Wireless passive multi-parameter integrated sensor based on curved surface conformal and preparation method thereof

Abstract

The invention provides a wireless passive multi-parameter integrated sensor based on curved surface conformal and a preparation method thereof, and belongs to the technical field of aero-engine sensors. The sensor comprises a lower heat insulation layer, a metal layer, a lower substrate, an upper substrate, a sensitive unit layer and an upper heat insulation layer, the lower heat insulation layer is deposited on the lower surface of the metal layer, the metal layer is sprayed on the lower surface of the lower substrate, the lower substrate and the upper substrate are attached to form a double-layer substrate structure, and the sensitive unit layer is printed on the upper surface of the upper substrate. The upper heat insulation layer is deposited above the sensitive unit layer, the sensitive unit layer is composed of a strain sensitive metamaterial antenna, a temperature sensitive metamaterial antenna and a heat flow sensitive unit, and the strain sensitive metamaterial antenna and the temperature sensitive metamaterial antenna are distributed on the upper surface of the upper substrate in an array mode. The invention is used for solving the problems of difficult wiring, difficult curved surface conformal and difficult integration of the existing sensor, thereby realizing the real-time rapid detection of the temperature, strain and heat flow of the engine blade in the aerospace field.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of aero-engine sensor, in particular to a wireless passive multi-parameter integrated sensor based on curved surface conformation and a preparation method thereof. BACKGROUND

[0002] In recent years, wireless passive sensors have attracted widespread attention due to their practical applications in aerospace, health care, and equipment manufacturing. Wireless passive sensors effectively solve the problems of wiring difficulties, poor flexibility, and power limitations of wired sensors, and greatly reduce the maintenance cost of sensors. Among them, the curved surface conformal wireless passive sensor can overcome the problems of poor interface adhesion and limited application scenarios of traditional rigid sensors, thereby achieving high-end equipment component monitoring without affecting the performance of the measured device.

[0003] In particular in the field of aerospace, the engine as the power component of the spacecraft directly determines the flight speed of the aircraft. When the engine is running, the internal components are subjected to extreme conditions of high temperature, high speed, and high pressure for a long time. This harsh environment greatly exacerbates the wear and tear of the components. Whether the real-time monitoring of engine components can be achieved has become a key problem to be solved in the field of aerospace.

[0004] Therefore, there is an urgent need for a curved surface conformal high-temperature resistant wireless passive multi-parameter integrated sensor that can simultaneously measure temperature, strain, and heat flow to meet the parameter monitoring of aerospace and equipment components. SUMMARY

[0005] In order to overcome the shortcomings of the prior art, the purpose of the present application is to provide a wireless passive multi-parameter integrated sensor based on curved surface conformation and a preparation method thereof, which solves the problems of wiring difficulty, curved surface conformation difficulty, and integration difficulty of existing sensors, thereby realizing real-time and rapid detection of temperature, strain, and heat flow of engine blades in the field of aerospace, achieving remote monitoring of three parameters of temperature, strain, and heat flow in a high-temperature harsh environment, filling the gap of aero-engine sensor technology, and laying a foundation for aero-engine sensor technology.

[0006] To achieve the above-mentioned purpose, the present application provides the following solutions: A wireless passive multi-parameter integrated sensor based on curved surface conforming, comprising, from bottom to top, a lower thermal insulation layer, a metal layer, a lower substrate, an upper substrate, a sensitive unit layer and an upper thermal insulation layer, the lower thermal insulation layer is deposited on the lower surface of the metal layer, the metal layer is sprayed on the lower surface of the lower substrate, the lower substrate and the upper substrate are bonded to form a double-layer substrate structure, the sensitive unit layer is printed on the upper surface of the upper substrate, the upper thermal insulation layer is deposited above the sensitive unit layer, and the sensitive unit layer is composed of a strain sensitive metamaterial antenna, a temperature sensitive metamaterial antenna and a heat flow sensitive unit, the strain sensitive metamaterial antenna and the temperature sensitive metamaterial antenna are arrayed on the upper surface of the upper substrate.

[0007] Preferably, the lower substrate and the upper substrate are both SiC ceramic fiber films with a thickness of 420 μm, and the lower thermal insulation layer and the upper thermal insulation layer are both Al2O3 films with a thickness of 5 mm.

[0008] Preferably, the strain sensitive metamaterial antenna and the temperature sensitive metamaterial antenna are both directly printed on the upper surface of the upper substrate, and both are 4×4 metamaterial antenna arrays, with a single antenna line width of 2 mm, a line length of 6 mm and a thickness of 0.1 mm; the strain sensitive metamaterial antenna has an I-shaped structure, and the temperature sensitive metamaterial antenna is divided into a hot end and a cold end, wherein the cold end of the temperature sensitive metamaterial antenna extends into the area covered by the upper thermal insulation layer.

[0009] Preferably, the heat flow sensitive unit comprises: a thermoelectric pile composed of 15 pairs of copper paste and silver paste thermocouples connected in series, printed on the upper surface of the upper substrate, with a line width of 2 mm and a thickness of 0.1 mm; the hot end of the thermoelectric pile is located in the same temperature measuring area as the hot end of the temperature sensitive metamaterial antenna; an interdigital capacitor and a spiral inductor, both printed on the upper surface of the upper substrate and penetrating the upper and lower lead holes of the upper substrate through the connecting lines, and connected to the lower surface of the upper substrate and the hole groove of the lower substrate to form an LC resonant circuit; a special-shaped microstrip antenna printed on the upper surface of the upper substrate, which is located in the same plane as the strain sensitive metamaterial antenna and the temperature sensitive metamaterial antenna and is spaced apart from them.

[0010] Preferably, the upper and lower lead holes of the upper substrate are both 2 mm×2 mm, used for connecting lines to penetrate and connect the interdigital capacitor and the spiral inductor.

[0011] Preferably, the spiral inductor has a planar single spiral structure, with 4 turns, a line width of 2 mm and a thickness of 0.1 mm.

[0012] Preferably, the thickness of the strain-sensitive metamaterial antenna, the temperature-sensitive metamaterial antenna, the thermoelectric pile, the interdigital capacitor, the spiral inductor and the metal layer is 0.1 mm.

[0013] Preferably, the upper thermal insulation layer covers the sensitive unit layer, and the strain-sensitive metamaterial antenna strain temperature measurement cavity, the temperature-sensitive metamaterial antenna temperature measurement cavity, and the first, second and third thermoelectric pile temperature measurement cavities of the thermoelectric pile are not covered by the thermal insulation layer; and the lower thermal insulation layer completely covers the metal layer.

[0014] Preferably, the wireless passive multi-parameter integrated sensor further comprises a readout system, the readout system comprising a signal receiving end module, a signal decoupling module and a display module; the signal receiving end module transmits electromagnetic wave signals between the strain-sensitive metamaterial antenna, the temperature-sensitive metamaterial antenna and the special-shaped microstrip antenna through the receiving antenna, the signal decoupling module adopts a CNN-LSTM algorithm for decoupling, and the display module displays the parameter signals in real time through the upper computer software.

[0015] The application also provides a preparation method of the wireless passive multi-parameter integrated sensor based on the curved surface conformal structure. A SiC ceramic fiber film with a thickness of 420 μm is prepared as the lower substrate and the upper substrate by a chemical vapor deposition (CVD) method; the upper substrate is pre-processed with an upper lead hole and a lower lead hole, and the lower substrate is pre-processed with a hole slot; An Al2O3 film with a thickness of 5 mm is deposited on the lower surface of the lower substrate as a lower thermal insulation layer by a pulsed laser deposition method; A strain-sensitive metamaterial antenna, a temperature-sensitive metamaterial antenna, a thermoelectric pile composed of 15 pairs of copper-silver thermocouples in series, an interdigital capacitor, a 4-turn spiral inductor and a special-shaped microstrip antenna are printed in sequence on the upper surface of the upper substrate by a DIW ink direct writing printing method, and a metal layer with a thickness of 0.1 mm is sprayed on the lower surface of the lower substrate; The connecting lines of the interdigital capacitor and the spiral inductor are connected to the lower surface of the upper substrate and the hole slot of the lower substrate through the 2 mm*2 mm upper lead hole and the lower lead hole of the upper substrate, forming an LC resonant circuit; An Al2O3 film with a thickness of 5 mm is deposited on the sensitive unit layer as an upper thermal insulation layer by a pulsed laser deposition method, and the strain-sensitive metamaterial antenna strain temperature measurement cavity, the temperature-sensitive metamaterial antenna temperature measurement cavity, and the first, second and third thermoelectric pile temperature measurement cavities of the thermoelectric pile are not deposited, completing the packaging to obtain the wireless passive multi-parameter integrated sensor.

[0016] According to the specific embodiments of the application, the following technical effects are achieved: (1) The application solves the problems of wiring difficulty, poor flexibility and high maintenance cost of wired sensors by receiving electromagnetic wave transmission signals between the receiving antenna and the strain-sensitive metamaterial antenna, the temperature-sensitive metamaterial antenna and the special-shaped microstrip antenna without power supply and wiring, and realizes long-distance wireless transmission and real-time detection of temperature, strain and heat flow multi-parameter sensing signals.

[0017] (2) The application solves the problems of poor adhesion, limited application scenarios and insufficient stability in high-temperature environments of traditional rigid sensors by using a SiC ceramic fiber film substrate with a thickness of 420 microns and a 5mm thick Al2O3 film thermal insulation layer, utilizing the high-temperature resistance and flexible bending characteristics of SiC, and realizes curved surface conformal monitoring and structural reliability guarantee of equipment components in harsh environments such as high temperature, high rotation and high pressure.

[0018] (3) The application solves the problems of signal interference and insufficient precision in multi-parameter detection by designing a I-shaped strain-sensitive metamaterial antenna, a hot-cold structure temperature-sensitive metamaterial antenna and a heat flow sensitive unit based on thermocouple and LC resonant circuit, and combining CNN-LSTM algorithm decoupling, and realizes high-precision sensing and independent signal decoupling of temperature, strain and heat flow parameters.

[0019] (4) The application solves the manufacturing and packaging problems of traditional complex structure sensors by using DIW ink direct writing printing method to prepare the sensitive unit layer, chemical vapor deposition method to prepare the SiC substrate and pulse laser deposition method to deposit the Al2O3 thermal insulation layer, realizes high-precision control of the line width of the sensitive unit layer, makes the line width of the sensitive unit layer reach 2mm and the thickness reach 0.1mm, and realizes integrated packaging of long-term stable work of the sensor. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor under the premise of the drawings.

[0021] Figure 1 It is a whole structure schematic view of a wireless passive multi-parameter integrated sensor based on curved surface conformal of the application; Figure 2 It is a top view of a wireless passive multi-parameter integrated sensor based on curved surface conformal of the application; Figure 3 It is a A-A cross-sectional structure view in Figure 2 Figure 4 ​A schematic diagram of the upper surface of a SiC ceramic fiber material upper substrate provided in an embodiment of the present invention; Figure 5 Schematic diagram of the lower surface of the SiC ceramic fiber material upper substrate provided in an embodiment of the present invention.

[0022] Description of reference numerals: 101. Lower thermal insulation layer; 102. Upper thermal insulation layer; 201. Lower substrate; 2011. Hole groove; 202. Upper substrate; 2021. Upper lead hole; 2022. Lower lead hole; 301. Metal layer; 601. Copper paste; 602. Silver paste; 4. Strain-sensitive metamaterial antenna; 5. Temperature-sensitive metamaterial antenna; 6. Thermopile; 7. Interdigital capacitor; 8. Connecting wire; 9. Spiral inductor; 10. Special-shaped microstrip antenna; 1021. Strain temperature measurement cavity; 1022. Temperature temperature measurement cavity; 1023. First thermopile temperature measurement cavity; 1024. Second thermopile temperature measurement cavity; 1025. Third thermopile temperature measurement cavity. DETAILED DESCRIPTION

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0025] Example like Figures 1 to 5 As shown, the present invention provides a wireless passive multi-parameter integrated sensor based on curved surface conformality, which includes, from bottom to top, a lower insulation layer 101, a metal layer 301, a lower substrate 201, an upper substrate 202, a sensitive unit layer and an upper insulation layer 102.

[0026] Among them, the lower insulation layer 101 adopts a 5mm thick Al2O3 film, which is deposited on the lower surface of the metal layer 301. The thermal insulation properties of Al2O3 are used to block the influence of the heat below on the internal structure of the sensor, ensuring the stability of the metal layer 301 and the structure above.

[0027] The metal layer 301 is sprayed on the lower surface of the lower substrate 201 with a thickness of 0.1 mm, and serves as a signal reflection and auxiliary support structure to enhance the electromagnetic coupling effect between the sensor and the measured surface.

[0028] The lower substrate 201 and the upper substrate 202 are both SiC ceramic fiber films with a thickness of 420 μm, and a double-layer substrate structure is formed by bonding. The SiC ceramic fiber film has both high temperature resistance and flexible bending characteristics, thereby realizing curved surface conforming, providing stable support for the sensor, and adapting to complex curved surfaces.

[0029] The sensitive unit layer is printed on the upper surface of the upper substrate 202 and is composed of a strain-sensitive metamaterial antenna 4, a temperature-sensitive metamaterial antenna 5, and a heat flow-sensitive unit: The strain-sensitive metamaterial antenna 4 is a 4x4 metamaterial antenna array, with a single antenna line width of 2 mm, a line length of 6 mm, and a thickness of 0.1 mm, in the shape of an I-beam. Through electromagnetic wave transmission signals, the sensitivity of the structure to mechanical strain is used to detect external strain signals in real time and convert them into changes in electromagnetic wave characteristics.

[0030] The temperature-sensitive metamaterial antenna 5 is also a 4x4 metamaterial antenna array, divided into a hot end and a cold end. The hot end is exposed to the measured environment, with the upper thermal insulation layer 102 not covering it, and the cold end extends into the area covered by the upper thermal insulation layer 102. The temperature difference between the hot end and the cold end causes changes in the electromagnetic properties of the antenna, enabling temperature detection.

[0031] Further, when the temperature changes, the degree of polarization of the dielectric material of the strain-sensitive metamaterial antenna 4 and the temperature-sensitive metamaterial antenna 5 changes, causing the dielectric constant to drift, thereby causing the resonant frequency of the temperature-sensitive metamaterial antenna 5 to shift. By monitoring the change in resonant frequency, the real-time temperature change of the measured component can be detected.

[0032] The heat flow-sensitive unit: the thermoelectric pile 6 is composed of 15 pairs of copper paste 601 and silver paste 602 thermocouples connected in series, with a line width of 2 mm and a thickness of 0.1 mm. It is printed on the upper surface of the upper substrate 202, and the hot end is located in the same temperature measurement area as the hot end of the temperature-sensitive metamaterial antenna 5. Using the Seebeck effect, the temperature difference caused by heat flow is converted into an electrical signal, enabling heat flow detection.

[0033] The interdigital capacitor 7 and the spiral inductor 9 are both printed on the upper surface of the upper substrate 202 and connected to the lower surface of the upper substrate 202 through the 2mmx2mm upper lead hole 2021 and lower lead hole 2022 of the upper substrate 202 via the connecting line 8, and further connected through the hole groove 2011 on the surface of the lower substrate 201, forming an LC resonance circuit. The spiral inductor 9 is a planar single spiral structure with 4 turns, a line width of 2 mm, and a thickness of 0.1 mm. This circuit modulates the output signal of the thermoelectric pile 6, making it easier to extract the signal later.

[0034] The special-shaped microstrip antenna 10 is printed on the upper surface of the upper substrate 202 and is located in the same plane as the strain-sensitive metamaterial antenna 4 and the temperature-sensitive metamaterial antenna 5, and is spaced apart from them. It is responsible for transmitting the heat flow-sensitive unit signal in the form of electromagnetic waves over a long distance.

[0035] The upper thermal insulation layer 102 is an Al2O3 film with a thickness of 5 mm, which is deposited above the sensitive unit layer, covering all parts except the strain sensitive metamaterial antenna 4 strain measurement cavity 1021, the temperature sensitive metamaterial antenna 5 temperature measurement cavity 1022, and the first thermoelectric element measurement cavity 1023, the second thermoelectric element measurement cavity 1024 and the third thermoelectric element measurement cavity 1025 of the thermoelectric element 6, to prevent external environment from interfering with the sensitive unit layer, and to protect part of the structure.

[0036] In addition, the sensor also includes a readout system, which has the following specific functions: signal receiving end module: through the receiving antenna, the electromagnetic wave transmission signals of the strain sensitive metamaterial antenna 4, the temperature sensitive metamaterial antenna 5 and the special-shaped microstrip antenna 10 are obtained, and the scattering parameter changes are monitored in real time. Signal decoupling module: the CNN-LSTM algorithm is used to decouple the time-frequency characteristics of the mixed signal, and the FFT (Fast Fourier Transform) algorithm is used to analyze the phase difference between the output frequency of the LC resonant circuit and the local oscillator frequency of the special-shaped microstrip antenna 10, and the temperature change is calculated by combining the preset calibration coefficient; based on the Fourier law and the multi-point temperature measurement data, the heat flux density distribution of the measured component is inversed through the heat conduction equation, and the independent extraction and optimization of the temperature, strain and heat flux signals are realized. Display module: the decoupled signal is converted into intuitive parameters by the upper computer software, and the temperature, strain and heat flux data are displayed in real time.

[0037] In addition, the embodiment also provides a preparation method of the sensor, which comprises the following steps: Substrate preparation: a SiC ceramic fiber film with a thickness of 420 μm is prepared by a chemical vapor deposition method (CVD) as a lower substrate 201 and an upper substrate 202, the CVD method ensures the uniformity and crystallization quality of the film, and gives the substrate high temperature resistance and flexibility, and the upper substrate 202 is pre-processed with an upper lead hole 2021 and a lower lead hole 2022, and the lower substrate 201 is pre-processed with a hole groove 2011; Lower thermal insulation layer 101 deposition: a 5mm thick Al2O3 film is deposited on the lower surface of the lower substrate 201 by a pulsed laser deposition method to form a lower thermal insulation layer 101, which improves the heat insulation capacity of the bottom layer of the sensor.

[0038] Sensitive unit layer and metal layer 301 preparation: DIW ink direct writing printing method is used to print the strain sensitive metamaterial antenna 4, the temperature sensitive metamaterial antenna 5, the thermoelectric element 6 with 15 pairs of copper-silver thermocouples in series, the interdigital capacitor 7, the 4-turn spiral inductor 9 and the special-shaped microstrip antenna 10 on the upper surface of the upper substrate 202 in sequence; at the same time, a 0.1mm thick metal layer 301 is sprayed on the lower surface of the lower substrate 201, realizing high-precision forming of the sensitive unit layer and adhesion with the metal layer 301.

[0039] LC resonant circuit connection: the connection line 8 of the interdigital capacitor 7 and the spiral inductor 9 is connected to the hole groove 2011 of the upper substrate 202 and the lower substrate 201 through the 2mm*2mm upper lead hole 2021 and lower lead hole 2022 of the upper substrate 202, forming an LC resonant circuit, completing the assembly of the heat flow signal modulation structure.

[0040] Upper thermal insulation layer 102 deposition and packaging: a 5mm thick Al2O3 film is deposited as an upper thermal insulation layer 102 above the sensitive unit layer by pulsed laser deposition method, leaving the strain sensitive metamaterial antenna 4 strain temperature measurement cavity 1021, temperature sensitive metamaterial antenna 5 temperature measurement cavity 1022, and thermoelectric element 6 first thermoelectric element measurement cavity 1023, second thermoelectric element measurement cavity 1024 and third thermoelectric element measurement cavity 1025 not deposited, completing the packaging, which not only protects the sensor but also ensures accurate detection of the hot end signal.

[0041] Therefore, the above-mentioned wireless passive multi-parameter integrated sensor based on curved surface conforming and its preparation method are used to solve the problems of existing sensor wiring difficulty, curved surface conforming difficulty and integration difficulty, so as to realize real-time and rapid detection of temperature, strain and heat flow of engine blades in the field of aerospace, realize remote monitoring of three parameters of temperature, strain and heat flow in high temperature and harsh environment, fill the gap of aero-engine sensor technology, and lay a foundation for aero-engine sensor technology.

[0042] The principles and embodiments of the present application are described in this paper by using specific examples, and the above examples are only used to help understand the method and core idea of the present application; at the same time, for those skilled in the art, according to the idea of the present application, there will be changes in specific embodiments and application scope. In summary, the content of the specification should not be understood as a limitation of the present application.

Claims

1. A wireless passive multi-parameter integrated sensor based on curved surface conformality, characterized in that: From bottom to top, it includes: a lower thermal insulation layer, a metal layer, a lower substrate, an upper substrate, a sensitive unit layer and an upper thermal insulation layer. The lower thermal insulation layer is deposited on the lower surface of the metal layer, the metal layer is sprayed on the lower surface of the lower substrate, the lower substrate and the upper substrate are bonded to form a double-layer substrate structure, the sensitive unit layer is printed on the upper surface of the upper substrate, the upper thermal insulation layer is deposited above the sensitive unit layer, and the sensitive unit layer is composed of a strain-sensitive metamaterial antenna, a temperature-sensitive metamaterial antenna and a heat flow sensitive unit. The strain-sensitive metamaterial antenna and the temperature-sensitive metamaterial antenna are distributed in an array on the upper surface of the upper substrate.

2. The surface conformal wireless passive multi-parameter integrated sensor according to claim 1, characterized in that: The lower substrate and the upper substrate are both SiC ceramic fiber films with a thickness of 420 μm, and the lower thermal insulation layer and the upper thermal insulation layer are both Al 2 O 3 films with a thickness of 5 mm.

3. The surface conformal wireless passive multi-parameter integrated sensor according to claim 1, characterized in that: The strain-sensitive metamaterial antenna and the temperature-sensitive metamaterial antenna are both directly printed on the upper surface of the upper substrate. Both the strain-sensitive metamaterial antenna and the temperature-sensitive metamaterial antenna are 4×4 metamaterial antenna arrays, with a single antenna line width of 2mm, a line length of 6mm, and a thickness of 0.1mm. The strain-sensitive metamaterial antenna is in the shape of an I-beam, and the temperature-sensitive metamaterial antenna is divided into a hot end and a cold end, wherein the cold end of the temperature-sensitive metamaterial antenna extends into the area covered by the upper thermal insulation layer.

4. The surface conformal wireless passive multi-parameter integrated sensor according to claim 1, characterized in that: The heat flow sensitive unit includes: A thermopile, consisting of 15 pairs of copper paste and silver paste thermocouples connected in series, printed on the upper surface of the upper substrate, with a line width of 2 mm and a thickness of 0.1 mm; the hot end of the thermopile and the hot end of the temperature-sensitive metamaterial antenna are located in the same temperature measurement area; The interdigital capacitor and the spiral inductor are both printed on the upper surface of the upper substrate and penetrate the upper lead hole and the lower lead hole of the upper substrate through connecting wires, and are connected to the lower surface of the upper substrate and the hole groove of the lower substrate to form an LC resonant circuit; A special-shaped microstrip antenna is printed on the upper surface of the upper substrate. The special-shaped microstrip antenna, the strain-sensitive metamaterial antenna, and the temperature-sensitive metamaterial antenna are located in the same plane and are spaced apart from each other.

5. The surface conformal wireless passive multi-parameter integrated sensor according to claim 4, characterized in that: The upper lead hole and the lower lead hole of the upper substrate are both 2mm×2mm, and are used for connecting wires to pass through and connect the interdigital capacitor and the spiral inductor.

6. The surface conformal wireless passive multi-parameter integrated sensor according to claim 5, characterized in that: The spiral inductor is a planar single spiral structure, with 4 turns of coil, a line width of 2 mm and a thickness of 0.1 mm.

7. The surface conformal wireless passive multi-parameter integrated sensor according to claim 6, characterized in that: The thickness of the strain-sensitive metamaterial antenna, the temperature-sensitive metamaterial antenna, the thermopile, the interdigital capacitor, the spiral inductor and the metal layer are all 0.1 mm.

8. The surface conformal wireless passive multi-parameter integrated sensor according to claim 1, characterized in that: The upper thermal insulation layer covers the sensitive unit layer, and there is no thermal insulation layer above the strain temperature measurement cavity of the strain-sensitive metamaterial antenna, the temperature temperature measurement cavity of the temperature-sensitive metamaterial antenna, and the first thermopile temperature measurement cavity, the second thermopile temperature measurement cavity, and the third thermopile temperature measurement cavity of the thermopile; the lower thermal insulation layer completely covers the bottom of the metal layer.

9. The surface conformal wireless passive multi-parameter integrated sensor according to claim 1, characterized in that: The wireless passive multi-parameter integrated sensor also includes a readout system, which includes a signal receiving end module, a signal decoupling module and a display module; the signal receiving end module transmits signals through electromagnetic waves between the receiving antenna and the strain-sensitive metamaterial antenna, the temperature-sensitive metamaterial antenna and the special-shaped microstrip antenna; the signal decoupling module uses the CNN-LSTM algorithm for decoupling; and the display module displays the parameter signals in real time through the host computer software.

10. A method for preparing a surface conformal wireless passive multi-parameter integrated sensor according to any one of claims 1 to 9, characterized in that: The following steps are involved: A SiC ceramic fiber film with a thickness of 420 μm was prepared by chemical vapor deposition (CVD) as a lower substrate and an upper substrate; the upper substrate was pre-machined with an upper lead hole and a lower lead hole, and the lower substrate was pre-machined with a hole groove; Depositing a 5 mm thick Al2O3 film as a lower thermal insulation layer on the lower surface of the lower substrate by pulsed laser deposition; Using a DIW ink direct-write printing method, a strain-sensitive metamaterial antenna, a temperature-sensitive metamaterial antenna, a thermopile consisting of 15 pairs of copper-silver thermocouples connected in series, an interdigital capacitor, a 4-turn spiral inductor, and a special-shaped microstrip antenna were sequentially printed on the upper surface of the upper substrate, and a 0.1 mm thick metal layer was sprayed on the lower surface of the lower substrate; Connect the connecting wires of the interdigital capacitor and the spiral inductor to the lower surface of the upper substrate and the hole groove of the lower substrate through the 2mm×2mm upper lead hole and lower lead hole of the upper substrate to form an LC resonant circuit; A 5 mm thick Al2O3 film is deposited on the sensitive unit layer by a pulsed laser deposition method as an upper thermal insulation layer, and the strain temperature measurement cavity of the strain-sensitive metamaterial antenna, the temperature temperature measurement cavity of the temperature-sensitive metamaterial antenna, and the first thermopile temperature measurement cavity, the second thermopile temperature measurement cavity, and the third thermopile temperature measurement cavity of the thermopile are retained without deposition, and the wireless passive multi-parameter integrated sensor is obtained after packaging.

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