MEMS chip radiator

Abstract

The MEMS chip radiator comprises a driving power supply, a frame and a cover plate arranged on the frame, the frame is provided with a pendulous reed and an air inlet, the pendulous reed is provided with a first conducting layer, the cover plate is provided with an air outlet, the inner surface of the cover plate is provided with a second conducting layer, the second conducting layer and the first conducting layer are arranged correspondingly, and the driving power supply is arranged on the frame. The driving power supply is connected with the first conductive layer and the second conductive layer, and drives the pendulous reed to vibrate in a resonance state in an electrostatic driving mode. A traditional cooling fan is compressed to a chip level, the cooling fan can be installed in a compact mobile device, the pendulous reed vibrates in a resonance state through simple electrostatic driving, the pendulous reed drives air around the pendulous reed to flow, heat exchange is promoted, redundant heat on a cooled chip is taken away, the overall structure is simple, the size is small, and the cooling fan is convenient to use. The noise during operation is low, and the cooling effect is good.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation equipment of compact electronic devices, and particularly to a MEMS chip radiator. BACKGROUND

[0002] Compact mobile devices urgently need more efficient cooling systems, such as 5G connection, space computing, high-resolution video and game, edge application of artificial intelligence, etc., so that the heat dissipation capacity of devices sensitive to volume and mass, such as smart phones, becomes the main bottleneck restricting performance.

[0003] Although the traditional heat dissipation fan has good heat dissipation effect, the size and weight are generally large, and a certain noise is generated during operation, which is difficult to apply to compact mobile devices. SUMMARY

[0004] The technical problem to be solved by the present application is to overcome the shortcomings of the prior art and provide a MEMS chip radiator with simple structure, small volume, small noise during operation and good cooling effect.

[0005] To solve the above technical problems, the following technical solutions are adopted: A MEMS chip radiator comprises a driving power supply, a frame and a cover plate arranged on the frame, the frame is provided with a swing plate and an air inlet, the swing plate is provided with a first conductive layer, the cover plate is provided with an air outlet and an inner surface is provided with a second conductive layer, the second conductive layer is arranged corresponding to the first conductive layer to form a flat plate capacitor structure, the driving power supply is connected to the first conductive layer and the second conductive layer, and the swing plate is driven to vibrate in a resonant state by an electrostatic driving mode.

[0006] As a further improvement of the above technical solution: the frame comprises a center beam, the swing plate is provided with at least one group, and each group of swing plates comprises two and is symmetrically arranged on both sides of the center beam.

[0007] As a further improvement of the above technical solution: the swing plate is connected to the center beam through a vibration beam.

[0008] As a further improvement of the above technical solution: the cross section of the vibration beam is a polygon.

[0009] As a further improvement of the above technical solution: at least one end of the frame is provided with a first conductive pad, the first conductive pad is formed by a photoetching and metallization deposition method, the vibration beam and the center beam are formed by a photoetching and metallization deposition method to form a first conductive wire for connecting the first conductive layer and the first conductive pad, and the first conductive pad is connected to the driving power supply.

[0010] As a further improvement of the above technical solution: the cover plate is provided with an avoiding part for the first conductive pad to pass through.

[0011] As a further improvement of the above technical solution: the vibrating beam is formed by wet etching and / or dry etching.

[0012] As a further improvement of the above technical solution: the outer surface of the cover plate is provided with a second conductive pad, the second conductive pad is formed by photoetching and metal deposition, the inner surface of the cover plate is provided with a second conductive wire formed by photoetching and metal deposition, one end of the second conductive wire is connected with the second conductive layer, the other end of the second conductive wire is connected with the second conductive pad through a metalized via, and the second conductive pad is connected with the driving power supply.

[0013] As a further improvement of the above technical solution: the material of the cover plate is electronic glass or high-purity quartz, and the material of the frame is single crystal silicon or high-purity quartz.

[0014] As a further improvement of the above technical solution: the cover plate, the frame and the vibrating plate are formed by photoetching, wet etching, dry etching or laser etching, and the first conductive layer and the second conductive layer are formed by photoetching and metal deposition.

[0015] Compared with the prior art, the MEMS chip radiator has the following advantages: The MEMS chip radiator disclosed by the application compresses a traditional heat dissipation fan to a chip level, can be installed in a compact mobile device, and makes the vibrating plate vibrate in a resonance state through simple electrostatic driving, drives the air flow around the vibrating plate, promotes heat exchange, and makes cold air enter from an air inlet, absorbs the heat of the chip, and then is discharged from an air outlet to take away the excess heat on the cooled chip.

[0016] Other features and advantages of the application will be described in detail in the following specific embodiment part. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a schematic diagram of the three-dimensional structure of the MEMS chip radiator of the first embodiment of the application. Figure 2 is a schematic diagram of the three-dimensional structure of the cover plate in the first embodiment of the application.

[0018] Figure 3 is a schematic diagram of the three-dimensional structure of the frame in the first embodiment of the application.

[0019] Figure 4 is a schematic diagram of the three-dimensional structure of the MEMS chip radiator of the second embodiment of the application.

[0020] Figure 5 is a structural schematic diagram of the frame in Embodiment Two of the present application.

[0021] The various reference signs in the drawings represent: 1, cover plate; 11, second conductive wire; 12, second conductive layer; 13, avoiding part; 14, second conductive pad; 15, air outlet; 2, frame; 21, center beam; 22, vibration beam; 23, first conductive wire; 24, first conductive pad; 25, air inlet; 3, swing piece; 31, first conductive layer. DETAILED DESCRIPTION

[0022] In the description of the present application, it needs to be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0023] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features referred to. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.

[0024] In the present application, unless otherwise explicitly specified and limited, the terms "assembly", "connection", "connection", "fixing" and the like should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0025] The present application will be further described in detail below in combination with the drawings and specific embodiments.

[0026] As Figures 1 to 5As shown, the MEMS chip radiator of the embodiment comprises a driving power supply (not shown in the figure), a frame 2, and a cover plate 1 arranged on the frame 2. The frame 2 is provided with a swing plate 3 and an air inlet 25. The swing plate 3 is provided with a first conductive layer 31. The cover plate 1 is provided with an air outlet 15. The inner surface of the cover plate 1 (i.e. the side facing the frame 2) is provided with a second conductive layer 12. The second conductive layer 12 is arranged in correspondence with the first conductive layer 31 to form a flat plate type capacitor structure. The driving power supply is connected to the first conductive layer 31 and the second conductive layer 12, and drives the swing plate 3 to vibrate in a resonant state through electrostatic driving. The full name of MEMS is Micro-Electro-Mechanical Systems, i.e. micro-electromechanical system technology. Preferably, the frame 2 also has a flat plate structure, occupies a small space, and is convenient to install in a compact mobile device. The air inlet 25 and the air outlet 15 are long strip-shaped holes, and are arranged on the side surface of the frame 2 and the upper surface of the cover plate 1 respectively, have a large flow area, and are convenient for cold air to enter the inside of the frame 2 and for hot air to be discharged to the outside of the cover plate 1.

[0027] The MEMS chip radiator of the embodiment compresses the traditional cooling fan to the chip level, can be installed in a compact mobile device, and drives the swing plate 3 to vibrate in a resonant state through simple electrostatic driving (when a voltage is applied between two electrodes, an electrostatic field is generated between the electrodes. If one of the electrodes is movable, the movable electrode will be attracted or repelled by the electrostatic force under the action of the electrostatic field, thereby changing the position. Electrostatic driving has low power consumption, high energy efficiency, can achieve very precise control, and has fast response speed), drives the swing plate 3 to drive the air flow around the swing plate, promotes heat exchange, and the cold air enters from the air inlet 25, absorbs the heat of the chip, and then is discharged from the air outlet 15 to take away the excess heat on the cooled chip. The overall structure is simple, small in size, low in noise during operation, and good in cooling effect.

[0028] Specifically, Figure 3 In the embodiment, the frame 2 comprises a center beam 21. The swing plate 3 is provided with two groups and is distributed along the length direction of the center beam 21. Each group comprises two swing plates 3 and is symmetrically arranged on the two sides of the center beam 21. Correspondingly, the second conductive layer 12 on the cover plate 1 is also correspondingly provided in two groups, which is good in symmetry and balance and is conducive to realizing reliable and stable operation of the radiator.

[0029] Of course, in other embodiments, specifically, Figure 4 and 5 The swing plate 3 can also be provided in three groups or other groups in parallel, and can even be stacked when necessary to achieve the required refrigeration effect.

[0030] As a preferred embodiment, the swing plate 3 is connected to the center beam 21 through a vibrating beam 22, which is conducive to realizing high-frequency swinging of the swing plate 3 and further improving the cooling effect.

[0031] As a preferred embodiment, the cross section of the vibrating beam 22 is polygonal, such as convex quadrilateral, hexagon, etc., and common parallelogram, rectangle, square, etc., which will not be described here.

[0032] Further, in the embodiment, the frame 2 is provided with first conductive pads 24 at both ends, the first conductive pads 24 are formed by photolithography and metal deposition, the center beam 21 is located between the first conductive pads 24 at both ends, the vibrating beam 22 and the center beam 21 are formed by photolithography and metal deposition to form first conductive lines 23 for connecting the first conductive layer 31 and the first conductive pads 24, the first conductive pads 24 are connected with the driving power supply, thereby realizing the connection of the first conductive layer 31 and the driving power supply without increasing the number of parts, the volume and mass of the heat sink, and the structure is reasonable and effective. The two pairs of swing plates 3 can be connected with the first conductive pads 24 correspondingly.

[0033] Further, in the embodiment, the cover plate 1 is provided with a avoiding part 13 for the first conductive pads 24 to pass through, which facilitates the connection of the first conductive pads 24 and the driving power supply. Preferably, the avoiding part 13 is an arc-shaped notch structure and is arranged at both ends of the upper surface of the cover plate 1.

[0034] The vibrating beam 22 can be made by wet etching or dry etching or a combination of the two.

[0035] Specifically referring to Figure 2 In the embodiment, the outer surface of the cover plate 1 is provided with a second conductive pad 14, the second conductive pad 14 is formed by photolithography and metal deposition, the inner surface of the cover plate 1 is formed by photolithography and metal deposition to form a second conductive line 11, one end of the second conductive line 11 is connected with the second conductive layer 12, the other end of the second conductive line 11 is connected with the second conductive pad 14 through a metalized via, the second conductive pad 14 is connected with the driving power supply, thereby realizing the connection of the second conductive layer 12 and the driving power supply without increasing the number of parts, the volume and mass of the heat sink, and the structure is reasonable and effective.

[0036] Preferably, the material of the cover plate 1 is electronic glass or high-purity quartz (i.e. the purity of silicon dioxide is above 99.995%), and the material of the frame 2 is single crystal silicon or high-purity quartz. The electronic glass, single crystal silicon or high-purity quartz and other materials make the production process compatible with the MEMS process, and the single crystal silicon or high-purity quartz has excellent physical properties, so that the heat sink (mainly the swing plate 3) can adapt to long-term heat dissipation driving without fatigue damage.

[0037] Further, in the embodiment, the cover plate 1 (including the air outlet 15 on the cover plate 1, etc.), the frame 2 and the swing piece 3 are formed by wet etching, dry etching or laser etching, and the first conductive layer 31 and the second conductive layer 12 are formed by photolithography metal deposition. By using the wet etching, dry etching or laser etching process, the micro-sized swing piece 3 can be conveniently released; and by using the chemical and physical deposition method, the electrodes for driving the swing piece 3 can be formed on the surface of the swing piece 3 and the inner surface of the cover plate 1.

[0038] The frame 2 and the cover plate 1 can be cut into products after being bonded, or can be assembled with target cooling chips at the wafer level.

[0039] Although the present application has been disclosed with reference to the preferred embodiments, it is not intended to limit the present application. Any person skilled in the art, without departing from the scope of the present application, can make many possible changes and modifications to the disclosed technical content, or modify equivalent embodiments with equivalent changes. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application, without departing from the scope of the present application, shall fall within the scope of protection of the present application.

Claims

1. A MEMS chip heat sink, characterized by: The invention comprises a driving power supply, a frame (2) and a cover plate (1) arranged on the frame (2); the frame (2) is provided with a pendulum (3) and an air inlet (25); the pendulum (3) is provided with a first conductive layer (31); the cover plate (1) is provided with an air outlet (15) and a second conductive layer (12) is provided on the inner surface; the second conductive layer (12) is arranged corresponding to the first conductive layer (31); the driving power supply is connected to the first conductive layer (31) and the second conductive layer (12), and drives the pendulum (3) to vibrate in a resonant state by electrostatic driving.

2. The MEMS chip heat sink according to claim 1, wherein: The frame (2) includes a central beam (21), and the pendulum pieces (3) are provided in at least one group, each group of the pendulum pieces (3) including two pendulum pieces symmetrically arranged on both sides of the central beam (21).

3. The MEMS chip heat sink according to claim 2, characterized in that: The pendulum piece (3) is connected to the central beam (21) via a vibration beam (22).

4. The MEMS chip heat sink according to claim 3, characterized in that: The cross section of the vibration beam (22) is polygonal.

5. The MEMS chip heat sink according to claim 3, characterized in that: At least one end of the frame (2) is provided with a first conductive pad (24), the first conductive pad (24) being formed by photolithographic metallization deposition, the vibration beam (22) and the center beam (21) forming a first conductive line (23) by photolithographic metallization deposition, for connecting the first conductive layer (31) and the first conductive pad (24), and the first conductive pad (24) being connected to the driving power supply.

6. The MEMS chip heat sink according to claim 5, characterized in that: The cover plate (1) is provided with an escape portion (13) for the first conductive pad (24) to pass through.

7. The MEMS chip heat sink according to claim 3, characterized in that: The vibration beam (22) is formed by wet etching and / or dry etching.

8. The MEMS chip heat sink according to claim 1, wherein: The outer surface of the cover plate (1) is provided with a second conductive pad (14), the second conductive pad (14) is formed by photolithographic metallization deposition, the inner surface of the cover plate (1) is formed with a second conductive line (11) by photolithographic metallization deposition, one end of the second conductive line (11) is connected to the second conductive layer (12), the other end of the second conductive line (11) is connected to the second conductive pad (14) through a metallized via, and the second conductive pad (14) is connected to the driving power supply.

9. The MEMS chip heat sink according to any one of claims 1 to 8, characterized in that: The material of the cover plate (1) is electronic glass or high-purity quartz, and the material of the frame (2) is single crystal silicon or high-purity quartz.

10. The MEMS chip heat sink according to any one of claims 1 to 8, characterized in that: The cover plate (1), the frame (2) and the swing plate (3) are all formed by photolithographic wet etching, dry etching or laser etching, and the first conductive layer (31) and the second conductive layer (12) are formed by photolithographic metallization deposition.

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