Airborne multi-temperature-zone refrigerating device with coupled secondary refrigerant loops and simulated annealing method of airborne multi-temperature-zone refrigerating device

Abstract

The invention provides a secondary refrigerant loop coupled airborne multi-temperature-zone refrigerating device and a simulated annealing method thereof. The device comprises a double-evaporator steam compression type refrigerating system, a secondary refrigerant circulation loop, a semiconductor assembly, a multi-temperature-zone box body, a control element and a central processing unit. The hot ends of the three semiconductor assemblies are subjected to double cooling through an air cooling head and a water cooling head, and a cold end radiator cools air in a plurality of temperature zone box bodies. Through coupling application of vapor compression refrigeration and semiconductor refrigeration, efficient collaborative refrigeration of multiple temperature zones is achieved; the control element receives signals of the pressure sensor and the temperature sensor to control the opening degree of the electronic expansion valve, the frequency of the compressor and the current of the semiconductor refrigeration chip. The central processing unit performs global optimization search on the intermediate pressure of the double-evaporator vapor compression type refrigeration system by using a simulated annealing method, so that the overall performance of the refrigeration device and the utilization efficiency of energy are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of multi-temperature zone refrigeration equipment, and particularly relates to an on-board multi-temperature zone refrigeration device coupled with a carrier refrigerant loop and a simulated annealing method thereof. BACKGROUND

[0002] With the rapid development of low-altitude economy, the application value of multi-functional unmanned aerial vehicles (UAVs) in the fields of civilian logistics, inspection, surveying and mapping, and military reconnaissance and strike is increasingly prominent. However, with the evolution of the avionics equipment of the UAVs towards high-density, integration and multi-temperature zone collaborative work, the diversified thermal load generated thereby poses unprecedented challenges to the on-board thermal management system.

[0003] Traditional cooling means cannot meet the needs of these UAV avionics equipment in multi-element thermal control and long-endurance safe and stable flight, and the existing single-stage evaporation cycle refrigeration technology faces core bottleneck problems such as small cooling weight ratio, insufficient wide-temperature-domain regulation and control capability, and difficulty in realizing multi-temperature zone temperature control. In addition, in a double-evaporator vapor compression refrigeration system, the traditional method also has difficulty in finding an actual global optimal intermediate pressure, thereby leading to a decrease in refrigeration performance. SUMMARY

[0004] In view of the problems existing in the prior art, the present application aims to provide an on-board multi-temperature zone refrigeration device coupled with a carrier refrigerant loop and a simulated annealing method thereof. The present application couples a double-evaporator vapor compression refrigeration system with a semiconductor component, and uses a simulated annealing method to perform global optimization search on the intermediate pressure of the compressor in the double-evaporator vapor compression refrigeration system, thereby improving the overall performance of the refrigeration device.

[0005] In order to achieve the above technical purpose, the present application adopts the following technical solutions:

[0006] The on-board multi-temperature zone refrigeration device coupled with a carrier refrigerant loop comprises a double-evaporator vapor compression refrigeration system, a carrier refrigerant circulation loop, a semiconductor component, a multi-temperature zone box, a control element and a central processing unit.

[0007] The double-evaporator vapor compression refrigeration system comprises a compressor 101, a condenser 102, a first evaporator 103, a second evaporator 104, a gas-liquid separator 105, a first electronic expansion valve 106, a second electronic expansion valve 107, a third electronic expansion valve 108, a first mass flow meter 109, a second mass flow meter 110, and a pressure regulating valve 111; the outlet of the compressor 101 is connected to the inlet of the condenser 102, the outlet of the condenser 102 is connected to the inlet of the gas-liquid separator 105 through the first electronic expansion valve 106, the first outlet of the gas-liquid separator 105 is connected to the air supplement port of the compressor 101, the second outlet of the gas-liquid separator 105 is divided into two paths, one path is connected to the inlet of the first evaporator 103 through the second electronic expansion valve 107 and the first mass flow meter 109, the outlet of the first evaporator 103 is connected to the pressure regulating valve 111, the other path is connected to the refrigerant side inlet of the second evaporator 104 through the third electronic expansion valve 108 and the second mass flow meter 110, the refrigerant side outlet of the second evaporator 104 is connected to the outlet of the pressure regulating valve 111, and then sequentially passes through a first gas cooling head 112, a second gas cooling head 113, and a third gas cooling head 114, and then is connected to the inlet of the compressor 101; thus, a complete double-evaporator parallel vapor compression refrigeration system is formed.

[0008] The secondary refrigerant circulation loop comprises a water pump 115, an expansion tank 116, a first water cooling head 117, a second water cooling head 118, and a third water cooling head 119; the outlet of the water pump 115 is connected to the inlet of the expansion tank 116, the outlet of the expansion tank 116 is connected to the secondary refrigerant side inlet of the second evaporator 104, the secondary refrigerant side outlet of the second evaporator 104 is sequentially connected to the first water cooling head 117, the second water cooling head 118, and the third water cooling head 119, the surfaces of the first water cooling head 117, the second water cooling head 118, and the third water cooling head 119 are tightly attached to the surfaces of the first gas cooling head 112, the second gas cooling head 113, and the third gas cooling head 114 respectively, and the outlet of the third water cooling head 119 is connected to the inlet of the water pump 115.

[0009] The semiconductor assembly comprises a first semiconductor refrigeration element 120, a second semiconductor refrigeration element 121, and a third semiconductor refrigeration element 122; the hot ends of the first semiconductor refrigeration element 120, the second semiconductor refrigeration element 121, and the third semiconductor refrigeration element 122 are tightly attached to the first gas cooling head 112, the second gas cooling head 113, and the third gas cooling head 114 respectively; the cold end heat sinks of the first semiconductor refrigeration element 120, the second semiconductor refrigeration element 121, and the third semiconductor refrigeration element 122 are located directly above the first temperature zone 123, the second temperature zone 124, and the third temperature zone 125 respectively.

[0010] The multi-temperature zone box includes a first temperature zone 123, a second temperature zone 124 and a third temperature zone 125; the control element receives the signals of the first pressure sensor 126 located at the gas outlet of the compressor 101, the second pressure sensor 127 located at the first outlet of the gas-liquid separator 105, the third pressure sensor 128 and the first temperature sensor 132 located at the inlet of the first evaporator 103, the fourth pressure sensor 129 and the second temperature sensor 133 located at the outlet of the first evaporator 103, the fifth pressure sensor 130 and the third temperature sensor 134 located at the inlet of the refrigerant side of the second evaporator 104, the sixth pressure sensor 131 and the fourth temperature sensor 135 located at the outlet of the refrigerant side of the second evaporator 104, the fifth temperature sensor 136 located at the outlet of the secondary coolant side of the second evaporator 104, the sixth temperature sensor 137, the seventh temperature sensor 138 and the eighth temperature sensor 139 located below the first temperature zone 123, the second temperature zone 124 and the third temperature zone 125 respectively, and transmits the signals to the central processing unit, which sends control instructions to the control element to adjust the frequency of the compressor 101, the opening of the first electronic expansion valve 106, the second electronic expansion valve 107, the third electronic expansion valve 108 and the pressure regulating valve 111, the start and stop of the water pump 115, and the current of the first semiconductor refrigeration element 120, the second semiconductor refrigeration element 121 and the third semiconductor refrigeration element 122.

[0011] As a preferred scheme, the refrigerant mixed after the outlet flow paths of the first evaporator 103 and the second evaporator 104 in the double-evaporator vapor compression refrigeration system passes through the first gas cooling head 112, the second gas cooling head 113 and the third gas cooling head 114 in turn, and is fully superheated before entering the compressor 101.

[0012] As a preferred scheme, the first evaporator 103 is a tube-fin heat exchanger, which has high heat exchange efficiency, strong full-working-condition adaptability and corrosion resistance; the second evaporator 104 is a plate heat exchanger, which is used for cooling the secondary coolant and has the characteristics of compactness, high efficiency and easy maintenance.

[0013] As a preferred scheme, the secondary coolant used in the secondary coolant circulation loop is one of ethylene glycol solution, propylene glycol solution and calcium chloride brine, and the application of low freezing point secondary coolant further reduces the temperature of the hot end of the semiconductor refrigeration sheet and improves the refrigeration performance thereof.

[0014] As a preferred scheme, the first semiconductor refrigeration element 120 is a multi-stage semiconductor refrigeration sheet, the second semiconductor refrigeration element 121 is a single-stage semiconductor refrigeration sheet, and the third semiconductor refrigeration element 122 is a double-stage semiconductor refrigeration sheet, which are diversifiedly matched with single-stage, double-stage and multi-stage semiconductor refrigeration sheets according to different refrigeration requirements of the multi-temperature zones.

[0015] As a preferred scheme, the cold end heat dissipater of the first semiconductor refrigeration element 120, the second semiconductor refrigeration element 121 and the third semiconductor refrigeration element 122 comprises flexible heat conductive material, heat conductive pipe and metal fin; the heat conductive pipe connects the cold end of the semiconductor refrigeration element through flexible heat conductive material; the metal fin is arranged outside the heat conductive pipe for heat dissipation.

[0016] As a preferred scheme, the first evaporator 103 is used for heat dissipation of the cabin internal electronic element; the second evaporator 104 is used for heat dissipation of the hot end of the first semiconductor refrigeration element 120, the second semiconductor refrigeration element 121 and the third semiconductor refrigeration element 122; the first temperature zone 123 is used for providing low-temperature working environment for the infrared detector; the second temperature zone 124 is used for heat dissipation of the laser weapon; the third temperature zone 125 is used for heat dissipation of the communication equipment.

[0017] The simulated annealing method of the onboard multi-temperature zone refrigeration device coupled with the secondary refrigerant circuit is realized based on the onboard multi-temperature zone refrigeration device coupled with the secondary refrigerant circuit, and comprises the following steps.

[0018] Step 1: detecting the condensing pressure P1 through the first pressure sensor 126, the intermediate supplementary air pressure P2 through the second pressure sensor 127, the first evaporator 103 inlet pressure P3 through the third pressure sensor 128, the first evaporator 103 outlet pressure P4 through the fourth pressure sensor 129, the second evaporator 104 refrigerant side inlet pressure P5 through the fifth pressure sensor 130, the second evaporator 104 refrigerant side outlet pressure P6 through the sixth pressure sensor 131, the first evaporator 103 inlet temperature T1 through the first temperature sensor 132, the first evaporator 103 outlet temperature T2 through the second temperature sensor 133, the second evaporator 104 refrigerant side inlet temperature T3 through the third temperature sensor 134, the second evaporator 104 refrigerant side outlet temperature T4 through the fourth temperature sensor 135, the second evaporator 104 secondary refrigerant side outlet temperature T5 through the fifth temperature sensor 136, the first temperature zone 123 temperature T6 through the sixth temperature sensor 137, the second temperature zone 124 temperature T7 through the seventh temperature sensor 138, the third temperature zone 125 temperature T8 through the eighth temperature sensor 139, setting the rated temperatures of the first temperature zone 123, the first temperature zone 124 and the third temperature zone 125 as Ts1, Ts2 and Ts3 respectively, the second evaporator 104 secondary refrigerant side outlet rated temperature as Tr2, the first evaporator 103 outlet superheat degree as Tsh1, the second evaporator 104 refrigerant side outlet superheat degree as Tsh2, and setting the initial opening degrees of the first electronic expansion valve 106, the second electronic expansion valve 107 and the third electronic expansion valve 108 as 50% of the full opening degree.

[0019] Step 2: The control element controls the second electronic expansion valve 107 and the opening of the third electronic expansion valve 108 to meet the conditions of Tsh1 = 8℃ and Tsh2 = 8℃; the control element adjusts the input power of the first semiconductor refrigeration element 120, the second semiconductor refrigeration element 121 and the third semiconductor refrigeration element 122 according to the set rated temperature of the first temperature zone 123, the second temperature zone 124 and the third temperature zone 125 respectively to meet the conditions of T1 = Ts1, T2 = Ts2 and T3 = Ts3; the control element controls the frequency of the compressor 101 to meet the condition of T2 = Tr2;

[0020] Step 3: The process of real-time optimization and regulation of the refrigeration device using simulated annealing method is as follows:

[0021] Step a, set the initial algorithm temperature T0, the termination temperature Tmin, the cooling coefficient α and the number of internal loop iterations L, and generate the initial solution S; wherein S is the opening of the first electronic expansion valve 106; set the operating constraints of the refrigeration device, including the upper limit of the evaporation temperature of the first evaporator 103 Te1_high, the lower limit of the evaporation temperature of the first evaporator 103 Te1_low, the upper limit of the evaporation temperature of the second evaporator 104 Te2_high, the lower limit of the evaporation temperature of the second evaporator 104 Te2_low, and the upper limit of the discharge pressure of the compressor 101 Pout_high;

[0022] Step b, when the refrigeration device is stably running, that is, the outlet superheat of the first evaporator 103 Tsh1 and the outlet superheat of the second evaporator 104 Tsh2 are 8℃, and the temperatures of the first temperature zone 123, the second temperature zone 124 and the third temperature zone 125 are Ts1, Ts2 and Ts3 respectively, judge whether the parameters meet the constraints Te1_low≤T1≤Te1_high, Te1_low≤T2≤Te1_high, Te2_low≤T3≤Te2_high, Te2_low≤T4≤Te2_high and P1≤Pout_high according to the operating constraints of the refrigeration device set in step a, if all parameters meet the constraints, S is regarded as a feasible solution, and the refrigeration performance η of the refrigeration device is calculated, and the specific calculation formula is as follows:

[0023] Evaporator total refrigerating capacity Q t :

[0024] Q t =m e1 *(h o1 -h i1 )+m e2 *(h o2 -h i2 )

[0025] Wherein, m e1 is the refrigerant mass flow entering the first evaporator 103, me2 is the refrigerant mass flow rate entering the second evaporator 104, h o1 is the refrigerant enthalpy at the outlet of the first evaporator 103, h i1 is the enthalpy of the refrigerant at the inlet of the first evaporator 103, h o2 is the refrigerant enthalpy at the outlet of the second evaporator 104, h i2 is the enthalpy of the refrigerant at the inlet of the second evaporator 104;

[0026] Input power W t :

[0027] W t =W c +W1+W2+W3

[0028] Among them, W c is the power of the compressor 101, W1 is the power of the first semiconductor refrigeration element 120, W2 is the power of the second semiconductor refrigeration element 121, and W3 is the power of the third semiconductor refrigeration element 122;

[0029] Refrigeration performance η:

[0030]

[0031] Step c, executing an inner loop iteration process: applying random disturbance to the current opening of the first electronic expansion valve (106) to generate a new solution S', and calculating the corresponding refrigeration coefficient increment Δη of the refrigeration device;

[0032] Step d: Determine whether to accept the new solution S' according to the simulated annealing criterion: If Δη>0 or the Metropolis acceptance criterion based on the current algorithm temperature T is met, that is, the inferior solution is accepted with probability P=exp(Δη / T), then S' is accepted as the current solution;

[0033] Step e: After executing one inner loop iteration, a cooling operation is performed on the current algorithm temperature according to the cooling coefficient α, that is, T = T * α, and the temperature is updated; after executing L inner loop iterations, until the current algorithm temperature T is lower than the set termination temperature Tmin, the process is terminated, and the optimal intermediate air supply pressure P2 of the compressor and the corresponding refrigeration performance η of the refrigeration device obtained when the optimization process terminates are output.

[0034] Compared with the prior art, the present invention has the following advantages:

[0035] 1. The first evaporator 103 and the second evaporator 104 outlet flow path in turn through the first air cooling head 112, the second air cooling head 113 and the third air cooling head 114 which are in close contact with the hot end of the first semiconductor refrigeration element 120, the second semiconductor refrigeration element 121 and the third semiconductor refrigeration element 122 respectively, and the heat released by the semiconductor refrigeration element during operation is used to heat the refrigerant in the outlet flow path, so that the refrigerant reaches a superheated state before entering the compressor 101, thereby effectively improving the COP of the refrigeration system and optimizing the energy utilization efficiency.

[0036] 2. The double-evaporator vapor compression refrigeration system is cleverly coupled with multiple semiconductor refrigeration elements, the first evaporator 103 is applied to the heat dissipation of cabin electronic elements, the first temperature zone 123 is used to provide a low-temperature working environment for infrared detectors, the second temperature zone 124 is used to dissipate heat for laser weapons, and the third temperature zone 125 is used to dissipate heat for communication equipment, and the components of the refrigeration device work cooperatively to respond to the cold quantity demand of multiple temperature zones.

[0037] 3. The control element receives digital signals from multiple sensors and transmits them to the central processing unit, and the central processing unit performs calculation and logical judgment processing based on a preset temperature control algorithm and sends control instructions to the control element to drive the execution components to adjust.

[0038] 4. The central processing unit uses the simulated annealing method to perform global optimization search on the intermediate pressure of the double-evaporator vapor compression refrigeration system, finds the optimal intermediate pressure of the actual compressor to improve the overall performance of the refrigeration device and the utilization efficiency of energy. BRIEF DESCRIPTION OF DRAWINGS

[0039] Figure 1 It is a structure schematic view of the airborne multi-temperature zone refrigeration device of the embodiment of the present application.

[0040] Figure 2 It is a feedback control schematic view of the control element of the embodiment of the present application.

[0041] Figure 3 It is a logic diagram of the simulated annealing method of the airborne multi-temperature zone refrigeration device of the embodiment of the present application.

[0042] In the drawing: 101 - compressor; 102 - condenser; 103 - first evaporator; 104 - second evaporator; 105 - gas-liquid separator; 106 - first electronic expansion valve; 107 - second electronic expansion valve; 108 - third electronic expansion valve; 109 - first mass flow meter; 110 - second mass flow meter; 111 - pressure regulating valve; 112 - first gas cooling head; 113 - second gas cooling head; 114 - third gas cooling head; 115 - water pump; 116 - expansion water tank; 117 - first water cooling head; 118 - second water cooling head; 119 - third water cooling head; 120 - first semiconductor refrigeration element; 121 - second semiconductor refrigeration element; 122 - third semiconductor refrigeration element; 123 - first temperature zone; 124 - second temperature zone; 125 - third temperature zone; 126 - first pressure sensor; 127 - second pressure sensor; 128 - third pressure sensor; 129 - fourth pressure sensor; 130 - fifth pressure sensor; 131 - sixth pressure sensor; 132 - first temperature sensor; 133 - second temperature sensor; 134 - third temperature sensor; 135 - fourth temperature sensor; 136 - fifth temperature sensor; 137 - sixth temperature sensor; 138 - seventh temperature sensor; 139 - eighth temperature sensor. DETAILED DESCRIPTION

[0043] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the related drawings will be described in further detail below.

[0044] The embodiment of the present invention proposes an onboard multi-temperature zone refrigeration device coupled with a refrigerant loop, and uses thermal conductive gel to closely attach the hot ends of the first semiconductor refrigeration element 120, the second semiconductor refrigeration element 121 and the third semiconductor refrigeration element 122 to the first air cooling head 112, the second air cooling head 113 and the third air cooling head 114 respectively, so that the dual-evaporator vapor compression refrigeration system is better coupled with the semiconductor components; the refrigerant circulation loop is used to further dissipate the heat from the hot ends of the semiconductor components; the first evaporator 103 is designed to provide effective heat dissipation for the electronic components in the cabin, ensuring that the electronic components work stably under high-density heat loads; the first temperature zone 123 is used to provide a low-temperature working environment for the infrared detector, thereby improving its detection accuracy and response speed; the second temperature zone 124 is specifically used to dissipate heat for laser weapons to ensure their performance; the third temperature zone 125 is responsible for the heat dissipation of communication equipment, ensuring that the communication equipment maintains the best working condition and transmission quality during long-term high-load operation; the various components of the refrigeration device work closely together dynamically and precisely Accurately respond to the cooling demand of each temperature zone to achieve overall thermal balance and performance optimization; the outlet flow paths of the first evaporator 103 and the second evaporator 104 pass through the first air-cooled head 112, the second air-cooled head 113, and the third air-cooled head 114, which are respectively in close contact with the hot ends of the first semiconductor refrigeration element 120, the second semiconductor refrigeration element 121, and the third semiconductor refrigeration element 122, and use the heat released by the semiconductor refrigeration elements when they are working to heat the refrigerant in the outlet flow path, so that the refrigerant reaches a superheated state before entering the compressor 101, thereby effectively improving the COP of the refrigeration system and optimizing energy utilization efficiency; the control element will receive digital signals from multiple sensors and transmit them to the central processing unit, and the central processing unit will issue control instructions to the control element to drive the system execution components to make adjustments; the central processing unit uses the simulated annealing method to perform a global optimization search on the intermediate pressure of the dual-evaporator vapor compression refrigeration system to find the optimal intermediate air supply pressure P2 of the actual compressor to improve the overall performance of the refrigeration device and the energy utilization efficiency.

[0045] See also Figure 1 The embodiment of the present invention provides an onboard multi-temperature zone refrigeration device, comprising: a dual-evaporator vapor compression refrigeration system, a refrigerant circulation loop, a semiconductor component, a multi-temperature zone box, a control element, and a central processing unit.

[0046] Specifically, in one possible implementation, the dual-evaporator vapor compression refrigeration system of the embodiment of the present application comprises a compressor 101, a condenser 102, a first evaporator 103, a second evaporator 104, a gas-liquid separator 105, a first electronic expansion valve 106, a second electronic expansion valve 107, a third electronic expansion valve 108, a first mass flow meter 109, a second mass flow meter 110, and a pressure regulating valve 111. The compressor 101 is connected to the condenser 102, the condenser 102 is connected to the first electronic expansion valve 106, the first electronic expansion valve 106 is connected to the gas-liquid separator 105, the first outlet of the gas-liquid separator 105 is connected to the compressor 101, the second outlet of the gas-liquid separator 105 is connected to the second electronic expansion valve 107 and the third electronic expansion valve 108, the outlet of the second electronic expansion valve 107 is connected to the first mass flow meter 109, the outlet of the first mass flow meter 109 is connected to the first evaporator 103, the outlet of the first evaporator 103 is connected to the pressure regulating valve 111, the outlet of the third electronic expansion valve 108 is connected to the second mass flow meter 110, the outlet of the second mass flow meter 110 is connected to the second evaporator 104, the outlet of the second evaporator 104 is connected to the first gas cooling head 112, the second gas cooling head 113, and the third gas cooling head 114, and the inlet of the compressor 101 is connected to the outlet of the third gas cooling head 114, thereby forming a complete dual-evaporator parallel vapor compression refrigeration system.

[0047] The first evaporator 103 of the embodiment of the present application is a tube-fin heat exchanger, and the second evaporator 104 is a plate heat exchanger, which is used to cool the coolant.

[0048] In one possible implementation, the coolant circulation loop of the embodiment of the present application comprises a water pump 115, an expansion tank 116, a first water cooling head 117, a second water cooling head 118, and a third water cooling head 119. The outlet of the water pump 115 is connected to the inlet of the expansion tank 116, the outlet of the expansion tank 116 is connected to the inlet of the second evaporator 104, the outlet of the second evaporator 104 is connected to the first water cooling head 117, the second water cooling head 118, and the third water cooling head 119, the surfaces of the first water cooling head 117, the second water cooling head 118, and the third water cooling head 119 are tightly attached to the surfaces of the first gas cooling head 112, the second gas cooling head 113, and the third gas cooling head 114, respectively, and the outlet of the third water cooling head 119 is connected to the inlet of the water pump 115.

[0049] Specifically, in the embodiment, the coolant used in the coolant circulation loop is one of ethylene glycol solution, propylene glycol solution, calcium chloride brine, and other cooling media.

[0050] In a possible implementation, the semiconductor assembly of the embodiment of the present application comprises a first semiconductor refrigeration element 120, a second semiconductor refrigeration element 121 and a third semiconductor refrigeration element 122; the hot ends of the first semiconductor refrigeration element 120, the second semiconductor refrigeration element 121 and the third semiconductor refrigeration element 122 are in close contact with the first gas cold head 112, the second gas cold head 113 and the third gas cold head 114 respectively; the cold end heat sinks of the first semiconductor refrigeration element 120, the second semiconductor refrigeration element 121 and the third semiconductor refrigeration element 122 are located directly above the first temperature zone 123, the second temperature zone 124 and the third temperature zone 125 respectively.

[0051] The first pressure sensor 126 of the embodiment of the present application is arranged at the outlet end of the compressor 101; the second pressure sensor 127 is arranged at the first outlet end of the gas-liquid separator 105; the third pressure sensor 128 and the first temperature sensor 132 are arranged at the inlet end of the first evaporator 103 in sequence; the fourth pressure sensor 129 and the second temperature sensor 133 are arranged at the outlet end of the first evaporator 103 in sequence; the fifth pressure sensor 130 and the third temperature sensor 134 are arranged at the inlet end of the refrigerant side of the second evaporator 104 in sequence; the sixth pressure sensor 131 and the fourth temperature sensor 135 are arranged at the outlet end of the refrigerant side of the second evaporator 104 in sequence; the fifth temperature sensor 136 is arranged at the outlet end of the secondary refrigerant side of the second evaporator 104; the sixth temperature sensor 137, the seventh temperature sensor 138 and the eighth temperature sensor 139 are located below the first temperature zone 123, the second temperature zone 124 and the third temperature zone 125 respectively.

[0052] Specifically, in the present embodiment, the first semiconductor refrigeration element 120 is a multi-stage semiconductor refrigeration sheet, and the second semiconductor refrigeration element 121 and the third semiconductor refrigeration element 122 are single-stage semiconductor refrigeration sheets or double-stage semiconductor refrigeration sheets to meet the cooling capacity requirements of different temperature zones.

[0053] Specifically, in the present embodiment, the cold end heat sinks of the first semiconductor refrigeration element 120, the second semiconductor refrigeration element 121 and the third semiconductor refrigeration element 122 comprise flexible heat-conductive materials, heat-conductive pipes and metal fins; the heat-conductive pipes are connected to the cold ends of the semiconductor refrigeration sheets through the flexible heat-conductive materials; and the metal fins are arranged outside the heat-conductive pipes.

[0054] In a possible implementation, the multi-temperature zone box of the embodiment of the present application comprises a first temperature zone 123, a second temperature zone 124 and a third temperature zone 125.

[0055] The first evaporator 103 of the embodiment of the present application is designed to provide effective heat dissipation for electronic components in the cabin, and ensure stable operation of the electronic components under high-density heat load; the second evaporator 104 is used to dissipate heat from the hot end of the first semiconductor refrigeration element 120, the second semiconductor refrigeration element 121 and the third semiconductor refrigeration element 122; the first temperature zone 123 is used to provide a low-temperature working environment for the infrared detector, thereby improving the detection accuracy and response speed thereof; the second temperature zone 124 is specially used to dissipate heat from the laser weapon, and guarantee the performance of the laser weapon; and the third temperature zone 125 is responsible for dissipating heat from the communication equipment, and ensures that the communication equipment maintains the best working state and transmission quality during long-time high-load operation.

[0056] Please refer to Figure 2 The first electronic expansion valve 106, the second electronic expansion valve 107, the third electronic expansion valve 108, the pressure regulating valve 111, the water pump 115, the first semiconductor refrigeration element 120, the second semiconductor refrigeration element 121, the third semiconductor refrigeration element 122, the first pressure sensor 126, the second pressure sensor 127, the third pressure sensor 128, the fourth pressure sensor 129, the fifth pressure sensor 130, the sixth pressure sensor 131, the first temperature sensor 132, the second temperature sensor 133, the third temperature sensor 134, the fourth temperature sensor 135, the fifth temperature sensor 136, the sixth temperature sensor 137, the seventh temperature sensor 138 and the eighth temperature sensor 139 in the embodiment of the present application are connected with the control element; the control element receives signals of the first pressure sensor 126, the second pressure sensor 127, the third pressure sensor 128, the fourth pressure sensor 129, the fifth pressure sensor 130, the sixth pressure sensor 131, the first temperature sensor 132, the second temperature sensor 133, the third temperature sensor 134, the fourth temperature sensor 135, the fifth temperature sensor 136, the sixth temperature sensor 137, the seventh temperature sensor 138 and the eighth temperature sensor 139, and then transmits the signals to the central processing unit, and the central processing unit sends control instructions to the control element to adjust the frequency of the compressor 101, adjust the opening of the first electronic expansion valve 106, the second electronic expansion valve 107, the third electronic expansion valve 108 and the pressure regulating valve 111, control the start and stop of the water pump 115, and adjust the current of the first semiconductor refrigeration element 120, the second semiconductor refrigeration element 121 and the third semiconductor refrigeration element 122.

[0057] Please refer to Figure 3 The simulation annealing method of the airborne multi-temperature-zone refrigeration device in the embodiment of the present application specifically includes:

[0058] Step 1: Detecting the condensing pressure P1 by the first pressure sensor 126, the intermediate supercharging pressure P2 by the second pressure sensor 127, the first evaporator 103 inlet pressure P3 by the third pressure sensor 128, the first evaporator 103 outlet pressure P4 by the fourth pressure sensor 129, the second evaporator 104 refrigerant side inlet pressure P5 by the fifth pressure sensor 130, the second evaporator 104 refrigerant side outlet pressure P6 by the sixth pressure sensor 131, the first evaporator 103 inlet temperature T1 by the first temperature sensor 132, the first evaporator 103 outlet temperature T2 by the second temperature sensor 133, the second evaporator 104 refrigerant side inlet temperature T3 by the third temperature sensor 134, the second evaporator 104 refrigerant side outlet temperature T4 by the fourth temperature sensor 135, the second evaporator 104 secondary refrigerant side outlet temperature T5 by the fifth temperature sensor 136, the first temperature zone 123 temperature T6 by the sixth temperature sensor 137, the second temperature zone 124 temperature T7 by the seventh temperature sensor 138, and the third temperature zone 125 temperature T8 by the eighth temperature sensor 139. The set values of the rated temperatures of the first temperature zone 123, the second temperature zone 124, and the third temperature zone 125 are Ts1, Ts2, and Ts3, respectively. The rated temperature of the second evaporator 104 secondary refrigerant side outlet is Tr2. The first evaporator 103 outlet superheat is Tsh1, and the second evaporator 104 refrigerant side outlet superheat is Tsh2. The initial opening degrees of the first electronic expansion valve 106, the second electronic expansion valve 107, and the third electronic expansion valve 108 are 50% of the full opening degree.

[0059] Step 2: The control element controls the second electronic expansion valve 107 and the opening degree of the third electronic expansion valve 108 to meet the conditions of Tsh1 = 8℃ and Tsh2 = 8℃. The control element adjusts the input power of the first semiconductor refrigeration element 120, the second semiconductor refrigeration element 121, and the third semiconductor refrigeration element 122 according to the set rated temperatures of the first temperature zone 123, the second temperature zone 124, and the third temperature zone 125 to meet the conditions of T1 = Ts1, T2 = Ts2, and T3 = Ts3. The control element controls the frequency of the compressor 101 to meet the condition of T2 = Tr2.

[0060] Step 3: The process of real-time optimization and control of the refrigeration device using the simulated annealing method is as follows:

[0061] Step a, initialize the initial algorithm temperature T0, the termination temperature Tmin, the cooling coefficient a and the inner loop iteration number L, generate the initial solution S; wherein S is the opening degree of the first electronic expansion valve 106; set the operation constraints of the refrigeration device, including the upper limit of the evaporation temperature of the first evaporator 103 Te1_high, the lower limit of the evaporation temperature of the first evaporator 103 Te1_low, the upper limit of the evaporation temperature of the second evaporator 104 Te2_high, the lower limit of the evaporation temperature of the second evaporator 104 Te2_low, the upper limit of the discharge pressure of the compressor 101 Pout_high;

[0062] Step b, when the refrigeration device is stably operated, that is, the superheat degree T sh1 and the superheat degree T sh2 of the second evaporator 104 outlet are 8℃, the temperatures of the first temperature zone 123, the second temperature zone 124 and the third temperature zone 125 are Ts1, Ts2 and Ts3 respectively, judge whether the parameters meet the constraints Te1_low≤T1≤Te1_high, Te1_low≤T2≤Te1_high, Te2_low≤T3≤Te2_high, Te2_low≤T4≤Te2_high and P1≤Pout_high according to the constraints, if all the parameters meet the constraints, S is regarded as a feasible solution, and the refrigeration performance η of the refrigeration device is calculated, and the specific calculation formula is as follows:

[0063] The total refrigeration capacity of the evaporator Q t :

[0064] Q t = m e1 *(h o1 -h i1 )+m e2 *(h o2 -h i2 )

[0065] Wherein, m e1 is the refrigerant mass flow entering the first evaporator 103, m e2 is the refrigerant mass flow entering the second evaporator 104, h o1 is the outlet refrigerant enthalpy of the first evaporator 103, h i1 is the inlet refrigerant enthalpy of the first evaporator 103, h o2 is the outlet refrigerant enthalpy of the second evaporator 104, and h i2 is the inlet refrigerant enthalpy of the second evaporator 104;

[0066] Input power W t :

[0067] W t =W c +W1+W2+W3

[0068] wherein, W c W is the power of the compressor 101, W1 is the power of the first semiconductor refrigeration element 120, W2 is the power of the second semiconductor refrigeration element 121, and W3 is the power of the third semiconductor refrigeration element 122;

[0069] Refrigeration performance η:

[0070]

[0071] Step c, performing an inner loop iteration process: applying a random disturbance to the current first electronic expansion valve 106 opening degree to generate a new solution S', and calculating the corresponding refrigeration coefficient increment Δη of the refrigeration device;

[0072] Step d, judging whether to accept the new solution S' according to the simulated annealing criterion: if Δη>0 is satisfied or the Metropolis acceptance criterion based on the current algorithm temperature T (accepting a worse solution with a probability P = exp(Δη / T)) is satisfied, then accepting S' as the current solution;

[0073] Step e, after performing one inner loop iteration, performing a cooling operation (T = T*α) on the current algorithm temperature according to the cooling coefficient α, and updating the temperature; after performing L inner loop iterations, until the current algorithm temperature T is lower than the set termination temperature Tmin, the process is terminated, and the obtained optimal intermediate supercharging pressure P2 of the compressor and the corresponding refrigeration performance η of the refrigeration device are output.

[0074] The above only describes the preferred embodiments of the present application, and does not limit the technical solutions of the present application. Those skilled in the art should understand that without departing from the spirit and principles of the present application, the technical solutions can also be modified and replaced in several ways, and these modifications and replacements also belong to the protection scope covered by the claims.

Claims

1. An onboard multi-temperature zone refrigeration device coupled with a refrigerant circuit, characterized by: It includes a dual-evaporator vapor compression refrigeration system, a refrigerant circulation loop, semiconductor components, a multi-temperature zone box, control components, and a central processing unit; The dual-evaporator vapor compression refrigeration system comprises a compressor (101), a condenser (102), a first evaporator (103), a second evaporator (104), a gas-liquid separator (105), a first electronic expansion valve (106), a second electronic expansion valve (107), a third electronic expansion valve (108), a first mass flow meter (109), a second mass flow meter (110) and a pressure regulating valve (111); the outlet of the compressor (101) is connected to the inlet of the condenser (102), the outlet of the condenser (102) is connected to the inlet of the gas-liquid separator (105) through the first electronic expansion valve (106), the first outlet of the gas-liquid separator (105) is connected to the gas supply port of the compressor (101), and the gas-liquid separator (105) is connected to the gas supply port of the compressor (101). The second outlet (105) is divided into two paths, one path is connected to the inlet of the first evaporator (103) through the second electronic expansion valve (107) and the first mass flow meter (109), and the outlet of the first evaporator (103) is connected to the pressure regulating valve (111); the other path is connected to the refrigerant side inlet of the second evaporator (104) through the third electronic expansion valve (108) and the second mass flow meter (110), and the refrigerant side outlet of the second evaporator (104) is connected to the outlet of the pressure regulating valve (111), and then passes through the first air cooling head (112), the second air cooling head (113), and the third air cooling head (114) in sequence, and then is connected to the inlet of the compressor (101); thus forming a complete dual-evaporator parallel vapor compression refrigeration system; The coolant circulation loop comprises a water pump (115), an expansion water tank (116), a first water cooling head (117), a second water cooling head (118) and a third water cooling head (119); the outlet of the water pump (115) is connected to the inlet of the expansion water tank (116), the outlet of the expansion water tank (116) is connected to the coolant side inlet of the second evaporator (104), the coolant side outlet of the second evaporator (104) is connected to the first water cooling head (117), the second water cooling head (118) and the third water cooling head (119) in sequence, the surfaces of the first water cooling head (117), the second water cooling head (118) and the third water cooling head (119) are respectively in close contact with the surfaces of the first air cooling head (112), the second air cooling head (113) and the third air cooling head (114), and the outlet of the third water cooling head (119) is connected to the inlet of the water pump (115); The semiconductor assembly comprises a first semiconductor refrigeration element (120), a second semiconductor refrigeration element (121) and a third semiconductor refrigeration element (122); the hot ends of the first semiconductor refrigeration element (120), the second semiconductor refrigeration element (121) and the third semiconductor refrigeration element (122) are respectively in close contact with the first air cooling head (112), the second air cooling head (113) and the third air cooling head (114); the cold end radiators of the first semiconductor refrigeration element (120), the second semiconductor refrigeration element (121) and the third semiconductor refrigeration element (122) are respectively located directly above the first temperature zone (123), the second temperature zone (124) and the third temperature zone (125); The multi-temperature zone box includes a first temperature zone (123), a second temperature zone (124) and a third temperature zone (125); The control element receives a first pressure sensor (126) located at the air outlet of the compressor (101), a second pressure sensor (127) located at the first outlet of the gas-liquid separator (105), a third pressure sensor (128) and a first temperature sensor (132) located at the inlet of the first evaporator (103), a fourth pressure sensor (129) and a second temperature sensor (133) located at the outlet of the first evaporator (103), a fifth pressure sensor (130) and a third temperature sensor (134) located at the refrigerant side inlet of the second evaporator (104), a sixth pressure sensor (131) and a fourth temperature sensor (135) located at the refrigerant side outlet of the second evaporator (104), and a fourth pressure sensor (136) located at the refrigerant side outlet of the second evaporator (104). Signals from the fifth temperature sensor (136), the sixth temperature sensor (137), the seventh temperature sensor (138) and the eighth temperature sensor (139) located below the first temperature zone (123), the second temperature zone (124) and the third temperature zone (125) are transmitted to the central processing unit. The central processing unit sends control instructions to the control element to adjust the frequency of the compressor (101), adjust the opening of the first electronic expansion valve (106), the second electronic expansion valve (107), the third electronic expansion valve (108) and the pressure regulating valve (111), control the start and stop of the water pump (115), and adjust the current of the first semiconductor refrigeration element (120), the second semiconductor refrigeration element (121) and the third semiconductor refrigeration element (122).

2. The onboard multi-temperature zone refrigeration device coupled with a secondary refrigerant circuit according to claim 1, characterized in that: In a dual-evaporator vapor compression refrigeration system, the refrigerant mixed at the outlet flow paths of the first evaporator (103) and the second evaporator (104) passes through the first air cooling head (112), the second air cooling head (113), and the third air cooling head (114) in sequence, and the refrigerant is fully superheated before entering the compressor (101).

3. The onboard multi-temperature zone refrigeration device coupled with a secondary refrigerant circuit according to claim 1, characterized in that: The first evaporator (103) is a tube-fin heat exchanger; the second evaporator (104) is a plate heat exchanger, which is used to cool the refrigerant.

4. The onboard multi-temperature zone refrigeration device coupled with a secondary refrigerant circuit according to claim 1, characterized in that: The refrigerant used in the refrigerant circulation loop is one of ethylene glycol solution, propylene glycol solution and calcium chloride brine.

5. The onboard multi-temperature zone refrigeration device coupled with a secondary refrigerant circuit according to claim 1, characterized in that: The first semiconductor refrigeration element (120) is a multi-stage semiconductor refrigeration plate, the second semiconductor refrigeration element (121) is a single-stage semiconductor refrigeration plate, and the third semiconductor refrigeration element (122) is a double-stage semiconductor refrigeration plate.

6. The onboard multi-temperature zone refrigeration device coupled with a secondary refrigerant circuit according to claim 1, characterized in that: The cold end heat sinks of the first semiconductor refrigeration element (120), the second semiconductor refrigeration element (121) and the third semiconductor refrigeration element (122) comprise flexible heat-conducting material, heat-conducting pipes and metal fins; the heat-conducting pipes are connected to the cold ends of the semiconductor refrigeration elements via the flexible heat-conducting material; and the metal fins are arranged outside the heat-conducting pipes.

7. The onboard multi-temperature zone refrigeration device coupled with a secondary refrigerant circuit according to claim 1, characterized in that: The first evaporator (103) is used to dissipate heat for electronic components inside the cabin; the second evaporator (104) is used to dissipate heat for the hot ends of the first semiconductor refrigeration element (120), the second semiconductor refrigeration element (121), and the third semiconductor refrigeration element (122); the first temperature zone (123) is used to provide a low-temperature working environment for the infrared detector; the second temperature zone (124) is used to dissipate heat for laser weapons; and the third temperature zone (125) is used to dissipate heat for communication equipment.

8. The simulated annealing method for an onboard multi-temperature zone refrigeration device coupled with a brine circuit according to any one of claims 1 to 7, characterized in that: The following steps are involved: Step 1: Detect the condensing pressure P1 through the first pressure sensor (126), detect the intermediate air supply pressure P2 through the second pressure sensor (127), and detect the inlet pressure P of the first evaporator (103) through the third pressure sensor (128). 3， The fourth pressure sensor (129) detects the outlet pressure P of the first evaporator (103) 4， The fifth pressure sensor (130) detects the refrigerant side inlet pressure P of the second evaporator (104). 5， The sixth pressure sensor (131) detects the refrigerant outlet pressure P of the second evaporator (104). 6， The first temperature sensor (132) detects the inlet temperature T of the first evaporator (103) 1， The second temperature sensor (133) detects the outlet temperature T of the first evaporator (103) 2， The third temperature sensor (134) detects the refrigerant side inlet temperature T of the second evaporator (104). 3， The fourth temperature sensor (135) detects the refrigerant outlet temperature T of the second evaporator (104). 4， The fifth temperature sensor (136) detects the temperature T of the refrigerant outlet of the second evaporator (104). 5， The sixth temperature sensor (137) detects the temperature T6 of the first temperature zone (123), the seventh temperature sensor (138) detects the temperature T7 of the second temperature zone (124), and the eighth temperature sensor (139) detects the temperature T8 of the third temperature zone (125). The rated temperatures of the first temperature zone (123), the first temperature zone (124), and the third temperature zone (125) are set to Ts1, Ts2, and Ts3, respectively. s 3. The rated temperature of the refrigerant outlet of the second evaporator (104) is Tr2, and the superheat degree of the outlet of the first evaporator (103) is Ts. h 1. The superheat degree at the outlet of the refrigerant side of the second evaporator (104) is Ts h 2. The initial opening degrees of the first electronic expansion valve (106), the second electronic expansion valve (107), and the third electronic expansion valve (108) are 50% of the full opening degree; Step 2: The control element controls the opening of the second electronic expansion valve (107) and the third electronic expansion valve (108) to meet T sh 1=8℃ and T sh 2=8℃; the control element adjusts the input power of the first semiconductor refrigeration element (120), the second semiconductor refrigeration element (121) and the third semiconductor refrigeration element (122) respectively according to the set rated temperatures of the first temperature zone (123), the second temperature zone (124) and the third temperature zone (125) to meet the conditions of T1=Ts1, T2=Ts2 and T3=Ts3; the control element controls the frequency of the compressor (101) to meet the condition of T2=Tr2; Step 3: The process of real-time optimization and control of the refrigeration device using the simulated annealing method is as follows: Step a: Set the initial algorithm temperature T0 and the termination temperature Tm i n, the cooling coefficient α and the number of inner loop iterations L, generate the initial solution S; wherein S is the opening of the first electronic expansion valve (106); and setting the operating constraints of the refrigeration device, including the upper limit Te1_high of the evaporation temperature of the first evaporator (103), the lower limit Te1_low of the evaporation temperature of the first evaporator (103), the upper limit Te2_high of the evaporation temperature of the second evaporator (104), the lower limit Te2_low of the evaporation temperature of the second evaporator (104), and the upper limit P of the exhaust pressure of the compressor (101). o ut _ hi g h; Step b: When the refrigeration device is running stably, the superheat degree Ts at the outlet of the first evaporator (103) is h 1 and the second evaporator (104) outlet superheat Ts h 2 is 8°C, and the temperatures of the first temperature zone (123), the second temperature zone (124), and the third temperature zone (125) are Ts1, Ts2, and Ts3 respectively, judging whether the parameters satisfy the following conditions according to the refrigeration device operation constraint conditions set in step a: Te1_low≤T1≤Te1_high, Te1_low≤T2≤Te1_high, Te2_low≤T3≤Te2_high, Te2_low≤T4≤Te2_high, P1≤P o ut _ hi g h. If all parameters satisfy the constraints, S is considered a feasible solution, and the refrigeration performance η of the refrigeration unit is calculated. The specific calculation formula is as follows: Total cooling capacity of evaporator Q t : Q t =m e1 *(h o1 -h i1 )+m e2 *(h o2 -h i2 ) Among them, m e1 is the mass flow rate of refrigerant entering the first evaporator (103), m e2 is the mass flow rate of refrigerant entering the second evaporator (104), h o1 is the refrigerant enthalpy at the outlet of the first evaporator (103), h i1 is the enthalpy of the refrigerant at the inlet of the first evaporator (103), h o2 is the refrigerant enthalpy at the outlet of the second evaporator (104), h i2 is the enthalpy of the refrigerant at the inlet of the second evaporator (104); Input power W t : W t =W c +W1+W2+W3 Among them, W c is the power of the compressor (101), W1 is the power of the first semiconductor refrigeration element (120), W2 is the power of the second semiconductor refrigeration element (121), and W3 is the power of the third semiconductor refrigeration element (122); Refrigeration performance η: Step c, executing an inner loop iteration process: applying random disturbance to the current opening of the first electronic expansion valve (106) to generate a new solution S', and calculating the corresponding refrigeration coefficient increment Δη of the refrigeration device; Step d: Determine whether to accept the new solution S' according to the simulated annealing criterion: If Δη>0 or the Metropolis acceptance criterion based on the current algorithm temperature T is met, that is, the inferior solution is accepted with probability P=exp(Δη / T), then S' is accepted as the current solution; Step e: After executing one inner loop iteration, a cooling operation is performed on the current algorithm temperature according to the cooling coefficient α, that is, T = T * α, and the temperature is updated; after executing L inner loop iterations, until the current algorithm temperature T is lower than the set termination temperature Tmin, the process is terminated, and the optimal intermediate air supply pressure P2 of the compressor and the corresponding refrigeration performance η of the refrigeration device obtained when the optimization process terminates are output.

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