Display screen spacer measuring method and device and electronic equipment

Abstract

The invention discloses a display screen spacer measuring method and device and electronic equipment, and the method comprises the steps: obtaining the three-dimensional shape of a PS column, carrying out the inclination correction of the three-dimensional shape based on an inclination correction parameter through a preset inclination correction rule, and obtaining a target three-dimensional shape; determining a measurement range of each measuring head in the target three-dimensional shape based on mark point information of three mark points at preset positions of a display screen; acquiring a height matrix of the PS column in the measurement range, and identifying a to-be-measured PS column; obtaining a measurement value of the to-be-measured PS column through the measuring head; and performing multiple correction processing on the measurement value based on the correction parameter of the measurement head to obtain a target measurement result. According to the invention, through inclination correction of the three-dimensional morphology, the to-be-measured point position of the measuring head is rapidly and accurately found, the to-be-measured PS column is rapidly and accurately positioned in the three-dimensional morphology, the problem that the measurement results of different measuring heads of the same to-be-measured PS column are different is solved, and high-precision PS column measurement is realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of optical micro-nano structure measurement, and in particular to a display screen spacer measurement method and device and electronic equipment. BACKGROUND

[0002] In the production process of an LCD (Liquid Crystal Display) liquid crystal screen, a CF (Color Filter) screen and an Array screen are combined. The CF screen mainly controls RGB colors, and the Array screen is mainly used to control color switching to facilitate the control of which pixels of the CF screen can be lit. Because there are a plurality of fine photo spacer heights (PSHs) in both the CF screen and the Array screen, the PSHs slightly separate the two screens when the screens are combined, and the gap formed by the PSHs is filled with liquid crystal. The fine PSHs are distributed on the surfaces of the two screens. After the PSHs are manufactured, the heights of the PSHs must be measured. If the heights of the PSHs are too high or too low, the amount of liquid crystal poured must be adjusted.

[0003] If the heights of the PSHs are too high or too low due to the manufacturing process, inaccurate measurement will affect the amount of liquid crystal poured. If the heights of the PSHs are too low in the case of inaccurate measurement, the liquid crystal poured will be excessive, which will cause the two bonded screens to be raised and form a bulge. Conversely, if the heights of the PSHs are too high, there will be a gap without liquid crystal after the fixed amount of liquid crystal is poured, which will form an internal bubble. Such a situation will cause the expensive liquid crystal screen to be scrapped, resulting in an increase in cost.

[0004] Therefore, how to improve the measurement accuracy of the PSHs in the liquid crystal screen is a problem to be solved. SUMMARY

[0005] To solve the above problems, embodiments of the present application provide a display screen spacer measurement method and device, electronic equipment, computer readable storage medium, and computer program product.

[0006] In a first aspect, to solve the above technical problem, the present application provides a display screen spacer measurement method, comprising: After the three-dimensional topography of the PSHs of the display screen is constructed, an inclination correction parameter corresponding to the three-dimensional topography is obtained through a preset inclination correction rule; The three-dimensional topography is corrected based on the inclination correction parameter to obtain a target three-dimensional topography; Based on the landmark point information of the three landmark points of the preset position of the display screen, the measurement range of each measurement head in the target three-dimensional topography is determined. obtain a height matrix of the PS columns in the measurement range, and identify the to-be-measured PS column based on the height matrix; obtain a measurement value of the to-be-measured PS column measured by the measurement head; obtain a correction parameter of the measurement head, and perform multiple correction processing on the measurement value based on the correction parameter to obtain a target measurement result.

[0007] Beneficial effects are: In the technical scheme provided in the embodiments of the present application, after the three-dimensional topography of the PS columns of the display screen is constructed, the tilt correction parameter corresponding to the three-dimensional topography is obtained through the preset tilt correction rule; the three-dimensional topography is tilt-corrected based on the tilt correction parameter to obtain a target three-dimensional topography; the measurement range of each measurement head in the target three-dimensional topography is determined based on the landmark information of the three landmark points of the preset position of the display screen; the height matrix of the PS columns in the measurement range is obtained, and the to-be-measured PS column is identified based on the height matrix; the measurement value of the to-be-measured PS column measured by the measurement head is obtained; the correction parameter of the measurement head is obtained, and multiple correction processing is performed on the measurement value based on the correction parameter to obtain a target measurement result. In this way, the present application finds the point to be measured by each measurement head quickly and accurately through tilt correction of the three-dimensional topography, quickly and accurately locates the to-be-measured PS column to be measured in the three-dimensional topography field, and solves the difference between the measurement results of different measurement heads for the same to-be-measured PS column in four aspects, thereby realizing high-precision PS column measurement.

[0008] Further, the tilt correction parameter corresponding to the three-dimensional topography is obtained through the preset tilt correction rule, including: three reference points are selected on the three-dimensional topography through the preset tilt correction rule; reference coordinates of the reference points are obtained, and a slope value of the three-dimensional topography in a target axis direction is obtained based on the reference coordinates; the target axis direction includes an x-axis and a y-axis; the slope value is taken as the tilt correction parameter corresponding to the three-dimensional topography.

[0009] Further, the three-dimensional topography is tilt-corrected based on the tilt correction parameter to obtain a target three-dimensional topography, including: a height matrix of the three-dimensional topography is obtained; the height value in the height matrix is updated based on the slope value to obtain a target height matrix; the target three-dimensional topography corresponding to the target height matrix is obtained to complete the tilt correction of the three-dimensional topography.

[0010] Further, the three landmark point information of the three landmark points based on the preset position of the display screen is used to determine the measurement range of each measurement head in the target three-dimensional topography, including: template information of the template display screen is obtained, the template information including template landmark point coordinates and template PS column coordinates corresponding to the measurement head; The landmark point actual coordinates of the three landmark points included in the landmark point information are obtained; the preset position where the landmark points are located is the corner position of the display screen; The coordinate mapping relationship between the landmark point actual coordinates and the template landmark point coordinates is obtained; Based on the coordinate mapping relationship and the template PS column coordinates, actual PS column coordinates corresponding to each measurement head are obtained, and the measurement range of each measurement head in the target three-dimensional topography is determined based on the actual PS column coordinates.

[0011] Further, the height matrix of the PS column in the measurement range is obtained, and the to-be-measured PS column is identified based on the height matrix, including: The height matrix of the PS column in the measurement range is obtained, and the average value between other height values in the height matrix except the minimum height value and the maximum height value is obtained; Based on the average value, the height values in the height matrix that are less than the average value are replaced to obtain a processed height matrix; A two-dimensional grayscale matrix corresponding to the processed height matrix is obtained by mapping; The similarity between the two-dimensional grayscale matrix and the template grayscale value corresponding to the measurement range is obtained, and the PS column corresponding to the two-dimensional grayscale value with the minimum similarity is taken as the to-be-measured PS column.

[0012] Further, the to-be-measured PS column corresponds to at least one measurement head; the correction parameter of the measurement head is obtained, and the measurement value is subjected to multiple correction processing based on the correction parameter to obtain a target measurement result, including: A primary correction parameter of the measurement head for a preset standard step sample is obtained; When the to-be-measured PS column corresponds to multiple measurement heads, any measurement head in the multiple measurement heads is taken as a reference measurement head; The height difference relationship between the reference measurement head and other measurement heads except the reference measurement head is obtained, and a secondary correction parameter of each of the other measurement heads is obtained based on the height difference relationship; The measurement value is subjected to correction processing based on the primary correction parameter and the secondary correction parameter in sequence to obtain a target measurement result.

[0013] Further, the primary correction parameter of the measurement head for the preset standard step sample is obtained, including: obtain original measurement values of the measurement heads on the preset standard step sample; linearly fit the original measurement values of each measurement head to obtain a corresponding correction parameter, and use the correction parameter as a first correction parameter.

[0014] Further, the height difference relationship between the reference measurement head and other measurement heads except the reference measurement head is obtained, and a second correction parameter of each other measurement head is obtained based on the height difference relationship, including: select a plurality of reference PS columns in the three-dimensional topography; obtain standard values of the reference measurement head on the reference PS columns, and measurement values of other measurement heads except the reference measurement head on the reference PS columns; perform least square fitting on the standard values and the measurement values to obtain a height difference relationship between the reference measurement head and the other measurement heads; obtain a second correction parameter of each other measurement head based on the height difference relationship.

[0015] In a second aspect, the present application provides a display screen spacer measurement device, including: A correction parameter unit is configured to, after the three-dimensional topography of the PS columns of the display screen is obtained, obtain a tilt correction parameter corresponding to the three-dimensional topography through a preset tilt correction rule; A tilt correction unit is configured to perform tilt correction on the three-dimensional topography based on the tilt correction parameter to obtain a target three-dimensional topography; A range determination unit is configured to determine a measurement range of each measurement head in the target three-dimensional topography based on landmark information of three landmark points of a preset position of the display screen; A to-be-measured object unit is configured to obtain a height matrix of PS columns in the measurement range, and identify to-be-measured PS columns based on the height matrix; A measurement unit is configured to obtain measurement values of the to-be-measured PS columns measured by the measurement heads; A multiple correction unit is configured to obtain correction parameters of the measurement heads, perform multiple correction processing on the measurement values based on the correction parameters, and obtain target measurement results.

[0016] In a third aspect, the present application further provides an electronic device, including one or more processors, and a storage device configured to store one or more programs, when the one or more programs are executed by the one or more processors, the electronic device is caused to implement the display screen spacer measurement method as described above.

[0017] In a fourth aspect, the present application also provides a computer readable storage medium having computer readable instructions stored thereon, which, when executed by a processor of a computer, cause the computer to perform the method for measuring the display spacer as described above.

[0018] In a fifth aspect, the present application also provides a computer program product or computer program, which comprises computer instructions stored in a computer readable storage medium. A processor of a computer device reads the computer instructions from the computer readable storage medium, and the processor executes the computer instructions, so that the computer device performs the method for measuring the display spacer provided in various optional embodiments described above.

[0019] It should be understood that the general description above and the following detailed description are only exemplary and explanatory, and cannot limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0020] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and serve to explain the principles of the present application. It is readily apparent to one of ordinary skill in the art that the accompanying drawings are merely some embodiments of the present application, and other drawings can be obtained from the accompanying drawings without any creative effort. In the drawings: Figure 1 is a flow chart of a method for measuring a display spacer according to an exemplary embodiment of the present application; Figure 2 is a schematic diagram showing the effect of tilt correction of a three-dimensional profile according to an embodiment of the present application; Figure 3 is a block diagram of a measuring device for a display spacer according to an exemplary embodiment of the present application; Figure 4 is a structural schematic diagram of a computer system of an electronic device suitable for implementing embodiments of the present application. DETAILED DESCRIPTION

[0021] The exemplary embodiments will be described in detail herein with reference to the attached drawings. The following description is only exemplary and explanatory, and cannot limit the present application. The same reference numbers in different drawings represent the same or similar elements or steps.

[0022] The block diagrams shown in the drawings are merely functional entities, and do not necessarily have to correspond to physically independent entities. That is, the functional entities can be implemented in the form of software, or implemented in one or more hardware modules or integrated circuits, or implemented in different networks and / or processor devices and / or microcontroller devices.

[0023] The flowcharts shown in the drawings are merely exemplary illustrations, and do not necessarily include all contents and operations / steps, nor necessarily executed in the described order. For example, some operations / steps can be further decomposed, and some operations / steps can be combined or partially combined, so the actual execution order can be changed according to actual conditions.

[0024] In the present application, "multiple" refers to two or more. "And / or" describes the association relationship of associated objects, which means that there can be three relationships, for example, A and / or B can represent the three cases of A alone, A and B together, and B alone. The character " / " generally represents that the associated objects before and after are in an "or" relationship.

[0025] In the related art, after the three-dimensional morphology of the PS column is constructed, due to the installation precision and the position change of the sample on the stage, there is an inclination angle between the collection device and the sample surface, so that the constructed three-dimensional morphology has different degrees of inclination, which will cause a large difference in the measured height of the PS column when different reference surfaces are selected. In the actual measurement process, it is found that when different probes measure the column at the same point, the measured height values are different, and the height difference is large, which does not meet the requirement that the height difference of the same column measured by different probes is less than 18nm. In the actual industrial measurement equipment, since the radius of the measured column is mostly between 2µm to 10µm, and the measured column in the field of view will change dynamically under the action of the fast movement of the probe, which will bring problems to the fixed position measurement.

[0026] In order to solve the above problems, the embodiments of the present application provide a display screen spacer measurement method and device, electronic equipment and computer readable storage medium, which are mainly related to display screen spacer measurement technology in optical micro-nano structure measurement technology. The embodiments will be described in detail below.

[0027] First, please refer to Figure 1 , Figure 1is a flowchart of a display screen spacer measurement method shown in an example embodiment of the present application. The method can be specifically performed by a server, which can be an independent server or a cloud server providing basic cloud computing services such as cloud service, cloud database, cloud computing, cloud function, cloud storage, network service, cloud communication, middleware service, domain name service, security service, content delivery network (CDN), and big data and artificial intelligence platform, etc. without limitation.

[0028] As shown in Figure 1 In an example embodiment, the display screen spacer measurement method can include steps S101 to S106, which are described in detail as follows: After the three-dimensional topography of the PS column of the display screen is constructed, the tilt correction parameter corresponding to the three-dimensional topography is obtained through a preset tilt correction rule in step S101.

[0029] The three-dimensional topography is tilt-corrected based on the tilt correction parameter to obtain a target three-dimensional topography in step S102.

[0030] The measurement range of each measurement head in the target three-dimensional topography is determined based on the landmark point information of the three landmark points of the preset position of the display screen in step S103.

[0031] The height matrix of the PS column in the measurement range is obtained in step S104, and the to-be-measured PS column is identified based on the height matrix.

[0032] The measurement value of the to-be-measured PS column measured by the measurement head is obtained in step S105.

[0033] The correction parameter of the measurement head is obtained in step S106, and the measurement value is processed by multiple correction based on the correction parameter to obtain a target measurement result.

[0034] As can be seen from the above, in the method provided in the present embodiment, first, the tilt correction parameter corresponding to the three-dimensional topography is obtained through a preset tilt correction rule, and the three-dimensional topography is tilt-corrected based on the tilt correction parameter to obtain a target three-dimensional topography. This solves the problem that the measurement accuracy is affected due to the existence of different degrees of tilt in the constructed three-dimensional topography caused by the installation precision and the position change of the sample on the stage. Secondly, the measurement range of each measurement head in the target three-dimensional topography is determined by the 3 Mark point alignment method in the detection process of the to-be-measured PS column, and the to-be-measured PS column is accurately identified therefrom. Finally, the measurement value of the to-be-measured PS column is corrected by multiple correction, which further improves the accuracy of the measurement result and reduces the difference between the results of different measurement heads testing the same PS column.

[0035] Therefore, the present application finds the point to be measured by each measuring head quickly and accurately through the tilt correction of the three-dimensional topography, quickly and accurately locates the to-be-measured PS column in the three-dimensional topography field, and solves the difference between the measurement results of different measuring heads for the same to-be-measured PS column, thereby achieving high-precision PS column measurement.

[0036] In an example embodiment of the present application, the specific steps of obtaining the tilt correction parameter corresponding to the three-dimensional topography through the preset tilt correction rule can include: selecting three reference points that are not collinear in the three-dimensional topography through the preset tilt correction rule; obtaining the reference coordinates of the reference points, and obtaining the slope value of the three-dimensional topography in the target axis direction based on the reference coordinates; the target axis direction includes the x axis and the y axis; taking the slope value as the tilt correction parameter corresponding to the three-dimensional topography.

[0037] In another example embodiment, after obtaining the tilt correction parameter, the specific steps of performing tilt correction on the three-dimensional topography based on the tilt correction parameter to obtain the target three-dimensional topography can include: obtaining the height matrix of the three-dimensional topography; updating the height value in the height matrix based on the slope value to obtain a target height matrix; obtaining the corresponding target three-dimensional topography based on the target height matrix to complete the tilt correction of the three-dimensional topography.

[0038] In this embodiment, in order to solve the tilt problem of the constructed three-dimensional topography, the slope k in the x axis direction and the slope t in the y axis direction of the three-dimensional topography need to be obtained first, and three points Z1(x1, y1, z1), Z2(x2, y2, z2), and Z3(x3, y3, z3) that are not collinear need to be selected in the three-dimensional topography, and the calculation formula of k and t is: The height value of the height matrix is updated again by using the obtained k and t, and the updated height value is: wherein pixel_size is the actual distance represented by one pixel in the image field.

[0039] Please refer to Figure 2 , Figure 2 is an effect diagram of the tilt correction of the three-dimensional topography in an embodiment of the present application. As shown in the figure, the left side is before the tilt correction, and the right side is after the tilt correction.

[0040] In this way, by the above embodiment, the tilt correction parameter corresponding to the three-dimensional topography is obtained by the preset tilt correction rule, and the three-dimensional topography is corrected based on the tilt correction parameter, and the target three-dimensional topography is obtained. The problem that the measurement accuracy is affected due to the three-dimensional topography constructed by the installation precision and the position change of the sample on the stage is solved.

[0041] In an example embodiment of the present application, the specific steps of determining the measurement range formed by each measurement head at the measurement point in the target three-dimensional topography based on the mark point information of the three mark points of the preset position of the display screen can include: Obtaining the template information of the template display screen, the template information including the template mark point coordinates and the template PS column coordinates corresponding to the measurement head; The mark point information includes the actual coordinates of the three mark points; the preset position of the mark point is the corner position of the display screen; Obtaining the coordinate mapping relationship between the actual coordinates of the mark points and the template mark point coordinates; Based on the coordinate mapping relationship and the template PS column coordinates, the actual PS column coordinates corresponding to each measurement head are obtained, and the measurement range of each measurement head in the target three-dimensional topography is determined based on the actual PS column coordinates.

[0042] In this embodiment, the measurement range of each measurement head in the target three-dimensional topography is formed by the coordinates of the point to be measured by each measurement head.

[0043] In order to solve the problem of quickly finding the coordinates of the point to be measured by each measurement head for a large sample and achieving micron accuracy of the point coordinates, the template information of the template display screen is first obtained, the template information including the template mark point coordinates and the template PS column coordinates corresponding to the measurement head, and there is a coordinate conversion relationship between the template mark point coordinates and the template PS column coordinates.

[0044] When constructing the template information of the template display screen, there are four cross Marks at the four corners of the template display screen as template mark points, two measurement heads are used to shoot the Marks on both sides of the display screen at one end, and the machine coordinates of the center of the cross Mark are recorded, and then the measurement head continues to walk to shoot the machine coordinates of the center of the cross center of the other Mark. Since there are glass coordinates of the center of the cross Mark on the display screen, according to the mapping relationship between the machine coordinates and the glass coordinates of the center of the cross Mark, a conversion matrix M1 from glass coordinates to machine coordinates can be obtained, and according to this conversion matrix M1, the glass coordinates of the center of the PS column to be measured on the display screen can be converted into the machine coordinates of the measurement head.

[0045] Preferably, the conversion matrix Ml from the glass coordinates to the machine coordinates is an affine transformation, which is a method of two-dimensional coordinate transformation, and can be represented by a linear transformation (matrix multiplication) plus a translation transformation (vector addition), and has the form of: In two-dimensional space, an affine transformation can be represented by the following formula: x'= a * x + b * y + tx y'= c * x + d* y + ty where (x, y) is the original coordinate, (x', y') is the transformed coordinate, a, b, c, d, tx, ty are the transformation parameters.

[0046] According to the conversion matrix Ml, the glass coordinates of the PS column center to be measured on the display screen can be converted into the machine coordinates of the measuring head.

[0047] In the actual measurement process, the template information can be the machine coordinates of the Mark cross center of a display screen in the same batch of display screen products P1, P2, P3 and the machine coordinates of the PS column to be measured, which are respectively taken as the template mark point coordinates and the template PS column coordinates, and are denoted as {P i}, i is the number of measurement points.

[0048] When the robot places a new display screen on the stage, it is first clamped and pre-aligned by the alignment cylinders around the stage to ensure that the cross Mark is still within the 2.5 times lens field of view (2.5 times the field of view length is 2.0 mm, and the width is 1.5 mm), and then the measuring head moves to the template coordinate position for shooting. At this time, the center of the cross Mark is not in the center of the field of view. The algorithm finds the center of the cross Mark through the gray scale information of the cross Mark, records the center coordinates P 11 , P 22 , P 33 of the cross Mark at this time, and calculates the machine coordinates of the PS column center to be measured of the display screen newly sent by the robot through the mapping relationship M2 from P1, P2, P3 to P 11 , P 22 , P 33 , so as to obtain the measurement range of each measuring head in the target three-dimensional topography, denoted as { i}, .

[0049] Therefore, in the embodiments of the present application, the measurement range of each measurement head in the target three-dimensional topography is determined by the alignment of three Mark points. The alignment of three Mark points is better than that of two Mark points, which is verified by experiments. The experimental results are shown in Table 1.

[0050] Table 1 From the three sets of data in Table 1, the differences between the calculated machine coordinates after the alignment of two Mark points and the actual machine coordinates are -0.274 mm (274 µm), -0.324 mm (324 µm), and -0.071 mm (71 µm) in the x direction, and -0.021 mm (21 µm), -0.021 mm (21 µm), and -0.011 mm (11 µm) in the y direction. The differences between the calculated machine coordinates after the alignment of three Mark points and the actual machine coordinates are 0, 0, and 0 in the x direction, and 0, 0.01 mm (10 µm), and 0.01 mm (10 µm) in the y direction.

[0051] Therefore, in the embodiments of the present application, the measurement range of each measurement head in the target three-dimensional topography is determined by the alignment of three Mark points. The alignment of three Mark points is better than that of two Mark points, which is verified by experiments. The experimental results are shown in Table 1.

[0052] In an example embodiment of the present application, the height matrix of the PS column in the measurement range is obtained, and the specific steps of identifying the PS column to be measured based on the height matrix can include: Obtaining the height matrix of the PS column in the measurement range, and obtaining the average value between other height values in the height matrix except the minimum height value and the maximum height value; Replacing the height values less than the average value in the height matrix based on the average value to obtain a processed height matrix; Mapping to obtain the two-dimensional gray matrix corresponding to the processed height matrix; Obtaining the similarity between the two-dimensional gray matrix and the template gray value corresponding to the measurement range, and taking the PS column corresponding to the minimum similarity of the two-dimensional gray value as the PS column to be measured.

[0053] Due to the influence of the "bat wing effect" of the white light interference device in the actual production environment, the maximum and minimum values in the height matrix of the PS column three-dimensional topography constructed are relatively large, resulting in a large gray scale change when the three-dimensional height matrix is mapped to a gray two-dimensional matrix. Therefore, it is difficult to find the PS column to be measured in actual measurement.

[0054] In this embodiment, in order to improve the accuracy of positioning the PS column to be measured in the three-dimensional topography field, the mean value is calculated by sorting the height values of the height matrix and taking the middle part of the data, and the data lower than the mean value in the original height matrix is replaced by the mean value, so that the maximum value and the minimum value in the height matrix are used to map the height value to 0 to 255 gray value, so that the gray value of the two-dimensional gray matrix obtained by the gray value mapping formula is smaller, and the gray value mapping formula is wherein f is the gray value after height mapping, max_z is the maximum value in the height matrix, z is the value of the height matrix, and min_z is the minimum value of the height matrix.

[0055] Finally, the similarity between the two-dimensional gray matrix and the template gray value corresponding to the measurement range is obtained, and the PS column corresponding to the minimum similarity of the two-dimensional gray value is taken as the PS column to be measured.

[0056] Preferably, the similarity between the two-dimensional gray matrix and the template gray value corresponding to the measurement range is obtained by gray comparison, and the gray comparison is a commonly used image matching method in computer vision through template matching (Template Matching), and the basic principle is to compare a small image template with a larger target image to find the position of the template in the target image.

[0057] The core idea of template matching is to calculate the similarity of the gray values between the template and the target image region; common similarity measurement methods include normalized correlation coefficient (NCC), sum of squared differences (SSD), sum of absolute differences (SAD), etc. The normalized correlation coefficient is used in this application, and the value is closer to 1, and the matching degree is higher. The formula is: wherein , , T(x, y) is the template gray value of the template PS column at coordinates (x, y), and I(x, y) is the gray value of the two-dimensional gray matrix at coordinates (x, y).

[0058] In an example embodiment of the present application, the specific steps of obtaining the correction parameters of the measurement head, performing multiple correction processing on the measurement value based on the correction parameters, and obtaining the target measurement result can include: obtaining a one-time correction parameter of the measurement head for a preset standard step sample; when the PS column to be measured corresponds to multiple measurement heads, any measurement head in the multiple measurement heads is taken as a reference measurement head; obtaining a height difference relationship between the reference probe head and other probe heads except the reference probe head, and obtaining a secondary correction parameter of each of the other probe heads based on the height difference relationship; sequentially correcting the measurement values based on the primary correction parameter and the secondary correction parameter to obtain a target measurement result.

[0059] In the embodiment, the to-be-measured PS column corresponds to at least one measurement head. When the to-be-measured PS column corresponds to one measurement head, there is no difference in measurement results under different measurement heads, and therefore the measurement values only need to be corrected by the primary correction parameter. When the to-be-measured PS column corresponds to multiple measurement heads, the measurement values need to be sequentially corrected based on the primary correction parameter and the secondary correction parameter to obtain a target measurement result, and the secondary correction parameter is used to eliminate systematic deviation between different probe heads.

[0060] In another example embodiment, the specific steps of obtaining the primary correction parameter of the measurement head for the preset standard step sample can include: obtaining original measurement values obtained by the measurement head in height measurement of the preset standard step sample; linearly fitting the original measurement values of each measurement head to obtain a corresponding correction parameter, and taking the correction parameter as the primary correction parameter.

[0061] In the embodiment, two standard step samples that have completed calibration are selected as compensation references, and then different measurement heads are used to perform height measurement on the standard step samples to obtain corresponding original measurement values. Then the measurement results of each measurement head are linearly fitted to calculate corresponding primary polynomial correction parameters (i.e., a and b). The correction coefficients obtained by fitting are taken as the primary correction parameters for linear compensation of the measurement results. wherein, is a corrected result, is an original measurement result.

[0062] In another example embodiment, the specific steps of obtaining a height difference relationship between the reference probe head and other probe heads except the reference probe head, and obtaining a secondary correction parameter of each of the other probe heads based on the height difference relationship can include: selecting multiple reference PS columns in the three-dimensional topography; obtaining a standard value obtained by the reference probe head in height measurement of the reference PS column, and measurement values obtained by other probe heads except the reference probe head in height measurement of the reference PS column; performing least squares fitting on the standard value and the measurement values to obtain a height difference relationship between the reference probe head and the other probe heads; obtaining a secondary correction parameter of each of the other probe heads based on the height difference relationship.

[0063] In this embodiment, under the premise that the measurement values of the PS columns to be measured are corrected by the first correction parameters, the following compensation strategy is adopted to eliminate the systematic deviation of multiple measurement heads in the product measurement process and ensure that the measurement results remain consistent between different measurement heads: At least two PS columns are selected in the three-dimensional morphology of the display screen as the height reference for compensation calculation, and a measurement head is set as the reference head (Reference Head), and the measurement result thereof is taken as the standard value. The measurement data of other heads will be fitted and corrected relative to the reference. All measurement heads measure the height of the selected PS column points to form a height corresponding data pair between the reference head, fit the height difference relationship between the measurement heads by the least squares method, construct a polynomial model of one or more times, and solve the correction coefficient (such as a, b) of each non-reference head.

[0064] The calculation process of the preferred second correction parameters can be that n PS columns are measured, there are n data points: (x_i, y_i), i = 1, 2,..., n, and a linear model (for example, a straight line) is used to fit these data: .

[0065] The goal of the least squares method is to find the coefficients a and b such that the sum of the squares of the residuals (the difference between the predicted value and the true value) of all data points is minimized. The sum of the squares of the residuals (loss function) is: S = Σ (y i - (a + b*x i ))^2 (i from 1 to n). In order to minimize S, take the partial derivative of a0 and a1 respectively, and set the partial derivative to 0: .

[0066] Thus, a and b can be solved as the second correction parameters, and the calculation of the first correction parameters is the same.

[0067] In this way, in the embodiments provided by the present application, the problem of differences in measurement results of different measurement heads for the same PS column can be solved by the first correction parameters corresponding to the standard step and the second correction parameters between the measurement heads. For example, the original measurement results of two standard pieces tested by measurement head H1 are shown in Table 2.

[0068] Table 2: The known calibration values are 1.864 µm and 3.63 µm, respectively, and the correction coefficients obtained by fitting are a = 0.045265 and b = 0.981588. For example, Head1 is taken as the reference head, and Head2 is fitted to obtain the height pair shown in Table 3.

[0069] Table 3: The fitting coefficients are: a: 0.046941, b: 1.668013 If the Head2 measures a PS column as 1.7355 pm, the corrected height is a+b*1.7355=1.7495 pm, which reduces the difference between the results of different measurement heads testing the same PS column.

[0070] Thus, the application corrects the measurement value of the to-be-measured PS column through the above-mentioned embodiments in a multiple correction manner, further improves the accuracy of the measurement result, and reduces the difference between the results of different measurement heads testing the same PS column.

[0071] Figure 3 is a block diagram of a display screen spacer measurement device 300 according to an exemplary embodiment of the application. As shown in Figure 3 The device comprises: A correction parameter unit 301 is configured to obtain a tilt correction parameter corresponding to the three-dimensional topography of the display screen by a preset tilt correction rule after the three-dimensional topography of the PS column of the display screen is constructed. A tilt correction unit 302 is configured to perform tilt correction on the three-dimensional topography based on the tilt correction parameter to obtain a target three-dimensional topography. A range determination unit 303 is configured to determine a measurement range of each measurement head in the target three-dimensional topography based on the landmark information of three landmark points of the preset position of the display screen. A to-be-measured object unit 304 is configured to obtain a height matrix of the PS column in the measurement range, and identify a to-be-measured PS column based on the height matrix. A measurement unit 305 is configured to obtain a measurement value of the to-be-measured PS column measured by the measurement head. A multiple correction unit 306 is configured to obtain a correction parameter of the measurement head, perform multiple correction processing on the measurement value based on the correction parameter, and obtain a target measurement result.

[0072] The device applies the display screen spacer measurement method provided in the application, constructs the three-dimensional topography of the PS column of the display screen, and then the correction parameter unit 301 obtains the tilt correction parameter corresponding to the three-dimensional topography by the preset tilt correction rule; the tilt correction unit 302 performs tilt correction on the three-dimensional topography based on the tilt correction parameter to obtain a target three-dimensional topography; the range determination unit 303 determines the measurement range of each measurement head in the target three-dimensional topography based on the landmark point information of the three landmark points of the preset position of the display screen; the height matrix of the PS column in the measurement range is obtained by the to-be-measured object unit 304, and the to-be-measured PS column is identified based on the height matrix; the measurement unit 305 obtains the measurement value of the to-be-measured PS column measured by the measurement head; and the correction parameter of the measurement head is obtained by the multiple correction unit 306, and the measurement value is processed by multiple correction based on the correction parameter to obtain a target measurement result. In this way, the tilt correction of the three-dimensional topography, the quick and accurate finding of the point to be measured by each measurement head, the quick and accurate positioning of the to-be-measured PS column to be measured in the three-dimensional topography field, and the solving of the difference between the measurement results of different measurement heads for the same to-be-measured PS column are realized, and high-precision PS column measurement is realized.

[0073] In another exemplary embodiment, the correction parameter unit 301 is further configured to select three reference points that are not collinear from the three-dimensional topography by the preset tilt correction rule; obtain reference coordinates of the reference points, and obtain a slope value of the three-dimensional topography in a target axis direction based on the reference coordinates; the target axis direction includes an x-axis and a y-axis; and the slope value is taken as the tilt correction parameter corresponding to the three-dimensional topography.

[0074] In another exemplary embodiment, the tilt correction unit 302 is further configured to obtain a height matrix of the three-dimensional topography; update the height values in the height matrix based on the slope value to obtain a target height matrix; and obtain a corresponding target three-dimensional topography based on the target height matrix to complete the tilt correction of the three-dimensional topography.

[0075] In another exemplary embodiment, the range determination unit 303 is further configured to obtain template information of the template display screen, the template information including template landmark point coordinates and template PS column coordinates corresponding to the measurement head; obtain landmark point actual coordinates of the three landmark points included in the landmark point information; the preset position where the landmark points are located is an edge corner position of the display screen; obtain a coordinate mapping relationship between the landmark point actual coordinates and the template landmark point coordinates; obtain actual PS column coordinates corresponding to each measurement head based on the coordinate mapping relationship and the template PS column coordinates, and determine the measurement range of each measurement head in the target three-dimensional topography based on the actual PS column coordinates.

[0076] In another example embodiment, the to-be-measured object unit 304 is further configured to obtain a height matrix of the PS columns in the measurement range, and obtain a mean value between height values in the height matrix other than the minimum height value and the maximum height value; replace height values less than the mean value in the height matrix based on the mean value to obtain a processed height matrix; map a two-dimensional grayscale matrix corresponding to the processed height matrix; and obtain a similarity between the two-dimensional grayscale matrix and a template grayscale value corresponding to the measurement range, and take the PS column corresponding to the minimum similarity as the to-be-measured PS column.

[0077] In another example embodiment, the to-be-measured PS column corresponds to at least one measurement head; the multiple correction unit 306 is further configured to obtain a first correction parameter of the measurement head for a preset standard step sample; when the to-be-measured PS column corresponds to multiple measurement heads, take any one of the multiple measurement heads as a reference measurement head; obtain a height difference relationship between the reference measurement head and other measurement heads other than the reference measurement head, and obtain a second correction parameter of each other measurement head based on the height difference relationship; and sequentially correct the measurement values based on the first correction parameter and the second correction parameter to obtain a target measurement result.

[0078] In another example embodiment, the multiple correction unit 306 is further configured to obtain an original measurement value of the measurement head for height measurement of the preset standard step sample; perform linear fitting on the original measurement value of each measurement head to obtain a correction parameter, and take the correction parameter as the first correction parameter.

[0079] In another example embodiment, the multiple correction unit 306 is further configured to select multiple reference PS columns in the three-dimensional topography; obtain a standard value of the reference measurement head for height measurement of the reference PS column, and a measurement value of other measurement heads other than the reference measurement head for height measurement of the reference PS column; perform least squares fitting on the standard value and the measurement value to obtain a height difference relationship between the reference measurement head and the other measurement heads; and obtain a second correction parameter of each other measurement head based on the height difference relationship.

[0080] It should be noted that the display screen spacer measurement device provided in the above embodiments and the display screen spacer measurement method provided in the above embodiments belong to the same concept, and the specific manner in which each module and unit performs operations has been described in detail in the method embodiments, which will not be repeated here. The display screen spacer measurement device provided in the above embodiments can allocate the above functions to different functional modules as needed in actual application, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above, and this is not limited herein.

[0081] Embodiments of the present application also provide an electronic device, comprising: one or more processors; a storage device for storing one or more programs, which, when executed by the one or more processors, cause the electronic device to implement the method for measuring the display screen spacer provided in each of the above embodiments.

[0082] Figure 4 A structural diagram of a computer system of an electronic device suitable for implementing embodiments of the present application is shown. It should be noted that, Figure 4 The computer system 400 of the electronic device shown is only an example and should not impose any limitation on the functions and use range of embodiments of the present application.

[0083] As Figure 4 shown, the computer system 400 includes a central processing unit (CPU) 401, which can perform various appropriate actions and processes according to programs stored in a read-only memory (ROM) 402 or programs loaded from a storage portion 408 into a random access memory (RAM) 403, such as performing the methods in the above embodiments. In the RAM 403, various programs and data required for system operation are also stored. The CPU 401, the ROM 402, and the RAM 403 are connected to each other through a bus 404. An input / output (I / O) interface 405 is also connected to the bus 404.

[0084] The following components are connected to the I / O interface 405: an input portion 406 including a keyboard, a mouse, and the like; an output portion 407 including a display such as a cathode ray tube (CRT), a liquid crystal display (LCD), and the like, and a speaker, and the like; a storage portion 408 including a hard disk, and the like; and a communication portion 409 including a network interface card such as a LAN (Local Area Network) card, a modem, and the like. The communication portion 409 performs communication processing via a network such as the Internet. A drive 410 is also connected to the I / O interface 405 as necessary. A removable recording medium 411 such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, and the like is attached to the drive 410 as necessary, so that a computer program read therefrom is installed into the storage portion 408 as necessary.

[0085] In particular, the processes described above with reference to the flow charts can be implemented as a computer software program in accordance with embodiments of the present application. For example, embodiments of the present application include a computer program product comprising a computer program carried on a computer readable medium, the computer program comprising computer instructions for performing the methods illustrated by the flow charts. In such embodiments, the computer program can be downloaded and installed from a network via the communication section 409 and / or installed from the removable media 411. When the computer program is executed by the central processing unit (CPU) 401, various functions defined in the system of the present application are performed.

[0086] It should be noted that the computer readable medium shown in the embodiments of the present application can be a computer readable signal medium or a computer readable storage medium or any combination thereof. The computer readable storage medium may, for example, be an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus or device, or any combination thereof. More specific examples of the computer readable storage medium can include, but are not limited to, an electrical connection having one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a flash memory, an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof. In this application, a computer readable signal medium can include a data signal propagated in or on a baseband medium, or a propagated as a carrier wave, in which the computer readable computer program is embodied. Such propagated data signals can take a variety of forms including, but not limited to, electro-magnetic, optical, or any suitable combination thereof. The computer readable signal medium can also be any computer readable medium that is not a computer readable storage medium and that can communicate with or be accessed by a computer readable storage medium. The computer program contained in the computer readable medium can be transmitted using any suitable medium, including, but not limited to, wireless, wired, optical fiber, or any suitable combination thereof.

[0087] The flowcharts and block diagrams in the drawings illustrate the architecture, functionality, and operation of possible implementations of apparatuses, methods, and computer program products according to various embodiments of the present application. In this regard, each block in the flowcharts or block diagrams can represent a module, a segment, or a portion of code, which comprises one or more executable instructions for implementing the specified logical functions. It should also be noted that in some alternative implementations, the functions noted in the blocks can occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently or in the reverse order, depending on the functionality involved. It will also be noted that each block of the block diagrams or flowcharts, and combinations thereof, can be implemented by a dedicated hardware-based system that performs the specified functions or operations, or combinations of hardware and software.

[0088] The units described in the embodiments of the present application can be implemented by software, or by hardware, or by a combination of software and hardware. The units described can also be located in a single processor. In some cases, the names of the units do not limit the units themselves.

[0089] Another aspect of the present application provides a computer readable storage medium, which stores a computer program. The computer program is executed by a processor to implement the method for measuring the display spacer as described above. The computer readable storage medium can be included in the electronic device as described in the embodiments above, or can exist separately from the electronic device.

[0090] Another aspect of the present application provides a computer program product or a computer program, which includes computer instructions. The computer instructions are stored in a computer readable storage medium. A processor of a computer device reads the computer instructions from the computer readable storage medium, and executes the computer instructions, so that the computer device performs the method for measuring the display spacer as described in the embodiments above.

[0091] The above only describes the preferred embodiments of the present application, and is not intended to limit the present application. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for measuring spacers of a display screen, characterized in that: The method comprises: After constructing the three-dimensional morphology of the PS column of the display screen, the tilt correction parameters corresponding to the three-dimensional morphology are obtained through the preset tilt correction rules; Performing tilt correction on the three-dimensional shape based on the tilt correction parameter to obtain a target three-dimensional shape; Determining a measurement range of each measuring head within the target three-dimensional shape based on marker point information of three marker points at preset positions of the display screen; obtaining a height matrix of PS columns within the measurement range, and identifying a PS column to be measured based on the height matrix; Obtaining a measurement value of the PS column to be measured obtained by measuring the measuring head; Correction parameters of the measuring head are obtained, and multiple correction processes are performed on the measurement values ​​based on the correction parameters to obtain a target measurement result.

2. The method according to claim 1, characterized in that The step of obtaining the tilt correction parameters corresponding to the three-dimensional topography by using a preset tilt correction rule includes: Selecting three non-collinear reference points in the three-dimensional topography according to a preset tilt correction rule; Acquiring reference coordinates of the reference point, and obtaining a slope value of the three-dimensional topography in a target axis direction based on the reference coordinates; the target axis direction includes an x-axis and a y-axis; The slope value is used as a tilt correction parameter corresponding to the three-dimensional topography.

3. The method according to claim 2, characterized in that The step of performing tilt correction on the three-dimensional shape based on the tilt correction parameter to obtain a target three-dimensional shape includes: Obtaining a height matrix of the three-dimensional topography; Updating the height values ​​in the height matrix based on the slope value to obtain a target height matrix; The corresponding target three-dimensional shape is obtained based on the target height matrix to complete the tilt correction of the three-dimensional shape.

4. The method according to claim 1, wherein The determining of the measurement range of each measuring head within the target three-dimensional shape based on the marker point information of the three marker points at the preset positions of the display screen includes: Acquire template information of the template display screen, wherein the template information includes template marker point coordinates and template PS column coordinates corresponding to the measuring head; Acquire the actual coordinates of the three marker points included in the marker point information; the preset positions of the marker points are the corner positions of the display screen; Obtaining a coordinate mapping relationship between the actual coordinates of the marker point and the coordinates of the template marker point; The actual PS cylindrical coordinates corresponding to each measuring head are obtained based on the coordinate mapping relationship and the template PS cylindrical coordinates, and the measurement range of each measuring head within the target three-dimensional morphology is determined based on the actual PS cylindrical coordinates.

5. The method according to claim 1, wherein The obtaining of a height matrix of PS columns within the measurement range and identifying a PS column to be measured based on the height matrix includes: Obtaining a height matrix of PS columns within the measurement range, and obtaining a mean value between other height values ​​in the height matrix except a minimum height value and a maximum height value; Based on the mean, a replacement process is performed on the height values ​​in the height matrix that are smaller than the mean to obtain a processed height matrix; Mapping to obtain a two-dimensional grayscale matrix corresponding to the processed height matrix; The similarity between the two-dimensional grayscale matrix and the template grayscale value corresponding to the measurement range is obtained, and the PS column corresponding to the two-dimensional grayscale value with the minimum similarity is used as the PS column to be measured.

6. The method according to claim 1, characterized in that The PS column to be measured corresponds to at least one measuring head; obtaining correction parameters of the measuring head, and performing multiple correction processing on the measured values ​​based on the correction parameters to obtain target measurement results, including: Obtaining a primary correction parameter of the measuring head for a preset standard step sample; When the PS column to be measured corresponds to multiple measuring heads, any one of the multiple measuring heads is used as a reference measuring head; Acquiring a height difference relationship between the reference probe and other probes except the reference probe, and obtaining a secondary correction parameter of each of the other probes based on the height difference relationship; The measurement value is corrected in sequence based on the primary correction parameter and the secondary correction parameter to obtain a target measurement result.

7. The method according to claim 6, characterized in that The obtaining of a primary correction parameter of the measuring head for a preset standard step sample comprises: Obtaining an original measurement value obtained by measuring the height of a preset standard step sample by the measuring head; Perform linear fitting on the original measurement value of each measuring head to obtain corresponding correction parameters, and use the correction parameters as primary correction parameters.

8. The method according to claim 6, characterized in that The step of obtaining a height difference relationship between the reference probe and other probes other than the reference probe, and obtaining a secondary correction parameter of each of the other probes based on the height difference relationship, includes: selecting a plurality of reference PS pillars within the three-dimensional topography; Acquire a standard value obtained by measuring the height of the reference PS column by the reference probe, and a measurement value obtained by measuring the height of the reference PS column by other probes except the reference probe; Performing least square fitting on the standard value and the measured value to obtain a height difference relationship between the reference probe and the other probes; A secondary correction parameter of each of the other probes is obtained based on the height difference relationship.

9. A device for measuring spacers for display screens, characterized in that: include: A correction parameter unit is used to construct a three-dimensional topography of the PS column of the display screen and obtain a tilt correction parameter corresponding to the three-dimensional topography according to a preset tilt correction rule; a tilt correction unit, configured to perform tilt correction on the three-dimensional shape based on the tilt correction parameter to obtain a target three-dimensional shape; a range determination unit, configured to determine a measurement range of each measuring head within the target three-dimensional shape based on marker point information of three marker points at preset positions of the display screen; a test object unit, configured to obtain a height matrix of PS columns within the measurement range and identify the PS columns to be tested based on the height matrix; a measuring unit, configured to obtain a measurement value of the PS column to be measured obtained by measuring the measuring head; The multiple correction unit is used to obtain correction parameters of the measuring head, and perform multiple correction processing on the measurement value based on the correction parameters to obtain a target measurement result.

10. An electronic device, characterized in that: include: one or more processors; A storage device for storing one or more programs, which, when executed by the one or more processors, enables the electronic device to implement the method for measuring display screen spacers as described in any one of claims 1 to 8.

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