Automobile headlamp chip welding tool based on cooling channel structure

Abstract

The invention relates to the technical field of chip welding, and discloses an automobile headlamp chip welding tool based on a cooling channel structure, the automobile headlamp chip welding tool comprises a base, the top of the base is provided with a positioning part used for assisting chip welding, and the top of the base is provided with a driving unit; wherein the positioning part comprises a bearing seat fixedly connected to the top of the base, the bearing seat is internally and rotatably connected with a turnover frame, the bottom of the turnover frame is fixedly connected with a positioning frame attached to the outer side of the chip, when the turnover frame rotates to the position parallel to the circuit board, the turnover frame presses the chip, and when the turnover frame rotates to the position parallel to the circuit board, the chip is positioned on the positioning frame. Therefore, the chip is prevented from shifting in the welding process. According to the automobile headlamp chip welding tool based on the cooling channel structure, the problem that in the prior art, when hot air welding equipment heats pins on the periphery of a chip, hot air flow generated by the hot air welding device easily causes position deviation of the chip, and then welding errors are caused can be effectively solved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip welding, and in particular to a welding tool for automobile headlight chips based on a cooling channel structure. Background Art

[0002] The core functional components of automotive headlights include LED light sources, driver chips, heat sinks, and optical components. These chips require electrical connection and mechanical fixation to the circuit board through a soldering process to ensure stable headlight operation. Since most chips utilize multi-pin, densely distributed side packages, each pin must be securely soldered and fixed during the soldering process. To ensure reliable chip soldering, the chip and circuit board are typically placed on a suitable soldering fixture, and hot air soldering equipment is used to solder the chip pins. This allows for efficient and rapid soldering, significantly improving soldering quality and efficiency.

[0003] The typical process for chip soldering in existing tooling involves positioning the circuit board in the tooling, evenly coating the solder paste on the soldering area, aligning the chip to the target location, and ensuring the solder paste covers the lower ends of the chip pins. Finally, hot air soldering equipment is used to heat the surrounding chip pins. While this method improves soldering efficiency to a certain extent, the hot air flow generated by the hot air soldering device can easily cause the chip to shift position during the heating process, leading to soldering errors and affecting the subsequent functional stability and reliability of the vehicle headlights. Summary of the Invention

[0004] In response to the above-mentioned shortcomings of the prior art, the present invention provides a car headlight chip welding tool based on a cooling channel structure, which can effectively solve the problem in the prior art that when the hot air welding equipment heats the peripheral pins of the chip, the hot air flow generated by the hot air welding device can easily cause the chip to shift in position, thereby causing welding errors.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0006] The present invention provides a welding tool for automobile headlight chips based on a cooling channel structure, comprising:

[0007] A base, the top of which is provided with a limiting portion for fixing the circuit board, a positioning portion for assisting chip welding, and a driving unit;

[0008] The positioning portion includes a bearing seat fixedly connected to the top of the base, and a flip frame is rotatably connected to the bearing seat. The flip frame is fixedly connected to a positioning frame that fits the outer side of the chip on the side close to the circuit board.

[0009] The driving unit is in transmission connection with the turnover frame, and is used for driving the turnover frame to rotate around the central axis of the bearing seat; when the turnover frame rotates to a position parallel to the circuit board, the turnover frame forms a press-fit to the chip to prevent the chip from being offset during welding.

[0010] Further, the positioning frame is in U-shaped design, and a side close to the circuit board is in inclined surface design; a side close to the chip is provided with a plurality of embedded rolling balls arranged in an array along the center of the positioning frame.

[0011] Further, the turnover frame is slidably connected with an abutting block abutting the outer side of the chip through a guide hole formed in the top of the turnover frame; the guide hole is provided with a plurality of holes arranged in an array along the center of the turnover frame; the abutting block is connected with the inner wall of the guide hole through a reset spring arranged on the outer side of the abutting block; a counterweight plate is fixedly connected to the side of the abutting block away from the positioning frame; and the side close to the chip of the positioning frame and the abutting block are both in rough surface design.

[0012] Further, the turnover frame is provided with two airflow channels arranged in a symmetrical manner along the center of the turnover frame; the bottom of the turnover frame is fixedly connected with air pipes in communication with the airflow channels; and a cooling unit is fixedly connected to the outer side of the turnover frame and is in communication with the airflow channels through a connecting pipe arranged on the outer side of the cooling unit.

[0013] Further, the top of the turnover frame is provided with a plurality of air holes arranged in an array along the center of the turnover frame; and the top end of the turnover frame is provided with two slot holes arranged in a symmetrical manner along the center of the turnover frame.

[0014] Further, the slot holes are slidably connected with a movable rod and a blocking rod through a slide rail arranged in the slot hole; and the movable rod and the blocking rod are sequentially arranged from the outside to the inside along the slot hole.

[0015] Further, the movable rod and the blocking rod are connected through a connecting rod; the top of the blocking rod is in inclined surface design; the bottom of the movable rod is in arc surface design; and the movable rod is connected with the outer side of the slide rail through an elastic member arranged in the movable rod.

[0016] Compared with the prior art, the technical scheme provided by the application has the following beneficial effects:

[0017] The application is provided with a positioning part, when the driving unit drives the turnover frame to be parallel to the circuit board, the positioning frame and the abutting block jointly compress the chip to form rigid constraint, the compression structure directly offsets the airflow impact force, ensures the accurate alignment of the chip and the circuit board pad, avoids the welding error caused by position deviation, and when the turnover frame rotates, the counterweight plate generates a downward sliding component force with the change of the inclination angle, drives the abutting block and the positioning frame to clamp the chip, when the inclination angle of the turnover frame reaches the critical value, the abutting block is attached to the sidewall of the chip, pushes the chip to the closed end of the positioning frame to form bidirectional limiting, avoids the chip from separating from the positioning frame due to centrifugal force in the turnover process, meanwhile, the positioning frame adopts U-shaped structure design, the side close to the circuit board is provided with a guide slope to guide the chip to enter the positioning frame stably, and the inner wall of the positioning frame is embedded with multiple groups of array arranged balls to convert the sliding friction between the chip and the positioning frame into rolling friction, effectively prevents the chip damage caused by jamming in the chip feeding process, when the turnover frame rotates to the feeding station, cooperates with the external chip conveying device to complete the feeding action, and the chip position does not need to be deliberately adjusted in the feeding process, only needs to follow the chip welding sequence. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only show some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor based on these drawings.

[0019] Figure 1 It is a three-dimensional structure schematic diagram of the embodiment of the present application;

[0020] Figure 2 It is a three-dimensional structure schematic diagram of the embodiment of the present application;

[0021] Figure 3 It is a three-dimensional structure schematic diagram of the positioning part of the embodiment of the present application;

[0022] Figure 4 It is a three-dimensional structure schematic diagram of the positioning part of the embodiment of the present application; Figure 3

[0023] Figure 5 It is a three-dimensional structure schematic diagram of the positioning frame of the embodiment of the present application;

[0024] Figure 6 It is a three-dimensional structure schematic diagram of the positioning frame of the embodiment of the present application; Figure 5

[0025] Figure 7 ​​Schematic diagram of the cross-sectional structure of the turning frame according to an embodiment of the present invention;

[0026] Figure 8 For the embodiment of the present invention Figure 7 A schematic diagram of the structure with a partial enlargement at point C in the middle;

[0027] Figure 9 Schematic diagram of the three-dimensional state transformation of the turning frame according to an embodiment of the present invention;

[0028] Figure 10 Schematic diagram of the three-dimensional state transformation of the abutment block and the counterweight plate according to an embodiment of the present invention.

[0029] The numbers in the figure represent: 1. base; 2. limiting part; 3. positioning part; 31. bearing seat; 32. turning frame; 321. air flow channel; 322. air pipe; 323. vent; 324. slot; 325. movable rod; 326. stop rod; 327. connecting rod; 33. positioning frame; 331. ball; 34. guide hole; 35. abutment block; 36. return spring; 37. counterweight plate; 38. cooling unit; 381. connecting pipe; 4. driving unit. DETAILED DESCRIPTION

[0030] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0031] The present invention will be further described below with reference to the embodiments.

[0032] Example:

[0033] See also Figures 1-10 The present invention provides a technical solution: a welding tool for automobile headlight chips based on a cooling channel structure, comprising:

[0034] The base 1 has a limiting portion 2 for fixing the circuit board on the top of the base 1, a positioning portion 3 for assisting chip welding on the top of the base 1, and a driving unit 4 on the top of the base 1;

[0035] The positioning portion 3 includes a bearing seat 31 fixedly connected to the top of the base 1, and a flip frame 32 is rotatably connected to the bearing seat 31. The flip frame 32 is fixedly connected to a positioning frame 33 that fits the outer side of the chip on the side close to the circuit board.

[0036] The driving unit 4 is in transmission connection with the turnover frame 32, and is used to drive the turnover frame 32 to rotate around the central axis of the bearing seat 31; when the turnover frame 32 rotates to a position parallel to the circuit board, the turnover frame 32 forms a pressing on the chip to prevent the chip from being deviated in the welding process.

[0037] The positioning frame 33 is in a U-shaped design, and the side close to the circuit board is in an inclined surface design; the side close to the chip of the positioning frame 33 is embeddedly provided with a plurality of rolling balls 331 which are arrayed along the center of the positioning frame 33.

[0038] The turnover frame 32 is slidingly connected with an abutting block 35 which is in abutment with the outer side of the chip through a guide hole 34 formed in the top of the turnover frame 32; the guide hole 34 is provided with a plurality of holes which are arrayed along the center of the turnover frame 32; the abutting block 35 is connected with the inner wall of the guide hole 34 through a reset spring 36 arranged on the outer side of the abutting block 35; the side away from the positioning frame 33 of the abutting block 35 is fixedly connected with a counterweight plate 37; the side close to the chip of the positioning frame 33 and the abutting block 35 are both in a rough surface design.

[0039] The turnover frame 32 is provided with a plurality of airflow passages 321 which are symmetrically distributed along the center of the turnover frame 32; the bottom of the turnover frame 32 is fixedly connected with an air pipe 322 which is in communication with the airflow passages 321; the outer side of the turnover frame 32 is fixedly connected with a cooling unit 38 which is in communication with the airflow passages 321 through a connecting pipe 381 arranged on the outer side of the cooling unit 38.

[0040] The top of the turnover frame 32 is provided with a plurality of air holes 323 which are arrayed along the center of the turnover frame 32; the top end of the turnover frame 32 is provided with a plurality of slot holes 324 which are symmetrically distributed along the center of the turnover frame 32.

[0041] The slot holes 324 are slidingly connected with a movable rod 325 and a blocking rod 326 through a slide rail arranged in the slot holes 324; the movable rod 325 and the blocking rod 326 are sequentially distributed from the outside to the inside along the slot holes 324.

[0042] The movable rod 325 and the blocking rod 326 are connected through a connecting rod 327; the top of the blocking rod 326 is in an inclined surface design; the bottom of the movable rod 325 is in an arc surface design; the movable rod 325 is connected with the outer side of the slide rail through an elastic member arranged in the movable rod 325.

[0043] The principle and advantages of the automobile headlamp chip welding tool based on the cooling channel structure are as follows:

[0044] During the welding operation, the operator places the circuit board to be welded above the base 1, controls the limiting part 2 on the base 1, and makes the limiting part 2 rigidly constrain the circuit board to eliminate the welding quality deviation caused by the displacement of the circuit board in the subsequent chip welding process. After the positioning of the circuit board is completed, the operator uniformly applies solder paste to the pad area thereof.

[0045] After the solder paste application process is completed, the drive unit 4 drives the turnover frame 32 to turn around the axis of the bearing seat 31 to a horizontal posture (i.e., a preset loading station), at which time the external chip conveying device conveys the chip to be welded into the space formed by the positioning frame 33 and the turnover frame 32 according to the welding sequence. After the chip is positioned in the positioning frame 33, the drive unit 4 drives the turnover frame 32 to turn toward the circuit board until 180-degree reverse turning is completed, so that the chip can butt joint the welding target point of the circuit board and realize lamination.

[0046] During the turning of the turnover frame 32 from the preset loading station to the welding station, the chip is in the placement space formed by the positioning frame 33 and the turnover frame 32. With the rotational movement of the turnover frame 32, the chip is subjected to the centrifugal inertial force, which will make the chip overcome the restraining force of the positioning frame 33 and produce relative displacement, resulting in the failure of accurate butt joint of the chip to the welding target point of the circuit board, and even the chip falls off from the positioning frame 33, thereby causing interruption or failure of the welding process.

[0047] When the turnover frame 32 is in the loading position, the counterweight plate 37 and the abutting block 35 are in the initial station and are not in contact with the chip. With the turning of the turnover frame 32, the inclination angle gradually increases. When the inclination angle reaches the critical value, the downward sliding component force of the counterweight plate 37 overcomes the static friction force between the abutting block 35 and the turnover frame 32, drives the abutting block 35 to displace along the guide hole 34 and compresses the return spring 36. Since the positioning frame 33 is of a U-shaped structure, the abutting block 35 contacts the sidewall of the chip with displacement, pushes the chip to translate from the open end to the closed end of the positioning frame 33, until the chip is laminated with the closed end of the positioning frame 33, realizing the limiting locking of the chip. Meanwhile, the positioning frame 33 and the side close to the chip of the abutting block 35 are both rough surfaces, which increase the static friction coefficient of the contact surface, form the double fixing effects of mechanical constraint and friction constraint, further resist the displacement trend of the chip, avoid the displacement of the chip during the turning of the turnover frame 32, and ensure the butt joint accuracy of the chip and the pad.

[0048] It is worth noting that the side close to the circuit board of the positioning frame 33 is designed with an inclined surface, which constitutes a guide inclined surface and can guide the chip to smoothly transition to the positioning cavity when the external loading device conveys the chip to the positioning frame 33; the sidewall of the positioning frame 33 is internally provided with a ball bearing 331, which can convert the sliding friction between the chip and the sidewall of the positioning frame 33 into rolling friction, reduce the friction resistance in the displacement process of the chip, and improve the moving stability of the chip in the positioning frame 33.

[0049] During the process that the turnover frame 32 rotates from the loading position to the position of the counterweight plate 37 to the critical inclination angle, the counterweight plate 37 drives the abutting block 35 to limit the chip, so that the chip is in the position of accurate alignment with the pad. With the continuous rotation of the turnover frame 32 to the vertical position, the sliding force of the counterweight plate 37 reaches the maximum value, which can ensure that the chip is clamped and fixed by the positioning frame 33 and the abutting block 35 in this process, so as to avoid the chip from being separated from the positioning frame 33. In this process, when the counterweight plate 37 moves from the initial position to the position of the slot hole 324, the counterweight plate 37 is in contact with the inclined surface of the stop rod 326. With the continuous reduction of the distance between the two, the extrusion strength increases. The extrusion force drives the stop rod 326 to move away from the chip direction until the stop rod 326 is completely retracted into the slot hole 324. When the counterweight plate 37 moves beyond the slot hole 324 (i.e. is out of contact with the stop rod 326), the built-in elastic element of the movable rod 325 cooperates with the connecting rod 327 to drive the stop rod 326 to reset. At this time, the planar end of the stop rod 326 is in contact with the side wall of the counterweight plate 37, which realizes the mechanical limiting of the counterweight plate 37, avoids the reduction of the limiting degree of the abutting block 35 to the chip due to the reduction of the sliding force of the counterweight plate 37 when the turnover frame 32 rotates from the vertical position to the horizontal position (the direction of the circuit board), and ensures that the chip is reliably limited in the positioning frame 33 during the rotation of the turnover frame 32.

[0050] It is worth noting that the closed end of the positioning frame 33 is always aligned with a certain welding position of the pad. After the external chip conveying device sends the chip into the positioning frame 33, no matter the initial position of the chip, the counterweight plate 37 and the abutting block 35 can make the chip in contact with the closed end of the positioning frame 33 through the cooperation during the rotation of the turnover frame 32, without the need for deliberate adjustment of the position of the chip.

[0051] With the continuous rotation of the turnover frame 32, the included angle between the turnover frame 32 and the circuit board gradually decreases. In this process, the end of the movable rod 325 in the slot hole 324 gradually contacts the top of the circuit board. After the contact degree deepens, the movable rod 325 is extruded by the circuit board and slides along the built-in slide rail in the slot hole 324. The connecting rod 327 is supported by the bracket connected to the base 1. The connecting rod 327 can rotate around the center of the bracket. Therefore, the movable rod 325, the stop rod 326 and the connecting rod 327 constitute a lever mechanism. When the movable rod 325 moves upward, the stop rod 326 moves inward of the slot hole 324 under the linkage action of the connecting rod 327. With the movement of the movable rod 325, the stop rod 326 gradually moves inward of the slot hole 324. When the turnover frame 32 rotates to the welding position (i.e. is in parallel with the circuit board), the stroke of the movable rod 325 reaches the maximum value, and the stop rod 326 is synchronously moved into the slot hole 324. At this time, the counterweight plate 37 is out of the mechanical limiting of the stop rod 326, and the reset spring 36 drives the abutting block 35 and the counterweight plate 37 to reset to the initial position, so as to realize the circulation of the chip loading.

[0052] It is worth mentioning that the contact end of the movable rod 325 with the circuit board adopts an arc surface structure design. This design can avoid the contact stress concentration caused by sharp angle or flat surface contact, realize the uniform distribution of contact load, thereby reducing the risk of extrusion damage to the surface of the circuit board, and avoiding problems such as indentation, crack and component falling off. At the same time, in the lever mechanism, the support fulcrum is arranged close to the stop rod 326, so that the movable rod 325, the stop rod 326 and the connecting rod 327 form a force-saving lever (the power arm is greater than the resistance arm). Since the contact force of the movable rod 325 with the circuit board is constrained by the rotation angle of the turnover frame 32, the initial contact force is small, and with the force amplification effect of the force-saving lever, the small driving force can be amplified, so that the stop rod 326 can be reliably lowered and fully retracted into the slot hole 324.

[0053] After the chip placement is completed, the external hot air welding device is cooperated, the hot gas flow generated by the external hot air welding device is introduced from the upper side of the chip to realize the melting of the solder paste and the welding of the chip pins. During the welding process, the turnover frame 32 remains in a static position, and a continuous pre-tightening force is applied to the chip to form a positioning constraint, which effectively suppresses the displacement of the chip caused by the hot gas flow generated by the hot air welding device, thereby reducing the welding deviation.

[0054] It is worth noting that the turnover frame 32 is provided with a guide hole 34 and a ventilation hole 323. When the hot gas flow of the hot air welding device acts on the chip, the gas flow can enter the space formed by the turnover frame 32 and the circuit board through the guide hole 34 and the ventilation hole 323, so as to ensure that the solder paste is fully melted to meet the welding requirements of the chip.

[0055] Both the chip and the circuit board have a clear thermal damage threshold. In the hot air welding process, the melting of the solder paste requires a high temperature input for a short time, but a continuous high temperature can easily cause the oxidation and deterioration of the internal wire bonding layer of the chip, and also cause the excessive thermal expansion of the circuit board, resulting in the peeling of the solder pad or the warping of the substrate. In addition, the excessive volatilization of the flux in the solder paste can cause metallurgical defects such as pores and cavities in the welding point.

[0056] When the hot air welding device completes the preset heat input and the solder has fully wetted the chip pins and the circuit board pads and formed a preliminary metallurgical bond, the cooling unit 38 on the outside of the turnover frame 32 starts to operate. The gas flow generated by the cooling unit 38 is introduced into the gas flow channel 321 through the connecting pipe 381. Since the gas pipe 322 and the gas flow channel 321 form a communication loop, the gas flow can be directed to the chip welding area. When the gas flow passes through the high temperature area, the excess heat generated during the welding process is quickly removed through forced convection, thereby realizing the temperature regulation of the welding point, accelerating the solidification of the solder and reducing the accumulation of thermal stress.

[0057] After the chip welding process is completed, the reset spring 36 drives the counterweight plate 37 and the abutting block 35 to reset to the initial position along the guide hole 34, and then the driving unit 4 outputs driving force to drive the turnover frame 32 to rotate around the center axis of the bearing seat 31 to the feeding position, in the process, the operator can take the circuit board constrained by the limiting part 2 from the base 1 to the next process.

[0058] The positioning part 3 has the following advantages:

[0059] Advantage one, the driving unit 4 drives the turnover frame 32 to rotate around the bearing seat 31, when the turnover frame 32 is parallel to the circuit board, the positioning frame 33 and the abutting block 35 jointly press the chip to form rigid constraint. The hot air generated by the hot air welding device during welding is easy to cause the chip to deviate, and the pressing structure directly offsets the impact force of the airflow, ensures the accurate alignment of the chip and the circuit board pad, avoids the welding error caused by the position deviation, and when the turnover frame 32 rotates, the counterweight plate 37 generates a downward sliding component force with the change of the inclination angle, drives the abutting block 35 to cooperate with the positioning frame 33 to clamp the chip. When the inclination angle of the turnover frame 32 reaches the critical value, the abutting block 35 is attached to the side wall of the chip, and the chip is pushed to the closed end of the positioning frame 33 to form bidirectional limiting, and the clamping force is automatically adjusted by using the gravity component force, so that the chip is prevented from deviating from the positioning frame 33 due to centrifugal force during the turnover process.

[0060] Advantage two, the positioning frame 33 adopts a U-shaped structure design, and the side close to the circuit board is provided with a guide slope, when the external feeding device feeds the chip, the slope forms a natural guide track to guide the chip to enter the positioning frame 33 stably, and a plurality of groups of array arranged balls 331 are embedded in the inner wall of the positioning frame 33, which can convert the sliding friction between the chip and the positioning frame 33 into rolling friction, effectively preventing the chip from being damaged due to jamming during the feeding process of the chip, and when the turnover frame 32 rotates to the feeding position, the feeding action is completed cooperatively with the external chip conveying device, and the position of the chip does not need to be adjusted during the feeding process, and only the chip welding sequence needs to be followed. No matter what the initial position of the chip is in the positioning frame 33, the counterweight plate 37 and the abutting plate can realize the final limiting of the chip through cooperative action during the rotation of the turnover frame 32.

[0061] Advantage three, the movable rod 325 and the blocking rod 326 constitute a lever mechanism through the connecting rod 327, when the turnover frame 32 rotates from the feeding station to the vertical state, the counterweight plate 37 cooperates with the abutting block 35 to realize the limiting of the chip, during the process of the turnover frame 32 rotating from the vertical state to the welding station, the planar end of the blocking rod 326 mechanically limits the counterweight plate 37 to avoid the displacement of the counterweight plate 37 under the action of the return spring 36, which leads to the weakening of the limiting effect of the abutting block 35 on the chip, and when the turnover frame 32 rotates to the welding station, the movable rod 325 is pressed upward by the circuit board, the stroke reaches the maximum value, the blocking rod 326 is driven to retract into the slot hole 324 through the lever mechanism, the locking of the counterweight plate 37 is released, the counterweight plate 37 cooperates with the return spring 36 to drive the abutting block 35 to reset to the initial position along the guide hole 34, realizing the cyclic feeding of the chip.

[0062] Advantage four, the turnover frame 32 completes position conversion under the driving of the driving unit 4, when rotating to the feeding position, cooperates with the external chip conveying device to realize the automatic feeding of the chip, when rotating to the vertical state, the counterweight plate 37 drives the abutting block 35 to slide along the guide hole 34 by means of the gravitational component force, cooperates with the positioning frame 33 to form dynamic limiting and locking of the chip, when rotating to the welding position, cooperates with the reference of the positioning part 3 and the limiting part 2 to realize the accurate alignment of the chip and the circuit board pad area, through the position conversion of the turnover frame 32, integrates the automatic feeding and dynamic positioning process of the chip in the same tooling system, integrates the traditional separate feeding and positioning process through the mechanical action of the turnover frame 32 to form a coherent welding step.

[0063] The above embodiments are only used to illustrate the technical solutions of the present application, but not limit it; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements will not make the essence of the corresponding technical solutions deviate from the protection scope of the technical solutions of the embodiments of the present application.

Claims

1. A welding tool for automobile headlight chips based on a cooling channel structure, characterized in that: include: A base (1), wherein a limiting portion (2) for fixing a circuit board is provided on the top of the base (1), a positioning portion (3) for assisting chip welding is provided on the top of the base (1), and a driving unit (4) is provided on the top of the base (1); The positioning portion (3) includes a bearing seat (31) fixedly connected to the top of the base (1), and a flip frame (32) is rotatably connected inside the bearing seat (31), and a positioning frame (33) is fixedly connected to the side of the flip frame (32) close to the circuit board and is in contact with the outer side of the chip; The driving unit (4) is connected to the flip frame (32) by a transmission mechanism, and is used to drive the flip frame (32) to rotate around the central axis of the bearing seat (31). When the flip frame (32) rotates to a position parallel to the circuit board, the flip frame (32) presses the chip to prevent the chip from shifting during the welding process.

2. The automotive headlight chip welding tool based on the cooling channel structure according to claim 1, characterized in that: The positioning frame (33) is U-shaped, and the side of the positioning frame (33) close to the circuit board is inclined. The inner wall of the positioning frame (33) close to the chip is embedded with a ball (331), and a plurality of the ball (331) are provided and distributed in an array along the center of the positioning frame (33).

3. The automotive headlight chip welding tool based on the cooling channel structure according to claim 1, characterized in that: The flip frame (32) is slidably connected to an abutment block (35) that fits the outer side of the chip through a guide hole (34) opened on the top thereof. The guide holes (34) are provided in plurality and are distributed in an array along the center of the flip frame (32). The abutment block (35) is connected to the inner wall of the guide hole (34) through a return spring (36) arranged on the outer side thereof. The abutment block (35) is fixedly connected to a counterweight plate (37) on the side away from the positioning frame (33). The positioning frame (33) and the abutment block (35) are both designed with rough surfaces on the side close to the chip.

4. The automotive headlight chip welding tool based on the cooling channel structure according to claim 1, characterized in that: An air flow channel (321) is provided in the flip frame (32), and the air flow channels (321) are provided with two and are symmetrically distributed along the center of the flip frame (32). An air pipe (322) communicating with the air flow channel (321) is fixedly connected to the bottom of the flip frame (32), and a cooling unit (38) is fixedly connected to the outside of the flip frame (32), and the cooling unit (38) is communicated with the air flow channel (321) via a connecting pipe (381) provided on the outside of the flip frame (32).

5. The automotive headlight chip welding tool based on the cooling channel structure according to claim 1, characterized in that: The top of the flip frame (32) is provided with a vent hole (323), and the vent holes (323) are provided in plurality and distributed in an array along the center of the flip frame (32). The top of the flip frame (32) is provided with a slot hole (324), and the slot holes (324) are provided in two pieces and distributed symmetrically along the center of the flip frame (32).

6. The automotive headlight chip welding tool based on the cooling channel structure according to claim 5, characterized in that: The slot hole (324) is slidably connected to a movable rod (325) and a blocking rod (326) via a slide rail arranged inside the slot hole (324). The movable rod (325) and the blocking rod (326) are sequentially distributed from outside to inside along the slot hole (324).

7. The automotive headlight chip welding tool based on the cooling channel structure according to claim 6, characterized in that: The movable rod (325) and the blocking rod (326) are connected via a connecting rod (327). The top of the blocking rod (326) is designed as an inclined surface, and the bottom of the movable rod (325) is designed as an arc surface. The movable rod (325) is connected to the outer side of the slide rail via an elastic member arranged inside the movable rod (325).

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