Automatic packaging device of wafer box and control method

Abstract

The invention provides an automatic packaging device for a wafer box and a control method. The automatic packaging device comprises an automatic feeding module, an AOI appearance detection module, an automatic overturning module, a picking module, a labeling module, an auxiliary material feeding module, an automatic packaging module, a packaging bag feeding module, an automatic discharging module, a discharging AOI appearance detection module and a discharging labeling module. The automatic feeding module is used for bearing the wafer box; the auxiliary material feeding module is used for pasting auxiliary materials on the wafer boxes, and the labeling module is used for pasting labels on the wafer boxes; the automatic packaging module is used for sleeving the wafer box with a packaging bag; the automatic discharging module is used for moving the packaged wafer box to the discharging AOI appearance detection module; the discharging AOI appearance detection module is used for detecting whether the packaged wafer box is qualified or not; the discharging and labeling module is used for labeling the packaged wafer boxes. All packaging actions of the wafer box can be completed at a time through the automatic packaging device, and the production efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer packaging, in particular to an automatic packaging device and control method for wafer boxes. BACKGROUND

[0002] In the field of semiconductor manufacturing, the transportation and storage of wafers are of great importance. Wafer boxes are used to carry and protect wafers, ensuring their safety during production, transportation, and storage. In order to prevent wafers from being contaminated, damaged, or affected by the external environment during transportation, wafer boxes often need to be packaged. However, existing wafer box packaging equipment mostly adopts manual or semi-automatic packaging methods, which have many problems.

[0003] Firstly, manual packaging is inefficient. Due to the different sizes and shapes of wafer boxes, and the need for precise placement and fixation, manual operation is difficult to complete the packaging of a large number of wafer boxes in a short time. This not only increases production costs, but also may cause delays in production progress. For example, on a large-scale production line, the speed of manual packaging is far from meeting the production demand, thus becoming a bottleneck in the production process.

[0004] Secondly, the quality of manual packaging is unstable. Due to the subjectivity and inconsistency of manual operation, the tightness, sealing performance, and usage amount of packaging materials are difficult to guarantee consistency. This may cause some wafer boxes to be damaged during transportation due to loose packaging, or the wafers to be contaminated due to insufficient sealing. For example, uneven force during manual wrapping of the packaging tape may cause the packaging tape to loosen, resulting in loose packaging during transportation.

[0005] In addition, although semi-automatic packaging equipment improves packaging efficiency to some extent, it still has many limitations. Semi-automatic equipment usually needs manual assistance to complete part of the operation, such as placing wafer boxes and adjusting packaging positions. This not only increases the frequency of manual intervention, but also may cause operational errors. At the same time, the automation degree of semi-automatic equipment is low, and it cannot realize full-automatic control of the packaging process, making it difficult to match the automation degree of modern production lines. For example, semi-automatic equipment may need manual frequent adjustment of packaging parameters during the packaging process, which not only increases the complexity of operation, but also may cause fluctuations in packaging quality.

[0006] With the rapid development of the semiconductor industry, higher requirements are put forward for the efficiency, quality, and automation degree of wafer box packaging. Therefore, developing a fully automatic wafer box packaging equipment to improve packaging efficiency, ensure packaging quality, and realize full-automatic packaging process is a technical problem to be solved at present. SUMMARY

[0007] Therefore, the automatic packaging device and the control method of the wafer box are provided to achieve full-automatic packaging of the wafer box, so that the original manual or semi-automatic packaging is changed to full-automatic packaging.

[0008] The embodiments of the present specification provide the following technical solutions: An automatic packaging device of a wafer box comprises: An automatic feeding module, an AOI appearance detection module, an automatic overturning module, a picking module, a labeling module, a supplementary material feeding module, an automatic packaging module, a packaging bag feeding module, an automatic discharging module, a discharging AOI appearance detection module, and a discharging labeling module. The AOI appearance detection module is arranged at an intermediate station of the automatic feeding module, and the automatic overturning module is arranged at the last station of the automatic feeding module and is used to receive the wafer box on the AOI appearance detection module. The supplementary material feeding module and the labeling module are arranged opposite to each other, the picking module is arranged between the supplementary material feeding module and the labeling module, the feeding side of the picking module is arranged at the wafer box discharging side of the automatic overturning module, the supplementary material feeding module is used to paste supplementary materials on the wafer box, and the labeling module is used to paste labels on the wafer box. The automatic packaging module is arranged at the wafer box discharging side of the picking module, the packaging bag feeding module is arranged at the packaging bag feeding side of the automatic packaging module, and the automatic packaging module is used to receive the packaging bag in the packaging bag feeding module and to wrap the packaging bag outside the wafer box. The automatic discharging module is arranged at the wafer box discharging side of the automatic packaging module and is used to move the packaged wafer box to the discharging AOI appearance detection module. The discharging AOI appearance detection module is arranged above the automatic discharging module, and the discharging AOI appearance detection module is used to detect whether the packaged wafer box is qualified. The discharging labeling module is arranged at one side of the automatic discharging module, and the discharging labeling module is used to paste labels on the packaged wafer box.

[0009] Further, the automatic packaging module comprises: A packaging moving platform, a belt grabbing assembly, a lower bag suction assembly, an upper bag suction assembly, a left middle edge pulling assembly, a right middle edge pulling assembly, a cutting assembly, a bag supporting assembly, a bag pressing assembly, and a rubber sticking assembly. The belt grabbing assembly is arranged on the frame of the automatic packaging module and is used to pick up and move the packaging bag. The packaging moving platform is fixed on the bottom of the frame of the automatic packaging module and is used to place and move the wafer box. The lower bag suction assembly and the upper bag suction assembly are arranged on the upper and lower sides of the packaging moving platform respectively, and the lower bag suction assembly and the upper bag suction assembly are used to open the four corners of the packaging bag. The left middle pull edge assembly and the right middle pull edge assembly are respectively arranged on the left and right sides of the packaging mobile platform, and both the left middle pull edge assembly and the right middle pull edge assembly are used to pull the middle part of the packaging bag; The tying assembly is arranged on the loading side of the packaging mobile platform, the bag-supporting assembly (780) is arranged on the upper and lower sides of the packaging mobile platform, and is staggered in front and back with respect to the wafer box entry direction of the lower suction bag assembly and the upper suction bag assembly, the tying assembly is used to clamp the packaging bag and vacuum the packaging bag, and the bag-supporting assembly is used to pre-press, press and heat the opening side of the packaging bag; The bag pressing assembly is arranged at the rear side of the bag supporting assembly and is used to fold the opening side of the packaging bag downward; The adhesive tape component is arranged on one side of the opening of the packaging bag and is used to stick the adhesive tape to the packaged wafer box.

[0010] Furthermore, the packaged mobile platform includes: A mobile module, a rotating support unit, a packaging platform and a pressing module, wherein the rotating support unit is fixed on the mobile module, the packaging platform is fixed on the rotating support unit, and the pressing module is fixed on the packaging platform; The grab belt assembly includes: The bag grabbing transverse movement module, the bag grabbing Z-axis module and the bag grabbing claw assembly. The bag grabbing transverse movement module is connected to the bag grabbing transverse movement module through the bag grabbing Z-axis module. The bag grabbing claw assembly moves horizontally through the bag grabbing transverse movement module and vertically through the bag grabbing Z-axis module. The lower suction bag assembly includes: Lower suction bag Z-axis module, lower suction bag suction head, left lower bag pull-up component and right lower bag pull-up component. The lower suction bag suction head is fixed at the upper end of the lower suction bag Z-axis module. The lower suction bag suction head moves vertically through the lower suction bag Z-axis module. The left lower bag pull-up component and the right lower bag pull-up component are respectively fixed at both ends of the lower suction bag suction head. The upper suction bag assembly includes: Upper bag suction Z-axis module, upper bag suction head, left upper bag pulling component and right upper bag pulling component. The upper bag suction head is fixed at the lower end of the lower bag suction Z-axis module. The upper bag suction head moves vertically through the upper bag suction Z-axis module. The left upper bag pulling component and the right upper bag pulling component are respectively fixed at both ends of the upper bag suction head; The left middle pull edge components include: The left middle pull belt transverse movement shaft and the left middle pull belt claw are fixed on the left middle pull belt transverse movement shaft, and the left middle pull belt claw is used to pull the middle of the packaging bag; The right middle pull edge components include: A right middle pull belt transverse shifting shaft and a right middle pull belt claw, wherein the right middle pull belt claw is fixed on the right middle pull belt transverse shifting shaft and is used to pull the middle of the packaging bag; The tying components include: The bagging Z-axis, the bagging X-axis, the bagging Y-axis and the vacuumizing assembly are all fixed on the base of the bagging opening assembly, the bagging Z-axis can move up and down relative to the base, the bagging X-axis and the bagging Y-axis are both provided with a grabbing claw and are used for clamping the packaging bag, and the vacuumizing assembly is used for vacuumizing the packaging bag. The bag supporting assembly comprises: The bag supporting Z-axis, the upper sealing cover and the lower sealing cover are all fixed on the bag supporting Z-axis, and the upper sealing cover and the lower sealing cover can move close to or away from the bag supporting Z-axis.

[0011] Further, the bag pressing assembly comprises: The bag pressing Z-axis and the bag pressing roller, the bag pressing roller is fixed on the bag pressing Z-axis and can move up and down along the bag pressing Z-axis; The glue sticking assembly comprises: The glue removing assembly, the glue feeding module and the glue sucking assembly, the glue sucking assembly is arranged above the glue feeding module, the glue removing assembly is used for providing the adhesive tape, the glue feeding module is used for conveying the adhesive tape to the sticking station of the glue sucking assembly, and the adhesive tape is stuck on the packaging bag of the wafer box through the glue sucking assembly.

[0012] Further, the packaging bag feeding module comprises: The packaging bag storage bin, the storage bin lifting assembly, the material taking manipulator assembly and the material placing platform assembly; The packaging bag storage bin is connected with the storage bin lifting assembly and is driven to move up and down by the storage bin lifting assembly; The packaging bag is placed in the packaging bag storage bin; The material taking manipulator assembly is arranged on the discharge side of the packaging bag storage bin and is used for taking out the packaging bag in the packaging bag storage bin; One end of the material placing platform assembly is fixed on the storage bin lifting assembly and is used for placing the taken-out packaging bag.

[0013] Further, the automatic feeding module comprises: The feeding module and a plurality of feeding Buffer positions; The feeding Buffer positions are sequentially arranged in the feeding direction from the feeding side to the discharging side, and the feeding module is arranged below the feeding Buffer position on the feeding side of the automatic feeding module; The feeding and labeling module comprises: The printing and peeling module of the outer packaging label, the feeding assembly and the label sticking assembly; The printing and peeling module of the outer packaging label is used for providing the outer packaging label, the outer packaging label is conveyed to the label sticking assembly through the feeding assembly, and the outer packaging label is stuck on the packaging bag of the sealing cover through the label sticking assembly.

[0014] A control method of a wafer box automatic packaging device, using the wafer box automatic packaging device to automatically package a wafer box, comprising the following steps: The wafer box is conveyed to the detection station of the AOI appearance detection module by the automatic feeding module, and the appearance of the wafer box is detected by the automatic turnover module and the AOI appearance detection module; If the appearance detection is qualified, the wafer box is moved to the auxiliary material feeding module by the picking module, and the auxiliary material is attached to the outside of the wafer box; After the wafer box is moved to the labeling module by the picking module, the wafer box is moved to the automatic packaging module by the picking module; The packaging bag is conveyed to the automatic packaging module by the packaging bag feeding module, and the wafer box is put into the packaging bag and sealed by the automatic packaging module and the picking module, and the sealed packaging bag is conveyed to the discharge port; The sealed packaging bag is picked up at the discharge port by the automatic discharge module, and is conveyed to the discharge AOI appearance detection module, and the appearance of the sealed packaging bag is detected by the discharge AOI appearance detection module, and the outer packaging label is attached to the sealed packaging bag by the discharge labeling module.

[0015] Further, the appearance of the wafer box is detected by the automatic turnover module and the AOI appearance detection module, comprising: The wafer box is automatically optically detected by the AOI appearance detection module; It is determined whether the wafer box needs to be turned over according to external requirements, if the wafer box needs to be turned over, the wafer box is turned over by the automatic turnover module, and the other side of the wafer box is automatically optically detected by the AOI appearance detection module, if the wafer box does not need to be turned over, the automatic optical detection is ended; If the automatic optical detection is qualified, the wafer box is moved to the Mapping detection station of the AOI appearance detection module by the picking module, wherein the Mapping detection is used to detect the state of the wafer in the wafer box; If the Mapping detection is qualified, the appearance detection is qualified, if the automatic optical detection is unqualified and / or the Mapping detection is unqualified, the appearance detection is unqualified.

[0016] Further, the wafer box is conveyed to the automatic packaging module by the packaging bag feeding module, and the wafer box is put into the packaging bag by the automatic packaging module and the picking module, and the packaged wafer box is conveyed to the discharge side of the automatic packaging module, comprising: The packaging bag storage bin is moved to the discharge position by the storage bin lifting assembly, and the packaging bag is picked up at the discharge position by the material taking manipulator assembly and placed on the upper surface of the discharging platform assembly; The packaging bag is adsorbed on the surface of the discharge platform assembly, and the bag grabbing transverse moving module of the grab belt assembly moves transversely to the top of the discharge platform assembly; Adjust the table of the rotating support unit so that the table of the rotating support unit is level with the table of the packaging platform; Control the Z-axis module of the bag grabbing unit to descend, pick up the packaging bag through the bag grabbing claw assembly and place the packaging bag on the packaging platform of the mobile packaging platform; Move the packaging platform and the rotating support unit to a position where the lower surface of the packaging bag can rest on the upper surface of the lower suction bag suction head; Suction the packaging bag through the lower suction bag suction head; Control the bag grabbing Z-axis module and the bag upper suction Z-axis module to simultaneously descend to the upper surface of the packaging bag, use the suction cups on the left upper bag pulling component and the right upper bag pulling component to suck the upper surface of the packaging bag and then pull it to a certain height; After clamping the four corners of the packaging bag with the upper left bag component, the upper right bag component, the lower left bag component, and the lower right bag component, the upper left bag component, the upper right bag component, the lower left bag component, and the lower right bag component are pulled to open the packaging bag until the bag opening is opened to the maximum; Rotate the rotary support unit in the opposite direction to a vertical state; Extend the left and right middle drawstring transverse axes, and use the left and right middle drawstring claws to pull the middle of the packaging bag to open the packaging bag to the maximum; Place the wafer box into the packaging bag through the pick-up module and fix the wafer box with the clamping claws of the packaging platform; After the picking module is retracted, the left middle pull edge assembly and the right middle pull edge assembly are retracted; The Z-axis of the bag tying assembly descends vertically, and when the clamping claws of the bag tying Y-axis are open, the middle of the bag is clamped by the bag tying X-axis; The clamping claws of the bag-tying X-axis push the bag from the outside, the upper bag suction assembly clamps the bag and moves downward, and the lower bag suction assembly clamps the bag and moves upward; When the upper suction bag assembly approaches the lower suction bag assembly, the upper seal and the lower seal move toward each other at the same time, and after the upper seal and the lower seal clamp the packaging bag, the packaging bag is pre-pressed, and the lower suction bag assembly and the upper suction bag assembly are withdrawn to their original state; The clamping claws on the Y-axis of the bag are withdrawn, and the upper seal and the lower seal move toward each other again at the same time. After the upper seal and the lower seal clamp the packaging bag, the packaging bag is pressed tightly. The packaging bag is continuously inflated and evacuated by the vacuum assembly to form a vacuum. When the packaging bag is tightened, the moving module moves forward following the state of the packaging bag; When the vacuum degree of the packaging bag reaches the set value, the sealing of the packaging bag is heated by the upper sealing and the lower sealing, the position of the moving module is kept unchanged, and the upper sealing and the lower sealing are loosened and then retracted; The bag opening of the sealed packaging bag is flattened by the bag pressing roller, and the bag opening of the sealed packaging bag is pressed on the wafer box by the clamping head of the pressing module, and the moving module is moved to the vicinity of the adhesive assembly; The adhesive tape is torn and cut by the adhesive removal assembly, and the adhesive tape is pasted on the bag opening of the sealed packaging bag after the adhesive removal assembly moves to the adhesive removal assembly to obtain the adhesive tape. The wafer box after packaging is transported to the unloading side of the automatic packaging module by the moving module.

[0017] Further, it also includes: The total length of the packaging bag is L, the length of the bottom of the packaging bag is L1, the length of the wafer box is L3, L2 is the length of the packaging bag after removing the bottom, L2=L-L1, L4 is the length of the bevel of the packaging bag after heat sealing, L5 is the length of the opening of the packaging bag from the sealing, L6 is the overall height of the packaging bag after being pulled open, L7 is the length of the packaging bag after vacuumizing, and L8 is the projection length of the bevel of the packaging bag after heat sealing in the Y direction, then L2=L3+L4+L5, L7+L6 / 2=L2-L3. In the pre-pressing, the initial stretching distance of the upper bag suction Z-axis module is L6, the moving distance of the upper bag suction Z-axis module, the bag grabbing Z-axis module, the upper sealing and the lower sealing in the Z direction is L6 / 2, and the moving distance of the moving module in the Y direction is L4-L8, so that the time for moving the upper bag suction Z-axis module, the bag grabbing Z-axis module, the upper sealing and the lower sealing by L6 / 2 is equal to the time for moving the moving module by L4-L8. In the vacuumizing of the packaging bag, the difference between the change time of the deformation distance L4-L6 / 2 of the packaging bag caused by the vacuumizing and the change time of the moving distance L8+L5-L7 of the moving module is less than a set difference value.

[0018] Compared with the prior art, the above at least one technical scheme adopted by the embodiments of the present application can achieve at least the following beneficial effects: The wafer box automatic packaging device of the embodiments of the present application can complete all packaging actions of the wafer box at one time, can effectively reduce the labor, and can improve the production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creating labor.

[0020] Figure 1 is a schematic diagram of an automatic packaging device of a wafer box of an embodiment of the present application; Figure 2 is a schematic diagram of an automatic feeding module, an AOI appearance detection module and an automatic overturning module of an embodiment of the present application; Figure 3 is a detailed schematic diagram of an automatic overturning module of an embodiment of the present application; Figure 4 is a schematic diagram of a picking module, a labeling module and a spare material feeding manipulator assembly of an embodiment of the present application; Figure 5 is a schematic diagram of an automatic packaging module and a packaging bag feeding module of an embodiment of the present application; Figure 6 is a first schematic diagram of an automatic packaging module of an embodiment of the present application; Figure 7 is a second schematic diagram of an automatic packaging module of an embodiment of the present application; Figure 8 is a detailed schematic diagram of a packaging bag feeding module of an embodiment of the present application; Figure 9 is a schematic diagram of a packaging moving platform of an embodiment of the present application; Figure 10 is a schematic diagram of a tape grabbing assembly of an embodiment of the present application; Figure 11 is a schematic diagram of a lower bag sucking assembly of an embodiment of the present application; Figure 12 is a schematic diagram of an upper bag sucking assembly of an embodiment of the present application; Figure 13 is a schematic diagram of a left middle edge pulling assembly of an embodiment of the present application; Figure 14 is a schematic diagram of a right middle edge pulling assembly of an embodiment of the present application; Figure 15 is a schematic diagram of a knotting assembly of an embodiment of the present application; Figure 16 is a schematic diagram of a bag supporting assembly of an embodiment of the present application; Figure 17 is a schematic diagram of a bag pressing assembly of an embodiment of the present application; Figure 18 is a schematic diagram of a rubber sticking assembly of an embodiment of the present application; Figure 19 is a schematic diagram of an automatic feeding module, a feeding AOI appearance detection module and a feeding labeling module of an embodiment of the present application; Figure 20 is a schematic diagram of a packaging process of a packaging bag of an embodiment of the present application; Figure 21is a side view of a packaging bag in an unopened state of an embodiment of the present application; Figure 22 is a side view of a packaging bag in an opened state of an embodiment of the present application; Figure 23 is a side view of a packaging bag in a pre-pressed and non-vacuumed state of an embodiment of the present application; Figure 24 is a schematic view of a bag supporting assembly, a packing moving platform, a lower bag sucking assembly, and an upper bag sucking assembly of an embodiment of the present application; Figure 25 is a schematic view of a rotating state of a rotating supporting unit of an embodiment of the present application.

[0021] Figure, reference signs: 100, automatic feeding module; 110, Buffer position; 120, horizontal transfer manipulator; 130, NG port assembly; 200, AOI appearance detection module; 210, bottom AOI detection assembly; 220, top AOI detection assembly; 230, detection completed station; 300, automatic turnover module; 310, feeding shaft; 320, turnover assembly; 400, picking module; 500, labeling module; 510, printer assembly; 520, label picking assembly; 530, code reader; 540, manipulator pasting and code scanning assembly; 600, auxiliary material feeding module; 610, auxiliary material feeding manipulator assembly; 620, humidity card; 630, desiccant; 700, automatic packaging module; 710, packaging moving platform; 711, moving module; 712, rotating support unit; 713, packaging platform; 714, pressing module; 720, belt grabbing assembly; 721, bag grabbing horizontal moving module; 722, bag grabbing Z-axis module; 723, bag grabbing jaw assembly; 730, lower bag suction assembly; 731, lower bag suction Z-axis module; 732, lower bag suction head; 733, left lower bag pulling element; 734, right lower bag pulling element; 740, upper bag suction assembly; 741, upper bag suction Z-axis module; 742, upper bag suction head; 743, left upper bag pulling element; 744, right upper bag pulling element; 750, left middle belt pulling assembly; 751, left middle belt pulling horizontal shaft; 752, left middle belt pulling claw; 760, right middle belt pulling assembly; 761, right middle belt pulling horizontal shaft; 762, right middle belt pulling claw; 770, knotting assembly; 771, bag knotting Z-axis; 772, bag knotting X-axis; 773, bag knotting Y-axis; 774, vacuum pumping assembly; 780, bag supporting assembly; 781, bag supporting Z-axis; 782, upper sealing; 783, lower sealing; 790, bag pressing assembly; 791, bag pressing Z-axis; 792, bag pressing roller; 7100, rubber pasting assembly; 7101, rubber detaching assembly; 7102, rubber feeding module; 7103, rubber suction assembly; 800, packaging bag feeding module; 810, packaging bag storage bin; 820, storage bin lifting assembly; 830, material taking manipulator assembly; 840, material placing platform assembly; 900, automatic discharging module; 910, discharging module; 920, discharging Buffer position; 1000, discharging AOI appearance detection module; 1100, discharging labeling module; 1110, feeding assembly; 1120, outer packaging label printing and peeling module; 1130, label pasting assembly. DETAILED DESCRIPTION

[0022] The embodiments of the present application will be described in detail below with reference to the drawings.

[0023] It should be noted that the embodiments and features in the embodiments of the present application can be combined with each other without conflict. The present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0024] AsFigure 1 As shown in the drawings, an automatic packaging device of a wafer box comprises: The automatic feeding module 100, the AOI appearance detection module 200, the automatic overturning module 300, the pickup module 400, the labeling module 500, the auxiliary material feeding module 600, the automatic packaging module 700, the packaging bag feeding module 800, the automatic discharging module 900, the discharging AOI appearance detection module 1000 and the discharging labeling module 1100.

[0025] The AOI appearance detection module 200 is arranged at the middle station of the automatic feeding module 100, and the automatic overturning module 300 is arranged at the last station of the automatic feeding module 100 and used for receiving the wafer box located at the AOI appearance detection module 200.

[0026] The auxiliary material feeding module 600 is arranged opposite to the labeling module 500, and the pickup module 400 is arranged between the auxiliary material feeding module 600 and the labeling module 500. The feeding side of the pickup module 400 is arranged at the wafer box discharging side of the AOI appearance detection module 200. The auxiliary material feeding module 600 is used for pasting auxiliary materials on the wafer box, and the labeling module 500 is used for pasting labels on the wafer box.

[0027] The automatic packaging module 700 is arranged at the wafer box discharging side of the pickup module 400, and the packaging bag feeding module 800 is arranged at the packaging bag feeding side of the automatic packaging module 700. The automatic packaging module 700 is used for receiving the packaging bag in the packaging bag feeding module 800 and sleeving the packaging bag on the outside of the wafer box.

[0028] The automatic discharging module 900 is arranged at the wafer box discharging side of the automatic packaging module 700 and used for moving the packaged wafer box to the discharging AOI appearance detection module 1000 or to other equipment.

[0029] The discharging AOI appearance detection module 1000 is arranged above the automatic discharging module 900, and the discharging AOI appearance detection module 1000 is used for detecting whether the packaged wafer box is qualified.

[0030] The discharging labeling module 1100 is arranged at one side of the automatic discharging module 900, and the discharging labeling module 1100 is used for pasting labels on the packaged wafer box.

[0031] The automatic feeding module 100 is used to receive a wafer box. The feeding position of the automatic feeding module 100 is compatible with manual feeding, AGV (Automated Guided Vehicle) feeding and OHT (Overhead Hoist Transport) feeding. The feeding interface standard meets the standard of SEMI (Semiconductor Equipment and Materials International). A plurality of buffer positions are arranged in the module to buffer a plurality of wafer boxes. Each position can be complementary. A mechanical hand is arranged on the buffer. The mechanical hand holds the wafer box and moves the wafer box to the position of the AOI bottom detection assembly 210 to perform AOI bottom detection.

[0032] Subsequently, the wafer box that passes the detection is placed on the automatic turnover module 300 to perform further AOI top detection. After the detection is completed, the wafer box is flipped or not flipped according to the actual unloading requirement.

[0033] Subsequently, the pickup mechanical hand of the pickup module 400 holds the wafer box and places the wafer box on the Mapping detection position of the AOI. The Mapping detection position is used to detect the state of the wafer in the wafer box. After the detection is passed, the pickup mechanical hand holds the wafer box and moves the wafer box to the position of the auxiliary material feeding module 600 (firstly, the wafer box is moved to the detection completed position 230, and then the wafer box is moved to the auxiliary material feeding module 600 by the pickup module 400).

[0034] The mechanical hand of the auxiliary material feeding module 600 is prepared in advance. The mechanical hand of the auxiliary material feeding module 600 takes out the auxiliary material such as a desiccant and a humidity card from an auxiliary material feeding box and waits. After the pickup mechanical hand holds the wafer box and reaches the specified position, the mechanical hand of the auxiliary material feeding module 600 sticks the auxiliary material to the outside of the wafer box.

[0035] After the auxiliary material feeding is completed, the pickup mechanical hand holds the wafer box and places the wafer box on the position of the labeling module 500. The position of the labeling module 500 automatically completes the printing, peeling, sticking and detection of the outer packaging label according to the requirement.

[0036] After the labeling is completed, the mechanical hand of the pickup module 400 places the wafer box at the packaging position of the automatic packaging module 700. Before this, the packaging moving platform 710 is prepared to open the packaging bag. The opening action of the packaging moving platform 710 is as follows. The packaging bag loading module 800 determines the type of packaging bag (aluminum foil bag and PE bag, and there are two specifications, three-dimensional bag and flat bag, which will result in two different packaging methods, the difference is that the three-dimensional bag is made in the required style in advance, and the flat bag is not, it is only a simple upper and lower packaging bag. When using a three-dimensional bag, the three-dimensional bag has an open end and a closed end), the mechanical hand will grab the closed end of the packaging bag from the packaging bag loading box and place it on a platform, and then the automatic packaging module at the top will have a mechanical hand that will place the packaging bag on the packaging platform. The automatic packaging module 700 has several mechanical shafts on the packaging moving platform 710, which will complete the actions of pulling open the packaging bag, opening the bag, picking up the wafer box and placing it in the packaging bag, folding the bag opening, sealing the bag opening, extracting the gas or protective gas in the bag for cleaning and vacuumizing, heat sealing the bag opening, folding the bag opening again to flatten it, sealing the folded edge with adhesive tape, and sending it to the unloading position. Then the packaging platform will automatically package the wafer box and transport it to the unloading module.

[0037] The automatic unloading module 900 moves the packaged wafer box to the work station of the unloading AOI appearance detection module 1000, and the camera will take a picture of the packaged wafer box and transmit and store the data.

[0038] Then, at the same work station, the unloading labeling module 1100 will print, peel and send the label to the waiting position, and the unloading mechanical hand of the unloading labeling module 1100 will suck the outer packaging label and paste it on the outside of the packaging bag. After completing all the above actions, the unloading mechanical hand will store the completely packaged wafer box in the unloading Buffer position 920, waiting for manual or AGV to take it away.

[0039] As shown in Figure 2 , the automatic loading module 100 includes Buffer positions 110, a horizontal moving mechanical hand 120, and an NG port assembly 130. Among them, the Buffer positions include multiple Buffer positions 110, which are set to OHT loading, manual loading or AGV loading according to actual needs. The horizontal moving mechanical hand 120 grabs the wafer box and places it in each work station, respectively, for AOI bottom detection in the bottom AOI detection assembly 210, and top AOI detection in the top AOI detection assembly 220, and for handover with the automatic turnover module 300 or placement in the line body of the NG port assembly 130. The separate arrangement of AOI detection can effectively utilize the existing space. The NG port assembly 130 is used to store the wafer box that is detected as NG, and is a buffer work station for NG wafer boxes.

[0040] As shown in Figure 3As shown, the automatic turnover module 300 includes a feeding shaft 310 and a turnover assembly 320. If the top of the wafer box needs to be upward, the turnover assembly 320 does not need to be rotated after being connected with the horizontal transfer robot 120. If the top of the wafer box needs to be sideways, the turnover assembly 320 needs to be rotated by 90 degrees. After the wafer box is transferred from the turnover assembly 320, the feeding shaft 310 receives the wafer box and then sends it to the next position. Whether the wafer box needs to be turned over is determined by actual requirements.

[0041] As shown, Figure 4 The picking module 400 is a robot module. The robot of the picking module 400 places the wafer box to the labeling module 500, the auxiliary material loading module 600 and the detection completed station 230 to place the auxiliary material (including but not limited to humidity cards and drying agents), label scanning and AOI mapping detection, and finally the robot of the picking module 400 places the wafer box into the packaging station of the automatic packaging module 700.

[0042] The labeling module 500 is provided with a plurality of printer assemblies 510 (a plurality of printer assemblies 510 to meet the printing requirements of labels of multiple specifications), a label picking assembly 520 (to place a plurality of printed labels in a pre-labelling position), a code reader 530 (to compare the information of the printed code with the information in the system), and a robot labelling and scanning assembly 540 (to determine the accuracy of the labelling position and whether the label is correctly labelling).

[0043] The auxiliary material loading module 600 is provided with a plurality of auxiliary material loading stations, including the loading of humidity cards 620 and the loading of drying agents 630. The auxiliary material loading module 600 is also provided with an auxiliary material loading robot assembly 610. The humidity cards 620 are used to detect the humidity of the objects in the wafer box. If the humidity exceeds a certain value, the wafer box is considered unqualified. The drying agents 630 are used to absorb excess moisture in the wafer box to keep the wafer box dry.

[0044] As shown, Figure 5 The automatic packaging module 700 is arranged adjacent to the packaging bag loading module 800.

[0045] As shown, Figure 6 , 7 The automatic packaging module 700 includes a packaging moving platform 710, a belt grabbing assembly 720, a lower bag sucking assembly 730, an upper bag sucking assembly 740, a left middle bag pulling assembly 750, a right middle bag pulling assembly 760, a sealing assembly 770, a bag supporting assembly 780, a bag pressing assembly 790 and a rubber band sticking assembly 7100.

[0046] The grab tape assembly 720 is arranged on the frame of the automatic packaging module 700 and is used to pick up and move the packaging bag. The packaging moving platform 710 is fixed on the frame of the automatic packaging module 700 and is used to place and move the wafer box. The lower bag suction assembly 730 and the upper bag suction assembly 740 are arranged on the upper and lower sides of the packaging moving platform 710 respectively, and the lower bag suction assembly 730 and the upper bag suction assembly 740 are used to open the four corners of the packaging bag. The left middle pull edge assembly 750 and the right middle pull edge assembly 760 are arranged on the left and right sides of the packaging moving platform 710 respectively, and the left middle pull edge assembly 750 and the right middle pull edge assembly 760 are used to pull the middle part of the packaging bag.

[0047] The notching assembly 770 is arranged on the feeding side of the packaging moving platform 710. As shown in Figure 24 The bag supporting assembly 780 is arranged on the upper and lower sides of the packaging moving platform 710 and is staggered forward and backward with the wafer box entering direction of the lower bag suction assembly 730 and the upper bag suction assembly 740. The notching assembly 770 is used to clamp the packaging bag and vacuumize the packaging bag. The bag supporting assembly 780 is used to pre-press, press and heat the opening side of the packaging bag. The bag pressing assembly 790 is arranged on the rear side of the bag supporting assembly 780 and is used to fold the opening side of the packaging bag downward. The adhesive assembly 7100 is arranged below the opening side of the packaging bag and is used to paste the adhesive tape on the packaged wafer box.

[0048] As shown in Figure 8 The packaging moving platform 710 includes a moving module 711, a rotating support unit 712, a packaging platform 713 and a pressing module 714.

[0049] As shown in Figure 9 The packaging bag feeding module 800 includes a packaging bag storage bin 810, a storage bin lifting assembly 820, a material taking manipulator assembly 830 and a material placing platform assembly 840. The packaging bag storage bin 810 is connected with the storage bin lifting assembly 820 and moves up and down by the driving of the storage bin lifting assembly 820. The packaging bag is placed in the packaging bag storage bin 810. The material taking manipulator assembly 830 is arranged on the discharging side of the packaging bag storage bin 810 and is used to take out the packaging bag in the packaging bag storage bin 810. One end of the material placing platform assembly 840 is fixed on the storage bin lifting assembly 820 and is used to place the taken packaging bag.

[0050] As shown in Figure 10 The grab tape assembly 720 includes a bag grabbing horizontal moving module 721, a bag grabbing Z-axis module 722 and a bag grabbing jaw assembly 723. The bag grabbing horizontal moving module 721 is connected with the bag grabbing Z-axis module 722 through the bag grabbing Z-axis module 722. The bag grabbing jaw assembly 723 moves horizontally through the bag grabbing horizontal moving module 721 and moves vertically through the bag grabbing Z-axis module 722.

[0051] As shown in Figure 11As shown, the lower suction bag assembly 730 includes a lower suction bag Z-axis module 731, a lower suction bag suction head 732, a left lower bag pull-up element 733, and a right lower bag pull-up element 734. The lower suction bag suction head 732 is fixed to the upper end of the lower suction bag Z-axis module 731 and moves vertically via the lower suction bag Z-axis module 731. The left lower bag pull-up element 733 and the right lower bag pull-up element 734 are respectively fixed to the two ends of the lower suction bag suction head 732.

[0052] like Figure 12 As shown, the upper bag suction assembly 740 includes an upper bag suction Z-axis module 741, an upper bag suction head 742, a left upper bag pull element 743, and a right upper bag pull element 744. The upper bag suction head 742 is fixed to the lower end of the lower bag suction Z-axis module 731 and is vertically movable by the upper bag suction head 741. The left upper bag pull element 743 and the right upper bag pull element 744 are respectively fixed to the two ends of the upper bag suction head 742.

[0053] like Figure 13 and Figure 14 As shown, the left middle drawstring assembly 750 includes a left middle drawstring transverse axis 751 and a left middle drawstring claw 752. The right middle drawstring assembly 760 includes a right middle drawstring transverse axis 761 and a right middle drawstring claw 762. The left middle drawstring claw 752 is fixed to the left middle drawstring transverse axis 751 and is used to pull the middle of the packaging bag. The right middle drawstring claw 762 is fixed to the right middle drawstring transverse axis 761 and is used to pull the middle of the packaging bag.

[0054] like Figure 15 As shown, the bag-tying assembly 770 includes a bag-tying Z-axis 771, a bag-tying X-axis 772, a bag-tying Y-axis 773 (a pair of bag-tying Y-axis 773, one on each side), and a vacuum assembly 774. The bag-tying Z-axis 771, bag-tying X-axis 772, bag-tying Y-axis 773, and vacuum assembly 774 are all fixed to the base of the bag-tying assembly 770. The bag-tying Z-axis 771 can move up and down relative to the base. The bag-tying X-axis 772 and bag-tying Y-axis 773 are both equipped with grippers for clamping the packaging bag. The vacuum assembly 774 is used to vacuum the packaging bag.

[0055] like Figure 16 As shown, the bag-stretching assembly 780 includes a bag-stretching Z-axis 781, an upper seal 782, and a lower seal 783. The upper seal 782 and the lower seal 783 are both fixed to the bag-stretching Z-axis 781, and the upper seal 782 and the lower seal 783 can move closer to or farther away from each other along the bag-stretching Z-axis 781.

[0056] like Figure 17 As shown, the bag pressing assembly 790 includes a bag pressing Z axis 791 and a bag pressing roller 792. The bag pressing roller 792 is fixed on the bag pressing Z axis 791 and can move up and down along the bag pressing Z axis 791.

[0057] likeFigure 18 As shown, the adhesive application assembly 7100 includes an adhesive removal assembly 7101, an adhesive feeding module 7102, and an adhesive suction assembly 7103. The adhesive suction assembly 7103 is disposed above the adhesive feeding module 7102. The adhesive removal assembly 7101 is used to provide adhesive tape, and the adhesive feeding module 7102 is used to transport the adhesive tape to the application station of the adhesive suction assembly 7103, where the adhesive tape is applied to the packaging bag of the wafer box.

[0058] The steps for packaging wafer boxes using the automatic packaging module 700 and the packaging bag loading module 800 are as follows: The storage bin lifting assembly 820 moves the packaging bag storage bin 810 to one of the corresponding positions. The material picking robot assembly 830 picks up a packaging bag and then swings it up and down and places the packaging bag on the upper surface of the material discharge platform assembly 840. At the same time, the surface of the material discharge platform assembly 840 generates a vacuum to absorb the packaging bag. Then, the bag grabbing transverse movement module 721 of the grabbing belt assembly 720 moves transversely to the top of the material discharge platform assembly 840. After the bag grabbing Z-axis module 722 descends, the bag grabbing claw assembly 723 picks up the packaging bag and places it on the packaging platform 713 of the packaging mobile platform 710 (the rotating support unit 712 can rotate 90 degrees (such as Figure 25 As shown), at this time, the table of the rotating support unit 712 is Figure 8 After rotating 90 degrees in the state and keeping it horizontal with the table surface of the packaging platform 713), the packaging platform 713 and the rotating support unit 712 move to a suitable position with the packaging bag. At this time, due to the tension of the packaging bag itself and the upper surface of the lower suction bag suction head 732 is much lower than the surface of the packaging platform 713, the lower surface of the packaging bag can be placed on the upper surface of the lower suction bag suction head 732, and then the lower suction bag suction head 732 generates vacuum and adsorbs the packaging bag.

[0059] Then, the bag grabbing Z-axis module 722 and the upper bag suction Z-axis module 741 simultaneously descend to the upper surface of the packaging bag, and the suction cups on the upper left bag pulling element 743 and the upper right bag pulling element 744 suck the upper surface of the packaging bag and pull it to a certain height. The edge of the packaging bag is clamped by the upper left bag pulling element 743, the upper right bag pulling element 744, the lower left bag pulling element 733, and the lower right bag pulling element 734, and after being pulled to the highest point, the four corners of the packaging bag are again stretched open by the upper left bag pulling element 743, the upper right bag pulling element 744, the lower left bag pulling element 733, and the lower right bag pulling element 734, so that the mouth of the packaging bag is opened to the maximum, and at the same time, the rotating support unit 712 rotates in the opposite direction to a vertical state. Figure 8As shown. After the left and right middle drawstring lateral axes 751 and 761 are extended, the left and right middle drawstring claws 752 and 762 pull the middle portion of the packaging bag, further expanding the packaging bag to its maximum. The robotic arm of the pick-up module 400 places the wafer box into the packaging bag, and the clamping claws of the packaging platform 713 secure the wafer box. After the robotic arm of the pick-up module 400 retracts, the left and right middle drawstring assemblies 750 and 760 retract. The bag-binding Z-axis 771 of the bag-binding opening assembly 770 descends vertically, and with the clamping claws of the bag-binding Y-axis 773 open, the bag-binding X-axis 772 clamps the middle portion of the packaging bag (the opposite side of the packaging bag just pulled by the left and right middle drawstring claws 752 and 762). The clamping claws of the bag-binding X-axis 772 push the packaging bag from the outside, the upper bag suction assembly 740 clamps the packaging bag and moves downward, and the lower bag suction assembly 730 clamps the packaging bag and moves upward. When the upper bag suction assembly 740 and the lower bag suction assembly 730 are very close to each other, the upper seal 782 and the lower seal 783 move toward each other at the same time. After lightly clamping the packaging bag, the lower bag suction assembly 730 and the upper bag suction assembly 740 withdraw to their original state, the clamping claws of the bag-binding Y-axis 773 withdraw, and the upper seal 782 and the lower seal 783 move toward each other again at the same time. After heavily clamping the packaging bag, the vacuum assembly 774 performs an air bath action (that is, through continuous inflation and degassing actions to achieve the purpose of changing the gas composition in the wafer box). At the same time, in conjunction with the tightening process of the packaging bag, the moving module 711 moves forward following the state of the packaging bag. After the vacuum reaches a certain value, the upper seal 782 and lower seal 783 begin to heat the bag's seal. After the bag is sealed, the mobile module 711 remains in position, and the upper and lower seals 782 and 783 are loosened and retracted. Then, the bag pressing Z axis 791 descends, and the bag pressing roller 792 smoothes the sealed bag opening. The pressing module 714 extends its clamp to press the sealed bag opening onto the wafer box, and the mobile module 711 returns to the gluing position. The adhesive stripping assembly 7101 prepares the tape tearing, pulling, and cutting operations in advance. The adhesive feeding module 7102, along with the adhesive suction assembly 7103, obtains the tape from the adhesive stripping assembly 7101 and applies it to the outer packaging of the wafer box. The mobile module 711 then moves to the unloading position.

[0060] like Figure 19 As shown, the automatic unloading module 900 includes an unloading module 910 and several unloading buffers 920. During operation, the moving module 711 places the wafer box on the first unloading buffer 920 and then leaves. The unloading module 910 lifts the wafer box from under the first unloading buffer 920 to the unloading AOI appearance inspection module 1000 and the unloading labeling module 1100. The blanking AOI appearance inspection module is used to take pictures of the appearance of the sealed packaging bag (wafer box in the packaging bag) through a camera; The feeding and labeling module 1100 comprises a printing and peeling module 1120 of outer packaging labels, a feeding assembly 1110, and a label pasting assembly 1130. In operation, the feeding module 910 places the wafer box on the work station of the feeding and labeling module 1100. First, the camera of the feeding AOI appearance detection module 1000 photographs the state of the packaged wafer box, and the camera image system compares the picture of the qualified packaged product to determine whether it is qualified. Meanwhile, the printing and peeling module 1120 of outer packaging labels prints corresponding labels. The feeding assembly 1110 picks up the labels from the printing and peeling module 1120 of outer packaging labels through the label pasting assembly 1130 according to the positions to be pasted and moves to the corresponding positions to paste the labels. After the labeling is completed, the feeding AOI appearance detection module 1000 photographs and reads the code again to confirm whether the pasting position and the barcode are correct, and then uploads to the control system.

[0061] The shape change of the packaging process of the packaging bag is as shown in Figure 20 .

[0062] It is a difficult problem to ensure the fit degree of the packaging bag in the packaging process and the consistency of the packaging in the packaging process. The embodiments of the present application adopt the following multi-axis cooperation method to solve this problem, in which the moving module 711 carries the packaging bag or the packaging bag containing the wafer box, the bag opening of the bag grabbing Z-axis module 722 / upper bag sucking Z-axis module 741 is opened, the bag opening of the lower bag sucking Z-axis module 731 is opened, and the cooperation method of the pre-pressing, pressing, and vacuum pumping assembly 774 of the upper sealing port 782 / lower sealing port 783 is as follows: As shown in Figure 21 and Figure 22 , the total length of the packaging bag is L, the length of the bottom of the packaging bag (the direction of the bottom is the backward direction of Y (referring to Figure 1 )), the length of L1 is occupied by the packaging bag, the length of L3 is occupied by the wafer box after being placed in the packaging bag, L2 is the length of the packaging bag after removing the bottom, L2=L-L1, L3 is the length occupied by the wafer box in the packaging bag, L4 is the length of the bevel of the packaging bag after heat sealing, L5 is the length of the opening of the packaging bag from the sealing port, L6 is the maximum degree of the packaging bag (i.e. the overall height of the packaging bag after being pulled open), the actual size is greater than the height of the wafer box, and L7 is the length of the packaging bag remaining after vacuum pumping. Figure 23As shown, L8 is the projection length of the bevel of the heat-sealed packaging bag in the Y direction, theoretically L2=L3+L4+L5, L7+L6 / 2=L2-L3, wherein L6 is the initial stretching distance of the upper suction bag Z-axis module 741, L6 / 2 is the walking distance in the Z direction when the upper suction bag Z-axis module 741, the bag grabbing Z-axis module 722, the upper sealing 782 and the lower sealing 783 are pre-pressed, L4-L8 is the walking distance of the moving module 711 in the Y direction, and the moving module 711 walks a distance of L8+L5-L7 after vacuumizing. At the same time, according to the Pythagorean theorem L8 2 +(L6 / 2) 2 =L4 2 , each movement axis (the upper suction bag Z-axis module 741, the bag grabbing Z-axis module 722, the upper sealing 782 and the lower sealing 783) satisfies that the change time of the pre-pressing L6 / 2 and the walking distance L4-L8 of the moving module 711 in the packaging process is equal, the change time of the deformation distance L4-L6 / 2 of the packaging bag caused by vacuumizing and the change time of L8+L5-L7 are kept in a small difference, and the actual difference needs to be slightly changed according to the properties of each packaging bag, that is, the packaging bag is always in a tight state.

[0063] The embodiment of the application achieves the following technical effects: The automatic packaging device for wafer boxes can complete all packaging actions of the wafer boxes at one time, can effectively reduce manual work, improve production efficiency and ensure the consistency of packaging; the automatic packaging device for wafer boxes can be compatible with FOSB (Front Opening Shipping Box) and FOUP (Front Opening Unified Pod) of various brands conforming to the SEMI standard; the whole automatic packaging device adopts a flow line design, does not need manual operation and effectively ensures the cleanliness level of packaging.

[0064] The above is only a specific embodiment of the application, which cannot limit the range of the application, so the replacement of equivalent components or equivalent changes and modifications made within the scope of the patent protection of the application should still belong to the scope covered by the patent. In addition, the technical features in the application, the technical features and the technical solutions, and the technical solutions can be freely combined and used.

Claims

1. An automatic packaging device for wafer boxes, characterized in that: include: Automatic loading module (100), AOI appearance inspection module (200), automatic flipping module (300), picking module (400), labeling module (500), auxiliary material loading module (600), automatic packaging module (700), packaging bag loading module (800), automatic unloading module (900), unloading AOI appearance inspection module (1000) and unloading labeling module (1100); The AOI appearance inspection module (200) is arranged at the middle station of the automatic loading module (100), and the automatic flip module (300) is arranged at the last station of the automatic loading module (100) and is used to receive the wafer box located on the AOI appearance inspection module (200); The auxiliary material loading module (600) is arranged opposite to the labeling module (500), the picking module (400) is arranged between the auxiliary material loading module (600) and the labeling module (500), the feeding side of the picking module (400) is arranged on the wafer box discharge side of the automatic flip module (300), the auxiliary material loading module (600) is used to attach auxiliary materials to the wafer box, and the labeling module (500) is used to attach labels to the wafer box; The automatic packaging module (700) is arranged on the wafer box discharge side of the picking module (400), and the packaging bag loading module (800) is arranged on the packaging bag feeding side of the automatic packaging module (700). The automatic packaging module (700) is used to receive the packaging bag in the packaging bag loading module (800) and put the packaging bag on the outside of the wafer box; The automatic unloading module (900) is arranged at the wafer box discharge side of the automatic packaging module (700) and is used to move the packaged wafer box to the unloading AOI appearance inspection module (1000); The blanking AOI appearance inspection module (1000) is arranged above the automatic blanking module (900), and the blanking AOI appearance inspection module (1000) is used to detect whether the wafer box after packaging is qualified; The blanking and labeling module (1100) is arranged on one side of the automatic blanking module (900), and the blanking and labeling module (1100) is used to label the packaged wafer box.

2. The automatic packaging device for wafer boxes according to claim 1, characterized in that: The automatic packaging module (700) comprises: A packing mobile platform (710), a grabbing belt assembly (720), a lower suction bag assembly (730), an upper suction bag assembly (740), a left middle pull edge assembly (750), a right middle pull edge assembly (760), a tying assembly (770), a bag supporting assembly (780), a bag pressing assembly (790) and a gluing assembly (7100); The grab belt assembly (720) is arranged on the frame of the automatic packaging module (700) and is used to pick up and move the packaging bag; The packaging mobile platform (710) is fixed on the frame of the automatic packaging module (700) and is used to place and move the wafer box; The lower suction bag assembly (730) and the upper suction bag assembly (740) are respectively arranged on the upper and lower sides of the packaging mobile platform (710), and the lower suction bag assembly (730) and the upper suction bag assembly (740) are used to open the four corners of the packaging bag; The left middle pull edge assembly (750) and the right middle pull edge assembly (760) are respectively arranged on the left and right sides of the packaging mobile platform (710), and the left middle pull edge assembly (750) and the right middle pull edge assembly (760) are both used to pull the middle part of the packaging bag; The tying assembly (770) is arranged on the loading side of the packaging mobile platform (710), and the bag-supporting assembly (780) is arranged on the upper and lower sides of the packaging mobile platform (710), and is staggered in front and back with respect to the wafer box entry direction of the lower suction bag assembly (730) and the upper suction bag assembly (740). The tying assembly (770) is used to clamp the packaging bag and vacuum the packaging bag, and the bag-supporting assembly (780) is used to pre-press, press and heat the opening side of the packaging bag from top to bottom; The bag pressing assembly (790) is arranged on the rear side of the bag supporting assembly (780) and is used to fold the opening side of the packaging bag downwards; The adhesive tape component (7100) is arranged on one side of the opening side of the packaging bag and is used to stick the tape to the packaged wafer box.

3. The automatic packaging device for wafer boxes according to claim 2, characterized in that: The packaged mobile platform (710) includes: A movable module (711), a rotating support unit (712), a packaging platform (713) and a pressing module (714), wherein the rotating support unit (712) is fixed on the movable module (711), the packaging platform (713) is fixed on the rotating support unit (712), and the pressing module (714) is fixed on the packaging platform (713); The gripping belt assembly (720) comprises: A grab bag transverse movement module (721), a grab bag Z-axis module (722), and a grab bag clamp assembly (723), wherein the grab bag transverse movement module (721) is connected to the grab bag transverse movement module (721) via the grab bag Z-axis module (722), and the grab bag clamp assembly (723) moves horizontally via the grab bag transverse movement module (721) and moves vertically via the grab bag Z-axis module (722); The lower suction bag assembly (730) comprises: A lower suction bag Z-axis module (731), a lower suction bag suction head (732), a left lower bag pull-up element (733) and a right lower bag pull-up element (734), wherein the lower suction bag suction head (732) is fixed to the upper end of the lower suction bag Z-axis module (731), the lower suction bag suction head (732) moves vertically through the lower suction bag Z-axis module (731), and the left lower bag pull-up element (733) and the right lower bag pull-up element (734) are respectively fixed to both ends of the lower suction bag suction head (732); The upper suction bag assembly (740) comprises: An upper suction bag Z-axis module (741), an upper suction bag suction head (742), a left upper bag pulling element (743) and a right upper bag pulling element (744), wherein the upper suction bag suction head (742) is fixed to the lower end of the lower suction bag Z-axis module (731), the upper suction bag suction head (742) moves vertically through the upper suction bag Z-axis module (741), and the left upper bag pulling element (743) and the right upper bag pulling element (744) are respectively fixed to both ends of the upper suction bag suction head (742); The left middle pull edge component (750) comprises: a left middle drawstring transverse axis (751) and a left middle drawstring claw (752), wherein the left middle drawstring claw (752) is fixed on the left middle drawstring transverse axis (751), and the left middle drawstring claw (752) is used to pull the middle of the packaging bag; The right middle pull edge component (760) comprises: a right middle drawstring transverse axis (761) and a right middle drawstring claw (762), wherein the right middle drawstring claw (762) is fixed on the right middle drawstring transverse axis (761), and the right middle drawstring claw (762) is used to pull the middle of the packaging bag; The tying assembly (770) comprises: A bag tying Z axis (771), a bag tying X axis (772), a bag tying Y axis (773) and a vacuum pumping assembly (774), wherein the bag tying Z axis (771), the bag tying X axis (772), the bag tying Y axis (773) and the vacuum pumping assembly (774) are all fixed on the base of the tying assembly (770); the bag tying Z axis (771) can move up and down relative to the base; the bag tying X axis (772) and the bag tying Y axis (773) are both provided with grippers and used to clamp the packaging bag; the vacuum pumping assembly (774) is used to vacuum the packaging bag; The bag support assembly (780) includes: The bag support Z axis (781), the upper seal (782) and the lower seal (783) are fixed on the bag support Z axis (781), and the upper seal (782) and the lower seal (783) can approach or move away from each other along the direction of the bag support Z axis (781).

4. The automatic packaging device for wafer boxes according to claim 2, characterized in that: The bag pressing assembly (790) comprises: a bag pressing Z axis (791) and a bag pressing roller (792), wherein the bag pressing roller (792) is fixed on the bag pressing Z axis (791) and can move up and down along the bag pressing Z axis (791); The adhesive component (7100) includes: A glue removal component (7101), a glue delivery module (7102) and a glue suction component (7103), wherein the glue suction component (7103) is arranged above the glue delivery module (7102), the glue removal component (7101) is used to provide adhesive tape, the glue delivery module (7102) is used to transport the adhesive tape to the pasting station of the glue suction component (7103), and the adhesive tape is pasted to the packaging bag of the wafer box through the glue suction component (7103).

5. The automatic packaging device for wafer boxes according to claim 1, characterized in that: The packaging bag loading module (800) comprises: A packaging bag storage bin (810), a storage bin lifting assembly (820), a material retrieving manipulator assembly (830), and a material discharging platform assembly (840); The packaging bag storage bin (810) is connected to the storage bin lifting assembly (820), and the packaging bag storage bin (810) is driven to move up and down by the storage bin lifting assembly (820); The packaging bag is placed in the packaging bag storage bin (810); The retrieving manipulator assembly (830) is arranged on the discharge side of the packaging bag storage bin (810) and is used to retrieve the packaging bags from the packaging bag storage bin (810); One end of the material discharging platform component (840) is fixed to the material storage bin lifting component (820) and is used to place the taken-out packaging bags.

6. The automatic packaging device for wafer boxes according to claim 1, characterized in that: The automatic unloading module (900) comprises: A blanking module (910) and multiple blanking buffer positions (920); The unloading buffer positions (920) are sequentially arranged along the feeding to discharging direction, and the unloading module (910) is arranged below the unloading buffer position (920) on the feeding side of the automatic unloading module (900); The blanking and labeling module (1100) comprises: An outer packaging label printing and peeling module (1120), a feeding component (1110), and a label applying component (1130); The outer packaging label printing and peeling module (1120) is used to provide an outer packaging label, which is transported to the label applying component (1130) via the feeding component (1110), and the outer packaging label is applied to the sealed packaging bag via the label applying component (1130).

7. A control method for an automatic wafer box packaging device, comprising: using the automatic wafer box packaging device according to any one of claims 1 to 6 to automatically package the wafer box, wherein: The following steps are involved: The wafer box is transferred to the inspection station of the AOI appearance inspection module (200) by the automatic loading module (100), and the appearance inspection of the wafer box is performed by the automatic flipping module (300) and the AOI appearance inspection module (200); If the appearance inspection is qualified, the wafer box is moved to the auxiliary material loading module (600) through the picking module (400), and the auxiliary material is attached to the outside of the wafer box; The wafer box is moved to the labeling module (500) by the picking module (400), and after the outer packaging label is attached to the wafer box, the wafer box is moved to the automatic packaging module (700) by the picking module (400); The packaging bag is conveyed to the automatic packaging module (700) via the packaging bag loading module (800), and the wafer box is placed into the packaging bag and sealed via the automatic packaging module (700) and the picking module (400), and the sealed packaging bag is conveyed to a discharge port; The automatic unloading module (900) picks up the sealed packaging bag at the unloading port and transports the sealed packaging bag to the unloading AOI appearance inspection module (1000). After the appearance of the sealed packaging bag is inspected by the unloading AOI appearance inspection module (1000), the outer packaging label is affixed to the sealed packaging bag by the unloading labeling module (1100).

8. The control method of the wafer box automatic packaging device according to claim 7, characterized in that: Performing appearance inspection on the wafer box using the automatic flip module (300) and the AOI appearance inspection module (200), including: Performing automatic optical inspection on one side of the wafer box through the AOI appearance inspection module (200); determining whether the wafer box needs to be flipped according to external demand; if flipping is required, flipping the wafer box by the automatic flipping module (300); performing automatic optical inspection on the other side of the wafer box by the AOI appearance inspection module (200); and ending the automatic optical inspection if flipping is not required; If the automatic optical inspection is qualified, the wafer box is moved to the Mapping inspection position of the AOI appearance inspection module (200) through the picking module (400), wherein the Mapping inspection is used to detect the state of the wafer in the wafer box; If the Mapping test is qualified, the appearance test is qualified. If the automatic optical test fails and / or the Mapping test fails, the appearance test fails.

9. The control method of the wafer box automatic packaging device according to claim 7, characterized in that: The packaging bag is conveyed to the automatic packaging module (700) through the packaging bag loading module (800), and the wafer box is placed in the packaging bag through the automatic packaging module (700) and the picking module (400), and the packaged wafer box is transported to the unloading side of the automatic packaging module (700), including: The packaging bag storage bin (810) is moved to a discharge position by using the storage bin lifting assembly (820), and the material picking robot assembly (830) picks up one of the packaging bags at the discharge position and places the packaging bag on the upper surface of the discharge platform assembly (840); The packaging bag is adsorbed by the surface of the material discharge platform component (840), and the bag grabbing transverse movement module (721) of the grab belt component (720) moves transversely to above the material discharge platform component (840); Adjusting the tabletop of the rotating support unit (712) so that the tabletop of the rotating support unit (712) and the tabletop of the packaging platform (713) remain level; Controlling the bag grabbing Z-axis module (722) to descend, picking up the packaging bag through the bag grabbing claw assembly (723) and placing the packaging bag on the packaging platform (713) of the packaging mobile platform (710); Moving the packaging platform (713) and the rotating support unit (712) to a position where the lower surface of the packaging bag can rest on the upper surface of the lower suction bag suction head (732); Adsorbing the packaging bag through the lower bag suction head (732); Controlling the bag grabbing Z-axis module (722) and the upper bag suction Z-axis module (741) to simultaneously descend to the upper surface of the packaging bag, and using the suction cups on the left upper bag pulling element (743) and the right upper bag pulling element (744) to suck the upper surface of the packaging bag and then pull it to a certain height; After clamping the four corners of the packaging bag by the upper left pull bag element (743), the upper right pull bag element (744), the lower left pull bag element (733) and the lower right pull bag element (734), the upper left pull bag element (743), the upper right pull bag element (744), the lower left pull bag element (733) and the lower right pull bag element (734) are pulled to open the packaging bag until the bag opening of the packaging bag is opened to the maximum; Rotating the rotating support unit (712) in the opposite direction to a vertical state; Extending the left middle drawstring transverse axis (751) and the right middle drawstring transverse axis (761), and pulling the middle of the packaging bag through the left middle drawstring claw (752) and the right middle drawstring claw (762), so that the packaging bag is opened to the maximum; placing the wafer box into the packaging bag via the pickup module (400), and securing the wafer box using the clamping claws of the packaging platform (713); After the picking module (400) is retracted, the left middle pull-edge assembly (750) and the right middle pull-edge assembly (760) are retracted; The bag-tying Z axis (771) of the tying assembly (770) descends vertically, and when the clamping claws of the bag-tying Y axis (773) are in an open state, the middle of the packaging bag is clamped by the bag-tying X axis (772); The clamping claws of the bag-tying X-axis (772) push the packaging bag from the outside, the upper bag suction assembly (740) clamps the packaging bag and moves downward, and the lower bag suction assembly (730) clamps the packaging bag and moves upward; When the upper suction bag assembly (740) and the lower suction bag assembly (730) are close to each other, the upper seal (782) and the lower seal (783) move toward each other at the same time, and after the upper seal (782) and the lower seal (783) clamp the packaging bag, the packaging bag is pre-pressed, and the lower suction bag assembly (730) and the upper suction bag assembly (740) are withdrawn to their original state; The clamping claws of the bag-tying Y-axis (773) are withdrawn, and the upper seal (782) and the lower seal (783) are moved toward each other again at the same time. After the upper seal (782) and the lower seal (783) clamp the packaging bag, the packaging bag is pressed tightly, and the packaging bag is continuously inflated and evacuated by the vacuum assembly (774) to evacuate the packaging bag into a vacuum state. When the packaging bag is tightened, the moving module (711) moves forward following the state of the packaging bag; When the vacuum degree of the packaging bag reaches a set value, the seal of the packaging bag is heated through the upper seal (782) and the lower seal (783), and the position of the movable module (711) is kept unchanged, so that the upper seal (782) and the lower seal (783) are loosened and then retracted; The bag pressing Z axis (791) is lowered, and the bag opening of the sealed packaging bag is smoothed by the bag pressing roller (792), and the bag opening of the sealed packaging bag is pressed onto the wafer box by the clamp of the pressing module (714), and the moving module (711) is moved to the vicinity of the glue sticking assembly (7100); The adhesive tape is torn and cut by the adhesive removal component (7101), and the adhesive suction component (7103) is moved to the adhesive removal component (7101) by the adhesive feeding module (7102) to obtain the adhesive tape, and then the adhesive tape is pasted on the bag opening of the sealed packaging bag; The packaged wafer box is transported to the unloading side of the automatic packaging module (700) via the moving module (711).

10. The control method of the wafer box automatic packaging device according to claim 9, characterized in that: Also includes: The total length of the packaging bag is L, the length of the bottom of the packaging bag is L1, the length of the wafer box is L3, L2 is the length of the packaging bag after removing the bottom, L2=L-L1, L4 is the length of the hypotenuse of the packaging bag after heat sealing, L5 is the distance from the opening of the packaging bag to the seal, L6 is the overall height of the packaging bag after opening, L7 is the remaining length of the packaging bag after vacuuming, and L8 is the projection length of the hypotenuse of the packaging bag after heat sealing in the Y direction. Therefore, L2=L3+L4+L5, L7+L6 / 2=L2-L3; During pre-pressing, the initial stretching distance of the upper bag suction Z-axis module (741) is L6, the moving distance of the upper bag suction Z-axis module (741), the bag grabbing Z-axis module (722), the upper seal (782) and the lower seal (783) in the Z direction is L6 / 2, and the moving distance of the moving module (711) in the Y direction is L4-L8, so that the time for the upper bag suction Z-axis module (741), the bag grabbing Z-axis module (722), the upper seal (782) and the lower seal (783) to move L6 / 2 is equal to the time for the moving module (711) to move L4-L8; When the packaging bag is vacuumed, the difference between the change time of the deformation distance L4-L6 / 2 of the packaging bag caused by vacuuming and the change time of the movement of the moving module (711) L8+L5-L7 is less than the set difference.

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