Circuit board solder resist ink automatic adding device and method

Abstract

The invention relates to the technical field of circuit boards, in particular to a circuit board solder resist ink automatic adding device and method.The circuit board solder resist ink automatic adding device comprises a rack, a screen printing machine body, a camera shooting mechanism and an ink barrel and further comprises a mixing assembly, and the mixing assembly comprises a connecting rod, a rotating frame, a mixing rod, a supporting frame, a vertical cylinder, a connecting rod, a rotating edge and a rotating component; the connecting rod is connected with the ink barrel through the rotating component, the rotating frame is fixedly connected with the connecting rod, the mixing rod is fixedly connected with the rotating frame, the supporting frame is fixedly connected with the ink barrel, the vertical barrel is fixedly connected with the supporting frame, the rotating rod is fixedly connected with the connecting rod, the rotating edge is fixedly connected with the rotating rod, and the rotating component is arranged on the ink barrel. The mixing rod is arranged in the vertical cylinder and connected with the connecting rod, solder resist ink raw materials can be stirred in the vertical direction and the horizontal direction through cooperation of the mixing rod and the rotating edges in the vertical cylinder, solder resist ink can be fully mixed, deposition of the solder resist ink is avoided, and then reduction of adhesive force in the printing process is avoided.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of circuit board, and particularly relates to a circuit board solder resist ink automatic adding device and method. BACKGROUND

[0002] The main work of the traditional silk screen printing machine is to observe the remaining amount of the solder resist ink of the screen plate base and the solder resist ink coating condition of the circuit board by the staff, and when the solder resist ink is insufficient, the staff pours the solder resist ink into the screen plate base by lifting the barrel, but such operation is low in efficiency.

[0003] The existing circuit board solder resist ink automatic adding device comprises a circuit board silk screen printing mechanism, a camera mechanism and a solder resist ink adding mechanism. The camera mechanism comprises an industrial camera and an industrial computer, the industrial camera is located above the outlet of the transportation channel, the industrial camera is electrically connected with the industrial computer, and the display screen of the industrial computer displays the image of the industrial camera. The solder resist ink adding mechanism comprises a solder resist ink barrel, a first material pipe, a second material pipe and a conveying pump, and the conveying pump is electrically connected with the industrial computer. The camera mechanism of the device detects the solder resist ink coating condition of the circuit board, the industrial camera sends the image to the industrial computer, the conveying pump is controlled by the industrial computer, the solder resist ink is automatically added to the screen plate base, the staff does not need to be on duty at the circuit board silk screen printing mechanism, and the production efficiency is improved.

[0004] However, in the machining process, the solder resist ink in the ink barrel will precipitate, and the ink barrel in the existing device cannot mix and stir the solder resist ink, so that the adhesion of the precipitated solder resist ink will decrease when it is discharged for machining and printing. SUMMARY

[0005] The application aims to provide a circuit board solder resist ink automatic adding device and method, and aims to solve the problem that in the machining process, the solder resist ink in the ink barrel will precipitate, and the ink barrel in the existing device cannot mix and stir the solder resist ink, so that the adhesion of the precipitated solder resist ink will decrease when it is discharged for machining and printing.

[0006] To achieve the above technical purposes, the technical scheme adopted by the application is as follows: comprising a rack, a silk screen printing machine body, a camera mechanism and an ink barrel, the silk screen printing machine body is arranged on the rack and located at one side of the rack, the camera mechanism is arranged on the rack, the ink barrel is connected with the rack, and further comprising a mixing assembly, The mixing assembly comprises a connecting rod, a rotating frame, a mixing rod, a supporting frame, a vertical cylinder, a rotating rod, a rotating edge and a rotating member, the connecting rod is connected with the ink bucket through the rotating member and is located at one side of the ink bucket, the rotating frame is fixedly connected with the connecting rod and is located at one side of the connecting rod, the mixing rod is fixedly connected with the rotating frame and is located at one side of the rotating frame close to the ink bucket, the supporting frame is fixedly connected with the ink bucket and is located at one side of the ink bucket, the vertical cylinder is fixedly connected with the supporting frame and is located at one side of the supporting frame, the rotating rod is fixedly connected with the connecting rod and is located at one side of the connecting rod, the rotating edge is fixedly connected with the rotating rod and is located at one side of the rotating rod close to the vertical cylinder, and the rotating member is arranged on the ink bucket and connected with the connecting rod.

[0007] The rotating member comprises a rotating seat and a rotating shaft, the rotating seat is fixedly connected with the ink bucket and is located at one side of the ink bucket, and the rotating shaft is rotatably connected with the rotating seat and fixedly connected with the connecting rod and located at one side of the rotating seat close to the connecting rod.

[0008] The rotating member further comprises a driving motor, the driving motor is arranged on the rotating seat and connected with the rotating shaft and located at one side of the rotating seat close to the rotating shaft.

[0009] The rotating member further comprises a limiting ring, the limiting ring is fixedly connected with the rotating shaft and located at one side of the rotating shaft close to the rotating seat.

[0010] The mixing assembly further comprises an adding pipeline, the adding pipeline is connected with the ink bucket and located at one side of the ink bucket.

[0011] The mixing assembly further comprises a sealing plug, the sealing plug is arranged on the adding pipeline and located at one side of the adding pipeline.

[0012] The mixing assembly further comprises an observation window, the observation window is fixedly connected with the ink bucket and located at one side of the ink bucket.

[0013] The mixing assembly further comprises a limiting member, the limiting member comprises a limiting slide frame and a sliding block, the limiting slide frame is fixedly connected with the ink bucket and located at one side of the ink bucket, and the sliding block is slidably connected with the limiting slide frame and fixedly connected with the rotating frame and located at one side of the limiting slide frame close to the rotating frame.

[0014] The circuit board solder resist ink automatic adding device further comprises a conveying assembly, the conveying assembly comprises an output pump, a connecting hose and an output pipe, the output pump is arranged on the ink barrel and connected with the camera mechanism; the connecting hose is connected with the output pump and located on one side of the output pump; and the output pipe is arranged on the rack and connected with the connecting hose.

[0015] A circuit board solder resist ink automatic adding method, comprising the following steps: The solder resist ink is introduced into the ink barrel; The circuit board is placed on the workbench below the screen printing machine body; The rotating member is started to mix the solder resist ink in the ink barrel; The mixed solder resist ink is introduced onto the circuit board and the circuit board is coated by the screen printing machine body; The camera mechanism detects the solder resist ink coating condition of the circuit board and controls the automatic adding of the solder resist ink in the ink barrel; The solder resist ink coating of the circuit board is completed.

[0016] The circuit board solder resist ink automatic adding device and method of the present application can make the connecting rod rotate through the rotating member, drive the rotating frame to rotate in the ink barrel through the connecting rod, drive the mixing rod to rotate in the ink barrel through the rotation of the rotating frame, and stir the solder resist ink between the ink barrel and the vertical cylinder in the horizontal direction through the rotation of the mixing rod. Meanwhile, the rotating rod is driven to rotate through the rotation of the connecting rod, the rotating edge is driven to rotate in the vertical cylinder through the rotation of the rotating rod, and the solder resist ink at the bottom of the ink barrel is introduced into the top of the ink barrel through the rotation of the rotating edge, so that the solder resist ink can be stirred in the vertical direction. Thus, the mixing rod and the rotating edge in the vertical cylinder can cooperate to stir the solder resist ink in the vertical and horizontal directions, so that the solder resist ink can be fully mixed, thereby avoiding the solder resist ink precipitation and the resulting decrease in adhesion during printing. BRIEF DESCRIPTION OF DRAWINGS

[0017] The present application can be further illustrated by the non-limiting examples shown in the accompanying drawings.

[0018] Figure 1 is a structural schematic view of the circuit board solder resist ink automatic adding device of the first embodiment of the present application.

[0019] Figure 2 is a structural schematic view of the ink barrel of the first embodiment of the present application.

[0020] Figure 3 is a structural schematic view of the mixing assembly of the first embodiment of the present application.

[0021] Figure 4 is a structural schematic view of the limiting member of the second embodiment of the present application.

[0022] Figure 5 is a structural schematic view of the output assembly of the third embodiment of the present application.

[0023] Figure 6 is a step diagram of the automatic adding method of the circuit board soldering resist ink of the fourth embodiment of the present application.

[0024] In the figure: 101-frame, 102-screen printing machine body, 103-camera mechanism, 104-ink barrel, 105-connecting rod, 106-rotating frame, 107-mixing rod, 108-supporting frame, 109-vertical cylinder, 110-rotating rod, 111-rotating edge, 112-adding pipeline, 113-sealing plug, 114-rotating seat, 115-rotating shaft, 116-driving motor, 117-limiting ring, 118-observation window, 201-limiting slide, 202-sliding block, 301-output pump, 302-connecting hose, 303-output pipe. DETAILED DESCRIPTION

[0025] In order for those skilled in the art to better understand the present application, the technical solutions of the present application are further described below in combination with the drawings and examples.

[0026] Example one: As shown in Figures 1-3 , wherein Figure 1 is a structural schematic view of the automatic adding device of the circuit board soldering resist ink of the first embodiment of the present application. Figure 2 is a structural schematic view of the ink barrel of the first embodiment of the present application. Figure 3 is a structural schematic view of the mixing assembly of the first embodiment of the present application.

[0027] The application provides a kind of automatic adding device of circuit board solder resist ink, including rack 101, silk screen machine body 102, camera mechanism 103, ink tank 104 and mixing component, the mixing component includes connecting rod 105, rotating frame 106, mixing rod 107, support frame 108, vertical cylinder 109, rotating rod 110, rotating edge 111, rotating component, adding pipeline 112 and sealing plug 113, the rotating component includes rotating seat 114, rotating shaft 115, drive motor 116 and limit ring 117.The foregoing scheme solves the existing device in the process of processing, the solder resist ink in ink tank can be deposited, and the ink tank in the existing device cannot be stirred and mixed, so that the adhesion of the solder resist ink after deposition can be reduced when being exported for processing printing.It can be understood that the foregoing scheme can be used in the case where the solder resist ink in the ink tank needs to be stirred and mixed.

[0028] In the embodiment, the silk screen machine body 102 is arranged on the rack 101, the camera mechanism 103 is arranged on the rack 101, and the ink tank 104 is arranged on the rack 101.The silk screen machine body 102 and the ink tank 104 can be used to apply solder resist ink on the circuit board, and the camera mechanism 103 can be used to detect the application of solder resist ink on the circuit board, so as to automatically add solder resist ink.The structure of the rack 101, the silk screen machine body 102 and the camera mechanism 103 is described in detail in the prior art CN222128611U, and will not be described here.

[0029] The connecting rod 105 is connected with the ink barrel 104 through the rotating member and is located on one side of the ink barrel 104. The rotating frame 106 is fixedly connected with the connecting rod 105 and is located on one side of the connecting rod 105. The mixing rod 107 is fixedly connected with the rotating frame 106 and is located on one side of the rotating frame 106 close to the ink barrel 104. The support frame 108 is fixedly connected with the ink barrel 104 and is located on one side of the ink barrel 104. The vertical cylinder 109 is fixedly connected with the support frame 108 and is located on one side of the support frame 108. The rotating rod 110 is fixedly connected with the connecting rod 105 and is located on one side of the connecting rod 105. The rotating edge 111 is fixedly connected with the rotating rod 110 and is located on one side of the rotating rod 110 close to the vertical cylinder 109. The rotating member is arranged on the ink barrel 104 and is connected with the connecting rod 105. The connecting rod 105 is connected on the ink barrel 104 through the rotating member and can be driven to rotate through the rotating member. The rotating frame 106 is welded on the connecting rod 105 and can be driven to rotate through the rotation of the connecting rod 105. The mixing rod 107 has two, and the two mixing rods 107 are welded on the rotating frame 106. The mixing rod 107 can be driven to rotate in the ink barrel 104 through the rotating frame 106, so as to achieve the purpose of horizontal direction stirring of the solder resist ink. The support frame 108 has a plurality of support frames 108 welded on the bottom of the ink barrel 104. The vertical cylinder 109 is welded on the plurality of support frames 108 and can be supported in the ink barrel 104 through the support frame 108. The rotating rod 110 is welded below the connecting rod 105. The rotating edge 111 is welded on the rotating rod 110 and can be tightly rotated in the vertical cylinder 109, so as to be driven to rotate in the vertical cylinder 109 through the rotation of the rotating rod 110. The rotation of the rotating edge 111 can make the solder resist ink at the bottom of the ink barrel 104 enter the top of the ink barrel 104, so as to achieve the purpose of vertical direction stirring of the solder resist ink. The rotating member is arranged on the ink barrel 104 and is connected with the connecting rod 105. The connecting rod 105 can be driven to rotate through the rotating member, so as to realize that the connecting rod 105 is driven to rotate through the rotating member when the solder resist ink needs to be mixed and stirred. The rotating frame 106 can be rotated in the ink barrel 104 through the connecting rod 105. The mixing rod 107 can be driven to rotate in the ink barrel 104 through the rotation of the rotating frame 106.Further, the rotation of the mixing rod 107 can stir the solder resist ink between the ink barrel 104 and the vertical cylinder 109 in the horizontal direction, and the rotation of the connecting rod 105 can drive the rotation of the rotating rod 110, the rotation of the rotating rod 110 can drive the rotation of the rotating edge 111 in the vertical cylinder 109, and the rotation of the rotating edge 111 can guide the solder resist ink at the bottom of the ink barrel 104 to the top of the ink barrel 104, so that the solder resist ink can be stirred vertically, so that the solder resist ink can be fully mixed in the vertical and horizontal directions by the cooperation of the mixing rod 107 and the rotating edge 111 in the vertical cylinder 109, so that the solder resist ink can be fully mixed, thereby avoiding the deposition of the solder resist ink, and further avoiding the decrease of the adhesion during printing.

[0030] Secondly, the rotating seat 114 is fixedly connected with the ink barrel 104 and located on one side of the ink barrel 104; the rotating shaft 115 is rotatably connected with the rotating seat 114 and fixedly connected with the connecting rod 105, and located on the side of the rotating seat 114 close to the connecting rod 105, the rotating seat 114 is welded on the ink barrel 104, the rotating shaft 115 is rotatably connected in the rotating seat 114, the rotating seat 114 can support the rotation of the rotating shaft 115, and the rotating shaft 115 is welded on the connecting rod 105, so that the rotation of the connecting rod 105 can be driven by the rotation of the rotating shaft 115.

[0031] Meanwhile, the driving motor 116 is arranged on the rotating seat 114 and connected with the rotating shaft 115, and located on the side of the rotating seat 114 close to the rotating shaft 115, the driving motor 116 is bolted and fixedly installed on the rotating seat 114, the rotating shaft 115 is connected on the output end of the driving motor 116, the output of the driving motor 116 can drive the rotating shaft 115 to rotate; the limiting ring 117 is fixedly connected with the rotating shaft 115 and located on the side of the rotating shaft 115 close to the rotating seat 114, the limiting ring 117 is welded on the rotating shaft 115, the limiting ring 117 is welded on the rotating shaft 115, the limiting ring 117 is limited to rotate in the rotating seat 114, the rotating seat 114 can limit the rotation of the limiting ring 117, so that the rotation of the limiting ring 117 can avoid the displacement or dislocation of the rotating shaft 115 in the rotating seat 114.

[0032] In addition, the adding pipeline 112 is connected with the ink barrel 104 and located at one side of the ink barrel 104; the sealing plug 113 is arranged on the adding pipeline 112 and located at one side of the adding pipeline 112, the adding pipeline 112 is arranged on the ink barrel 104 and communicates with the ink barrel 104, so that the operator can add solder resist ink into the ink barrel 104 through the adding pipeline 112, and the sealing plug 113 arranged on the adding pipeline 112 can seal when the connecting pipeline is not used, so as to avoid impurities entering the ink barrel 104 through the adding pipeline 112.

[0033] Finally, the observation window is fixedly connected with the ink barrel 104 and located at one side of the ink barrel 104, and the observation window is bonded on the ink communication, the observation window is transparent glass material, so that the operator can observe the mixing condition of the solder resist ink in the ink barrel 104 in real time through the observation window.

[0034] When the solder resist ink needs to be mixed and stirred, the connecting rod 105 can be rotated through the rotating member, the rotating frame 106 can be rotated in the ink barrel 104 through the connecting rod 105, the mixing rod 107 can be rotated in the ink barrel 104 through the rotation of the rotating frame 106, the solder resist ink between the ink barrel 104 and the vertical cylinder 109 can be stirred in the horizontal direction through the rotation of the mixing rod 107, the rotating rod 110 can be rotated through the rotation of the connecting rod 105, the rotating edge 111 can be rotated in the vertical cylinder 109 through the rotation of the rotating rod 110, the solder resist ink at the bottom of the ink barrel 104 can be introduced into the top of the ink barrel 104 through the rotation of the rotating edge 111, so that the solder resist ink can be stirred in the vertical direction, so that the solder resist ink raw material can be stirred in the vertical direction and the horizontal direction through the cooperation of the mixing rod 107 and the rotating edge 111 in the vertical cylinder 109, so that the solder resist ink can be fully mixed, so as to avoid the solder resist ink precipitation, and thus avoid the adhesion to be reduced when printing.

[0035] The second embodiment of the application is: On the basis of the first embodiment, please refer to Figure 4 , Figure 4 is a structure diagram of the limiting member of the second embodiment of the application.

[0036] The application provides a circuit board solder resist ink automatic adding device, which further comprises a limiting component.

[0037] The limiting slide rack 201 is fixedly connected with the ink barrel 104 and located on one side of the ink barrel 104; the sliding block 202 is slidably connected with the limiting slide rack 201 and fixedly connected with the rotating frame 106 and located on the side of the limiting slide rack 201 close to the rotating frame 106; the limiting slide rack 201 is welded in the ink barrel 104; the sliding block 202 is two, and the two sliding blocks 202 are slidably connected in the limiting slide rack 201; the sliding block 202 is welded at two ends of the rotating frame 106; the rotation of the rotating frame 106 is limited through the limiting sliding of the sliding block 202, so that the rotation of the rotating frame 106 is more stable.

[0038] The third embodiment of the application is: On the basis of the second embodiment, refer to Figure 5 , Figure 5 The output assembly of the third embodiment of the application is shown in the structural schematic view.

[0039] The application provides a circuit board solder resist ink automatic adding device, which further comprises a conveying assembly, the conveying assembly comprising an output pump 301, a connecting hose 302 and an output pipe 303.

[0040] The output pump 301 is arranged on the ink barrel 104 and connected with the camera mechanism 103; the connecting hose 302 is connected with the output pump 301 and located on one side of the output pump 301; the output pipe 303 is arranged on the rack 101 and connected with the connecting hose 302; the output pump 301 is arranged below the ink barrel 104 and connected with the camera mechanism 103; the driving output of the output pump 301 can be controlled through the camera mechanism 103; the connecting hose 302 is connected on the output pump 301; the output pipe 303 is arranged on the rack 101 and connected with the connecting hose 302; the solder resist ink in the ink barrel 104 can be guided out through the connecting hose 302 and the output pipe 303 through the driving output of the output pump 301, so that the solder resist ink in the ink barrel 104 can be conveniently added by an operator.

[0041] The fourth embodiment of the application is: On the basis of the fourth embodiment, refer to Figure 6 , Figure 6 The fourth embodiment of the application is shown in the step view of a circuit board solder resist ink automatic adding method.

[0042] The application provides a kind of automatic adding method of circuit board solder resist ink, comprising the following steps: S401: the solder resist ink is introduced into the ink tank 104; S402: the circuit board is placed on the workbench below the screen printing machine body 102; S403: the rotating member is started to mix the solder resist ink in the ink tank 104; S404: the mixed solder resist ink is introduced into the circuit board and coated by the screen printing machine body 102; S405: the solder resist ink coating condition of the circuit board is detected by the camera mechanism 103, and the automatic adding of the solder resist ink in the ink tank 104 is controlled; S406: the solder resist ink coating of the circuit board is completed.

[0043] The operator introduces the solder resist ink into the ink tank 104, and places the circuit board on the workbench below the screen printing machine body 102, and starts the rotating member to drive the mixing rod 107 and the rotating edge 111 to rotate, so that the solder resist ink raw material can be stirred in the vertical direction and the horizontal direction by the cooperation of the mixing rod 107 and the rotating edge 111 in the vertical cylinder 109, so that the solder resist ink can be fully mixed, so as to avoid the solder resist ink precipitation, thereby avoiding the adhesion decrease during printing. The mixed solder resist ink is introduced into the circuit board and coated by the screen printing machine body 102, and the solder resist ink coating condition of the circuit board is detected by the camera mechanism 103, the camera mechanism 103 prestores the qualified circuit board solder resist ink coating image, the camera mechanism 103 compares the collected image with the prestored qualified circuit board solder resist ink coating image, judges the solder resist ink coating condition of the circuit board, and automatically adds the solder resist ink when the unqualified coated circuit board appears. The camera mechanism 103 completes the comparison without error, and completes the solder resist ink coating processing of the circuit board.

[0044] The above examples only illustrate the principles and effects of the application, and are not used to limit the application. Any person skilled in the art can modify or change the above examples without departing from the spirit and scope of the application. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical idea disclosed by the application should be covered by the claims of the application.

Claims

1. A circuit board solder mask ink automatic adding device, comprising a frame, a screen printing body, a camera mechanism and an ink barrel, wherein the screen printing body is arranged on the frame and is located on one side of the frame, the camera mechanism is arranged on the frame, and the ink barrel is connected to the frame, characterized in that: Also includes mixing components, The mixing assembly includes a connecting rod, a rotating frame, a mixing rod, a supporting frame, a vertical cylinder, a connecting rod, a rotating rib and a rotating component. The connecting rod is connected to the ink barrel through the rotating component and is located on one side of the ink barrel. The rotating frame is fixedly connected to the connecting rod and is located on one side of the connecting rod. The mixing rod is fixedly connected to the rotating frame and is located on a side of the rotating frame close to the ink barrel. The supporting frame is fixedly connected to the ink barrel and is located on one side of the ink barrel. The vertical cylinder is fixedly connected to the supporting frame and is located on one side of the supporting frame. The rotating rod is fixedly connected to the connecting rod and is located on one side of the connecting rod. The rotating rib is fixedly connected to the rotating rod and is located on a side of the rotating rod close to the vertical cylinder. The rotating component is arranged on the ink barrel and connected to the connecting rod.

2. The automatic adding device for solder resist ink for circuit board according to claim 1, characterized in that: The rotating component includes a rotating seat and a rotating shaft. The rotating seat is fixedly connected to the ink barrel and is located on one side of the ink barrel; the rotating shaft is rotatably connected to the rotating seat and fixedly connected to the connecting rod, and is located on the side of the rotating seat close to the connecting rod.

3. The automatic adding device for solder resist ink for circuit board according to claim 2, characterized in that: The rotating component further includes a limiting ring, which is fixedly connected to the rotating shaft and is located on a side of the rotating shaft close to the rotating seat.

4. The automatic adding device for solder resist ink for circuit board according to claim 1, characterized in that: The mixing assembly further includes an adding pipe connected to the ink barrel and located at one side of the ink barrel.

5. The automatic adding device for solder resist ink for circuit board according to claim 4, characterized in that: The mixing assembly further includes a sealing plug, which is arranged on the addition pipe and located at one side of the addition pipe.

6. The automatic adding device for solder resist ink for circuit board according to claim 1, characterized in that: The mixing assembly also includes a limiting component, which includes a limiting slide and a sliding block. The limiting slide is fixedly connected to the ink barrel and is located on one side of the ink barrel; the sliding block is slidably connected to the limiting slide and fixedly connected to the rotating frame, and is located on a side of the limiting slide close to the rotating frame.

7. The automatic adding device for solder resist ink for circuit board according to claim 1, characterized in that: The automatic adding device for solder mask ink for circuit boards also includes a conveying component, which includes an output pump, a connecting hose and an output pipe. The output pump is arranged on the ink barrel and is connected to the photographic mechanism; the connecting hose is connected to the output pump and is located on one side of the output pump; the output pipe is arranged on the frame and is connected to the connecting hose.

8. A method for automatically adding solder resist ink to a circuit board, suitable for the automatic solder resist ink adding device for a circuit board as claimed in claim 1, characterized in that: The following steps are involved: Introducing solder resist ink into the ink barrel; Placing the circuit board on the workbench below the screen printing machine body; Starting the rotating member to mix the solder resist ink in the ink barrel; introducing the mixed solder resist ink onto the circuit board and coating the circuit board through the screen printing machine; The solder resist ink coating condition of the circuit board is detected by a camera mechanism, and the solder resist ink in the ink barrel is automatically added; Complete the solder mask ink coating on the circuit board.

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