Solvent-free resin composition and application thereof

Abstract

The invention provides a solvent-free resin composition and application thereof, the solvent-free resin composition comprises a functional reinforcing phase and a continuous matrix phase, and the functional reinforcing phase comprises a magnetic composite filler; the magnetic composite filler comprises the following components: (A1) FeMn ferrite and / or carbonyl iron, wherein D50 is 0.1-0.9 [mu] m; (A2) FeMn ferrite and / or carbonyl iron, wherein D50 is 1 to 10 [mu] m; (B) a FeSiCr alloy and / or an iron-based nanocrystal, wherein D50 is 1 to 20 [mu] m. According to the resin composition provided by the invention, the magnetic filler with a specific particle size is introduced, and the specific type of the magnetic filler is limited, so that the resin composition has excellent magnetic performance, high magnetic conductivity and low magnetic loss at high frequency (10MHz-100MHz), and the resin composition is solvent-free, has relatively good stability and can realize high filling property.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit boards and relates to a solvent-free resin composition and application thereof. Background Art

[0002] With the development of high-frequency, high-speed, and highly integrated electronic circuits, higher requirements are being placed on the miniaturization and thinning of electronic devices. Furthermore, the circuit substrates used in electronic devices need to be further miniaturized and have higher circuit density. Integrating traditional external inductors and power components into circuit boards is an inevitable trend in future development.

[0003] CN112805795A discloses a magnetic paste that primarily addresses processability and storage stability. By incorporating magnetic powder with a defined particle size distribution, the paste suppresses the unevenness of the magnetic powder within the paste, resulting in a magnetic paste with excellent discharge properties from a dispenser. Furthermore, the cured product of this magnetic paste exhibits improved relative permeability at frequencies of 10 to 200 MHz. However, the magnetic paste provided by this invention exhibits high magnetic loss.

[0004] CN111886939A discloses a through-hole filling paste. By using a through-hole filling paste containing magnetic powder treated with a specific surface treatment agent, after grinding the solidified paste overflowing from the through-hole, a plating layer is formed on the ground surface without performing a roughening process such as an oxidizing agent. While high plating adhesion can be obtained, the loss at 100 MHz is close to 0.1, and high-frequency low-loss performance cannot be achieved.

[0005] Therefore, it is desired in this field to develop a material with good magnetic properties that can achieve both high magnetic permeability and low magnetic loss. Summary of the Invention

[0006] In view of the deficiencies in the prior art, the object of the present invention is to provide a solvent-free resin composition and its application, wherein the solvent-free resin composition can be applied in the fields of high-frequency integrated inductors, circuit components and circuit substrates.

[0007] To achieve this object, the present invention adopts the following technical solutions:

[0008] In a first aspect, the present invention provides a solvent-free resin composition, comprising a functional enhancement phase and a continuous matrix phase, wherein the functional enhancement phase comprises a magnetic composite filler;

[0009] The magnetic composite filler comprises the following components: (A1) FeMn ferrite and / or carbonyl iron, D50 is 0.1-0.9 μm, for example, can be 0.1 μm, 0.2 μm, 0.3 μm, 0.4 μm, 0.5 μm, 0.6 μm, 0.7 μm, 0.8 μm or 0.9 μm and specific point values between the above point values, limited to the length and for the sake of simplicity, the present application does not exhaustively list the specific point values included in the range; (A2) FeMn ferrite and / or carbonyl iron, D50 is 1-10 μm, for example, can be 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm or 10 μm and specific point values between the above point values, limited to the length and for the sake of simplicity, the present application does not exhaustively list the specific point values included in the range; (B) FeSiCr alloy and / or iron-based nanocrystalline, D50 is 1-20 μm, for example, can be 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm or 20 μm and specific point values between the above point values, limited to the length and for the sake of simplicity, the present application does not exhaustively list the specific point values included in the range.

[0010] The resin composition provided by the present application has excellent magnetic properties at high frequency (10-100 MHz) by introducing magnetic fillers of specific particle size and limiting the specific types thereof, can balance high permeability and low magnetic loss, and has good stability and high filling property.

[0011] In the present application, the large particle size filler component (i.e. component (A2) and component B) provides high permeability, and the small particle size filler component (i.e. component (A1)) provides low magnetic loss at high frequency, and the combined use thereof can achieve high frequency, high permeability and low magnetic loss.

[0012] The following is a preferred technical solution of the present application, but not as a limitation on the technical solutions provided by the present application, and the purpose and beneficial effects of the present application can be better achieved and realized through the following preferred technical solution.

[0013] As a preferred technical solution of the present application, the morphology of the magnetic composite filler is spherical or spherical-like, which can improve the filling amount and the flowability, and the maximum particle size (D100) is less than 40 μm, so as to be able to meet the filling hole process.

[0014] Preferably, the content of the component (A1) is 1 to 20 %, for example, 1 %, 2 %, 3 %, 4 %, 5 %, 6 %, 7 %, 8 %, 9 %, 10 %, 11 %, 12 %, 13 %, 14 %, 15 %, 16 %, 17 %, 18 %, 19 %, or 20 %, and a specific point value between the above-mentioned point values, and the content of the component (A2) is 80 to 99 %, for example, 80 %, 81 %, 82 %, 83 %, 84 %, 85 %, 86 %, 87 %, 88 %, 89 %, 90 %, 91 %, 92 %, 93 %, 94 %, 95 %, 96 %, 97 %, 98 %, or 99 %, and a specific point value between the above-mentioned point values, based on 100 % of the total weight of the components (A1) and (A2), and the present application does not exhaustively list the specific point values included in the range for the sake of brevity and consideration of the length.

[0015] Preferably, the total content of the components (A1) and (A2) is 80 to 99.9 %, for example, 80 %, 81 %, 82 %, 83 %, 84 %, 85 %, 86 %, 87 %, 88 %, 89 %, 90 %, 91 %, 92 %, 93 %, 94 %, 95 %, 96 %, 97 %, 98 %, 99 %, 99.2 %, 99.3 %, 99.5 %, 99.7 %, 99.8 %, or 99.9 %, and a specific point value between the above-mentioned point values, and the content of the component (B) is 0.1 to 20 %, for example, 0.1 %, 0.2 %, 0.3 %, 0.5 %, 0.7 %, 0.8 %, 1 %, 2 %, 3 %, 4 %, 5 %, 6 %, 7 %, 8 %, 9 %, 10 %, 11 %, 12 %, 13 %, 14 %, 15 %, 16 %, 17 %, 18 %, 19 %, or 20 %, and a specific point value between the above-mentioned point values, based on 100 % of the total weight of the magnetic composite filler, and the present application does not exhaustively list the specific point values included in the range for the sake of brevity and consideration of the length.

[0016] Preferably, the continuous matrix phase includes an epoxy resin, a diluent, a curing agent, and other auxiliaries.

[0017] Preferably, the epoxy resin includes any one of a glycerol type epoxy resin, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a bisphenol AF type epoxy resin, a naphthalene type epoxy resin, a phenol resin type epoxy resin, an alicyclic type epoxy resin having an ester skeleton, a cyclohexane dimethanol type epoxy resin, an epoxy resin having a butadiene structure, a dicyclopentadiene type epoxy resin, a triphenol type epoxy resin, a phenol novolac epoxy resin, a tert-butyl-o-phenol type epoxy resin, a naphthol novolac type epoxy resin, a naphthalene type epoxy resin, a naphthol type epoxy resin, an anthracene type epoxy resin, or a combination of at least two thereof.

[0018] Preferably, the diluent includes any one of a glycerol ester type epoxy resin, a glycerol amine type epoxy resin, a glycidyl amine type epoxy resin, a glycidyl ester type epoxy resin, a cresol novolac type epoxy resin, a biphenyl type epoxy resin, a linear aliphatic epoxy resin, an alicyclic epoxy resin, a heterocyclic epoxy resin, an epoxy resin containing a spiro ring, a cyclohexane dimethanol type epoxy resin, a trimethylol type epoxy resin, a tetraphenyl ethane type epoxy resin, or a combination of at least two thereof.

[0019] Preferably, the curing agent includes an acid anhydride curing agent and / or an amine-based curing agent.

[0020] Preferably, the acid anhydride curing agent can use a curing agent having one or more acid anhydride groups in one molecule, preferably a curing agent having two or more acid anhydride groups in one molecule as an acid anhydride-based curing agent, such as phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methyl naphthalene anhydride, hydrogenated methyl naphthalene anhydride, trialkyl tetrahydrophthalic anhydride, polydicyclopentadiene succinic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride; trimellitic anhydride, pyromellitic anhydride, benzophenone tetra carboxylic dianhydride, biphenyl tetra carboxylic dianhydride, naphthalene tetra carboxylic dianhydride, oxalic diphthalic dianhydride, 3,3'-4,4'-diphenyl sulfonic acid tetra carboxylic dianhydride, 1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-C]furan-1,3-dione, ethylene glycol bis(trimethyl phthalate), a styrene-maleic acid resin copolymerized with styrene and maleic acid, and the like polymer type acid anhydride, and the like commercially available products of acid anhydride hardening agents.

[0021] Preferably, the amine curing agent has at least one amino group per molecule, and as a preferred amine curing agent having two or more amino groups, aliphatic amines, polyether amines, alicyclic amines, aromatic amines, and the like can be used, and among them, aromatic amine curing agents are preferred, and as a specific example of the amine curing agent which is preferably a primary amine or a secondary amine, and more preferably a primary amine, 4,4'-methylenebis(2,6-dimethyl aniline), 4,4'-diaminodiphenyl methane; 4,4'-diaminodiphenyl sulfone; 3,3'-diaminodiphenyl sulfone; m-phenylenediamine, m-phenylenediamine, diethyltoluene diamine, 4,4'-diaminodiphenyl ether; 3,3'-dimethyl-4,4'-diaminobiphenyl; 2,2'-dimethyl-4,4'-diaminobiphenyl; 3,3'-dihydroxybenzidine; 2,2-bis(3-amino-4-hydroxyphenyl)propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethane diamine, 2,2-bis(4-aminophenyl)propane; 2,2-bis(4-(4-aminophenoxy)phenyl propane, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4-bis(4-aminophenoxy)biphenyl, bis(4-(4-aminophenoxy)phenyl sulfonic acid, bis(4-(3-aminophenoxy)phenyl sulfonic acid, and the like can be used. Commercially available products can be used as the amine curing agent.

[0022] Preferably, the other auxiliary agent includes a dispersant and / or an accelerator.

[0023] Preferably, the dispersant includes any one of or a combination of at least two of a phosphate-based dispersant (e.g., polyoxyethylene alkyl ether phosphate, and the like), an anionic dispersant (e.g., sodium dodecylbenzenesulfonate, sodium laurate, ammonium salt of polyoxyethylene alkyl ether sulfate, and the like), a nonionic dispersant (e.g., silicone oxane-based dispersant, acetylene glycol, polyoxyethylene alkyl ether, polyoxyethylene alkyl ester, polyoxyethylene sorbitan fatty acid ester, polyoxyethylene alkyl phenyl ether, polyoxyethylene alkyl amine, polyoxyethylene alkyl amide, and the like).

[0024] Preferably, the accelerator includes an imidazole accelerator and / or an amine accelerator.

[0025] Preferably, the imidazole accelerator includes 2-methylimidazole, 2-undecylimidazole, 2-heptidineimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-benzimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-benzimidazole, 1-cyanoethyl-2-methylimidazole; 1-cyanoethyl-2-undecylimidazole; 1-cyanoethyl-2-ethyl-4-methylimidazole; 1-cyanoethyl-2-benzimidazole; 1-cyanoethyl-2-undecylimidazole trimesate, 1-cyanoethyl-2-phenylimidazole trimesate, 2,4-diamino-6-[2' -Methylimidazolidine-(1')]-ethyl-s-triazine; 2,4-diamino-6-[2'-undecylimidazolidine-(1')]-ethyl-s-triazine; 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolidino[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazole chloride, etc.

[0026] Preferably, the amine accelerator can use commercially available products, such as trialkylamines such as boron trifluoride monoethylamine, triethylamine, and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6,-trimethyl(dimethylaminomethyl)phenol, 1,8-diazabicyclo(5,4,0)-undecene, and other amine hardening accelerators.

[0027] As a preferred technical solution of the present invention, other additives may be added, for example, triethyl borate may be added to extend the storage period, thixotropy and anti-settling properties may be achieved, and aerated silicon, bentonite, montmorillonite, flame retardants, organic fillers, organometallic compounds such as organic copper compounds, organic zinc compounds and organic cobalt compounds, as well as resin additives such as thickeners, defoamers, leveling agents, adhesion imparting agents, and colorants may also be added.

[0028] Preferably, the content of the epoxy resin is 40% to 80%, for example, can be 40%, 42%, 44%, 46%, 48%, 50%, 52%, 54%, 56%, 58%, 60%, 62%, 64%, 66%, 68%, 70%, 72%, 74%, 76%, 78%, or 80%, and the specific point values between the above point values, limited to the length and for the sake of simplicity, the present application will not be exhaustive listing of the specific point values included in the range, the content of the diluent is 20% to 60%, for example, can be 20%, 22%, 24%, 26%, 28%, 30%, 32%, 34%, 36%, 38%, 40%, 42%, 44%, 46%, 48%, 50%, 52%, 54%, 56%, 58%, or 60%, and the specific point values between the above point values, limited to the length and for the sake of simplicity, the present application will not be exhaustive listing of the specific point values included in the range, the content of the curing agent is 0.01% to 20%, for example, can be 0.01%, 0.02%, 0.03%, 0.05%, 0.06%, 0.08%, 0.1%, 0.3%, 0.5%, 0.8%, 1%, 2%, 3%, 5%, 8%, 10%, 12%, 14%, 16%, 18%, or 20%, and the specific point values between the above point values, limited to the length and for the sake of simplicity, the present application will not be exhaustive listing of the specific point values included in the range, the content of the other auxiliary agent is 0.01% to 5%, for example, can be 0.01%, 0.02%, 0.03%, 0.05%, 0.06%, 0.08%, 0.1%, 0.3%, 0.5%, 0.8%, 1%, 2%, 3%, 4%, or 5%, and the specific point values between the above point values, limited to the length and for the sake of simplicity, the present application will not be exhaustive listing of the specific point values included in the range.

[0029] Preferably, the mass ratio of the functional enhanced phase and the continuous matrix phase is (1 to 9): 1, for example, can be 1:1, 2:1, 3:1, 4:1, 5:1, 6:1, 7:1, 8:1, or 9:1, and the specific point values between the above point values, limited to the length and for the sake of simplicity, the present application will not be exhaustive listing of the specific point values included in the range.

[0030] Preferably, the thixotropic index of the solvent-free resin composition is greater than 1.

[0031] It should be noted that the present application does not limit the preparation method of the solvent-free resin composition, which can be prepared by the following method:

[0032] The components of the continuous matrix phase are blended, specifically, using a homogenizer or a three-roll mill (selected according to the amount of raw materials, a homogenizer is used for less than 100 g, and a three-roll mill is used for kilograms and above), so that the curing agent and part of other additives (such as accelerators) are evenly dispersed in the epoxy resin and diluent to form a uniform and stable system, and then other additives (such as dispersants) are added, and finally the functional enhancement phase is added, and dispersed uniformly at high speed to obtain the solvent-free resin composition.

[0033] The resin composition provided by the present invention does not require addition of solvent during the preparation process and has good stability in subsequent applications.

[0034] The resin composition of the present invention is a solvent-free, highly filled system. In order to further obtain a uniform and stable resin composition, the finished product prepared by a three-roller mill can be further filled and degassed using a centrifuge. A small amount can be degassed by standing still. A heated vacuum machine can also be selected for degassed. The purpose is to make the resin composition more uniform and stable.

[0035] Preferably, the resin composition prepared by the above method can be directly cured in a mold to obtain a device, or can be coated to form a magnetic coating or used as a plugging resin on a substrate with processed holes, and finally cured to achieve magnetic properties.

[0036] In a second aspect, the present invention provides a use of the solvent-free resin composition as described in the first aspect in an inductor component.

[0037] In a third aspect, the present invention provides an inductor component, comprising a cured product of the solvent-free resin composition according to the first aspect.

[0038] In a fourth aspect, the present invention provides a circuit substrate, wherein the circuit substrate comprises the inductor component as described in the third aspect.

[0039] Compared with the prior art, the present invention has at least the following beneficial effects:

[0040] The resin composition provided by the present invention introduces magnetic fillers of specific particle sizes and limits their specific types, so that the resin composition has excellent magnetic properties at high frequencies (10MHz to 100MHz), can achieve both high magnetic permeability and low magnetic loss, and the resin composition is solvent-free, has good stability, and can achieve high filling properties. DETAILED DESCRIPTION

[0041] The technical solution of the present invention is further described below by way of specific embodiments. It should be understood by those skilled in the art that the embodiments are merely to help understand the present invention and should not be regarded as specific limitations of the present invention.

[0042] The materials involved in the following specific embodiments of the present application are shown as follows:

[0043] (1) Functional enhancement phase

[0044] Component (A1)

[0045] FeMn ferrite: D50 of 0.5 μm, purchased from Xianyang Yinghe Electronics;

[0046] Component (A2)

[0047] FeMn ferrite: D50 of 3 μm, purchased from Xianyang Yinghe Electronics;

[0048] Carbonyl iron: D50 of 5 μm, purchased from Jiangxi Yuean;

[0049] Component (B)

[0050] FeSiCr alloy: D50 of 20 μm, SPN200, purchased from Shenzhen Pt. Co.;

[0051] Iron-based nanocrystals: D50 of 5 μm, NP01-A, purchased from Antai;

[0052] (2) Continuous matrix phase

[0053] 1) Epoxy resin

[0054] Bisphenol A type epoxy resin, brand Epoxy 128, purchased from Shengquan;

[0055] Bisphenol F type epoxy resin, brand NPF170, purchased from Shengquan;

[0056] 2) Diluent

[0057] Alicyclic epoxy resin, brand 2021P, purchased from Japan Daiso;

[0058] 3) Curing agent

[0059] Methyl hexahydrophthalic anhydride

[0060] 4) Other auxiliary agents

[0061] Dispersant: BYK-9010;

[0062] Promoter: 2-MI.

[0063] Example 1

[0064] In this example, a solvent-free resin composition is provided, and the specific components and amounts (parts by weight) of the solvent-free resin composition are shown in Table 1.

[0065] The preparation method of the solvent-free resin composition includes the following steps:

[0066] The components of the continuous matrix phase are blended, specifically, the curing agent and the accelerator are uniformly dispersed in the epoxy resin and the diluent to form a uniform and stable system, then the dispersant is added, and finally the functional reinforcing phase is added and uniformly dispersed at high speed to obtain the solvent-free resin composition.

[0067] Performance test

[0068] (1) Viscosity: Anton Paar rheometer MCR102, CP25 rotor, respectively test the viscosity under different rotation speed 0.5 r / min and 5 r / min;

[0069] (2) Thixotropic index: the ratio of the viscosity under small rotation speed 0.5 r / min to the viscosity under large rotation speed 5 r / min;

[0070] (3) Magnetic performance: the impedance analyzer E4991B of keysight company and 16454A test fixture are used to realize the test of magnetic performance.

[0071] The test results are shown in Table 1.

[0072] Examples 2-6, Comparative Examples 1-3

[0073] The difference from Example 1 is only that the specific components and / or amount of the solvent-free resin composition are different, which are shown in Table 1 and Table 2. The test method is the same as in Example 1, and the specific test results are shown in Table 1 and Table 2.

[0074] Table 1

[0075]

[0076]

[0077] Table 2

[0078]

[0079] As can be seen from Table 1, the solvent-free resin composition provided by the examples of the present application has excellent magnetic performance, which can balance high magnetic permeability (5.91-6.5 at 100 MHz) and low magnetic loss (0.006-0.009 at 100 MHz), and the resin composition is solvent-free, has good stability, and can realize high filling.

[0080] Compared with Example 1, the magnetic loss of the solvent-free resin composition provided by Comparative Example 1 is increased, and the magnetic permeability of the solvent-free resin compositions provided by Comparative Examples 2-3 is reduced.

[0081] The applicant states that the present application is illustrated by the above-mentioned examples of the solvent-free resin composition and the use thereof, but the present application is not limited to the above-mentioned examples, i.e. it does not mean that the present application must rely on the above-mentioned examples to be implemented. It should be understood by those skilled in the art that any improvement on the present application, equivalent replacement of each raw material of the product of the present application, addition of auxiliary ingredients, selection of specific modes, etc. fall within the protection scope and disclosure scope of the present application.

Claims

1. A solvent-free resin composition, characterized in that The solvent-free resin composition comprises a function-enhancing phase and a continuous matrix phase, wherein the function-enhancing phase comprises a magnetic composite filler; The magnetic composite filler comprises the following components: (A1) FeMn ferrite and / or carbonyl iron, with D50 of 0.1 to 0.9 μm; (A2) FeMn ferrite and / or carbonyl iron, with D50 of 1 to 10 μm; and (B) FeSiCr alloy and / or iron-based nanocrystals, with D50 of 1 to 20 μm.

2. The solvent-free resin composition according to claim 1, characterized in that Based on the total weight of the component (A1) and the component (A2) as 100%, the content of the component (A1) is 1% to 20%, and the content of the component (A2) is 80% to 99%.

3. The solvent-free resin composition according to claim 1 or 2, characterized in that Based on the total weight of the magnetic composite filler being 100%, the total content of the component (A1) and the component (A2) is 80% to 99.9%, and the content of the component (B) is 0.1% to 20%.

4. The solvent-free resin composition according to any one of claims 1 to 3, characterized in that The continuous matrix phase includes epoxy resin, diluent, curing agent and other additives.

5. The solvent-free resin composition according to claim 4, characterized in that The epoxy resin includes any one or a combination of at least two of glycerol-type epoxy resin, bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, bisphenol AF-type epoxy resin, naphthalene-type epoxy resin, phenol-formaldehyde-type epoxy resin, alicyclic epoxy resin with an ester skeleton, cyclohexanedimethanol-type epoxy resin, epoxy resin with a butadiene structure, dicyclopentadiene-type epoxy resin, trisphenol-type epoxy resin, phenol-formaldehyde epoxy resin, tert-butyl-catechol-type epoxy resin, naphthol-formaldehyde epoxy resin, naphthalene-type epoxy resin, naphthol-type epoxy resin, and anthracene-type epoxy resin; Preferably, the diluent includes any one or a combination of at least two of glycerol ester epoxy resin, glyceryl amine epoxy resin, glycidyl amine epoxy resin, glycidyl ester epoxy resin, cresol novolac epoxy resin, biphenyl epoxy resin, linear aliphatic epoxy resin, alicyclic epoxy resin, heterocyclic epoxy resin, epoxy resin containing spiro ring, cyclohexanedimethanol epoxy resin, trimethylol epoxy resin, and tetraphenylethane epoxy resin; Preferably, the curing agent includes an anhydride curing agent and / or an amine curing agent; Preferably, the other auxiliary agents include dispersants and / or promoters; Preferably, the dispersant includes any one or a combination of at least two of a phosphate dispersant, an anionic dispersant, and a nonionic dispersant; Preferably, the accelerator comprises an imidazole accelerator and / or an amine accelerator.

6. The solvent-free resin composition according to claim 4 or 5, characterized in that Based on the total weight of the continuous matrix phase as 100%, the content of the epoxy resin is 40% to 80%, the content of the diluent is 20% to 60%, the content of the curing agent is 0.01% to 20%, and the content of the other additives is 0.01% to 5%; Preferably, the mass ratio of the functional enhancement phase to the continuous matrix phase is (1-9):

1.

7. The solvent-free resin composition according to any one of claims 1 to 6, characterized in that The thixotropic index of the solvent-free resin composition is greater than 1.

8. Use of the solvent-free resin composition according to any one of claims 1 to 7 in inductive components.

9. An inductor component, characterized in that: The inductor component comprises a cured product of the solvent-free resin composition according to any one of claims 1 to 7.

10. A circuit substrate, characterized in that: The circuit substrate includes the inductor component according to claim 9.

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