A processing method of a cuboid strip-shaped optical component

Abstract

The application provides a processing method of a cuboid strip-shaped optical component, comprising the following steps: performing temperature rising and falling treatment on a polishing piece; fixing the polishing piece and a first matching disc piece on a plane disc to form a first processing assembly; detecting the light circle shape of the surface shape of the first processing surface to obtain a first measurement value after repeatedly performing temperature rising and falling treatment on the first processing assembly placed on the plane disc; smearing a protective glue layer on the first processing assembly; fixing a second matching disc on the first matching disc piece to form a second processing assembly; detecting the light circle shape of the surface shape of the first processing surface to obtain a second measurement value, and obtaining a light circle number change amount according to the difference between the second measurement value and the first measurement value; and polishing the first processing surface on a ring polishing machine according to a predetermined polishing circle number, wherein the predetermined polishing circle number is equal to the light circle number change amount. The problem that the surface shape of the strip-shaped optical component in the prior art is uncontrollable in the processing process, thereby failing to guarantee the surface shape quality requirement of the component is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of optical part processing, and more particularly to a processing method of cuboid strip-shaped optical parts. BACKGROUND

[0002] In the processing (e.g., polishing) of optical lenses, the optical parts are usually processed by using a processing method of fixing in a disc or by using optical cement, but for long strip-shaped optical parts, the existing fixing in a disc or by using optical cement will introduce a larger surface shape variation, and the surface shape processing is uncontrollable.

[0003] The main disadvantage of the existing processing method is that the long strip-shaped optical parts will have stress introduced after being fixed in a disc or by using optical cement, and the residual stress will easily cause surface deformation of the parts after processing, so that the surface deformation value of the processed surface is 10-20 times the required surface shape value, the surface shape variation after being fixed in a disc or by using optical cement is uncontrollable, and the surface shape quality requirement of the parts cannot be guaranteed.

[0004] Therefore, the prior art still needs to be improved and developed. SUMMARY

[0005] The present application aims to provide a processing method of cuboid strip-shaped optical parts, which solves the problem of uncontrollable surface shape of long strip-shaped optical parts in the processing process in the prior art, and cannot guarantee the surface shape quality requirement of the parts.

[0006] To achieve the above-mentioned purpose, the technical solution adopted by the present application is:

[0007] The present application provides a processing method of cuboid strip-shaped optical parts, comprising the steps of:

[0008] Performing temperature rising and falling treatment on the part to be polished to eliminate the internal stress of the part to be polished;

[0009] Providing a first disc part, placing the first disc part on a flat disc, abutting the second processing surface of the part to be polished against the positioning side surface of the first disc part, abutting the first processing surface of the part to be polished against the flat disc, and fixing the part to be polished and the first disc part to form a first processing assembly;

[0010] After repeatedly performing temperature rising and falling on the first processing assembly placed on the flat disc, detecting the light circle shape of the surface shape of the first processing surface in the first processing assembly to obtain a first measurement value;

[0011] Applying a protective glue layer on the first processing assembly;

[0012] The second chuck is provided, and the connecting surface of the second chuck is abutted and fixed to the positioning side surface of the first chuck, and the outer side surface of the second chuck protrudes from the second observation surface of the workpiece to be polished to form a second machining assembly;

[0013] The second measurement value is obtained by detecting the shape of the first machining surface in the second machining assembly, and the variation of the number of laps is obtained according to the difference between the second measurement value and the first measurement value.

[0014] The second machining assembly is placed in the ring polishing spacer, and the first machining surface is polished on the ring polishing machine according to the predetermined polishing laps, wherein the predetermined polishing laps are equal to the variation of the number of laps.

[0015] In an optional embodiment, the workpiece to be polished is subjected to repeated temperature rising and falling treatment a predetermined number of times in the step of temperature rising and falling treatment of the workpiece to be polished to eliminate the internal stress of the workpiece to be polished, wherein each temperature rising and falling treatment comprises:

[0016] The workpiece to be polished is heated to a first preset temperature and kept for a first predetermined time;

[0017] The workpiece to be polished is cooled.

[0018] In an optional embodiment, the first chuck is provided, and the first chuck is placed on the flat disc, the second machining surface of the workpiece to be polished is abutted to the positioning side surface of the first chuck, the first machining surface of the workpiece to be polished is abutted to the flat disc, and the workpiece to be polished is fixed with the first chuck to form a first machining assembly, and the step further comprises:

[0019] The bottom plane of the first chuck abuts to the surface of the flat disc, and the stripe is observed.

[0020] The positioning side surface is provided with two positioning side surfaces, and the two positioning side surfaces are respectively located on both sides of the width direction of the first chuck, the second machining surface of one workpiece to be polished is abutted and fixed to one side of the positioning side surface of the first chuck, and the second machining surface of the other workpiece to be polished is abutted and fixed to the other side of the positioning side surface of the first chuck.

[0021] In an optional embodiment, the first chuck is provided, and the first chuck is placed on the flat disc, the second machining surface of the workpiece to be polished is abutted to the positioning side surface of the first chuck, the first machining surface of the workpiece to be polished is abutted to the flat disc, and the workpiece to be polished is fixed with the first chuck to form a first machining assembly, and the step further comprises:

[0022] The bottom plane of the first chuck abuts to the surface of the flat disc, and the stripe is observed.

[0023] The first surface of the workpiece to be polished is placed against the surface of the flat disk, and stripes are observed. The second surface of the workpiece to be polished is placed against the positioning side of the first mounting disk, and stripes are observed.

[0024] The first mounting plate and the workpiece to be polished are left to stand on the flat plate for a second predetermined time to release the combined stress;

[0025] After stress relief, the first mating part and the workpiece to be polished are bonded and fixed together to form the first processing assembly.

[0026] In an optional embodiment, the step of bonding and fixing the first mating disc and the workpiece to be polished after stress relief to form the first processing assembly includes:

[0027] Multiple adhesive dots are bonded and fixed at the junction of the first mounting plate and the workpiece to be polished. The multiple adhesive dots include: end face adhesive dots located on the edges of the two end faces of the workpiece to be polished and multiple side adhesive dots located on the edges of the second processing surface of the workpiece to be polished. The multiple side adhesive dots are evenly distributed.

[0028] In an optional embodiment, the step of detecting the aperture shape of the surface of the first processing component to obtain a first measurement value after the first processing component undergoes repeated heating and cooling includes:

[0029] The heating and cooling process is repeated a predetermined number of times, wherein each heating and cooling process includes: heating the first processing component to a second heating temperature in an oven and holding it at that temperature for a third predetermined time, and then allowing the first processing component to cool down naturally.

[0030] The first processing component is placed in a frozen environment at a predetermined temperature and kept warm for a fourth predetermined time;

[0031] The first measurement value is obtained by detecting the aperture shape of the first processing surface of the first processing component.

[0032] In an optional embodiment, the step of applying a protective adhesive layer to the first processing component includes:

[0033] A protective adhesive layer is applied to the surface of the workpiece to be polished in the first processing component by intermittent application.

[0034] In an optional embodiment, a second mounting plate is provided, and the connecting surface of the second mounting plate abuts against and is fixed to the positioning side of the first mounting plate. The outer side of the second mounting plate protrudes from the second viewing surface of the workpiece to be polished, forming the second processing assembly.

[0035] The connecting surface and the outer surface of the second mounting plate are opposite each other. The second mounting plate is fixed at both ends of the length direction of the positioning side of the first mounting plate through the connecting surface. The outer surface of the second mounting plate protrudes from the second observation surface of the workpiece to be polished.

[0036] In an alternative embodiment, the step of placing the second processing assembly in the ring-throwing spacer and polishing the first processing surface on the ring-throwing machine by a predetermined polishing lap number further comprises:

[0037] immersing the polished second processing assembly to separate the first chucking member, the second chucking member and the polished part to be polished and to clean the surface of the polished part to be polished;

[0038] detecting the surface lap and error of the first processing surface of the polished part to be polished by the interferometer to obtain a semi-finished part meeting the predetermined standard.

[0039] In an alternative embodiment, the step of detecting the surface lap and error of the first processing surface after processing by the interferometer to meet the predetermined standard further comprises:

[0040] abutting the first processing surface of the semi-finished part against the positioning side of the first chucking member, abutting the second processing surface of the semi-finished part against the flat disc, and fixing the semi-finished part and the first chucking member to form a third processing assembly;

[0041] cyclically repeating a predetermined number of temperature rising and falling processes, wherein each temperature rising and falling process comprises: heating the third processing assembly to a second heating temperature by the oven and maintaining the third processing assembly at the second heating temperature for a third predetermined time, and naturally cooling the third processing assembly;

[0042] detecting the lap shape of the surface shape of the second processing surface of the third processing assembly to obtain a third measurement value;

[0043] abutting and fixing the connecting surface of the second chucking member against the positioning side of the first chucking member, and protruding the outer side of the second chucking member from the first observation surface of the part to be polished to form a fourth processing assembly;

[0044] detecting the lap shape of the surface shape of the second processing surface of the fourth processing assembly to obtain a fourth measurement value, and obtaining a second lap number change amount according to the difference between the fourth measurement value and the third measurement value;

[0045] placing the fourth processing assembly in the ring-throwing spacer and polishing the second processing surface on the ring-throwing machine by a predetermined polishing lap number, wherein the predetermined polishing lap number is equal to the second lap number change amount.

[0046] The beneficial effects of the processing method for a cuboid strip-shaped optical component provided in this application are at least as follows: Firstly, the workpiece to be polished undergoes heating and cooling treatments to achieve secondary annealing, thereby reducing or eliminating the stress within the workpiece itself or the blank, and releasing the internal stress of the workpiece to be polished as much as possible. A first mounting plate is used to assist in positioning the workpiece to be polished and fix it to form a first processing assembly. Repeated heating and cooling are used to accelerate aging, which can release the stress during the fixing process, ensuring firmness, increasing the polishing area, and minimizing stress introduction. After obtaining a first measurement value for the aperture shape of the first processing surface in the first processing assembly, a second mounting plate is fixed to form the second processing assembly. The second mounting plate prevents the workpiece to be polished from directly contacting the ring polishing spacer during processing, thus preventing loosening and improving stability during processing. A second measurement value is then obtained for the aperture shape of the first processing surface in the second processing assembly, and the change in the number of apertures is calculated. Finally, the second processing assembly is placed in the ring polishing spacer for processing, and the predetermined number of polishing rings is the same as the change in the number of apertures, thus forming a compensatory processing method and improving the surface shape quality of the processed surface. Furthermore, surface shape control and processing of slender optical parts can be performed on a traditional polishing machine, solving the problem of surface shape changes during processing. Attached Figure Description

[0047] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0048] Figure 1 This is a schematic diagram of the structure of a cuboid strip-shaped optical component (to be polished) according to an embodiment of this application;

[0049] Figure 2 A flowchart illustrating the main steps of a method for processing a cuboid strip-shaped optical component according to an embodiment of this application;

[0050] Figure 3 A flowchart illustrating the detailed steps of a method for processing a cuboid strip-shaped optical component according to an embodiment of this application;

[0051] Figure 4 A schematic diagram illustrating the principle of step S200 in a method for processing a cuboid strip-shaped optical component provided in an embodiment of this application;

[0052] Figure 5 A schematic diagram illustrating the principle of step S240 in a method for processing a cuboid strip-shaped optical component provided in an embodiment of this application;

[0053] Figure 6 A schematic diagram of the principle of step S500 in the processing method of the cuboid strip-shaped optical component provided in the embodiment of the present application;

[0054] Figure 7 A schematic diagram of the principle of simultaneous processing and angle detection in the processing method of the cuboid strip-shaped optical component provided in the embodiment of the present application, wherein Figure 7 (a) is a schematic diagram of the principle of the structure of the left side view, Figure 7 (b) is a schematic diagram of the principle of the structure of the top view;

[0055] Figure 8 A schematic diagram of the principle of step S700 in the processing method of the cuboid strip-shaped optical component provided in the embodiment of the present application;

[0056] Figure 9 A schematic diagram of the principle of step S900 in the processing method of the cuboid strip-shaped optical component provided in the embodiment of the present application.

[0057] In the drawings, various reference signs represent:

[0058] 100, a part to be polished; 110, a first processing surface; 120, a first observation surface; 130, a second processing surface; 140, a second observation surface; 200, a flat disc; 210, a supporting surface; 300, a first processing assembly; 310, a first dispensing disc; 311, a bottom flat surface; 312, a positioning side surface; 313, a clearance groove; 320, a glue point; 321, an end surface glue point; 322, a side surface glue point; 400, a second processing assembly; 410, a second dispensing disc; 411, a connecting surface; 412, an outer side surface; 600, a marble spacer; 610, a ring polishing spacer; 611, a circular spacer disc; 612, a limiting slot hole; 620, a correction disc. DETAILED DESCRIPTION

[0059] In order to make the technical problems, technical solutions and beneficial effects of the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0060] It should be noted that when a component is referred to as being "fixed" or "set" on another component, it can be directly or indirectly on the other component. When a component is referred to as being "connected" to another component, it can be directly or indirectly connected to the other component. The terms "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate the orientation or position shown in the drawings, and are used only for convenience of description, and cannot be understood as a limitation on the technical solutions. The terms "first", "second" are only used for convenience of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0061] The professional terms involved in the present embodiment are explained as follows:

[0062] Elongated part: In the present processing scheme, it refers to an optical part with a length: width: thickness > 10:1:1.

[0063] Surface shape: PV (Peak to valley), also called peak-to-valley value, is a common index of optical surface shape quality. It refers to the height difference between the highest point and the lowest point in the sampling range (based on 2D profile or 3D data map) after removing the reference surface.

[0064] Aperture: The deviation value of the measured optical surface relative to the reference optical surface.

[0065] Error: The maximum deviation of the aperture stripe of the local area relative to the ideal aperture stripe.

[0066] Silica gel: A kind of glue that is still elastic after curing.

[0067] Acetone glue: A protective glue made by mixing resin glue and acetone solution.

[0068] For long strip-shaped optical lens parts, for example Figure 1The elongated bar-shaped part shown in the figure is a quartz cuboid, and the blank to be polished is 100. The shape of the blank to be polished 100 is consistent with the finished product profile, so the finished product part is compared with the blank to be polished 100. The overall length is 340mm, and the width and thickness are both 11mm. The requirement for any two perpendicular elongated surfaces in the overall structure is that the global aperture number is less than or equal to 4fr, and the error is less than or equal to 1.5fr; the perpendicularity is 90°±1'. If polishing is performed in a disc or optical glue manner by a ring polishing machine, the surface shape of the processed surface cannot be controlled, and the surface shape quality is poor. If ion beam or magnetorheological machine tool processing is used, the process price is expensive, and the processing equipment price for large-size parts is even more expensive. For those who use traditional processing methods and do not have ion beam or magnetorheological, they need to solve the polishing problem in terms of surface shape change. Therefore, in order to solve or improve the above problems, the following embodiments are proposed, as follows:

[0069] Please refer to Figure 1 , Figure 2 The embodiment proposes a processing method for processing the processing surface of the blank to be polished 100. Please refer to Figure 1 , taking the above-mentioned quartz cuboid elongated bar-shaped part as an example, among the six surfaces, the front end surface and the rear end surface do not require polishing. The other four side surfaces are polishing surfaces, among which the first observation surface 120 and the second observation surface 140 are in a polished state in the blank state and do not need to be polished, and can be used as auxiliary surfaces; and the first processing surface 110 and the second processing surface 130 are required surfaces, which need to be processed by the processing method. (For convenience, the edges marked with arrows represent the back surface or the surface hidden below) Among the four side surfaces, the first observation surface 120 is arranged opposite to the first processing surface 110, the second observation surface 140 is arranged opposite to the second processing surface 130, and the first processing surface 110 is arranged perpendicular to the second processing surface 130. The structure of the blank to be polished 100 before processing (blank) is the same as that of the cuboid bar-shaped optical part, so the structure of the blank to be polished 100 before processing is described according to the above-mentioned surfaces.

[0070] Please refer to Figure 2 The processing method of the cuboid bar-shaped optical part of the embodiment mainly includes the following steps:

[0071] Step S100, temperature rising and falling treatment is performed on the blank to be polished, so as to eliminate the internal stress of the blank to be polished.

[0072] The polishing piece 100 is repeatedly subjected to temperature rising and falling treatment for a predetermined number of times, wherein each temperature rising and falling treatment comprises: heating the polishing piece 100 to a first preset temperature and keeping the temperature for a first predetermined time. The polishing piece 100 is cooled. In the specific process, the polishing piece 100 is first soaked in acetone, cleaned, and placed in a heat preservation box. The first preset temperature is set to 300 DEG C, the polishing piece 100 is naturally heated and kept at the temperature for 3 hours, and then naturally cooled. The temperature rising and falling is repeated four times. In this way, the internal stress generated in the polishing piece 100 after the early processing or shaping can be released, thereby reducing or eliminating the stress of the processing and the blank itself, so that the stress is released as much as possible, and the influence of the initial stage internal stress in the later processing process is avoided.

[0073] Referring to Figure 1 , the first processing surface 110 and the second processing surface 130 of the polishing piece 100 are cleaned with acetone solution. Similarly, acetone is dropped on the cleaning surface, and the acetone is fully spread to ensure the cleanliness of the first processing surface 110 and the second processing surface 130 of the polishing piece 100.

[0074] In step S200, a first disc part is provided, the first disc part is placed on a plane disc, the second processing surface of the polishing piece is abutted against the positioning side surface of the first disc part, the first processing surface of the polishing piece is abutted against the plane disc, and the polishing piece and the first disc part are fixed to form a first processing assembly.

[0075] Referring to Figure 4 , the first disc part 310 and the plane disc 200 are prepared in advance. The plane disc 200 can adopt a light adhesive disc, and the upward surface of the light adhesive disc is a flat support surface 210. The light adhesive disc is cleaned with acetone solution, and the upper support surface 210 needs to be cleaned until a drop of acetone can be fully spread, which proves that the light adhesive disc has been cleaned and is ready for use.

[0076] Referring to Figure 4 , the first disc part 310 can adopt a long strip shape, and the length of the first disc part 310 is longer than the length of the polishing piece 100. Among the four side surfaces of the first disc part 310, the downward surface is a bottom plane 311, and the left and right side surfaces are positioning side surfaces 312, which are perpendicular to the bottom plane 311, and the perpendicularity is high in accuracy.

[0077] Referring to Figure 4Before use, the bottom plane 311 of the first matching disc part 310, the positioning side 312 and the supporting surface 210 (the optical cement surface) of the flat disc 200 are cleaned with acetone, and the acetone is dropped on the cleaned surface to ensure the cleanliness of the product. Before placing the workpiece 100 and the first matching disc part 310, the squirrel tail hair brush is used to clean the hair and dust on the surfaces of the workpiece 100, the first matching disc part 310 and the flat disc 200 to prevent affecting the close contact of the parts.

[0078] Please refer to Figure 2 , Figure 3 , the step S200 specifically includes steps S210-S240, which are specifically as follows:

[0079] In step S210, the bottom plane of the first matching disc part is abutted to the surface of the flat disc, and the interference fringes are observed. Here, the interference fringes are observed when the bottom plane of the first matching disc part is abutted to the surface of the flat disc, and the operator observes 3-5 thick fringes on the upper surface of the first matching disc part.

[0080] In step S220, the first machined surface of the workpiece is abutbed to the surface of the flat disc, and the interference fringes are observed, and the second machined surface of the workpiece is abutted to the positioning side of the first matching disc part, and the interference fringes are observed.

[0081] Please refer to Figure 4 In the above process, the bottom plane 311 of the first matching disc part 310 is in contact with the supporting surface 210 of the flat disc 200, and the first matching disc part 310 is placed on the flat disc 200. The interference fringes can be seen to indicate that the bottom plane 311 and the supporting surface 210 are in close contact with high surface flatness, and optical cementing will not occur. Then the workpiece 100 is placed on the supporting surface 210 of the flat disc 200, and the second machined surface 130 of the workpiece 100 is in close contact with the positioning side 312 of one side of the first matching disc part 310, and the interference fringes are observed, and the optical cementing will not occur. The first machined surface 110 of the workpiece 100 is in close contact with the supporting surface 210 of the flat disc 200, and the interference fringes are observed, and the optical cementing will not occur. Since the positioning side 312 is provided with two left and right positioning sides 312, the two positioning sides 312 are respectively located on both sides of the width direction (left and right) of the first matching disc part 310. When the second machined surface 130 of one workpiece 100 is abutted to the positioning side 312 of one side of the first matching disc part 310 on the left side, another workpiece 100 is also abutted to the positioning side 312 of the right side of the first matching disc part 310 in the same way.

[0082] In addition, please refer to Figure 4 , Figure 7In Figure (a), clearance grooves 313 are provided on the bottom plane 311 of the workpiece 100 to be polished. For example, clearance grooves 313 are provided at both the front and rear ends of the bottom plane 311, thus dividing the bottom plane 311 into multiple segments. Please refer to [reference needed]. Figure 7 In Figure (b), when the polished parts 100 on the left and right sides are connected to the first mounting plate 310, the polished parts 100 on the left and right sides are staggered by a certain position, so that one end of the polished parts 100 on the left and right sides is located at the clearance groove 313 respectively. Figure 7 As shown in Figure (a), the angles of the workpieces 100 to be polished on the left and right sides can be detected simultaneously through the clearance grooves 313 at both ends, avoiding deviations between the reference and the workpiece machining surface due to gaps in the bonding, which would affect the final angle machining. In addition, the clearance grooves 313 divide the bottom plane 311 into multiple segments, which are distributed along the length of the first mounting plate 310. Since the multiple bottom plane segments 311 are on the same plane, when the bottom plane 311 is placed on the support surface 210 of the flat plate 200, only a few small areas contact the support surface 210 to achieve positioning. This avoids the problem of insufficient plane accuracy caused by using the entire lower surface as the positioning surface due to the large span, resulting in higher positioning accuracy.

[0083] Step S230: Place the first mounting plate and the workpiece to be polished on the flat plate for a second predetermined time to release the combined stress.

[0084] The second predetermined time can be 5 hours, so that the workpiece to be polished and the first matching plate are placed on the support surface of the flat plate (polishing plate) and left to stand for 5 hours, so as to ensure that the workpiece to be polished and the first matching plate naturally release the comprehensive stress. The comprehensive stress includes the internal stress of the workpiece to be polished itself, the stress caused by the operator's hand temperature contacting the workpiece to be polished and the stress after the polishing workpiece is pressed against the plate surface.

[0085] Step S240: After stress relief, the first mating part and the workpiece to be polished are bonded and fixed to form the first processing assembly.

[0086] Please see Figure 4 , Figure 5 Silicone is used to bond the parts. Silicone dots 320, approximately 3-4 mm in diameter and 2-3 mm thick, are extruded and applied at multiple locations. These dots are then used to bond and fix the parts at the junction of the first mating disc 310 and the part to be polished 100. (See [link to relevant documentation]). Figure 5The plurality of glue points 320 include: an end surface glue point 321 located on the edge of the two end surfaces of the workpiece 100, and a plurality of side surface glue points 322 located on the edge of the second machined surface 130 of the workpiece 100, and the plurality of side surface glue points 322 are evenly distributed. For example, one end surface glue point 321 is located on the edge of the front end surface of the workpiece 100 which is located on the positioning side surface 312, one end surface glue point 321 is located on the edge of the rear end surface of the workpiece 100 which is located on the positioning side surface 312, and five side surface glue points 322 are located on the edge of the first observation surface 120 (upper surface) of the workpiece 100 which is located on the positioning side surface 312, and the five side surface glue points 322 are evenly distributed in the length direction. Thus, the workpiece 100 can be stably fixed on the first chuck 310, and the space between the glue points provides space for the release of internal stress, which is not easy to cause surface deformation.

[0087] In step S300, after repeatedly raising and lowering the temperature of the first machining assembly placed on the flat disc, the first measurement value of the light ring shape of the surface shape of the first machined surface in the first machining assembly is detected.

[0088] Referring to Figure 3 , the internal stress in the glue layer and the internal stress in the workpiece itself during the bonding process are released through aging after repeatedly raising and lowering the temperature, and then the surface shape is detected. Step S300 specifically includes steps S310-S340, as follows:

[0089] In step S310, the temperature raising and lowering process is repeatedly cycled for a predetermined number of times to release the internal stress of the first machining assembly. Each temperature raising and lowering process includes: heating the first machining assembly to a second heating temperature and maintaining the temperature for a third predetermined time through an oven, and naturally lowering the temperature of the first machining assembly.

[0090] In the above process, the flat disc and the first machining assembly are placed in the oven, the second heating temperature is set, for example, 40-50℃, the temperature is maintained for a third predetermined time, for example, 2h, and the natural temperature raising and lowering is performed through the oven. The temperature raising and lowering process is repeatedly cycled 5 times.

[0091] In step S320, the first machining assembly is placed in a freezing environment at a predetermined temperature and maintained for a fourth predetermined time.

[0092] Subsequently, the flat disc and the first machining assembly are placed in a freezing environment at -5-10℃, and maintained for a fourth predetermined time, for example, 24h. Through this process, the residual stress of each part in the first machining assembly is removed, and the stress of the glue is also released, completing the aging process. Through the process of applying silicone + heating / cooling to accelerate aging and release stress, the firmness is ensured, the polishing area is increased, and the stress is introduced more small.

[0093] When stress release is performed by freezing aging, there is a risk of condensate water being generated on the two machined surfaces (the first machined surface and the second machined surface) of the workpiece to be polished. If the condensate water leaves corrosion marks on the first machined surface and the second machined surface, subsequent polishing of the first machined surface and the second machined surface will remove the corrosion marks. Therefore, freezing is used in this step to release stress to improve the stress release effect. In step S330, the first measured value is obtained by detecting the shape of the first machined surface of the first machining assembly.

[0094] The first measured value is obtained by detecting the shape of the first machined surface of the first machining assembly.

[0095] In step S400, a protective glue layer is applied to the first machining assembly.

[0096] The protective glue layer can be acetone glue. The acetone glue is applied to the machined (polished) surface of the workpiece to be polished in the first machining assembly by intermittent application. The acetone glue is applied by intermittent application, and each application is separated by a certain time interval, which can reduce the problem of large-scale surface shape change of the first machining assembly caused by collective shrinkage when the acetone glue is applied to the entire surface. In addition, during the gluing process of the first machining assembly, inverted application is performed. During the inverted application process, the excess acetone glue can slide down along the plane and fall off, thereby preventing the accumulation of excess acetone glue on the first machining assembly. Through the protective glue layer, the machined surface can be effectively protected. By using the intermittent application and inverted application of acetone glue, the product is protected while reducing stress introduction and reducing the impact on the surface shape of the workpiece to be polished.

[0097] In step S500, a second disc part is provided, and the connecting surface of the second disc part is abutted and fixed to the positioning side surface of the first disc part. The outer side surface of the second disc part protrudes from the second observation surface of the workpiece to be polished to form a second machining assembly.

[0098] Please refer to Figure 6The second disc member 410 can be square-shaped, and thus the second disc member 410 has a connecting surface 411 and an outer surface 412, which are opposite to each other, for example, the left and right side surfaces of the second disc. The second disc member 410 is provided with a plurality of members, and when the first processing assembly 300 has one piece 100 to be polished, the second disc member 410 is provided with two members. The two second disc members 410 are respectively fixed to the front and rear ends of the positioning side surface 312 of the first disc member 310 through the connecting surface 411, and the outer surfaces 412 of the two ends of the second disc respectively protrude from the second observation surface 140 of the piece 100 to be polished. The connecting surface 411 of the second disc member 410 is glued to the positioning side surface 312 of the first disc member 310 by using 502 glue, and the left and right widths of the second disc member 410 are greater than the left and right widths of the piece 100 to be polished, so that the outer surface 412 of the second disc member 410 protrudes from the second observation surface 140 of the piece 100 to be polished in the left and right directions, thereby forming the second processing assembly 400. When the second processing assembly 400 is directly removed from the flat disc 200 and then polished, the outer surface 412 of the second disc member 410 can prevent the piece 100 to be polished from directly contacting the ring polishing spacer 610, which can cause the piece 100 to be polished in the second processing assembly 400 to be loose, thereby affecting the processing progress.

[0099] In step S600, the second measurement value is obtained by detecting the shape of the first processing surface in the second processing assembly. The difference between the second measurement value and the first measurement value is obtained, and the variation of the number of laps is obtained.

[0100] The first processing surface of the piece to be polished on the second processing assembly is detected again, and the detection direction is two directions to ensure the adhesion firmness and the consistency of the surface shape of the piece to be polished. At this time, the product surface shape is the second measurement value, for example, the lap shape is -1.3 fr, and the error is 0.2 fr.

[0101] Therefore, by comparing the first measurement value and the second measurement value, the variation of the number of laps is calculated as -0.3 fr, and the error is 0.1 fr. That is, the adhesion process introduces a concave variation of the lap, and after the glue is removed, it will change to +0.3 fr, and the error variation is 0.1 fr. Therefore, during the processing process, -0.3 fr needs to be polished, and the error is 1.4 fr. Therefore, it can be concluded that how much the number of laps changes before and after the piece to be polished is adhered, and how much the lap is polished during the processing process, and the smaller the error is, the better.

[0102] In step S700, the second processing assembly is placed in the ring polishing spacer, and the first processing surface is polished on the ring polishing machine according to the predetermined polishing laps, wherein the predetermined polishing laps are equal to the variation of the number of laps.

[0103] Please refer to Figure 8In the processing, the second processing assembly 400 is placed in the marble spacer 600 of the ring polishing machine together with the ring polishing spacer 610, the correcting disc 620 of the ring polishing machine is adjusted, and the desired surface shape is obtained. The thickness of the ring polishing spacer must be greater than the thickness of the workpiece to be polished by 5-10 mm. In the polishing process, the polishing is carried out according to the change amount of the aperture number, and the compensation processing is realized, so that the surface shape quality after processing can be well guaranteed.

[0104] Referring to Figure 8 The ring polishing spacer 610 comprises a circular spacer disc 611, and a plurality of limiting grooves 612 are arranged side by side on the circular spacer disc 611. The limiting grooves 612 are rectangular, and each limiting groove 612 is used for placing a second processing assembly 400. The length direction of the limiting groove 612 is used for limiting the front and rear end faces of the first matching disc 310, and the width direction of the limiting groove 612 is used for limiting the outer side face 412 of the second matching disc 410. In this way, in the processing, the front and rear end faces and the left (right) side face of the workpiece 100 can be prevented from being in contact with the limiting grooves 612, and the workpiece 100 can be effectively protected.

[0105] Referring to Figure 4 , Figure 7 In addition, it is emphasized that the processing method can detect the angle and process the surface shape at the same time. Specifically, the fixed positions of the workpiece 100, the first matching disc 310 and the second matching disc 410 can be used to achieve this. When the left and right workpieces 100 are connected to the first matching disc 310, the left and right workpieces 100 are staggered at a certain position, for example, the front end face of the left workpiece 100 is located at the front air gap 313, and the rear end face of the right workpiece 100 is located at the rear air gap 313, so that one end of the left and right workpieces 100 is located in the middle of the air gap 313. In this way, in the polishing process, the angle of the left and right workpieces 100 can be directly detected through the air gaps 313 at both ends, and the two workpieces 100 are detected at the same time, which avoids the deviation of the positioning side face 312 and the first processing surface 110 of the workpiece 100 due to the gap, and affects the final angle processing.

[0106] Step S800: Soaking the polished second processing assembly to separate the first matching disc, the second matching disc and the polished workpiece and clean the surface.

[0107] Step S810: Detecting the surface aperture and error of the first processing surface of the polished workpiece by an interferometer to obtain a semi-finished product meeting the predetermined standard.

[0108] In the above process, the second machining assembly is soaked in acetone for 2 hours, the part surface is cleaned using acetone, and the first disc part, the second disc part, and the part to be polished are separated. After separation, the surface aperture and error of the part to be polished are detected using an interferometer. When the detection is qualified, the semi-finished part with the first machined surface is obtained.

[0109] Step S900, polishing the second machined surface of the semi-finished part. In this process, except that step S320 does not need to be frozen, the rest of the machining process is consistent with the machining process of the first machined surface.

[0110] Please refer to Figure 9 , the main steps are, for example:

[0111] Step S910, abutting the first machined surface of the semi-finished part against the positioning side surface of the first disc part, abutting the second machined surface of the semi-finished part against the flat disc, and fixing the semi-finished part and the first disc part to form a third machining assembly.

[0112] Step S920, cyclically repeating a predetermined number of temperature rising and falling processes, wherein each temperature rising and falling process includes: heating the third machining assembly to a second heating temperature by the oven and maintaining for a third predetermined time, and naturally cooling the third machining assembly.

[0113] In this step, no part freezing aging is needed, thereby avoiding the problem that water droplets in the air are easily generated on the surface of the part in a micro state when the part is taken out from a low temperature state to a room temperature state, thereby avoiding the problem that the water droplets are attached to the surface of the part to easily corrode the surface of the part to cause water marks and damage the surface of the part, affecting the subsequent use of the part.

[0114] Step S930, detecting the aperture shape of the surface shape of the second machined surface of the third machining assembly to obtain a third measurement value.

[0115] Step S940, applying a protective glue layer on the third machining assembly.

[0116] Step S950, abutting and fixing the connecting surface of the second disc part against the positioning side surface of the first disc part, abutting the outer side surface of the second disc part against the second observation window of the semi-finished part, and forming a fourth machining assembly.

[0117] Step S960, detecting the aperture shape of the surface shape of the second machined surface of the fourth machining assembly to obtain a fourth measurement value, and obtaining a second aperture number change amount according to the difference between the fourth measurement value and the third measurement value.

[0118] Step S970, placing the fourth machining assembly in the ring polishing spacer, and polishing the second machined surface on the ring polishing machine according to a predetermined polishing aperture number, wherein the predetermined polishing aperture number is equal to the second aperture number change amount.

[0119] In summary, the application provides a processing method for a cuboid strip-shaped optical component. The processing method is a compensation type processing. Annealing / freezing is used during bonding to release the stress of the to-be-polished component itself and the glue. Silicone and acetone glue are used for bonding to protect the component, ensure firmness, and reduce the surface shape change of the product. The scheme only requires the operator to be able to use traditional polishing equipment and to be able to bond, and the skill requirement for processing is not high. The scheme is suitable for the processing of long strip-shaped optical components by a general ring polishing machine.

[0120] The above only describes preferred embodiments of the application and is not intended to limit the application. Any modification, equivalent replacement, and improvement made within the spirit and principle of the application should be included in the protection scope of the application.

Claims

1. A method for processing a rectangular strip-shaped optical component, characterized in that, The method comprises the steps of: performing temperature rising and falling treatment on the polishing piece to eliminate internal stress of the polishing piece; providing a first chuck, placing the first chuck on a flat disc, abutting a second machining surface of the polishing piece against a positioning side surface of the first chuck, abutting a first machining surface of the polishing piece against the flat disc, and fixing the polishing piece and the first chuck to form a first machining assembly; after repeatedly performing temperature rising and falling treatment on the first machining assembly placed on the flat disc, detecting the light circle shape of the surface shape of the first machining surface in the first machining assembly to obtain a first measurement value; applying a protective glue layer on the first machining assembly; providing a second chuck, abutting and fixing a connecting surface of the second chuck against the positioning side surface of the first chuck, and protruding an outer side surface of the second chuck from a second observation surface of the polishing piece to form a second machining assembly; detecting the light circle shape of the surface shape of the first machining surface in the second machining assembly to obtain a second measurement value, and obtaining a light circle number change value according to the difference between the second measurement value and the first measurement value; placing the second machining assembly in a ring polishing spacer, and polishing the first machining surface on a ring polishing machine according to a predetermined polishing circle number, wherein the predetermined polishing circle number is equal to the light circle number change value; the step of detecting the light circle shape of the surface shape of the first machining assembly to obtain a first measurement value after repeatedly performing temperature rising and falling treatment on the first machining assembly comprises the steps of: cyclically repeating a predetermined number of times of temperature rising and falling processes, wherein each temperature rising and falling process comprises: heating the first machining assembly to a second heating temperature and keeping the first machining assembly at the second heating temperature for a third predetermined time through an oven, and naturally cooling the first machining assembly; placing the first machining assembly in a refrigerated environment at a predetermined temperature, and keeping the first machining assembly at the predetermined temperature for a fourth predetermined time; detecting the light circle shape of the surface shape of the first machining surface of the first machining assembly to obtain a first measurement value.

2. The method of processing a rectangular parallelepiped-shaped optical member according to claim 1, wherein In the step of performing temperature rising and falling treatment on the polishing piece to eliminate internal stress of the polishing piece, the polishing piece is repeatedly subjected to temperature rising and falling treatment a predetermined number of times, wherein each temperature rising and falling treatment comprises the steps of: heating the polishing piece to a first preset temperature and keeping the polishing piece at the first preset temperature for a first predetermined time; cooling the polishing piece.

3. The method of processing a rectangular parallelepiped-shaped optical member according to claim 1, wherein In the step of providing a first chuck, placing the first chuck on a flat disc, abutting a second machining surface of the polishing piece against a positioning side surface of the first chuck, abutting a first machining surface of the polishing piece against the flat disc, and fixing the polishing piece and the first chuck to form a first machining assembly, the bottom flat surface of the first chuck abutting against the flat disc and the positioning side surface are perpendicular to each other; the positioning side surface is provided with two positioning side surfaces, and the two positioning side surfaces are respectively located on both sides of the width direction of the first chuck, one second machining surface of the polishing piece is abutted against and fixed on one side of the positioning side surface of the first chuck, and the second machining surface of another polishing piece is abutted against and fixed on the other side of the positioning side surface of the first chuck. ​ 4. The method of processing a rectangular parallelepiped-shaped optical member according to Claim 1, wherein The step of providing a first adapter, placing the first adapter on a flat disc, abutting a second working surface of the workpiece against a positioning side of the first adapter, abutting a first working surface of the workpiece against the flat disc, and fixing the workpiece and the first adapter to form a first working assembly further comprises: abutting a bottom plane of the first adapter against a surface of the flat disc and observing a stripe; abutting the first working surface of the workpiece against the surface of the flat disc and observing a stripe, and abutting the second working surface of the workpiece against the positioning side of the first adapter and observing a stripe; resting the first adapter and the workpiece on the flat disc for a second predetermined time to release the overall stress; adhesively fixing the first adapter and the workpiece after the stress is released to form the first working assembly.

5. The method of processing a rectangular parallelepiped-shaped optical member according to claim 4, wherein The step of adhesively fixing the first adapter and the workpiece after the stress is released to form the first working assembly comprises: adhesively fixing a plurality of glue points at the joint of the first adapter and the workpiece, wherein the plurality of glue points include end surface glue points respectively located on the two side end surface edges of the workpiece and a plurality of side surface glue points located on the edge of the second working surface of the workpiece, and the plurality of side surface glue points are distributed at equal intervals.

6. The method of processing a rectangular parallelepiped-shaped optical member according to claim 1, wherein The step of applying a protective glue layer on the first working assembly comprises: applying the protective glue layer on the surface of the workpiece in the first working assembly by intermittent application.

7. The method of processing a rectangular parallelepiped-shaped optical member according to Claim 1, wherein The step of providing a second adapter, abutting and fixing a connecting surface of the second adapter against the positioning side of the first adapter, and protruding an outer side surface of the second adapter from a second observation surface of the workpiece to form a second working assembly comprises: the connecting surface and the outer side surface of the second adapter are opposite to each other, the second adapter is fixed at both ends of the length direction of the positioning side of the first adapter through the connecting surface, and the outer side surface of the second adapter protrudes from the second observation surface of the workpiece.

8. The method of processing a rectangular parallelepiped-shaped optical member according to claim 7, wherein The step of placing the second working assembly in a ring polishing spacer and polishing the first working surface on a ring polishing machine according to a predetermined polishing circle number further comprises: immersing the polished second working assembly to separate the first adapter, the second adapter and the polished workpiece and clean the surfaces; detecting the surface light circle and error of the first working surface of the polished workpiece by an interferometer to obtain a semi-finished product meeting a predetermined standard.

9. The method of processing a rectangular parallelepiped-shaped optical member according to claim 8, wherein The step of detecting the surface light circle and error of the first working surface after processing by an interferometer to meet a predetermined standard further comprises: abutting the first working surface of the semi-finished product against the positioning side of the first adapter, abutting the second working surface of the semi-finished product against the flat disc, and fixing the semi-finished product and the first adapter to form a third working assembly. The temperature increasing and decreasing process is repeated for a predetermined number of times, wherein each temperature increasing and decreasing process comprises: heating the third processing assembly to a second heating temperature by the oven and holding for a third predetermined time, and naturally cooling the third processing assembly; A third measurement value is obtained by detecting the light circle shape of the surface shape of the second processing surface of the third processing assembly; The connecting surface of the second dispensing disc is abutted and fixed against the positioning side surface of the first dispensing disc, and the outer side surface of the second dispensing disc protrudes from the first observation surface of the to-be-polished part to form a fourth processing assembly; A fourth measurement value is obtained by detecting the light circle shape of the surface shape of the second processing surface of the fourth processing assembly, and a second light circle number change amount is obtained according to the difference between the fourth measurement value and the third measurement value; The fourth processing assembly is placed in a ring polishing spacer, and the second processing surface is polished on a ring polishing machine according to a predetermined polishing circle number, wherein the predetermined polishing circle number is equal to the second light circle number change amount.

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