Film laminating machine for semiconductor wafer processing

Abstract

The application relates to the technical field of wafer film coating equipment, and discloses a film coating machine for semiconductor wafer processing, which comprises a base, the middle part of the top end of the base is sequentially provided with an inner support plate, a support ring plate and an elastic support device from inside to outside, the support ring plate is movably arranged relative to the inner support plate and the elastic support device, and the top parts of the inner support plate, the support ring plate and the elastic support device are flush in a normal state, a film pressing assembly is movably arranged above the support ring plate, a rubber ring and a tool holder are arranged on the film pressing assembly, and a blade is arranged on the tool holder. After the film pressing assembly moves downward, the inner side of the rubber ring cooperates with the outer side of the inner support plate to straighten the film material, the blade arranged on the outer side of the inner support plate is used to rotate around the inner support plate to cut the film material, the film material adsorbed on the wafer surface is not prone to wrinkles during the cutting of the film material, the elimination of the air bubbles in the film material above the wafer is facilitated, and therefore the film coating effect of the wafer is improved.

Description

Technical Field

[0001] This application relates to the field of wafer coating equipment technology, and more particularly to a coating machine for semiconductor wafer processing. Background Technology

[0002] Wafer coating machines are core equipment in semiconductor manufacturing, photovoltaic industry and other fields. They are used to precisely apply protective films (such as blue film, UV film) to the surface of wafers to prevent contamination or damage to the wafer surface during subsequent processes (cutting, thinning, dicing, etc.). The wafer is fixed by vacuum adsorption and the film is flatly applied to the wafer surface. The pressure roller is rotated to eliminate air bubbles in the film above the wafer. The film is then cut with a blade. In order to solve the problem of film wrinkling that is easy to occur during cutting, the existing technology uses a hot ring cutter.

[0003] For example, Chinese invention patent CN115339093B discloses a fully automatic wafer coating machine. Through the cooperation between the molding assembly and the fixed angle assembly, the BG film is controlled to be in a flat state before coating, and the angle between the BG film and the coating platform between the molding roller and the fixed angle roller remains unchanged. The molding roller can remove the air under the BG film to avoid wrinkles. When cutting the BG film, a hot-cutting ring cutter assembly is used, which can use heated blades to cut the BG film and avoid wrinkles caused by the ring cutter during the cutting process.

[0004] However, in existing technologies, although a hot ring cutter is used, the cutter makes a ring cut directly above the film material. The real-time change in the direction of the blade during cutting still easily causes the film material adsorbed on the wafer surface to wrinkle due to the pulling force during cutting. Furthermore, in existing technologies, a pressure roller rotates above the film material on the wafer, and a vacuum is drawn from below the wafer to eliminate air bubbles. However, when the pressure roller rotates, it easily flattens the air bubbles in the film material, causing wrinkles to still appear in the flattened areas, thus reducing the wafer coating effect. Summary of the Invention

[0005] This application proposes a coating machine for semiconductor wafer processing, which has the advantage of not easily causing wrinkles in wafer coating, in order to solve the problem that existing equipment, despite using pressure rollers to eliminate air bubbles and using ear-shaped cutters to cut the film material, is still prone to wrinkles in the film material, which affects the wafer coating effect.

[0006] To achieve the above objectives, this application adopts the following technical solution: a coating machine for semiconductor wafer processing, comprising a base, on which a first movable seat and a second movable seat that can move horizontally are provided, and a film pressing shaft located above the base is provided on the inner side of the first movable seat, and a film taking shaft located above the base is provided on the inner side of the second movable seat. An inner support plate, a support ring plate and an elastic support device are provided sequentially from the inside to the outside at the middle of the top of the base, wherein the support ring plate is movably arranged relative to the inner support plate and the elastic support device, and the tops of the inner support plate, the support ring plate and the elastic support device are flush under normal conditions, and a film pressing assembly is movably arranged directly above the support ring plate.

[0007] The film pressing assembly includes a lower ring plate, with a rubber ring on the inner edge of the top of the lower ring plate, and an outer sleeve plate located outside the lower ring plate on the top of the lower ring plate. A rotating ring plate is movably mounted on the inner side of the outer sleeve plate via a bearing. The rotating ring plate is driven to rotate by a motor. A blade holder is movably mounted on one side of the bottom of the rotating ring plate, with a blade on the side of the blade holder facing the inner support plate. A cylinder is provided on the rotating ring plate to push the blade holder to move horizontally.

[0008] Furthermore, a surrounding plate is fixedly installed on the top of the base, and an outer support plate is fixedly installed on the top of the surrounding plate. A circular groove is opened on the outer support plate, and the support ring plate and the inner support plate are both located in the circular groove of the outer support plate. Several ventilation holes are opened on the outer support plate so that when the inner side of the surrounding plate is vacuumed, the membrane material can be attached to the surface of the outer support plate by utilizing the ventilation holes opened on the outer support plate.

[0009] Furthermore, an elastic support device is movably installed on the base, and there are no fewer than two elastic support devices. Each elastic support device includes a movable support shaft movably fitted on the base. The connection between the movable support shaft and the base is sealed. The top end of the movable support shaft is fixedly connected to the bottom of the support ring plate. A spring is movably fitted on the movable support shaft between the base and the support ring plate. A stop block located below the base is fixedly installed at the bottom end of the movable support shaft. Under normal conditions, the elastic force of the spring keeps the support ring plate moving upward. Combined with the limiting effect of the stop block at the bottom of the base, the top of the support ring plate and the top of the outer support plate are on the same plane. When the pressure film assembly moves downward, it will push the support ring plate downward.

[0010] Furthermore, the film pressing assembly also includes an upper ring plate fixedly installed on the top of the lower ring plate. An inner sleeve plate is fixedly installed on the inner edge of the bottom of the upper ring plate. At least one centimeter gap is reserved between the top of the rubber ring and the bottom of the inner sleeve plate. A gear ring is fixedly installed on the top of the rotating ring plate. A motor is fixedly installed on one side of the top of the upper ring plate. The output shaft of the motor extends to the bottom of the upper ring plate and a gear is fixedly installed thereon. The outer teeth of the gear mesh with the outer teeth of the gear ring. By moving the film pressing assembly downward, the rubber ring engages with the outer side of the inner support plate, straightening the film material placed on the wafer on the inner support plate to eliminate air bubbles. The output shaft driven by the motor drives the gear to rotate, thereby driving the gear ring and the rotating ring plate to rotate together, and then driving the cutter holder on the rotating ring plate to rotate together. The blade on one side of the cutter holder cuts the film material on the outer side of the inner support plate.

[0011] Furthermore, the inner and outer sides of the bottom of the lower ring plate are designed with smooth chamfers to prevent the inner and outer sides of the bottom of the lower ring plate from bulging and breaking the film material after the entire film pressing assembly moves down.

[0012] Furthermore, a limiting ring is fixedly installed on the lower ring plate, located on the outside of the rubber ring. The limiting ring limits the rubber ring on the outside, ensuring that the inside of the rubber ring can cooperate with the outside of the lower ring plate to clamp the membrane material. After the entire pressing assembly moves down, it is beneficial to straighten the membrane material.

[0013] Furthermore, the rotating ring plate has two sliding grooves, and a sliding shaft is movably fitted in each of the two grooves. The bottom end of the sliding shaft is fixedly connected to the tool holder, and the top end of the sliding shaft is fixedly connected to a sliding block located above the rotating ring plate. One side of the sliding block is fixedly connected to one end of the piston shaft on the cylinder. The cylinder drives the piston shaft to move the sliding block horizontally, which in turn drives the tool holder to move horizontally. At the same time, the sliding grooves limit the sliding shaft, allowing the rotating ring plate to drive the sliding shaft and the tool holder to rotate together around the outside of the inner support plate, so that the blade on the tool holder can cut the film material on the outside of the inner support plate.

[0014] Furthermore, the inner support plate has several through holes, and two ejector cylinders are fixedly installed at the bottom of the base. The top ends of the piston shafts of the two ejector cylinders are fixedly connected to the ejector ring plate. The top of the ejector ring plate is fixedly installed with vertical shafts that correspond one-to-one with the number of through holes on the inner support plate. The top end of the vertical shaft is fixedly connected to a support block located in the through hole. The ejector cylinders drive the piston shafts to push the ejector ring plate and the vertical shaft upward, so that the support block moves above the inner support plate, making it easier to place the wafer onto the inner support plate.

[0015] The beneficial effects of this invention are as follows:

[0016] 1. This application provides a coating machine for semiconductor wafer processing. From the inside out, an inner support plate, a support ring plate, and an elastic support device are sequentially arranged at the center of the top of the base. The support ring plate is movably arranged relative to the inner support plate and the elastic support device. In conjunction with a film pressing assembly positioned above the inner support plate, the downward movement of the film pressing assembly allows the inner side of the rubber ring to engage with the outer side of the inner support plate, straightening the film material placed above the wafer on the inner support plate. Combined with vacuum treatment below the film material, compared to existing coating machines that use pressure rollers, this method facilitates the elimination of air bubbles in the film material above the wafer and avoids wrinkles at air bubbles caused by the rotation of the pressure rollers, thereby improving the wafer coating effect.

[0017] 2. The semiconductor wafer processing coating machine provided in this application, after the film pressing assembly moves down, the inner side of the rubber ring and the outer side of the inner support plate straighten the film material. Then, the blade set on the outer side of the inner support plate rotates around the inner support plate to cut the film material. Compared with the existing coating machines that directly cut the film material from above, the real-time change of the blade direction during cutting can easily cause the film material adsorbed on the wafer surface to wrinkle due to the pulling force during cutting. This method makes it less likely for the film material adsorbed on the wafer surface to wrinkle during film cutting. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort:

[0019] Figure 1 This is a schematic diagram of the structure of the present invention;

[0020] Figure 2 for Figure 1 A schematic diagram of the cross-sectional structure of the middle base and the pressure film assembly;

[0021] Figure 3 for Figure 2 A schematic diagram of the structure after the membrane material has been removed.

[0022] Figure 4 for Figure 2 A schematic diagram of the elastic support device in the middle;

[0023] Figure 5 for Figure 2 Schematic diagram of a medium-pressure membrane module;

[0024] Figure 6 for Figure 5 A magnified schematic diagram of the structure at point A in the diagram;

[0025] Figure 7 for Figure 2 A schematic diagram of the internal support plate structure;

[0026] Figure 8 for Figure 2 A schematic diagram of the state of the medium-pressure membrane module after the membrane material is pressed down;

[0027] Figure 9 for Figure 8 A magnified schematic diagram of the structure at point B.

[0028] In the diagram: 1. Base; 2. Enclosure; 3. Outer support plate; 4. Inner support plate; 5. Elastic support device; 501. Movable support shaft; 502. Spring; 503. Stop block; 6. Support ring plate; 7. Support frame; 8. Lifting cylinder; 9. Film pressing assembly; 901. Upper ring plate; 902. Inner sleeve plate; 903. Outer sleeve plate; 904. Lower ring plate; 905. Rubber ring; 906. Limiting ring; 10. Rotating ring plate; 101. Slide groove; 11. Gear ring; 12. Motor; 13. Gear; 14. Knife holder; 15. Sliding block; 16. Cylinder; 17. Ejection cylinder; 18. Ejection ring plate; 19. Vertical shaft; 20. Support block; 21. First moving seat; 22. Second moving seat; 23. Film pressing shaft; 24. Film taking shaft. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Example 1, as Figures 1-3 A coating machine for semiconductor wafer processing includes a base 1, a surrounding plate 2 fixedly installed on the top of the base 1, an outer support plate 3 fixedly installed on the top of the surrounding plate 2, a circular groove in the middle of the outer support plate 3, an inner support plate 4 fixedly installed on the top of the base 1 in the middle of the circular groove of the outer support plate 3, and the top of the inner support plate 4 and the top of the outer support plate 3 are on the same plane. An elastic support device 5 is movably installed on the base 1, and there are at least two elastic support devices 5. The top of the elastic support device 5 is fixedly installed on a support ring plate 6, which is located inside the outer support plate 3 and outside the inner support plate 4. The inner side of the support ring plate 6 does not contact the outer side of the inner support plate 4, and the outer side of the support ring plate 6 does not contact the inner side of the outer support plate 3. Under normal conditions, the top of the support ring plate 6 is also on the same plane as the top of the outer support plate 3.

[0031] Please see Figures 3-4 The elastic support device 5 includes a movable support shaft 501 movably mounted on the base 1. The connection between the movable support shaft 501 and the base 1 is sealed. The top end of the movable support shaft 501 is fixedly connected to the bottom of the support ring plate 6. A spring 502 is movably mounted on the movable support shaft 501 between the base 1 and the support ring plate 6. A stop block 503 located below the base 1 is fixedly installed at the bottom end of the movable support shaft 501. Under normal conditions, the elastic force of the spring 502 keeps the support ring plate 6 moving upward. With the limiting effect of the stop block 503 at the bottom of the base 1, the top of the support ring plate 6 and the top of the outer support plate 3 are on the same plane.

[0032] Please continue reading. Figures 1-3 , Figures 5-6 A support frame 7 is fixedly installed on the base 1. Two lifting cylinders 8 are fixedly installed on the support frame 7. The piston shafts of the two lifting cylinders 8 are fixedly connected to a pressure film assembly 9. The pressure film assembly 9 includes an upper ring plate 901. An inner sleeve plate 902 is fixedly installed on the inner edge of the bottom of the upper ring plate 901. An outer sleeve plate 903 is fixedly installed on the outer edge of the bottom of the upper ring plate 901. A lower ring plate 904 is fixedly installed at the bottom of the outer sleeve plate 903. The inner and outer sides of the bottom of the lower ring plate 904 are designed with smooth chamfers. A rubber ring 905 is fixedly installed on the inner edge of the top of the lower ring plate 904. At least one centimeter gap is reserved between the top of the rubber ring 905 and the bottom of the inner sleeve plate 902. A limiting ring 906 located outside the rubber ring 905 is fixedly installed on the lower ring plate 904.

[0033] A rotating ring plate 10 is movably mounted on the inner side of the outer sleeve plate 903 via a bearing. A gear ring 11 is fixedly mounted on the top of the rotating ring plate 10. A motor 12 is fixedly mounted on one side of the top of the upper ring plate 901. The output shaft of the motor 12 extends to the lower part of the upper ring plate 901 and a gear 13 is fixedly mounted thereon. The outer teeth of the gear 13 mesh with the outer teeth of the gear ring 11. The output shaft driven by the motor 12 drives the gear 13 to rotate, thereby driving the gear ring 11 and the rotating ring plate 10 to rotate together.

[0034] Two sliding grooves 101 are provided on the rotating ring plate 10. Sliding shafts are movably fitted in the two sliding grooves 101 respectively. A blade holder 14 is fixedly installed at the bottom end of the sliding shaft. A blade is provided on one side of the blade holder 14. The blade is located between the rubber ring 905 and the inner sleeve plate 902. A sliding block 15 is fixedly installed at the top end of the sliding shaft. A cylinder 16 is fixedly installed on the rotating ring plate 10, located on one side of the sliding block 15. The piston shaft of the cylinder 16 is fixedly connected to the side of the sliding block 15. The cylinder 16 drives the piston shaft to move, pushing the sliding block 15, the sliding shaft and the blade holder 14 to move horizontally as a whole, thereby controlling the horizontal movement of the blade.

[0035] Please see Figure 3 and Figure 7 The inner support plate 4 has several through holes. Two ejection cylinders 17 are fixedly installed at the bottom of the base 1. The top ends of the piston shafts of the two ejection cylinders 17 are fixedly connected to the ejection ring plate 18. The top of the ejection ring plate 18 is fixedly installed with vertical shafts 19 that correspond one-to-one with the number of through holes on the inner support plate 4. The top end of the vertical shaft 19 is fixedly connected to a support block 20 located in the through hole. The ejection cylinders 17 drive the piston shafts to push the ejection ring plate 18 and the vertical shaft 19 upward, so that the support block 20 moves above the inner support plate 4, making it easier to place the wafer on the inner support plate 4.

[0036] Please continue reading. Figures 1-3 The base 1 is equipped with a first movable seat 21 and a second movable seat 22 that can move horizontally. The movement of the first movable seat 21 and the second movable seat 22 can be achieved by using existing ball screws, which will not be described in detail here. The inner side of the first movable seat 21 is provided with a longitudinally movable pressing shaft 23, and the inner side of the second movable seat 22 is provided with a longitudinally movable film taking shaft 24. The longitudinal movement of the second movable seat 22 and the pressing shaft 23 can be controlled by existing pneumatic cylinders or hydraulic cylinders, which will not be described in detail here either.

[0037] In use, the wafer is first placed on the inner support plate 4. The first moving seat 21 is controlled to move the pressing shaft 23 to the side closer to the second moving seat 22. One end of the film material is wrapped around the top of the taking shaft 24 and the bottom of the pressing shaft 23. Then, a vacuum is drawn inside the surrounding plate 2, and the pressing shaft 23 is controlled to move downward, so that the pressing shaft 23 adheres the film material to the top of the outer support plate 3. Then, the first moving seat 21 is controlled to move the pressing shaft 23 away from the second moving seat 22, in coordination with... The negative pressure suction inside the enclosure 2 causes the membrane material to adhere to the surfaces of the outer support plate 3, the support ring plate 6, and the inner support plate 4, while simultaneously removing air from the membrane material above the wafer. Then, the lifting cylinder 8 drives the piston shaft to move the entire membrane pressing assembly 9 downwards, causing the bottom of the lower ring plate 904 to first contact the membrane material above the support ring plate 6. As the lower ring plate 904 continues to move downwards, the inner side of the rubber ring 905, in conjunction with the outer side of the inner support plate 4, clamps the membrane material, thus straightening the membrane material above the wafer. Figures 8-9The state shown further removes air from the film material above the wafer. After defoaming the film material above the wafer, the piston shaft driven by cylinder 16 pushes the sliding block 15, causing the sliding shaft, the tool holder 14, and the blade to move towards the inner support plate 4. Then, the output shaft driven by motor 12 drives the gear 13 to rotate, which in turn causes the gear ring 11, cylinder 16, sliding block 15, tool holder 14, and blade to rotate around the outside of the inner support plate 4. The blade cuts the film material on the outside of the inner support plate 4. Finally, the lifting cylinder 8 drives the piston shaft to move the pressing assembly 9 upward as a whole, cooperating with the surrounding plate 2. The internal negative pressure suction separates the entire film pressing assembly 9 from the film material. At the same time, the motor 12 drives the output shaft to drive the gear 13, gear ring 11 and rotating ring plate 10 to reset and rotate, preventing the air pipe connected to the cylinder 16 from winding. Then, the vacuuming of the inner cavity of the enclosure plate 2 is stopped, and the ejection cylinder 17 is started to drive the piston shaft to push the ejection ring plate 18 to move the vertical shaft 19 and the support block 20 upward, lifting the wafer on the inner support plate 4 for collection. Then, the second moving seat 22 is controlled to move towards the side of the first moving seat 21, and the remaining film material is lifted by the film taking shaft 24 for winding and the next wafer coating.

[0038] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A coating machine for semiconductor wafer processing, comprising a base, a first movable seat and a second movable seat that can move horizontally on the base, wherein a pressing shaft is provided on the inner side of the first movable seat above the base, and a film-removing shaft is provided on the inner side of the second movable seat above the base, characterized in that, The base has an inner support plate, a support ring plate, and an elastic support device arranged sequentially from the inside to the outside at the top center. The support ring plate is movably arranged relative to the inner support plate and the elastic support device. Under normal conditions, the tops of the inner support plate, the support ring plate, and the elastic support device are flush. A pressure film assembly is movably arranged directly above the support ring plate. The film pressing assembly includes a lower ring plate, a rubber ring is provided on the inner edge of the top of the lower ring plate, and an outer sleeve plate is provided on the top of the lower ring plate. A rotating ring plate is movably mounted on the inner side of the outer sleeve plate through a bearing. The rotating ring plate is driven to rotate by a motor. A blade holder is movably provided on one side of the bottom of the rotating ring plate. A blade is provided on the side of the blade holder facing the inner support plate, and a cylinder is provided on the rotating ring plate to push the blade holder to move horizontally. A surrounding plate is fixedly installed on the top of the base, and an outer support plate is fixedly installed on the top of the surrounding plate. A circular groove is opened on the outer support plate, and the support ring plate and the inner support plate are both located in the circular groove of the outer support plate. Several ventilation holes are opened on the outer support plate. The base is movably mounted with an elastic support device, and there are no fewer than two elastic support devices. Each elastic support device includes a movable support shaft movably fitted on the base. The connection between the movable support shaft and the base is sealed. The top end of the movable support shaft is fixedly connected to the bottom of the support ring plate. A spring is movably fitted on the movable support shaft between the base and the support ring plate. A stop block located below the base is fixedly installed at the bottom end of the movable support shaft. The pressure film assembly also includes an upper ring plate fixedly installed on the top of the lower ring plate. An inner sleeve plate is fixedly installed on the inner edge of the bottom of the upper ring plate. At least one centimeter gap is reserved between the top of the rubber ring and the bottom of the inner sleeve plate. A gear ring is fixedly installed on the top of the rotating ring plate. A motor is fixedly installed on one side of the top of the upper ring plate. The output shaft of the motor extends to the bottom of the upper ring plate and a gear is fixedly installed thereon. The outer teeth of the gear mesh with the outer teeth of the gear ring.

2. The coating machine for semiconductor wafer processing according to claim 1, characterized in that, The inner and outer sides of the bottom of the lower ring plate are both designed with smooth chamfers.

3. The coating machine for semiconductor wafer processing according to claim 1, characterized in that, A limiting ring located outside the rubber ring is fixedly installed on the lower ring plate.

4. The coating machine for semiconductor wafer processing according to claim 1, characterized in that, The rotating ring plate has two sliding grooves, and a sliding shaft is movably fitted in each of the two sliding grooves. The bottom end of the sliding shaft is fixedly connected to the tool holder, and the top end of the sliding shaft is fixedly connected to a sliding block located above the rotating ring plate. One side of the sliding block is fixedly connected to one end of the piston shaft on the cylinder.

5. The coating machine for semiconductor wafer processing according to claim 1, characterized in that, The inner support plate has several through holes. Two ejector cylinders are fixedly installed at the bottom of the base. The top ends of the piston shafts of the two ejector cylinders are fixedly connected to the ejector ring plate. The top of the ejector ring plate is fixedly installed with a vertical shaft that has the same number of through holes as the inner support plate and corresponds one-to-one. The top end of the vertical shaft is fixedly connected to a support block located in the through hole.

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