A phase change cooling system for a punch press and a control method thereof

Abstract

This application discloses a phase change cooling system and its control method for a punch press, relating to the field of intelligent temperature control technology for stamping equipment. The phase change cooling system includes a cooling pipeline module, which comprises a dynamic microchannel pipeline and a static main pipeline. The dynamic microchannel pipeline is embedded inside the upper die, lower die, and guide pillars. The static main pipeline is fixed to the punch press frame and is independent of the die's moving parts. The dynamic microchannel pipeline and the static main pipeline are connected via a floating quick-release interface. A compression condensation module drives the phase change medium to circulate within the cooling pipeline module to achieve phase change cooling. By replacing water cooling with a phase change medium, cooling efficiency is improved. The cooling system is independent of the die's moving parts, avoiding increased weight of the upper die and improving the stability of the equipment during stamping.

Description

Technical Field

[0001] This application relates to the field of intelligent temperature control technology for stamping equipment, and in particular to a phase change cooling system for a punch press and its control method. Background Technology

[0002] In the field of precision stamping, dies and punches generate a large amount of heat due to friction and plastic deformation during high-speed continuous operation, causing a sharp rise in temperature. High temperatures not only reduce the hardness of the die and accelerate wear, but also cause thermal expansion deformation, seriously affecting stamping accuracy and part quality.

[0003] For example, patent CN117798247A (an automatic punch press with a punch cooling structure) adopts a dual-mode of "water cooling + air cooling". Although it achieves pump-free coolant circulation through mechanical linkage, the heat exchange efficiency of water cooling is limited, and the heat dissipation contact surface of air cooling is incomplete, making it difficult to meet the temperature control accuracy requirements of high-precision punch presses. In addition, its cooling mechanism is integrated into the upper die, which increases the mass and complexity of moving parts, and is prone to vibration problems during high-speed stamping, reducing the reliability of the equipment. Summary of the Invention

[0004] To address the aforementioned issues, this application provides a phase change cooling system for a punch press, which replaces water cooling with a phase change medium to improve cooling efficiency. The cooling system is independent of the moving parts of the die, avoiding increased weight of the upper die and improving the stability of the equipment during stamping. Correspondingly, a control method is provided that can be applied to the phase change cooling system for a punch press.

[0005] The first technical solution adopted in this application is: providing a phase change cooling system for a punch press, comprising:

[0006] A cooling pipeline module, comprising a dynamic microchannel pipeline and a static main pipeline; the dynamic microchannel pipeline is embedded inside the upper die, lower die, and guide pillars; the static main pipeline is fixed to the punch press frame and independent of the die moving parts; the dynamic microchannel pipeline and the static main pipeline are connected via a floating quick-release interface;

[0007] A compression condensation module is used to drive the phase change medium to circulate within the cooling pipeline module to achieve phase change cooling.

[0008] In an optional embodiment, the dynamic microchannel pipeline includes a spiral channel distributed in the upper die punch cutting edge area, a mesh channel in the lower die forming area, and an axial channel in the guide post friction surface.

[0009] In an optional embodiment, the compression-condensation module drives the phase change medium to achieve phase change cooling, which includes compression, condensation, expansion, and evaporation stages.

[0010] Compression stage: Low-pressure superheated steam generated by the dynamic microchannel pipeline is drawn in and compressed to output a high-pressure, high-temperature gaseous medium;

[0011] Condensation stage: The high-pressure, high-temperature gaseous medium flows through the air-cooled condenser, releasing sensible heat and transforming into a high-pressure subcooled liquid;

[0012] Expansion stage: The high-pressure subcooled liquid is depressurized through the expansion valve to generate a low-temperature, low-pressure gas-liquid two-phase flow;

[0013] Evaporation stage: Low-temperature and low-pressure gas-liquid two-phase flow enters the dynamic microchannel pipeline, absorbs heat from the mold, and realizes the transformation of the liquid phase into the gas phase.

[0014] In an optional embodiment, the condensation stage further includes a secondary condensation stage;

[0015] A portion of the high-pressure subcooled liquid flows through the hot end of the thermoelectric generator module; the cold end of the thermoelectric generator module is connected to the secondary cooling circuit.

[0016] The thermoelectric power generation module generates electricity by forming a stable temperature difference between its hot and cold ends; the output end of the thermoelectric power generation module is connected to the power management circuit and supplied to the system load or storage after voltage regulation.

[0017] In an optional embodiment, the system further includes a temperature sensor assembly and a control module; the temperature sensor assembly acquires temperature data of the upper mold, lower mold, and guide post; and the control module outputs a valve opening command based on the acquired temperature data.

[0018] In an optional embodiment, the control module includes a real-time control layer and a prediction correction layer;

[0019] The real-time control layer uses a proportional-integral-derivative controller to output valve opening commands based on the deviation between the set value and the measured temperature in the first cycle.

[0020] The prediction correction layer uses a spatiotemporal prediction model to predict the temperature change trend of the mold in the second cycle, and dynamically optimizes the temperature setpoint of the real-time control layer based on the prediction results.

[0021] When the spatiotemporal prediction model is detected to be faulty, the system automatically switches to pure feedback control mode, where only the real-time control layer outputs valve opening commands.

[0022] In an optional embodiment, the input to the spatiotemporal prediction model includes historical temperature sequences, process parameters, and frequency domain decomposition features of the temperature signal;

[0023] The output of the spatiotemporal prediction model is used to adaptively adjust the differential and integral coefficients of the proportional-integral-derivative controller.

[0024] In an optional embodiment, a process adaptive module is also included; the process adaptive module adjusts the cooling strategy based on material type, stamping speed, and material thickness.

[0025] The second technical solution adopted in this application is: providing a control method for a phase change cooling system as described above, comprising:

[0026] The spatiotemporal prediction model of the prediction correction layer periodically outputs the trend of mold temperature change;

[0027] Based on the temperature change trend, the temperature setpoint of the real-time control layer is dynamically adjusted;

[0028] In the real-time control layer, based on the deviation between the adjusted temperature setpoint and the measured temperature, the valve opening control quantity of the cooling medium circulation loop is calculated and output.

[0029] In an optional embodiment, it further includes:

[0030] When a sudden change in process parameters is detected, the frequency domain features of the current temperature signal are extracted;

[0031] Based on the extracted frequency domain feature intensity, the differential or integral action of the proportional-integral-derivative controller in the real-time control layer is enhanced.

[0032] Due to the adoption of the above technical solution, this application has at least one of the following beneficial effects compared with the prior art:

[0033] 1. The cooling system is independent of the moving parts of the mold, avoiding increasing the weight of the upper mold and improving the stability of the equipment during stamping.

[0034] 2. Improve cooling efficiency by replacing water cooling with phase change media.

[0035] 3. Through intelligent control methods such as temperature sensor components, control modules, and predictive correction layers, cooling parameters can be automatically adjusted according to the actual temperature distribution of the mold, achieving precise dynamic closed-loop control.

[0036] 4. A two-stage condensation stage is introduced in the compression condensation module, and the waste heat is recovered and converted into electrical energy using the thermoelectric generator (TEG) module, thereby improving energy utilization efficiency. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0038] Figure 1 A schematic diagram of the frame of a phase change cooling system for a punch press provided in an embodiment of this application;

[0039] Figure 2 A schematic diagram of the frame of a phase change cooling system for a punch press, provided as another embodiment of this application;

[0040] Figure 3 for Figure 2 A schematic diagram of the control module framework;

[0041] Figure 4 for Figure 2 Control logic diagram of the control module;

[0042] Figure 5 This is a flowchart illustrating a control method provided in an embodiment of this application. Detailed Implementation

[0043] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. It is understood that the specific embodiments described herein are only for explaining this application and not for limiting it. Furthermore, it should be noted that, for ease of description, only the parts related to this application are shown in the accompanying drawings, not all structures. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0044] The terms "first," "second," etc., used in this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0045] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0046] Existing technologies for cooling high-precision punch presses have significant drawbacks, mainly manifested in low cooling efficiency, increased upper die weight due to integrated cooling mechanisms leading to aggravated vibration during high-speed punching, lack of intelligent temperature control methods making it difficult to respond to die temperature changes in real time, and high energy consumption with insufficient recycling. In view of this, this application provides a phase change cooling system for punch presses, which improves cooling efficiency by replacing water cooling with a phase change medium; the cooling system is independent of the moving parts of the die, avoiding the increase of upper die weight and improving the stability of the equipment during punching.

[0047] The phase change cooling system for punching machines provided in this application is suitable for the stamping process of square battery casings for new energy vehicles. The battery casing material is aluminum alloy or stainless steel. During stamping, the local temperature of the die can reach 200–300℃. The working temperature needs to be controlled below 80–120℃ to ensure dimensional accuracy and surface quality.

[0048] like Figure 1 As shown, Figure 1 A schematic diagram of the frame of a phase change cooling system for a punch press provided in an embodiment of this application includes:

[0049] The cooling pipeline module includes dynamic microchannel pipelines and static main pipelines. The dynamic microchannel pipelines are embedded inside the upper die, lower die, and guide pillars. The dynamic microchannel pipelines include spiral channels distributed in the cutting edge area of ​​the upper die punch, ensuring that the cooling medium can directly contact the high-temperature area, quickly absorb heat, and effectively reduce the punch temperature.

[0050] The mesh channel in the lower mold forming area helps to achieve a more uniform cooling effect, avoiding local overcooling or overheating that may occur with traditional cooling methods, and improving the dimensional accuracy of the product.

[0051] The axial channel of the guide post friction surface effectively manages the frictional heat generated by long-term high-speed movement, reduces material expansion or wear caused by temperature rise, and extends the service life of the guide post.

[0052] In this embodiment, the upper die punch cutting edge is integrally formed using copper-chromium alloy material through 3D printing technology, with 36 spiral microchannels machined 5mm behind it. The channel cross-section is semi-circular, with a depth of 3mm and a spacing of 2mm. The lower die forming area is formed by electrical discharge machining and nickel plating, with a mesh microchannel arrangement 2mm below it. The channel width is 2mm, the depth is 3mm, and the node spacing is 3mm. The guide post friction surface is machined by deep hole drilling and polished, with 8 axial straight channels evenly distributed circumferentially. The channel diameter is 2mm and the distance from the surface is 3mm.

[0053] In other embodiments, the material, width, spacing, and number of dynamic microchannels may be selected separately, and no limitation is made thereto.

[0054] The static main pipeline is fixed to the press frame and is independent of the mold moving parts. The design of the static main pipeline being independent of the mold moving parts avoids increasing the mass of the upper mold, reduces vibration problems that may occur during high-speed stamping, and improves the overall stability and reliability of the equipment.

[0055] The dynamic microchannel pipeline is connected to the static main pipeline via a floating quick-release interface. The design of the floating quick-release interface simplifies the mold change process, allowing operators to quickly disconnect or reconnect the cooling system, reducing downtime and improving production efficiency.

[0056] The compression condensation module drives the phase change medium to circulate within the cooling pipeline module to achieve phase change cooling. In this embodiment, Freon (R134a) is selected as the phase change medium. In other embodiments, propane, isobutane, or hydrofluoroolefins can be selected as the phase change medium, and no limitation is made in this regard.

[0057] The pressure is regulated by a variable frequency compressor to match the boiling point of the phase change medium with the process requirements. Microchannels are incorporated inside the mold to directly cool the high-temperature region, controlling the punch cutting edge temperature below 100℃, the die forming surface below 90℃, and the guide post friction surface below 80℃. The compression-condensation module drives the phase change medium to achieve phase change cooling, including compression, condensation, expansion, and evaporation stages. The following is a detailed description of each stage:

[0058] Compression stage: Low-pressure superheated steam generated by the dynamic microchannel pipeline is drawn in and compressed into a high-pressure, high-temperature gaseous medium; that is, the low-pressure superheated steam generated by the dynamic microchannel pipeline is drawn into the variable frequency scroll compressor. This compressor can adjust its power according to actual needs, thereby compressing the low-pressure superheated steam into a high-pressure, high-temperature gaseous medium.

[0059] Condensation stage: The high-pressure, high-temperature gaseous medium flows through the air-cooled condenser, releasing sensible heat and transforming into a high-pressure subcooled liquid;

[0060] Expansion stage: The high-pressure subcooled liquid is depressurized through the expansion valve to generate a low-temperature, low-pressure gas-liquid two-phase flow; that is, the high-pressure subcooled liquid after condensation is depressurized through the expansion valve to generate a low-temperature, low-pressure gas-liquid two-phase flow; the precise control of the expansion valve ensures that the medium entering the evaporation stage is in the best state to maximize the absorption of heat from the mold.

[0061] Evaporation stage: Low-temperature and low-pressure gas-liquid two-phase flow enters the dynamic microchannel pipeline, absorbs heat from the mold, and realizes the transformation from liquid to gas phase; the low-temperature and low-pressure gas-liquid two-phase flow enters the dynamic microchannel pipeline and directly contacts key parts such as the upper mold, lower mold, and guide pillars; the medium rapidly absorbs the heat emitted by the mold and transforms from liquid to gas, completing a complete phase change cooling cycle.

[0062] The condensation stage also includes a secondary condensation stage; when the primary condensation is insufficient to sufficiently cool the high-pressure gaseous medium to the required subcooled liquid state, the secondary condensation stage can provide additional cooling capacity; the implementation process of the secondary condensation stage is described in detail below:

[0063] A portion of the high-pressure subcooled liquid flows through the hot end of the thermoelectric generator module; the cold end of the thermoelectric generator module is connected to the secondary cooling circuit; that is, the high-pressure subcooled liquid first flows through the hot end of the thermoelectric generator module (TEG). In this embodiment, the TEG module adopts... Made from base materials, it contains 16 pairs of thermocouples in series and measures 40×40×5mm. It can deliver a maximum output power of 15W at operating temperatures of 80-120℃.

[0064] The thermoelectric generator module generates electricity by creating a stable temperature difference between its hot and cold ends. The output of the thermoelectric generator module is connected to the power management circuit and supplied to the system load or storage after voltage regulation. The power generated by the TEG module is converted to 12V by DC-DC converter and then supplied to the system's sensor network first. The remaining power is stored in the supercapacitor for subsequent use.

[0065] After passing through the TEG module, the high-pressure subcooled liquid continues to flow to the secondary cooling circuit, where it is further cooled to ambient temperature by liquid cooling, completing the secondary condensation process. Secondary condensation not only ensures that the cooling medium reaches the optimal physical state, but also realizes the effective recovery and reuse of energy, improving energy utilization efficiency.

[0066] like Figure 2 As shown, Figure 2 The schematic diagram of the phase change cooling system for a punch press provided in another embodiment of this application also includes a temperature sensor assembly and a control module; the temperature data of the upper die, lower die and guide post are obtained based on the temperature sensor assembly; in this embodiment, three infrared thermocouples are arranged at 120° intervals on the punch cutting edge to obtain the temperature data of the upper die, two fiber optic sensors 10mm from the edge are arranged on the die forming surface to obtain the temperature data of the lower die, and two PT100 platinum resistance thermometers are arranged on each guide post to obtain the temperature data of the guide post.

[0067] High-precision temperature sensors distributed in different parts of the mold can accurately obtain the actual temperature data of the upper mold, lower mold and guide pillars.

[0068] The control module outputs valve opening commands based on the acquired temperature data; such as Figure 3 As shown, Figure 3 for Figure 2 A schematic diagram of the control module; the control module consists of a control execution unit, a data acquisition unit, and an edge computing unit.

[0069] The data acquisition unit is responsible for collecting data from various temperature sensors and transmitting this information to the edge computing unit.

[0070] The edge computing unit uses a runtime prediction model and a PID (proportional-integral-derivative) control algorithm to process this data and outputs valve opening commands based on the analysis results.

[0071] The control execution unit receives valve opening commands and adjusts the degree of valve opening and closing.

[0072] The control module consists of a real-time control layer and a prediction correction layer; that is, the edge computing unit performs calculations based on the real-time control layer and the prediction correction layer. The workflow of the control module is described in detail below:

[0073] The real-time control layer employs a proportional-integral-derivative (PI-DE) controller, which outputs a valve opening command based on the deviation between the setpoint and the measured temperature in the first cycle. In this embodiment, the real-time control layer directly controls the opening of the electronic expansion valve with a first cycle of 10ms. The input to the PI-DE controller is the difference between the temperature setpoint and the current temperature, and the output is the valve opening adjustment. The PID control algorithm is as follows:

[0074] .

[0075] in, The difference between the temperature setpoint and the current temperature. , and These are the proportional, integral, and differential gain coefficients, respectively; in this embodiment, In other embodiments, the values ​​of the proportional, integral, and differential gain coefficients may be selected separately, and no limitation is made thereto.

[0076] The prediction correction layer employs a spatiotemporal prediction model. In this embodiment, the spatiotemporal prediction model uses STC-LSTM (Spatiotemporal Convolutional Long Short-Term Memory Network) to perform predictions. The temperature change trend of the mold is predicted in the second cycle, and the temperature setpoint of the real-time control layer is dynamically optimized based on the prediction results. In this embodiment, the second cycle is 1 second, meaning a prediction is performed once per second.

[0077] The spatiotemporal prediction model receives historical temperature sequences, process parameters, and frequency domain decomposition features of temperature signals as input, and outputs predicted temperature values ​​for the next 5 seconds. The workflow of the spatiotemporal prediction model in this embodiment is described in detail below:

[0078] Receive temperature and process data from the last 20 time steps (a total of 18 dimensions × 20 = 360 input points).

[0079] The input signal is decomposed into high-frequency and low-frequency components using Haar wavelets.

[0080] Causal convolution kernels with three dilation rates are used to extract multi-scale features; in this embodiment, the three dilation rates are 1, 2, and 4, respectively.

[0081] The cell state is updated through a gating mechanism, and the final output is the temperature prediction value for the next 5 seconds.

[0082] When the spatiotemporal prediction model fails, the system automatically switches to pure feedback control mode, with only the real-time control layer outputting valve opening commands. To prevent over-adjustment from causing system instability, a hardware limit is set for the valve opening (e.g., the valve opening is limited to 20%-90%). Even in the event of a failure of the spatiotemporal prediction model, the system can still maintain basic temperature control functions by relying on the PID controller, thus avoiding production interruptions caused by prediction model failure.

[0083] like Figure 4 As shown, Figure 4 for Figure 2 A schematic diagram of the control logic of the control module.

[0084] The setpoint optimizer dynamically calculates the formula based on the prediction results as follows:

[0085] .

[0086] in, As the process reference temperature, For the safety threshold temperature, It can be adaptively adjusted.

[0087] The output of the spatiotemporal prediction model is used to adaptively adjust the derivative and integral coefficients of the proportional-integral-derivative controller. If the prediction results indicate that a rapid temperature rise is imminent, the derivative coefficient may be increased to enhance the system's response speed. If a sustained temperature shift is expected, the integral coefficient may be increased to eliminate steady-state errors.

[0088] The PID controller calculates the new valve opening command based on the adjusted parameters and sends it to the electric regulating valve for execution. The system periodically (e.g., every 30 minutes) incrementally learns the spatiotemporal prediction model based on the latest collected data to ensure that it can accurately reflect the latest operating condition changes, while adjusting the PID parameters in reverse to optimize the control effect.

[0089] The control logic is described in detail below with reference to a specific embodiment: In this embodiment, when the stamping speed suddenly increases from 60 times / minute to 80 times / minute, the change in process parameters of the increased stamping speed is detected first.

[0090] High-frequency components of temperature signals that abruptly change were captured by wavelet decomposition.

[0091] Output prediction: The temperature will rise from 98℃ to 112℃; This is a temperature prediction for the next 5 seconds.

[0092] Calculate the new temperature setpoint: .

[0093] In this embodiment, the process reference temperature is 100°C and the safe temperature is 120°C; the set value is lowered in advance to reserve buffer space for the upcoming temperature rise.

[0094] Valve opening adjustment is based on PID control, with the current temperature detected as 98℃; the control input is calculated as follows:

[0095] .

[0096] It is known that the valve opening needs to be increased by 15% and cooling should be strengthened in advance.

[0097] In one embodiment, the phase change cooling system further includes a process adaptive module (not shown); the process adaptive module adjusts the cooling strategy based on material type, stamping speed, and material thickness; based on the input process parameters, the process adaptive module automatically matches the optimal cooling mode and dynamically adjusts the cooling strategy. For example, for thicker materials or higher stamping speeds, the system may increase the cooling medium flow rate or lower the set temperature to ensure the mold remains within the ideal temperature range.

[0098] By customizing cooling strategies for different material properties and processing conditions, mold temperature can be controlled more precisely, improving product dimensional accuracy. The process adaptive module can quickly respond to changes in process parameters, eliminating the need for frequent manual adjustments to cooling settings, reducing downtime, and improving the overall efficiency of the production line.

[0099] like Figure 5 As shown, Figure 5 This is a flowchart illustrating a control method provided in one embodiment of the present application. The control method can be applied to a phase change cooling system for a punch press as described in any of the above embodiments, and includes the following steps:

[0100] S11: The spatiotemporal prediction model of the prediction correction layer periodically outputs the mold temperature change trend.

[0101] S12: Based on the temperature change trend, dynamically adjust the temperature setpoint of the real-time control layer.

[0102] S13: In the real-time control layer, based on the deviation between the adjusted temperature setpoint and the measured temperature, calculate and output the valve opening control quantity of the cooling medium circulation loop.

[0103] Control methods also include:

[0104] When a sudden change in process parameters is detected, the frequency domain features of the current temperature signal are extracted;

[0105] Based on the extracted frequency domain feature intensity, the differential or integral action of the proportional-integral-derivative controller in the real-time control layer is enhanced.

[0106] In the several embodiments provided in this application, it should be understood that the disclosed methods and devices can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed.

[0107] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment, depending on actual needs.

[0108] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0109] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A phase change cooling system for a punch press, characterized in that, include: A cooling pipeline module, comprising a dynamic microchannel pipeline and a static main pipeline; the dynamic microchannel pipeline is embedded inside the upper die, lower die, and guide pillars; the static main pipeline is fixed to the punch press frame and independent of the die moving parts; the dynamic microchannel pipeline and the static main pipeline are connected via a floating quick-release interface; A compression condensation module is used to drive a phase change medium to circulate within the cooling pipeline module to achieve phase change cooling. The phase change cooling system for the punch press also includes a temperature sensor assembly and a control module; the temperature sensor assembly acquires temperature data of the upper die, lower die, and guide post; the control module outputs valve opening commands based on the acquired temperature data; The control module includes a real-time control layer and a prediction correction layer; The real-time control layer uses a proportional-integral-derivative controller to output valve opening commands based on the deviation between the set value and the measured temperature in the first cycle. The prediction correction layer uses a spatiotemporal prediction model to predict the temperature change trend of the mold in the second cycle, and dynamically optimizes the temperature setpoint of the real-time control layer based on the prediction results. When the spatiotemporal prediction model is detected to be faulty, the system automatically switches to pure feedback control mode, where only the real-time control layer outputs valve opening commands. The inputs to the spatiotemporal prediction model include historical temperature sequences, process parameters, and frequency domain decomposition features of the temperature signal. The output of the spatiotemporal prediction model is used to adaptively adjust the differential and integral coefficients of the proportional-integral-derivative controller.

2. The phase change cooling system for a punch press according to claim 1, characterized in that, The dynamic microchannel pipeline includes a spiral channel distributed in the upper die punch cutting edge area, a mesh channel in the lower die forming area, and an axial channel on the guide post friction surface.

3. The phase change cooling system for a punch press according to claim 1, characterized in that, The compression and condensation module drives the phase change medium to achieve phase change cooling, which includes compression, condensation, expansion and evaporation stages; Compression stage: Low-pressure superheated steam generated by the dynamic microchannel pipeline is drawn in and compressed to output a high-pressure, high-temperature gaseous medium; Condensation stage: The high-pressure, high-temperature gaseous medium flows through the air-cooled condenser, releasing sensible heat and transforming into a high-pressure subcooled liquid; Expansion stage: The high-pressure subcooled liquid is depressurized through the expansion valve to generate a low-temperature, low-pressure gas-liquid two-phase flow; Evaporation stage: Low-temperature and low-pressure gas-liquid two-phase flow enters the dynamic microchannel pipeline, absorbs heat from the mold, and realizes the transformation of the liquid phase into the gas phase.

4. The phase change cooling system for a punch press according to claim 3, characterized in that, The condensation stage also includes a secondary condensation stage; A portion of the high-pressure subcooled liquid flows through the hot end of the thermoelectric generator module; the cold end of the thermoelectric generator module is connected to the secondary cooling circuit. The thermoelectric power generation module generates electricity by forming a stable temperature difference between its hot and cold ends; the output end of the thermoelectric power generation module is connected to the power management circuit and supplied to the system load or storage after voltage regulation.

5. The phase change cooling system for a punch press according to claim 1, characterized in that, It also includes a process adaptive module; the process adaptive module adjusts the cooling strategy based on material type, stamping speed and material thickness.

6. A control method applied to the phase change cooling system according to any one of claims 1 to 5, characterized in that, include: The spatiotemporal prediction model of the prediction correction layer periodically outputs the trend of mold temperature change; Based on temperature change trends, dynamically adjust the temperature setpoint of the real-time control layer; In the real-time control layer, based on the deviation between the adjusted temperature setpoint and the measured temperature, the valve opening control quantity of the cooling medium circulation loop is calculated and output.

7. The control method according to claim 6, characterized in that, Also includes: When a sudden change in process parameters is detected, the frequency domain features of the current temperature signal are extracted; Based on the extracted frequency domain feature intensity, the differential or integral action of the proportional-integral-derivative controller in the real-time control layer is enhanced.

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