A thin-film photovoltaic material scribing apparatus

Abstract

The application discloses a kind of film photovoltaic material scribe processing equipment.The equipment includes: rack, bottom plate, end plate, stage, support assembly and laser processing component;Bottom plate is arranged on rack;End plate is arranged on bottom plate;Stage is arranged on end plate;Support assembly is arranged on bottom plate;Laser processing component includes first light source, second light source, first reflector, beam expander, second reflector, shift piece, third reflector and cutting head;First light source is arranged on support table;First reflector is arranged on the right side of first light source, and the front side is provided with beam expander, through hole and second reflector;Shift piece is arranged on transmission component;Third reflector is arranged on the left side of second reflector;Second light source is arranged on the upper side of third reflector;Cutting head is arranged on the lower side of third reflector.Through multiple laser cutting, the applicability of the equipment for thin film photovoltaic material can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser processing, in particular to a thin-film photovoltaic material scribing processing equipment. BACKGROUND

[0002] Thin-film photovoltaic material is one of the most rapidly developing photoelectric conversion materials at present, among which perovskite as a typical representative shows excellent application potential in the field of solar cells. For the micro-nano processing of this kind of material, mechanical etching, diamond wire cutting and laser processing technologies are currently mainly used.

[0003] Among them, the principle of laser processing is to irradiate high-density high-energy laser beam on the surface of thin-film photovoltaic material, vaporize and remove part of the material to form cutting. In the prior art, the laser processing machine generally only uses one of the optical fiber (red light), purple light (ultraviolet), green light and other light sources to process thin-film photovoltaic material. However, due to the different material properties, thickness and processing quality requirements of the thin-film photovoltaic material to be processed, the required laser wavelength is also different, and the current laser processing machine cannot meet the laser cutting demand of various thin-film photovoltaic materials. SUMMARY

[0004] In order to solve the defects of the prior art, the purpose of the present application is to provide a thin-film photovoltaic material scribing processing equipment. The laser cutting device has at least two laser beams, which can select the corresponding laser beam to cut the material according to the processing requirement, and has higher applicability.

[0005] Based on the above purpose, the present application adopts the following technical scheme:

[0006] The application discloses a scribing device for thin-film photovoltaic material, which comprises a rack, a bottom plate, an end plate, a carrier, a support assembly and a laser processing assembly; the bottom plate is arranged on the rack at least partially; the end plate is arranged on the bottom plate at least partially and extends along the front-back direction of the processing device; the carrier is arranged on the end plate at least partially and can slide along the front-back direction of the end plate; the support assembly is arranged on the bottom plate at least partially and comprises a stand column arranged on the left and right sides of the end plate, a support table arranged on the stand column and a crossbeam arranged on the support table; the crossbeam is arranged on the front side of the support table at least partially and is provided with a through hole along the front-back direction on the right end; the crossbeam is provided with a conveying assembly extending along the left-right direction; the laser processing assembly comprises a first light source, a second light source, a first reflector, a beam expander, a second reflector, a moving carrier, a third reflector and a cutting head; the first light source is arranged on the support table; the first reflector is arranged on the right side of the first light source and is provided with the beam expander and the through hole in sequence on the front side; the second reflector is arranged on the front side of the through hole at least partially and is connected to the crossbeam; the moving carrier is arranged on the conveying assembly at least partially and can move along the left-right direction on the conveying assembly; the third reflector is arranged on the moving carrier at least partially and is arranged on the left side of the second reflector; the second light source is arranged on the moving carrier at least partially and is arranged on the upper side of the third reflector; and the cutting head is arranged on the bottom of the moving carrier and is arranged on the lower side of the third reflector.

[0007] Further, the processing device further comprises a detecting element for detecting the distance between the cutting head and the thin-film photovoltaic material along the vertical direction; the detecting element is arranged on the front end surface of the moving carrier at least partially.

[0008] Further, the detecting element comprises a CCD camera and a coaxial light source; the CCD camera is arranged on the front end surface of the moving carrier along the vertical direction; and the coaxial light source is arranged on the lower side of the CCD camera.

[0009] Further, the second light source comprises an isolator; the isolator is arranged on the moving carrier and is arranged on the upper side of the third reflector.

[0010] Further, the second light source further comprises a fixing element; the isolator is connected to the moving carrier through the fixing element; and the fixing element is provided with a first displacement element for adjusting the position of the isolator.

[0011] Further, the moving carrier is provided with a mounting plate for fixing the third reflector; and the mounting plate is provided with a second displacement element for adjusting the position of the third reflector.

[0012] Further, the cutting head comprises a lifting movable plate and a triangular mirror frame; the cutting head is arranged on the bottom of the moving carrier; and the triangular mirror frame is arranged on the bottom of the lifting movable plate.

[0013] Further, the front end surface of the transfer component is provided with a screw rod, a servo motor and a slide rail; the screw rod and the slide rail both extend in the up-down direction; the lifting dynamic plate is slidingly arranged on the slide rail and is connected with the screw rod at least in part; the servo motor is connected with the screw rod and can drive the screw rod to drive the lifting dynamic plate to move along the extension direction of the guide rail.

[0014] Further, the conveying assembly comprises a transmission component, a stator and guide rails arranged on the upper and lower sides of the stator; the transmission component is arranged on the top surface of the cross beam at least in part; the stator is arranged on the front end surface of the cross beam at least in part and extends in the left-right direction; the guide rails extend in the left-right direction; the transfer component is slidingly arranged on the guide rails and is connected with the transmission component.

[0015] The application provides a thin-film photovoltaic material scribing processing equipment. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is a structural schematic diagram of the thin-film photovoltaic material scribing processing equipment according to the application;

[0017] Figure 2 is a partial structural schematic diagram of a laser processing assembly of the thin-film photovoltaic material scribing processing equipment according to the application. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments will be described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative work are within the protection scope of the application.

[0019] In order to clearly illustrate the technical solutions of the application, the upper side, the lower side, the left side, the right side, the front side and the back side are defined as shown in Figure 1

[0020] As shown in Figure 1 and Figure 2 The application provides a thin-film photovoltaic material scribing processing equipment for laser scribing of thin-film photovoltaic materials. The thin-film photovoltaic material scribing processing equipment comprises a rack 11, a bottom plate 12, an end plate 13, a carrier 14, a support assembly 15, a conveying assembly 16 and a laser processing assembly 17.

[0021] ​Specifically, the bottom plate 12 is arranged at least partially on the rack 11 and serves as a main support structure of the device. The end plate 13 is arranged at least partially on the bottom plate 12 and extends substantially along the front-to-rear direction of the processing device. The carrier 14 is arranged at least partially on the end plate 13 and is slidable along the front-to-rear direction of the end plate 13, and is used to carry the thin-film photovoltaic material to be processed and to achieve cutting processing of the thin-film photovoltaic material along the y direction. The y direction refers to the front-to-rear direction.

[0022] The support assembly 15 is arranged at least partially on the bottom plate 12 and includes upright columns 151 arranged on the left and right sides of the end plate 13, and a support table 152 and a cross beam 153 arranged on the upright columns 151. The cross beam 153 is arranged at least partially on the front side of the support table 152 and has a through hole 1531 on the right end along the front-to-rear direction. The cross beam 153 is provided with a conveying assembly 16 extending along the left-to-right direction.

[0023] The laser processing assembly 17 includes a first light source 171, a second light source 172, a first reflector 173, a beam expander 174, a second reflector 175, a displacement member 176, a third reflector 177, and a cutting head 178. Specifically, the first light source 171 is arranged on the support table 152 and is used to provide a first laser beam. The first reflector 173 is arranged on the right side of the first light source 171 and has the beam expander 174 and the through hole 1531 arranged in sequence on the front side. The beam expander 174 is used to improve the collimation of the first laser beam, adjust the diameter of the first laser beam, and improve the quality of laser scribing. The second reflector 175 is arranged at least partially on the front side of the through hole 1531 and is connected to the cross beam 153. The displacement member 176 is arranged at least partially on the conveying assembly 16 and is movable along the left-to-right direction on the conveying assembly 16, so as to achieve cutting processing of the thin-film photovoltaic material by the laser processing assembly 17 along the x direction. The x direction refers to the left-to-right direction. The third reflector 177 is arranged at least partially on the displacement member 176 and is arranged on the left side of the second reflector 175. The second light source 172 is arranged at least partially on the displacement member 176 and is arranged on the upper side of the third reflector 177, and is used to provide a second laser beam. The cutting head 178 is arranged on the bottom of the displacement member 176 and is arranged on the lower side of the third reflector 177, and is used to focus the laser beam to cut the thin-film photovoltaic material.

[0024] The first light source 171 emits a first laser beam which is reflected by the first reflector 173 to the beam expander 174. After the beam expander 174 adjusts the diameter and collimation of the first laser beam, the first laser beam is transmitted to the second reflector 175 through the through hole 1531, is reflected by the second reflector 175 to the third reflector 177, and is reflected by the third reflector 177 to the cutting head 178 to cut the thin-film photovoltaic material. The third reflector 177 is a two-way mirror. The second light source 172 also emits a second laser beam which can be transmitted to the cutting head 178 through the third reflector 177 to process the thin-film photovoltaic material.

[0025] Through the above arrangement, the adaptability of the device to thin-film photovoltaic materials is improved, and the laser source, laser power, focal point position and cutting path can be dynamically adjusted according to the changes in the thickness, composition and characteristics of different materials, thereby ensuring high-precision and high-efficiency processing effect. At the same time, the integrated multi-laser system can reduce the production cost of thin-film photovoltaic materials, improve the production efficiency and reduce the material loss.

[0026] It should be understood that the laser processing assembly 17 can also be provided with more laser sources according to the processing requirements of thin-film photovoltaic materials.

[0027] As shown in Figure 2 , the processing device further comprises a detection member 18 for detecting the distance between the cutting head 178 and the thin-film photovoltaic material in the vertical direction, and the detection member 18 is at least partially arranged on the front end surface of the moving member 176. Before processing, the detection member 18 can be moved to the upper side of the thin-film photovoltaic material by the moving member 176 to detect the distance in the vertical direction from the thin-film photovoltaic material. The detection member 18 can ensure that the focal point of the cutting head 178 is located on the surface of the thin-film photovoltaic material, thereby improving the accuracy and reliability of the cutting.

[0028] Specifically, the detection member 18 comprises a CCD camera 181 and a coaxial light source 182, and the CCD camera 181 is arranged on the front end surface of the moving member 176 in the vertical direction, and the coaxial light source 182 is arranged on the lower side of the CCD camera 181. By using the CCD camera 181 and the coaxial light source 182, the accuracy and reliability of detection can be further improved.

[0029] As shown in Figure 2 , the second light source 172 comprises an isolator 1721. The isolator 1721 is arranged on the moving member 176 and is arranged on the upper side of the third mirror 177. The isolator 1721 is used to prevent the adverse effects of back transmission light in the second light source 172 on the optical path system, thereby improving the reliability of the device.

[0030] Further, the second light source 172 further comprises a fixing member 1722, and the isolator 1721 is connected to the moving member 176 through the fixing member 1722. The fixing member 1722 is provided with a first displacement member 1723 for adjusting the position of the isolator 1721, so as to adjust the relative position between the second light source 172 and the third mirror 177, thereby improving the accuracy of laser beam transmission.

[0031] The moving device 176 is provided with a mounting plate 1761 for fixing the third reflector 177. The mounting plate 1761 is provided with a second moving device 1762 for adjusting the position of the third reflector 177. The second moving device 1762 is used to adjust the relative position of the third reflector 177, the second reflector 175 and the cutting head 178, so as to ensure that the first laser beam can be accurately transmitted to the cutting head 178 after being reflected by the second reflector 175 and the third reflector 177, thereby improving the processing accuracy.

[0032] The cutting head 178 comprises a lifting dynamic plate 1781 and a triangular mirror frame 1782. The cutting head 178 is arranged at the bottom of the moving device 176. The triangular mirror frame 1782 is arranged at the bottom of the lifting dynamic plate 1781. The lifting dynamic plate 1781 is used to support the triangular mirror frame 1782, and the triangular mirror frame 1782 is used to ensure the stability of the structure of the cutting head 178.

[0033] The front end surface of the moving device 176 is provided with a lead screw 1763, a servo motor 1764 and a sliding rail 1765. The lead screw 1763 and the sliding rail 1765 both extend in the up-down direction. The lifting dynamic plate 1781 is slidingly arranged on the sliding rail 1765 and at least partially connected with the lead screw 1763. The servo motor 1764 is connected with the lead screw 1763 and can drive the lead screw 1763 to move the lifting dynamic plate 1781 along the extension direction of the guide rail 163. Through the above arrangement, the lifting dynamic plate 1781 can adjust the focal point of the cutting head 178 according to the detection result of the detection device 18, so as to ensure that the focal point is focused on the surface of the thin-film photovoltaic material and improve the cutting precision.

[0034] As shown in FIG. 1, Figure 1 The transmission assembly 16 comprises a transmission device 161, a stator 162 and a guide rail 163. Specifically, the stator 162 is at least partially arranged on the front end surface of the cross beam 153 and extends in the left-right direction. The guide rail 163 is arranged on both sides of the stator 162 in the up-down direction and extends in the left-right direction. The moving device 176 is slidingly arranged on the guide rail 163 and connected with the transmission device 161. The transmission device 161 is at least partially arranged on the top surface of the cross beam 153 and used to drive the moving device 176 to move on the guide rail 163 in the left-right direction.

[0035] The above describes the embodiments of the present application. Through the above description of the disclosed embodiments, those skilled in the art can implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A thin-film photovoltaic material scribe processing device, comprising: a frame (11) ; a base plate (12) arranged at least partially on the frame (11) ; an end plate (13) arranged at least partially on the base plate (12) ; a carrier (14) arranged at least partially on the end plate (13) and slidable in the front-back direction of the end plate (13) ; characterized in that the processing device further comprises: a support assembly (15) arranged at least partially on the base plate (12), comprising a column (151) arranged on the left and right sides of the end plate (13), and a support table (152) and a crossbeam (153) arranged on the column (151) ; the crossbeam (153) is arranged at least partially on the front side of the support table (152), and the right end is provided with a through hole (1531) in the front-back direction; the crossbeam (153) is provided with a conveying assembly (16) ; a laser processing assembly (17) comprising a first light source (171), a second light source (172), a first mirror (173), a beam expander (174), a second mirror (175), a transfer member (176), a third mirror (177), and a cutting head (178) ; the first light source (171) is arranged on the support table (152) ; the first mirror (173) is arranged on the right side of the first light source (171), and the front side is sequentially provided with the beam expander (174) and the through hole (1531) ; the second mirror (175) is arranged at least partially on the front side of the through hole (1531) and connected to the crossbeam (153) ; the transfer member (176) is arranged at least partially on the conveying assembly (16) and movable in the left-right direction on the conveying assembly (16) ; the third mirror (177) is arranged at least partially on the transfer member (176) and on the left side of the second mirror (175) ; the second light source (172) is arranged at least partially on the transfer member (176) and on the upper side of the third mirror (177) ; the cutting head (178) is arranged at the bottom of the transfer member (176) and on the lower side of the third mirror (177) ; the transfer member (176) is provided with a mounting plate (1761) for fixing the third mirror (177) ; the mounting plate (1761) is provided with a second displacement member (1762) for adjusting the position of the third mirror (177).

2. The thin film photovoltaic material scribe processing apparatus of claim 1, wherein, The processing device further comprises a detection member (18) for detecting the vertical distance between the cutting head (178) and the material to be processed; the detection member (18) is arranged at least partially on the front end face of the transfer member (176).

3. The thin film photovoltaic material scribing apparatus of claim 2, wherein, The detection member (18) comprises a CCD camera (181) and a coaxial light source (182), the CCD camera (181) is arranged on the front end surface of the transfer member (176) in the vertical direction, and the coaxial light source (182) is arranged on the lower side of the CCD camera (181).

4. The thin film photovoltaic material scribing apparatus of claim 1, wherein The second light source (172) comprises an isolator (1721), which is arranged on the transfer member (176) and on the upper side of the third mirror (177).

5. The thin film photovoltaic material scribing apparatus of claim 4, wherein, The second light source (172) further comprises a fixing member (1722), the isolator (1721) is connected to the transfer member (176) through the fixing member (1722), and the fixing member (1722) is provided with a first displacement member (1723) for adjusting the position of the isolator (1721).

6. The thin film photovoltaic material scribing apparatus of claim 1, wherein, The cutting head (178) comprises a lifting dynamic plate (1781) and a triangular mirror frame (1782), the cutting head (178) is arranged on the bottom of the transfer member (176), and the triangular mirror frame (1782) is arranged on the bottom of the lifting dynamic plate (1781).

7. The thin film photovoltaic material scribing apparatus of claim 6, wherein, The front end surface of the transfer member (176) is provided with a lead screw (1763), a servo motor (1764) and a slide rail (1765), the lead screw (1763) and the slide rail (1765) extend in the up-down direction, the lifting dynamic plate (1781) is slidingly arranged on the slide rail (1765) and is at least partially connected with the lead screw (1763), and the servo motor (1764) is connected with the lead screw (1763).

8. The thin film photovoltaic material scribing apparatus of claim 1, wherein, The conveying assembly (16) comprises a transmission member (161), a stator (162) and guide rails (163) arranged on the upper and lower sides of the stator (162), the transmission member (161) is at least partially arranged on the top surface of the cross beam (153), the stator (162) is at least partially arranged on the front end surface of the cross beam (153) and extends in the left-right direction, the guide rails (163) extend in the left-right direction, and the transfer member (176) is slidingly arranged on the guide rails (163) and is connected with the transmission member (161).

Images