a third processing assembly.

[0112] Step S920, repeating the heating and cooling process for a predetermined number of times, wherein each heating and cooling process includes: heating the third processing component to a second heating temperature and keeping the temperature for a third predetermined time by the oven, and naturally cooling the third processing component.

[0113] In this step, there is no need to freeze-age the parts, so as to avoid the problem that when the parts are taken out from a low-temperature state and returned to a room temperature state, the water vapor in the air will be cooled and easily produce microscopic water droplets on the surface of the parts, thereby preventing water droplets from adhering to the surface of the parts and easily corroding the surface of the parts, causing watermarks and damaging the surface of the parts, affecting the subsequent use of the parts.

[0114] Step S930: Detect the aperture shape of the second processing surface of the third processing component to obtain a third measurement value.

[0115] Step S940: Apply a protective adhesive layer on the third processing component.

[0116] Step S950: The connecting surface of the second matching plate is pressed against and fixed to the positioning side surface of the first matching plate, and the outer side surface of the second matching plate is pressed against the second observation window of the semi-finished product to form a fourth processing assembly.

[0117] Step S960: Detect the aperture shape of the second processing surface of the fourth processing component to obtain a fourth measurement value, and obtain a second aperture number change according to the difference between the fourth measurement value and the third measurement value.

[0118] Step S970: placing the fourth processing assembly in the ring polishing spacer, and polishing the second processing surface on the ring polishing machine according to a predetermined number of polishing circles, wherein the predetermined number of polishing circles is equal to the variation of the second aperture number.

[0119] In summary, this application provides a method for processing rectangular, strip-shaped optical parts using compensatory processing. Annealing / freezing during bonding releases stress in the polished part and the glue. Silicone and acetone adhesives are also used for bonding, protecting the parts and ensuring their durability while also minimizing surface variations. This solution only requires the operator to use traditional polishing equipment and bonding skills, and requires minimal machining skills. It is suitable for processing long strips of optical parts using conventional ring polishing machines.

[0120] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A method for processing a rectangular parallelepiped strip optical component, characterized in that: Including steps: Performing temperature raising and lowering treatment on the workpiece to be polished to eliminate the internal stress of the workpiece to be polished; Providing a first matching disc, placing the first matching disc on a flat disc, placing the second processing surface of the workpiece to be polished against the positioning side surface of the first matching disc, placing the first processing surface of the workpiece to be polished against the flat disc, and fixing the workpiece to be polished and the first matching disc to form a first processing assembly; After repeatedly heating and cooling the first processing assembly placed on the flat plate, detecting the aperture shape of the first processing surface in the first processing assembly to obtain a first measurement value; Applying a protective adhesive layer on the first processing component; Providing a second matching disc, placing a connecting surface of the second matching disc against and fixing it to the positioning side surface of the first matching disc, with an outer side surface of the second matching disc protruding from the second observation surface of the workpiece to be polished, to form a second processing assembly; Detecting the aperture shape of the first processing surface in the second processing assembly to obtain a second measurement value, and obtaining an aperture number change based on a difference between the second measurement value and the first measurement value; The second processing assembly is placed in a ring polishing spacer, and the first processing surface is polished on a ring polishing machine according to a predetermined number of polishing circles, wherein the predetermined number of polishing circles is equal to the change in the aperture number.

2. The method for processing a rectangular parallelepiped strip optical component according to claim 1, wherein: In the step of performing a temperature raising and lowering process on the workpiece to be polished to eliminate the internal stress of the workpiece to be polished, the temperature raising and lowering process is repeated for a predetermined number of times on the workpiece to be polished, wherein each temperature raising and lowering process comprises: Heating the workpiece to be polished to a first preset temperature and keeping the temperature for a first predetermined time; Cool the parts to be polished.

3. The method for processing a rectangular parallelepiped strip optical component according to claim 1, wherein: In the steps of providing a first matching disc, placing the first matching disc on a flat disc, placing the second processing surface of the workpiece to be polished against the positioning side surface of the first matching disc, placing the first processing surface of the workpiece to be polished against the flat disc, and fixing the workpiece to be polished and the first matching disc to form a first processing assembly: The bottom plane of the first matching plate member abutting against the planar plate and the positioning side surface are perpendicular to each other; There are two positioning side surfaces, which are respectively located on both sides of the width direction of the first matching disc. The second processing surface of one of the workpieces to be polished is pressed against and fixed on one side positioning side surface of the first matching disc, and the second processing surface of the other workpiece to be polished is pressed against and fixed on the other side positioning side surface of the first matching disc.

4. The method for processing a rectangular parallelepiped strip optical component according to claim 1, wherein: The steps of providing a first matching disc, placing the first matching disc on a flat disc, placing the second processing surface of the workpiece to be polished against the positioning side surface of the first matching disc, placing the first processing surface of the workpiece to be polished against the flat disc, and fixing the workpiece to be polished and the first matching disc to form a first processing assembly further include: placing the bottom plane of the first matching disc member against the surface of the planar disc and observing striations; The first processing surface of the workpiece to be polished is placed against the surface of the planar disk, and stripes are observed, and the second processing surface of the workpiece to be polished is placed against the positioning side surface of the first matching disk, and stripes are observed; placing the first matching disc member and the workpiece to be polished on the flat disc for a second predetermined time to release the combined stress; The first matching disc component and the component to be polished after stress release are bonded and fixed to form a first processing assembly.

5. The method for processing a rectangular parallelepiped strip optical component according to claim 4, wherein: The step of bonding and fixing the first matching disc member and the workpiece to be polished after stress release to form a first processing assembly includes: The plurality of glue points at the junction of the first matching disc and the workpiece to be polished are bonded and fixed, wherein the plurality of glue points include: end face glue points respectively located on the end face edges of both sides of the workpiece to be polished and a plurality of side face glue points located on the edges of the second processing surface of the workpiece to be polished, and the plurality of side face glue points are distributed at equal intervals.

6. The method for processing a rectangular parallelepiped strip optical component according to claim 1, wherein: After the first processing component is repeatedly heated and cooled, the step of detecting the aperture shape of the surface of the first processing component to obtain a first measurement value includes: Repeating the heating and cooling process for a predetermined number of times, wherein each heating and cooling process comprises: heating the first processing component to a second heating temperature by an oven and keeping the temperature at a second predetermined time, and naturally cooling the first processing component; placing the first processing component in a refrigerated environment at a predetermined temperature and keeping the temperature therein for a fourth predetermined time; A first measurement value is obtained by detecting an aperture shape of the first processing surface of the first processing component.

7. The method for processing a rectangular parallelepiped strip optical component according to claim 6, wherein: The step of applying a protective adhesive layer on the first processing component includes: A protective adhesive layer is applied to the surface of the workpiece to be polished in the first processing assembly by intermittent coating.

8. The method for processing a rectangular parallelepiped strip optical component according to claim 1, wherein: Providing a second matching plate member, placing the connecting surface of the second matching plate against and fixing it to the positioning side surface of the first matching plate member, with the outer side surface of the second matching plate protruding from the second observation surface of the workpiece to be polished, to form the second processing assembly: The connecting surface and the outer side surface of the second matching disc are opposite to each other. The second matching disc is fixed to both ends of the positioning side surface of the first matching disc in the length direction through the connecting surface. The outer side surface of the second matching disc protrudes from the second observation surface of the workpiece to be polished.

9. The method for processing a rectangular parallelepiped strip optical component according to claim 8, wherein: After placing the second processing assembly in a ring polishing spacer and polishing the first processing surface on a ring polishing machine according to a predetermined number of polishing circles, the method further includes: Soaking the polished second processing assembly to separate the first matching disc, the second matching disc and the polished workpiece and clean their surfaces; The surface aperture and error of the first processing surface of the workpiece to be polished are detected by an interferometer to obtain a semi-finished workpiece that meets predetermined standards.

10. The method for processing a rectangular parallelepiped strip optical component according to claim 9, wherein: After the step of detecting the surface aperture and error of the first processed surface by an interferometer and meeting the predetermined standards, the following steps are further included: placing the first processing surface of the semi-finished part against the positioning side surface of the first matching disc, placing the second processing surface of the semi-finished part against the flat disc, and fixing the semi-finished part and the first matching disc to form a third processing assembly; Repeating the heating and cooling process for a predetermined number of times, wherein each heating and cooling process comprises: heating the third processing component to a second heating temperature and keeping the temperature at that temperature for a third predetermined time by using an oven, and naturally cooling the third processing component; detecting an aperture shape of the second processing surface of the third processing component to obtain a third measurement value; The connecting surface of the second matching disc is pressed against and fixed to the positioning side surface of the first matching disc, and the outer side surface of the second matching disc protrudes from the first observation surface of the workpiece to be polished, thereby forming a fourth processing assembly; detecting an aperture shape of the second processing surface of the fourth processing component to obtain a fourth measurement value, and obtaining a second aperture number change according to a difference between the fourth measurement value and the third measurement value; The fourth processing assembly is placed in a ring polishing spacer, and the second processing surface is polished on a ring polishing machine according to a predetermined number of polishing circles, wherein the predetermined number of polishing circles is equal to the change in the second aperture number.

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