Optical module with spatially separated optical fiber and optical communication component and optical coupling architecture
By spatially separating the bent fiber array from the optical communication unit and the metal wire in the optical module, the interference problem between the bent fiber array, the optical communication unit and the metal wire is solved, and the space utilization and reliability of the optical module are improved.
Patent Information
- Application Number
- CN202410382876.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-01
- Publication Date
- 2025-10-14
AI Technical Summary
In existing optical modules, with the demands for high channel counts and miniaturization, the bent fiber arrays are prone to interference with optical communication units and metal wires, resulting in problems such as breakage or bending of the fiber ends.
By spatially spacing the bent optical fiber array from the optical communication unit and also spatially spacing it from the metal wire, the bent optical fiber array is elevated to a higher height to avoid contact with the optical communication unit and the metal wire.
This effectively avoids damage to optical communication units and metal wires caused by bending the optical fiber array, and improves the space utilization and reliability of the optical module.
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Figure CN120779537A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to an optical module and an optical coupling architecture, in particular, an optical module and an optical coupling architecture having an air gap between an optical fiber and an optical communication component. BACKGROUND
[0002] Optical modules are commonly installed in electronic communication equipment of modern high-speed communication networks. In order to promote the compatibility of global optical Internet products and reduce the maintenance burden, organizations such as Multi-Source Agreement (MSA), Institute of Electrical and Electronics Engineers (IEEE), and Optical Internetworking Forum (OIF) have developed several form factors suitable for different signal transmission rates. These form factors include, but are not limited to, 10Gbps XFP, 40Gbps QSFP (Quad Small Form Factor Pluggable), 100Gbps QSFP28, 400Gbps QSFP-DD (Double Density), 800Gbps QSFP-DD, 1.6Tbps OSFP (Octal Small Form Factor Pluggable), and 3.2Tbps CPO (Co-Packaged Optics).
[0003] However, there are still some problems to be overcome in the existing optical modules. SUMMARY
[0004] The present application provides an optical module that helps to solve the problems of existing optical modules. The present application also provides an optical coupling architecture suitable for optical modules.
[0005] The optical module disclosed by the present application includes a housing, a substrate, and an optical coupling architecture. The substrate is disposed in the housing. The optical coupling architecture includes an optical communication component and a bent optical fiber array. The optical communication component is disposed on the substrate. The optical communication component includes an optical communication unit and an electronic element, and the optical communication unit is electrically connected to the electronic element via a metal wire. The bent optical fiber array is optically coupled to the optical communication unit, and each of the bent optical fiber array, the optical communication unit, and the metal wire is spatially separated from each other.
[0006] The optical module further includes a housing, a substrate, and an optical coupling architecture. The substrate is disposed in the housing. The optical coupling architecture includes a first optical communication component, a second optical communication component, and a bent optical fiber array. The first optical communication component and the second optical communication component are disposed on the substrate. The second optical communication component includes an optical communication unit and an electronic element, and the optical communication unit is electrically connected to the electronic element via a metal wire. The bent optical fiber array spans the first optical communication component and is optically coupled to the optical communication unit of the second optical communication component, and the bent optical fiber array is spatially separated from each of the optical communication unit and the metal wire.
[0007] The optical module further includes a housing, a substrate, and an optical coupling architecture. The substrate is disposed in the housing. The optical coupling architecture includes a first optical communication component, a second optical communication component, and a bent optical fiber array. The first optical communication component and the second optical communication component are disposed on the substrate. The second optical communication component includes an optical communication unit and an electronic element, and the optical communication unit is electrically connected to the electronic element via a metal wire. The bent optical fiber array spans the first optical communication component and is optically coupled to the optical communication unit of the second optical communication component, and the bent optical fiber array is spatially separated from each of the optical communication unit and the metal wire.
[0008] According to the optical module and the optical coupling architecture disclosed in the present application, the bent optical fiber array is spatially separated from the optical communication unit and also spatially separated from the metal wire. Since the position of the bent optical fiber array is lifted to a higher height, the bent optical fiber array will not touch the optical communication unit and will not break or bend the metal wire.
[0009] The above description of the present application and the following description of the embodiments are used to demonstrate and explain the spirit and principles of the present application, and provide further explanation for the protection scope of the present application. BRIEF DESCRIPTION OF DRAWINGS
[0010] Figure 1 A schematic view of an optical module according to an embodiment of the present application.
[0011] Figure 2 A schematic view of an optical module according to an embodiment of the present application. Figure 1
[0012] A schematic view of an optical module according to an embodiment of the present application. Figure 3 Figure 1 A schematic view of an optical module according to an embodiment of the present application.
[0013] Figure 4 Figure 3 A schematic view of an optical coupling architecture according to an embodiment of the present application.
[0014] Figure 5 A schematic view of an optical coupling architecture according to an embodiment of the present application. Figure 4
[0015] A schematic view of an optical coupling architecture according to an embodiment of the present application. Figure 6
[0016] A schematic view of an optical coupling architecture according to an embodiment of the present application.Figure 7 Side view schematic of a light coupling architecture according to yet another embodiment of the application.
[0017] Figure 8 Side view schematic of a light coupling architecture according to yet another embodiment of the application.
[0018] Figure 9 Side view schematic of a light coupling architecture according to yet another embodiment of the application.
[0019] Figure 10 Schematic of an optical communication system according to an embodiment of the application.
[0020]
BRIEF DESCRIPTION OF DRAWINGS
[0021] Optical module 1
[0022] Housing 10
[0023] Light coupling member 20
[0024] Substrate 30
[0025] Main plate 31
[0026] Top surface 310
[0027] Sub-plate 32
[0028] Mounting surface 320
[0029] Carrier seat 330
[0030] Protrusion 331
[0031] Optical communication assembly 40, 50, 60
[0032] Optical communication unit 410, 510, 610
[0033] Optically active region 610a
[0034] Electronic component 420, 520, 620
[0035] Metal wire 61
[0036] Internal optical fiber 710, 720, 730
[0037] Bent portion 731
[0038] Bare fiber end portion 732
[0039] Light coupling architecture 80, 80a, 80b, 80c, 80d
[0040] Bent optical fiber array 81, 81b, 81c, 81d
[0041] Carrier seat 810
[0042] Base 811
[0043] Cover 812
[0044] Clamping block 813
[0045] Upper cover 82
[0046] Optical lens 90
[0047] Shortest distance d1, d2
[0048] Optical communication system 2
[0049] Carrier plate 21
[0050] External optical fiber 22
[0051] Special application integrated circuit chip 23 DETAILED DESCRIPTION
[0052] The detailed features and advantages of the present application are described in detail in the embodiments below, which are sufficient for those skilled in the art to understand the technical content of the present application and implement it, and those skilled in the art can easily understand the related purposes and advantages of the present application according to the content disclosed in the specification, the scope of protection and the drawings. The following examples further illustrate the concept of the present application, but do not limit the scope of the present application in any way.
[0053] Under the premise of meeting the size, as the demand for high channel number and miniaturization of optical modules increases, providing optical modules that can accommodate more active or passive elements related to optical communication is one of the problems that the related industry needs to solve. For some specific size, replacing the existing internal optical fiber or pigtail with a bent optical fiber array can improve the space utilization inside the optical module, so it is considered a viable solution. Optical communication active elements are usually electrically connected to each other by wire bonding, but configuring a bent optical fiber array can easily cause the optical fiber end to interfere with the wire in space, such as the optical fiber end may break or bend to the wire.
[0054] According to an embodiment of the present application, the bent optical fiber array is spaced apart from the optical communication unit in space, and also spaced apart from the metal wire in space. That is, the bent optical fiber array and the optical communication unit can have an air gap therebetween, and the bent optical fiber array and the metal wire can also have an air gap therebetween. Since the position of the bent optical fiber array is lifted to a higher height, the bent optical fiber array will not touch the optical communication unit, nor will it break or bend the metal wire.
[0055] One or more embodiments of the present application disclose some or all of the technical features, which can be combined to achieve the corresponding effects.
[0056] Please refer toFigures 1 to 3 wherein Figure 1 is a schematic view of an optical module according to an embodiment of the present application, Figure 2 is Figure 1 is a side view schematic of the optical module in Figure 3 is Figure 1 is a partial enlarged schematic view of the optical module in. In the present embodiment, the optical module 1 can include a housing 10, optical couplings 20, a substrate 30, optical communication components 40, optical communication components 50, optical communication components 60, and a plurality of internal optical fibers. In order to make the present application easy to be understood, Figure 3 the housing 10 is omitted. The optical module 1 can be understood as an optical transceiver.
[0057] The housing 10 can be a single housing, or the housing 10 can be a multi-part housing including an upper housing part and a lower housing part. The housing 10 can be a housing conforming to the CPO architecture developed by the OIF, but this shape and size are not intended to limit the present application.
[0058] The optical couplings 20 can be disposed in the housing 10. Further, at least a portion of the optical couplings 20 can be exposed externally. One end of the internal optical fibers can be coupled with the optical couplings 20. Figure 1 The optical module 1 is exemplarily illustrated as including three optical couplings 20, but the number of the optical couplings 20 is not intended to limit the present application. The optical couplings 20 can be understood as fiber joints or active optical cables (AOCs).
[0059] The substrate 30 can be a single printed circuit board assembly (PCBA), or can include a plurality of independent PCBAs. In the present embodiment, the substrate 30 can include a main board 31 and a sub-board 32. The main board 31 and the sub-board 32 can be disposed in the housing 10, and the sub-board 32 can be disposed on a top surface 310 of the main board 31. More specifically, the sub-board 32 can be fixed to the top surface 310 to allow electrical connection between circuits of the sub-board 32 and the main board 31. In addition, the sub-board 32 can have a mounting surface 320 with respect to the top surface 310. Further, the mounting surface 320 can be a top surface of the sub-board 32.
[0060] The optical communication components 40 can be disposed in the substrate 30. Further, the optical communication components 40 can include optical communication units 410 disposed on the top surface 310 of the main board 31 and electronic elements 420. The optical communication units 410 are, for example, laser diodes, and the electronic elements 420 are, for example, driving chips. Further, the electronic elements 420 can be understood as photonic integrated circuits (PICs). The optical communication components 40 can additionally include optical modulators, wavelength division multiplexers, collimating lenses, and / or digital signal processors (DSPs). Figure 1Two optical communication assemblies 40 are shown as examples, and each of the optical communication assemblies 40 includes two optical communication units 410, but the number of the optical communication assemblies 40 is not intended to limit the present application.
[0061] The optical communication assembly 50 can be disposed on the substrate 30. Further, the optical communication assembly 50 can include an optical communication unit 510 and an electronic element 520 disposed on the mounting surface 320 of the sub-board 32. The optical communication unit 510 is, for example, a laser diode, and the electronic element 520 is, for example, a driving chip. Further, the electronic element 520 can be understood as a PIC. The optical communication assembly 50 can further include an optical modulator, a wavelength division multiplexer, a collimating lens, and / or a digital signal processor (DSP). Figure 1 Two optical communication assemblies 50 are shown as examples, and each of the optical communication assemblies 50 includes two optical communication units 510, but the number of the optical communication assemblies 50 is not intended to limit the present application.
[0062] The optical communication assembly 60 can be disposed on the substrate 30. Further, the optical communication assembly 60 can include an optical communication unit 610 and an electronic element 620 disposed on the top surface 310 of the main board 31. The optical communication unit 610 is, for example, a photodiode, and the electronic element 620 is, for example, a transimpedance amplifier. Further, the electronic element 620 can be understood as an electronic integrated circuit (EIC). The optical communication unit 610 can be electrically connected to the electronic element 620 via the metal wire 61, that is, the optical communication unit 610 can be connected to the electronic element 620 by wire bonding. The optical communication assembly 60 can further include a wavelength division demultiplexer and / or a DSP. Figure 3 Eight optical communication assemblies 60 are shown as examples, and each of the optical communication assemblies 60 includes four optical communication units 610, but the number of the optical communication assemblies 60 is not intended to limit the present application. In addition, Figure 3 The eight optical communication assemblies 60 are also shown in a double-row arrangement in which four assemblies form a row, but the present application is not limited thereto.
[0063] In some embodiments, the optical communication unit 410 of the optical communication assembly 40 can be a photodiode, and the electronic element 420 can be a transimpedance amplifier. In some embodiments, the optical communication unit 510 of the optical communication assembly 50 can be a photodiode, and the electronic element 520 can be a transimpedance amplifier. In some embodiments, the optical communication unit 610 of the optical communication assembly 60 can be a laser diode, and the electronic element 620 can be a driving chip.
[0064] In some embodiments, the optical module 1 can not include the optical communication assembly 40 or the optical communication assembly 50 as shown in FIG. 4A. Figure 1 In some embodiments, the optical module 1 can not include the optical communication assembly 40 or the optical communication assembly 50 as shown in FIG. 4A. Figure 1The optical communication assembly 40 and the optical communication assembly 50 are shown, and only the optical communication assembly 60 is included.
[0065] In some embodiments, the optical communication assemblies 40, 50 can be understood as a Transmitting Optical Sub-Assembly (TOSA). In some embodiments, the optical communication assembly 60 can be understood as a Receiver Optical Sub-Assembly (ROSA).
[0066] The internal optical fibers can be understood as pigtails or jumpers. The internal optical fibers can include an internal optical fiber 710 optically coupling the optical communication assembly 40 with the optical coupling member 20, an internal optical fiber 720 optically coupling the optical communication assembly 50 with the optical coupling member 20, and an internal optical fiber 730 optically coupling the optical communication assembly 60 with the optical coupling member 20. Figure 1 Four internal optical fibers 710, four internal optical fibers 720, and eight internal optical fibers 730 are exemplarily shown, and the number of the internal optical fibers is not intended to limit the present disclosure.
[0067] In the present embodiment, the optical coupling architecture 80 of the optical module 1 can include the aforementioned optical communication assembly 60 and a bent optical fiber array 81 including the internal optical fiber 730. Please refer to Figure 4 and Figure 5 wherein Figure 4 is a front view schematic diagram of the optical coupling architecture in Figure 3 , and Figure 5 is a side view schematic diagram of the optical coupling architecture in Figure 4 . As shown in Figure 2 , Figure 4 and Figure 5 , the bent optical fiber array 81 can include a carrier 810 and the internal optical fiber 730. The internal optical fiber 730 is disposed in the carrier 810 and optically coupled with the optical communication unit 610 of the optical communication assembly 60. The carrier 810 accommodates the internal optical fiber 730 and causes the internal optical fiber 730 to be bent. Further, the carrier 810 can include a base 811, a cover 812, and the internal optical fiber 730. The internal optical fiber 730 is disposed between the base 811 and the cover 812. The base 811 can have a groove, more specifically a V groove, to accommodate the internal optical fiber 730. The carrier 810 can further include a clamp 813 to cause the internal optical fiber 730 to form a bent portion 731.
[0068] The bent optical fiber array 81 is spatially separated from each of the optical communication unit 610 and the metal wire 61. As shown in Figure 4 and Figure 5As shown, the inner optical fiber 730 has a bare fiber end portion 732, and at least a portion of the bare fiber end portion 732 protrudes toward the optical communication unit 610 beyond the base 811. Each of the base 811, the cover 812, and the bare fiber end portion 732 is spatially separated from each of the optical communication unit 610 and the metal wire 61. Further, the "spatially separated" means that two objects do not directly contact each other, and there is no intermediate object between the two objects so that they are indirectly contacted.
[0069] More specifically, an upper surface of the optical communication unit 610 has an optically effective region 610a adjacent to the metal wire 61, and the optically effective region 610a can be understood as a light emitting region of a laser diode or a light receiving region of a photodiode. The base 811 has an end surface facing the optically effective region 610a, and the end surface is spatially separated from the optically effective region 610a. The cover 812 has an end surface facing the optically effective region 610a, and the end surface is spatially separated from the optically effective region 610a. An end surface of the bare fiber end portion 732 is spatially separated from the optically effective region 610a. The end surface of the base 811 is spatially separated from the metal wire 61. The end surface of the cover 812 is spatially separated from the metal wire 61. The end surface of the bare fiber end portion 732 is spatially separated from the metal wire 61.
[0070] According to an embodiment of the present application, the carrier 810 of the bent optical fiber array 81 can be supported by the substrate 30. As shown, Figure 4 The main plate 31 of the substrate 30 can include a carrier 330 for carrying the optical communication assembly 60, and the carrier 330 can have two protrusions 331. At least one of the base 811 and the cover 812 of the carrier 810 is supported by the protrusions 331. In this way, the bent optical fiber array 81 can be spatially separated from the optical communication unit 610 and the metal wire 61.
[0071] Since the position of the bent optical fiber array 81 is lifted to a higher height, the bent optical fiber array 81 will not touch the optical communication unit 610, nor will it break or bend the metal wire 61. In the present embodiment, the protrusions 331 of the substrate 30 maintain the position of the bent optical fiber array 81 at a height that will not touch the optical communication unit 610 and the metal wire 61, but any technical means that can lift the bent optical fiber array 81 can be considered as falling within the scope of the present application.
[0072] According to an embodiment of the present application, the optical module 1 can further include an upper cover 82 disposed above the optical communication assembly 40 or the optical communication assembly 50. As shown, Figure 1 and Figure 2 The inner optical fiber 730 of the bent optical fiber array 81 spans the optical communication assembly 40 and the optical communication assembly 50, and also spans the upper cover 82. The upper cover 82 helps to prevent the optical fiber from interfering with the optical transmission of the optical communication assembly located below.
[0073] The light coupling architecture of the optical module is not limited to the illustrated embodiments. Please refer to the following embodiments. Figure 5 Figure 6 FIG. 8B is a side view schematic diagram of a light coupling architecture according to another embodiment of the present application. In this embodiment, the light coupling architecture 80a applicable to the optical module can include the optical communication assembly 60, the bent fiber array 81, and further include the optical lens 90. The optical lens 90 is disposed on at least one of the base 811 and the cover 812 of the bent fiber array 81, and at least a portion of the optical lens 90 is between the internal fiber 730 and the optical communication unit 610. More specifically, the end face of the bare fiber end portion 732 of the internal fiber 730 is flush with the end face of the base 811 and the end face of the cover 812. The optical lens 90 is disposed at the interface between the end face of the base 811 and the end face of the cover 812, and the optical lens 90 is spatially separated from the optical communication unit 610 and the metal wire 61. The optical lens 90 can improve the light coupling efficiency between the internal fiber 730 and the optical effective area 610a of the optical communication unit 610.
[0074] Please refer to the following embodiments. Figure 7 FIG. 8C is a side view schematic diagram of a light coupling architecture according to yet another embodiment of the present application. In this embodiment, the light coupling architecture 80b applicable to the optical module can include the optical communication assembly 60 and the bent fiber array 81b. Unlike the bent fiber array 81 of FIG. 8A, Figure 5 The bent fiber array 81b does not include the cover 812. The bent fiber array 81b includes the base 811, the internal fiber 730, and the clamping block 813. The internal fiber 730 is disposed on the base 811. The base 811 can have a V-shaped groove accommodating the internal fiber 730. The clamping block 813 causes the internal fiber 730 to form the bent portion 731. Figure 7 Please refer to the following embodiments.
[0075] FIG. 8D is a side view schematic diagram of a light coupling architecture according to still another embodiment of the present application. In this embodiment, the light coupling architecture 80c applicable to the optical module can include the optical communication assembly 60 and the bent fiber array 81c. The shortest distance d1 between the base 811 of the bent fiber array 81c and the optical communication unit 610 can be less than the shortest distance d2 between the cover 812 and the optical communication unit 610. Further, the shortest distance d1 can be understood as the vertical distance from the end face of the base 811 to the optical effective area 610a of the optical communication unit 610, and the shortest distance d2 can be understood as the vertical distance from the end face of the cover 812 to the optical effective area 610a. More specifically, the end face of the base 811 can be closer to the optical effective area 610a of the optical communication unit 610 than the end face of the cover 812. Figure 8 Please refer to the following embodiments.
[0076] FIG. 8D is a side view schematic diagram of a light coupling architecture according to still another embodiment of the present application. In this embodiment, the light coupling architecture 80c applicable to the optical module can include the optical communication assembly 60 and the bent fiber array 81c. The shortest distance d1 between the base 811 of the bent fiber array 81c and the optical communication unit 610 can be less than the shortest distance d2 between the cover 812 and the optical communication unit 610. Further, the shortest distance d1 can be understood as the vertical distance from the end face of the base 811 to the optical effective area 610a of the optical communication unit 610, and the shortest distance d2 can be understood as the vertical distance from the end face of the cover 812 to the optical effective area 610a. More specifically, the end face of the base 811 can be closer to the optical effective area 610a of the optical communication unit 610 than the end face of the cover 812. Figure 9 FIG. 8 is a side view of a light coupling architecture according to another embodiment of the present application. In this embodiment, the light coupling architecture 80d for a light module can include the optical communication component 60 and a bent fiber array 81d. The shortest distance dl between the base 811 of the bent fiber array 81d and the optical communication unit 610 can be greater than the shortest distance d2 between the cover 812 and the optical communication unit 610. More specifically, the end face of the cover 812 can be closer to the optically active region 610a of the optical communication unit 610 than the end face of the base 811.
[0077] Figure 10 FIG. 1 is a schematic diagram of an optical communication system according to an embodiment of the present application. The optical communication system 2 can include a light module 1 as shown in FIG. 2 and can be mounted on a carrier board 21 including an application specific integrated circuit (ASIC) chip 23. The optical interface of the light module 1 can be optically coupled with an external optical fiber 22, and the electrical interface of the light module 1 can be electrically connected with the ASIC chip 23. Figure 1 FIG. 1 is a schematic diagram of an optical communication system according to an embodiment of the present application. The optical communication system 2 can include a light module 1 as shown in FIG. 2 and can be mounted on a carrier board 21 including an application specific integrated circuit (ASIC) chip 23. The optical interface of the light module 1 can be optically coupled with an external optical fiber 22, and the electrical interface of the light module 1 can be electrically connected with the ASIC chip 23. Figure 10 An exemplary optical communication system 2 including a total of sixteen light modules 1 is shown, where each light module 1 can have a signal transmission rate of 3.2 Tbps, and the ASIC chip 23 can have a signal transmission rate of 51.2 Tbps.
Claims
1. An optical module, characterized in that: Include: a housing; a substrate disposed in the housing; and An optical coupling structure, comprising: an optical communication component disposed on the substrate, the optical communication component comprising an optical communication unit and an electronic component, wherein the optical communication unit is electrically connected to the electronic component via a metal wire; as well as A bent optical fiber array is optically coupled to the optical communication unit, and the bent optical fiber array is spatially separated from each of the optical communication unit and the metal wire.
2. The optical module according to claim 1, wherein: The optical communication unit includes a photodiode, and the electronic component includes a transimpedance amplifier.
3. The optical module according to claim 1, wherein: The base plate has two protrusions. The bent optical fiber array includes a supporting seat and an optical fiber. The optical fiber is arranged on the supporting seat and optically coupled with the optical communication unit. The supporting seat is supported by the two protrusions.
4. The optical module according to claim 1, wherein: The bent optical fiber array includes a base, a cover, and an optical fiber. The optical fiber is arranged between the base and the cover and optically coupled to the optical communication unit. The base has a groove for accommodating the optical fiber. The optical fiber has a bending portion, and each of the base, the cover, and the optical fiber is spatially separated from each of the optical communication unit and the metal wire.
5. The optical module according to claim 4, wherein: The optical fiber has a bare fiber end portion, and at least a portion of the bare fiber end portion protrudes from the base toward the optical communication unit.
6. The optical module according to claim 4, wherein: The bent optical fiber array further includes an optical lens. The optical lens is disposed on at least one of the base and the cover, and at least a portion of the optical lens is located between the optical fiber and the optical communication unit.
7. The optical module according to claim 4, wherein: The shortest distance between the base and the optical communication unit is smaller than the shortest distance between the cover and the optical communication unit.
8. The optical module according to claim 4, wherein: The shortest distance between the base and the optical communication unit is greater than the shortest distance between the cover and the optical communication unit.
9. The optical module according to claim 1, wherein: The bent optical fiber array includes a base and an optical fiber, which is arranged on the base and optically coupled to the optical communication unit. The base has a groove for accommodating the optical fiber, and the optical fiber has a bending portion, and each of the base and the optical fiber is spatially separated from each of the optical communication unit and the metal wire.
10. An optical module, characterized in that: Include: a housing; a substrate disposed in the housing; and An optical coupling structure, comprising: A first optical communication component and a second optical communication component are disposed on the substrate, wherein the second optical communication component includes an optical communication unit and an electronic component, and the optical communication unit is electrically connected to the electronic component via a metal wire; as well as A bent optical fiber array spans the first optical communication component and is optically coupled to the optical communication unit of the second optical communication component. The bent optical fiber array is spatially separated from each of the optical communication unit and the metal wire.
11. The optical module according to claim 10, wherein: The first optical communication component includes a laser diode, the optical communication unit of the second optical communication component includes a photodiode, and the electronic component of the second optical communication component includes a transimpedance amplifier.
12. The optical module according to claim 10, wherein: The base plate has two protrusions. The bent optical fiber array includes a supporting seat and an optical fiber. The optical fiber is arranged on the supporting seat, and the supporting seat is supported by the two protrusions.
13. The optical module according to claim 10, wherein: It further comprises a top cover disposed above the first optical communication component, wherein an optical fiber of the bent optical fiber array is optically coupled with the optical communication unit of the second optical communication component, and the optical fiber spans the top cover.
14. An optical coupling structure in an optical module, characterized in that: Include: An optical communication assembly, comprising an optical communication unit and an electronic component, wherein the optical communication unit is electrically connected to the electronic component via a metal wire; and A bent optical fiber array is optically coupled to the optical communication unit, and the bent optical fiber array is spatially separated from each of the optical communication unit and the metal wire.
15. The optical coupling structure in the optical module according to claim 14, wherein: The optical communication unit includes a photodiode, and the electronic component includes a transimpedance amplifier.
16. The optical coupling structure in the optical module according to claim 14, wherein: The bent optical fiber array includes a base, a cover, and an optical fiber. The optical fiber is arranged between the base and the cover and optically coupled to the optical communication unit. The base has a groove for accommodating the optical fiber. The optical fiber has a bending portion, and each of the base, the cover, and the optical fiber is spatially separated from each of the optical communication unit and the metal wire.
17. The optical coupling structure in the optical module according to claim 14, wherein: The bent optical fiber array includes a base and an optical fiber, which is arranged on the base and optically coupled to the optical communication unit. The base has a groove for accommodating the optical fiber, and the optical fiber has a bending portion, and each of the base and the optical fiber is spatially separated from each of the optical communication unit and the metal wire.