Photovoltaic module repairing device

Abstract

The invention discloses a photovoltaic module repairing device, and relates to the technical field of crystalline silicon cell photovoltaic module processing, the photovoltaic module repairing device comprises a support frame and an induction heating module, the induction heating module can be fixed relative to the support frame, the induction heating module comprises an induction head and a suppression layer, and the suppression layer is arranged at the induction end, opposite to a photovoltaic module, of the induction head. A hollow part is arranged on the suppression layer and is used for being opposite to a to-be-repaired welding spot on the photovoltaic module; the inductive head can generate an alternating magnetic field, the restraining layer can restrain the alternating magnetic field of the area, covered by the restraining layer, of the inductive end of the inductive head, and the hollowed-out part can enable the alternating magnetic field to be directionally transmitted to a to-be-repaired welding spot so as to heat the to-be-repaired welding spot. According to the photovoltaic module repairing device provided by the invention, accurate repairing of the photovoltaic module is facilitated, and the efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of crystalline silicon cell photovoltaic module processing, in particular to a photovoltaic module repair device. BACKGROUND

[0002] In the manufacturing process of the photovoltaic module, the front plate, back plate, encapsulation adhesive film and crystalline silicon solar cell are laminated to make the multi-layer materials adhere to a whole, so as to realize the encapsulation protection, electrical connection and fixation and optical performance optimization of the cell. After laminating, the photovoltaic module as a whole needs to be inspected. If there is a problem such as virtual welding in the photovoltaic module, the photovoltaic module needs to be repaired.

[0003] The existing technology mainly has the following ways for repairing the virtual welding inside the photovoltaic module: 1. The whole photovoltaic module is heated to melt the encapsulation adhesive film, and the encapsulated photovoltaic module is disassembled, and then the poor welding position is repaired. This way has low efficiency, and in the process of disassembling the module, the module is easily damaged, resulting in the module being scrapped. 2. The virtual welding position is focused and irradiated by electromagnetic waves, and the solder of the local position is heated to melt and repair the virtual welding point, but this way can only be applied to the laser transparent back plate material. 3. The alternating magnetic field is generated by the induction coil to make the metal inside the welding point generate eddy current and heat to melt the solder, which can be applied to the laser opaque back plate material; the existing induction repair method usually adopts an open induction coil design, and the magnetic field is in a spherical diffusion mode (similar to the "star magnetic field" distribution characteristics). The magnetic force lines are dispersed from the coil to the space at 360°, and the actual heating range is much larger than the size of the welding point. The adjacent normal welding points are easily heated by eddy current under the action of the stray magnetic field, which leads to the secondary melting and welding of the solder, and forms new fault points. SUMMARY

[0004] The purpose of the present application is to provide a photovoltaic module repair device to solve the problems existing in the above-mentioned existing induction repair technology, which is beneficial to realize accurate repair of the photovoltaic module and improve the efficiency.

[0005] To achieve the above-mentioned purpose, the present application provides the following solutions: The present application provides a photovoltaic module repair device, which comprises a support frame and an induction heating assembly. The induction heating assembly can be fixed relative to the support frame. The induction heating assembly comprises an induction head and a suppression layer. The suppression layer is arranged on the induction head for the induction end opposite to the photovoltaic module. The suppression layer is provided with a hollow part, which is used for being opposite to the welding point to be repaired on the photovoltaic module. The induction head can generate an alternating magnetic field. The suppression layer can suppress the alternating magnetic field of the induction end of the induction head covered by the suppression layer. The hollow part can make the alternating magnetic field directional transmission to the welding point to be repaired to heat the welding point to be repaired.

[0006] Preferably, a heat dissipation assembly is further included, the heat dissipation assembly is capable of being fixed relative to the support frame, and the heat dissipation assembly is used for dissipating heat of the surrounding area of the to-be-repaired solder joint on the photovoltaic module.

[0007] Preferably, the heat dissipation assembly has a hollow portion, the induction end of the induction head is capable of penetrating through the heat dissipation assembly through the hollow portion; the induction end of the induction head and the heat dissipation assembly are both capable of being attached to the photovoltaic module, and the heat dissipation assembly is capable of dissipating heat of the surrounding area of the to-be-repaired solder joint on the photovoltaic module.

[0008] Preferably, the induction head includes a magnetic core and an induction coil arranged on the outer periphery of the magnetic core, the magnetic core is used for forming a boss at one end close to the photovoltaic module, the boss is used for arranging the suppression layer on the induction end opposite to the photovoltaic module; and the boss is capable of penetrating through the hollow portion.

[0009] Preferably, a lifting mechanism is further included, the lifting mechanism is connected with the support frame, and the lifting mechanism is also connected with the induction heating assembly and the heat dissipation assembly; the lifting mechanism is capable of driving the induction heating assembly and / or the heat dissipation assembly to move along the direction close to or away from the photovoltaic module.

[0010] Preferably, the lifting mechanism includes a first lifting assembly and a second lifting assembly, both of which are connected with the support frame; the first lifting assembly is connected with the induction heating assembly and is used for driving the induction heating assembly to move along the direction close to or away from the photovoltaic module; and the second lifting assembly is connected with the heat dissipation assembly and is used for driving the heat dissipation assembly to move along the direction close to or away from the photovoltaic module.

[0011] Preferably, a control mechanism is further included, the control mechanism is electrically connected with the induction heating assembly, the heat dissipation assembly, the first lifting assembly and the second lifting assembly, and is capable of controlling actions.

[0012] Preferably, a temperature monitoring component is further included, which is used for monitoring temperature information of the to-be-repaired solder joint area on the photovoltaic module; the control mechanism is electrically connected with the temperature monitoring component and is capable of receiving the monitored temperature information.

[0013] Preferably, the suppression layer is arranged as a soft magnetic material.

[0014] Preferably, the induction head is capable of being connected with different suppression layers respectively, and the different suppression layers have different sizes of the hollow portion.

[0015] The present application has the following technical effects relative to the prior art: The photovoltaic module repair device provided by the application can restrain the alternating magnetic field range of the induction heating assembly by arranging a restraining layer on the induction end of the induction heating assembly, so that the alternating magnetic field only passes through the hollow part of the restraining layer. Since the hollow part is opposite to the welding point to be repaired, the restraining layer can constrain the heating range of the induction head, improve the accuracy of the heating range, and avoid misheating the normal welding area of the photovoltaic module, so that the normal welding point is easy to produce eddy current heating under the action of the stray magnetic field, resulting in secondary melting and soldering-off of the soldering tin and forming a new fault point. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings in the following description only constitute some embodiments of the application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0017] Figure 1 The shaft side view of the photovoltaic module repair device provided by the first embodiment of the application is shown in the figure. Figure 2 The structure schematic view of the induction heating assembly provided by the first embodiment of the application is shown in the figure. Figure 3 The structure schematic view of the heat dissipation assembly and the second lifting assembly provided by the first embodiment of the application is shown in the figure. Figure 4 The busbar structure schematic view of the photovoltaic module is shown in the figure. Figure 5 The electroluminescence (EL) test figure of the busbar structure of the photovoltaic module before repair is shown in the figure. Figure 6 The electroluminescence (EL) test figure of the busbar structure of the photovoltaic module after repair is shown in the figure. Figure 7 The communication connection schematic view of the control mechanism and the induction heating assembly, the heat dissipation assembly and the lifting mechanism provided by the first embodiment of the application is shown in the figure.

[0018] In the figure: 1 - support frame; 11 - fixed seat; 12 - top plate; 13 - back plate; 2 - induction heating assembly; 21 - induction head; 211 - magnetic core; 212 - induction coil; 213 - boss; 22 - restraining layer; 23 - hollow part; 3 - photovoltaic module; 4 - heat dissipation assembly; 41 - hollow part; 42 - refrigeration fin; 43 - cold plate; 5 - lifting mechanism; 51 - first lifting assembly; 52 - second lifting assembly; 53 - first connecting plate; 54 - second connecting plate; 6 - control mechanism. DETAILED DESCRIPTION

[0019] With reference to the accompanying drawings, the technical solutions in the embodiments of the present application will be clearly and completely described below, obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0020] The purpose of the present application is to provide a photovoltaic module repair device to solve the above-mentioned problems existing in the prior art, which is beneficial to realize accurate repair of the photovoltaic module and improve the efficiency.

[0021] In order to make the above-mentioned purposes, features and advantages of the present application more apparent and easy to understand, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0022] Embodiment one The present embodiment provides a photovoltaic module repair device, please see Figures 1-4 , including support frame 1 and induction heating assembly 2, induction heating assembly 2 can be fixed relative to support frame 1, induction heating assembly 2 includes induction head 21 and suppression layer 22, suppression layer 22 is arranged on the induction head 21 for the induction end opposite to the photovoltaic module 3, the suppression layer 22 is provided with hollow part 23, the hollow part 23 is used for being opposite to the repair welding point on the photovoltaic module 3;Induction head 21 can generate alternating magnetic field, suppression layer 22 can suppress the alternating magnetic field of the induction end of induction head 21 covered by suppression layer 22, and the hollow part 23 can make the alternating magnetic field directional transmission to the repair welding point to heat the repair welding point.

[0023] Among them, by setting the suppression layer on the induction end of the induction heating assembly 2, the alternating magnetic field range of the induction heating assembly 2 is suppressed, so that the alternating magnetic field only passes through the hollow part of the suppression layer 22, since the hollow part 23 is opposite to the repair welding point, therefore the suppression layer can constrain the heating range of the induction head 21, improve the accuracy of the heating range, avoid the normal welding area of the photovoltaic module 3 from being heated by mistake, which can cause the normal welding point to be easily heated by eddy current under the action of stray magnetic field, resulting in the soldering tin to be re-melted and detached, forming a new fault point.

[0024] Among them, the support frame 1 includes a fixed seat 11, a top plate 12 and a back plate 13, the top plate 12 and the back plate 13 are fixedly connected vertically, such as welding or bolt connection, the back plate 13 and the fixed seat 11 are fixedly connected, such as welding or bolt connection, to form the main support structure of the photovoltaic module repair device.

[0025] In the optional scheme of the present embodiment, more preferably, the photovoltaic module repair device provided by the present embodiment further includes a heat dissipation assembly 4, which can be fixed relative to the support frame 1, and the heat dissipation assembly 4 is used for dissipating heat to the surrounding area of the repair welding point on the photovoltaic module 3.

[0026] Wherein, considering the high frequency induction heating of the soldering point area induction heating assembly 2, the temperature rises too fast, which can reach 400-600℃ in a short time, which may cause thermal damage to the organic materials such as the EVA encapsulation adhesive film and the backboard substrate of the photovoltaic module 3, such as the cross-linking structure damage of the EVA encapsulation adhesive film and the thermal oxidation degradation of the backboard substrate, thereby causing the light transmittance of the photovoltaic module to decrease and the mechanical properties to attenuate, and further affecting the long-term reliability of the photovoltaic module; therefore, the heat dissipation assembly 4 is arranged in the embodiment to dissipate heat from the area around the soldering point to be repaired on the photovoltaic module 3, and the area around the soldering point to be repaired is rapidly dissipated when being repaired, so as to solve the problem of thermal damage of the organic materials such as the encapsulation adhesive film caused by high frequency induction heating, and ensure the long-term reliability of the photovoltaic module 3.

[0027] In an optional scheme of the embodiment, preferably, the heat dissipation assembly 4 has a hollow part 41, and the induction end of the induction head 21 can pass through the hollow part 41 to penetrate the heat dissipation assembly 4; both the induction end of the induction head 21 and the heat dissipation assembly 4 can be attached to the photovoltaic module 3, and the heat dissipation assembly 4 can dissipate heat from the area around the soldering point to be repaired on the photovoltaic module 3.

[0028] Wherein, in order to avoid the heat dissipation assembly 4 affecting the repair of the soldering point to be repaired by the induction heating assembly 2, the hollow part 41 is arranged on the heat dissipation assembly 4 to avoid the magnetic field path of the induction heating assembly 2, and does not affect the rapid heat dissipation from the area around the soldering point to be repaired.

[0029] In an optional scheme of the embodiment, preferably, the induction head 21 includes a magnetic core 211 and an induction coil 212 wound on the outer periphery of the magnetic core 211, and the magnetic core 211 is arranged to have a boss 213 at one end close to the photovoltaic module 3, and the induction end opposite to the photovoltaic module 3 is arranged with a suppression layer 22; the boss 213 can penetrate the hollow part 41.

[0030] Wherein, the magnetic core 211 is wound with the induction coil 212 along the outer side, and the lower end of the magnetic core 211 is arranged with the boss 213 without winding the induction coil 212 on the outer side, the induction coil 212 can be connected to an alternating current power supply, the magnetic core 211 can collect magnetic induction lines and enhance the magnetic field, and the boss 213 is arranged to cooperate with the hollow part 41 on the heat dissipation assembly 4, so that the boss 213 can penetrate the heat dissipation assembly 4 to realize the repair of the soldering point to be repaired; in addition, the arrangement of the boss 213 is beneficial to further reducing the contact area between the induction head 21 and the photovoltaic module 3, and further realizing the precise heating of the soldering point to be repaired; under the premise of not affecting the heating of the soldering point to be repaired, since the heat dissipation assembly 4 surrounds the boss 213, the smaller the size of the boss 213 is, the smaller the area of the induction end of the boss 213 is, and the larger the heat dissipation area of the heat dissipation assembly 4 from the area around the soldering point to be repaired is, which can improve the heat dissipation efficiency of the area around the soldering point to be repaired.

[0031] In an optional solution of the embodiment, preferably, the photovoltaic module repair device provided by the embodiment further comprises a lifting mechanism 5, the lifting mechanism 5 is connected with the support frame 1, and the lifting mechanism 5 is also connected with the induction heating assembly 2 and the heat dissipation assembly 4. The lifting mechanism 5 can drive the induction heating assembly 2 and / or the heat dissipation assembly 4 to move in the direction of approaching or moving away from the photovoltaic module 3.

[0032] In the embodiment, the induction heating assembly 2 and / or the heat dissipation assembly 4 are driven by the lifting mechanism 5 to approach or move away from the photovoltaic module 3, so that the photovoltaic module 3 can be repaired by approaching and removed after repair. Specifically, the lifting mechanism 5 can be provided with one or more lifting assemblies. A single lifting assembly can drive the induction heating assembly 2 and the heat dissipation assembly 4 to be synchronously lifted, and multiple lifting assemblies can drive the induction heating assembly 2 and the heat dissipation assembly 4 to be lifted individually.

[0033] In an optional solution of the embodiment, preferably, the lifting mechanism 5 comprises a first lifting assembly 51 and a second lifting assembly 52, both of which are connected with the support frame 1. The first lifting assembly 51 is connected with the induction heating assembly 2 and is used to drive the induction heating assembly 2 to move in the direction of approaching or moving away from the photovoltaic module 3. The second lifting assembly 52 is connected with the heat dissipation assembly 4 and is used to drive the heat dissipation assembly 4 to move in the direction of approaching or moving away from the photovoltaic module 3.

[0034] In the embodiment, the first lifting assembly 51 is fixedly connected with the top plate 12, such as being welded or bolted. The induction head of the induction heating assembly 2 is fixedly connected with the first lifting assembly 51, such as being bolted or bonded, for driving the induction heating assembly 2 to be vertically lifted. The second lifting assembly 52 is fixedly connected with the top plate 12, such as being welded or bolted. The heat dissipation assembly 4 is fixedly connected with the second lifting assembly 52, such as being welded or bolted, for being vertically moved under the driving of the second lifting assembly 52 and rapidly cooling the area to be repaired of the photovoltaic module 3. The second connecting plate 54 comprises a vertical segment and a horizontal segment. The vertical segment is arranged vertically, and the horizontal segment is arranged horizontally. The horizontal segment is provided with an opening coaxial with the boss 213 of the induction heating assembly 2 in the vertical direction and is in communication with the hollow portion 41. The vertical segment of the second connecting plate 54 is connected with the second lifting assembly 52, and the horizontal segment of the second connecting plate 54 is fixedly connected with the refrigeration fin 42 and the cold plate 43 of the heat dissipation assembly 4, such as being bolted.

[0035] Further preferably, the first lifting assembly 51 and the second lifting assembly 52 can be driven by a sliding table air cylinder or other driving modes capable of precisely controlling the descending stroke and the stopping time, such as a servo motor.

[0036] In an optional solution of the embodiment, preferably, the photovoltaic module repair device provided by the embodiment further comprises a control mechanism 6 arranged on the support frame 1, and the control mechanism 6 is electrically connected with the induction heating assembly 2, the heat dissipation assembly 4, the first lifting assembly 51 and the second lifting assembly 52 and can control the action.

[0037] As shown in FIG. 1, the control mechanism 6 is arranged on the back plate 13 or the fixing seat 11. Figure 7 As shown in FIG. 1, the control mechanism 6 is arranged on the back plate 13 or the fixing seat 11. The control mechanism 6 is arranged as an industrial control box and is fixed on the back plate 13 or the fixing seat 11 by bolts or welding; the industrial control box comprises a first power module, a second power module, a current detection module, a trigger control module and a drive control module; the first power module is responsible for providing stable power supply for the induction heating assembly 2, the heat dissipation assembly 4 and the lifting mechanism 5, and the second power module is responsible for providing stable power supply for the control circuit; the current detection module is connected with the first power module and is used for detecting and protecting the current output by the first power module; the trigger control module adopts a multi-channel solid-state relay and is used for receiving the control signal sent by the drive control module and triggering the induction heating assembly 2, the heat dissipation assembly 4 and the lifting mechanism 5 to act; the drive control module is used for receiving the process parameters such as set current, voltage, frequency and time and sending the control signal to the trigger control module; in addition, the control mechanism 6 can also adopt other conventional electric control cabinets, which can provide the required electric energy for the induction heating assembly 2, the heat dissipation assembly 4 and the lifting mechanism 5 and can control and monitor the action, so as to realize the accurate control of the lifting stroke and the residence time of the induction heating assembly 2 and the heat dissipation assembly 4 and improve the consistency of repair.

[0038] Specifically, the first power module can be selected as an EWP-2KW250V-V1.2 type power supply, which is used for providing stable power supply for the induction heating assembly 2, the heat dissipation assembly 4 and the lifting mechanism 5; the second power module can be selected as an EWP-10W15V*8-V1.1 type power supply, which is used for providing stable power supply for the control circuit; the current detection module can be selected as a CURRENT-MODULE-V2.0 type current detector, which is used for detecting and protecting the current output by the first power module; the trigger control module can be selected as a TM1001-V1.2 type 10-channel solid-state relay, which is used for receiving the control signal sent by the drive control module and triggering the induction heating assembly 2, the heat dissipation assembly 4 and the lifting mechanism 5 to act; the drive control module can be selected as an EWD-1.5KW370KHZ-V2.0 type drive board, which is used for receiving the process parameters such as set current, voltage, frequency and time and sending the control signal to the trigger control module.

[0039] In an optional solution of the embodiment, preferably, the induction head 21 is connectable with different suppression layers 22, and the different suppression layers 22 have different size hollow parts 23; specifically, the suppression layer 22 can be bonded to the induction end of the induction head 21, and the bonding mode facilitates the connection of the suppression layer 22 and the induction end; in addition, the induction head 21 is connected with different suppression layers 22 separately, and since the different suppression layers 22 have different size hollow parts 23, the different size welding points can be repaired.

[0040] In an optional solution of the embodiment, preferably, the suppression layer 22 is made of soft magnetic material; for example, Ni-Zn ferrite or Mn-Zn ferrite material, which has a relative permeability (ratio of the absolute permeability of magnetic medium to the permeability of vacuum) greater than 10 3 The stray magnetic field lines of the non-axial component are captured by the difference in magnetic resistance and dissipated by the suppression layer 22 itself, and only the axial main magnetic field is allowed to be transmitted in a directional manner to the welding point to be repaired through the hollow part 23, thereby improving the accuracy of the heating range and avoiding the misheating of the normal welding area to cause the welding to be removed; in addition, the suppression layer 22 can also be made of other types of ferrite and permalloy, soft magnetic iron, nanocrystalline material and other magnetic materials with high permeability and low magnetic resistance characteristics, which can effectively suppress the alternating magnetic field.

[0041] Further preferably, the magnetic core 211 is made of Mn-Zn ferrite material with high frequency and low loss, and the cross section is rectangular; the magnetic core 211 can also be made of other applicable high-frequency magnetic core materials, and the cross section of the magnetic core 211 can also be elliptical, circular or other shapes.

[0042] In an optional solution of the embodiment, preferably, the hollow part 23 is in the shape of a ring or a polygon; in the embodiment, the hollow part 23 is in the shape of a rectangle, and it should be noted that the specific shape can be determined according to actual needs.

[0043] Further preferably, the heat dissipation assembly 4 provided in the embodiment adopts semiconductor refrigeration, including a refrigeration sheet 42 and a cold plate 43, the refrigeration sheet 42 is arranged on the surface of the cold plate 43 away from the photovoltaic module 3, the refrigeration sheet 42 has a first hollow part, the cold plate 43 has a second hollow part, the first hollow part and the second hollow part are coaxially arranged with the boss 213 of the induction heating assembly 2 in the vertical direction, and the size of the first hollow part is not less than the size of the second hollow part; the boss 213 can sequentially penetrate the first hollow part and the second hollow part and contact the photovoltaic module 3, wherein the first hollow part can abut and limit the other areas of the induction head 21 except the boss 213; in order to ensure the refrigeration effect of the semiconductor refrigeration sheet, the hot surface of the semiconductor refrigeration sheet can also be cooled by compressed air, air cooling, water cooling, liquid cooling and other methods (not shown in the figure).

[0044] In an optional solution of the embodiment, preferably, the photovoltaic module repair device provided by the embodiment further comprises a temperature monitoring component for monitoring temperature information of the to-be-repaired soldering point area of the photovoltaic module 3, and the control mechanism 6 is electrically connected with the temperature monitoring component and can receive the monitored temperature information.

[0045] The temperature monitoring component can be a temperature sensor such as a patch sensor and can be arranged on the lower side of the cold plate 43 of the heat dissipation assembly 4 and close to the to-be-repaired soldering point, so as to avoid affecting the magnetic field transmission by directly facing the hollow part 23. The temperature of the to-be-repaired area of the photovoltaic module 3 is monitored and fed back to the drive control module of the control mechanism 6 to realize feedback regulation.

[0046] In an optional solution of the embodiment, preferably, the photovoltaic module repair device provided by the embodiment further comprises a detection unit for detecting repair information of the to-be-repaired soldering point, and the control mechanism 6 is electrically connected with the detection unit and can receive the monitored repair information.

[0047] The detection unit is arranged as a conventional EL image recognition unit. After the photovoltaic module 3 is repaired, the repair information such as the virtual soldering situation of the repaired area is recognized by the external EL image recognition unit and fed back to the drive control module of the control mechanism 6. If the repair is not completed, the photovoltaic module 3 is repaired again.

[0048] The working method of the photovoltaic module repair device provided by the embodiment is as follows: S1, place the photovoltaic module 3 with the back upward on the table top, so that the first hollow part and the second hollow part of the heat dissipation assembly 4 are aligned with the to-be-repaired soldering point of the photovoltaic module 3. At this time, the boss 213 of the induction heating assembly 2 is coaxial with the to-be-repaired soldering point in the vertical direction; S2, the operator inputs process parameters (current, voltage, frequency, duration, etc.) into the industrial control box, and the drive control module receives the external process parameters to generate control signals; the trigger control module receives the control signals sent by the drive control module to trigger the lifting mechanism 5 to act: First, the second lifting assembly 52 moves vertically downward to drive the heat dissipation assembly 4 to move vertically downward until the lower surface of the cold plate 43 of the heat dissipation assembly 4 contacts the back surface of the photovoltaic module 3, and the second lifting assembly 52 stops moving; Then, the first lifting assembly 51 moves vertically downward to drive the induction heating assembly 2 to move vertically downward until the boss 213 of the induction heating assembly 2 contacts the corresponding back surface position of the to-be-repaired soldering point of the photovoltaic module 3 through the first hollow part and the second hollow part of the heat dissipation assembly 4, and the first lifting assembly 51 stops moving; S3, the first power module supplies power to the induction heating assembly 2, outputs high-frequency current, generates a linear range magnetic field in the axial direction of the boss 213 of the induction heating assembly 2 through the induction coil 212, melts and refills the solder of the soldering point to be repaired of the photovoltaic module 3; the first power module synchronously supplies power to the heat dissipation assembly 4, and realizes rapid heat dissipation around the soldering point to be repaired of the photovoltaic module; S4, the photovoltaic module 3 is removed, and whether the virtual welding of the photovoltaic module 3 is repaired is detected by an electroluminescence (EL) image recognition unit, if not, the steps S1-S4 are repeated.

[0049] Taking the repair of a kind of photovoltaic module busbar structure with a backboard thickness of 0.25mm as an example, the specific method is as follows: As shown in Figure 4 The copper foil and the solder strip are often used to prepare the busbar structure in the production process of the photovoltaic module, and the welding quality of the busbar structure has an important influence on the power generation efficiency, service life and failure rate of the finished product. As shown in Figure 5 Through electroluminescence (EL) detection, it can be observed that the solder strip is welded on the surface of the copper foil through the solder, and the solder beside the solder strip is not melted, which indicates that the solder of the welding surface between the solder strip and the copper foil is also not melted, and the welding point of the busbar structure exists virtual welding.

[0050] The steps of repairing the virtual welding of the photovoltaic module busbar structure using the photovoltaic module repair device of example 1 are as follows: S1, the photovoltaic module 3 is placed on the table with the back upward, the first hollow part and the second hollow part of the heat dissipation assembly 4 are aligned with the soldering point to be repaired of the photovoltaic module 3, at this time the boss 213 of the induction heating assembly 2 is coaxial with the soldering point to be repaired in the vertical direction; S2, the operator inputs the process parameters (current (I)=1.2A, voltage (U)=156V, frequency (f)=400kHz, duration 3 seconds) into the industrial control box, the drive control module receives the external process parameters to generate control signals; the trigger control module receives the control signals sent by the drive control module, and triggers the lifting assembly and the induction heating assembly to act: Firstly, the second lifting assembly 52 moves vertically downward, driving the heat dissipation assembly 4 to move vertically downward until the lower surface of the cold plate 43 of the heat dissipation assembly 4 contacts the back surface of the photovoltaic module 3, and the second lifting assembly 52 stops moving; Then, the first lifting assembly 51 moves vertically downward, driving the induction heating assembly 2 to move vertically downward until the boss 213 of the induction heating assembly 2 contacts the corresponding back surface position of the soldering point to be repaired of the photovoltaic module 3 through the first hollow part and the second hollow part of the heat dissipation assembly 4, and the first lifting assembly 51 stops moving; S3, the first power module supplies power to the induction heating assembly 2, outputs high-frequency current, generates a linear range magnetic field in the boss 213 of the induction heating assembly 2 through the induction coil 212, melts the solder of the soldering point to be repaired of the photovoltaic module 3 and refills the virtual soldering point; the first power module synchronously supplies power to the heat dissipation assembly 4, realizes the rapid heat dissipation around the soldering point of the photovoltaic module to be repaired; S4, the photovoltaic module 3 is removed, the photovoltaic module is detected through electroluminescence (EL), as shown in Figure 6 It can be observed that: Figure 5 The solder not melted beside the middle solder strip has been melted, which indicates that the solder of the solder strip and the copper foil soldering surface has also been melted, and the virtual soldering of the busbar structure has been repaired.

[0051] The principle and implementation mode of the present application are described by applying specific examples in the present application, the above embodiment is only used for helping to understand the method and core idea of the present application; meanwhile, for the general skilled in the art, according to the idea of the present application, the specific implementation mode and application range will be changed. In conclusion, the content of the specification should not be understood as the limitation of the present application.

Claims

1. A photovoltaic module repair device, characterized by: include: Support frame (1); and An induction heating component (2) is capable of being fixed relative to the support frame (1), and the induction heating component (2) comprises an induction head (21) and an inhibition layer (22), wherein the inhibition layer (22) is provided at an induction end of the induction head (21) opposite to the photovoltaic component (3), and a hollow portion (23) is provided on the inhibition layer (22), and the hollow portion (23) is used to be opposite to the solder joint to be repaired on the photovoltaic component (3); the induction head (21) is capable of generating an alternating magnetic field, and the inhibition layer (22) is capable of suppressing the alternating magnetic field in the area where the induction end of the induction head (21) is covered by the inhibition layer (22), and the hollow portion (23) is capable of transmitting the alternating magnetic field in a directionally directed manner to the solder joint to be repaired so as to heat the solder joint to be repaired.

2. The photovoltaic module repair device according to claim 1, characterized in that: It also includes a heat dissipation component (4), which can be fixed relative to the support frame (1), and the heat dissipation component (4) is used to dissipate heat from the surrounding area of ​​the solder joint to be repaired on the photovoltaic component (3).

3. The photovoltaic module repair device according to claim 2, characterized in that: The heat dissipation component (4) has a hollow portion (41), and the sensing end of the sensing head (21) can pass through the hollow portion (41) and penetrate the heat dissipation component (4); the sensing end of the sensing head (21) and the heat dissipation component (4) can both be attached to the photovoltaic component (3), and the heat dissipation component (4) can dissipate heat from the surrounding area of ​​the solder joint to be repaired on the photovoltaic component (3).

4. The photovoltaic module repair device according to claim 3, characterized in that: The induction head (21) comprises a magnetic core (211) and an induction coil (212) wound around the outer periphery of the magnetic core (211); the magnetic core (211) is provided with a boss (213) at one end close to the photovoltaic assembly (3); the boss (213) is provided with the suppression layer (22) at the induction end opposite to the photovoltaic assembly (3); and the boss (213) is capable of passing through the hollow portion (41).

5. The photovoltaic module repair device according to claim 2, characterized in that: The invention also includes a lifting mechanism (5), wherein the lifting mechanism (5) is connected to the support frame (1), and the lifting mechanism (5) is also connected to both the induction heating component (2) and the heat dissipation component (4), and the lifting mechanism (5) can drive the induction heating component (2) and / or the heat dissipation component (4) to move in a direction close to or away from the photovoltaic component (3).

6. The photovoltaic module repair device according to claim 5, characterized in that: The lifting mechanism (5) comprises a first lifting assembly (51) and a second lifting assembly (52) both connected to the support frame (1); the first lifting assembly (51) is connected to the induction heating assembly (2) and is used to drive the induction heating assembly (2) to move in a direction close to or away from the photovoltaic assembly (3); and the second lifting assembly (52) is connected to the heat dissipation assembly (4) and is used to drive the heat dissipation assembly (4) to move in a direction close to or away from the photovoltaic assembly (3).

7. The photovoltaic module repair device according to claim 6, characterized in that: It also includes a control mechanism (6) disposed on the support frame (1), wherein the control mechanism (6) is electrically connected to the induction heating component (2), the heat dissipation component (4), the first lifting component (51) and the second lifting component (52), and is capable of controlling the movements thereof.

8. The photovoltaic module repair device according to claim 7, characterized in that: It also includes a temperature monitoring component for monitoring the temperature information of the solder joint area to be repaired on the photovoltaic component (3); the control mechanism (6) is electrically connected to the temperature monitoring component and is capable of receiving the monitored temperature information.

9. The photovoltaic module repair device according to claim 1, characterized in that: The suppression layer (22) is configured as a soft magnetic material.

10. The photovoltaic module repair device according to claim 1, characterized in that: The sensing head (21) can be connected to different suppression layers (22) respectively, and different suppression layers (22) have hollow portions (23) of different sizes.

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