High borosilicate glass cold cutting device with positioning mechanism

Abstract

The application relates to the technical field of laser cutting, in particular to a high-boron-silicon glass cold cutting device with a positioning mechanism, which is used for laser cutting and splitting of a high-boron-silicon glass plate and comprises a laser cutting machine, a processing table moving longitudinally in the laser cutting machine and a laser head moving transversely in the laser cutting machine, the high-boron-silicon glass plate is installed on the processing table, an upwardly-opened splitting cover and an ultrasonic generator are fixedly installed on the processing table, the splitting cover is filled with cooling liquid, two symmetrical clamping pieces are arranged in the splitting cover, an XYZ three-axis platform is jointly installed on the top of the two clamping pieces, an ultrasonic transducer is installed on the output end of the XYZ three-axis platform, the ultrasonic transducer is electrically connected with the ultrasonic generator, and a driving assembly for driving the clamping pieces to move horizontally or vertically is installed between the clamping pieces and the processing table.

Description

Technical Field

[0001] This invention relates to the field of laser cutting technology, and more specifically to a cold cutting device for high borosilicate glass with a positioning mechanism. Background Technology

[0002] The core differences between high borosilicate glass and ordinary glass lie in three aspects: composition, physical properties, and application fields. High borosilicate glass contains boron and high silicon content, can withstand temperature differences from -30℃ to 150℃, and its coefficient of expansion is only about one-third that of ordinary glass.

[0003] When cold cutting existing high borosilicate glass, glass laser cutting machines are generally used to employ picosecond / femtosecond ultrafast laser pulses, combined with Bessel beam focusing, to break the glass molecular bonds instantaneously with high energy rather than melting the material; the laser cutting methods for glass can be divided into two types in principle: one is the melting method, and the other is the thermal cracking method.

[0004] In the hot cracking method, a high-energy laser beam is focused onto a specific area of ​​the glass surface using a laser scalpel, rapidly raising the temperature of that area to well above the glass's softening point. This causes the glass to expand violently in a localized area, generating enormous thermal stress within the glass. Since glass is an isotropic brittle material, this thermal stress creates a complex stress distribution within the material. When the thermal stress exceeds the glass's strength limit, initial microcracks form in the stress concentration area. However, this compressive stress does not cause the glass to break. After the desired path is drawn on the glass surface, high-speed jets of carbon dioxide gas are sprayed onto the cutting area. The rapid cooling creates a large temperature gradient and tensile stress on the glass surface, inducing the glass to gradually expand along the predetermined cutting path. The cutting speed is relatively fast and it is suitable for glass of various thicknesses, especially glass thicker than 1 mm. However, microcracks may exist at the cutting edges, requiring further processing.

[0005] There are two main problems with using thermal cracking: first, the consumption of carbon dioxide gas; and second, the debris generated when the initial microcracks open can affect the health of workers, so protective clothing is required.

[0006] The information disclosed in the background section is only intended to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0007] The purpose of this invention is to design a cold cutting device for high borosilicate glass with a positioning mechanism that does not require the use of carbon dioxide gas for rapid cooling and does not generate debris in the air, thereby overcoming the aforementioned shortcomings in the technology.

[0008] To achieve the above objectives, the present invention provides the following technical solution: a cold cutting device for high borosilicate glass with a positioning mechanism, used for laser cutting and dicing of high borosilicate glass plates, including a laser cutting machine, a longitudinally moving processing table inside the laser cutting machine, and a transversely moving laser head inside the laser cutting machine. The high borosilicate glass plate is mounted on the processing table, and an upward-opening dicing cover and an ultrasonic generator are fixedly mounted on the processing table. The dicing cover is filled with coolant and has two symmetrically distributed clamping members inside. An XYZ three-axis platform is mounted on the top of the two clamping members. An ultrasonic transducer is mounted on the output end of the XYZ three-axis platform. The ultrasonic transducer and the ultrasonic generator are electrically connected. A drive assembly for driving the clamping members to move horizontally or vertically is installed between the clamping members and the processing table.

[0009] After the required micro-crack paths are processed on the glass plate by the processing table and laser head using the thermal cracking method, the clamping device drives the glass plate to move and intermittently rise and fall in the coolant. With the help of the ultrasonic transducer, the coolant vibration is penetrated into the micro-crack paths, causing the micro-crack paths to expand into cracks.

[0010] Preferably, the clamping member includes a first plate and a second plate parallel to the processing table, and a vertical plate fixedly installed between the first plate and the second plate, wherein the top surface of the first plate contacts the bottom surface of the glass plate, and the vertical plate contacts the side surface of the glass plate.

[0011] Preferably, the drive assembly includes a plurality of first electric telescopic rods installed below the second plate, and a positioning rod installed at the bottom of the first electric telescopic rods. A second electric telescopic rod is also fixedly installed on the top of the processing table. The output end of the second electric telescopic rod is fixedly connected to one of the positioning rods. This positioning rod is slidably connected to the top surface of the processing table, and the other positioning rod is fixedly connected to the processing table.

[0012] Preferably, a positioning plate is rotatably mounted on the top of the first electric telescopic rod, and the positioning plate is fixedly connected to the bottom surface of the second plate.

[0013] Preferably, a filter screen is slidably installed between the two first plates.

[0014] Preferably, the laser emitted by the laser head is a 1064nm infrared picosecond laser.

[0015] Preferably, when the top surface of the glass plate and the ultrasonic transducer are both below the surface of the coolant, there is a gap of 1-5 mm between the ultrasonic transducer and the glass plate.

[0016] Preferably, when the ultrasonic transducer is working, the filter screen does not contact the bottom surface of the inner cavity of the slit cover.

[0017] The technical effects and advantages provided by the present invention in the above technical solution are as follows:

[0018] 1. In this invention, after the initial micro-crack path is processed on the surface of a glass plate by laser, the glass plate is moved into a coolant to cool it down and make the initial micro-crack larger. Then, an ultrasonic transducer is used to perform ultrasonic vibration along the crack path, causing the coolant to generate bubbles and form instantaneous pressure to process the originally fragile crack path. This allows the glass to gradually expand along the predetermined processing and cutting path, thus completing the purpose of splitting the glass.

[0019] 2. The present invention, by subjecting the crack path to ultrasonic vibration in a liquid, not only prevents the debris from dispersing into the air and affecting the health of workers as in the prior art, but also allows the debris to act as abrasive particles, polishing the cracks present at the cutting edge.

[0020] 3. At the same time, the drive component in this invention can not only operate the clamping parts to clamp the glass plate, but also intermittently drive the glass plate to rise and fall, so that the glass in the processing area is constantly subjected to constantly changing forces. As a result, due to material fatigue, the glass in the processing area that has not been separated by ultrasonic vibration will eventually be completely separated from the glass in the unprocessed area, which plays a safety role and can also realize the automatic separation of the glass in the processing area and the unprocessed area. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0022] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 This is a schematic diagram of the top structure of the processing table of the present invention;

[0024] Figure 3 This is a schematic diagram of the ultrasonic vibration glass crack path according to the present invention;

[0025] Figure 4 This is a front view of the top structure of the processing table of the present invention;

[0026] Figure 5 This is a schematic diagram of the clamping component of the present invention clamping a glass plate.

[0027] Explanation of reference numerals in the attached figures:

[0028] 1. Glass plate; 2. Laser cutting machine; 3. Processing table; 4. Splitting cover; 5. Ultrasonic generator; 6. Coolant; 7. Clamping components; 7a. First plate; 7b. Second plate; 7c. Vertical plate; 8. XYZ three-axis platform; 9. Ultrasonic transducer; 10. Drive assembly; 10a. First electric telescopic rod; 10b. Positioning rod; 10c. Second electric telescopic rod; 11. Positioning plate; 12. Filter screen. Detailed Implementation

[0029] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0031] This invention provides, for example Figure 1-5 The apparatus shown is a cold cutting device for high borosilicate glass with a positioning mechanism, used for laser cutting and cleaving of high borosilicate glass plate 1. It includes a laser cutting machine 2 as in the prior art. The laser cutting machine 2 is equipped with a laser head that emits a 1064nm infrared picosecond laser. The laser head can move laterally within the laser cutting machine 2. The laser cutting machine 2 also has a processing table 3 for placing the glass plate 1. The processing table 3 can move longitudinally within the laser cutting machine 2. In conjunction with the laterally moving laser head, the required micro-crack paths can be processed on the glass plate 1.

[0032] A shard cover 4 is fixedly installed on the processing table 3. The shard cover 4 has an upward-opening chamber filled with coolant 6. Multiple second electric telescopic rods 10c are fixedly installed on the processing table 3. A positioning rod 10b is fixedly installed at the output shaft end of these second electric telescopic rods 10c. This positioning rod 10b is slidably connected to the processing table 3. Another positioning rod 10b is also fixedly installed on the processing table 3. Multiple first electric telescopic rods 10a are fixedly installed on these two positioning rods 10b. The first electric telescopic rods 10a output… Positioning plates 11 are rotatably mounted on the ends of the output shafts. A second plate 7b is fixedly mounted on the positioning plates 11 above the same positioning rod 10b. Alternatively, the positioning plates 11 can be omitted, and the output end of the first electric telescopic rod 10a can be directly fixedly connected to the bottom surface of the second plate 7b. However, in this case, the first electric telescopic rod 10a can only rise and fall synchronously. Vertical plates 7c are fixedly mounted on opposite sides of the two second plates 7b. First plates 7a are fixedly mounted on opposite sides of the bottom of the vertical plates 7c. A filter is slidably installed between the two first plates 7a. The two first plates 7a, located inside the cleaving cover 4, support the glass plate 1. The two vertical plates 7c, close together, clamp the glass plate 1, allowing the processing table 3 to move the glass plate 1 longitudinally synchronously for processing. Furthermore, when the output shafts of the two first electric telescopic rods 10a rise and fall synchronously, they can press the coolant 6 down onto the bottom surface of the glass plate 1 or raise the coolant 6 up onto the top surface of the glass plate 1. An XYZ three-axis platform 8 is also mounted on the top of the two second plates 7b, and an ultrasonic transducer is installed at the output end of the XYZ three-axis platform 8. The second plate 7b, which is close to the second electric telescopic rod 10c, and the XYZ three-axis platform 8 are slidably connected. That is, a connecting plate can be installed under the XYZ three-axis platform 8, and then a guide rail fixedly installed on the second plate 7b can be slidably installed on the plate. This is a common technical means in the prior art. It is only shown in the figure and is not fully drawn. The XYZ three-axis platform 8 is fixedly installed on the second plate 7b, which is away from the second electric telescopic rod 10c. An ultrasonic generator 5, which is electrically connected to the ultrasonic transducer 9, is installed on the processing table 3.

[0033] When using this device, the operator first needs to place the glass plate 1 on the two first plates 7a. The first plates 7a are not located below the processed texture; their width needs to be controlled. Then, the output shaft of the second electric telescopic rod 10c extends, which moves the positioning rod 10b closer to the cleaving cover 4. The positioning rod 10b then moves the first electric telescopic rod 10a, which in turn moves the second plate 7b via the positioning plate 11. The second plate 7b then moves the vertical plates 7c closer together, clamping the sides of the glass plate 1. Finally, the laser head uses a 1064nm infrared picosecond laser to process the surface of the glass plate 1, creating an initial texture. The path of the microcrack, where the temperature of the path and its surroundings is higher than that of the area not irradiated by the laser, then the output shaft of the second electric telescopic rod 10c slightly reduces and no longer drives the vertical plate 7c to clamp the glass plate 1. Then, the output shaft of the first electric telescopic rod 10a, which is closer to the second electric telescopic rod 10c, is driven to shorten. At this time, one side of the glass plate 1 will first contact the coolant 6. Then, the output shaft of the first electric telescopic rod 10a, which is farther away from the second electric telescopic rod 10c, is driven to shorten, so that the glass plate 1 gradually contacts the coolant 6 from one side to the other. Alternatively, the output shafts of the first electric telescopic rods 10a on both sides can be driven to shorten synchronously. Figure 3 As shown, cooling will cause a temperature gradient and tensile stress around the initial microcrack path. However, since the expansion coefficient of high borosilicate glass is only about one-third that of ordinary glass, the initial microcrack path will increase in number and size, but it will not completely separate the processed and unprocessed areas. Unless, as in existing technology, a high-speed jet of low-temperature carbon dioxide gas is used to create a rapid cooling effect, glass fragments will be generated and ejected into the air. Therefore, the ultrasonic transducer 9 is lowered by the XYZ three-axis platform 8, so that the ultrasonic transducer 9 is lowered into the coolant 6 and has a distance of 1-5 mm from the glass plate 1 support. Then, the ultrasonic generator 5 operates the ultrasonic transducer 9 to start ultrasonic vibration. The XYZ three-axis platform 8 moves the ultrasonic transducer 9 along the processing path. When the ultrasonic wave propagates in the liquid, it will create a negative pressure zone inside the liquid, causing the gas in the liquid to become supersaturated and escape to form small bubbles. These bubbles form and grow in the longitudinal propagation path of the ultrasonic wave, and then rapidly close and burst in the positive pressure zone, generating huge instantaneous pressure, thereby turning the original microcrack path into a strong pressure. Figure 3The fragile processing path area shown is induced to gradually expand along the predetermined processing and cutting path of the glass. The debris in the micro-crack path, under the vibration of the ultrasonic waves, acts as abrasive particles, polishing the cracks present at the cutting edge. After all paths have been vibrated by the ultrasonic transducer 9, the ultrasonic generator 5 is turned off, and the ultrasonic transducer 9 is reset via the XYZ three-axis platform 8. At this time, the second electric telescopic rod 10c drives the vertical plate 7c to clamp the glass plate 1 again. All the output shafts of the first electric telescopic rods 10a intermittently rise and fall. When the glass plate 1 falls, it presses down on the coolant 6. At this time, the coolant 6 applies a reverse pressure to the glass plate 1. An upward reaction force is generated because the glass plate 1 in the unprocessed area is clamped by the vertical plate 7c. Therefore, the glass of the required shape in the processing area will be pushed upward by the reaction force. When the glass plate 1 rises, the processed glass will be pressed downward by the reaction force. During multiple intermittent lifting and lowering processes, the glass in the processing area will be subjected to constantly changing forces. As a result, due to material fatigue, it will eventually completely separate from the glass in the unprocessed area, that is, separate from the glass clamped by the vertical plate 7c. Finally, the output shaft of the first electric telescopic rod 10a extends to its maximum length, and the second electric telescopic rod 10c no longer drives the vertical plate 7c to clamp the glass plate 1. After the processing table 3 retracts, the unprocessed area of ​​the glass plate 1 and the processed glass material can be taken out.

[0034] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape and proportion of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), installation arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application.

Claims

1. A cold cutting device for high borosilicate glass with a positioning mechanism, used for laser cutting and slicing of high borosilicate glass plates (1), comprising a laser cutting machine (2), a longitudinally moving processing table (3) within the laser cutting machine (2), and a transversely moving laser head within the laser cutting machine (2), wherein the high borosilicate glass plate (1) is mounted on the processing table (3), characterized in that: The machining table (3) is fixedly mounted with an upward-opening slit cover (4) and an ultrasonic generator (5). The slit cover (4) is filled with coolant (6), and the slit cover (4) has two symmetrically distributed clamping members (7). The tops of the two clamping members (7) are jointly mounted with an XYZ three-axis platform (8). An ultrasonic transducer (9) is mounted on the output end of the XYZ three-axis platform (8). The ultrasonic transducer (9) and the ultrasonic generator (5) are electrically connected. A drive assembly (10) for driving the clamping member (7) to move horizontally or vertically is installed between the clamping member (7) and the machining table (3). The clamping member (7) includes a first plate (7a) and a second plate (7b) parallel to the machining table (3), and the first plate (7a) and the second plate (7b) are also connected. A vertical plate (7c) is fixedly installed between the two plates (7b). The top surface of the first plate (7a) is in contact with the bottom surface of the glass plate (1), and the vertical plate (7c) is in contact with the side surface of the glass plate (1). The drive assembly (10) includes a plurality of first electric telescopic rods (10a) installed below the second plate (7b), and a positioning rod (10b) installed at the bottom of the first electric telescopic rods (10a). A second electric telescopic rod (10c) is also fixedly installed on the top of the processing table (3). The output end of the second electric telescopic rod (10c) is fixedly connected to one of the positioning rods (10b). This positioning rod (10b) is slidably connected to the top surface of the processing table (3), and the other positioning rod (10b) is fixedly connected to the processing table (3). After the required microcrack path is processed on the glass plate (1) by the processing table (3) and the laser head using the thermal cracking method, the clamping part (7) drives the glass plate (1) to move into the coolant (6) and intermittently rise and fall. With the help of the ultrasonic transducer (9), the coolant (6) is vibrated and seeps into the microcrack path, causing the microcrack path to expand into a crack.

2. The borosilicate glass cold cutting device with a positioning mechanism according to claim 1, characterized in that: A positioning plate (11) is rotatably mounted on the top of the first electric telescopic rod (10a), and the positioning plate (11) is fixedly connected to the bottom surface of the second plate (7b).

3. The borosilicate glass cold cutting device with a positioning mechanism according to claim 1, characterized in that: A filter screen (12) is slidably installed between the two first plates (7a).

4. The borosilicate glass cold cutting device with a positioning mechanism according to claim 1, characterized in that: The laser emitted by the laser head is a 1064nm infrared picosecond laser.

5. The borosilicate glass cold cutting device with a positioning mechanism according to claim 1, characterized in that: When the top surface of the glass plate (1) and the ultrasonic transducer (9) are both below the surface of the coolant (6), there is a gap of 1-5 mm between the ultrasonic transducer (9) and the glass plate (1).

6. The cold cutting device for high borosilicate glass with a positioning mechanism according to claim 3, characterized in that: When the ultrasonic transducer (9) is working, the filter screen (12) does not contact the bottom surface of the inner cavity of the split cover (4).

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