Wireless passive multi-parameter integrated sensor based on surface conformity and its fabrication method

Abstract

This invention provides a wireless passive multi-parameter integrated sensor based on conformal surface design and its fabrication method, belonging to the field of aero-engine sensor technology. The sensor includes: a lower heat insulation layer, a metal layer, a lower substrate, an upper substrate, a sensitive element layer, and an upper heat insulation layer. The lower heat insulation layer is deposited on the lower surface of the metal layer, and the metal layer is sprayed onto the lower surface of the lower substrate. The lower and upper substrates are bonded together to form a double-layer substrate structure. The sensitive element layer is printed on the upper surface of the upper substrate, and the upper heat insulation layer is deposited above the sensitive element layer. The sensitive element layer consists of a strain-sensitive metamaterial antenna, a temperature-sensitive metamaterial antenna, and a heat flow-sensitive element. The strain-sensitive and temperature-sensitive metamaterial antennas are arrayed on the upper surface of the upper substrate. This invention addresses the problems of difficult wiring, difficult conformal surface design, and difficult integration in existing sensors, thereby enabling real-time and rapid detection of temperature, strain, and heat flow in engine blades in the aerospace field.

Description

Technical Field

[0001] This invention relates to the field of aero-engine sensor technology, and in particular to a wireless passive multi-parameter integrated sensor based on conformal surface and its fabrication method. Background Technology

[0002] In recent years, wireless passive sensors have received widespread attention due to their practical applications in aerospace, health monitoring, and equipment manufacturing. Wireless passive sensors effectively solve the problems of difficult wiring, poor flexibility, and power limitations associated with wired sensors, and significantly reduce sensor maintenance costs. Among them, conformal wireless passive sensors can overcome the problems of poor interface adhesion and limited applicability of traditional rigid sensors, thus enabling the monitoring of components in advanced equipment without affecting the performance of the device under test.

[0003] Especially in the aerospace field, the engine, as the power component of a spacecraft, directly determines the spacecraft's flight speed. When an engine is running, its internal components endure extreme conditions of high temperature, high speed, and high pressure for extended periods. This harsh environment significantly accelerates component wear and tear. Therefore, the ability to monitor engine component parameters in real time has become a critical challenge that urgently needs to be overcome in the aerospace field.

[0004] Therefore, there is an urgent need for a conformal, high-temperature resistant, wireless, passive multi-parameter integrated sensor capable of simultaneously measuring temperature, strain, and heat flow to meet the parameter monitoring needs of aerospace and equipment components. Summary of the Invention

[0005] To overcome the shortcomings of existing technologies, the purpose of this invention is to provide a wireless passive multi-parameter integrated sensor based on surface conformal and its fabrication method. This addresses the problems of difficult wiring, difficult surface conformal design, and difficult integration of existing sensors, thereby enabling real-time and rapid detection of temperature, strain, and heat flow of engine blades in the aerospace field. It achieves simultaneous remote monitoring of the three parameters of temperature, strain, and heat flow in high-temperature and harsh environments, filling the gap in aero-engine sensor technology and laying the foundation for aero-engine sensor technology.

[0006] To achieve the above objectives, the present invention provides the following solution:

[0007] A wireless passive multi-parameter integrated sensor based on curved surface conformal design comprises, from bottom to top: a lower heat insulation layer, a metal layer, a lower substrate, an upper substrate, a sensitive element layer, and an upper heat insulation layer. The lower heat insulation layer is deposited on the lower surface of the metal layer, and the metal layer is sprayed on the lower surface of the lower substrate. The lower substrate and the upper substrate are bonded together to form a double-layer substrate structure. The sensitive element layer is printed on the upper surface of the upper substrate, and the upper heat insulation layer is deposited above the sensitive element layer. The sensitive element layer consists of a strain-sensitive metamaterial antenna, a temperature-sensitive metamaterial antenna, and a heat flow-sensitive element. The strain-sensitive metamaterial antenna and the temperature-sensitive metamaterial antenna are arrayed on the upper surface of the upper substrate.

[0008] Preferably, both the lower substrate and the upper substrate are SiC ceramic fiber films with a thickness of 420 μm, and both the lower heat insulation layer and the upper heat insulation layer are Al2O3 films with a thickness of 5 mm.

[0009] Preferably, both the strain-sensitive metamaterial antenna and the temperature-sensitive metamaterial antenna are directly printed on the upper surface of the upper substrate. Both the strain-sensitive metamaterial antenna and the temperature-sensitive metamaterial antenna are 4×4 metamaterial antenna arrays, with each antenna having a linewidth of 2mm, a line length of 6mm, and a thickness of 0.1mm. The strain-sensitive metamaterial antenna is I-shaped, and the temperature-sensitive metamaterial antenna is divided into a hot end and a cold end, wherein the cold end of the temperature-sensitive metamaterial antenna extends into the area covered by the upper heat insulation layer.

[0010] Preferably, the heat flow sensing unit includes:

[0011] The thermopile consists of 15 pairs of copper and silver paste thermocouples connected in series, printed on the upper surface of the substrate, with a line width of 2 mm and a thickness of 0.1 mm; the hot end of the thermopile and the hot end of the temperature-sensitive metamaterial antenna are located in the same temperature measurement area.

[0012] The interdigitated capacitor and the spiral inductor are both printed on the upper surface of the upper substrate and pass through the upper lead hole and lower lead hole of the upper substrate through the connecting wire, and are connected to the lower surface of the upper substrate and the slot of the lower substrate to form an LC resonant circuit.

[0013] An irregularly shaped microstrip antenna is printed on the upper surface of the upper substrate. The irregularly shaped microstrip antenna, the strain-sensitive metamaterial antenna, and the temperature-sensitive metamaterial antenna are located on the same plane and spaced apart from each other.

[0014] Preferably, the upper lead hole and the lower lead hole of the upper substrate are both 2mm×2mm, used for connecting wires to pass through and connect the interdigitated capacitor and the spiral inductor.

[0015] Preferably, the spiral inductor has a planar single spiral structure, with 4 turns of coil, a line width of 2 mm, and a thickness of 0.1 mm.

[0016] Preferably, the thickness of the strain-sensitive metamaterial antenna, the temperature-sensitive metamaterial antenna, the thermopile, the interdigitated capacitor, the spiral inductor, and the metal layer is all 0.1 mm.

[0017] Preferably, the upper heat insulation layer covers the sensitive unit layer, and there is no heat insulation layer above the strain temperature measurement cavity of the strain-sensitive metamaterial antenna, the temperature temperature measurement cavity of the temperature-sensitive metamaterial antenna, and the first thermopile temperature measurement cavity, the second thermopile temperature measurement cavity, and the third thermopile temperature measurement cavity of the thermopile; the lower heat insulation layer completely covers the area below the metal layer.

[0018] Preferably, the wireless passive multi-parameter integrated sensor further includes a readout system, which includes a signal receiving module, a signal decoupling module, and a display module. The signal receiving module receives electromagnetic wave transmission signals between the receiving antenna and the strain-sensitive metamaterial antenna, the temperature-sensitive metamaterial antenna, and the irregular microstrip antenna. The signal decoupling module uses a CNN-LSTM algorithm for decoupling. The display module displays the parameter signals in real time through host computer software.

[0019] This invention also provides a method for fabricating the above-mentioned wireless passive multi-parameter integrated sensor based on surface conformity, comprising the following steps:

[0020] A 420 μm thick SiC ceramic fiber film was prepared by chemical vapor deposition (CVD) as a lower and upper substrate; the upper substrate was pre-processed with upper and lower lead holes, and the lower substrate was pre-processed with slots.

[0021] A 5 mm thick Al2O3 film was deposited on the lower surface of the substrate as a lower heat insulation layer using pulsed laser deposition.

[0022] Using the DIW ink direct writing printing method, a strain-sensitive metamaterial antenna, a temperature-sensitive metamaterial antenna, a thermopile consisting of 15 pairs of copper-silver thermocouples connected in series, an interdigital capacitor, a 4-turn spiral inductor, and an irregularly shaped microstrip antenna are sequentially printed on the upper surface of the upper substrate, and a metal layer with a thickness of 0.1 mm is sprayed on the lower surface of the lower substrate.

[0023] The connecting wires of the interdigital capacitor and the spiral inductor are connected to the lower surface of the upper substrate and the slot of the lower substrate through the 2mm×2mm upper lead hole and the lower lead hole of the upper substrate to form an LC resonant circuit.

[0024] A 5mm thick Al2O3 film is deposited above the sensitive unit layer as an upper heat insulation layer using pulsed laser deposition. The strain-sensitive metamaterial antenna's strain temperature measurement cavity, the temperature-sensitive metamaterial antenna's temperature temperature measurement cavity, and the first, second, and third thermopile temperature measurement cavities of the thermopile are not deposited. The encapsulation process is then completed to obtain the wireless passive multi-parameter integrated sensor.

[0025] According to specific embodiments provided by the present invention, the present invention discloses the following technical effects:

[0026] (1) This invention transmits electromagnetic wave signals between the receiving antenna and the strain-sensitive metamaterial antenna, the temperature-sensitive metamaterial antenna, and the irregular microstrip antenna. It eliminates the need for power supply and wiring, thus solving the problems of difficult wiring, poor flexibility, and high maintenance costs of wired sensors. It realizes long-distance wireless transmission and real-time detection of multi-parameter sensing signals such as temperature, strain, and heat flow.

[0027] (2) By using a SiC ceramic fiber film substrate with a thickness of 420μm and a 5mm thick Al2O3 film heat insulation layer, this invention utilizes the high temperature resistance and flexible bendability of SiC to solve the problems of poor interface adhesion, limited applicable scenarios and insufficient stability under high temperature environment of traditional rigid sensors, and realizes the surface conformal monitoring and structural reliability assurance of equipment components under harsh environments such as high temperature, high rotation and high pressure.

[0028] (3) This invention solves the problems of signal interference and insufficient accuracy in multi-parameter detection by designing an I-shaped strain-sensitive metamaterial antenna, a hot-end-cold-end structure temperature-sensitive metamaterial antenna and a heat flow-sensitive unit based on thermopile and LC resonant circuit, and combining it with CNN-LSTM algorithm decoupling, thus realizing high-precision sensing of temperature, strain and heat flow parameters and independent signal decoupling.

[0029] (4) This invention prepares the sensitive unit layer by DIW ink direct writing printing, prepares the SiC substrate by chemical vapor deposition and deposits the Al2O3 heat insulation layer by pulsed laser deposition, solves the manufacturing and packaging problems of traditional complex structure sensors, realizes high-precision control of the line width of the sensitive unit layer, makes the line width of the sensitive unit layer reach 2mm and the thickness 0.1mm, and realizes the integrated packaging of the sensor for long-term stable operation. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the overall structure of a wireless passive multi-parameter integrated sensor based on curved surface conformal according to the present invention;

[0032] Figure 2 This is a top view of a wireless passive multi-parameter integrated sensor based on surface conformal design according to the present invention.

[0033] Figure 3 for Figure 2 AA section structural view;

[0034] Figure 4 A schematic diagram of the upper surface of the SiC ceramic fiber material substrate provided in an embodiment of the present invention;

[0035] Figure 5 This is a schematic diagram of the lower surface of the SiC ceramic fiber material substrate provided in an embodiment of the present invention.

[0036] Explanation of reference numerals in the attached figures:

[0037] 101. Lower thermal insulation layer; 102. Upper thermal insulation layer; 201. Lower substrate; 2011. Hole / slot; 202. Upper substrate; 2021. Upper lead hole; 2022. Lower lead hole; 301. Metal layer; 601. Copper paste; 602. Silver paste; 4. Strain-sensitive metamaterial antenna; 5. Temperature-sensitive metamaterial antenna; 6. Thermopile; 7. Interdigital capacitor; 8. Connecting wire; 9. Spiral inductor; 10. Irregular microstrip antenna; 1021. Strain temperature measurement cavity; 1022. Temperature temperature measurement cavity; 1023. First thermopile temperature measurement cavity; 1024. Second thermopile temperature measurement cavity; 1025. Third thermopile temperature measurement cavity. Detailed Implementation

[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0040] Example

[0041] like Figures 1 to 5As shown, the present invention provides a wireless passive multi-parameter integrated sensor based on curved surface conformal, which includes, from bottom to top, a lower heat insulation layer 101, a metal layer 301, a lower substrate 201, an upper substrate 202, a sensitive unit layer and an upper heat insulation layer 102.

[0042] The lower heat insulation layer 101 is made of a 5mm thick Al2O3 film, which is deposited on the lower surface of the metal layer 301. The heat insulation properties of Al2O3 are used to block the heat below from affecting the internal structure of the sensor, ensuring the stability of the metal layer 301 and the structure above it.

[0043] A metal layer 301 is sprayed onto the lower surface of the substrate 201 with a thickness of 0.1 mm. It serves as a signal reflection and auxiliary support structure to enhance the electromagnetic coupling effect between the sensor and the measured surface.

[0044] Both the lower substrate 201 and the upper substrate 202 are SiC ceramic fiber films with a thickness of 420μm, which are bonded together to form a double-layer substrate structure. The SiC ceramic fiber film has both high temperature resistance, can adapt to high temperature environments and flexible and bendable characteristics, thereby achieving conformal surface design, providing stable support for the sensor and adapting to complex curved surfaces.

[0045] The sensitive element layer is printed on the upper surface of the upper substrate 202 and consists of strain-sensitive metamaterial antenna 4, temperature-sensitive metamaterial antenna 5, and heat flow-sensitive element:

[0046] The strain-sensitive metamaterial antenna 4 is a 4×4 metamaterial antenna array. Each antenna has a linewidth of 2mm, a line length of 6mm, and a thickness of 0.1mm, and is H-shaped. It transmits signals via electromagnetic waves and utilizes the sensitivity of its structure to mechanical strain to detect external strain signals in real time and convert them into changes in electromagnetic wave characteristics.

[0047] The temperature-sensitive metamaterial antenna 5 is also a 4×4 metamaterial antenna array, divided into a hot end and a cold end. The hot end is exposed to the measured environment, while the upper heat insulation layer 102 does not cover it. The cold end extends into the area covered by the upper heat insulation layer 102. Temperature detection is achieved by detecting the change in the antenna's electromagnetic characteristics caused by the temperature difference between the hot and cold ends.

[0048] Furthermore, when the temperature changes, the polarization of the dielectric material of the strain-sensitive metamaterial antenna 4 and the temperature-sensitive metamaterial antenna 5 changes, causing the dielectric constant to drift, which in turn causes the resonant frequency of the temperature-sensitive metamaterial antenna 5 to shift. The real-time temperature change of the tested component is detected by monitoring the change in the resonant frequency.

[0049] The heat flow sensing element: The thermopile 6 consists of 15 pairs of copper paste 601 and silver paste 602 thermocouples connected in series, with a line width of 2mm and a thickness of 0.1mm. It is printed on the upper surface of the upper substrate 202, and the hot end is located in the same temperature measurement area as the hot end of the temperature-sensitive metamaterial antenna 5. Utilizing the Seebeck effect, the temperature difference caused by heat flow is converted into an electrical signal to realize heat flow detection.

[0050] Both the interdigitated capacitor 7 and the spiral inductor 9 are printed on the upper surface of the upper substrate 202. They are connected to the lower surface of the upper substrate 202 via connecting wires 8 that pass through 2mm×2mm upper lead holes 2021 and lower lead holes 2022. Further connections are made through slots 2011 on the surface of the lower substrate 201, forming an LC resonant circuit. The spiral inductor 9 has a planar single-spiral structure with 4 turns, a line width of 2mm, and a thickness of 0.1mm. This circuit modulates the output signal of the thermopile 6, facilitating subsequent signal extraction.

[0051] The irregular microstrip antenna 10 is printed on the upper surface of the substrate 202. It is located on the same plane as the strain-sensitive metamaterial antenna 4 and the temperature-sensitive metamaterial antenna 5 and is spaced apart from each other. It is responsible for transmitting the heat flow sensitive unit signal over long distance in the form of electromagnetic waves.

[0052] The upper heat insulation layer 102 is a 5mm thick Al2O3 thin film, deposited above the sensitive unit layer. It covers all the components except for the strain temperature measurement cavity 1021 of the strain-sensitive metamaterial antenna 4, the temperature temperature measurement cavity 1022 of the temperature-sensitive metamaterial antenna 5, and the first thermopile temperature measurement cavity 1023, the second thermopile temperature measurement cavity 1024, and the third thermopile temperature measurement cavity 1025 of the thermopile 6. This prevents thermal interference from the external environment to the sensitive unit layer and protects part of the structure.

[0053] In addition, the sensor also includes a readout system with the following specific functions: Signal receiving module: Acquires electromagnetic wave transmission signals from strain-sensitive metamaterial antenna 4, temperature-sensitive metamaterial antenna 5, and irregular microstrip antenna 10 via a receiving antenna, and monitors changes in scattering parameters in real time. Signal decoupling module: Uses a CNN-LSTM algorithm to decouple the time-domain and frequency-domain features of the multi-parameter mixed signal. Simultaneously, it uses an FFT (Fast Fourier Transform) algorithm to analyze the phase difference between the output frequency of the LC resonant circuit and the local oscillator frequency of the irregular microstrip antenna 10, and calculates the temperature change using preset calibration coefficients. Based on Fourier's law and multi-point temperature measurement data, it inverts the heat flux density distribution of the measured component through the heat conduction equation, achieving independent extraction and optimization of temperature, strain, and heat flux signals. Display module: Converts the decoupled signals into intuitive parameters through host computer software, displaying temperature, strain, and heat flux data in real time.

[0054] In addition, this embodiment also provides a method for manufacturing the sensor, including the following steps:

[0055] Substrate preparation: A 420 μm thick SiC ceramic fiber film was prepared by chemical vapor deposition (CVD) as the lower substrate 201 and the upper substrate 202. The CVD method was used to ensure the uniformity and crystal quality of the film, and to give the substrate high temperature resistance and flexibility. The upper substrate 202 was pre-processed with an upper lead hole 2021 and a lower lead hole 2022, and the lower substrate 201 was pre-processed with a groove 2011.

[0056] Deposition of the lower heat insulation layer 101: A 5mm thick Al2O3 film is deposited on the lower surface of the lower substrate 201 by pulsed laser deposition to form the lower heat insulation layer 101, thereby improving the heat insulation capability of the sensor's bottom layer.

[0057] Fabrication of the sensitive unit layer and metal layer 301: Using the DIW ink direct writing printing method, strain-sensitive metamaterial antenna 4, temperature-sensitive metamaterial antenna 5, thermopile of 15 pairs of copper-silver thermocouples in series 6, interdigitated capacitor 7, 4-turn spiral inductor 9 and irregular microstrip antenna 10 are sequentially printed on the upper surface of the upper substrate 202; at the same time, a 0.1 mm thick metal layer 301 is sprayed on the lower surface of the lower substrate 201 to achieve high-precision forming of the sensitive unit layer and adhesion of it to the metal layer 301.

[0058] LC resonant circuit connection: Connect the interdigital capacitor 7 and the spiral inductor 9 through the 2mm×2mm upper lead hole 2021 and lower lead hole 2022 of the upper substrate 202 to the lower surface of the upper substrate 202 and the slot 2011 of the lower substrate 201 to form an LC resonant circuit and complete the assembly of the heat flow signal modulation structure.

[0059] Upper heat insulation layer 102 deposition and encapsulation: A 5mm thick Al2O3 film is deposited above the sensitive unit layer as the upper heat insulation layer 102 by pulsed laser deposition. The strain temperature measurement cavity 1021 of the strain-sensitive metamaterial antenna 4, the temperature temperature measurement cavity 1022 of the temperature-sensitive metamaterial antenna 5, and the first thermopile temperature measurement cavity 1023, the second thermopile temperature measurement cavity 1024, and the third thermopile temperature measurement cavity 1025 of the thermopile 6 are not deposited, thus completing the encapsulation, which protects the sensor and ensures accurate detection of the hot end signal.

[0060] Therefore, the above-mentioned wireless passive multi-parameter integrated sensor based on surface conformity and its fabrication method are used to solve the problems of difficult wiring, difficult surface conformity and difficult integration of existing sensors. This enables real-time and rapid detection of temperature, strain and heat flow of engine blades in the aerospace field, and realizes simultaneous remote monitoring of the three parameters of temperature, strain and heat flow in high temperature and harsh environment. This fills the gap in aero-engine sensor technology and lays the foundation for aero-engine sensor technology.

[0061] This document uses specific examples to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of the present invention. Furthermore, those skilled in the art will recognize that, based on the ideas of the present invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A wireless passive multi-parameter integrated sensor based on conformal curved surfaces, characterized in that, From bottom to top, it includes: a lower heat insulation layer, a metal layer, a lower substrate, an upper substrate, a sensitive element layer, and an upper heat insulation layer. The lower heat insulation layer is deposited on the lower surface of the metal layer, and the metal layer is sprayed on the lower surface of the lower substrate. The lower substrate and the upper substrate are bonded together to form a double-layer substrate structure. The sensitive element layer is printed on the upper surface of the upper substrate, and the upper heat insulation layer is deposited on top of the sensitive element layer. The sensitive element layer is composed of a strain-sensitive metamaterial antenna, a temperature-sensitive metamaterial antenna, and a heat flow-sensitive element. The strain-sensitive metamaterial antenna and the temperature-sensitive metamaterial antenna are arranged in an array on the upper surface of the upper substrate.

2. The wireless passive multi-parameter integrated sensor based on conformal surface as described in claim 1, characterized in that, Both the lower and upper substrates are SiC ceramic fiber films with a thickness of 420 μm, and both the lower and upper heat insulation layers are Al2O3 films with a thickness of 5 mm.

3. The wireless passive multi-parameter integrated sensor based on conformal surface as described in claim 1, characterized in that, Both the strain-sensitive metamaterial antenna and the temperature-sensitive metamaterial antenna are directly printed on the upper surface of the substrate. Both the strain-sensitive metamaterial antenna and the temperature-sensitive metamaterial antenna are 4×4 metamaterial antenna arrays, with each antenna having a linewidth of 2mm, a line length of 6mm, and a thickness of 0.1mm. The strain-sensitive metamaterial antenna is I-shaped, and the temperature-sensitive metamaterial antenna is divided into a hot end and a cold end, with the cold end of the temperature-sensitive metamaterial antenna extending into the area covered by the upper heat insulation layer.

4. The wireless passive multi-parameter integrated sensor based on conformal surface as described in claim 1, characterized in that, The heat flow sensing unit includes: The thermopile consists of 15 pairs of copper and silver paste thermocouples connected in series, printed on the upper surface of the substrate, with a line width of 2 mm and a thickness of 0.1 mm; the hot end of the thermopile and the hot end of the temperature-sensitive metamaterial antenna are located in the same temperature measurement area. The interdigitated capacitor and the spiral inductor are both printed on the upper surface of the upper substrate and pass through the upper lead hole and lower lead hole of the upper substrate through the connecting wire, and are connected to the lower surface of the upper substrate and the slot of the lower substrate to form an LC resonant circuit. An irregularly shaped microstrip antenna is printed on the upper surface of the upper substrate. The irregularly shaped microstrip antenna, the strain-sensitive metamaterial antenna, and the temperature-sensitive metamaterial antenna are located on the same plane and spaced apart from each other.

5. A wireless passive multi-parameter integrated sensor based on conformal surface as described in claim 4, characterized in that, The upper and lower lead holes of the upper substrate are both 2mm×2mm, used for connecting wires to pass through and connect the interdigitated capacitor and the spiral inductor.

6. A wireless passive multi-parameter integrated sensor based on conformal surface as described in claim 5, characterized in that, The spiral inductor has a planar single spiral structure, with 4 turns, a line width of 2mm, and a thickness of 0.1mm.

7. A wireless passive multi-parameter integrated sensor based on conformal surface as described in claim 6, characterized in that, The thickness of the strain-sensitive metamaterial antenna, temperature-sensitive metamaterial antenna, thermopile, interdigitated capacitor, spiral inductor, and metal layer is 0.1 mm.

8. A wireless passive multi-parameter integrated sensor based on conformal surface as described in claim 1, characterized in that, The upper heat insulation layer covers the sensitive unit layer, and there is no heat insulation layer above the strain temperature measurement cavity of the strain-sensitive metamaterial antenna, the temperature temperature measurement cavity of the temperature-sensitive metamaterial antenna, and the first thermopile temperature measurement cavity, the second thermopile temperature measurement cavity, and the third thermopile temperature measurement cavity of the thermopile; the lower heat insulation layer completely covers the area below the metal layer.

9. A wireless passive multi-parameter integrated sensor based on conformal surface as described in claim 1, characterized in that, The wireless passive multi-parameter integrated sensor also includes a readout system, which includes a signal receiving module, a signal decoupling module, and a display module. The signal receiving module receives electromagnetic wave transmission signals between the receiving antenna and the strain-sensitive metamaterial antenna, the temperature-sensitive metamaterial antenna, and the irregular microstrip antenna. The signal decoupling module uses a CNN-LSTM algorithm for decoupling. The display module displays the parameter signals in real time through host computer software.

10. A method for fabricating a wireless passive multi-parameter integrated sensor based on conformal surface according to any one of claims 1 to 9, characterized in that, Includes the following steps: A 420 μm thick SiC ceramic fiber film was prepared by chemical vapor deposition (CVD) as a lower and upper substrate; the upper substrate was pre-processed with upper and lower lead holes, and the lower substrate was pre-processed with slots. A 5 mm thick Al2O3 film was deposited on the lower surface of the substrate as a lower heat insulation layer using pulsed laser deposition. Using the DIW ink direct writing printing method, a strain-sensitive metamaterial antenna, a temperature-sensitive metamaterial antenna, a thermopile consisting of 15 pairs of copper-silver thermocouples connected in series, an interdigital capacitor, a 4-turn spiral inductor, and an irregularly shaped microstrip antenna are sequentially printed on the upper surface of the upper substrate, and a metal layer with a thickness of 0.1 mm is sprayed on the lower surface of the lower substrate. The connecting wires of the interdigital capacitor and the spiral inductor are connected to the lower surface of the upper substrate and the slot of the lower substrate through the 2mm×2mm upper lead hole and the lower lead hole of the upper substrate to form an LC resonant circuit. A 5mm thick Al2O3 film is deposited above the sensitive unit layer as an upper heat insulation layer using pulsed laser deposition. The strain-sensitive metamaterial antenna's strain temperature measurement cavity, the temperature-sensitive metamaterial antenna's temperature temperature measurement cavity, and the first, second, and third thermopile temperature measurement cavities of the thermopile are not deposited. The encapsulation process is then completed to obtain the wireless passive multi-parameter integrated sensor.

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